KR20150102712A - Conductive composition and conductor - Google Patents

Abstract

A problem of the present invention is to provide a conductive composition and a conductor thereof, capable of being treated by heat at low temperatures and being a material of a conductor having properties (elasticity) or conductive properties followable to a substrate which is weak to heat, and high adhesive properties with respect to a substrate which is weak to heat. Provided is a conductive composition, comprising a block copolymer and silver powder, so as to solve the problem.

Description

CONDUCTIVE COMPOSITION AND CONDUCTOR [0002]

The present invention relates to a conductive composition and a conductor.

The touch panel is a combination of a display device such as a liquid crystal panel and an input device such as a touch pad.

As a method of a liquid crystal panel, there is an in-plane switching (IPS) method. In this method, the liquid crystal molecules are rotated in the direction parallel to the panel plane, and display switching occurs. When the IPS liquid crystal panel is used for the touch panel, the liquid crystal molecules are parallel to the panel plane, so that the alignment of the liquid crystal molecules is likely to be disturbed by the transfer of the static electricity from the panel surface as the finger approaches. In order to avoid this problem, an IPS liquid crystal panel is provided with a mechanism for escaping static electricity. One example of such a mechanism is a conductor such as a wire.

The liquid crystal panel is formed by combining various members. Among these members, a substrate resistant to heat such as a film substrate such as a polarizing plate is included.

Patent Document 1 discloses a conductive composition containing silver and a resin. By using such a conductive composition, it is possible to manufacture the wiring in the liquid crystal panel. However, it is necessary to treat at a high temperature of 120 캜 or higher at the time of the heat treatment, and the influence of the polarizing plate or the like in the liquid crystal panel on the substrate weak against heat can not be avoided. Further, the wiring including such a conductive composition can not sufficiently follow the wiring when a substrate weak in heat is expanded and contracted.

Patent Document 2 discloses a liquid crystal display device having a transparent conductive layer for preventing static electricity. And a pair of transparent substrates (glass substrates) superimposed on one another, and an earth pad provided on the surface of one of the transparent substrates with a transparent conductive layer for preventing static electricity and covered with a polarizing plate and grounded to the other transparent substrate. The electrostatic discharge protection transparent conductive layer and the earth pad are electrically connected to each other with a conductive tape via a step corresponding to the thickness of the transparent substrate. However, since the area and thickness of the connecting portion increase due to the increase in width and thickness for processing into a tape, the formability is limited. In addition, precise alignment is required for attaching such a conductive tape, and the operation becomes troublesome.

In Patent Document 2, a transparent conductive film for preventing static electricity is disposed on a transparent substrate in a state covered with a film base such as a polarizing plate. In this case, since the static electricity-preventing transparent conductive film is integrated with the film substrate, the wiring including the conductive composition or the connection with the conductive tape is unstable due to the difference in thermal expansion of the transparent substrate on which the film substrate and the earth pad are ground- Resulting in poor conduction between the film substrate and the transparent substrate.

Japanese Patent Application Laid-Open No. 2004-111057 Japanese Patent Laid-Open Publication No. 2012-220677

The inventors of the present invention have found that a conductor such as a wiring which can be subjected to heat treatment at a low temperature and is capable of following it when a substrate weak in heat is stretched or shrunk is found.

Further, since the liquid crystal panel is formed by bonding a plurality of substrates, it is advantageous that the conductor such as wiring has adhesion to other substrates.

Disclosed is a conductive composition capable of being a material of a conductor capable of being subjected to heat treatment at a low temperature and capable of following a substrate which is weak against heat (stretchability) and continuity, and having high adhesiveness to heat- And a conductor having the above properties obtained by heat-treating the conductive composition.

In order to solve the above problems, the following conductive compositions and conductors are provided.

(One)

Block copolymer and silver powder.

(2)

The conductive composition according to (1), which has a tensile elongation at break of at least 100% as a cured product.

(3)

The conductive composition according to (1) or (2), wherein at least a part of silver is flake-like flake.

(4)

The conductive composition according to any one of (1) to (3), wherein the silver specific surface area measured by a BET method is 1.0 m ² / g or more.

(5)

The conductive composition according to any one of (1) to (4), wherein the block copolymer comprises a soft segment and a hard segment.

(6)

The conductive composition according to any one of (1) to (5), wherein the block copolymer is a block copolymer represented by the following formula (I).

