KR20140136233A - Display Panel and Display Apparatus - Google Patents

Abstract

The present invention relates to a display panel and a display device including the display panel.
A display device according to the present invention includes a display panel and a flexible substrate attached to a side surface of the display panel, wherein the display panel includes an electrode line and a switching element A second substrate disposed to face the first substrate, a seal part attaching the first substrate and the second substrate together, a vertical direction A pad electrode electrically connected to the electrode line, and a pad electrode connected to one end surface of the pad electrode and including a portion located on a side surface of the pad, The flexible substrate may include a side electrode, and the flexible substrate may be electrically connected to the side electrode.

Description

DISPLAY PANEL AND DISPLAY DEVICE COMPRISING SAME

The present invention relates to a display panel and a display device including the display panel.

(PDP), Electro Luminescent Display (ELD), Vacuum Fluorescent Display (VFD), and the like have been developed in recent years in response to the demand for display devices. Display) have been studied and used. Among them, a liquid crystal panel of an LCD includes a TFT substrate and a color filter substrate which are opposed to each other with a liquid crystal layer and a liquid crystal layer interposed therebetween, and an image can be displayed using light provided from the backlight unit.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a display panel which reduces the size of a bezel region and a display device including the same.

A display device according to the present invention includes a display panel and a flexible substrate attached to a side surface of the display panel, wherein the display panel includes an electrode line and a switching element A second substrate disposed to face the first substrate, a seal part attaching the first substrate and the second substrate together, a vertical direction A pad electrode electrically connected to the electrode line, and a pad electrode connected to one end surface of the pad electrode and including a portion located on a side surface of the pad, The flexible substrate may include a side electrode, and the flexible substrate may be electrically connected to the side electrode.

The flexible substrate may include a base layer having flexibility, a cover layer including an electrode disposed on the base layer and a portion covering the electrode, At least one of which may include a black material, and the electrode may include a portion electrically connected to the side electrode.

Further, the width of the flexible substrate in the horizontal direction (Horizontal Direction) may be larger than the gap between adjacent flexible substrates.

The flexible substrate may include at least one of a portion attached to a side surface of the first substrate, a portion attached to a side surface of the seal portion, and a portion attached to a side surface of the second substrate.

In addition, the flexible substrate may include a portion extending from a front surface of the second substrate.

The flexible substrate may further include a resin layer covering at least a part of the flexible substrate and a part of the second substrate and extending in the horizontal direction.

The resin layer may include a first portion located on a side surface of the display panel and a second portion located in front of the display panel.

The apparatus may further include a film type filter attached to a front surface of the second substrate, and the second portion may be in contact with the film type filter.

The electrode lines may include a gate line and a data line intersecting with each other. The pad electrode may include a gate pad electrode electrically connected to the gate line, and a gate electrode electrically connected to the data line. And a data side electrode connected to one end surface of the data pad electrode, wherein the flexible substrate includes a gate electrode formed on the gate electrode, A gate flexible substrate electrically connected to the side electrodes, and a data flexible substrate electrically connected to the data side electrodes.

The gate pad electrode, the gate side electrode, and the gate flexible substrate are located on a short side of the first substrate, and the data pad electrode, the data side electrode, and the data flexible substrate are located on the short side of the first substrate. It can be located on the Long Side.

The display panel and the display device including the display panel according to the present invention have the effect of reducing the size of the bezel region by exposing the side surface of the pad electrode and forming the side electrode on the side surface of the pad electrode .

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view for explaining a configuration of a display panel according to the present invention; FIG.
2 to 32 are views for explaining a manufacturing method and a structure of a display panel;
33 to 62 are views for explaining a configuration in which a flexible substrate is connected to a side surface of a display panel;
63 to 74 are diagrams for explaining another configuration of the display device; And
75 is a view for explaining an example of an electronic apparatus to which the display device according to the present invention is applied.

Hereinafter, a display panel and a display device including the display panel according to the present invention will be described in detail with reference to the accompanying drawings.

While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail. It is to be understood that the present invention is not intended to be limited to the specific embodiments but includes all changes, equivalents, and alternatives falling within the spirit and scope of the present invention.

In describing the present invention, the terms first, second, etc. may be used to describe various components, but the components may not be limited by the terms. The terms may only be used for the purpose of distinguishing one element from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The term " and / or " may include any combination of a plurality of related listed items or any of a plurality of related listed items.

When an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, but other elements may be present in between Can be understood. On the other hand, when it is mentioned that an element is "directly connected" or "directly connected" to another element, it can be understood that no other element exists in between.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions may include plural expressions unless the context clearly dictates otherwise.

In the present application, the terms "comprises", "having", and the like are used interchangeably to designate one or more of the features, numbers, steps, operations, elements, components, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, parts, or combinations thereof.

Unless otherwise defined, all terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries can be interpreted as having a meaning consistent with the meaning in the context of the relevant art and are, unless expressly defined in the present application, interpreted in an ideal or overly formal sense .

In addition, the following embodiments are provided to explain more fully to the average person skilled in the art. The shapes and sizes of the elements in the drawings and the like can be exaggerated for clarity.

1 is a schematic view for explaining a configuration of a display panel according to the present invention. 1 illustrates a liquid crystal display panel as an example of a display panel, the display panel of the present invention may be an organic light emitting panel (OLED panel).

Referring to FIG. 1, the display panel 10 according to the present invention may include a first substrate 100 and a second substrate 110, which are disposed to oppose each other. In addition, although not shown, a liquid crystal layer may be disposed between the first substrate 100 and the second substrate 110.

An electrode line (EL line) may be disposed on the first substrate 100. Here, the electrode line EL may include a gate line GL and a data line DL intersecting with each other.

The electrode line EL can be referred to as an electrode wiring.

The gate line GL may extend in a second direction DR2 and the data line DL may extend in a third direction DR3 that intersects the second direction DR2.

A switching element T may be disposed on a portion of the first substrate 100 where the gate line GL and the data line DL cross each other. In addition, a pixel electrode P electrically connected to the switching element T may be disposed on the first substrate 100.

The switching element T may be implemented in the form of a thin film transistor (TFT).

In addition, in the first substrate 100, the switching elements T may be arranged in a matrix form.

The gate line GL and the data line DL may be electrically connected to the switching element T, respectively.

The first substrate 100 may be referred to as an array substrate.

A color filter 111 may be disposed on the second substrate 110. The color filter 111 may include at least R (Red), G (Green), and B (Blue) regions.

Although not shown, a black matrix layer may be formed on the second substrate 110 to define a pixel region.

In addition, although not shown, another electrode, for example, a common electrode may be disposed on the second substrate 110.

Such a second substrate 110 can be referred to as a color filter substrate.

2 to 32 are views for explaining a manufacturing method and a structure of a display panel. In the following description of the parts described in detail above may be omitted.

2 (A), the first substrate 100 and the second substrate 110 on which the electrode line EL and the switching element T are formed can be bonded together using a sealing part 120 .

The seal 120 may be formed on the edge of at least one of the first substrate 100 and the second substrate 110.

2B, the liquid crystal layer 130 may be injected into a region between the first substrate 100 and the second substrate 110 which are adhered together by the seal 120. In this case, as shown in FIG.

Thereafter, as in the case of FIG. 3A, the edge of the display panel can be cut according to a cutting line (CL).

In this cutting process, the first substrate 100, the second substrate 110, and a part of the seal 120 can be cut.

Accordingly, after the cutting process, the ends of the first substrate 100, the second substrate 110, and the seal 120 may be placed on a straight line, as in the case of FIG. 3B.

In this way, by cutting off the edges of the display panel, the size of the bezel area can be reduced.

It is possible to change the cut portion according to the structure of the electrode line EL disposed on the first substrate 100 in the display panel.

For example, as in the case of FIG. 4A, the first substrate 100 and the second substrate 110 are bonded together in a state where the first substrate 100 and the second substrate 110 are bonded together, Cutting the first short side LS1 region of the first substrate 100 and the second short side SS2 of the second substrate 110 along the second cutting line CL2, It is possible to cut along the line CL1.

In this case, although not shown, a pad electrode may be disposed on the first long side LS1 and the second short side SS2 of the first substrate 100 and the second substrate 110, respectively.

