KR20140143812A - 레이저 어닐 장치 및 레이저 어닐 방법 - Google Patents
레이저 어닐 장치 및 레이저 어닐 방법 Download PDFInfo
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- 238000005224 laser annealing Methods 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims description 17
- 229910021417 amorphous silicon Inorganic materials 0.000 claims abstract description 40
- 230000003287 optical effect Effects 0.000 claims abstract description 24
- 238000000137 annealing Methods 0.000 claims abstract description 22
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
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Abstract
Description
도 2는 상기 실시 형태에 있어서 사용되는 제2 펄스 레이저의 일 구성예를 도시하는 평면도이다.
도 3은 상기 제2 펄스 레이저에 있어서, Q 스위치의 포켈스 셀의 인가 전압을 제어하여 롱 펄스의 제2 레이저 광의 생성에 대해 도시하는 설명도이고, (a)는 통상의 제어를 나타내는 그래프, (b)는 인가 전압을 점감했을 때의 그래프이다.
도 4는 상기 도 3의 (b)에 있어서 인가 전압의 점감 구배에 1회의 변곡점이 발생하도록 인가 전압을 제어했을 때에 생성되는 레이저 펄스에 대해 나타내는 그래프이다.
도 5는 상기 제2 펄스 레이저에 있어서 사용되는 레이저용 어테뉴에이터의 일 구성예를 도시하는 평면도이다.
도 6은 상기 레이저용 어테뉴에이터에 의한 1펄스의 레이저 광에 있어서의 특정 시간의 에너지가 선택적으로 저감되는 모습을 도시하는 설명도이고, (a)는 저감 전의 상태를 나타내고, (b)는 저감 후의 상태를 나타낸다.
도 7은 상기 실시 형태에 있어서 사용되는 제1 및 제2 레이저 광의 펄스파형 의 일례를 나타내는 설명도이고, (a)는 제1 레이저 광을 나타내고, (b)는 제2 레이저 광을 나타낸다.
도 8은 각종 무기 재료의 파장대 광흡수 계수의 관계를 나타내는 그래프이다.
도 9는 본 발명의 레이저 어닐 방법에 있어서, 어닐 처리를 위해 유효하게 작용하는 레이저 에너지를 도시하는 설명도이고, (a)는 제2 레이저 광의 펄스 폭 내의 소정의 타이밍에서 제1 레이저 광을 발생시킨 경우를 나타내고, (b)는 제1 및 제2 레이저 광을 동시에 발생시킨 경우를 나타낸다.
5 : 아몰퍼스 실리콘막
6 : 제1 펄스 레이저
7 : 제2 펄스 레이저
8 : 합성 수단
L1 : 제1 레이저 광
L2 : 제2 레이저 광
Claims (5)
- 아몰퍼스 실리콘막에 레이저 광을 조사하여 어닐 처리하는 레이저 어닐 장치로서,
일정한 펄스 폭을 갖는 일정 파장의 제1 레이저 광을 발생하는 제1 펄스 레이저와,
상기 제1 레이저 광보다도 펄스 폭 및 파장이 긴 제2 레이저 광을 발생하는 제2 펄스 레이저와,
상기 제1 레이저 광과 상기 제2 레이저 광을 동일한 광축에 합성하는 합성 수단과,
상기 제1 및 제2 펄스 레이저에 작용하여 상기 제1 및 제2 레이저 광의 발생 타이밍을 제어하는 제어 수단을 구비하고,
상기 제어 수단은, 상기 제1 레이저 광이 상기 제2 레이저 광의 펄스 폭 내의 미리 정해진 타이밍에서 발생하도록 상기 제1 펄스 레이저를 제어하는 것을 특징으로 하는 레이저 어닐 장치. - 제1항에 있어서, 상기 제어 수단은, 상기 제1 펄스 레이저를 제어하여 상기 제1 레이저 광의 발생 타이밍을 상기 제2 레이저 광의 펄스폭 내에서 조정 가능하게 한 것을 특징으로 하는 레이저 어닐 장치.