X ₁ -YX ₂ (I)

(Wherein,

X ₁ and X ₂ each independently represent a polymer unit having a glass transition point Tg of 0 ° C or higher,

And Y represents a polymer unit having a glass transition point Tg of less than 0 DEG C)

(7)

The conductive composition according to any one of (1) to (6), wherein the block copolymer has an elongation of 100 to 600% according to a measurement method of ISO 37.

(8)

The conductive composition according to any one of (1) to (7), further comprising a thermosetting component.

(9)

The conductive composition according to (8), wherein the thermosetting component is an epoxy resin.

(10)

A conductor comprising the conductive composition according to any one of (1) to (9) applied on a substrate and subjected to heat treatment.

INDUSTRIAL APPLICABILITY According to the present invention, it becomes possible to manufacture a conductor having characteristics (stretchability) and continuity that can follow a substrate that is weak against heat, and high adhesiveness to a substrate that is weak against heat at low temperature, Can be manufactured.

The first embodiment of the present invention is a conductive composition.

The conductive composition according to the embodiment includes a block copolymer and silver powder.

The conductive composition means a composition having conductivity in its original state or a composition having improved conductivity by processing. In particular, the conductive composition means a composition capable of forming a conductor by performing heat treatment. The heat treatment is, for example, drying or thermosetting. Molding may be performed prior to the heat treatment. An example of the conductive composition according to the embodiment is a conductive composition for forming a conductive circuit.

The block copolymer refers to a copolymer having a molecular structure in which two or more kinds of polymers having different properties are linked by a covalent bond to form a long chain.

The block copolymer is preferably a solid at least in the range of 20 캜 to 30 캜. It is advantageous because it is solid in the above-mentioned temperature range and excellent in adhesiveness when dried into a dry film or applied to a substrate and dried.

The block copolymer preferably comprises a soft segment and a hard segment. A soft segment means a portion having more flexibility. On the other hand, a hard segment means a portion having more rigidity.

As the block copolymer including a soft segment and a hard segment, a block copolymer represented by the following formula (Ia) may be mentioned.

X-Y (Ia)

Wherein X is a polymer unit (hard segment) having a glass transition point Tg _x > 30 DEG C and Y is a polymer unit (soft segment) having a glass transition point Tgy < 0 DEG C,

By using the block copolymer represented by the formula (Ia), toughness is imparted to the cured product obtained from the conductive composition of the present invention. Further, the glass transition point Tg is measured by differential scanning calorimetry (DSC).

The block copolymer may be a block copolymer represented by the following formula (I).

X ₁ -YX ₂ (I)

(In the formula (I)

X ₁ and X ₂ each independently represent a polymer unit having a glass transition point Tg of 0 ° C or higher,

And Y represents a polymer unit having a glass transition point Tg of less than 0 DEG C)

Preferably, X ₁ and X ₂ are polymer units having a Tg of 50 ° C or higher, and Y is a polymer unit having a Tg of -20 ° C or lower. The glass transition point Tg can be measured, for example, by differential scanning calorimetry (DSC). In the formulas, X ₁ and X ₂ may be different polymer units, but are preferably the same polymer unit.

In the block copolymer represented by the formula (I), it is preferable that Y having a glass transition point Tg smaller is a soft segment and X having a glass transition point Tg larger is a hard segment.

Among the above-mentioned formulas (Ia) and (I), the formula (I) is preferable from the viewpoint of the tensile elongation at break.

Examples of X, X ₁ and X ₂ include polymethyl (meth) acrylate (PMMA) and polystyrene (PS). Examples of Y include poly-n-butyl acrylate (PBA) and polybutadiene (PB).

The block copolymer may be a commercial product. An example of a commercially available product is an acrylic triblock copolymer produced by living polymerization of an acrylic resin. Specifically, there may be mentioned SBM type represented by polystyrene-polybutadiene-polymethyl methacrylate, MAM type represented by polymethyl methacrylate-polybutyl acrylate-polymethyl methacrylate, and carboxylic acid denaturation treatment or hydrophilic group Modified MAM N type or MAM A type can be used. Examples of SBM types are E41, E40, E21 and E20. Examples of MAM types are M51, M52, M53 and M22. Examples of MAM N types are 52N and 22N. An example of a MAM A type is SM4032XM10. Another example of a commercial product is Kurarity of Kuraray Co., Ltd. This guarity is a block copolymer derived from methyl methacrylate and butyl acrylate.