4B, the first and second substrates 100 and 110 may be bonded to each other at a first long side LS1 of the first substrate 100 and a second substrate 110 in a state where the first substrate 100 and the second substrate 110 are bonded together, And cutting the second long side (LS2) region of the first substrate 100 and the second substrate 110 along the fourth cutting line CL4 by cutting the second cutting line CL2 along the second cutting line CL2, Cutting the first short side SS1 of the first substrate 100 and the second substrate 110 along the third cutting line CL3 and cutting the first short side SS1 of the first substrate 100 and the second substrate 110, It is possible to cut the second short side SS2 region of the substrate 110 along the first cutting line CL1.

In this case, although not shown, the first long side LS1, the second long side LS2, the first short side SS1, and the second short side SS2 of the first substrate 100 and the second substrate 110, A pad electrode may be disposed on each pad electrode.

After the edge of the display panel is cut, the side of the cut display panel can be grinded using a grinder 200 as in the case of FIG. 5 (A).

Then, as in the case of Fig. 5B, the side surface of the display panel can be smoothly processed. Accordingly, the structural stability of at least one of the first substrate 100 and the second substrate 110 can be improved.

Referring to FIG. 6, a pad electrode ELP may be disposed at an edge of the first substrate 100. In addition, the pad electrode ELP may be electrically connected to the electrode line EL.

A data pad electrode DLP electrically connected to the data line DL is disposed in a second long side LS2 region of the first substrate 100 and a second short side And a gate pad electrode GLP electrically connected to the gate line GL may be disposed in the gate line SS2.

The pad electrode ELP can be located at least at one end of the electrode line EL.

The pad electrode ELP may be integrated with the electrode line EL. Alternatively, after the pad electrode ELP is formed separately from the electrode line EL, it may be possible to electrically connect the pad electrode ELP and the electrode line EL.

The seal 120 may be formed at a position overlapping the pad electrode ELP, that is, the gate pad electrode GLP and the data pad electrode DLP. In other words, the gate pad electrode GLP and the data pad electrode DLP are overlapped with the seal 120 in a vertical direction crossing the second direction DR2 and the third direction DR3 .

Hereinafter, the vertical direction can be referred to as a first direction (First Direction, DR1). In addition, the second direction DR2 and the third direction DR3 can be collectively referred to as a horizontal direction.

In addition, the region where the seal 120 is formed can be referred to as a dummy area (DA). The area surrounded by the dummy area DA can be referred to as an effective area (AA). The effective area AA can be regarded as a region in which an image is displayed.

The width of the pad electrode ELP can be larger than the width of the electrode line EL.

7A and 7B, the width W1 of the gate pad electrode GLP is larger than the width W2 of the gate line GL and the width W1 of the data pad electrode DLP is larger than the width W2 of the gate line GL, The width W3 of the data line DL can be larger than the width W4 of the data line DL.

In this case, it is possible to easily electrically connect the gate pad electrode GLP and the data pad electrode DLP to a flexible substrate (not shown).

Hereinafter, it is assumed that the width of the pad electrode ELP is larger than the width of the electrode line EL, but it is also possible that the width of the pad electrode ELP and the width of the electrode line EL are substantially equal to each other .

The first substrate 100 may further include an insulating layer for insulating the electrode lines EL.

For example, as in the case of FIG. 8A, the data line DL and the data pad electrode DLP are formed on the first substrate 100, and then, as in the case of FIG. 8B, A first insulating layer 140A covering the data line DL and the data pad electrode DLP may be formed on one substrate 100. [

9A, the gate line GL and the gate pad electrode GLP may be formed on the first substrate 100 on which the first insulating layer 140A is formed. For example, the gate line GL may be formed on the first insulating layer 140A, and the gate pad electrode GLP may be formed on the first substrate 100. Referring to FIG.

9B, a second insulating layer 140B is formed on the first substrate 100 so as to cover the first insulating layer 140A, the gate line GL, and the gate pad electrode GLP, Can be formed.

In this case, an insulating layer, that is, a second insulating layer 140B, may be positioned between the gate line GL and the data line DL. Thus, the gate line GL and the data line DL can be electrically insulated.

9, when the gate line GL and the gate pad electrode GLP are formed, at least a part of the gate line GL is located in a layer different from the gate pad electrode GLP or the gate pad electrode GLP May be located on a different layer from the gate line GL.

Although not shown, a step of forming the switching element T is formed between the step of forming the data line DL (FIG. 8A) and the step of forming the gate line GL (FIG. 9A) Can be added.

Hereinafter, the first insulating layer 140A and the second insulating layer 140B will be collectively referred to as an insulating layer 140. [ The structure of the insulating layer 140 in the present invention is not limited thereto. For example, the insulating layer 140 may be formed in a three-layer structure or a four-layer structure.

A part of the gate pad electrode GLP and the data pad electrode DLP are exposed to the side surfaces of the gate pad electrode GLP and the data pad electrode DLP in the cutting process to the first substrate 100 and the second substrate 110, And the seal 120 together.

6, the data pad electrode DLP is disposed on the second long side LS2 of the first substrate 100 and the gate pad electrode DL2 is formed on the second short side SS2 of the first substrate 100. As described above, (GLP) is disposed.

10 (A), if the second long side LS2 of the display panel 10 is cut, as shown in FIG. 10 (B), the side surface of the data pad electrode DLP May be exposed between the first substrate 100 and the insulating layer 140. In other words, one end surface of the data pad electrode DLP may be exposed between the first substrate 100 and the insulating layer 140.

11A, the second short side SS2 of the display panel 10 is cut so that the side surface of the gate pad electrode GLP is covered with the second short side SS2, as in the case of FIG. 11B. 1 substrate 100 and the insulating layer 140. In this case, In other words, one end surface of the gate pad electrode GLP may be exposed between the first substrate 100 and the insulating layer 140.

9 to 10, one end of the pad electrode ELP may be positioned on a straight line with the end of the seal 120. In other words, one end of the pad electrode ELP can coincide with the end of the seal 120.

12, a side electrode 150 may be formed on a side surface of the cut display panel 10. In the following drawings, it is assumed that the electrode line EL and the pad electrode ELP are formed on the same layer for convenience of explanation. However, the electrode line EL and the pad electrode ELP are formed in different layers It is also possible. This has been described above with reference to FIG.

The side electrode 150 may be connected to the exposed side (end surface) of the pad electrode ELP in the cutting process.

The side electrode 150 may include a portion connected to the pad electrode ELP as well as a side portion of the seal 120. In this case, the area of the side electrode 150 can be increased to facilitate the electrical connection between the flexible substrate and the side electrode 150, which is not shown.

In addition, the side electrode 150 may include a portion located on the side surface of the first substrate 100.

The side electrodes 150 are spaced apart from the first substrate 100, the second substrate 110 and the seal 120 by a predetermined length D1 in the horizontal direction (the second direction DR2 or the third direction DR3) And may include extended portions. In other words, the side electrodes 150 may be arranged in a more direction than the first substrate 100, the second substrate 110, and the body 120 in the horizontal direction (the second direction DR2 and / or the third direction DR3) Can be extended.

The side electrode 150 may preferably have a sufficiently high electric conductivity so as to more efficiently supply a driving signal supplied through a flexible substrate not shown to the pad electrode ELP and the electrode line EL.

Since the side electrode 150 is connected to at least one end surface of the pad electrode ELP after the electrode line EL and the pad electrode ELP are formed, the side surface electrode 150 and the pad electrode ELP ) May increase the electrical resistance.

The electric conductivity of the side electrode 150 is more than the electric conductivity of the pad electrode ELP and the electrode line EL in order to compensate for the loss due to the electric resistance at the interface between the side electrode 150 and the pad electrode ELP. Higher may be desirable.

In other words, the side electrode 150 may include a material having electrical conductivity higher than that of the electrode line EL and the pad electrode ELP.

For example, assuming that the electrode line EL and the pad electrode ELP are formed of copper (Cu), the side electrode 150 may be formed of aluminum (Al), silver (Ag), gold As shown in FIG.

As such, the material of the electrode line EL and the pad electrode ELP may be different from the material of the side electrode 150.

