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KR20140077533A - Method for manufacturing optical wiring board - Google Patents

Method for manufacturing optical wiring board Download PDF

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Publication number
KR20140077533A
KR20140077533A KR1020120146447A KR20120146447A KR20140077533A KR 20140077533 A KR20140077533 A KR 20140077533A KR 1020120146447 A KR1020120146447 A KR 1020120146447A KR 20120146447 A KR20120146447 A KR 20120146447A KR 20140077533 A KR20140077533 A KR 20140077533A
Authority
KR
South Korea
Prior art keywords
forming
layer
base substrate
optical waveguide
mirror
Prior art date
Application number
KR1020120146447A
Other languages
Korean (ko)
Inventor
정재현
김상훈
이춘근
조재춘
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020120146447A priority Critical patent/KR20140077533A/en
Publication of KR20140077533A publication Critical patent/KR20140077533A/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12166—Manufacturing methods

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

A method for manufacturing an optical substrate according to the present invention includes the steps of: preparing a base substrate having circuit patterns on both surfaces thereof; forming an optical waveguide on one surface of the base substrate; forming photosensitive insulation layers on the surface of the optical waveguide and the other surface of the base substrate; forming, on the photosensitive insulation layers, an aperture for forming a mirror groove to expose the surface of the optical waveguide and an aperture for forming an optoelectronic element to expose the other surface of the base substrate; respectively forming the mirror groove and a via hole on the optical waveguide exposed through the aperture for forming the mirror groove and on the base substrate exposed through the aperture for forming the optoelectronic element; forming a metal layer on the photosensitive insulation layers including the inner walls of the mirror groove and the via hole; and patterning the metal layer to form a metal mirror layer, an external layer circuit, and an optoelectronic element connection pad.

Description

[0001] The present invention relates to a method for manufacturing an optical wiring board,

The present invention relates to a method of manufacturing a light guide plate.

Printed circuit board (PCB) technology using copper-based electrical wiring has reached its limit by increasing the data speed and capacity of electronic components. Accordingly, a photovoltaic panel including an optical waveguide has been attracting attention as a technique capable of overcoming the problems of the conventional copper-based electric wiring.

An optical waveguide includes an optical waveguide, which can transmit and receive a signal by using a polymer and an optical fiber, in a printed circuit board. The optical waveguide includes an electro-optical circuit (EOCB) Board). The EOCB is a backplane or daughterboard in the communications network switch and transmit / receive equipment, data communication switches and servers, communications in aerospace and avionics, mobile phone base stations in UMTS (Universal Mobile Telecommunication System) Daughter Board).

The formation of the optical waveguide, which is the path of light in the optical plate, can be performed by a method of directly arranging the optical fiber on the printed circuit board, a method of separately attaching the optical waveguide element to the printed circuit board, A method of forming an optical waveguide on a printed circuit board using a material, and the like are known.

However, when the optical fiber or the optical waveguide device is directly mounted on the printed circuit board, the compatibility with the electric wiring layer formed on the printed circuit board is weak.

In addition, when the optical waveguide device is fabricated and then mounted on a printed circuit board, the physical properties of the optical waveguide material are changed by high temperature and high pressure because a high temperature and high pressure press process is necessarily involved, And there is a case where signal quality deterioration occurs.

In addition, even when the optical waveguide is formed directly on the printed circuit board, the electric wiring layer is located on the same layer above or below the optical waveguide, or above and below, and it is difficult to form a further electric wiring layer. It is difficult to do.

On the other hand, a method of manufacturing a photomask according to the prior art is disclosed in U.S. Patent Publication No. 2004-117984.

One aspect of the present invention is to provide a method of manufacturing a light guide plate capable of improving the matching between a circuit pattern and an optical waveguide.

Another aspect of the present invention is to provide a method of manufacturing a photovoltaic panel capable of reducing the number of processes and shortening the process time and reducing the process cost.

