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KR20130063076A - Light emitting diode array and lighting device including the same - Google Patents

Light emitting diode array and lighting device including the same Download PDF

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Publication number
KR20130063076A
KR20130063076A KR1020110129387A KR20110129387A KR20130063076A KR 20130063076 A KR20130063076 A KR 20130063076A KR 1020110129387 A KR1020110129387 A KR 1020110129387A KR 20110129387 A KR20110129387 A KR 20110129387A KR 20130063076 A KR20130063076 A KR 20130063076A
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KR
South Korea
Prior art keywords
wiring
light emitting
circuit board
emitting device
device array
Prior art date
Application number
KR1020110129387A
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Korean (ko)
Other versions
KR101412011B1 (en
Inventor
이경재
선경표
Original Assignee
주식회사 루멘스
엘이디라이텍(주)
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Priority to KR1020110129387A priority Critical patent/KR101412011B1/en
Publication of KR20130063076A publication Critical patent/KR20130063076A/en
Application granted granted Critical
Publication of KR101412011B1 publication Critical patent/KR101412011B1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L33/486—
    • H01L33/62—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The present invention relates to a light emitting element array capable of easily coupling a light emitting element and a lighting apparatus including the same, which comprises a circuit board, a first wiring having a loop shape disposed on the circuit board, And a second wiring electrically connected to the first wiring and the second wiring, and a light emitting element array including the first light emitting element and the first light emitting element, And a lighting device.

Description

TECHNICAL FIELD [0001] The present invention relates to a light emitting device array and a lighting device including the light emitting device array.

The present invention relates to a light emitting device, and more particularly, to a light emitting device array and a lighting device including the same.

Generally, a light emitting element emits light by combining electrons and holes. Such a light emitting device has low power consumption, long life, and can be installed in a narrow space, and has a characteristic of being resistant to vibration.

The array of light emitting elements can be used as a light source of the lighting apparatus. For example, the light emitting device array performs a local dimming operation to provide a comfortable illumination to the user when used as a light source in a lighting device.

However, such a conventional light emitting device array and a lighting device including the same have a problem in that the wiring for arranging the light emitting devices is complicated.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a light emitting device array capable of easily coupling light emitting devices and a lighting device including the light emitting device array. However, these problems are exemplary and do not limit the scope of the present invention.

According to an aspect of the present invention, there is provided a circuit board, comprising: a circuit board; a first wiring having a loop shape disposed on the circuit board; and a second wiring that surrounds the first wiring so as not to intersect with the first wiring, And a first light emitting element electrically connected to the first wiring and the second wiring.

The first wiring may have a closed loop shape. Alternatively, the first wiring may have a loop shape with one side opened.

The second wiring may have a circular or rectangular shape with one side opened, and the first wiring may extend outside the second wiring via an opened side of the second wiring.

The first light emitting devices may be connected in parallel by the first wiring and the second wiring.

A third wiring arranged on the circuit board so as to surround the second wiring and open at one side so as not to intersect with the second wiring; and a second wiring surrounding the third wiring so as not to cross the third wiring, A fourth wiring disposed on the circuit board, and second light emitting devices electrically connected to the third wiring and the fourth wiring and having different color temperatures from the first light emitting devices.

Each of the third wiring and the fourth wiring may have a circular shape or a quadrilateral shape in which one side is open.

And the second light emitting elements may be connected in parallel by the third wiring and the fourth wiring.

Any one of the group including the first light emitting elements and the group including the second light emitting elements may emit cool white light and the other group may emit warm white light .

According to another aspect of the present invention, there is provided a light emitting device including a light emitting device array according to embodiments of the present invention, a first dimming unit electrically connected to the light emitting device array and controlling brightness of the first light emitting devices, And a second dimming section for adjusting the brightness of the elements.

According to an embodiment of the present invention as described above, a light emitting device array capable of easily coupling a light emitting device and a lighting device including the same can be realized. Of course, the scope of the present invention is not limited by these effects.

