KR20150045393A - Method for manufacturing flexible printed circuit board and flexible printed circuit board manufactured by the method - Google Patents

Abstract

This invention is related with a manufacturing method for the flexible printed circuit board and a flexible printed circuit board manufactured by this method. Using the anisotropic conductive adhesive, one can connect circuit patterns of two flexible printed circuit boards. Before applying the anisotropic conductive adhesive on the circuit patterns, one needs to process the surface of the circuit patterns or apply the adhesive on the circuits so that some of the patterns can be connected with each other, thereby the anisotropic conductive layers attaching firmly on the circuit patterns.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method of manufacturing a flexible printed circuit board and a flexible printed circuit board manufactured by the method.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed circuit board manufacturing method and a flexible printed circuit board therefor, and more particularly, to a flexible printed circuit board manufacturing method in which a circuit can be smoothly formed by using an anisotropic conductive material, Circuit board.

In general, a flexible printed circuit board is a substrate that can be flexibly bent by forming a circuit pattern on a thin insulating film, and is widely used in portable electronic devices and automation devices or display products that require flexibility and flexibility in use.

Particularly, in the flexible printed circuit board, the flexible printed circuit board has been widely used in a smartphone whose demand has been explosively increasing in recent years.

An example of the flexible printed circuit board is an antenna such as Near Field Communication (NFC).

The near field communication (NFC) refers to a technique of performing wireless communication at a short distance using a standardized frequency of 13.56 MHz between a portable terminal and an external device. In addition to billing, short-range wireless communications are widely used in supermarkets and general shops for transporting travel information for goods information and visitors, as well as for access control locks.

The flexible printed circuit board includes a terminal portion electrically connected to another flexible printed circuit board or a battery. A circuit pattern is formed on one surface of the substrate, and the terminal portion is formed on the other surface of the substrate.

In addition, the flexible printed circuit board may be manufactured to have a multi-layer structure for effectively arranging circuits for operation of a multi-layered device, and in the case of a flexible printed circuit board composed of a plurality of layers, And the layers are electrically connected to each other after arranging them.

When the flexible printed circuit board needs to have a terminal portion for connecting a circuit to another flexible printed circuit board or a device such as a battery, a circuit is formed on one surface of the substrate, the terminal portion is formed on the other surface of the substrate, The antenna pattern formed on the different surfaces and the terminal connection pattern must be connected to each other. Therefore, the manufacturing process is complicated and the manufacturing cost is increased.

In addition, the terminal portion is subjected to a separate plating process in order to reinforce the rigidity of the connection portion with other terminals. In the process of plating the terminal portion, the adhesion force between the circuit and the substrate is weakened, There is a problem that defects are generated.

Further, when connecting the circuits of the two flexible printed circuit boards, the connection at the connection portion of the circuit is unstable.

Korean Patent Laid-Open Publication No. 2008-0031713 'Manufacturing method of flexible printed circuit board for easy mounting of electronic parts and flexible printed circuit board' (published on April 10, 2008)

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and it is an object of the present invention to provide a flexible printed circuit board manufacturing method in which circuit patterns of two flexible printed circuit boards can be stably connected and held by using an anisotropic conductive material, And to provide a circuit board.

According to an aspect of the present invention, there is provided a method of manufacturing a flexible printed circuit board, comprising: preparing a first substrate having a first circuit pattern and a second substrate having a second circuit pattern;

Surface-treating a circuit connection portion connected to the second circuit pattern among the first circuit patterns;

Forming an anisotropic conductive layer of an anisotropic conductive material on the circuit connection portion; And

And electrically connecting the first circuit pattern and the second circuit pattern to the anisotropic conductive layer by laminating the first base material and the second base material.

In the present invention, the step of performing the surface treatment may remove the oxide film formed on the surface of the first circuit pattern formed of a metallic material.

According to another aspect of the present invention, there is provided a method of manufacturing a flexible printed circuit board, comprising: preparing a first substrate having a first circuit pattern and a second substrate having a second circuit pattern;

Forming an anisotropic conductive layer in which at least a part of an anisotropic conductive material is connected to and fixed to the first substrate, at a portion where the first circuit pattern and the second circuit pattern are connected;

And electrically connecting the first circuit pattern and the second circuit pattern to the anisotropic conductive layer by laminating the first base material and the second base material.

In the present invention, the step of electrically connecting the first circuit pattern and the second circuit pattern may include: forming an insulating layer between the first substrate and the second substrate; And electrically connecting the first circuit pattern and the second circuit pattern through the anisotropic conductive layer.

The method of manufacturing a flexible printed circuit board according to the present invention is characterized in that, before the step of forming the anisotropic conductive layer, the first substrate among the first circuit patterns formed on the first substrate is connected to the second circuit pattern, And forming a substrate connection hole to be exposed.

The step of forming the anisotropic conductive layer may include forming an anisotropic conductive layer by applying an anisotropic conductive paste on a surface of a circuit connecting portion connected to the second circuit pattern of the first circuit pattern, And connecting the anisotropic conductive layer and the first substrate by filling the anisotropic conductive paste.

In the present invention, the step of forming the anisotropic conductive layer may include applying an anisotropic conductive paste to at least one of the surface of the circuit connection part connected to the second circuit pattern and the outer circumference of the circuit connection part of the first circuit pattern An anisotropic conductive layer and an anisotropic conductive connection portion connecting the anisotropic conductive layer and the first base material may be formed.

In the present invention, the step of preparing the first substrate having the first circuit pattern and the second substrate having the second circuit pattern may include a step of forming an antenna having a loop antenna pattern wound on a surface of the first substrate a plurality of times And a terminal pattern having a terminal pattern for connecting the antenna pattern to another circuit board electrically connected to both ends of the antenna pattern on one surface of the second substrate and having a communication circuit, The step of electrically connecting the first circuit pattern and the second circuit pattern includes attaching the terminal unit to the antenna unit so that both ends of the antenna pattern and both ends of the terminal pattern are electrically connected through the anisotropic conductive layer .

The step of electrically connecting the first circuit pattern and the second circuit pattern may include the step of electrically connecting the first circuit pattern and the second circuit pattern to the antenna unit using a bonding sheet having a connection hole formed at a position corresponding to an end of the antenna pattern and an end of the terminal pattern, A step of contacting the terminal unit, and a step of electrically connecting an end portion of the antenna pattern and an end portion of the terminal pattern.

A method of manufacturing a flexible printed circuit board according to the present invention includes the steps of: attaching a cover film to one surface of the first substrate; The method may further include attaching a ferrite sheet to the other surface of the first substrate, and forming the antenna by punching the first substrate in a final designed antenna shape.

