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KR20150101571A - Image sensor chip package - Google Patents

Image sensor chip package Download PDF

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Publication number
KR20150101571A
KR20150101571A KR1020140023031A KR20140023031A KR20150101571A KR 20150101571 A KR20150101571 A KR 20150101571A KR 1020140023031 A KR1020140023031 A KR 1020140023031A KR 20140023031 A KR20140023031 A KR 20140023031A KR 20150101571 A KR20150101571 A KR 20150101571A
Authority
KR
South Korea
Prior art keywords
image sensor
sensor chip
circuit board
printed circuit
dam
Prior art date
Application number
KR1020140023031A
Other languages
Korean (ko)
Inventor
천병태
하민기
Original Assignee
천병태
하민기
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 천병태, 하민기 filed Critical 천병태
Priority to KR1020140023031A priority Critical patent/KR20150101571A/en
Priority to CN201410317510.1A priority patent/CN104882456A/en
Publication of KR20150101571A publication Critical patent/KR20150101571A/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Facsimile Heads (AREA)

Abstract

The present invention relates to an image sensor chip package in which an image sensor chip and a package lead are wire-bonded at a similar height during wire bonding of an image sensor chip and a printed circuit board, A printed circuit board having a chip insertion groove into which a sensor chip is inserted; An image sensor chip inserted into the chip insertion groove; A wire for electrically connecting the image sensor chip and the printed circuit board; A dam formed on a rim of the printed circuit board; And a glass cover installed on the dam to implement an image sensor chip package.

Description

An image sensor chip package

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image sensor chip package, and more particularly, to an image sensor chip package. More particularly, the present invention relates to an image sensor chip package, So that the bonding operation can be performed.

2. Description of the Related Art Generally, an image sensor is an apparatus for detecting subject information and converting it into an electrical image signal, which is a photoelectric conversion device integrated into an integrated circuit using a semiconductor device manufacturing technique.

Line image sensors (one-dimensional image sensors) used in facsimiles and copiers, and array image sensors (two-dimensional image sensors) used in television cameras, notebook cameras, camcorders, CCTVs, smart phones and digital cameras.

The package for image sensor is classified into an insert type semiconductor package and a surface mount type (SMT) type semiconductor package according to a method of being mounted on a mother board. Typical examples of the insert type semiconductor package are a dual in-line package (DIP) And a pin grid array). Typical surface mount semiconductor packages include QFP (Quad Flat Package), PLCC (Plastic Leaded Chip Carrier), CLCC (Ceramic Leaded Chip Carrier), and BGA (Ball Grid Array).

The surface mount type semiconductor package has a small size and can be mounted in a small size when the chip is the same size as the insert type semiconductor package. Thin and light thickness, parasitic capacitance and inductance are small.

In particular, a PLCC type image sensor package using a general semiconductor encapsulating material and a lead frame and a glass cover is widely used.

A general description of the PLCC type image sensor package as described above is shown in FIG. 1, the image sensor package 10 includes a printed circuit board 11 having multilayer electric wiring, an image sensor chip 12 mounted at the center of the printed circuit board 11 using an adhesive such as epoxy, And wires 13 are used to electrically connect the image sensor chip 12 and the printed circuit board 11 to each other. At this time, the wire is pulled down from the surface of the image sensor chip 12 to the bottom surface of the printed circuit board 11, and the wire bonding is performed. For wire bonding, a capillary (serving as a needle for wire bonding) need.

After the wire bonding, a dam (a molding dam, an injection block, or the like) 14, which is a structure serving as a dam, is installed on the rim of the printed circuit board 11 for attaching the glass lid 15, , The glass cover 15 is attached using an adhesive such as epoxy to complete the image sensor chip package.

On the other hand, a conventional technique for a semiconductor package for an image sensor is disclosed in the following Patent Document 1: Korean Patent Laid-Open Publication No. 10-2007-0025442 (published on Mar. 3, 2007).