When the electrical resistance at the interface between the side electrode 150 and the pad electrode ELP is negligibly low, the electrical conductivity of the side electrode 150 may be approximately equal to the electrical conductivity of the pad electrode ELP. In this case, the material of the electrode line EL and the pad electrode ELP may be the same as the material of the side electrode 150.

The side electrode 150 may be manufactured by various methods. A method of manufacturing the side electrode 150 will be described in detail below.

The electrode material layer 300 can be formed on the side surface of the display panel 10 as shown in FIG. Such an electrode material layer 300 may include a photosensitive material.

14A, a photo mask 310 having a predetermined pattern formed thereon is disposed on the electrode material layer 300, and light such as ultraviolet light is irradiated to the photo mask 310 The electrode material layer 300 can be irradiated through the formed pattern.

Then, a part of the electrode material layer 300 exposed to light by the photosensitive material can be cured.

Thereafter, when a process such as etching or sandblasting is performed, the hardened portion remains in the electrode material layer 300, and the portion that is not hardened is removed, whereby, as in the case of FIG. 14 (B) A side electrode 150 may be formed on a side surface of the display panel 10.

The process described above can be considered as an example of the photo process. The side electrode 150 manufactured through the photolithography process can have a shape as shown in FIG.

It is also possible to manufacture the side electrode 150 by using an offset method different from the photo process. The following is a look at this. The offset method is an example of a direct patterning printing method.

Referring to FIG. 16A, an electrode material 410 in a paste state or a slurry state can be applied to the surface of a mold 400.

Thereafter, as shown in FIG. 16B, the blanket 420 can be moved from the surface of the mold 400 to which the electrode material 410 is applied. Then, the electrode material 410 may be deposited on the surface of the blanket 420.

The blanket 420 may preferably be in the form of a roller to allow the electrode material 410 to be more effectively imbedded. Thus, when the blanket 420 is in the form of a roller, the blanket 420 may be rotated on the surface of the mold 400 so that the electrode material 410 may be embedded.

16 (C), the electrode material 410 deposited on the surface of the blanket 420 while moving the blanket 420 with the electrode material 410 on the side of the cut display panel 10, To be printed on the side surface of the display panel 10.

Thereafter, the side electrode 150 may be formed on the side surface of the display panel 10 by performing the firing or drying process.

An example of the side electrode 150 manufactured in this manner is shown in Fig.

It is also possible to manufacture the side surface electrode 150 using a photolithography process, an offset process, and another plating process. The plating method may include an electrolytic plating method and an electroless plating method. A method of forming the side electrode 150 by electrolytic plating in the plating method will be described below.

The display panel 10 with the edge cut to expose the pad electrode ELP may be deepened into the electrolytic solution 510, as in the case of FIG. 18A. In addition, the metal electrode 520 can be deeply doped into the electrolytic solution 510.

In this state, if a predetermined voltage is applied to the electrode line EL or the pad electrode ELP and the metal electrode 520, the metal contained in the electrolytic solution 510, as in the case of FIG. 18B, The component 530 is deposited on the exposed side of the pad electrode ELP, so that the side electrode 150 can be formed.

For example, when a positive voltage is applied to the metal electrode 520 and a negative voltage is applied to the pad electrode ELP or the electrode line EL, And may collect on the side surface of the electrode ELP and precipitate.

An example of the side electrode 150 formed by this method is shown in Figs. 19A and 19B.

Here, the metal component 530 may include a material having high electrical conductivity, such as silver (Ag). In this case, the side electrode 150 may also be formed of a silver (Ag) material.

In addition, the size of the metal component 530 for effective precipitation can be approximately a few nanometers. In addition, the electrolytic solution 510 can be an aqueous solution of Ag-Aceate. In addition, the concentration of the electrolytic solution 510 can be about 0.1 wt% or more.

Alternatively, it may be possible to hold the electrolytic solution 510 in a predetermined vessel 500 and apply a voltage to the vessel 500. In this case, it is possible not to use the metal electrode 520.

A method of forming the side electrode 150 by the electroless plating method in the plating method will be described below.

20 (A), the display panel 10 having the edges cut to expose the pad electrode ELP can be deeply dipped in the H2SO4 aqueous solution. Thus, the oxide film formed on the exposed surface of the pad electrode ELP can be removed.

If the pad electrode ELP is made of a material which is not easily oxidized, the step of FIG. 20 (A) may be omitted.

In the case where the pad electrode ELP is made of a material such as copper having a relatively high possibility of being oxidized, the copper material is oxidized on the exposed side of the pad electrode ELP to form a copper oxide film Is likely to be relatively high. Therefore, it may be preferable to perform the step of removing the oxide film on the exposed side of the pad electrode ELP, as shown in Fig. 20 (A).

Thereafter, as in the case of FIG. 20 (B), the pad electrode ELP is deposited in the aqueous solution of palladium (Pd) for forming a seed in a state where the oxide film is removed from the side surface of the pad electrode ELP, can do.

In this case, the palladium (Pd) material contained in the palladium (Pd) aqueous solution adheres to the side surface of the pad electrode ELP to form the seed 540 as shown in FIG. 20C. In this case, the seed 540 may be made of palladium (Pd) material.

Here, only the case where the seed 540 is formed using palladium (Pd) is described, but it is also possible to form the seed 540 using another metallic material.

21A, the side surface of the pad electrode ELP may be deeply doped into the electrolytic solution 550 with the seed 540 formed on the side surface of the pad electrode ELP. Here, the electrolytic solution 550 may include a metal material for forming the side electrode 150. For example, the electrolytic solution 550 can be an aqueous solution of Ag-Aceate.

Deeping the side surface of the pad electrode ELP in the electrolytic solution 550 in the state where the seed 540 is formed on the side surface of the pad electrode ELP as described above allows the metal material contained in the electrolytic solution 550 to be adhered to the seed 540 And the side electrode 150 as shown in FIG. 21 (B) by being gathered on the side surface of the pad electrode ELP.

Here, the seed 540 may improve the electrode growth rate and reduce the time required for the manufacturing process of the side electrode 150. [

Referring to FIG. 21B, a seed 540 may be positioned between the side surface of the pad electrode ELP and the side electrode 150.

For example, it is possible that the seed 540 is made of palladium (Pd), the side electrode 150 is made of silver (Ag), and the pad electrode ELP is made of copper . In this case, a seed 540 including a material different from the material of the side electrode 150 and / or the pad electrode ELP may be formed between the side electrode 150 and the pad electrode ELP.

The structure and shape of the side electrode 150 formed in accordance with this method may be similar to those of FIGS. 19A and 19B.

Referring to FIG. 22, a protective electrode (protection electrode) 150C may be formed on the surface of the pad electrode ELP. In detail, the side electrode 150 may include a base electrode 150B and a protective electrode 150C coated on the surface of the base electrode 150B.

Here, the base electrode 150B may be located at one end of the pad electrode ELP. That is, the base electrode 150B may be connected to one end surface of the pad electrode ELP.

The thickness D3 of the protective electrode 150C may be smaller than the thickness D2 of the base electrode 150B in the horizontal direction (the second direction DR2 or the third direction DR3).

The protective electrode 150C may include a material which is relatively inferior in oxidation compared to the material of the pad electrode ELP and / or the base electrode 150B. That is, the protective electrode 150C can prevent the base electrode 150B from being oxidized. For example, the protective electrode 150C may be made of nickel (Ni) or gold (Au).

This protective electrode 150C can also be formed by a plating method.

For example, after the base electrode 150B is formed on the side surface of the pad electrode ELP by the same method as shown in FIGS. 20 to 21, a protective electrode 150C is formed on the surface of the base electrode 150B, It can be formed by the same method as that shown in FIG.

In this case, another seed 560 may be formed between the base electrode 150B and the protective electrode 150C, as in the case of FIG. The material of another seed 560 in which the base electrode 150B and the protective electrode 150C are formed is the same as the material of the seed 540 formed between the pad electrode ELP and the base electrode 150B It is possible.

On the other hand, in order to electrically connect the flexible substrate (not shown) and the side electrode 150 effectively, it may be desirable to sufficiently increase the area of the side electrode 150.

