KR20120073074A - Display apparatus - Google Patents

Abstract

PURPOSE: A display device is provided to place a heat insulating layer between a driving board and a display panel, thereby suppressing heat of the driving board from being transferred to the display panel. CONSTITUTION: A display device includes a frame(14), a driving board(15), and a heat insulating layer(1000). The frame is arranged on a rear side of a display panel. The driving board is arranged on a rear side of the frame. The heat insulating layer is arranged between the display panel and the driving board. The heat insulating layer suppresses heat of the driving board from being transferred to a backlight unit(12) and/or an optical layer(11).

Description

Display device {Display Apparatus}

The present invention relates to a display device.

As the information society develops, the demand for display devices is increasing in various forms, and in recent years, liquid crystal display devices (LCDs), plasma display panels (PDPs), electro luminescent displays (ELDs), and vacuum fluorescents (VFDs) have been developed. Various display devices such as displays have been researched and used. Among them, the liquid crystal panel of the LCD includes a TFT substrate and a color filter substrate facing each other with the liquid crystal layer and the liquid crystal layer interposed therebetween, and can display an image using light provided from the backlight unit.

SUMMARY OF THE INVENTION An object of the present invention is to provide a display device for suppressing heat generated from a driving board from being transferred toward a display panel.

According to an exemplary embodiment of the present invention, a display apparatus includes a display panel, a frame disposed on a rear surface of the display panel, a driving board disposed on a rear surface of the frame, and a heat insulation layer disposed between the display panel and the driving board. (Heat Insulating Layer) may be included.

In addition, the heat insulation layer may be disposed between the driving board and the frame.

In addition, the heat insulation layer may include a resin layer including a plurality of beads.

In addition, the beads may comprise bubbles.

In addition, a heat spreader may be further disposed between the display panel and the driving board.

In addition, the thermal diffusion layer may be disposed between the driving board and the frame.

In addition, the heat insulation layer may be disposed between the frame and the thermal diffusion layer.

In addition, the thermal diffusion layer may include a metal material.

In addition, the distance between the first area of the frame and the driving board is different from the distance between the driving area and the second area facing the first area, and between the first area and the driving board in the thermal diffusion layer. The width of the first portion positioned may be different from the width of the second portion positioned between the second region and the driving board.

In addition, the distance between the first area of the frame and the drive board is greater than the distance between the drive area and the second area facing the first area, and the width of the first portion in the thermal diffusion layer is the second area. It can be larger than the width of the part.

In addition, a heat sink may be further disposed between the driving board and the heat insulation layer.

In addition, the heat sink may include a first portion including a plurality of protrusions and a second portion not including the protrusions.

In addition, the driving board may be located in the second portion.

In addition, the maximum height of the protrusion may be lower than the maximum height of the drive board.

In addition, the thickness of the second portion may be smaller than the minimum thickness of the first portion.

In addition, the frame may include a heat spreader.

In addition, the frame may include a plurality of protrusions.

In addition, a back cover may be disposed behind the driving board.

In addition, the back cover may be disposed in an area overlapping with the heat insulation layer, and the back cover may be connected to the frame.

In addition, another display apparatus according to the present invention is a display panel, a frame disposed on the rear surface of the display panel, a driving board disposed on the rear surface of the frame, a heat sink disposed behind the driving board. (Heat Sink) and the Peltier device (Peltier Device) disposed between the heat sink and the drive board.

In addition, a heat insulating layer may be further disposed between the display panel and the driving board.

In addition, another display apparatus according to the present invention includes a display panel, a backlight unit disposed on a rear surface of the display panel, an optical layer disposed between the backlight unit and the display panel, It may include a frame disposed on the back of the backlight unit, a driving board disposed on the back of the frame, and a heat insulating layer disposed between the display panel and the drive board.

In addition, a resin layer may be disposed between the optical layer and the backlight unit, and the thickness of the resin layer in a region overlapping the driving board may be thicker than that in other regions.

