KR20120117278A - Apparatus for measuring light output of luminous element - Google Patents

Abstract

PURPOSE: A device for measuring the optical power of a light emitting element is provided to rapidly and accurately measure the optical power of a light emitting element and to prevent damage to the light emitting element in an optical power measuring process. CONSTITUTION: A device(100) for measuring the optical power of a light emitting element comprises a light output analyzing part(10) and a moving pin(30). The light output analyzing part faces a light emitting element assembly(200) including a plurality of light emitting elements(1) which are separated each other. The light output analyzing part can be moved relatively with respect to the light emitting element assembly. The light output analyzing part receives lights emitted from the light emitting elements, thereby analyzing optical power. The moving pin is arranged in a side opposite to the light output analyzing part. The light emitting element assembly is arranged in between the moving pin and light output analyzing part. The moving pin moves some of the light emitting elements included in the light emitting element assembly toward the light output analyzing part.

Description

Apparatus for measuring light output of luminous element

The present invention relates to a light output measuring device for measuring the light output of a light emitting device such as an LED.

In a typical LED manufacturing process, LEDs are manufactured on a wafer basis. That is, LEDs are manufactured in units of wafers containing thousands to hundreds of thousands of LEDs, and the wafers are cut in units of individual LED chips. Then, in the state in which electricity is applied by contacting the probe pin to each cut LED chip, a detector 2 disposed on the top of the LED chip 1 is generated in the LED chip as shown in FIG. 1. It receives the light and measures the light output of the LED chip.

By the way, the LED emits light in all directions, such as the top of the light emitting surface as well as the back, side, etc. of the LED, in particular, the light emitted to the side is hit by the adjacent LED as shown by the arrow in Figure 1 is incident to the detector. At this time, the degree of incident light reflected from the side and incident to the detector is determined by various factors such as the distance between adjacent LEDs, the reflectivity of the side of the LED, roughness, and the light output measurement is inaccurate because these factors are not always constant. You lose. In fact, as shown in FIG. 2, the closer the distance between adjacent LEDs is, the more light is reflected and incident to the detector, so the light output is measured somewhat higher, and when the distance between adjacent LEDs is farther, the reflected and incident light to the detector is greater. The light output is measured low.

In order to solve this problem, as shown in FIG. 3, an apparatus for separating the LED chip 1 and placing it on an independent measuring stage 3 and measuring light output has been developed. However, in this case, a complicated mechanism is used to separate and transport the LED chip, there is a risk that the LED chip may be damaged in the process of separating and transporting the LED chip, and furthermore, excessive time is required to separate and transport the LED chip. There is a problem that the time becomes longer.

The present invention has been made to solve the above problems, an object of the present invention is to improve the structure so that the light output of the light emitting device can be measured quickly and accurately, and the light emitting device is prevented from being damaged in the light output measurement process It is to provide a light output measuring device of the light emitting device.

In order to achieve the above object, the light output measuring apparatus of the light emitting device according to the present invention is disposed so as to be movable relative to the light emitting device assembly facing the light emitting device assembly including a plurality of light emitting devices separated from each other, A light output analyzer configured to receive light output from the device and to analyze the light output, and a light output device disposed on the opposite side of the light output analyzer with the light emitting device assembly interposed therebetween; It characterized in that it comprises a moving pin for moving the light emitting device of the light output side.

According to the present invention, the light emitting device assembly includes an attaching member having elasticity and coated with an adhesive material on one surface, and a plurality of light emitting devices attached to the attaching member to be spaced apart from each other. Preferably, the light emitting device assembly further includes a chuck plate movable relative to the light emitting device assembly.

In addition, according to the present invention, the moving pin is a first position protruding toward the light output analyzer with respect to the upper surface of the chuck plate to move the light emitting element toward the light output analyzer and the light relative to the upper surface of the chuck plate It is preferable to be movable between second positions which do not protrude toward the output analyzer.

In addition, according to the present invention, it is preferable that a vacuum pressure forming passage is formed in the chuck plate to form a vacuum pressure so that the light emitting device assembly is adsorbed on the upper surface of the chuck plate.

According to the present invention of the above configuration, the light output of the light emitting device can be measured quickly and accurately, and the light emitting device is prevented from being damaged in the light output measuring process.

1 is a schematic configuration diagram illustrating a conventional method of measuring optical characteristics of a light emitting device.
2 is a graph showing the relationship between the distance between adjacent light emitting devices and the measured light output.
3 is a schematic diagram illustrating another conventional method of measuring optical characteristics of a light emitting device.
4 is a schematic plan view of the light emitting device assembly.
5 is a schematic configuration diagram of a light output measuring apparatus of a light emitting device according to an embodiment of the present invention.
6 is a schematic diagram of a light output measuring apparatus of a light emitting device according to another embodiment of the present invention.