In the present invention, the first base material may be a black film, and the step of attaching the electromagnetic wave shielding sheet to one surface of the first base material may be included.

According to another aspect of the present invention, there is provided a flexible printed circuit board comprising: a first substrate having a first circuit pattern formed on a first surface thereof;

A second substrate having a second circuit pattern electrically connected to the first circuit pattern on one surface thereof and stacked on the first substrate; And

And an anisotropic conductive layer which is provided at a circuit connection part connected to the second circuit pattern of the first circuit pattern and electrically connects the first circuit pattern and the second circuit pattern and is formed of an anisotropic conductive material,

And at least a part of the anisotropic conductive layer is connected and fixed to one surface of the first base.

In the present invention, a substrate connection hole is formed in the circuit connection portion with the second circuit pattern in the first circuit pattern, and the anisotropic conductive layer formed on the surface of the circuit connection portion is connected to the first substrate May be provided.

In the present invention, the circuit connecting portion connecting the anisotropic conductive layer to the first substrate may be provided outside the circuit connection portion with the second circuit pattern in the first circuit pattern.

In the present invention, a substrate connection hole is formed in the circuit connection portion with the second circuit pattern in the first circuit pattern, and the anisotropic conductive layer formed on the surface of the circuit connection portion is connected to the first substrate May be provided.

In the present invention, the circuit connecting portion connecting the anisotropic conductive layer to the first substrate may be provided outside the circuit connection portion with the second circuit pattern in the first circuit pattern.

The flexible printed circuit board according to the present invention may further include an insulating layer which is provided between the first substrate and the second substrate and covers a contact portion between the first circuit pattern and the second circuit pattern, .

In the present invention, the first circuit pattern is a loop-shaped antenna pattern wound a plurality of times, the first substrate is an antenna unit, the second circuit pattern is electrically connected to both ends of the antenna pattern, And the second substrate may be a terminal unit attached to the antenna unit.

In the present invention, the terminal unit is attached to the antenna unit by a bonding sheet, and the bonding sheet may be formed with a connection hole exposing a part of both ends of the antenna pattern.

The flexible printed circuit board according to the present invention may further include a step difference compensation pattern formed on one surface of the first substrate so as to be spaced apart from the antenna pattern and compensating a stepped portion by the antenna pattern.

In the present invention, the first substrate may be a black film, and may further include an electromagnetic wave shielding sheet attached to one surface of the first substrate to cover the antenna pattern.

The present invention is advantageous in that an anisotropic conductive layer formed of an anisotropic conductive paste is firmly attached to a circuit pattern, so that two flexible printed circuit boards can be stably connected and held via an anisotropic conductive layer.

The present invention has the effect of securing operational reliability of a flexible printed circuit board to improve product satisfaction and merchantability.

1 is a block diagram illustrating an embodiment of a method of manufacturing a flexible printed circuit board according to the present invention.
2 is a schematic view showing an embodiment of a method of manufacturing a flexible printed circuit board according to the present invention.
3 is a block diagram illustrating another embodiment of a method of manufacturing a flexible printed circuit board according to the present invention.
4 is a schematic view showing another embodiment of the method of manufacturing a flexible printed circuit board according to the present invention.
5 and 6 are schematic views showing an embodiment of manufacturing an antenna by a method of manufacturing a flexible printed circuit board according to the present invention.
7 is a cross-sectional view showing a flexible printed circuit board according to the present invention
8 is a cross-sectional view showing another example of the flexible printed circuit board according to the present invention
9 and 10 are views showing an antenna which is an embodiment of a flexible printed circuit board according to the present invention
11 and 12 are exploded perspective views showing an antenna which is another embodiment of the flexible printed circuit board according to the present invention.
13 is a cross-sectional view taken along the line AA '

The present invention will now be described in detail with reference to the accompanying drawings. Hereinafter, a repeated description, a known function that may obscure the gist of the present invention, and a detailed description of the configuration will be omitted. Embodiments of the present invention are provided to more fully describe the present invention to those skilled in the art. Accordingly, the shapes and sizes of the elements in the drawings and the like can be exaggerated for clarity.

1 and 2, a method of manufacturing a flexible printed circuit board according to the present invention includes a first substrate 10 provided with a first circuit pattern 11, a second substrate 10 provided with a second circuit pattern 21, 2 substrate 20 (S100).

The first substrate 10 and the second substrate 20 are flexible insulating films that use an extremely thin, flexible, transparent or translucent insulating film provided to maintain the shape of a flexible printed circuit board. The insulating film may be an EPT film or a PI film. The PI film is thin and flexible, excellent in heat resistance and resistance to crushing, has little dimensional change, and is resistant to heat. Therefore, when a metal foil is heat- And the PET film is advantageous in that the price of the PI film is comparatively low.

The first circuit pattern 11 is formed on the first base material 10 and the second circuit pattern 21 is formed on the second base material 20 by forming a circuit pattern having conductivity on the base material Or may be formed by the same method or may be formed by different methods.

The process of forming a circuit pattern on the substrate may be performed by forming a loop antenna pattern 11 'wound on one surface of the first base material 10 several times and arranging the antenna pattern 11' on one surface of the second base material 20, And a terminal pattern 21 'for connecting the antenna pattern 11' to another circuit board which is electrically connected to both ends of the antenna pattern 11 'and is provided with a communication circuit.

That is, the step (S100) of preparing the first base material 10 provided with the first circuit pattern 11 and the second base material 20 provided with the second circuit pattern 21 is a step A first substrate 10 provided with a pattern 11 'and an antenna pattern 11' which is electrically connected to both ends of the antenna pattern 11 ' The terminal pattern 21 'for connection of the terminal pattern 21' is prepared.

In the process of forming the circuit pattern on the substrate, a circuit pattern may be formed by etching a metal foil on one side of the substrate followed by etching.

In the process of forming the circuit pattern, a conductive paste may be printed on one surface of the substrate in the form of a circuit pattern and fired to form a circuit pattern.

In the process of forming the circuit pattern, a circuit pattern may be formed by printing a conductive paste on one surface of a substrate in the form of a circuit pattern, drying the conductive paste, and plating the surface of the dried conductive paste.

The step of forming the circuit pattern may include forming a loop pattern by winding a metal foil on one surface of the substrate and winding the metal foil on the substrate several times and removing the portion of the metal foil except the circuit pattern, A circuit pattern can be formed on one surface of the substrate.

The process of forming the circuit pattern may include forming a circuit pattern on a metal foil laminated on one side of the transfer film, bonding the metal foil to one side of the transfer film, transferring the circuit pattern to the substrate A circuit pattern can be formed on one surface of the substrate.