The display device according to the present invention is to prevent the malfunction or structural deformation caused by the heat generated from the drive board by arranging an insulating layer between the drive board and the display panel to suppress the heat generated from the drive board to the display panel. It works.

1 to 9 are views for schematically explaining a configuration of a display device according to the present invention; And
10 to 36 are views for explaining the display apparatus according to the present invention in more detail.

Hereinafter, a display apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

As the invention allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the written description. It is to be understood that the present invention is not intended to be limited to the specific embodiments but includes all changes, equivalents, and alternatives falling within the spirit and scope of the present invention.

In describing the present invention, terms such as first and second may be used to describe various components, but the components may not be limited by the terms. The terms may be used only for the purpose of distinguishing one component from another component. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

The term and / or may include a combination of a plurality of related items or any item of a plurality of related items.

When an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, but other elements may be present in between Can be understood. On the other hand, when it is mentioned that an element is "directly connected" or "directly connected" to another element, it can be understood that no other element exists in between.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. The singular expressions may include plural expressions unless the context clearly dictates otherwise.

In the present application, the terms "comprises", "having", and the like are used interchangeably to designate one or more of the features, numbers, steps, operations, elements, components, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, parts, or combinations thereof.

Unless otherwise defined, all terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries can be interpreted as having a meaning consistent with the meaning in the context of the relevant art and are, unless expressly defined in the present application, interpreted in an ideal or overly formal sense .

In addition, the following embodiments are provided to explain more fully to the average person skilled in the art. The shapes and sizes of the elements in the drawings and the like can be exaggerated for clarity.

1 to 9 are views for schematically explaining a configuration of a display apparatus according to the present invention.

Referring to FIG. 1, a display device according to the present invention includes a display panel 10, an optical layer 11, a back light unit 12, a frame 14, a driving board 150, and a display panel 10. It may include a back cover (13).

Although not shown, various types of display panels, such as a liquid crystal display panel, a plasma display panel, and an organic light emitting panel (OLED), are applied to the display panel 10 displaying an image in the present invention. It is possible to be.

Hereinafter, it will be assumed that the display panel 10 is a liquid crystal display panel.

The optical layer 11 may be composed of a plurality of sheets. For example, although not shown, the optical layer 11 may include at least one of a prism sheet and a diffusion sheet.

The backlight unit 12 may be disposed behind the optical layer 11. Although not shown, the backlight unit 12 may include at least one light source.

Various types of light sources can be applied to the present invention. For example, the light source may be one of a light emitting diode (LED) chip or a light emitting diode package having at least one light emitting diode chip. In this case, the light source may be a colored LED or a white LED emitting at least one of colors such as red, blue, green, and the like.

The frame 14 may be disposed behind the backlight unit 12. Such a frame 14 may provide a supporting force for supporting the backlight unit 12.

The driving board 15 may be disposed behind the frame 14. The driving board 15 may supply a driving signal to the electrode of the display panel 10. In addition, the driving board 15 may supply a driving signal to the backlight unit 12.

The back cover 13 may be disposed behind the driving board 15.

Here, the optical layer 11 may be in close contact with the display panel 10. Alternatively, the backlight unit 12 may be in close contact with the optical layer 11. In this case, the thickness of the display device according to the present invention can be reduced.

Although only a case of a direct type backlight unit is illustrated in FIG. 1, in the present invention, an edge type backlight unit as shown in FIG. 2 may also be applied.

In detail, the display device according to the present invention may include the light guide plate 20 disposed between the optical layer 11 and the frame 14 as in the case of FIG. 2. In addition, an edge type backlight unit 12 may be disposed on a side surface of the light guide plate 20.

In this case, the edge type backlight unit 12 may emit light toward the side of the light guide plate 20, and the light guide plate 20 may reflect / scatter light incident on the side to emit light to the front. To this end, the light guide plate 20 may include a plurality of scattering particles (not shown).

Referring to FIG. 3, the display panel 10 may include a color filter substrate 110 and a thin film transistor (TFT) substrate 120 bonded together to maintain a uniform cell gap facing each other. In addition, a liquid crystal layer (not shown) may be disposed between the color filter substrate 110 and the TFT substrate 120.