Hereinafter, a light output measuring apparatus of a light emitting device according to an embodiment of the present invention will be described with reference to the accompanying drawings.

4 is a schematic plan view of a light emitting device assembly, and FIG. 5 is a schematic configuration diagram of an apparatus for measuring light output of a light emitting device according to an embodiment of the present invention.

4 and 5, the light output measuring apparatus 100 of the light emitting device according to the present exemplary embodiment includes a light output analyzer 10, a chuck plate 20, and a moving pin 30.

First, the light emitting device assembly 200 will be described. Light emitting devices such as LEDs are manufactured in units of wafers through a deposition process as mentioned in the related art. Subsequently, an attachment member (hereinafter referred to as 'blue tape') 201 such as blue tape is attached to the lower surface of the wafer. At this time, the blue tape 201 is made of a material having elasticity, and an adhesive material is coated on one surface so that the wafer is attached to the blue tape. Subsequently, after cutting the wafer into a light emitting device unit (Chip unit) through laser processing or the like (ie, forming a groove with a constant depth), the wafer is separated into a plurality of light emitting devices by applying a predetermined impact to the wafer.

At this time, when the blue tape is stretched in all directions, the plurality of light emitting devices 1 are spaced apart from each other at regular intervals. In this state, when the ring holder ring 202 is attached to the blue tape 201, As shown in FIG. 4, the state in which the plurality of light emitting devices are attached to the blue tape is maintained while being spaced apart from each other. The light emitting device assembly 200 in the present application means a blue tape (ie, an attachment member) 201 shown in FIG. 4 and a plurality of light emitting devices 1 attached to the blue tape to be spaced apart from each other. More specifically, the blue tape includes a holder ring 202 coupled thereto.

The light output analyzer 10 receives the light emitted from the light emitting device and analyzes the light output of the light emitting device by analyzing the light. The light output analyzer 10 is a well-known structure, and thus, a detailed description thereof will be omitted. . The light output analyzer is disposed to face the light emitting device assembly 200, and more specifically, to face the light emitting surface (the surface where light is intensively emitted) of the light emitting device. The light output analyzer 10 is arranged to be movable relative to the light emitting device assembly. In the present embodiment, the light emitting device assembly is connected to a driving member (not shown), and is movable in the X and Y axis directions of FIG. 5, whereby the light output analyzer and the light emitting device assembly are relatively moved.

The chuck plate 20 is formed in a flat plate shape, and is disposed on the opposite side of the light output analyzer 10 (that is, the lower side of the light emitting device assembly) with the light emitting device assembly 200 interposed therebetween. It is arranged to be movable. In the present embodiment, as described above, the light emitting device assembly 200 may move in the X-axis and Y-axis directions, thereby allowing relative movement of the chuck plate 20 and the light emitting device assembly 200. Then, the light emitting device assembly 200 is placed on the upper surface of the chuck plate 20. Then, the through hole 12 and the vacuum pressure forming passage 22 are formed in the chuck plate. The through hole 21 is formed through the upper and lower surfaces of the chuck plate. The vacuum forming flow passage 22 is formed through the upper surface (except for the region where the through hole is formed) and the side surface of the chuck plate, and the vacuum forming flow passage is connected to the vacuum pump (not shown). Then, when the vacuum pump is driven (or opens the vacuum valve connected to the vacuum pump), the vacuum pressure is transmitted through the vacuum pressure forming passage so that the light emitting device assembly (specifically, blue tape) is adsorbed on the upper surface of the chuck plate.

The moving pins 30 are used to move some of the light emitting devices, most preferably one of the light emitting devices included in the light emitting device assembly, toward the light output analyzer 10. In the present embodiment, the moving pin 30 is disposed on the lower side of the light emitting device assembly (that is, the opposite side of the light output analyzer based on the light emitting device assembly) and is disposed between the first position and the second position through the through hole 21. It is installed to be elevated. Here, the second position means a position where the moving pin 30 does not protrude toward the light output analyzer (ie, upward direction) with respect to the upper surface of the chuck plate, as shown in FIG. And, as shown in (b) of FIG. 5, the first position is a light emitting element disposed on the through-hole 21 by the moving pin 30 protrudes upward with respect to the upper surface of the chuck plate 20. It means a position to move toward the output analysis unit 10.

Hereinafter, a process of measuring the light output of the light emitting device using the light output measuring device of the light emitting device configured as described above will be described.