The step of transferring the circuit pattern onto the base material includes an adhesive layer on one surface of the base material or on the surface of the circuit pattern to transfer the circuit pattern laminated on the transfer film to one surface of the base material. The adhesive layer provided on the base material is formed of an adhesive having a stronger adhesive force than the adhesive layer to which the metal foil is adhered in the transfer film so that the circuit pattern to be adhered to the transfer film is smoothly transferred to the base material .

The transferring step may include removing the portion other than the circuit pattern formed on the metal foil, transferring the circuit pattern onto the substrate, and performing a laminating process.

The transferring step may include a step of removing a portion of the metal foil on which the circuit pattern has been formed excluding the circuit pattern and forming an adhesive layer on one surface of the substrate so that one surface of the transfer film overlaps one surface of the substrate And the circuit pattern is transferred to the base material by thermocompression bonding. The transfer film is separated from the substrate after thermocompression.

The portion of the metal foil excluding the circuit pattern is preferably removed from the metal foil while pressing the circuit pattern with a jig capable of pressing part or all of the circuit pattern. This is to prevent a portion of the circuit pattern from being removed together when the portion of the metal foil except for the circuit pattern is removed. That is, the transferring process includes removing a portion (scrap) excluding the circuit pattern from the transfer film while pressing a part or the whole of the circuit pattern using a jig.

The transferring step may include a step of forming an adhesive layer on one surface of the base material, arranging the one surface of the transfer film and the one surface of the base material so as to overlap with each other, applying heat only to the portion where the circuit pattern is formed, Separating the film from the substrate and removing the metal foil from the transfer film and the portion (scrap) excluding the circuit pattern. In this case, the adhesive layer is formed of a thermosetting adhesive.

The transferring process is performed without removing the portion of the metal foil except for the circuit pattern. That is, the circuit pattern is formed in the metal foil.

The substrate is brought into contact with the surface of the metal foil and only the portion where the circuit pattern is formed is heated and pressed to transfer only the circuit pattern onto the substrate. When the transfer film is separated from the circuit pattern only on the substrate, the metal foil portion excluding the circuit pattern is removed separately from the transfer film.

The transferring process removes a portion of the transfer film and the metal foil excluding the circuit pattern.

Therefore, a separate transferring step is not required, so that the working time is greatly shortened, and the failure of the position of the circuit pattern during the transferring operation is also prevented.

The transferring step may separate the circuit pattern from the transfer film and transfer it to the substrate.

Wherein the transferring step includes the steps of: vacuum-adsorbing the circuit pattern on the transfer film using a mold having a vacuum adsorption pattern corresponding to the shape of the circuit pattern, and transferring the separated circuit pattern directly to one surface of the substrate As an example.

More particularly, the present invention relates to a method of manufacturing a semiconductor device, in which a vacuum adsorption pattern is placed on the metal mold corresponding to the circuit pattern, and the circuit pattern is absorbed by the vacuum adsorption pattern to separate the transfer film and the metal foil, The circuit pattern is directly transferred to one surface of the substrate. In this case, automation is possible, which shortens the working time.

The circuit pattern is formed of a conductive paste or a metal foil as described above. The conductive paste may be a copper paste or a silver paste, and the metal foil may be an aluminum foil or a copper foil or an Ag foil.

The metal foil is preferably an aluminum foil (AL foil). The aluminum foil can be used directly as a circuit pattern by using a material having a thickness of 9 to 40 탆. In particular, when the circuit pattern is the antenna pattern 11 ', the aluminum foil can be directly used as the antenna pattern 11'. That is, it is easy to control the thickness of the circuit pattern by adjusting the thickness of the aluminum foil. Aluminum has a high thermal conductivity compared to copper and has a low resistance, so that it can form a circuit pattern with a thin thickness of 9 to 40 mu m and can be used as a circuit pattern, particularly, an antenna pattern 11 'without additional plating process.

To cope with this, in the case of a copper pattern, it is necessary to secure a pattern thickness of 20 μm through plating after etching, mainly by Sn plating. This is to minimize heat generation and power consumption.

The circuit pattern is preferably formed of a metal material having excellent conductivity. When the metal material is formed of a metal such as Al (aluminum), which is oxidized in air, oxidation occurs on the surface.

The method for manufacturing a flexible printed circuit board according to the present invention includes a step (S200) of surface-treating a circuit connection portion connected to the second circuit pattern 21 among the first circuit patterns 11.

The surface treatment step S200 removes the oxide film formed on the surface of the first circuit pattern 11 formed of a metallic material. The surface treatment step S200 may further include surface-treating a circuit connection part connected to the first circuit pattern 11 of the second circuit pattern 21. [ When the first circuit pattern 11 and the second circuit pattern 21 are formed of a metal material such as aluminum that is oxidized by being in contact with air, the surface of the first circuit pattern 11 and the surface of the second circuit pattern 21 The anisotropic conductive paste is hardly adhered even if the anisotropic conductive paste is applied. The surface treatment step S200 may include removing the first circuit pattern 11 of the metal material and other foreign materials including the oxide film formed on the surface of the second circuit pattern 21, The anisotropic conductive paste is applied to the circuit connection portion of the second circuit pattern 21 so that the circuit pattern can be securely attached and fixed.

After the step S200 of performing the surface treatment, an anisotropic conductive layer 30 is formed of an anisotropic conductive material at the circuit connection portion (S300).

In the step S300 of forming the anisotropic conductive layer 30, anisotropic conductive paste (ACP) is applied to the circuit connection portion to form the anisotropic conductive layer 30. [

The first substrate 10 and the second substrate 20 are laminated so that the first circuit pattern 11 and the second circuit pattern 21 are electrically connected to each other.

The step (S400) of electrically connecting the first circuit pattern 11 and the second circuit pattern 21 may include forming an insulating layer 40 between the first substrate 10 and the second substrate 20, (S410); And electrically connecting the first circuit pattern 11 and the second circuit pattern 21 through the anisotropic conductive layer 30 (S420).

The step of forming the insulating layer 40 may include forming the first circuit pattern 11 and the second circuit pattern 21 when the first substrate 10 and the second substrate 20 are laminated, The insulating layer 40 is formed at a portion where the first circuit pattern 11 and the second circuit pattern 21 are electrically connected to each other except the circuit connecting portion to prevent a short circuit .

The anisotropic conductive paste is applied to the anode side and the cathode side, respectively, so that the anisotropic conductive paste can be electrically connected to the second circuit pattern (21) in the first circuit pattern (11), and the insulating layer (40) 10) and the second base material (20), a portion of the first circuit pattern (11) and the second circuit pattern (21) 11 and the second circuit pattern 21 are electrically connected to each other.