The block copolymer comprising such a (meth) acrylate polymer block can be obtained, for example, by the method described in JP-A-2007-516326 or JP-A-2005-515281. In particular, it can be suitably obtained by polymerizing Y units with an alkoxyamine compound represented by any one of the following formulas (1) to (4) as an initiator and then polymerizing X units.

(Wherein n represents 2 and Z represents a divalent organic group, preferably 1,2-ethanedioxy, 1,3-propanedioxy, 1,4-butane dioxy, 1,6-hexane (2-ethoxy) cyanuric acid, polyaminoamines such as polyethyleneamine, 1,3,5-tris (2-ethylamino) cyanuric acid, polythioxy , Phosphonate or polyphosphonate, and Ar represents a divalent aryl group)

The weight average molecular weight of the block copolymer is preferably from 20,000 to 400,000, more preferably from 50,000 to 300,000. When the weight average molecular weight is 20,000 or more, the desired toughness and flexibility are obtained, and when the conductive composition is molded and dried into a film, or when it is applied to a substrate and dried, excellent tackiness is obtained. In addition, when the weight average molecular weight is 400,000 or less, the conductive composition has a good viscosity and higher printability and processability can be achieved. In addition, when the weight average molecular weight is 50,000 or more, an excellent effect in mitigating the impact from the outside can be obtained.

The elongation percentage according to the measurement method of International Standard ISO 37 of the International Organization for Standardization of Block Copolymers is preferably 100 to 600%, more preferably 300 to 600%. The elongation percentage of the block copolymer, which is an example of the block copolymer, is 140 to 490%.

The content of the block copolymer in the conductive composition is preferably 20 to 50% by mass based on the total solid content contained in the conductive composition, for example. Further, for example, it is preferably 85 to 100% by mass based on the total mass of the organic component. When the content is within the above range, stretchability is preferable.

Silver powder has a shape and size that can impart conductivity. Particularly, the shape of the silver powder is preferably granular or flaky, or a mixture thereof.

It is preferable that at least a part of the silver powder is a flake-like flake powder because good conductivity can be obtained even in a small amount. The thin flaky flake silver halide means a value obtained by dividing the average particle diameter (D ₅₀ ) measured by the laser light scattering method by the average thickness measured by a scanning electron microscope (aspect ratio) of preferably 60 or more and 120 or less. Here, D ₅₀ is a particle diameter at a cumulative volume of 50% obtained by using a laser diffraction scattering particle size distribution measurement method based on the Mie scattering theory. More specifically, the particle size distribution of the conductive fine particles can be measured by using a laser diffraction scattering type particle size distribution measuring device based on the volume, and the median diameter of the conductive fine particles is determined as the average particle size. As the measurement sample, those in which conductive fine particles are dispersed in water by ultrasonic waves can be preferably used. As the laser diffraction particle size distribution measuring apparatus, HORIBA Seisakusho Co., Ltd. LA-500 and the like can be used. The average thickness is taken by photographing with a scanning electron microscope and the thickness of the silver microparticles is measured and expressed as an average value of 50 measurement numbers.

The flaky flakes may be obtained by flaking the granular silver powder produced by a known method using a known stirring ball mill.

The specific surface area of the silver measured by the BET method is preferably 1.0 m ² / g or more. More preferably, the specific surface area is 1.2 m ² / g or more, more preferably 1.2 m ² / g or more and 3.0 m ² / g or less, particularly preferably 1.5 m ² / g or more and 2.0 m ² / g or less. If the specific surface area is 1.0 m ² / g or more, it is preferable because the contact area is large and the resistance value tends to be low.

When the silver powder is flaky flake silver powder, the average particle size (D ₅₀ ) by the laser diffraction scattering type particle size distribution measurement method is preferably 3.0 to 10.0 탆. When the average particle diameter (D ₅₀ ) is 3.0 μm or more, the resistance value is preferably low. On the other hand, when the average particle diameter (D ₅₀ ) is 10.0 탆 or less, it is preferable that the average particle diameter (D ₅₀ ) is not blocked at the time of pattern formation and can be favorably formed.

The silver content in the conductive composition is preferably 50 to 80 mass%, more preferably 70 to 75 mass%, based on the total solid content contained in the conductive composition, for example. When the content is 50 mass% or more, the resistance value is preferably low. On the other hand, if it is 80 mass% or less, stretchability is preferable.