A method of manufacturing a photonic plate according to the present invention includes: preparing a base substrate having circuit patterns on both sides; Forming an optical waveguide on one surface of the base substrate; Forming a photosensitive insulating layer on the optical waveguide surface and the other surface of the base substrate; Forming an opening for forming a mirror groove for exposing the surface of the optical waveguide on the photosensitive insulating layer and an optical device mounting opening exposing the other surface of the base substrate; Forming mirror grooves and via holes in the optical waveguide exposed through the opening for forming the mirror groove and the base substrate exposed through the opening for mounting the photoelectric device, respectively; Forming a metal layer on the photosensitive insulating layer including the mirror groove and the inner wall of the via hole; And patterning the metal layer to form a metal mirror layer, an outer layer circuit, and a photoelectric element connection pad.

At this time, the step of forming the opening for forming the mirror groove and the opening for mounting the optoelectronic device in the photosensitive insulating layer is performed by a photolithography process including an exposure and a development process.

Further, the method may further include forming a solder resist layer covering the metal mirror layer and the outer layer circuit on the photosensitive insulating layer, after the step of forming the metal mirror layer, the outer layer circuit, and the photoelectric element connection pad.

The optical waveguide may include a core layer having one side and the other side; A first clad layer formed on one surface of the core layer; And a second clad layer formed on the other surface of the core layer.

The forming of the optical waveguide on one surface of the base substrate may include forming a first cladding layer on one surface of the base substrate, Forming the core layer on the first clad layer; And forming the second clad layer on the core layer.

Further, the step of forming the mirror groove and the via hole is performed through a cutting process or a laser process.

Further, the step of forming the metal layer is performed through a plating process.

The plating process includes an electroless plating process and an electroplating process.

The base substrate may be a CCL (Copper Clad Laminate) or an FCCL (Flexible Copper Clad Laminate).

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to that, terms and words used in the present specification and claims should not be construed in a conventional and dictionary sense, and the inventor may properly define the concept of the term in order to best explain its invention It should be construed as meaning and concept consistent with the technical idea of the present invention.

According to the present invention, by forming the optical waveguide on the circuit pattern on the basis of the circuit pattern on one side of the base substrate, compared with the optical waveguide which separately forms the optical waveguide means and joins to the printed circuit board, And there is no need for a high-temperature / high-pressure process. Therefore, there is an effect of preventing a light loss due to a change in physical properties of an optical waveguide and a deterioration in signal quality.

Further, according to the present invention, after the photosensitive insulating layer is formed on the optical waveguide, the opening for forming the mirror groove and the opening for mounting the photoelectric device are opened through the photolithography process including exposure and development, The number of process steps can be reduced, and productivity and cost can be reduced.

1 is a flowchart schematically illustrating a method of manufacturing a light plate according to an embodiment of the present invention, and Fig.
FIGS. 2 to 12 are process cross-sectional views sequentially illustrating a method of manufacturing a light guide plate according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The objectives, particular advantages and novel features of the invention will become more apparent from the following detailed description and examples taken in conjunction with the accompanying drawings. It should be noted that, in the present specification, the reference numerals are added to the constituent elements of the drawings, and the same constituent elements have the same numerical numbers as much as possible even if they are displayed on different drawings. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. In this specification, the terms first, second, etc. are used to distinguish one element from another element, and the element is not limited by the terms.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a flow chart schematically illustrating a method of manufacturing a light guide plate according to an embodiment of the present invention, and FIGS. 2 to 12 are process cross-sectional views sequentially illustrating a method of manufacturing a light guide plate according to an embodiment of the present invention.

Referring to FIG. 1, a method of manufacturing a photodiode according to an embodiment of the present invention includes providing a base substrate (S10), forming a circuit pattern on a base substrate (S20 (S30) forming an optical waveguide on a circuit pattern on one side of the base substrate; forming a photosensitive insulation layer on the optical waveguide in a name of the base substrate and on a circuit pattern on the other side of the base substrate (S50) of opening the mirror groove forming opening and the photoelectric device mounting opening (S50); forming a mirror groove in the mirror groove forming opening and forming a via hole for electrical connection of the photoelectric device (S70) forming a metal layer by electroless plating or electrolytic plating on one surface and the other surface of the base substrate treated in the above step (S70); and forming an outer layer circuit pattern and a photoelectric Forming a device connection pad S80, and finally forming a solder resist layer S90.