1 is a plan view schematically showing a light emitting device array according to an embodiment of the present invention.
2 is a plan view schematically showing a light emitting device array according to a modification of the embodiment of the present invention.
3 is a plan view schematically illustrating a light emitting device array according to another embodiment of the present invention.
4 is a plan view schematically showing a light emitting device array according to another embodiment of the present invention.
5 is a cross-sectional view schematically showing a cross section taken along line VV in Figs. 1 to 4. Fig.
6 is a cross-sectional view schematically showing a cross-section of a part of a light-emitting element array according to another embodiment of the present invention.
7 is a plan view schematically illustrating a lighting device including a light emitting device array according to embodiments of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, Is provided to fully inform the user. Also, for convenience of explanation, the components may be exaggerated or reduced in size.

FIG. 1 schematically shows a light emitting device array 100 according to an embodiment of the present invention. According to the present embodiment, the light emitting device array 100 may include a circuit board 10, a first wiring 21, and a first light emitting device 31.

The circuit board 10 may be embodied in various forms and materials as a substrate on which light emitting elements and wiring are disposed. For example, the circuit board 10 may have a rectangular shape as shown in the drawing, but may have various shapes such as a circular shape. The circuit board 10 may be a printed circuit board (PCB) or a metal core printed circuit board (MCPCB). However, the present invention is not limited thereto.

The first wires 21 may be disposed on the circuit board 10 such that one end and the other end of the first wires 21 are adjacent to each other. That is, the first wiring 21 may be arranged on the circuit board 10 so as to have a loop shape.

Here, the first wiring 21 may have a loop shape with one side opened. Here, one end and the other end are both ends of the first wiring 21, but one end of the first wiring 21 may extend to the outside. In the drawing, the end disposed on the lower side of the first wiring 21 is extended to the outside of the second wiring 22. This also applies to the following embodiments and modifications thereof. The first wiring 21 may have a circular shape with one side opened as shown in FIG. Alternatively, as shown in the drawing, the first wiring 21 may have a rectangular shape with one side opened.

For example, the first wiring 21 may be rounded or rounded and the circuit board 10 may be rounded. Here, the first wiring 21 may extend to the edge of the circuit board 10 in order to be electrically connected to the outside, and the first wiring 21 may have a round or rectangular shape with both ends thereof being spaced apart from each other.

The second wirings 22 may surround the first wirings 21 so as not to cross the first wirings 21 and may be disposed on the circuit board 10 such that one end and the other end of the second wirings 22 are adjacent to each other. Here, the second wiring 22 may have a circular shape with one side opened as shown in the drawing. Alternatively, as shown in the drawing, one side of the second wiring 22 may have an open rectangular shape. One end and the other end are both ends of the second wiring 22, but one end of the second wiring 22 may extend outward. In the drawing, the upper end disposed on the upper side of the second wiring 22 extends toward the edge of the circuit board 10.

For example, the second wiring 22 may be rounded or rounded and the circuit board 10 may be rounded. At this time, the second wiring 22 may be spaced apart from the first wiring 21 by a predetermined distance so as not to intersect with the first wiring 21, so that the circuit board 10 may be rounded. The second wiring 22 may extend to the edge of the circuit board 10 in order to be electrically connected to the outside. The second wiring 22 may have a round or rectangular shape with both ends thereof being spaced apart from each other. Here, the directions of the first wiring 21 and the second wiring 22 extending to the edge of the circuit board 10 may be the same. Therefore, the open portions of the first wiring 21 and the second wiring 22 can be adjacent to each other.

On the other hand, the first wiring 21 and the second wiring 22 may have different shapes, as described above. For example, the first wiring 21 may have a circular shape and the second wiring 22 may have a rectangular shape. However, it is preferable that the first wiring 21 and the second wiring 22 are disposed on the circuit board 10 in the same shape as shown. For example, if the first wiring 21 is circular, the second wiring 22 may also be circular. Of course, if the first wiring 21 has a rectangular shape, the second wiring 22 may have a rectangular shape.

Thus, the first wiring 21 and the second wiring 22 are arranged on the circuit board 10 in a simple shape, so that the first light emitting elements 31 can be easily and easily arranged. In particular, the second wiring 22 is formed in a circular or rectangular shape with one side opened, and the first wiring 21 is extended to the outside of the second wiring via the open side of the second wiring 22, It is possible to easily realize a configuration in which an electrical signal is applied to the first wiring 21 while the first wiring 21 and the second wiring 22 have a substantially parallel concentric or concentric shape.