24, the side electrode 150 may include a portion located on a side surface of the first substrate 100 and a portion located on a side surface of the second substrate 110. In addition,

In this case, the width D4 in the vertical direction (the first direction DR1) of the side electrode 150 is set to be larger than the width D4 in the horizontal direction (the second direction DR2 or the third direction DR3) of the pad electrode ELP May be larger than the width (D10) Alternatively, the width D4 in the vertical direction (first direction DR1) of the side electrode 150 is greater than the width D4 of the side electrode 150 in the horizontal direction (second direction DR2 or third direction DR3) May be greater than the width D5.

In addition, the width D4 in the vertical direction (the first direction DR1) of the side electrode 150 may be larger than the interval D6 between the adjacent side electrodes 150. [

The gap D8 between the side electrode 150 and the first substrate 100 in the vertical direction DR1 may be smaller than the gap D6 between the adjacent side electrodes 150. [ Alternatively, the distance D7 between the side electrodes 150 and the end of the second substrate 110 in the vertical direction DR1 may be smaller than the spacing D6 between the adjacent side electrodes 150.

When the pad electrode ELP is formed on the first substrate 100, the gap D8 between the side electrode 150 and the end of the first substrate 100 in the vertical direction DR1 is substantially equal to the distance D2 in the vertical direction DR1. May be smaller than a distance (D7) between the electrode (150) and the end of the second substrate (110).

On the other hand, in order to sufficiently reduce the electric resistance in the boundary region between the pad electrode ELP and the side electrode 150, it may be preferable to sufficiently increase the area of the cross section of the pad electrode ELP. 25, the width D10 of the pad electrode ELP in the horizontal direction (the second direction DR2 or the third direction DR3) is equal to the width D10 of the gap between the adjacent pad electrodes ELP D11).

The side electrode 150 includes a gate side electrode 150G connected to one end surface of the gate pad electrode GLP and a data side electrode 150D connected to one end surface of the data pad electrode DLP .

For example, as in the case of FIGS. 26A and 26B, on the side of the display panel 10 in the second long side (LS2) region of the display panel 10, (150D) may be disposed. The data side electrode 150D may be connected to the data pad electrode DLP.

Here, since the data pad electrode DLP is formed on the first substrate 100, the distance D13 between the data side electrode 150D and the end of the first substrate 100 in the vertical direction DR1 is in the vertical direction DR1 may be smaller than the distance D12 between the data side electrode 150D and the end of the second substrate 110. [

Alternatively, the distance D13 between the data side electrode 150D and the end of the first substrate 100 in the vertical direction DR1 may be set in the vertical direction DR1 according to the manufacturing method, And the distance D12 between the ends of the light emitting diode 110 may be substantially equal to each other.

The gate side electrode 150G of the side electrode 150 is formed on the side of the display panel 10 in the second short side SS2 region of the display panel 10 as in the case of Figures 27A and 27B . The gate side electrode 150G may be connected to the gate pad electrode GLP.

Here, since the gate pad electrode GLP is formed on the first substrate 100, the gap D15 between the gate side electrode 150G and the end of the first substrate 100 in the vertical direction DR1 is in the vertical direction DR1 between the gate side electrode 150G and the end of the second substrate 110. [

Alternatively, the distance D15 between the gate side electrode 150G and the end of the first substrate 100 in the vertical direction DR1 may be determined by the gate side electrode 150G in the vertical direction DR1, And the distance D14 between the ends of the light emitting element 110 may be substantially equal to each other.

28, in order to increase the contact area between the side electrode 150 and the flexible substrate (not shown), the width H2 of the side electrode 150 in the vertical direction DR1 is set in the horizontal direction DR2 or DR3, May be greater than the width (H1) of the recess (150).

29, the data side electrode 150D is disposed on the second long side LS2 of the display panel 10 and the first short side SS1 of the gate side electrode 150G is connected to the first short side SS1 of the display panel 10, The gate side electrode 150G1 may be disposed and the second gate side electrode 150G2 of the gate side electrode 150G may be disposed on the second short side SS2 of the display panel 10. [

In this case, the gate pad electrodes GLP may be formed on the first short side SS1 and the second short side SS2 of the first substrate 100, respectively. For example, as in the case of FIG. 30, an odd gate pad electrode GLP of a plurality of gate pad electrodes GLP, for example, a first gate pad electrode GLP, may be formed on the second short side SS2 of the first substrate 100 GLP1)... The (n-1) -th gate pad electrode GLPn-1 may be located. In addition, an even-numbered gate pad electrode GLP such as a second gate pad electrode GLP2 among the plurality of gate pad electrodes GLP is formed at the first short side SS1 of the first substrate 100 n gate pad electrode GLPn may be positioned. Here, n may mean an even number of natural numbers.

In order to expose one end surface of the gate pad electrode GLP at the first short side SS1 and the second short side SS2 of the display panel 10, Can be cut along the eleventh cutting line CL11 and the second short side SS2 of the first substrate 100 can be cut along the tenth cutting line CL10.

When the gate pad electrode GLP is disposed on the first short side SS1 and the second short side SS2 of the first substrate 100 as described above, it is preferable that the cross sectional area of the gate pad electrode GLP is sufficiently wide It is possible.

31, the first data side electrode 150D1 of the data side electrode 150D is disposed on the first long side LS1 of the display panel 10 and the first data side electrode 150D1 of the data side electrode 150D is disposed on the second long side LS2 of the display panel 10 The second data side electrode 150D2 of the data side electrode 150D is disposed and the first gate side electrode 150G1 of the gate side electrode 150G is disposed on the first short side SS1 of the display panel 10 And the second gate side electrode 150G2 of the gate side electrode 150G may be disposed on the second short side SS2 of the display panel 10. [

In this case, gate pad electrodes GLP are formed on the first short side SS1 and the second short side SS2 of the first substrate 100 and the first long side LS1 of the first substrate 100 And the data pad electrode DLP may be formed on the second long side LS2. 32, an odd-numbered data pad electrode DLP, for example, a first data pad electrode DLP among a plurality of data pad electrodes DLP may be formed on the first long side LS1 of the first substrate 100. [ GLP1, ..., and the (n-1) -th data pad electrode DLPn-1. In addition, an even-numbered data pad electrode DLP among the plurality of data pad electrodes DLP, for example, a second data pad electrode DLP2, is formed on the second long side LS2 of the first substrate 100 n data pad electrode DLPn may be located.

In order to expose one end surface of the data pad electrode DLP at the first long side LS1 and the second long side LS2 of the display panel 10, Can be cut along the twelfth cutting line CL11 and the second long side LS2 of the first substrate 100 can be cut along the thirteenth cutting line CL13.

When the data pad electrodes DLP are arranged at the first long side LS1 and the second long side LS2 of the first substrate 100 as described above, it is preferable that the cross-sectional area of the data pad electrode DLP is sufficiently wide It is possible.

33 to 62 are views for explaining a configuration in which a flexible substrate is connected to a side surface of a display panel. In the following, the description of the parts described in detail above can be omitted.

33, the display device 2000 according to the present invention may include a display panel 10 and a flexible substrate 600 attached to a side surface of the display panel 10. The structure of the display panel 10 has been described in detail above. The flexible substrate 600 may include a tape carrier package (TCP), a flexible printed circuit (FPC), a chip on film (COF), or the like.

Although not shown, the flexible substrate 600 can electrically connect a driver to supply a driving signal and a pad electrode ELP. To this end, the flexible substrate 600 may be electrically connected to the side electrode 150 formed on the side surface of the display panel 10. To this end, the flexible substrate 600 may include a connection electrode 620.

34A, the flexible substrate 600 includes a first connection area CA1 corresponding to the side electrode 150, a second connection area CA2 corresponding to a driving part (not shown) 1 may be bent into an intermediate area MA located between the first connection area CA1 and the second connection area CA2 and in which the transmission line 650 is formed.

A connection electrode 620 for electrical connection with the side electrode 150 may be disposed in the first connection area CA1.

An electrode 640 for electrical connection with a driving unit (not shown) may be disposed in the second connection area CA2.

An IC that supplies a predetermined driving signal to the display panel 10 in response to a predetermined control signal supplied from a driving unit (not shown) A portion 650 may be disposed. Here, the IC portion 630 may be omitted.