- 제1항 또는 제2항에 있어서, 상기 제1 펄스 레이저는 파장이 355㎚ 또는 532㎚인 상기 제1 레이저 광을 발생하고,
상기 제2 펄스 레이저는, 파장이 1064㎚인 상기 제2 레이저 광을 발생하는 것을 특징으로 하는 레이저 어닐 장치. - 일정한 펄스 폭을 갖는 일정 파장의 제1 레이저 광과, 상기 제1 레이저 광보다도 펄스 폭 및 파장이 긴 제2 레이저 광을 동일한 광축에 합성하여 아몰퍼스 실리콘막에 조사하여, 어닐 처리하는 레이저 어닐 방법으로서,
상기 제2 레이저 광을 발생하여 상기 아몰퍼스 실리콘막에 조사하는 단계와,
상기 제1 레이저 광을 상기 제2 레이저 광의 펄스폭 내의 미리 정해진 타이밍에서 발생하여 상기 아몰퍼스 실리콘막에 조사하는 단계를 행하는 것을 특징으로 하는 레이저 어닐 방법. - 제4항에 있어서,
상기 제1 레이저 광은 파장이 355㎚ 또는 532㎚이고,
상기 제2 레이저 광은 파장이 1064㎚인 것을 특징으로 하는 레이저 어닐 방법.
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JPJP-P-2012-080706 | 2012-03-30 | ||
JP2012080706A JP6167358B2 (ja) | 2012-03-30 | 2012-03-30 | レーザアニール装置及びレーザアニール方法 |
PCT/JP2013/056496 WO2013146197A1 (ja) | 2012-03-30 | 2013-03-08 | レーザアニール装置及びレーザアニール方法 |
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KR (1) | KR102054026B1 (ko) |
CN (1) | CN104272434B (ko) |
TW (1) | TWI632611B (ko) |
WO (1) | WO2013146197A1 (ko) |
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DE102014103749A1 (de) * | 2013-12-18 | 2015-06-18 | Rofin-Baasel Lasertech Gmbh & Co. Kg | Verfahren und Vorrichtung zur Bearbeitung eines Werkstücks |
CN108886230B (zh) * | 2016-03-30 | 2020-10-20 | 富士胶片株式会社 | 激光装置及光声测量装置 |
CN109564857B (zh) * | 2016-09-06 | 2023-05-16 | 极光先进雷射株式会社 | 激光装置和激光退火装置 |
JP7250695B2 (ja) | 2017-04-20 | 2023-04-03 | ジルテクトラ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 規定どおりに配向された改質線を有するウェハの製造方法 |
EP3749203A4 (en) | 2018-02-09 | 2021-11-03 | Imagine Scientific, Inc. | MONOCHROMATIC X-RAY IMAGING SYSTEMS AND METHODS |
KR102551147B1 (ko) * | 2018-04-18 | 2023-07-05 | 삼성디스플레이 주식회사 | 레이저 장치 |
JP7154592B2 (ja) * | 2019-01-29 | 2022-10-18 | 株式会社ブイ・テクノロジー | レーザアニール方法およびレーザアニール装置 |
JP7320975B2 (ja) | 2019-04-16 | 2023-08-04 | Jswアクティナシステム株式会社 | レーザ照射装置、レーザ照射方法、及び半導体装置の製造方法 |
KR102446159B1 (ko) * | 2019-07-30 | 2022-09-22 | (주)에이치아이티오토모티브 | 열처리 장치 |
CN114068307A (zh) * | 2021-11-16 | 2022-02-18 | 信利(惠州)智能显示有限公司 | 低温多晶硅薄膜及其制备方法、阵列基板、显示装置 |
GB202212286D0 (en) * | 2022-08-24 | 2022-10-05 | Rolls Royce Plc | System and method for finishing a surface of a workpiece |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0945632A (ja) | 1995-08-03 | 1997-02-14 | Matsushita Electric Ind Co Ltd | レーザーアニール方法及び半導体膜の溶融結晶化方法 |
KR20060046751A (ko) * | 2004-07-26 | 2006-05-17 | 샤프 가부시키가이샤 | 반도체 박막 결정화 장치 및 반도체 박막 결정화 방법 |