On the other hand, according to the modification shown in Fig. 2, the first wiring 21 may have a closed loop shape in which one side is not opened. The voltage drop (IR drop) between the one end and the other end of the first wiring 21 is effectively prevented, thereby effectively preventing the luminance lowering problem depending on the position of the first light emitting elements 31 described later. At this time, the first wiring 21 may have an extension extending from the first wiring 22 to the outside of the second wiring 22 to form a closed loop.

In the case of the second wiring 22, one end of the second wiring 22 is open as in the modification shown in FIG. 2, and both the one end and the other end extend toward the edge of the printed circuit board 10, The same electrical signal may be applied to the other end. Accordingly, it is possible to effectively prevent a luminance lowering problem depending on the position of the first light emitting devices 31, which will be described later.

The first light emitting devices 31 may be electrically connected to the first wiring 21 and the second wiring 22. Since the first light emitting elements 31 are the same, the configuration of one light emitting element will be described below.

5, which is a cross-sectional view schematically showing a cross section taken along the line VV in FIG. 1 or FIG. 2, the first light emitting device 31 is an element emitting light by receiving an electric signal, Can be used. For example, the first light emitting device 10 may be a diode of a compound semiconductor, and the first light emitting device 10 may be referred to as a light emitting diode (LED). For example, the first light emitting device 10 may include an N-type electrode 31b, an N-type region layer 31a, a P-type electrode 31e, a P-type region layer 31d, and an active layer 31c. Specifically, the first light emitting element 31 is formed by sequentially stacking an N-type region layer 31a, an N-type electrode 31b, an active layer 31c, a P-type region layer 31d and a P- Lt; / RTI >

An appropriate electrical signal is applied to the N-type region layer 31a through the N-type electrode 31b and the P-type region 31b is irradiated with the P- When an appropriate electrical signal is applied to the layer 31d, electrons and holes move to the active layer 31c, and light is emitted from the active layer 31c. In this case, the light emission amount of the first light emitting element 31 can be adjusted according to the electrical signal.

These first light emitting devices 31 may be connected in parallel by the first wiring 21 and the second wiring 22 as shown in FIGS. 1 and / or 2. For example, the first light emitting devices 31 may be arranged parallel to the first and second wirings 21 and 22 at predetermined intervals along the first wirings 21 and the second wirings 22, Lt; / RTI > More specifically, when the first wiring 21 and the second wiring 22 are circular, the first light emitting elements 31 are spaced apart from each other by a predetermined distance, and the first wiring 21 and the second wiring 22, It can be circular because it is connected to the wiring 22 in parallel. The same applies to the case where the first wiring 21 and the second wiring 22 have a rectangular shape.

The first light emitting devices 31 are connected to the first wiring 21 and the second wiring 22. For example, the first light emitting devices 31 are connected to the first wiring 21 and the second wiring 22, And the P-type electrode may be connected to the second wiring 22. [0050] The opposite is also possible. The direction in which the first light emitting elements 31 are connected to the first wiring 21 and the second wiring 22 can be changed according to the direction in which the electrical signal flows. A specific structure in which the first light emitting elements 31 are connected to the first wiring 21 and the second wiring 22 will be described later.

FIG. 3 shows a light emitting device array 100 according to another embodiment of the present invention. The light emitting device array 100 according to the embodiment shown in FIG. 3 includes the third wiring 23, the fourth wiring 24, and the second light emitting device 100 in the light emitting device array 100 of FIG. 1 and / Device 32 is added. Therefore, redundant description is omitted in the embodiments.

3, the third wiring 23 surrounds the second wiring 22 so as not to intersect with the second wiring 22, and is disposed on the circuit board 10 such that one end and the other end of the third wiring 23 are adjacent to each other, . For example, the third wiring 23 may have a circular shape with one side opened as shown in the drawing. The circular third wiring 23 may be disposed on the circuit board 10 so as not to intersect with the first wiring 21 and the second wiring 22. One end and the other end are both ends of the third wiring 23, but one end of the third wiring 23 may extend to the outside. In the drawing, an end disposed on the lower side of the third wiring 23 extends toward the edge of the circuit board 10.

For example, the third wiring 23 can circulate the circuit board 10 in a circle. At this time, the third wiring 23 may be spaced apart from the second wiring 22 by a predetermined distance so as not to intersect with the second wiring 22, so that the circuit board 10 may be rounded. The third wiring 23 may extend to the edge of the circuit board 10 so as to be electrically connected to the outside, and the second wiring 23 may be rounded at both ends thereof. Here, the third wiring 23 may extend in the direction extending to the edge of the second wiring 22 and the circuit board 10. Therefore, the third wiring 23 may be adjacent to the second wiring 22 and the open portion.