The transmission line 650 formed in the intermediate region MA may electrically connect the connection electrode 620 formed in the first connection region CA1 and the electrode 640 formed in the second connection region CA2 .

The electrode 640 formed in the connection electrode 620, the transmission line 650 and the second connection region CA2 in the flexible substrate 600 can be collectively referred to as an electrode.

34 (B), the flexible substrate 600 includes a base layer 610 having flexibility, an electrode 620 disposed on the base layer 610, 640, and 650, and a cover layer 660 that includes a portion covering the electrodes 620, 640, and 650 and has flexibility. Here, the electrodes 620, 640, 650 may include a portion connected to the side electrode 150, that is, a connection electrode 620. The base layer 610 and the cover layer 660 may each include a flexible Resin material so that the flexible substrate 600 can be bent.

Here, the case where the electrodes 620, 640 and 650 are single-layered in the flexible substrate 600 is described as an example, but the present invention is not limited thereto. For example, in the flexible substrate 600 according to the present invention, the electrodes 620, 640 and 650 may have a plurality of layers.

At least one of the base layer 610 and the cover layer 660 of the flexible substrate 600 may include a black material. In this case, the flexible substrate 600 may appear black. Therefore, even if the flexible substrate 600 is exposed, it is possible to prevent the visibility of the user from being disturbed by the flexible substrate 600.

The flexible substrate 600 and the side electrode 150 can be connected in various ways. This is described below.

35, a metal layer 700 may be disposed between the side electrode 150 and the connection electrode 620 of the flexible substrate 600. [ The metal layer 700 may electrically connect the side electrode 150 and the connection electrode 620 of the flexible substrate 600.

The metal layer 700 may be made of an organo-metallic compound.

A method of manufacturing the metal layer 700 will be described below.

36, after the side electrode 150 is formed on the side surface of the display panel 10 after the cutting process, an organic material including a metal material is coated on the side electrode 150 to form an organic metal layer 701, Can be formed. Alternatively, it is also possible to form an organic metal layer 701 by laminating a sheet of an organic material including a metal material on the side of the display panel 10.

Here, the organic metal layer 701 may be formed of an organo-metallic compound.

An organometallic compound is a material containing a chemical bond between a metal and carbon, and may be formed by dispersing a metal material of substantially nano unit in an organic material.

Examples of the metal that can be applied to the organic metal compound include materials having high electrical conductivity such as silver (Ag), gold (Au), and palladium (Pd).

In addition, the organic metal compound may include a material such as an organic solvent, a binder, etc. in addition to a metal material.

Examples of organometallic compounds which can be applied to the present invention include metal alkoxides, metal acetates, metal compounds including metal acid compounds, and ethylene glycol, propanediol and its derivatives, butanediol and its derivatives, pentanediol and its Derivatives and hexanols are mixed or reacted at a constant molar ratio and the solid and liquid organic metal (s) prepared by using trimethyl phosphate (TMP), triethyl phosphate (TEP) and triphenyl phosphate Lt; / RTI >

The organic metal layer 701 as shown in FIG. 36 can be formed using the above-described organic metal compound. The organic metal layer 701 may cover the side electrode 150 on the side of the display panel 10.

Thereafter, the flexible substrate 600 may be disposed on the organic metal layer 701, and pressure may be applied to the flexible substrate 600 at a predetermined temperature.

Here, if the ambient temperature rises above the critical temperature, the chemical bond between the metal material and carbon is broken in the organometallic compound forming the organic metal layer 701, and the metal material is electrically connected to the connection between the side electrode 150 and the flexible substrate 600 So that the metal layer 700 can be formed between the electrodes 620.

In the present invention, after the organic metal layer 701 including the metal material 702 is formed on the side surface of the display panel 10 as shown in FIG. 37A, It may be desirable to apply pressure to the flexible substrate 600 disposed on top of the organic metal layer 701 for about two minutes. More preferably, it may be desirable to apply pressure to the flexible substrate 600 disposed on top of the organic metal layer 701 at a temperature of about 180 DEG C for a time period of about 5 seconds to about 30 seconds. In this case, the organic solvent contained in the organic metal layer 701 is evaporated, and nano-sized metal materials sufficiently gather between the connection electrode 620 and the side electrode 150 of the flexible substrate 600, .

Materials such as epoxy, acrylic, and the like remain around the metal layer 700, so that the organic layer 703 can be formed as shown in FIG. 37 (B). That is, the organic layer 703 may include an acrylic material and / or an epoxy material. Since the organic layer 703 has adhesiveness, the flexible substrate 600 can be firmly attached to the side surface of the display panel 10. The organic layer 703 may include a portion of the metal material 702 included in the organic metal layer 701 that is not included in the metal layer 700.

When an organic metal compound is used to electrically connect the side electrode 150 and the connection electrode 620 of the flexible substrate 600, the side electrode 150 and the connection electrode 600 of the flexible substrate 600 The connection electrode 620 of the flexible substrate 600 and the side surface electrode 150 can be electrically connected more effectively by forming the metal layer 700 between the metal layer 700 and the organic layer 700, The flexible substrate 600 can be firmly attached to the side surface of the display panel 10. [

Referring to FIG. 38, the side electrodes 150 may be in direct contact with the connection electrodes 620 of the flexible substrate 600. For example, at least one of the connection electrode 620 and the side electrode 150 is melted at the bonding surface between the connection electrode 620 of the flexible substrate 600 and the side electrode 150 of the display panel 10, And the side surface electrode 150 may be bonded to each other.

As described above, it is possible to use ultrasonic waves to bond the side electrode 150 and the connection electrode 620 of the flexible substrate 600 in direct contact with each other.

39, the flexible substrate 600 including the connection electrode 620 may be positioned on a side surface of the display panel 10 on which the side electrodes 150 are formed. Ultrasonic waves can be emitted to the connection portion between the connection electrode 620 and the side surface electrode 150 by using the ultrasonic head 800.

The side electrode 150 and / or the connection electrode 620 are melted by the frictional force between the side electrode 150 and the connection electrode 620, (620) may be electrically connected.

When the ultrasonic bonding method in which the connection electrode 620 and the side surface electrode 150 are bonded by ultrasonic waves is used, the side surface electrode 150 and / or the connection electrode 620 are melted and directly connected The bonding force between the side electrode 150 and the connection electrode 620 can be improved.

In order to further facilitate the bonding of the side electrode 150 and the connection electrode 620, it may be desirable to perform an ultrasonic bonding process at a relatively high temperature. Preferably, the connecting electrode 620 and the side electrode 150 can be ultrasonically bonded at a temperature of approximately 130 ° C to 150 ° C.

40, an adhesive layer 900 including a plurality of conductive particles 901 is disposed between the connection electrode 620 and the side electrode 150 of the flexible substrate 600, thereby forming the conductive particles 901 The connection electrode 620 and the side electrode 150 of the flexible substrate 600 can be electrically connected to each other.

Here, the adhesive layer 900 may be an anisotropic conductive adhesive or an anisotropic conductive adhesive sheet.

In this case, the adhesive layer 900 including the conductive particles 901 is disposed between the connection electrode 620 and the side electrode 150 of the flexible substrate 600, and the adhesive layer 900 is formed at a temperature of at least 180 캜 for about 8 to 15 seconds The coupling electrode 620 of the flexible substrate 600 and the side electrode 150 can be electrically connected to each other by applying a pressure of about 2 to 4 Pa to the flexible substrate 600.

On the other hand, the pad electrode ELP and the connection electrode 620 of the flexible substrate 600 can correspond one to one. 41, the first connection electrode 620a of the connection electrode 620 formed on the flexible substrate 600 is electrically connected to the first electrode line EL1 of the display panel 10 and the first pad electrode And the second connection electrode 620b may correspond to the second electrode line EL2 and the second pad electrode ELP2 of the display panel 10. [

In this case, the driving signal supplied to the first electrode line EL1 is supplied through the first connection electrode 620a, and the driving signal supplied to the second electrode line EL2 is supplied through the second connection electrode 620b Can be supplied.

In addition, each flexible substrate 620 may correspond to a plurality of electrode lines EL.