The conductive composition according to the embodiment may further include a thermosetting component. Examples of the thermosetting component include a polyester resin (urethane modified product, an epoxy modified product, an acrylic modified product, etc.), an epoxy resin, a urethane resin, a phenol resin, a melamine resin , A vinyl-based resin, and a silicone resin.

The epoxy resin which is a specific example of the thermosetting component may be either a monoepoxy compound or a polyepoxy compound. Examples of monoepoxy compounds are butyl glycidyl ether, hexyl glycidyl ether, phenyl glycidyl ether, p-xylyl glycidyl ether, glycidyl acetate, glycidyl butyrate, glycidyl hexoate, Lt; / RTI &gt; Examples of the polyepoxy compound are a glycidyl ether type epoxy resin of bisphenol A and a glycidyl ether type epoxy resin of phenol novolak. These epoxy resins may be contained in the conductive composition alone or in combination of two or more. For example, the epoxy resin may be contained in the conductive composition as an adduct with an imidazole compound. Examples of the imidazole compound herein are imidazole and 2-substituted imidazole. Examples of 2-substituted imidazole are 2-methylimidazole, 2-ethylimidazole, 2-isopropylimidazole, 2- Dodecylimidazole, 2-ethyl-4-methylimidazole and 2-phenylimidazole.

The content of the thermosetting component in the conductive composition is, for example, 5 to 20 mass%, preferably 10 to 15 mass%, based on the resin component.

The conductive composition may contain other components. For example, additives such as a solvent, a thermoplastic resin and a dispersant may be included.

The conductive composition can be produced, for example, by kneading a block copolymer and silver powder dissolved in a solvent. As a kneading method, for example, there is a method using a stirring and mixing apparatus such as a roll mill.

The conductive composition of the present invention preferably has a tensile elongation at break of 100% or more of the cured product thereof. When the elongation percentage is 100% or more, it is preferable that the wiring including the conductor formed by the conductive composition of the present invention keeps continuity with the shrinkage of the substrate weak to heat such as the polarizing plate to maintain the continuity. The tensile elongation at break of the cured product is more preferably 130% or more, and still more preferably 300% or more. Although there is no particular upper limit, if the elongation percentage is high, the conductivity is poor and the conductivity may be insufficient depending on the application. From this viewpoint, it is preferable that the cured product of the conductive composition of the present invention has a tensile elongation at break of 1000% or less.

Here, the tensile elongation at break refers to the elongation of the film-like conductor, which is a cured product of the conductive composition of the present invention, as expressed by the following equation at the time of breaking in the tensile test. The tensile test is carried out by the method described in the following published examples.

Tensile elongation at break (%) = (elongation at break (mm) - initial dimension 20 mm) / (initial dimension 20 mm) x 100

A second embodiment of the present invention is a conductor.

The conductor according to the embodiment is made of the conductive composition according to the embodiment. The conductor may be one obtained by heat-treating the conductive composition. An example of a heat treatment is drying or thermosetting. Molding may be performed prior to the heat treatment. For example, the conductor is formed by applying a conductive composition according to the embodiment on a substrate and subjecting it to heat treatment.

The conductor may be of various shapes depending on the application used. Examples of the conductor are a conductor circuit and a wiring.

In the case of producing a conductor circuit, the method includes a pattern forming step of forming a coating film pattern by printing or applying the conductive composition according to the embodiment on a substrate, and a heat treatment step of heat treating the coating film pattern. For forming the coating film pattern, a masking method, a method using a resist, or the like can be used.

Examples of the pattern forming process include a printing method and a dispensing method. Examples of the printing method include gravure printing, offset printing, and screen printing. In the case of forming a fine circuit, screen printing is preferable. As a large area coating method, gravure printing and offset printing are suitable. The dispensing method is a method of forming a pattern by controlling the application amount of the conductive composition and extruding it from a needle, and is suitable for forming a partial pattern such as ground wiring or forming a pattern for a portion having irregularities.