The fourth wiring 24 may surround the third wiring 23 so as not to intersect with the third wiring 23 and may be disposed on the circuit board 10 such that one end and the other end of the fourth wiring 24 are adjacent to each other. Here, the fourth wiring 24 may have a circular shape with one side opened as shown in the drawing. One end and the other end are both ends of the fourth wiring 24, but one end of the fourth wiring 24 may extend to the outside. In the drawing, an end disposed on the upper side of the fourth wiring 24 extends toward the edge of the circuit board 10.

For example, the fourth wiring 24 can circulate the circuit board 10 in a circular shape. At this time, the fourth wiring 24 may be spaced apart from the third wiring 23 by a predetermined distance so as not to intersect with the third wiring 23, and the circuit board 10 may be rounded. Further, the fourth wiring 24 may extend to the edge of the circuit board 10 to be electrically connected to the outside, and the both ends of the fourth wiring 24 may be separated from each other to form an open circular shape. Here, the directions of the fourth wiring 24 and the third wiring 23 extending to the edge of the circuit board 10 may be the same. Therefore, the open portions of the fourth wiring 24 and the third wiring 23 can be adjacent to each other.

As such, the third wiring 23 and the fourth wiring 24 are arranged on the circuit board 10 in a simple shape, so that the second light emitting elements 32 can be easily and easily arranged. The third wirings 23 and the fourth wirings 24 are formed to have a circular or rectangular shape with one side opened and the wirings disposed on the inner side are extended to the outside of the second wirings through the open side of the wirings disposed on the outer side It is possible to easily realize an arrangement in which electrical signals are applied to wirings disposed on the inner side while having wirings in a substantially concentric circular or concentric rectangular shape.

Even in the case of the third wiring 23 and the fourth wiring 24, the third wiring 23 and the fourth wiring 24 are formed in such a shape that one side is open, but only one end is the edge of the printed circuit board 10 The third wiring 23 and the fourth wiring 24 have a shape in which one side is opened and both ends of the third wiring 23 and the fourth wiring 24 extend toward the edge of the printed circuit board 10, An electrical signal may be applied. This can effectively prevent the problem of luminance degradation depending on the position of the second light emitting devices 32, which will be described later.

The second light emitting devices 32 may be electrically connected to the fourth wiring 24 and the third wiring 23. The second light emitting device 32 may have the same or similar structure as the first light emitting device 31 described above.

On the other hand, the second light emitting devices 32 may have different color temperatures from the first light emitting devices 31. For example, the second light emitting devices 32 may be formed of an N-type region layer, a P-type region layer, or an active layer different from the first light emitting devices 31. Or the second light emitting element 32 and the first light emitting element 31 are arranged in such a manner that components such as a lens (not shown) on the light emitting path are different in color temperature from each other, .

Or the first light emitting element 31 and the second light emitting element 32 have the same configuration and the phosphor 60 is disposed in the first light emitting element 31 and / or the second light emitting element 32 so that the emitted light finally has a different color temperature. And may be doped on the second light emitting elements 32. [ That is, any one of the group including the first light emitting elements 31 and the second light emitting element 32 emits cool white light and the other group (S) may emit warm white light.

More specifically, the first light emitting element 31 and the second light emitting element 32 are formed on the first light emitting element 31 and the second light emitting element 32, respectively, The kind and / or amount of the phosphor 60 to be dotted may be different. For example, after the light emitted from the first light emitting element 31 passes through the phosphor 60, it is cooled to a cool white light having a color temperature of approximately 6500K, and the light emitted from the second light emitting element 32 is emitted to the phosphor The phosphors 60 doped to the first light emitting element 31 and the phosphors 60 doped to the second light emitting element 32 are mutually bonded to each other to form warm white light having a color temperature of approximately 2700 K Different doses, or even the same phosphor, may be dosed differently.