42, the first flexible substrate 600-1 corresponds to the first data line group DLG1 including the plurality of data lines DL, the second flexible substrate 600-1 corresponds to the first data line group DLG1 including the plurality of data lines DL, 2 may correspond to a second data line group DLG2 including a plurality of data lines DL. Here, the data line DL among the electrode lines EL is described as an example, but the following contents can also be applied to the gate line GL.

In FIG. 42, the first data line group DLG1 may correspond to the first data pad electrode group DLPG1, and the second data line group DLG2 may correspond to the second data pad electrode group DLPG2.

It is possible to change the traveling direction of at least one data line DL included in the data line group DLG in the dummy area DA to connect the data line group DLG to the flexible substrate 600. [ For example, it is possible to change the traveling direction of the data line DL so that the interval between the adjacent data lines DL in the first data line group DLG1 becomes small.

The region where the advancing direction of the electrode line EL is changed can be referred to as a dummy region DA or a bezel region.

Referring to FIG. 43, a plurality of flexible substrates 600-1 to 600-4 may be attached to the side surface of the display panel 10.

Here, the width S1 of the flexible substrate 600 in the horizontal direction DR2 or DR3 can be larger than the spacing S2 between the adjacent flexible substrates 620. [

As described above, if the distance S2 between the adjacent flexible substrates 620 in the horizontal direction DR2 or DR3 is made relatively small, the size of the region where the advancing direction of the electrode line EL is changed can be reduced, The size of the bezel area can be further reduced.

Referring to FIG. 44, the width of the data line group DLG may be larger than the width of the corresponding data pad electrode group DLPG in a direction intersecting (perpendicular) to the data line EL. For example, the width S3 of the first data line group DLG1 in the direction intersecting (perpendicular) to the data line EL is longer than the width S4 of the first data pad electrode group DLPG1 corresponding thereto It can be big.

In addition, the width of the data pad electrode group DLPG can be larger than the interval S5 between the adjacent data pad electrode groups DLPG. For example, the width S4 of the first data pad electrode group DLPG1 in the direction intersecting (perpendicular to) the data line DL is the width of the first data pad electrode group DLPG1 and the second data pad electrode group DLPG2 (S5). ≪ / RTI > Here, the interval S5 between the first data pad electrode group DLPG1 and the second data pad electrode group DLPG2 is equal to the interval S5 between the data pad electrodes DLP of the first data pad electrode group DLPG1, (A + 1) th data pad (DLPG1) closest to the first data pad electrode group DLPG1 among the data pad electrodes DLP of the first data pad electrode DLPa and the second data pad electrode group DLPG2 closest to the data pad electrode DLPG2, Can be seen as an interval between the electrodes DLPa + 1.

On the other hand, the width S6 of the portion where the advancing direction of the data line DL is changed in the direction parallel to the data line DL, for example, the width of the dummy region is shorter than the interval S5 between the adjacent data pad electrode groups DLPG Small is possible. In this case, the size of the bezel area can be further reduced.

Referring to FIG. 45, it is possible to position the electrode line EL and the pad electrode ELP on a straight line without changing the proceeding direction of the electrode line EL. In this case, it is possible to further reduce the size of the bezel region.

The flexible substrate 600 may include a gate flexible substrate 600G electrically connected to the gate side electrode 150G and a data flexible substrate 600D electrically connected to the data side electrode 150D.

46, a gate side electrode 150G is disposed on the second short side SS2 of the display panel 10, and a gate flexible substrate 600G is connected to the gate side electrode 150G. have. The data side electrode 150D may be disposed on the second long side LS2 of the display panel 10 and the data flexible substrate 600D may be connected to the data side electrode 150D.

The data side electrode 150D is disposed on the second long side LS2 of the display panel 10 and the gate side electrode 150G is provided on the first short side SS1 of the display panel 10, The first gate side electrode 150G1 is disposed and the second gate side electrode 150G2 of the gate side electrode 150G is disposed on the second short side SS2 of the display panel 10. [

In this case, a first gate flexible substrate 600G1 may be connected to the first gate side electrode 150G1, and a second gate flexible substrate 600G2 may be connected to the second gate side electrode 150G2.

The first data side electrode 150D1 of the data side electrode 150D is disposed on the first long side LS1 of the display panel 10 and the second long side LS2 of the display panel 10 And a first gate side electrode 150G1 of the gate side electrode 150G is connected to the first short side SS1 of the display panel 10 via the second data side electrode 150D2 of the data side electrode 150D, And the second gate side electrode 150G2 of the gate side electrode 150G is disposed on the second short side SS2 of the display panel 10. [

In this case, the first data flexible substrate 600D1 may be connected to the first data side electrode 150D1, and the second data flexible substrate 600D2 may be connected to the second data side electrode 150D2.

Each of the flexible substrates 600 may be connected to the plurality of side electrodes 150. Accordingly, in the region between the adjacent side electrodes 150, the flexible substrate 600 can be attached to the side surface of the display panel 10.

For example, as shown in FIG. 49, when the flexible substrate 600 is viewed in section A1-A2 of the portion passing through the side electrode 150 in the vertical direction DR1 while being connected to the side electrode 150, 50, it can be seen that the side electrode 150 is connected to the connection electrode 620 of the flexible substrate 600. As shown in FIG.

In this case, it is possible that the first adhesive layer 1000 is disposed between the first substrate 100 and the flexible substrate 600 to improve adhesion between the flexible substrate 600 and the display panel 10.

51, a second adhesive layer 1010 is added between the second substrate 110 and the flexible substrate 600 to improve adhesion between the flexible substrate 600 and the display panel 10, As shown in Fig.

49, when looking at the cross section B1-B2 of the portion of the flexible substrate 600 passing through the area between adjacent side electrodes 150 in the vertical direction DR1 with the flexible substrate 600 connected to the side electrode 150, 52, the flexible substrate 600 may be attached to at least one of the first substrate 100, the second substrate 110, the seal 120, and the pad electrode ELP of the display panel 10 have. To this end, a third adhesive layer 1020 may be disposed between the side of the display panel 10 and the flexible substrate 600. The third adhesive layer 1020 may include a portion located on the side surfaces of the first substrate 100, the second substrate 110, the seal 120 and / or the pad electrode ELP.

As described above, it is possible to further use an adhesive layer or an adhesive sheet to attach the flexible substrate 600 to the side surface of the display panel 10. [

For example, as in the case of FIG. 53, the adhesive sheet 1100 having the holes 1110 through which the side electrodes 150 are exposed in a state where the side electrodes 150 are formed on the side surfaces of the display panel 10, Can be attached to the side surface of the display panel (10).

It is possible that such an adhesive sheet 1100 includes the first, second and third adhesive layers 100, 1010 and 1020.

36 to 37, when an organic metal compound is used to connect the flexible substrate 600 to the side electrode 150, an organic layer 703 having adhesiveness is additionally formed It is possible not to use the adhesive sheet 1100.

40, it is possible not to use the adhesive sheet 1100 even when the adhesive layer 900 including the conductive particles 901 is used.

Meanwhile, in order to lower the electrical resistance between the connection electrode 620 and the side electrode 150 of the flexible substrate 600, it may be preferable to widen the area of the connection electrode within a possible range.

54 (B), the width S9 of the connecting electrode 620 in the vertical direction DR1 is set to be longer than the width S10 of the seal 120 in the vertical direction DR1, for example, (S11).

In this case, the contact area between the side electrode 150 and the connection electrode 620 can be increased.

55, the flexible substrate 600 may include a portion extending a predetermined length R1 from the front surface of the second substrate 110 in the vertical direction DR1. In this case, it is possible to make the length of the flexible substrate 600 sufficiently long.

Meanwhile, it is possible to form a resin layer on the side surface of the display panel 10 in order to more firmly connect the flexible substrate 600 to the display panel 10.

56, a resin layer 1200 covering at least a part of the flexible substrate 600 may be formed at the edge of the display panel 10 so as to extend in the horizontal direction DR2 or DR3.

The resin layer 1200 can cover a part of the second substrate 110 and / or a part of the seal 120.

The resin layer 1200 may include a photosensitive material.

In addition, the resin layer 1200 may include a black dye so that the flexible substrate 600 is not visible.