First, as shown in FIG. 5A, a light emitting device is disposed on a through hole of a chuck plate. As shown in FIG. 5B, when the moving pin is moved to the first position, one light emitting device is moved toward the optical characteristic analyzer. At this time, when the vacuum pump is operated (or the vacuum valve is opened), the blue tape is adsorbed on the upper surface of the chuck plate by the vacuum pressure, so that only one light emitting element is selectively selected as shown in FIG. The light characteristics of the light emitting device are analyzed.

Thereafter, as shown in (a) of FIG. 5, the moving pin 30 is moved to the second position, and then the light emitting device assembly is moved in the horizontal direction (that is, in the X and Y axis directions) and other light emitting devices (yet, optical A light emitting device having no measured characteristics is disposed above the through hole. In other words, when the light emitting device assembly is moved, the operation of the vacuum pump is stopped (or the vacuum valve is closed) to smoothly move the light emitting device assembly. Then, as shown in (b) of FIG. 5 again, after moving the moving pin to the first position to measure the optical properties of the light emitting device, by repeating this process to measure all the optical properties of the light emitting device included in the light emitting device assembly. .

As described above, according to the present embodiment, one light emitting device (inspection object) of the light emitting devices included in the light emitting device assembly is moved toward the optical characteristic measuring unit than the other light emitting devices (that is, at a position higher than other light emitting devices). In the disposed state) to inspect the optical properties. Therefore, the light emitted from the side of the light emitting device is reflected from the adjacent light emitting device and the light receiving device is not received (or minimized) as in the related art. As a result, the optical properties of the light emitting device can be accurately measured. have.

In the present embodiment, the process of separating the light emitting devices from the blue tape one by one and transferring them to the measurement stage is unnecessary. Therefore, not only can the light output of the light emitting device be measured at a much higher speed than in the related art, but the light emitting device can be prevented from being damaged during the light output measuring process.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of limitation in the embodiment in which said invention is directed. It will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the scope of the appended claims.

For example, in the above-described embodiment, although the vacuum pressure forming passage is formed in the chuck plate, the invention can be configured such that the vacuum pressure forming passage is not provided in the chuck plate 20A as shown in FIG. 6. As shown in FIG. 6, when the vacuum pressure forming passage is not provided in the chuck plate 20A, the blue tape 201 around the through hole may be lifted when the moving pin 30 is moved to the first position. have. However, in reality, the thickness of the light emitting device is very thin, and the interference of the adjacent light emitting devices can be prevented as long as the light emitting device to be inspected is moved to the optical characteristic measuring unit only by the thickness thereof than the adjacent light emitting devices. Therefore, the optical characteristics can be accurately measured without providing a vacuum pressure forming channel as shown in FIG. 6, and in this case, the structure of the device is simpler than in the above-described embodiment.

In addition, in the above embodiment, since the light emitting device assembly is moved in the X-axis and Y-axis directions by the driving member, the invention is configured such that the optical property measuring unit, the chuck plate, and the light emitting device assembly are relatively moved. The invention may be configured such that the chuck plate is moved in the X and Y axis directions.

Optical measuring device of light emitting device 10 Optical measuring device
20 ... chuck plate 21 ... through
22.Vacuum forming flow path 30 ... Moving pin
200 ... Light emitting element assembly 1 ... Light emitting element
201 ... Blue tape (attachment) 202 ... Holding

Claims (5)

An optical output analyzer configured to face the light emitting device assembly including a plurality of light emitting devices separated from each other, and to be relatively movable with respect to the light emitting device assembly, and to receive light output from the light emitting device and analyze light output; And
And a moving pin disposed on an opposite side of the light output analyzer with the light emitting device assembly interposed therebetween and moving some of the light emitting devices of the plurality of light emitting devices included in the light emitting device assembly toward the light output analyzer. An optical output measuring device of a light emitting device characterized in that. The method of claim 1,
The light emitting device assembly includes an attachment member having elasticity and an adhesive material applied to one surface thereof, and a plurality of light emitting devices attached to the attachment member to be spaced apart from each other.
The light emitting device assembly is formed in a flat shape and the light emitting device assembly is placed on the upper surface, relative to the light emitting device assembly; Chuck plate further comprises a light output measuring apparatus of the light emitting device. The method of claim 2,
The moving pin is protruded toward the light output analyzer with respect to the upper surface of the chuck plate to move the light emitting element toward the light output analyzer, and does not protrude toward the light output analyzer with respect to the upper surface of the chuck plate. Light output device of the light emitting element, characterized in that the movable between the second position. The method of claim 3,
The chuck plate is formed with a through hole penetrating the upper and lower surfaces,
And the moving pin is moved between the first position and the second position through the through hole. The method of claim 2,
And a vacuum pressure forming passage is formed in the chuck plate to form a vacuum pressure so that the light emitting device assembly is adsorbed on the upper surface of the chuck plate.

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