The second light emitting devices 32 may be connected in parallel by the third wiring 23 and the fourth wiring 24. For example, the second light emitting devices 32 may be arranged parallel to the third wiring 23 and the fourth wiring 24, spaced apart from each other by a predetermined distance along the third wiring 23 and the fourth wiring 24, Lt; / RTI > More specifically, when the third wiring 23 and the fourth wiring 24 are circular, the second light emitting devices 32 are spaced apart from each other by a predetermined distance, and the third wiring 23 and the fourth wiring 24, It can be formed in a circular shape since it is connected to the wiring 24 in parallel.

The second light emitting devices 32 are connected to the third wiring 23 and the fourth wiring 24. The second light emitting devices 32 are arranged such that the respective N-type electrodes 31b are connected to the third And the P-type electrode 31e may be connected to the fourth wiring 24 so as to be the circuit board 10. The opposite is also possible. The direction in which the second light emitting devices 32 are connected to the third wiring 23 and the fourth wiring 24 can be changed according to the direction in which the electrical signal flows. The structure in which the second light emitting elements 32 are connected to the third wiring 23 and the fourth wiring 24 will be described later.

FIG. 4 illustrates a light emitting device array 100 according to another embodiment of the present invention. The light emitting device array 100 according to the embodiment shown in FIG. 4 differs from the light emitting device array 100 of FIG. 3 in the shape of the third wiring 23 and the fourth wiring 24. Therefore, the same and / or similar parts in the embodiments are not described for the sake of convenience.

Referring to FIG. 4, the third wiring 23 may have a quadrangular shape with one side opened. That is, the rectangular third wiring 23 may be disposed on the circuit board 10 so as not to cross the first wiring 21 and the second wiring 22. For example, the third wiring 23 can make one round of the circuit board 10 in a rectangular shape. At this time, the third wiring 23 may be spaced apart from the second wiring 22 by a predetermined distance so as not to intersect with the second wiring 22, so that the circuit board 10 may be rounded.

The third wiring 23 may extend to the edge of the circuit board 10 so as to be electrically connected to the outside. The third wiring 23 may have a rectangular shape with both ends being spaced apart from each other. Here, the third wiring 23 may extend in the direction extending to the edge of the second wiring 22 and the circuit board 10. Therefore, the third wiring 23 may be adjacent to the second wiring 22 and the open portion.

The fourth wiring 24 may surround the third wiring 23 so as not to intersect with the third wiring 23 and may be disposed on the circuit board 10 such that one end and the other end of the fourth wiring 24 are adjacent to each other. Here, the fourth wiring 24 may have a rectangular shape in which one side is opened as shown in the figure.

As such, the third wiring 23 and the fourth wiring 24 are arranged on the circuit board 10 in a simple shape, so that the second light emitting elements 32 can be easily and easily arranged.

For example, the fourth wiring 24 may have a rectangular shape and may make one round of the circuit board 10. At this time, the fourth wiring 24 may be spaced apart from the third wiring 23 by a predetermined distance so as not to intersect with the third wiring 23, and the circuit board 10 may be rounded. In addition, the fourth wiring 24 may extend to the edge of the circuit board 10 to be electrically connected to the outside, and may have a rectangular shape with both ends thereof being spaced apart from each other. Here, the directions of the fourth wiring 24 and the third wiring 23 extending to the edge of the circuit board 10 may be the same. Therefore, the open portions of the fourth wiring 24 and the third wiring 23 can be adjacent to each other.

The first wiring 21, the second wiring 22, the third wiring 23, and the fourth wiring 24 may have different shapes, or at least two wirings may have the same shape. . For example, the first wiring 21 and the second wiring 22 may have a circular shape, and the third wiring 23 and the fourth wiring 24 may have a rectangular shape. However, in order to simplify the working process and reduce the working time, it is preferable that the first wiring 21 to the fourth wiring 24 have the same shape. In this case, the light emitting elements 31 and 32 can be easily and easily electrically connected to the wirings 21, 22, 23 and 24.

Hereinafter, a structure in which the first light emitting device 31 is connected to the first wiring 21 and the second wiring 22 will be described. FIG. 5 is a cross-sectional view schematically showing a cross section taken along the line VV in FIGS. 1 to 4, and FIG. 6 is a cross-sectional view schematically showing a cross section of a part of a light emitting device array according to another embodiment of the present invention .