Referring to FIGS. 57 and 58, the resin layer 1200 may include a portion located on the front surface FS of the second substrate 110. The resin layer 1200 may include a first portion 1210 located on the side of the display panel 10 and a second portion 1220 located on the front side of the display panel 10. In other words,

Here, the first portion 1210 of the resin layer 1200 can cover at least a part of the flexible substrate 600.

As described above, when the resin layer 1200 includes the second portion 1220 located in front of the display panel 10, the flexible substrate 600 includes a portion extending more than the front surface of the display panel 10 The resin layer 1200 can cover the end of the flexible substrate 600, thereby improving the structural stability.

59, a film type filter 1300 may be attached to the front surface of the second substrate 110 of the display panel 10.

The film-type filter 1300 may be a polarizing filter or a stereoscopic (3D) filter.

The second portion 1220 of the resin layer 1200 may contact the film-type filter 1300.

The resin layer 1200 may be formed so as to surround the edge of the display panel 10.

It is assumed that the gate side electrode 150G is formed in the second short side SS2 region of the display panel 10 and the gate flexible substrate 600G is connected to the gate side electrode 150G as in the case of FIG. Let's do it.

In this case, the first resin layer 1200A covers at least a part of the gate flexible substrate 600G at the second short side SS2 of the display panel 10, and the first short side SS1 of the display panel 10 The second resin layer 1200B may be formed to cover a part of the second substrate 110. [

61, a film type filter 1300 attached to the front surface of the second substrate 110 may extend to a side surface of the display panel 10. [ In this case, the film type filter 1300 can cover a part of the flexible substrate 600.

When the film type filter 1300 extends to the side of the display panel 10, the resin layer 1200 may be formed to cover the end of the film type filter 1300 and a part of the flexible substrate 600 have.

Figs. 63 to 74 are diagrams for explaining another configuration of the display apparatus. Fig. In the following, the description of the parts described above may be omitted. Hereinafter, a liquid crystal display device including a liquid crystal display panel will be described as an example of a display device, but the present invention is not limited thereto. For example, the backlight unit 11 may be omitted in the following configuration.

63, a display device 2000 includes a backlight unit 11 including a display panel 10, an optical layer 11A and a light source part 11B, , 12).

The display panel 10 for displaying an image has been described in detail above.

The optical layer 11A may be disposed between the display panel 10 and the cover 12. [

The optical layer 11A may be composed of a plurality of sheets. For example, although not shown, it is possible for the optical layer 11A to include at least one of a prism sheet and a diffusion sheet.

In addition, the light source portion 11B of the backlight unit 11 may be disposed behind the optical layer 11A. It is also possible that the backlight unit includes a light guide plate (not shown).

Various types of light sources may be applied to the light source unit 11B. For example, the light source may be one of a light emitting diode (LED) chip or a light emitting diode package having at least one light emitting diode chip. In this case, the light source may be a colored LED or a white LED that emits at least one color among colors such as red, blue, green, and the like.

The backlight unit 11 may be a direct type backlight unit or an edge type backlight unit.

It is possible that the cover 12 is disposed behind the backlight unit 11. [

The cover 12 can protect at least the backlight unit 11 from impact and pressure externally applied.

Referring to FIG. 64, a bracket 1500 may be disposed on a rear surface of the first substrate 100 of the display panel 10.

The bracket 1500 may be attached to the first substrate 100 by an adhesive layer 1510.

The bracket 1500 may be provided with a backlight unit 11 including the optical layer 11A and the light source unit 11B.

A frame 1520 may be disposed behind the backlight unit 11.

The driving unit 1530 may be disposed in the frame 1520. The driving unit 1530 may be referred to as a driving board.

The flexible substrate 600 may electrically connect the side electrode 150 formed on the side surface of the display panel 10 and the driving unit 1530.

Referring to Fig. 65, the cover 12 may include a rear portion 12A located on the rear side of the display panel and a side portion 12B located on the side of the display panel 10. That is, the cover 12 can cover the rear and side surfaces of the display panel 10.

Here, the rear portion 12A and the side portion 12B may be integrally formed.

In this way, the edge of at least one side of the front surface (FS) of the display panel 10 can be exposed while the cover 12 is disposed behind the display panel 10.

Here, the edge of at least one side of the front surface FS of the display panel 10 is exposed when the observer looks at the display panel 10 from the front (e.g., the first point P1) of the display device 2000 It can mean that the edge of the front surface FS of the display panel 10 can be observed.

In this case, a visual effect in which the screen of the display device is enlarged can be obtained.

Referring to Fig. 66, the cover 12 may be physically divided into a side portion 12B and a rear portion 12A.

In this case, the rear portion 12A and the side portion 12B of the cover 12 can be fastened by a fastening means S100 such as a screw.

The cover 12 may be connected to the frame 1520. For example, as in the case of Fig. 67, the rear portion 12A of the cover 12 and the frame 1520 can be fastened by a predetermined fastening means S200.

68, the flexible substrate 600 may be exposed in a region between the side portion 12B of the cover 12 and the display panel 10. [ For example, an observer can observe the flexible substrate 600 when an observer views the area between the side portion 12B of the cover 12 and the display panel 10 in front of the display device 2000. [

As described above, in the case where the base layer and / or the cover layer of the flexible substrate 600 include a black material, the soft substrate (or the cover layer) is formed in the region between the side portion 12B of the cover 12 and the display panel 10 600 may be exposed, the observer's view may not be interrupted.

69, when the resin layer 1200 is formed at the edge of the display panel 10, the resin layer 1200 covers the side surface 12B of the cover 12 and the side surface 12B of the display panel 10, As shown in FIG.

The area between the side portion 12B of the cover 12 and the side surface of the display panel 10 can be covered by the resin layer 1200. [ In this case, it is preferable that the resin layer 1200 further includes a black material as a dye.

Alternatively, a buffer layer 1600 having elasticity may be disposed between the side surface portion 12B of the cover 12 and the side surface of the display panel 10, as in the case of FIG.

The buffer layer 1600 may be made of a material having flexibility such as a sponge.

The buffer layer 1600 can prevent the side surface of the display panel 10 from colliding with the side surface portion 12B of the cover 12 and the side surface portion 12B of the cover 12, It is possible to prevent foreign matter such as dust from entering the space.

This buffer layer 1600 can also have a substantially black color.

The buffer layer 1600 may be attached to the side surface portion 12B of the cover 12. [ To this end, an adhesive layer 1610 may be disposed between the side portion 12B of the cover 120 and the buffer layer 1600.

71, the side portion 12B of the cover 12 is spaced a predetermined height X1 from the front surface FS of the display panel 10, that is, the front surface of the second substrate 110 in the vertical direction DR1 And may include protruding portions. In this case, the side surface portion 12B of the cover 12 can effectively protect the side surface of the display panel 10.

72 to 73, the display apparatus 2000 according to the present invention may further include a bottom cover 13. The lower cover 13 may be connected to the cover 12.

73, the side portion 12B of the cover 12 corresponds to the first long side LS1, the first short side SS1 and the second short side SS2 of the display panel 10, and the bottom cover 13 May be disposed on the second long side LS2 corresponding to the first long side LS1 of the display panel 10. [

The side portion 12B of the cover 12 is positioned on the side of the display panel 10 in the first long side LS1, the first short side SS1 and the second short side SS2 of the display panel 10 And the lower cover 13 can cover the side surface of the display panel 10 in the second long side (LS2) area of the display panel 10.

The edges of the front surface of the display panel 10 may be respectively exposed at the first long side LS1, the second long side LS2, the first short side SS1 and the second short side SS2.

The reason why the front edges of the display panel 10 are exposed at the first long side LS1, the second long side LS2, the first short side SS1 and the second short side SS2, respectively, This is because the flexible substrate 600 is attached to the side surface of the display panel 10.

74, a data side electrode 150D is disposed on the second long side LS2 of the display panel 10, and a gate side electrode (not shown) is formed on the first short side SS1 of the display panel 10, Assuming that the first gate side electrode 150G1 of the gate electrode 150G is disposed and the second gate side electrode 150G2 of the gate side electrode 150G is disposed on the second short side SS2 of the display panel 10 lets do it.

In this case, a first gate flexible substrate 600G1 may be connected to the first gate side electrode 150G1, and a second gate flexible substrate 600G2 may be connected to the second gate side electrode 150G2.