JP2008098595A (ja) * | 2006-10-13 | 2008-04-24 | Samsung Sdi Co Ltd | 多結晶シリコン薄膜トランジスタ及びその製造方法 |
KR20080102933A (ko) * | 2007-05-21 | 2008-11-26 | 시마쯔 코포레이션 | 결정화 장치 및 결정화 방법 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000012484A (ja) * | 1998-06-25 | 2000-01-14 | Mitsubishi Electric Corp | レーザアニール装置 |
JP2001044120A (ja) * | 1999-08-04 | 2001-02-16 | Mitsubishi Electric Corp | レーザ熱処理方法およびレーザ熱処理装置 |
JP2001319891A (ja) * | 2000-05-10 | 2001-11-16 | Nec Corp | 薄膜処理方法及び薄膜処理装置 |
JP2003347237A (ja) * | 2002-05-30 | 2003-12-05 | Mitsubishi Electric Corp | 半導体装置の製造方法およびその製造装置 |
US7304005B2 (en) * | 2003-03-17 | 2007-12-04 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation apparatus, laser irradiation method, and method for manufacturing a semiconductor device |
JP4171399B2 (ja) * | 2003-10-30 | 2008-10-22 | 住友重機械工業株式会社 | レーザ照射装置 |
JP2005276944A (ja) * | 2004-03-23 | 2005-10-06 | Sharp Corp | 半導体デバイス、その製造方法および製造装置 |
JP2006013050A (ja) * | 2004-06-24 | 2006-01-12 | Sharp Corp | レーザビーム投影マスク及びそれを用いたレーザ加工方法、レーザ加工装置 |
JP2007207896A (ja) * | 2006-01-31 | 2007-08-16 | Sharp Corp | レーザビーム投影マスクおよびそれを用いたレーザ加工方法、レーザ加工装置 |
JP2007208044A (ja) * | 2006-02-02 | 2007-08-16 | Sharp Corp | 半導体薄膜の製造方法および半導体薄膜の製造装置 |
JP5073260B2 (ja) * | 2006-09-29 | 2012-11-14 | 日立コンピュータ機器株式会社 | レーザアニール装置及びレーザアニール方法 |
JP2009044007A (ja) * | 2007-08-09 | 2009-02-26 | Sharp Corp | レーザ照射装置 |
JP5641965B2 (ja) * | 2011-02-09 | 2014-12-17 | 住友重機械工業株式会社 | レーザアニール方法及びレーザアニール装置 |
-
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0945632A (ja) | 1995-08-03 | 1997-02-14 | Matsushita Electric Ind Co Ltd | レーザーアニール方法及び半導体膜の溶融結晶化方法 |
KR20060046751A (ko) * | 2004-07-26 | 2006-05-17 | 샤프 가부시키가이샤 | 반도체 박막 결정화 장치 및 반도체 박막 결정화 방법 |
JP2008098595A (ja) * | 2006-10-13 | 2008-04-24 | Samsung Sdi Co Ltd | 多結晶シリコン薄膜トランジスタ及びその製造方法 |
KR20080102933A (ko) * | 2007-05-21 | 2008-11-26 | 시마쯔 코포레이션 | 결정화 장치 및 결정화 방법 |
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TW201351504A (zh) | 2013-12-16 |
JP2013211415A (ja) | 2013-10-10 |
KR102054026B1 (ko) | 2019-12-09 |
JP6167358B2 (ja) | 2017-07-26 |
WO2013146197A1 (ja) | 2013-10-03 |
CN104272434B (zh) | 2017-12-22 |
TWI632611B (zh) | 2018-08-11 |
CN104272434A (zh) | 2015-01-07 |
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