5, the first light emitting device 31 may be disposed on the circuit board 10 and may be electrically connected to the first wiring 21 and the second wiring 22 by a bonding wire 40, respectively . For example, the P-type electrode 31e of the first light emitting element 31 is electrically connected to the first wiring 21 by the bonding wire 40, and the N-type electrode 31a of the first light emitting element 31 31b may be electrically connected to the second wiring 22 by a bonding wire 40. [

Although not shown, the structure in which the second light emitting device 32 is connected to the third wiring 23 and the fourth wiring 24 may be basically the same as the connection method of the first light emitting device 31 have. For example, the second light emitting device 32 may be disposed on the circuit board 10, and may be electrically connected to the third wiring 23 and the fourth wiring 24 through a bonding wire, respectively. The P-type electrode of the second light emitting element 32 is electrically connected to the third wiring 23 by a bonding wire and the N-type electrode of the second light emitting element 32 is electrically connected to the fourth wiring 24 by a bonding wire As shown in Fig.

This connection method is advantageous in that the first light emitting elements 31 are connected to the first wiring 21 and the second wiring 22 and the second light emitting elements 32 are connected to the third wiring 23 and the fourth wiring 24 relatively Quick and simple electrical connection.

Referring to FIG. 6, the first light emitting device 31 may be electrically connected to the first wiring 21 and the second wiring 22 by an adhesive member. For example, the N-type electrode 31b and the P-type electrode 31e of the first light emitting element 31 are arranged so as to face the first wiring 21 and the second wiring 22, A film 50 (ACF) may be interposed. In this case, the anisotropic conductive film 50 includes the adhesive 51 and the conductive ball 52. The P-type electrode 31e of the first light emitting element 31 is electrically connected to the first wiring 21 through the N- And the second wiring 31b may be electrically connected to the second wiring 22 by the conductive balls 52, respectively.

Although not shown, the structure in which the second light emitting device 32 is connected to the third wiring 23 and the fourth wiring 24 may be basically the same as the connection method of the first light emitting device 31 have. For example, the N-type electrode and the P-type electrode of the second light emitting element 32 are arranged to face the third wiring 23 and the fourth wiring 24, and an anisotropic conductive film 50 (ACF ) Can be interposed. In this case, the P-type electrode of the second light emitting element 32 may be electrically connected to the third wiring 23, and the N-type electrode may be electrically connected to the fourth wiring 24 by an anisotropic conductive film.

The first light emitting devices 31 are connected to the first wiring 21 and the second wiring 22 and the second light emitting devices 32 are connected to the third wiring 23 and the fourth wiring 24, Can be relatively quickly and simply electrically connected.

A manufacturing process in the case shown in FIG. 5 will be schematically described as follows.

First, a circuit board 10 having a plurality of mounting portions on which the first light emitting elements 31 and / or the second light emitting elements 32 are mounted is prepared. Although the mounting portions are shown in a flat shape in the drawing, the mounting portions of the circuit board 10 may have a concave groove shape, for example, and the circuit board 10 having a plurality of grooves may be used as a result. The first wiring layer 21 to the fourth wiring layer 24 may be formed on the circuit board 10 as described above.

The first light emitting elements 31 and / or the second light emitting elements 32 may be seated on the mounting portions of the circuit board. When the mounting portion has a groove, each light emitting element can be seated in each groove. At this time, the first light emitting devices 31 and / or the second light emitting devices 32 may be bonded to the circuit board 10 by an adhesive.

Next, the first light emitting device 31 and / or the second light emitting device 32 are bonded to the first wiring layer 21 through the fourth wiring layer 24 by the bonding wire 40 or the anisotropic conductive film 50, And can be electrically connected.

Thereafter, the phosphor 60 may be doped onto the first light emitting element 31 and / or the second light emitting element 32 as described above. Here, when the first light emitting device 31 and the second light emitting device 32 are disposed at the same time, the first light emitting device 31 and the second light emitting device 32 may emit cool white light, 60 may be dotted or the amount of phosphor 60 doped may be different.

Meanwhile, if necessary, a lens may be further provided on the path of light emitted from the first light emitting device 31 and / or the second light emitting device 32.

FIG. 7 shows a lighting device including the light emitting device array 100 according to the above-described embodiments. Referring to FIG. 7, the illumination device may include a first dimming unit 111, a second dimming unit 112, and a light emitting device array 100 according to the above-described embodiments.

The power supply unit 113 is a device for supplying power to the first dimming unit 111, the second dimming unit 112 and the light emitting device 100, and may include a PFC circuit or an SMPS.