The insulating layer 40 is a bonding sheet 41 attached to the first base 10 and having a connection hole 41a exposing the circuit connection portion.

The bonding sheet 41 is provided with adhesive layers on both surfaces thereof and is attached to the first base 10 and the second base 20, respectively.

The second base material 20 may be formed on the first circuit pattern 11 so that the circuit connecting portion of the second circuit pattern 21 is located at a circuit connection portion of the first circuit pattern 11, (10), and the first circuit pattern (11) and the second circuit pattern (21) are electrically connected by the anisotropic conductive paste.

Step S420 of electrically connecting the first substrate 10 and the second substrate 20 through the anisotropic conductive layer 30 includes a step of hot pressing the first substrate 10 and the second substrate 20 by applying heat and pressure.

When the heat and pressure are applied to the anisotropic conductive paste, the conductive ball is broken and the first circuit pattern 11 and the second circuit pattern 21 are separated from each other, Respectively. Heat and pressure are applied to the anisotropic conductive paste through the hot press so that the circuit connecting portion of the first circuit pattern 11 and the circuit connecting portion of the second circuit pattern 21 are respectively connected to the anisotropic conductive layer 30 in the thickness direction . This protects the circuit connection portions of the first circuit pattern 11 and the second circuit pattern 21, increases durability, and prevents a short circuit in the connection portion. In addition, the circuit connection portion of the first circuit pattern 11 and the circuit connection portion of the second circuit pattern 21 are stably connected in the connection hole 41a. This is because the electrical connection between the first circuit pattern 11 and the second circuit pattern 21 in the connection hole 41a may be unstable due to the thickness of the insulating layer 40. [

Another example of a method of manufacturing a flexible printed circuit board according to the present invention will be described with reference to FIGS. 3 and 4. FIG. A method of manufacturing a flexible printed circuit board according to the present invention includes the steps of preparing a first substrate 10 provided with a first circuit pattern 11 and a second substrate 20 provided with a second circuit pattern 21 The anisotropic conductive layer 30 (at least a part of which is connected to and fixed to the first base 10) is connected to the portion where the first circuit pattern 11 and the second circuit pattern 21 are connected after the step (S100) The first substrate 10 and the second substrate 20 are laminated to form the first circuit pattern 11 and the second circuit pattern 30 with the anisotropic conductive layer 30, 12) are electrically connected to each other (S400).

The step 110 of preparing the first base material 10 provided with the first circuit pattern 11 and the second base material 20 provided with the second circuit pattern 21 forms the circuit pattern The first circuit pattern 11 and the second circuit pattern 21 may be formed on the first substrate 10 and the second substrate 20, respectively, and modified. The step (S100) of preparing the first base material 10 provided with the first circuit pattern 11 and the second base material 20 provided with the second circuit pattern 21 is the same as the embodiment described above And it is omitted as redundant description.

The anisotropic conductive paste is applied to the first circuit pattern 11 so that at least part of the first circuit pattern 11 is connected to the first substrate 10 on the surface of the circuit connection portion connected to the second circuit pattern 21, (S400) of electrically connecting the first circuit pattern (11) and the second circuit pattern (21) by stacking the first circuit pattern (10) and the second base material (20) .

The step (S100) of preparing the first base material 10 provided with the first circuit pattern 11 and the second base material 20 provided with the second circuit pattern 21 may be performed by using the first base material 10 The method for manufacturing a flexible printed circuit board according to the present invention is characterized in that the first circuit pattern 11 is formed on the first substrate 10, (S110) forming a substrate connection hole (10a) for exposing the first substrate (10) to a circuit connection part connected to the first substrate (21).

The step of forming the anisotropic conductive layer 30 may further include forming an anisotropic conductive layer 30 as an anisotropic conductive material on the surface of the circuit connecting portion of the first circuit pattern 11 connected to the second circuit pattern 21, Forming an anisotropically conductive layer 30 on the anisotropic conductive layer 30 by filling the anisotropic conductive material in the base connection hole 10a and connecting and fixing the anisotropic conductive layer 30 to the first base 10;

The step S310 of forming the anisotropic conductive layer 30 includes an anisotropic conductive layer 30 formed on the surface of the first circuit pattern 11 connected to the second circuit pattern 21, An anisotropically conductive material is filled in the substrate connection hole 10a to form an anisotropic conductive connection 31 connecting the anisotropic conductive layer 30 and the surface of the first base 10.

For example, the step (S310) of forming the anisotropic conductive layer 30 may be performed by applying an anisotropic conductive paste onto a circuit connection portion of the first circuit pattern 11 connected to the second circuit pattern 21 The anisotropic conductive layer 30 is formed and the anisotropic conductive connection portion 31 is formed by filling the anisotropic conductive paste in the base connection hole 10a.

In the step S310 of forming the anisotropic conductive layer 30, when the anisotropic conductive paste is applied on the circuit connecting portion of the first circuit pattern 11, the anisotropic conductive paste is filled in the base connection hole 10a Thereby forming the anisotropic conductive connection portion 31.

Although not shown, the step of forming the anisotropic conductive layer 30 (S310) may be such that at least one side of the outer circumference of the circuit connecting portion of the first circuit pattern 11 is made of the anisotropic conductive material An anisotropic conductive connection portion 31 connecting the conductive layer 30 and the first base 10 may be formed.

The step 300 of forming the anisotropic conductive layer may include applying an anisotropic conductive paste on the circuit connection portion of the first circuit pattern 11, So that the conductive paste is partially connected to the surface of the first base material 10 through the side surface of the circuit connecting portion.

The anisotropic conductive layer 30 formed on the surface of the circuit connection portion by being coated with anisotropic conductive paste is connected to the first base 10 by the anisotropic conductive connection portion 31 and is held in a more firmly attached state do.

 The step of preparing the first base material 10 provided with the first circuit pattern 11 and the second base material 20 provided with the second circuit pattern 21 may be the same as the first base material 10, The second circuit pattern 21 is formed on the first circuit pattern 20 and then the second circuit pattern 21 is connected to the circuit connection portion connected to the first circuit pattern 11, And further forming a hole.

The step S310 of forming the anisotropic conductive layer 30 may further include the step of filling the substrate connection hole 10a of the second circuit pattern 21 with an anisotropic conductive material so that the first circuit pattern 11 And the anisotropic conductive layer 30 disposed between the second circuit pattern 21 and the second circuit pattern 21 are held firmly attached to the first circuit pattern 11 and the second circuit pattern 21 The stability of the electrical connection can be greatly improved.

The first substrate 10 and the second substrate 20 are laminated to electrically connect the first circuit pattern 11 and the second circuit pattern 21 to the anisotropic conductive layer 30 .