The data flexible substrate 600 may be disposed between the side of the display panel 10 and the lower cover 13 in the second long side LS2 region of the display panel 10.

The first gate flexible substrate 600G1 may be disposed between the side of the display panel 10 and the side portion 12B of the cover 12 in the first short side SS1 region of the display panel 10 .

A second gate flexible substrate 600G2 may be disposed between the side of the display panel 10 and the side portion 12B of the cover 12 in the second short side SS2 region of the display panel 10 .

In this case, at least the first long side LS1, the first short side SS1, and the second short side SS2 of the display panel 10 may be cut. The edge of the front surface of the display panel 10 is exposed at the first long side LS1, the second long side LS2, the first short side SS1 and the second short side SS2 of the display panel 10 You can.

75 is a view for explaining an example of an electronic apparatus to which the display device according to the present invention is applied. Hereinafter, the description of the parts described in detail above will be omitted. In the following, an example of a broadcast signal receiver (Broadcasting Signal Receiver) will be described as an example of an electronic apparatus to which the display apparatus according to the present invention is applied. The display device according to the present invention can be applied to other electronic devices such as mobile phones.

Hereinafter, the display unit 10 may correspond to the display panel and the display device described in detail with reference to FIGS. 1 to 74.

75, a broadcast signal receiver 100Q according to the present invention includes a broadcast receiver 105Q, an external device interface unit 135Q, a storage unit 140Q, a user input interface unit 150Q, a controller 170Q, A display unit 10, an audio output unit 185Q, a power supply unit 190Q, and a photographing unit (not shown). The broadcast receiving unit 105Q may include a tuner 110Q, a demodulating unit 120Q, and a network interface unit 130Q.

The tuner 110Q and the demodulator 120Q may be provided and the network interface 130Q may not be included in the tuner 110Q and the network interface 130Q may be provided. It is also possible to design so as not to include the signal line 120Q.

The tuner 110Q selects an RF broadcast signal corresponding to a channel selected by the user or all pre-stored channels among RF (Radio Frequency) broadcast signals received through the antenna. Also, the selected RF broadcast signal is converted into an intermediate frequency signal, a baseband image, or a voice signal.

The demodulator 120Q receives the digital IF signal DIF converted by the tuner 110Q and performs a demodulation operation.

The stream signal output from the demodulation unit 120Q may be input to the control unit 170Q. The control unit 170Q performs demultiplexing, video / audio signal processing, and the like, and then outputs the video to the display unit 10 and the audio output unit 185Q.

The external device interface unit 135Q can connect the external device and the broadcast signal receiver 100Q. To this end, the external device interface unit 135Q may include an A / V input / output unit (not shown) or a wireless communication unit (not shown).

The network interface unit 130Q provides an interface for connecting the broadcast signal receiver 100Q to a wired / wireless network including the Internet network.

The network interface unit 130Q may correspond to the wireless communication unit described above in detail.

The storage unit 140Q may store a program for each signal processing and control in the control unit 170Q or may store a signal-processed video, audio, or data signal.

The user input interface unit 150Q transmits a signal input by the user to the controller 170Q or a signal from the controller 170Q to the user.

For example, the user input interface unit 150Q may turn on / off the power from the remote control device 200Q, select a channel, select a channel from the remote control device 200Q according to various communication methods such as an RF (Radio Frequency) communication method, Or a control signal from the control unit 170Q to the remote control device 200Q.

For example, the user input interface unit 150Q can transmit a control signal input from a local key (not shown) such as a power key, a channel key, a volume key, and a set value to the controller 170Q.

The control unit 170Q demultiplexes the input stream or processes the demultiplexed signals through the tuner 110Q or the demodulation unit 120Q or the external device interface unit 135Q to generate a signal for video or audio output Can be generated and output.

The video signal processed by the controller 170Q is input to the display unit 10 and can be displayed as an image corresponding to the video signal. The video signal processed by the controller 170Q may be input to the external output device through the external device interface unit 135. [

The audio signal processed in the control unit 170Q may be output to the audio output unit 185Q. In addition, the voice signal processed in the controller 170Q may be input to the external output device through the external device interface unit 135Q.

In addition, the control unit 170Q can control overall operation in the broadcast signal receiver 100Q. For example, the controller 170Q may control the tuner 110Q to control the tuner 110Q to select an RF broadcast corresponding to a channel selected by the user or a previously stored channel.

In addition, the controller 170Q can control the broadcast signal receiver 100Q according to a user command or an internal program input through the user input interface unit 150Q.

The display unit 10 converts an image signal, a data signal, an OSD signal processed by the control unit 170Q or a video signal and a data signal received from the external device interface unit 135Q into R, G, and B signals, respectively Thereby generating a driving signal.

The audio output unit 185Q receives a signal processed by the control unit 170Q, for example, a stereo signal, a 3.1 channel signal, or a 5.1 channel signal, and outputs it as a voice.

The power supply unit 190Q supplies the corresponding power supply throughout the broadcast signal receiver 100Q.

The remote control device 200Q transmits the user input to the user input interface unit 150Q. To this end, the remote control apparatus 200 can use Bluetooth, RF (radio frequency) communication, infrared (IR) communication, UWB (Ultra Wideband), ZigBee, or the like.

Also, the remote control device 200Q can receive the video, audio, or data signal output from the user input interface unit 150Q and display it on the remote control device 200Q or output voice or vibration.

The broadcast signal receiver 100Q does not include the tuner 110Q and the demodulator 120Q but receives the image content through the network interface unit 130Q or the external device interface unit 135Q have.

As described above, it is to be understood that the technical structure of the present invention can be embodied in other specific forms without departing from the spirit and essential characteristics of the present invention.

It should be understood, therefore, that the embodiments described above are to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than the foregoing description, And all changes or modifications derived from equivalents thereof should be construed as being included within the scope of the present invention.

Claims (10)

A display panel; And
A flexible substrate attached to a side surface of the display panel;
/ RTI >
The display panel
A first substrate on which an electrode line and a switching element are arranged;
A second substrate disposed to face the first substrate;
A seal part for attaching the first substrate and the second substrate together;
A pad electrode disposed at a position overlapping with the seal portion in a vertical direction and electrically connected to the electrode line; And
A side electrode connected to one end surface of the pad electrode and including a portion located on a side surface of the seal portion;
/ RTI >
And the flexible substrate is electrically connected to the side electrodes. The method according to claim 1,
The flexible substrate
A base layer having ductility;
An electrode disposed in the base layer;
A cover layer including a portion covering the electrode;
/ RTI >
At least one of the base layer and the cover layer includes a black material,
And the electrode includes a portion electrically connected to the side electrode. The method according to claim 1,
Wherein a width of the flexible substrate in a horizontal direction is larger than an interval between adjacent flexible substrates. The method according to claim 1,
Wherein the flexible substrate includes at least one of a portion attached to a side surface of the first substrate, a portion attached to a side surface of the seal portion, and a portion attached to a side surface of the second substrate. The method according to claim 1,
Wherein the flexible substrate includes a portion extending beyond a front surface of the second substrate. The method according to claim 1,
And a resin layer covering at least a part of the flexible substrate and a part of the second substrate and extending in the horizontal direction. The method according to claim 6,
The resin layer
A first portion located on a side surface of the display panel; And
A second portion located in front of the display panel;
. 8. The method of claim 7,
Further comprising a film type filter attached to a front surface of the second substrate,
And the second portion contacts the film type filter. The method according to claim 1,
The electrode line includes a gate line and a data line intersecting with each other,
The pad electrode
A gate pad electrode electrically connected to the gate line; And
A data pad electrode electrically connected to the data line;
/ RTI >
The side-
A gate side electrode connected to one end surface of the gate pad electrode; And
A data side electrode connected to one end surface of the data pad electrode;
/ RTI >
The flexible substrate
A gate flexible substrate electrically connected to the gate side electrode; And
A data flexible substrate electrically connected to the data side electrode;
. 10. The method of claim 9,
Wherein the gate pad electrode, the gate side electrode, and the gate flexible substrate are located on a short side of the first substrate,
Wherein the data pad electrode, the data side electrode, and the data flexible substrate are located on a long side of the first substrate.

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