The color filter substrate 110 includes a plurality of pixels including red (R), green (G), and blue (B) sub-pixels, and generates an image corresponding to the color of red, green, or blue when light is applied. You can.

The pixels may be composed of red, green, and blue subpixels, but the red, green, blue, and white (W) subpixels constitute one pixel, and the present invention is not limited thereto.

The TFT substrate 120 may switch a pixel electrode (not shown) as a switching element.

The liquid crystal layer may include a plurality of liquid crystal molecules, and the liquid crystal molecules may change an arrangement corresponding to a voltage difference generated between the pixel electrode and the common electrode, which are not shown. Light may be incident on the color filter substrate 110 in response to a change in the molecular arrangement of the liquid crystal layer.

An upper polarizer 130 and a lower polarizer 140 may be disposed on upper and lower sides of the display panel 10, and more specifically, an upper polarizer 130 is formed on an upper surface of the color filter substrate 110. The lower flat plate 140 may be formed on the lower surface of the TFT substrate 120.

The side of the display panel 10 may be provided with a gate and a data driver (not shown) for generating a driving signal for driving the panel 10.

The structure and configuration of the display panel 10 as described above is just an example, and the embodiments may be changed, added, or deleted within the scope of the spirit of the present invention.

The backlight unit 12 may be disposed behind the display panel 10, and the optical layer 11 may be disposed between the backlight unit 12 and the display panel 10.

The optical layer 11 may include a prism sheet 251 and a diffusion sheet 252. The plurality of sheets included in the optical layer 11 may be provided in a state of being bonded or adhered to each other without being spaced apart from each other, so that the thickness of the optical layer 11 may be reduced.

The diffusion sheet 252 diffuses the incident light to prevent the light emitted from the backlight unit 12 from being partially concentrated, thereby making the luminance of the light uniform. In addition, the prism sheet 251 may collect light from the diffusion sheet 252 to allow light to enter the display panel 10 vertically.

In the present invention, at least one of the prism sheet 251 and the diffusion sheet 252 may be removed from the optical layer 11, or the optical layer 11 may have various functions in addition to the prism sheet 251 and the diffusion sheet 252. It may also be possible to include further layers.

As shown in FIG. 3, the display device according to the present invention may be configured by closely placing the optical layer 11 and the backlight unit 12 on the display panel 10. For example, the backlight unit 12 may be attached to the lower portion of the optical layer 11, and the optical layer 11 may be attached to the lower side of the display panel 10, more specifically, the lower polarizer 140. Can be fixed. To this end, an adhesive layer (not shown) may be formed between the lower polarizer 140 and the backlight unit 12.

By forming the backlight unit 12 in close contact with the optical layer 11 as described above, the overall thickness of the display device may be reduced to improve appearance, and the display device may be removed by removing the structure for fixing the backlight unit 12. Can simplify the structure and manufacturing process. In addition, by reducing the space between the backlight unit 12 and the optical layer 11, it is possible to prevent the malfunction of the display device due to the insertion of foreign matters into the space or the degradation of the image quality of the display image.

According to the exemplary embodiment of the present invention, the display panel 10 may be divided into a plurality of regions, and the display panel 10 may be divided from regions of the backlight unit 12 corresponding to gray peak values or color coordinate signals of each of the divided regions. The brightness of the emitted light, that is, the brightness of the corresponding light source may be adjusted to adjust the brightness of the display panel 10.

To this end, the backlight unit 12 may be operated by being divided into a plurality of divided driving regions corresponding to each of the divided regions of the display panel 10.

Referring to FIG. 4, the backlight unit 12 may include a substrate 210, a light source 220, a resin layer 230, and a reflective layer 240.

The plurality of light sources 220 may be formed on the substrate 210, and the resin layer 230 may be formed on the substrate 210 to surround the plurality of light sources 220.