The step (500) of electrically connecting the first circuit pattern 11 and the second circuit pattern 21 may be performed in the same manner as the above-described embodiment, and the overlapping substrate is omitted.

Referring to FIG. 5, an example of manufacturing a flexible printed circuit board according to the present invention will be described in which an antenna is manufactured. In this case, it is confirmed that the following antenna pattern 11 'is included in the first circuit pattern 11, and the antenna terminal portion 21a and the terminal connection portion 21b described below are included in the second circuit pattern 21.

In the antenna manufacturing method, the step of preparing the first base material 10 provided with the first circuit pattern 11 and the second base material 20 provided with the second circuit pattern 21 may include the steps of: The method comprising the steps of: preparing an antenna unit (1) having a loop antenna pattern (11 ') wound on a surface of a first substrate (10) And preparing a terminal unit having a terminal pattern 21 'for connecting the antenna pattern 11' to another circuit board which is electrically connected to the communication circuit and is provided with a communication circuit, respectively.

The antenna pattern 11 'is formed of an aluminum foil as an example.

The step of preparing the antenna unit 1 may include forming a step difference compensation pattern 11a on one surface of the first base 10 to compensate a stepped portion by the antenna pattern 11 ' It is preferable to form them together.

The step of preparing the terminal unit 2 includes a terminal connection part connected to one end of the antenna pattern 11 'at one end and the antenna pattern 11' A step of forming two terminal patterns 21 'on the second base 20 having an antenna terminal for connection to another circuit board having the terminal pattern 21a; plating the antenna terminal 21a; And attaching a terminal cover sheet 22 covering a remaining part of the antenna terminal part 21a and at least a part of the terminal connection part 21b and a part of the antenna terminal part 21a plated in the antenna terminal part 21 '. The second base material 20 is a PI film. The terminal pattern 21 'is formed by etching on one side of the second substrate 20. Preferably, the plating process tin plating the antenna terminal portion 21a to greatly increase the hardness and wear resistance of the antenna terminal portion 21a.

The terminal cover sheet 22 covers a portion of the antenna terminal portion 21a excluding a portion connected to other terminals and a terminal connecting portion 21b connected to the antenna pattern 11 ' Thereby protecting the terminal portion 21a and the terminal connection portion 21b.

The terminal cover sheet 22 exposes a portion of the antenna terminal portion 21a connected to a terminal of another circuit board and a portion of the terminal connection portion 21b connected to the antenna pattern 11 ' Thereby enabling stable connection of the pattern 21 '. The terminal cover sheet 22 is formed with a terminal connection hole for exposing a portion of the antenna terminal portion 21a connected to a terminal of another circuit board.

The antenna according to the present invention is punched out in the shape and size of the mounting surface to be mounted and mounted on the mounting surface. The step difference compensating pattern 11a is formed such that the thickness of the antenna pattern 11 'at a portion excluding the antenna pattern 11' in the shape of the antenna formed when the size of the mounting surface is larger than the size of the antenna pattern 11 ' And the other part is mounted on the antenna, the mounting is unstable due to the stepped portion due to the antenna pattern 11 ', and the beauty is deteriorated, which is a cause of deteriorating the merchantability of the product .

If the mounting surface on which the antenna is mounted is larger than a predetermined size by the shape of the antenna pattern 11 ', the step difference compensating pattern 11a may be covered with the cover film 11' 10 with the antenna pattern 11 'on one side thereof.

The step difference compensation pattern 11a is preferably formed by the same process as a metal foil or a metal paste forming the antenna pattern 11 'so as to easily form the same thickness as the antenna pattern 11'.

The step of surface-treating a circuit connection portion of the first circuit pattern 11 connected to the second circuit pattern 21 and the step of forming an anisotropic conductive layer 30 in the circuit- The surface oxide film is removed from part of the both end portions provided on the inner and outer sides of the antenna pattern 11 ', and the anisotropic conductive layer 30 is formed of an anisotropic conductive material.

The step of forming the anisotropic conductive layer 30 may be performed by printing and drying an anisotropic conductive paste (ACP) on a part of both ends of the antenna pattern 11 ' For example.

The step of electrically connecting the first circuit pattern 11 and the second circuit pattern 21 may include a step of electrically connecting the end of the antenna pattern 11 'and the end of the terminal pattern 21' A process of contacting the terminal unit 2 to the antenna unit 1 by using a bonding sheet 41 having a terminal pattern 41a formed thereon and a process of attaching the terminal unit 2 to an end of the antenna pattern 11 ' And connecting the ends electrically.

In the process of contacting the terminal unit 2, the bonding sheet 41 is attached on the first base 10 to expose both end sides of the antenna pattern 11 'through the connection holes 41a The terminal unit 2 is brought into contact with the bonding sheet 41 so that an end portion of the terminal pattern 21 'of the terminal unit 2, that is, the terminal connection portion is formed at both ends of the antenna unit 1 Layered on the anisotropic conductive layer 30 and then connected.

The method for manufacturing an antenna includes the steps of attaching a cover film 50 to one side of the first base 10 and attaching the electromagnetic wave shielding sheet 60 to the other side of the first base 10 S600), and forming (700) an antenna by tapping the first substrate (10) in a final designed antenna shape.

The cover film 50 is attached to one surface of the first substrate 10 on which the antenna pattern 11 'is formed to protect the antenna pattern 11'.

The bonding sheet 41 has a thermosetting adhesive layer and is in contact with the second base material 20. The step of attaching the cover film 50 may include pressing the cover film 50 with the first hot- Is adhered to one surface of the base material (10), and the second base material (20) is made to be in contact via the bonding sheet (41). The second base material 20 is firstly bonded by the bonding sheet 41 to easily fix the terminal connecting portion 21b and the antenna pattern 11 ' .

Attaching the cover film 50 by the first hot pressing is to form an adhesive layer between the cover film 50 and the substrate, and then to heat-press the cover film 50. The cover film 50 is heated at a temperature of 140 to 160 ° C under a load of 50 to 70 kg Min for 60 minutes.

The step of attaching the electromagnetic wave shielding sheet 60 to the other surface of the first base material 10 attaches the electromagnetic wave shielding sheet 60 to the other surface of the first base material 10 by the second hot pressing.

The second hot pressing is a step of forming an adhesive layer between the base material and the electromagnetic shielding sheet 60, followed by hot pressing, and heating and pressing at a temperature of 50 to 60 DEG C and a load of 30 to 50 kg for 40 to 60 minutes For example.

6, the first substrate 10 is a black film, and the first circuit pattern 11 and the second circuit pattern 21 are electrically connected to one surface of the first substrate 10 After the connecting step, the step of attaching the electromagnetic shielding sheet 60 (S600), and the step of forming the antenna (S700) by tapping the first base material 10 with the finally designed antenna shape.