In the prior art disclosed in Patent Document 1, a protective cap made of a light-transmissive material is provided in a microlens provided in each image sensor chip in a wafer state, so that an external foreign substance, which is a weak point of the image sensor, And the yield of the final product can be improved.

Korean Patent Publication No. 10-2007-0025442 (Published on Mar. 08, 2007)

However, since a general image sensor chip package and a conventional technology as described above are required to secure a capillary space for wire bonding, a gap between the image sensor chip and the dam must be secured so that the size of the entire image sensor chip package is increased .

Also, since the general image sensor chip package as described above pulls down the wire from the surface of the image sensor chip to the bottom surface of the printed circuit board, there is a problem that progressive opening occurs due to wire tension after bonding.

It is an object of the present invention to provide an image sensor chip package and a package lead for wire bonding of an image sensor chip and a printed circuit board in order to solve the above- so that the lead can be wire-bonded at a similar height.

Another object of the present invention is to provide an image sensor chip package which can minimize the size of the overall image sensor chip package by removing the capillary space used for wire bonding.

It is a further object of the present invention to provide an image sensor chip package in which an image sensor chip and a package lead are wire-bonded at a similar height to reduce a progressive opening due to wire tension.

It is still another object of the present invention to provide an image sensor chip package that can eliminate the existing dam installation process by replacing a dam for installing a glass cover by applying an epoxy containing a spacer to a printed circuit board will be.

It is still another object of the present invention to provide an image sensor chip package capable of removing a conventional dam installation process by forming a concave-convex structure on the surface of a printed circuit board to replace a dam for installing a glass cover .

In order to achieve the above object, a first embodiment of the image sensor chip package according to the present invention includes a printed circuit board having a multilayer electric wiring and having a chip insertion groove into which an image sensor chip is inserted; An image sensor chip inserted into the chip insertion groove; A wire for electrically connecting the image sensor chip and the printed circuit board; A dam formed on a rim of the printed circuit board; And a glass cover installed on the dam.

Wherein a depth of the chip insertion groove is equal to or greater than a thickness of the image sensor chip or at least a predetermined number of times greater than a thickness of the image sensor chip.

The wires are formed by wire bonding, and the heights of the image sensor chip and the leads of the PCB are similar.

Wherein the dam is formed by applying an epoxy containing a spacing spacer to the printed circuit board.

Wherein the dam is formed by forming a concavo-convex structure on the surface of the printed circuit board when the circuit board is formed, and applying epoxy to the concave-convex structure.

In order to achieve the above object, a second embodiment of an image sensor chip package according to the present invention comprises: a first printed circuit board having multilayer electric wiring; A second printed circuit board stacked on the first printed circuit board, the second printed circuit board having a multilayer electric wiring and forming an insertion groove into which the image sensor chip is inserted; An image sensor chip inserted into the chip insertion groove; A wire for electrically connecting the image sensor chip and the second printed circuit board; A dam formed on a rim of the second printed circuit board; And a glass cover installed on the dam.

Wherein a depth of the chip insertion groove is equal to or greater than a thickness of the image sensor chip or at least a predetermined number of times greater than a thickness of the image sensor chip.

The wires are formed by wire bonding, and the heights of the image sensor chip and the leads of the second printed circuit board are similar to each other.

Wherein the dam is formed by applying an epoxy containing a space retaining spacer to the second printed circuit board.

Wherein the dam is formed by forming a concave-convex structure on the surface of the second printed circuit board when the second printed circuit board is formed, and applying epoxy to the concave-convex structure.

According to the present invention, a wire bonding operation is performed at a similar height between an image sensor chip and a package lead at the time of wire bonding between an image sensor chip and a printed circuit board. Thus, a capillary space It is possible to minimize the size of the overall image sensor chip package.

According to the present invention, the image sensor chip and the package lead are wire-bonded at a similar height, thereby making it possible to reduce a progressive opening due to wire tension.

According to the present invention, a dam installation process can be eliminated by replacing a dam which is a structure for installing a glass cover by applying epoxy containing a spacer to a printed circuit board, and a structure for installing a glass cover There is an advantage that the forming process can be simplified.