Referring to FIGS. 2 through 12 together with the flow chart of FIG. 1, a method of manufacturing a light guide plate according to an embodiment of the present invention will be described in detail.

2, the base substrate 10 provided in the step S10 includes a base body 11 made of an epoxy resin or a bakelite resin as an insulator and a copper foil (CCL) or FCCL (Flexible Copper Clad Laminate), which is made of a copper (Cu) 12, 13, but is not limited thereto.

When the base substrate is thus prepared, a circuit pattern forming method in a typical printed circuit board manufacturing process is used in step S20 as shown in Fig. 3, for example, a silk screen printing method using a system ink, And the desired circuit patterns 12 'and 13' are formed on both sides of the base substrate 10 by using a PCB milling method and a PCB milling method. At this time, the through holes 14 may be formed for electrical connection between the copper foil layers 12 and 13 with reference to the base body 11.

When the first and second circuit patterns 12 'and 13' are completed on the base substrate 10, in order to form the optical waveguide 20, as shown in FIG. 4, Specifically, the first clad layer 21 is formed on the surface on which the first circuit pattern 12 'is formed. The first clad layer 21 may be formed of a polymer material including acrylic, epoxy, polyimide and the like. The first clad layer 21 may be formed by dispensing a liquid clad material, Printing may be carried out by various methods such as ink jetting, printing, and the like, followed by curing, but the present invention is not limited thereto.

When the formation of the first clad layer 21 is completed, a core layer 22 is formed on the first clad layer 21 which is cured as shown in FIG. The core layer 22 may be made of a polymer material similar to the first clad layer 21 and may be formed in the same manner as the first clad layer 21.

In this case, the patterned mask is disposed on the core layer 22 formed on the first cladding layer 21, and then an optional exposure process is performed to cure the core layer. Through the development process, It is also possible to form the core layer 22.

When the core layer 22 is formed, a second clad layer 23 is formed on the core layer 22, as shown in FIG. The second clad layer 23 may be made of the same material as the first clad layer 23, but is not limited thereto.

The optical waveguide 20 in which the first clad layer 21 and the second clad layer 23 surround the core layer 22 is formed through the above-described process. Here, the refractive index of the core layer 22 may have a larger refractive index than that of the first and second clad layers for smooth optical wave, but the present invention is not limited thereto.

7, the surface of the optical waveguide 20 and the second circuit pattern 13 'are formed in order to form an additional circuit pattern (step S40) 10, the first photosensitive insulating layer 31 and the second photosensitive insulating layer 32 are formed. The first photosensitive insulating layer 31 and the second photosensitive insulating layer 32 may be formed by a spin coating method, a printing method, or a roll-to-roll method. But is not limited thereto.

8, the first photosensitive insulating layer 31 is formed with an optical waveguide 20 at step S50, and the first photosensitive insulating layer 31 and the second photosensitive insulating layer 32 are formed. And an opening 32'1 for mounting an optoelectronic device for mounting the photoelectric device is formed in the second photosensitive insulation layer 32. The opening 32 '

At this time, the formation of the mirror groove forming opening 31'1 and the photoelectric device mounting opening 32'1 can be performed through a photolithography process including exposure and development using a mask, no.

A second photosensitive insulating layer (not shown) is formed in the through hole 14 for electrical connection between the first circuit pattern 12'1 and the second circuit pattern 13'1 so that a metal layer can be formed through a plating process 32 may be formed with an open portion 14'1 communicating with the through hole 14. [

When the formation of the mirror groove forming opening 31'1 and the photoelectric device mounting opening 32'1 is completed, as shown in Fig. 9, in step S60, the mirror groove forming opening 31'1 A mirror groove 31'2 is formed in the exposed optical waveguide 20 and the base substrate 10 exposed through the opening 32'1 for optoelectronic devices is electrically and electrically connected to the first circuit pattern 12 ' Thereby forming a via hole 32'2 for connection.

At this time, the mirror groove 31'2 may be formed in a V-shape using a cutting process by a dicing blade or a laser process attached to a dicing saw or a cutting saw But is not limited thereto.