The heat treatment may be carried out at a temperature of, for example, about 80 to 150 DEG C or 150 to 200 DEG C, depending on the substrate used. When the conductive composition according to an embodiment comprising a flaky flake silver powder, the coating film pattern formed in the pattern forming step is do a specific resistance by heating at a low temperature of less than 100 ℃ 1 × 10 ^- as low as ⁴ Ω · cm, the conductive high conductor Circuit can be obtained. The temperature in the heat treatment process is preferably about 70 ° C or higher and about 120 ° C or lower, and more preferably about 80 ° C or higher and about 100 ° C or lower. The time in the heat treatment process is preferably about 15 minutes or more to about 90 minutes or less, more preferably about 30 minutes or more to about 75 minutes or less.

Examples of the substrate are pre-circuit printed wiring boards and flexible printed wiring boards. Other examples of the substrate include a resin such as a paper-phenol resin, a paper-epoxy resin, a glass cloth-epoxy resin, a glass-polyimide, a glass cloth / nonwoven-epoxy resin, a glass cloth / paper- (FR-4 and the like) using a composite material such as a fluororesin, a polyethylene, a polyphenylene ether, a polyphenylene oxide and a cyanate ester, a polyethylene terephthalate (PET), a polybutylene terephthalate A sheet or a film containing a plastic such as a polyamide, a polyphenylene sulfide, or a polyamide, a silicon substrate, an epoxy substrate, a polycarbonate substrate, an acrylic substrate, a phenol substrate, a glass substrate, a ceramic substrate , A wafer substrate, or the like can be used.

INDUSTRIAL APPLICABILITY According to the present invention, it becomes possible to manufacture a conductor having high stretchability and high adhesiveness at a low temperature, thereby making it possible to manufacture a touch panel having excellent performance.

Conventionally, various conductive compositions have been developed, but they have not been developed under consideration of handling and stretchability at low temperatures. As a result, there is no conductive composition which can handle at low temperatures, has high stretchability, and has both high adhesiveness.

In addition, a conventional conductive composition contains a resin such as polyurethane and a powder of a metal such as silver. According to such a composition, it is possible to produce a conductor having a certain stretchability, but the polyurethane is inconvenient to use because it has a limited solvent to be used in processing and requires a higher curing temperature.

On the other hand, according to the conductive composition according to the embodiment, it is possible to manufacture an ideal conductor which can be handled at a low temperature and has high stretchability and high adhesiveness. By including such a conductor, a touch panel having excellent performance can be manufactured.

Further, the resistance value of the conductive composition or the conductor can be greatly lowered by selecting the flaky flake as silver or by selecting the silver powder having the BET method specific surface area of 1.0 m ² / g or more. In other words, according to such silver, a constant resistance value can be achieved in a smaller amount.

Further, since the conductive composition according to the embodiment can form a conductor having high conductivity even after heat treatment at a low temperature, when the composition is applied to a substrate, a sheet, a film, and a substrate containing a thermoplastic resin having low heat resistance It becomes possible to use it. That is, the choice of substrate is broadened.

[Example]

The conductive composition according to the embodiment was prepared, a conductor was further prepared from the conductive composition, and then the performance of the conductor was verified.

(Preparation of conductive composition)

A resin solution in which the block copolymer was dissolved in diethylene glycol monoethyl ether acetate as a solvent was prepared. Silver powder was added to this resin solution, premixed in a stirrer, and then kneaded by a three-roll mill to obtain a conductive composition according to the embodiment.

As the block copolymer, three types of LA2330, LA2250 and LA4285 of Kuraray Co., Ltd. were used. These are block copolymers having a structure in which one poly-n-butyl acrylate (PBA) is sandwiched between two polymethyl (meth) acrylates (PMMA). The proportion of PBA, which is a soft segment, is increasing in the order of LA4285, LA2250, LA2330.

In Examples 1 to 8 and Comparative Examples 1 and 2, as a silver powder, the type number Ag-XF301 made by Fukuda Kindo Co., Ltd. was used. The silver powder has an apparent density of 0.5 to 0.75 g / cm ³ , a specific surface area by the BET method of 1.5 to 2.0 m ² / g, and an average particle diameter (D ₅₀ ) of 4.0 to 8.0 μm. Further, the silver flake is flaky flake and has an aspect ratio of 100. In Comparative Example 3, the type number AA-4703 made by Fukuda Corporation was used. The silver powder has an apparent density of 1.4 to 2.4 g / cm ³ , a specific surface area by BET method of 0.9 to 1.3 m ² / g, and an average particle diameter (D ₅₀ ) of 4 to 5 μm. This silver powder has an aspect ratio of 20, and does not correspond to flake-like flakes in the present invention.

