KR20150059358A - method for manufacturing a printed circuit board - Google Patents

Abstract

The present invention relates to a printed circuit board manufacturing method, and more specifically, to a printed circuit board manufacturing method using a multi-point guide using laser processing. The printed circuit board manufacturing method for processing a via hole and a circuit pattern on a substrate comprises: a process of forming a point for processing a via hole and a point for processing a guide hole on the substrate by light exposure; a process of forming the via hole and the guide hole by laser drilling; a process of coating an inner wall of the via hole; a dry film exposure process of aligning a mask film provided to form the circuit pattern to the guide hole on the substrate and exposing the mask film to light; and a process of forming the circuit pattern by using the exposed dry film. When forming a window for circuit continuity, the printed circuit board manufacturing method forms eight identical type window points to form through holes by laser drilling to reduce manufacture lead time by eliminating a conventional drill guide process and alleviate product defects by reducing treatment frequency and improving alignment.

Description

 [0001] METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board manufacturing method, and more particularly, to a technology for forming a guide for forming an image for a printed circuit board (PCB) ≪ / RTI >

In recent years, with the miniaturization of electronic parts for surface mounting such as IC chips, resistors, capacitors, etc., printed wiring boards to be mounted thereon are also required to have high density and many layers. Multilayered printed wiring boards such as four or six conductor layers are used even for civil use, and a multilayer printed wiring board having a larger number of layers for industrial use is in the trend of being used.

 The multilayer printed wiring board is composed of a conductor layer exposed to the outside and a conductor layer of an inner layer not exposed, and an insulating substrate is inserted between the conductor layers, and the conductor layer is bonded by the substrate.

Since a plurality of inner and outer layers are laminated, alignment of wiring and holes between layers is very important.

Therefore, a guiding hole serving as a reference is formed on the inner and outer layers to be the respective layers for accurate matching.

As shown in Fig. 1, in order to constitute a circuit of such a printed circuit board, a drill guide machining (s3) precedes a place for fixing the electronic chip.

Since a plurality of sheets are processed at a time in the drill guide processing (s3) as described above, a processing error may occur due to panel warpage.

Further, during the drilling operation, the inter-product fixing pins are inserted, and defects such as scratches and sticking due to the fixing pins may occur during the disassembling operation.

Fig. 2 shows a defective state due to such handling, and the circuit pattern is unclear, scratches or the like have occurred.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide a drill bit guide for drilling a guide hole, And to improve quality defects by omitting the process of the method.

The present invention provides a method of processing a via hole and a circuit pattern on a substrate, comprising the steps of: forming a point for via hole formation on the substrate by exposure and forming a point for machining a guide hole; A step of plating the inner wall of the via hole, a step of exposing the mask film provided on the substrate with respect to the guide hole, And forming the circuit pattern on the substrate using the exposed dry film.

At this time, it is preferable that points for the guide hole machining are formed at predetermined intervals around the points for machining the via holes.

According to the present invention as described above, the production lead time is shortened by skipping the existing drill guide process.

In addition, there is an effect of improving quality defects by reducing the number of times of handling and improving alignment.

Further, the printed circuit board is thinned and shortened, the thickness precision of the insulating layer is maximized, the operating characteristics of the printed circuit board are improved, the density of the circuit pattern is increased, and the electrical connection between the layers of the multilayer printed circuit board is more reliably .

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a diagram showing a conventional manufacturing process of a pcb,
2 is a diagram showing a defective state according to a conventional process,
3 is a flow chart showing a process for producing a pcb of the present invention,
4 is a view showing a process for manufacturing a pcb of the present invention,
5 is a view showing a guide form by the pcb manufacturing process of the present invention,
6 is a view showing a circuit arrangement state by the pcb manufacturing process of the present invention.

A method of processing a via hole and a circuit pattern on a substrate in a method for manufacturing a printed circuit board of the present invention is characterized by forming a point for processing a via hole on the substrate by exposure and forming a point for processing a guide hole A step (S20) of boring the via hole and the guide hole by laser drilling (S20), a step (S30) of plating the inner wall of the perforated via hole, a step of forming a mask (S40) of aligning a film on the substrate and exposing the film to light, and forming the circuit pattern on the substrate using the exposed dry film (S50). do.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a flowchart showing a method of processing a via hole and a circuit pattern on the substrate of the present invention.

As shown in FIG. 3, the improved printed circuit board manufacturing method of the present invention includes forming a point for via hole processing on a substrate by exposure, and forming points together for forming a guide hole S10), which forms a reference hole used in exposure and lamination prepared in Fig. 4, and forms a multi-point guide for pattern exposure on the circuit board (s15).

The reference hole machining is a tooling hole machining process in which the prepared material is used as a reference for post-machining.

Next, in the process (S20) of drilling the via hole and the guide hole by laser drilling, the multi-point guide and the via hole are simultaneously drilled (s25).

In order to form the multi-point guide as described above, it is preferable to set the point size and check the size of the laser drilled beam to set the optimum size.

FIG. 5 is a diagram showing a guide form by the pcb manufacturing process of the present invention. FIG.

As shown in FIG. 5, it is preferable that the point 80 for forming the guide hole is formed at a predetermined interval around the point 90 for machining the via hole.

Since only about 75% of the size of the laser beam is processed correctly, the window size is set to form the through hole using the double-side processing method.

 Marker Recognition of the Exposure Guide size is very important because accuracy can be different depending on the formation of the circular outline line image.

Next, in the step of plating the inner wall of the perforated via hole (S30), since the resin and glass are exposed in a state where the hole in the drilled hole after the hole processing is not conductive, it is plated with a conductive material so as to be electrically connectable do.

Electroless plating on the inner walls and surfaces of the exposed holes, followed by electrolytic plating to form the thickness of the circuit, enabling electrical connection between circuit layers.

Next, a dry film exposure process (S40) for aligning and exposing a mask film provided for forming the circuit pattern with respect to the guide hole on the substrate,

(S50) of forming the circuit pattern on the substrate using the exposed dry film,

In the next step, the through holes are plated, a working film is aligned on the laminated dry film of the working panel, and a predetermined pattern image is reproduced by supplying a predetermined intensity, exposure time and light energy to the film .

Unlike ordinary drill, the laser drilling method is very good for handling and constant processability by progressing work by vacuum fixing one by one.

It is possible to expect a printed circuit board on which the position matching of the substrate holes is precisely processed as shown in FIG.

The present invention aims to reduce the number of times of handling by omitting the conventional drill guide type process as described above. By omitting the conventional drill guide type process, the lead time can be shortened have.

In addition, there is an effect of improving quality defects by reducing the number of times of handling and improving alignment.

S10: Point forming process S20: Via hole and guide hole drilling process
S30: Inner wall plating process of via hole S40: Dry film exposure process
S50: Circuit pattern formation process
80: guide hole point 90: via hole point

Claims (2)

A printed circuit board manufacturing method for processing a via hole and a circuit pattern on a substrate,
Forming points for via hole processing on the substrate by exposure and forming points together for forming a guide hole;
Drilling the via hole and the guide hole by laser drilling;
Plating the inner wall of the perforated via hole;
A dry film exposure process for aligning and exposing a mask film provided for forming the circuit pattern with reference to the guide hole on the substrate;
Forming the circuit pattern on the substrate using the exposed dry film; ≪ / RTI >
The method according to claim 1,
Wherein a point for forming the guide hole is formed at a predetermined interval around the point for machining the via hole.

Images