The electromagnetic shielding sheet 60 is attached to one surface of the first circuit pattern 11, that is, the first substrate 10 on which the antenna pattern 11 'is formed, thereby forming a separate cover film on the first substrate 10 So that it is possible to manufacture the antenna with a slimmer, simpler manufacturing process and lower manufacturing cost.

The electromagnetic wave shielding sheet 60 is a ferrite sheet.

7, a flexible printed circuit board manufactured by the method of manufacturing a flexible printed circuit board according to the present invention includes a first substrate 10 having a first circuit pattern 11 on one surface thereof, A second substrate 20 provided on one side with a second circuit pattern 21 electrically connected to the pattern 11 and a second circuit pattern 21 connected to the second circuit pattern 21 of the first circuit pattern 11, And an anisotropic conductive layer 30 provided at a connection portion and electrically connecting the first circuit pattern 11 and the second circuit pattern 21 to each other.

The flexible printed circuit board according to the present invention is provided between the first substrate 10 and the second substrate 20 so that the first circuit pattern 11 and the second circuit 20, And an insulating layer (40) covering the contact portion of the pattern (21). The insulating layer 40 prevents shorts.

The anisotropic conductive layer 30 is formed of an anisotropic conductive material, and an example of the anisotropic conductive material is anisotropic conductive paste. At least a portion of the anisotropic conductive layer 30 is adhered to the first substrate 10 so that the anisotropic conductive layer 30 is firmly attached to the circuit connecting portion connected to the second circuit pattern 21 in the first circuit pattern 11 .

Therefore, the anisotropic conductive layer 30 is firmly attached to the connecting portion of the first circuit pattern 11 and the second circuit pattern 21, so that the first circuit pattern 11 and the second circuit pattern 21 21) are stably connected and the reliability is improved.

A substrate connection hole 10a is formed in a circuit connection portion with the second circuit pattern 21 in the first circuit pattern 11 and a connection hole 10a formed in the substrate connection hole 10a is formed in a surface of the circuit connection portion And an anisotropic conductive connection part 31 connecting the anisotropic conductive layer 30 with the first base 10 is provided.

The anisotropically conductive connection portion 31 is formed by filling an anisotropic conductive paste in the circuit connection hole.

Referring to FIG. 8, the anisotropically conductive connection portion 31 may be connected to the first circuit pattern 11 via the circuit connection portion with the second circuit pattern 21.

The anisotropically conductive connection part 31 is formed of an anisotropic conductive paste. The anisotropic conductive layer 30 formed on the surface of the first circuit pattern 11 is connected to the first base 10 The surface adhesion force of the anisotropic conductive layer 30 is reinforced.

9, an antenna will be described as an example of a flexible printed circuit board according to the present invention.

8, the flexible printed circuit board according to the present invention includes an antenna unit 1 having a loop-shaped antenna pattern 11 'wound on a surface of a first base 10 a plurality of times, a second base 20 (21 ') for connecting the antenna pattern (11') to another circuit board which is electrically connected to both ends of the antenna pattern (11 ') and is provided with a communication circuit, unit; A connection hole 41a is provided between the antenna unit 1 and the terminal unit 2 and exposes both ends of the antenna pattern 11 ' A bonding sheet 41 for preventing a short circuit of the pattern 21 'and an antenna pattern 11' provided at both ends of the antenna pattern 11 'and the antenna pattern 11' of the terminal pattern 21 ' And an anisotropic conductive layer (30) provided on a portion of both end sides of the anisotropic conductive layer (30). The antenna pattern 11 'is included in the first circuit pattern 11 formed on the first substrate 10 and the terminal connection portion 21b and the antenna terminal portion 21a are formed on the second substrate 20, And the second circuit pattern 21 formed on the second circuit pattern 21.

The anisotropic conductive layer 30 is formed at both ends of the antenna pattern 11 ', that is, at a circuit connecting portion of the first circuit pattern 11, and is formed on the surface of the antenna pattern 11' A portion of which is connected to the first substrate 10.

The first base material 10 may be one of a PI film and a PET film, and a PET film having a relatively low price may be used. The second base material 20 is an ET film or a PI film. The PI film is thin and flexible, has excellent heat resistance and resistance to crushing, has little dimensional change and is resistant to heat, and thus, It is suitable as an insulating film, and the PET film is advantageous in that the price of the PI film is relatively low.

The antenna pattern 11 'is formed of a metal foil, and the metal foil may be any one of an aluminum foil and a copper foil or an Ag foil.

The metal foil is preferably an aluminum foil (AL foil). The aluminum foil having a thickness of 9 to 40 mu m can be used directly as the antenna pattern 11 '. That is, it is easy to adjust the thickness of the antenna pattern 11 'by adjusting the thickness of the aluminum foil. Aluminum has a high thermal conductivity compared to copper and has a low resistance, so that it can be used as an antenna pattern 11 'without additional plating process with a thin thickness of 9 to 40 탆.

The antenna according to the present invention can easily form the antenna pattern 11 'without any additional process such as plating using an aluminum foil and the thickness of the antenna pattern 11' The manufacturing cost can be reduced.

In addition, the antenna according to the present invention can further reduce manufacturing cost by using the first base material 10 as PET.

The antenna pattern 11 'is formed in a loop shape having a plurality of turns and both ends are disposed on the inside and the outside of the antenna pattern 11', and a portion of both ends of the antenna pattern 11 'is connected to the terminal connecting portion 21b to be.

The antenna according to the present invention may further include a step difference compensation pattern 11a formed on one surface of the first substrate 10 and spaced apart from the antenna pattern 11 ' .

The antenna is punched out in the shape and size of the mounting surface to be mounted and mounted on the mounting surface. When the size of the mounting surface is larger than the size of the antenna pattern 11 ', a step difference in the shape of the antenna formed by the thickness of the antenna pattern 11' is generated at a portion excluding the antenna pattern 11 ' The back view tube is deteriorated and mounting of other parts to the antenna is unstable due to the stepped portion by the antenna pattern 11 'and the beauty is deteriorated, which is a cause of deteriorating the merchantability of the product.

The step difference compensation pattern 11a is formed such that the mounting surface on which the antenna is mounted is larger than the shape of the antenna pattern 11 'by a predetermined size or larger, and the portion of the antenna except for the antenna pattern 11' The stepped portion by the antenna pattern 11 'is compensated. The step difference compensation pattern 11a is formed with the same metal foil or conductive paste as the antenna pattern 11 'together with the antenna pattern 11' so as to have the same thickness as the antenna pattern 11 ' Simplification is desirable.

