KR20140147956A - Electroplating apparatus - Google Patents

Abstract

The present invention relates to a rectangular-shaped shielding device of an insulating material, which is installed between an anode metal net to receive positive (+) power inside a plating bath, and a cathode to receive negative (-) power, and on which a printed circuit board panel is mounted, to shield a gap between the anode metal net and the cathode. According to the present invention, mxn circular holes of the diameter D are vertically and horizontally arranged at equal intervals, so a line of electric force between the anode metal mesh and the cathode passes through the circular hole. Moreover, some of the holes having the mxn array can be selectively shielded by a bolt of an insulating material. Therefore, provided is the shielding device characterized by having a rectangular-shaped punched plate to control supply of plating current by part in the surface of the printed circuit board panel mounted on the cathode.

Description

[0001] ELECTROPLATING APPARATUS [0002]

The present invention relates to an electroplating apparatus and, more particularly, to an electroplating apparatus capable of uniformizing the thickness of a plating film and preventing an occurrence of a short-circuit accident due to direct contact with the anode even if the printed circuit board panel accidentally detaches from the cathode in the plating tank. ≪ / RTI >

Electroplating of a printed circuit board is carried out by placing a printed circuit board panel on a cathode and putting it in a plating bath filled with a plating solution and using a metal to be coated as an anode.

Typically, a printed circuit board panel is fixed to a carrier and vertically lowered to submergence into the plating solution at the center of the plating bath, and an anode metal plate is installed at a predetermined distance in both vertical directions of the printed circuit board panel. Then, an electric field is formed between the metal plate and the central printed circuit board panel, that is, an electric line of force is formed between the anode and the cathode. The ionized metal ions in the plating bath, for example, positive gold ions, move in the direction of the electric force lines and the plating proceeds on the printed circuit board panel.

However, since the amounts of electricity supplied to the respective positions of the printed circuit board panel are not equal to each other, a variation occurs in the plating thickness on the panel. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a chart showing an example of plating deviation by site when gold plating is applied to a panel according to the prior art. FIG.

In addition, when the printed circuit board panel mounted on the cathode is accidentally separated from the cathode frame in the plating bath, the printed circuit board panel, which is hit by the anode on both sides facing the cathode and is being supplied with negative power, So that a short-circuit accident occurs.

Korean Patent Publication No. 10-2012-0079414.

A first object of the present invention is to provide a plating apparatus capable of obtaining a uniform plating film on the entire printed circuit board panel.

A second object of the present invention is to provide a technique for preventing an accident that the printed circuit board inserted into the plating vessel is short-circuited to the anode even if the PCB deviates from the cathode.

In order to achieve the above object, a plating apparatus according to the present invention is characterized in that a shielding net is provided on an anode. The shielding net according to the present invention comprises a perforated plate, wherein the perforated plate comprises m.times.n perforation arrays, each perforation having a circular D shape. In order to compensate for the distribution of the thickness variation of the plating on the measured panel surface by performing the electroplating with the perforated plate according to the present invention removed, the perforation of the perforated plate is blocked with a plug such as a bolt, .

According to the present invention, since the shielding net provided on the anode is made of an insulating material such as PVC, epoxy resin, phenol resin or the like, even if the printed circuit board panel mounted on the cathode accidentally separates or tears from the cathode frame in the plating tank Shielding net of the insulating material prevents direct contact with the anode.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram showing an example of a plating deviation by site when gold plating is applied to a panel according to the prior art. FIG.
Figure 2 shows a typical anode metal net.
3A is a front view of a shielded network according to the present invention.
FIG. 3B is a view showing a detachable perforated plate according to the present invention. FIG.
3C is a rear view of the shielding net according to the present invention

The present invention provides an anode metal net receiving positive (+) power in a plating tank, and a cathode provided between the anode metal net and the cathode, Wherein a circular hole having a diameter D is arranged at an equal interval of m, n, and m at an equal interval in the vertical and horizontal directions so that an electric line of force between the anode metal mesh and the cathode passes through the circular hole, And a rectangular perforated plate for controlling the supply of plating current to each part of the surface of the printed circuit board panel mounted on the cathode by selectively shielding a part of the holes of the mxn array. .

Hereinafter, the plating apparatus according to the present invention will be described in detail with reference to FIGS. 2 and 3.

2 is a view showing a general anode metal net. The anode metal net of Fig. 2 is immersed in the plating bath by hanging from the bus bar. 3A is a front view of an anode shielding net according to the present invention for shielding an anode metal net.

3A, an anode shielding net according to the present invention includes a rectangular frame 10 and a latch 40 for hanging the bus bar at the longitudinal end of the frame 10. Referring to FIGS. 3B and 3C, grooves are formed in the frame 10 so that the perforated plate 20 is slidably attached and detached along the grooves.

The anode shielding net according to the present invention has m x n puncturing arrays formed in the perforated plate 20. Each of the perforations 30 has a circular shape with a diameter of D, and the electric line of force leaving the anode reaches the cathode through the perforation 30. [ Therefore, the plating amount can be adjusted by selectively blocking the pores 30 of the m x n array.

As a preferred embodiment of the present invention, in order to compensate for the distribution of the thickness variation of the plating on the surface of the panel by performing the electroplating with the anode perforated plate according to the present invention removed, the perforations of the perforated plate are covered with a plug such as a bolt, The amount of electricity supplied to the portion where the amount is large is controlled.

The foregoing has somewhat improved the features and technical advantages of the present invention in order to better understand the claims of the invention described below. Additional features and advantages that constitute the claims of the present invention will be described in detail below. It is to be appreciated by those skilled in the art that the disclosed concepts and specific embodiments of the invention can be used immediately as a basis for designing or modifying other structures to accomplish the invention and similar purposes.

In addition, the inventive concepts and embodiments disclosed herein may be used by those skilled in the art as a basis for modifying or designing other structures to accomplish the same purpose of the present invention. It will be apparent to those skilled in the art that various modifications, substitutions and alterations can be made hereto without departing from the spirit or scope of the invention as defined in the appended claims.

When the anode perforated plate according to the present invention is subjected to electroplating, the distribution of the thickness variation of the plating on the measured panel surface is blocked by a plug such as a bolt in the perforation of the perforated plate, , It is possible to eliminate the coating thickness variation of the entire panel. In addition, since the shielding net installed on the anode according to the present invention is made of an insulating material such as PVC, epoxy resin, or phenol resin, the printed circuit board panel mounted on the cathode is accidentally separated or torn from the cathode frame in the plating tank Shielding net of the insulating material prevents direct contact with the anode.

10: frame
20: Perforated plate
30: Perforation

Claims (1)

An anode metal net supplied with positive power in a plating tank, and a cathode installed between the cathode and the anode, which is supplied with negative power and is mounted with a printed circuit board panel, A rectangular-shaped shielding device made of an insulating material,
A circular hole having a diameter D is arranged at regular intervals of mxn at equal intervals in the vertical and lateral directions so that an electric force line between the anode metal mesh and the cathode passes through the circular hole and a part of the hole in the mxn array is selectively shielded And a rectangular perforated plate for controlling the supply of plating current to the surface of the printed circuit board panel mounted on the cathode.

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