The via hole 32'2 may be formed through a drilling operation, but is not limited thereto.

When the formation of the mirror groove 31'2 and the via hole 32'2 is completed, as shown in FIG. 10, in step S70, the inside of the mirror groove 31'2 and the inside of the via hole 32'2 A metal layer 50 is formed on the first photosensitive insulation layer 31 and the second photosensitive insulation layer 32.

At this time, the metal layer 50 may be formed through a plating process, but is not limited thereto.

The plating process may include an electroless plating process and an electroplating process, but is not limited thereto.

After the metal layer 50 is formed, the metal layer 50 is patterned to form an outer layer circuit pattern (not shown) on the surfaces of the first photosensitive insulating layer 31 and the second photosensitive insulating layer 32 in step S80, A metal mirror layer 52 is formed on the inner wall of the mirror groove 31'2 and a photoelectric element connection pad 53 for installing a photoelectric element is formed in the via hole 32'2.

At this time, the method of patterning the metal layer 50 is well known in the art, and a detailed description thereof will be omitted.

Next, as shown in Fig. 12, in step S90, a solder layer (not shown) covering the metal mirror layer 52 and the outer layer circuit pattern 51 is formed on the first photosensitive insulation layer 31 and the second photosensitive insulation layer 32, A resist layer 60 is formed.

The method of manufacturing the light guide plate according to the present embodiment will be summarized as follows.

The base substrate 10 on which circuit patterns 12 'and 13' are formed on both sides of the base body 11 of the base substrate 10 and the circuit pattern 12 'is formed, as shown in FIGS. 2 to 12, The optical waveguide 20 is formed on one side of the optical waveguide 20.

Thus, the matching between the circuit pattern 12 'and the optical waveguide 20 can be remarkably improved as compared with the conventional method of manufacturing the optical waveguide, in which the optical waveguide is manufactured in advance and then physically attached to the printed circuit board.

On the other hand, photosensitive insulating layers 31 and 32 are formed on the surface of the optical waveguide 20 and the other surface of the base substrate 10 using a photosensitive insulating film, and a photolithography process including exposure and development is performed, After the opening 31'1 and the photoelectric device mounting opening 32'1 are formed, a via hole 32'2 for electrical connection with the mirror groove 31'2 is formed.

Thus, in comparison with the conventional process in which the mirror groove forming opening and the photoelectric device mounting opening are formed on the insulating material in advance and then laminated on the optical waveguide surface and the other surface of the base substrate, The process time can be shortened and the process cost can be reduced, and also the accuracy of the interlayer matching can be improved.

Next, a metal mirror layer 52 is formed on the mirror groove 31'2, a photoelectric element connection pad 53 is formed on the via hole 32'2, and an outer layer circuit pattern 51 is formed on the photosensitive insulation layers 31 and 32 (Not shown) is formed on the photoelectric element connection pads 53 exposed through the photoelectric element mounting openings 32'1 after the solder resist layer 60 is formed to cover them.

At this time, the photoelectric device may be a Vertical Cavity Surface Emitting Laser (VCSEL) or a PD (Photo Diode), but is not limited thereto.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the same is by way of illustration and example only and is not to be construed as limiting the present invention. It is obvious that the modification or improvement is possible.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

10: base substrate
11: Base body
12, 13: Copper foil
12 ': first circuit pattern
13 ': second circuit pattern
14: Through hole
14'1: open section
20: optical waveguide
21: First cladding layer
22: core layer
23: second cladding layer
31: first photosensitive insulating layer
31'1: Mirror groove forming opening
31'2: Mirror groove
32: second photosensitive insulating layer
32'1: opening for mounting a photoelectric device
32'2:
50: metal layer
51: outer layer circuit pattern
52: metal mirror layer
53: Photoelectric element connection pad
60: solder resist layer

Claims (9)