Here, the average particle diameter and the aspect ratio are values measured by the above-mentioned method.

Further, a conductive composition further comprising a thermosetting component was also prepared. As the thermosetting component, an epoxy resin was used. Specifically, an epoxy-imidazole adduct mixture was used.

As a comparative example, a composition was prepared using a phenoxy resin (PKHC, manufactured by Phenoxy Associates) or an acrylic copolymer (BR77 manufactured by Mitsubishi Rayon) in place of the block copolymer.

In Table 1 to be published later, the combinations and contents of the materials used were integrated. In Table 1, the elongation percentage of the block copolymer (the value described in the manufacturer's catalog) is described.

From the above, eleven kinds of conductive compositions relating to Examples 1 to 8 and Comparative Examples 1 to 3 were produced.

(Measurement of Resistivity)

Each conductive composition was applied to a substrate and heat-treated at 80 DEG C for 30 minutes. As the substrate, a slide glass was used.

Resistance values of both ends of the obtained conductor were measured by the four-terminal method, and further the line width, line length and thickness were measured to obtain a specific resistance (volume resistivity). The results are shown in Table 1.

(Measurement of adhesion)

Each conductive composition was applied to a substrate and heat-treated at 80 DEG C for 30 minutes. As the substrate, a slide glass, a PET film, and a glass with indium tin oxide (ITO) were used.

The resulting conductor was subjected to a cross-cut cellophane tape (registered trademark) peeling test based on JIS: K5600-5-6. , &Quot;? &Quot;, &quot;? &Quot;, and &quot;? &Quot;, respectively. The results are incorporated in Table 1.

(Measurement of tensile elongation at break)

Each conductive composition was coated on a substrate and heat-treated at 80 DEG C for 60 minutes. As the base material, peeled PET (PET whose surface has been peeled off) was used. After the heat treatment, peeling The peeled conductor from the PET was made to have a width of 10 mm, a film thickness of 30 to 50 nm, and a length of 50 mm.

Both ends of the conductor were fixed with a jig so that the distance between jigs was 20 mm, and the tensile test was conducted at a rate of 1 to 5 mm / min at room temperature.

The tensile elongation at break was determined by the following equation.

Tensile elongation at break (%) = (elongation at break (mm) - initial dimension 20 mm) / (initial dimension 20 mm) x 100

The results are incorporated in Table 1.

(Continuity)

A polarizing plate smaller than the glass substrate was attached to the glass substrate, and the conductive composition of the present invention was applied over the glass substrate and the polarizing plate, followed by heat treatment at 80 캜 for 30 minutes to form a conductor. Then, a cold / heat cycle test was carried out at -40 ° C for 1 hour / 85 ° C for 1 hour, and the test was conducted five times to see whether there was continuity at both ends of the formed conductor. &Quot; was determined as &quot;? &Quot;, and &quot;? &Quot; was determined as &quot; DELTA &quot; The results are incorporated in Table 1.

From the above, it can be seen that the conductor of the present invention can attain excellent adhesiveness and stretchability while realizing a value of low resistivity as compared with the conventional conductor.

Claims (10)

Block copolymer and silver powder. The conductive composition according to Claim 1, wherein the tensile elongation at break of the cured product is 100% or more. 3. The conductive composition according to claim 1 or 2, wherein at least a part of the silver is flake-shaped flake. 4. The conductive composition according to any one of claims 1 to 3, wherein the silver specific surface area measured by a BET method is 1.0 m ² / g or more. 5. The conductive composition according to any one of claims 1 to 4, wherein the block copolymer comprises a soft segment and a hard segment. 6. The conductive composition according to any one of claims 1 to 5, wherein the block copolymer is a block copolymer represented by the following formula (I).
X ₁ -YX ₂ (I)
(Wherein,
X ₁ and X ₂ each independently represent a polymer unit having a glass transition point Tg of 0 ° C or higher,
And Y represents a polymer unit having a glass transition point Tg of less than 0 DEG C) 7. The conductive composition according to any one of claims 1 to 6, wherein the block copolymer has an elongation of 100 to 600% as measured by an ISO 37 method. The conductive composition according to any one of claims 1 to 7, further comprising a thermosetting component. The conductive composition according to claim 8, wherein the thermosetting component is an epoxy resin. A conductor comprising the conductive composition according to any one of claims 1 to 9 applied on a substrate and heat-treated.