In addition, according to the present invention, by forming a concavo-convex structure on the surface of a printed circuit board during manufacture of the printed circuit board and replacing the dam for installing the glass cover, the existing dam installation process can be eliminated and the structure for installing the glass cover can be conveniently There is an advantage to be able to do.

1 is a sectional view of a general image sensor chip package,
FIGS. 2A to 2C are cross-sectional views of an image sensor chip package according to a first preferred embodiment of the present invention,
FIGS. 3A to 3D are cross-sectional views of an image sensor chip package according to a second preferred embodiment of the present invention,
4 is a sectional view of an image sensor chip package for explaining a dam forming process in the present invention.

Hereinafter, an image sensor chip package according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

2A to 2C are sectional views of an image sensor chip package according to a first preferred embodiment of the present invention.

2A to 2C, a first embodiment of the image sensor chip package 100 according to the present invention includes a chip insertion groove 106 having a multilayer electric wiring and into which an image sensor chip 103 is inserted Thereby realizing the printed circuit board 101. Here, the printed circuit board 101 preferably has an insertion groove formed therein.

An image sensor chip 103 for capturing an image is mounted on a chip insertion groove 106 formed on the printed circuit board 101 by a bonding method. At this time, it is preferable that the depth of the chip insertion groove 106 is formed to be approximately equal to the thickness of the image sensor chip 103 or to be formed larger than a predetermined multiple (0.1 to 3 times). As a result, the heights of the image sensor chip 103 and the printed circuit board 101 become similar to each other, and it becomes unnecessary to separately secure a work space for use of the capillary during wire bonding. Removing the entire size of the image sensor chip package.

Then, the wire 104 is connected by a wire bonding method to electrically connect the image sensor chip 103 and the printed circuit board 101. In particular, since the lead height between the image sensor chip 103 and the printed circuit board 101 is similar, there is no need to draw the wire to the bottom surface of the printed circuit board, Can be reduced.

Next, a dam 102, which is a structure for supporting and installing the glass lid 105, is formed at the rim of the printed circuit board 101, and a glass lid 105 is formed on the dam 102 by using an adhesive such as epoxy. (105).

Although the first embodiment of the present invention as described above has many advantages and various effects as compared with the conventional image sensor chip package as the image sensor chip package, the inventor of the present invention has found that the first embodiment is more improved The structure of the dam 102 is improved to have the structure as shown in Fig.

For example, an epoxy containing a spacer for spacing when forming the dam 304 is applied to the printed circuit board 301 (same as 101 in FIG. 2A). At this time, the epoxy can be easily applied to the printed circuit board 301 by injecting using an injection device. If the epoxy containing the applied spacer is cured, it naturally becomes a structure like the existing dam. If the glass cover is placed on the epoxy before curing as needed, the epoxy naturally acts as an adhesive, It is not necessary to perform an operation of adhering to the dam 304 formed by the dam.

Also, unlike the above, it is also possible to form a concavo-convex structure capable of forming an interval (space) in the printed circuit board 301, and to apply the epoxy to the concavo-convex structure to form the dam 304.

With the above-described two dam forming methods, it is possible to eliminate the process of forming a dam separately as in the conventional method, or to simplify the dam process compared with the conventional method.

3A to 3D are sectional views of an image sensor chip package according to a second preferred embodiment of the present invention.

3A to 3D, a second embodiment of an image sensor chip package 200 according to the present invention includes an image sensor chip 2033 on a first printed circuit board 201 having multilayer electric wiring, The second printed circuit board 202 for forming the chip insertion groove 208 to be inserted is deposited. Here, the second printed circuit board 202 appears to be separated but is actually formed in a rectangular frame shape along the rim of the first printed circuit board 201, and a space is formed therein.

When the second printed circuit board 202 is deposited on the first printed circuit board 201 in this way, the overall printed circuit board 204 has the same shape as the printed circuit board 101 shown in FIG. 2A And the thickness is also the same. When a printed circuit board is formed in such a manner that two printed circuit boards are stacked as described above and a space is formed therein, compared to a method of forming a space in a printed circuit board in FIG. 2A, It is easy to form the groove.