The first dimming unit 111 may be electrically connected to the first light emitting devices 31 through the first and second wirings 21 and 22 to adjust the brightness of the first light emitting devices 31 . The second dimming unit 112 is electrically connected to the second light emitting devices 32 through the third wiring 23 and the fourth wiring 24 to adjust the brightness of the second light emitting devices 32 have. For example, when the first light emitting elements 31 emit cool white light having a color temperature of about 6500K and the second light emitting elements 32 emit warm white light having a color temperature of about 2700K The user may adjust the first dimming unit 111 and the second dimming unit 112 so that the light of the user's desired color temperature is emitted from the illuminating device. That is, the lighting device can provide light in accordance with the needs of the user.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

10: circuit board 21: first wiring
22: second wiring 23: third wiring
23: fourth wiring 31: first light emitting element
32: second light emitting element 40: bonding wire
50: anisotropic conductive film 100: light emitting element array
111: first dimming unit 112: second dimming unit

Claims (10)

A circuit board;
A first wiring having a loop shape disposed on the circuit board;
A second wiring arranged on the circuit board so as to surround the first wiring so as not to intersect with the first wiring and open at one side; And
First light emitting elements electrically connected to the first wiring and the second wiring;
The light emitting device array having a. The method of claim 1,
The first wiring has a closed loop shape, light emitting device array. The method of claim 1,
The first wiring has a loop shape in which one side is open, the light emitting device array. The method of claim 1,
The second wiring has a circular or quadrangular shape with one side open, and the first wiring extends outside the second wiring through an open side of the second wiring. The method of claim 1,
And the first light emitting devices are connected in parallel by the first wiring and the second wiring. The method of claim 1,
A third wiring line surrounding the second wiring line so as not to intersect with the second wiring line and disposed on the circuit board so that one side thereof is opened;
A fourth wiring arranged on the circuit board so as to surround the third wiring so as not to intersect with the third wiring and open at one side; And
Second light emitting devices electrically connected to the third wiring and the fourth wiring and different in color temperature from the first light emitting devices;
Further comprising a light emitting device array. The method according to claim 6,
Wherein each of the third wiring and the fourth wiring is circular or rectangular in shape with one side thereof opened. The method according to claim 6,
And the second light emitting devices are connected in parallel by the third wiring and the fourth wiring. The method according to claim 6,
Wherein at least one of the group including the first light emitting elements and the group including the second light emitting elements emits cool white light and the other group emits warm white light, Device array. The light emitting device array of any one of claims 6 to 9; And
A first dimming unit electrically connected to the light emitting element array and adjusting brightness of the first light emitting elements and a second dimming unit adjusting the brightness of the second light emitting elements;
.
KR1020110129387A 2011-12-06 2011-12-06 Light emitting diode array and Lighting device including the same KR101412011B1 (en)

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
WO2016105146A1 (en) * 2014-12-24 2016-06-30 엘지이노텍(주) Light emitting diode and light emitting diode array comprising same

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KR20070097603A (en) * 2006-03-28 2007-10-05 주식회사 필룩스 Illumination apparatus using led
JP2008124008A (en) * 2006-10-18 2008-05-29 Nobuichi Tsubota Led unit, manufacturing method of led unit, and luminaire for ceiling using led unit
JP2009009926A (en) * 2007-03-23 2009-01-15 Toshiba Lighting & Technology Corp Light emitting diode lighting system
KR101601624B1 (en) * 2010-02-19 2016-03-09 삼성전자주식회사 Semiconductor light emitting device having a multi-cell array, light emitting module and illumination apparatus

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WO2016105146A1 (en) * 2014-12-24 2016-06-30 엘지이노텍(주) Light emitting diode and light emitting diode array comprising same
KR20160077686A (en) * 2014-12-24 2016-07-04 엘지이노텍 주식회사 Light emittng device and light emitting device array including the same
CN107112394A (en) * 2014-12-24 2017-08-29 Lg伊诺特有限公司 Light emitting diode and the light emitting diode matrix including light emitting diode
US10186640B2 (en) 2014-12-24 2019-01-22 Lg Innotek Co., Ltd. Light emitting diode and light emitting diode array comprising same
CN107112394B (en) * 2014-12-24 2020-02-14 Lg伊诺特有限公司 Light emitting diode and light emitting diode array comprising the same

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