10, the terminal unit 2 includes two terminal patterns 21 'connected to both ends of the antenna pattern 11', and the two terminal patterns 21 ' One end of the antenna pattern 11 'is electrically connected to both ends of the antenna pattern 11', and the other end of the antenna pattern 11 'is arranged outside the antenna pattern 11'.

The terminal pattern 21 'is provided at its one end with a terminal connection part connected to the end of the antenna pattern 11' and the antenna pattern 11 ' That is, an antenna terminal portion for connecting to another circuit board having a communication circuit is provided.

The second base material 20 is provided with a terminal hole for exposing the antenna terminal portion 21a on both sides. The antenna terminal portions 21a are disposed adjacent to and adjacent to each other and are exposed to both sides of the second substrate 20 by the terminal holes to be connected to other terminals connected to other terminals, Can be freely selected. Preferably, the antenna terminal portion 21a is provided with a tin plating layer on its surface to improve hardness and durability. The terminal patterns 21 'are connected to the opposite end portions of the antenna pattern 11' through terminal connection portions 21b, respectively. The base 20 is formed by attaching a part of the plated antenna terminal part 21a and a terminal cover sheet 22 covering a part of the terminal connection part 21b to connect the antenna terminal part 21a and the terminal connection part 21b, It is more preferable to reinforce the rigidity of the second portion 21b.

9, the terminal unit is attached to the antenna unit 1 by a bonding sheet 41, and the bonding sheet 41 exposes portions of both ends of the antenna pattern 11 ' A connection hole 41a is formed.

The bonding sheet 41 is attached to a position where the terminal unit is attached so that the terminal connection part 21b is connected to only a part of both ends of the antenna pattern 11 'exposed in the connection hole 41a, Thereby preventing a short circuit between the terminal connecting portion 21b and the upper antenna pattern 11 '.

Since the antenna pattern 11 'is formed in a loop shape having a plurality of turns and both ends are disposed on the inside and the outside, any one of the two terminal patterns 21' is located inside the antenna pattern 11 ' And is disposed to extend to the outside of the antenna pattern 11 'across the antenna pattern 11'.

That is, the bonding sheet 41 is attached to the antenna unit 1 at a position where the terminal unit 2 is attached, and the terminal pattern 21 'connected to the end located inside the antenna pattern 11' Of the terminal pattern 21 'is connected to the end side located inside the antenna pattern 11' exposed to the connection hole 41a, and another portion of the terminal pattern 21 'is connected to the antenna pattern 11' So as to prevent a short circuit by the terminal pattern 21 'and the upper antenna pattern 11'.

The bonding sheet 41 may be bonded to the end portion of the terminal pattern 21 'corresponding to the shape of the terminal pattern 21' connected to the end portion of the two terminal patterns 21 'disposed outside the antenna pattern 11' Of the terminal pattern 21 'is connected to the end portion of the terminal pattern 21' located outside the antenna pattern 11 'exposed to the connection hole 51 and the other portion of the terminal pattern 21' Thereby preventing a short circuit by the terminal pattern 21 'and the upper antenna pattern 11'.

The bonding sheet 41 is formed to have an adhesive layer on both sides so as to be capable of double-sided adhesion, and has a thermosetting adhesive layer that can be folded. The bonding sheet 41 is stored in a state that the release sheets are attached to both sides thereof, and they are used after removing the release sheets in use.

In addition, the antenna according to the present invention further includes a cover film 50 attached to one surface of the first base 10 to protect the antenna pattern 11 '.

In addition, the antenna according to the present invention further includes an electromagnetic wave shielding sheet 60 attached to the other surface of the first base 10 to shield electromagnetic waves generated from the antenna.

The electromagnetic wave shielding sheet 60 is a ferrite sheet.

The antenna according to the present invention may be mounted on the surface of a battery of a corresponding electronic device, connected to another printed circuit board through a terminal of the battery, or attached to the inner surface of the battery cover. In this case, a ferrite sheet may be disposed between the battery and the antenna or between the battery cover and the antenna for shielding electromagnetic waves. The electromagnetic shielding sheet 60 is disposed on one side of the first base 10 of the antenna and disposed between the first base 10 and the battery or between the first base 10 and the battery cover So as to shield the electromagnetic wave as well as to protect the antenna pattern 11 '.

That is, the first substrate 10 is formed such that the antenna pattern 11 'to be mounted is formed of aluminum foil, one surface of the first substrate 10 faces the mounting surface of the object, and the electromagnetic shielding sheet 60 The thickness of the coverlay can be reduced, and the thickness of the antenna can be further reduced.

That is, one surface of the first substrate 10 on which the antenna pattern 11 'is formed is disposed opposite to the mounting surface of the object to be mounted, and the electromagnetic shielding sheet 60 is disposed on one surface of the first substrate 10, It can be made thinner.

The anisotropic conductive layer 30 connects and connects the antenna pattern 11 'and the terminal connection portion 21b in the connection hole 41a.

The anisotropic conductive layer 30 is formed of an anisotropic conductive paste (ACP).

 A part of both ends of the antenna pattern 11 'and an end of the terminal connecting part 21b are made to conduct only in the thickness direction of the film. This protects the connection portion between the antenna pattern 11 'and the terminal connection portion 21b, increases durability, and prevents a short circuit from occurring at the connection portion. In addition, the antenna pattern 11 'is attached to a portion of the end portion of the antenna pattern 11' in the connection hole 41a, thereby stably connecting the antenna pattern 11 'and the terminal connection portion 21b. This is because the connection between the antenna pattern 11 'and the terminal connection portion 21b in the connection hole 41a may be unstable due to the thickness of the bonding sheet 41. [

11 to 13, the first base 10 is a black film, and the electromagnetic wave shielding sheet 60 is attached to one surface of the first base 10 having the antenna pattern 11 ' do.

The electromagnetic wave shielding sheet 40 is a ferrite sheet 41 attached to one surface of the first substrate 10 as an example. The antenna according to the present invention may further include a sheet cover member 42 attached to the ferrite sheet 41 and mounted at a position where the antenna is mounted. The seat cover member 42 protects the ferrite sheet 41 and has a mounting surface to be mounted at a position where the antenna such as a battery is mounted. One surface of the ferrite sheet 41 is attached to the first substrate 10, and the other surface is attached to the sheet cover member 42. The seat cover member 42 can be attached and mounted at a position where the antenna is mounted. In addition, the seat cover member 42 may be a cover sheet for protecting the adhesive layer provided on the ferrite sheet 41, and may be detached and removed from the ferrite sheet 41 when the antenna cover is mounted at a position where the antenna is mounted, It is possible to expose the adhesive layer on the ferrite sheet 41 so as to be attached to the adhesive layer on the ferrite sheet 41 at a position where the antenna is mounted.