Next, the image sensor chip 205 for capturing an image is mounted on the chip insertion groove 208 formed on the printed circuit board 204 by a bonding method. At this time, it is preferable that the depth of the chip insertion groove 208 is formed to be larger than the thickness of the image sensor chip 205 or at least a predetermined multiple (0.1 to 3 times). As a result, the heights of the image sensor chip 205 and the printed circuit board 204 become similar to each other, and it becomes unnecessary to separately secure a work space for using the capillary during wire bonding. Removing the entire size of the image sensor chip package.

Then, the wire 206 is connected by a wire bonding method to electrically connect the image sensor chip 205 and the printed circuit board 204. Particularly, since the leads of the image sensor chip 205 and the printed circuit board 204 are similar to each other, there is no need to drag the wires to the bottom surface of the printed circuit board, Can be reduced.

Next, a dam 203, which is a structure for supporting and installing the glass lid 207, is formed at the rim of the printed circuit board 204, and a glass lid 207 is formed on the dam 2032 by using an adhesive such as epoxy. (207).

The second embodiment of the present invention as described above has many advantages and various advantages over the conventional image sensor chip package as the image sensor chip package. However, the present inventor has found that the second embodiment is more improved than the conventional image sensor chip package The structure of the dam 203 is improved to the structure shown in FIG.

For example, an epoxy containing a spacer for spacing when forming the dam 304 is applied to the printed circuit board 301 (same as 204 in FIG. 3D). At this time, the epoxy can be easily applied to the printed circuit board 301 by injecting using an injection device. If the epoxy containing the applied spacer is cured, it naturally becomes a structure like the existing dam. If the glass cover is placed on the epoxy before curing as needed, the epoxy naturally acts as an adhesive, It is not necessary to perform an operation of adhering to the dam 304 formed by the dam.

Also, unlike the above, it is also possible to form a concavo-convex structure capable of forming an interval (space) in the printed circuit board 301, and to apply the epoxy to the concavo-convex structure to form the dam 304.

With the above-described two dam forming methods, it is possible to eliminate the process of forming a dam separately as in the conventional method, or to simplify the dam process compared with the conventional method.

As described above, since the height of the surface of the image sensor chip and the lead portion of the printed circuit board, which requires wire bonding, is minimized, the size of the image sensor chip package can be minimized, and the wire bonding height So that the progressive opening due to the wire tension can be reduced. In addition, by forming the concavo-convex structure in which the spacer is embedded or capable of acting as a spacer on the surface of the glass or on the surface of the printed circuit board to which the glass is to be attached and then epoxy is applied, The installation process can be eliminated.

Although the present invention has been described in detail with reference to the above embodiments, it is needless to say that the present invention is not limited to the above-described embodiments, and various modifications may be made without departing from the spirit of the present invention.

The present invention is effectively applied to a technique of packaging an image sensor chip.

100, 200: image sensor chip package
101, 204: printed circuit board (PCB)
201, 202: first and second printed circuit boards
103, 205, 302: image sensor chip
104, 206, 303: wire
105, 207, 305: Glass cover
106, 208: chip insertion groove

Claims (10)