Preparing a base substrate having circuit patterns on both sides;
Forming an optical waveguide on one surface of the base substrate;
Forming a photosensitive insulating layer on the optical waveguide surface and the other surface of the base substrate;
Forming an opening for forming a mirror groove for exposing the surface of the optical waveguide on the photosensitive insulating layer and an optical device mounting opening exposing the other surface of the base substrate;
Forming mirror grooves and via holes in the optical waveguide exposed through the opening for forming the mirror groove and the base substrate exposed through the opening for mounting the photoelectric device, respectively;
Forming a metal layer on the photosensitive insulating layer including the mirror groove and the inner wall of the via hole; And
Forming a metal mirror layer, an outer layer circuit, and a photoelectric element connection pad by patterning the metal layer
Wherein the light guide plate comprises a light guide plate.
The method according to claim 1,
Forming an opening for forming a mirror groove and an opening for mounting a photoelectric device in the photosensitive insulating layer,
Wherein the photolithography process is performed by a photolithography process including an exposure process and a development process.
The method according to claim 1,
After forming the metal mirror layer, the outer layer circuit and the photoelectric element connection pad,
And forming a solder resist layer covering the metal mirror layer and the outer layer circuit on the photosensitive insulating layer.
The method according to claim 1,
The optical waveguide includes:
A core layer having one side and the other side;
A first clad layer formed on one surface of the core layer; And
A second clad layer formed on the other surface of the core layer,
≪ / RTI >
The method of claim 4,
Wherein forming the optical waveguide on one surface of the base substrate comprises:
Forming a first clad layer on one surface of the base substrate;
Forming the core layer on the first clad layer; And
And forming the second clad layer on the core layer
Wherein the light guide plate comprises a plurality of light guide plates.
The method according to claim 1,
Wherein the step of forming the mirror groove and the via hole is performed through a cutting process or a laser process.
The method according to claim 1,
Wherein the step of forming the metal layer is performed through a plating process.
The method of claim 7,
Wherein the plating process includes an electroless plating process and an electroplating process.
The method according to claim 1,
Wherein the base substrate is CCL (Copper Clad Laminate) or FCCL (Flexible Copper Clad Laminate).
KR1020120146447A 2012-12-14 2012-12-14 Method for manufacturing optical wiring board KR20140077533A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020120146447A KR20140077533A (en) 2012-12-14 2012-12-14 Method for manufacturing optical wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120146447A KR20140077533A (en) 2012-12-14 2012-12-14 Method for manufacturing optical wiring board

Publications (1)

Publication Number Publication Date
KR20140077533A true KR20140077533A (en) 2014-06-24

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9246596B2 (en) 2009-05-28 2016-01-26 Freedom Photonics, Llc. Monolithic widely-tunable coherent receiver
US9344196B1 (en) 2009-05-28 2016-05-17 Freedom Photonics, Llc. Integrated interferometric optical transmitter
EP3130950A1 (en) 2015-08-10 2017-02-15 Multiphoton Optics Gmbh Beam deflection element and optical construction element with beam deflection element
US11251584B2 (en) 2017-03-28 2022-02-15 Freedom Photonics Llc Tunable laser
WO2024162008A1 (en) * 2023-01-30 2024-08-08 京セラ株式会社 Photoelectric wiring board and production method for photoelectric wiring board

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9246596B2 (en) 2009-05-28 2016-01-26 Freedom Photonics, Llc. Monolithic widely-tunable coherent receiver
US9270380B2 (en) 2009-05-28 2016-02-23 Freedom Photonics, Llc. Chip-based advanced modulation format transmitter
US9344196B1 (en) 2009-05-28 2016-05-17 Freedom Photonics, Llc. Integrated interferometric optical transmitter
US9887780B2 (en) 2009-05-28 2018-02-06 Freedom Photonics, Llc. Chip-based advanced modulation format transmitter
US9941971B1 (en) 2013-07-23 2018-04-10 Freedom Photonics, Llc. Integrated interferometric optical transmitter
EP3130950A1 (en) 2015-08-10 2017-02-15 Multiphoton Optics Gmbh Beam deflection element and optical construction element with beam deflection element
US11251584B2 (en) 2017-03-28 2022-02-15 Freedom Photonics Llc Tunable laser
WO2024162008A1 (en) * 2023-01-30 2024-08-08 京セラ株式会社 Photoelectric wiring board and production method for photoelectric wiring board

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