The antenna according to the present invention is characterized in that the antenna pattern 11 'is provided on the substrate 1 and the electromagnetic wave shielding sheet is attached on the first substrate 10 so as to cover the antenna pattern 11' A separate antenna pattern 11 'for protecting the antenna pattern 11' is not required. Therefore, the number of film substrates is reduced compared to the conventional antenna structure, and the structure is slimmer.

An anisotropic conductive layer (30) formed of an anisotropic conductive paste is firmly attached to a circuit pattern to stably connect and connect two flexible printed circuit boards through an anisotropic conductive layer (30).

The present invention secures operational reliability of a flexible printed circuit board to improve product satisfaction and merchantability.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art in light of the above teachings. will be.

10: first substrate 11: first circuit pattern
20: second substrate 21: second circuit pattern
30: anisotropic conductive layer 40: insulating layer
41: bonding sheet 50: cover film
60: electromagnetic wave shielding sheet

Claims (19)

Preparing a first substrate having a first circuit pattern and a second substrate having a second circuit pattern;
Surface-treating a circuit connection portion connected to the second circuit pattern among the first circuit patterns;
Forming an anisotropic conductive layer of an anisotropic conductive material on the circuit connection portion; And
And electrically connecting the first circuit pattern and the second circuit pattern to the anisotropic conductive layer by laminating the first base material and the second base material. The method according to claim 1,
Wherein the surface treating step comprises:
Wherein the oxide film formed on the surface of the first circuit pattern formed of a metal material is removed. The method according to claim 1,
Wherein the step of electrically connecting the first circuit pattern and the second circuit pattern includes:
Forming an insulating layer between the first substrate and the second substrate; And electrically connecting the first circuit pattern and the second circuit pattern through the anisotropic conductive layer. Preparing a first substrate having a first circuit pattern and a second substrate having a second circuit pattern;
Forming an anisotropic conductive layer in which at least a part of an anisotropic conductive material is connected to and fixed to the first substrate, at a portion where the first circuit pattern and the second circuit pattern are connected;
And electrically connecting the first circuit pattern and the second circuit pattern to the anisotropic conductive layer by laminating the first base material and the second base material. 5. The method of claim 4,
Forming a substrate connection hole for exposing the first substrate to a circuit connection portion connected to the second circuit pattern among the first circuit patterns formed on the first substrate before the step of forming the anisotropic conductive layer, Wherein the flexible printed circuit board comprises a flexible printed circuit board. 6. The method of claim 5,
Wherein forming the anisotropic conductive layer comprises: forming an anisotropic conductive layer by applying an anisotropic conductive paste on the surface of the circuit connecting portion connected to the second circuit pattern of the first circuit pattern; And bonding the paste to the anisotropic conductive layer and the first substrate. 5. The method of claim 4,
Wherein forming the anisotropic conductive layer comprises:
Wherein an anisotropic conductive paste is applied to at least one of a surface of a circuit connecting portion connected to the second circuit pattern and an outer perimeter of the circuit connecting portion of the first circuit pattern to form an anisotropic conductive layer, And forming an anisotropic conductive connection connecting the substrates. The method according to claim 1 or 4,
The step of preparing the first substrate provided with the first circuit pattern and the second substrate provided with the second circuit pattern,
And an antenna unit having a plurality of turns of a loop antenna pattern formed on one surface of the first substrate, and an antenna unit electrically connected to both ends of the antenna pattern on one surface of the second substrate, A terminal unit having a terminal pattern for connecting patterns is prepared,
Wherein the step of electrically connecting the first circuit pattern and the second circuit pattern includes attaching the terminal unit to the antenna unit so that both ends of the antenna pattern and both ends of the terminal pattern are electrically connected to the antenna pattern through the anisotropic conductive layer To a flexible printed circuit board (PCB). 9. The method of claim 8,
Wherein the step of electrically connecting the first circuit pattern and the second circuit pattern includes:
Contacting the terminal unit with the antenna unit using a bonding sheet having a connection hole formed at a position corresponding to an end of the antenna pattern and an end of the terminal pattern; And connecting the flexible printed circuit board to the flexible printed circuit board. 9. The method of claim 8,
Attaching a cover film to one surface of the first substrate;
Attaching a ferrite sheet to the other surface of the first substrate, and
Further comprising the step of forming an antenna by tapping the first substrate with the finally designed antenna shape. 9. The method of claim 8,
The first substrate is a black film,
And attaching an electromagnetic wave shielding sheet to one surface of the first base material. A first substrate having a first circuit pattern on one surface thereof;
A second substrate having a second circuit pattern electrically connected to the first circuit pattern on one surface thereof and stacked on the first substrate; And
And an anisotropic conductive layer which is provided at a circuit connection part connected to the second circuit pattern of the first circuit pattern and electrically connects the first circuit pattern and the second circuit pattern and is formed of an anisotropic conductive material,
Wherein at least a portion of the anisotropic conductive layer is fixedly connected to one surface of the first substrate. 13. The method of claim 12,
A substrate connection hole is formed in a circuit connection portion with the second circuit pattern in the first circuit pattern, and the anisotropic conductive layer formed on the surface of the circuit connection portion is connected to the first substrate, And an anisotropically conductive connection portion. 13. The method of claim 12,
And a circuit connection portion for connecting the anisotropic conductive layer to the first base member outside the circuit connection portion with the second circuit pattern in the first circuit pattern. 13. The method of claim 12,
Further comprising an insulating layer provided between the first substrate and the second substrate to cover a contact portion between the first circuit pattern and the second circuit pattern except for the circuit connecting portion, . 13. The method of claim 12,
Wherein the first circuit pattern is a loop-shaped antenna pattern wound a plurality of times, the first base is an antenna unit,
Wherein the second circuit pattern is a terminal pattern for connecting the antenna pattern to another circuit board which is electrically connected to both ends of the antenna pattern and is provided with a communication circuit, Wherein the flexible printed circuit board is a flexible printed circuit board. 17. The method of claim 16,
Wherein the terminal unit is attached to the antenna unit by a bonding sheet, and the bonding sheet is provided with a connection hole for exposing a part of both ends of the antenna pattern. 17. The method of claim 16,
Further comprising a step difference compensating pattern formed on one surface of the first substrate so as to be spaced apart from the antenna pattern and compensating a stepped portion by the antenna pattern. 17. The method of claim 16,
The first substrate is a black film,
Further comprising an electromagnetic wave shielding sheet attached to one surface of the first substrate to cover the antenna pattern.

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