A printed circuit board having a multilayer electric wiring and formed with a chip insertion groove into which an image sensor chip is inserted;
An image sensor chip inserted into the chip insertion groove;
A wire for electrically connecting the image sensor chip and the printed circuit board;
A dam formed at a rim of the printed circuit board; And
And a glass cover installed on the dam.
The image sensor chip package according to claim 1, wherein a depth of the chip insertion groove is approximately equal to or at least larger than a thickness of the image sensor chip.
The image sensor chip package according to claim 1, wherein the wires are formed by wire bonding, and the heights of the image sensor chip and the leads of the printed circuit board are similar.
2. The image sensor chip package according to claim 1, wherein the dam is formed by applying an epoxy containing a spacing spacer to the printed circuit board.
The image sensor chip package according to claim 1, wherein the dam is formed by forming a concave-convex structure on a surface of the printed circuit board when the printed circuit board is formed, and applying epoxy to the concave-convex structure.
A first printed circuit board having multilayer electrical wiring;
A second printed circuit board stacked on the first printed circuit board, the second printed circuit board having a multilayer electric wiring and forming an insertion groove into which the image sensor chip is inserted;
An image sensor chip inserted into the chip insertion groove;
A wire for electrically connecting the image sensor chip and the second printed circuit board;
A dam formed on a rim of the second printed circuit board;
And a glass cover installed on the dam.
7. The image sensor chip package according to claim 6, wherein a depth of the chip insertion groove is equal to or at least a predetermined number of times larger than the thickness of the image sensor chip.
7. The image sensor chip package of claim 6, wherein the wires are formed by wire bonding, and the heights of the image sensor chip and the leads of the second printed circuit board are similar.
7. The image sensor chip package according to claim 6, wherein the dam is formed by applying an epoxy containing a spacing spacer to the second printed circuit board.
7. The image sensor chip package according to claim 6, wherein the dam is formed by molding a concave-convex structure on a surface of the second printed circuit board and coating the concave-convex structure with epoxy.

KR1020140023031A 2014-02-27 2014-02-27 Image sensor chip package KR20150101571A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020140023031A KR20150101571A (en) 2014-02-27 2014-02-27 Image sensor chip package
CN201410317510.1A CN104882456A (en) 2014-02-27 2014-07-04 Image sensor chip package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140023031A KR20150101571A (en) 2014-02-27 2014-02-27 Image sensor chip package

Publications (1)

Publication Number Publication Date
KR20150101571A true KR20150101571A (en) 2015-09-04

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Family Applications (1)

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CN (1) CN104882456A (en)

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KR20170051972A (en) * 2015-11-03 2017-05-12 삼성전기주식회사 Image sensor package
CN108321141A (en) * 2018-03-08 2018-07-24 信利光电股份有限公司 A kind of novel binding structure and electronic device of chip
US11901385B2 (en) 2020-10-19 2024-02-13 Samsung Electronics Co, Ltd. Semiconductor package and method of fabricating the same

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CN109788167A (en) * 2017-11-10 2019-05-21 格科微电子（上海）有限公司 Reduce the assembly method and camera module of camera module height
CN108538870A (en) * 2018-03-12 2018-09-14 信利光电股份有限公司 A kind of plastic package method of image sensor chip, plastic packaging component and camera
US20210249458A1 (en) * 2018-05-28 2021-08-12 Sony Semiconductor Solutions Corporation Imaging device

Family Cites Families (5)

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Publication number Priority date Publication date Assignee Title
KR100370852B1 (en) * 1999-12-20 2003-02-05 앰코 테크놀로지 코리아 주식회사 semiconductor package
JP5794002B2 (en) * 2011-07-07 2015-10-14 ソニー株式会社 Solid-state imaging device, electronic equipment
CN102569324B (en) * 2012-02-22 2017-03-01 苏州晶方半导体科技股份有限公司 The encapsulating structure of imageing sensor and method for packing
JP2013243340A (en) * 2012-04-27 2013-12-05 Canon Inc Electronic component, mounting member, electronic apparatus, and manufacturing method of these
CN103579258B (en) * 2012-07-18 2016-09-07 光宝电子(广州)有限公司 Embedded substrate modular structure

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170051972A (en) * 2015-11-03 2017-05-12 삼성전기주식회사 Image sensor package
CN108321141A (en) * 2018-03-08 2018-07-24 信利光电股份有限公司 A kind of novel binding structure and electronic device of chip
CN108321141B (en) * 2018-03-08 2023-12-26 信利光电股份有限公司 Binding structure of chip and electronic device
US11901385B2 (en) 2020-10-19 2024-02-13 Samsung Electronics Co, Ltd. Semiconductor package and method of fabricating the same

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