Although not illustrated, an electrode pattern (not shown) for connecting the connector (not shown) and the light source 220 may be formed on the substrate 210. For example, a carbon nanotube electrode pattern (not shown) may be formed on the upper surface of the substrate 210 to connect the light source 220 and the connector. The connector may be electrically connected to a power supply unit (not shown) that supplies power to the light source 220.

The substrate 210 may be a printed circuit board (PCB) including materials such as polyethylene terephthalate, glass, polycarbonate and silicon. In addition, the substrate 210 may be a film substrate.

The light source 220 may be one of a light emitting diode (LED) chip or a light emitting diode package having at least one light emitting diode chip. In this embodiment, a light emitting diode package is provided as the light source 220.

The light source 220 may be a colored LED or a white LED emitting at least one of colors such as red, blue, and green. In addition, the colored LED may include at least one of a red LED, a blue LED, and a green LED, and the arrangement and emission light of the light emitting diode may be changed within the technical scope of the embodiment.

On the other hand, the resin layer 230 disposed on the upper side of the substrate 210 transmits and diffuses the light emitted from the light source 220, and the light emitted from the light source 220 is uniformly distributed to the display panel 10. Can be provided.

A reflective layer 240 reflecting light emitted from the light source 220 may be formed between the substrate 210 and the resin layer 230, more specifically, on the upper surface of the substrate 210.

The reflective layer 240 may reflect the light totally reflected from the boundary of the resin layer 230 so that the light emitted from the light source 220 may be diffused more widely.

The reflective layer 240 may include a white pigment such as titanium oxide dispersed in a sheet of synthetic resin, a metal deposition film laminated on the surface, or a bubble dispersed to scatter light in a synthetic resin sheet. In order to increase the reflectance, silver (Ag) may be coated on the surface. Alternatively, the reflective layer 240 may be formed by coating the upper surface of the substrate 210.

The resin layer 230 may be made of various resins having light transmittance. For example, the resin layer 230 may include any one material or at least two materials selected from the group consisting of polyethylene terephthalate, polycarbonate, polypropylene, polyethylene, polystyrene, polyepoxy, silicone, acrylic, and the like. Do.

In addition, in order for the light emitted from the light source 220 to be diffused so that the backlight unit 12 has uniform brightness, the refractive index of the resin layer 230 may be about 1.4 to 1.6.

The resin layer 230 may include a polymer resin having adhesiveness so as to be in close contact with the light source 220 and the reflective layer 240. For example, the resin layer 230 is unsaturated polyester, methyl methacrylate, ethyl methacrylate, isobutyl methacrylate, normal butyl methacrylate, normal butyl methyl methacrylate, acrylic acid, methacrylic acid, hydride Hydroxy ethyl methacrylate, hydroxy propyl methacrylate, hydroxy ethyl acrylate, acrylamide, metyrol acrylamide, glycidyl methacrylate, ethyl acrylate, isobutyl acrylate, normal butyl acrylate, 2- It may comprise an acrylic, urethane, epoxy, melamine, such as ethyl hexyl acrylate polymer or copolymer or terpolymer.

The resin layer 230 may be formed by applying a resin on a liquid or gel to the upper surface of the substrate 210 on which the plurality of light sources 220 and the reflective layer 240 are formed, and then curing the resin. It is also possible to be formed separately and bonded to the upper surface of the substrate 210.

As the thickness T of the resin layer 230 increases, light emitted from the light source 200 may be spread more widely, and light of uniform brightness may be provided from the backlight unit 12 to the display panel 10. On the other hand, as the thickness T of the resin layer 230 increases, the amount of light absorbed by the resin layer 230 may increase, and thus the brightness of light provided from the backlight unit 12 to the display panel 10. May decrease overall.

Therefore, the thickness T of the resin layer 230 is 0.1 to 4.5 mm in order to provide light of uniform brightness without greatly reducing the brightness of the light provided from the backlight unit 12 to the display panel 10. desirable.

Referring to FIG. 5, a plurality of light sources 220 may be mounted on the substrate 210 in the backlight unit 12, and a resin layer 230 may be disposed on the substrate 210. Meanwhile, a reflective layer 240 may be formed between the substrate 210 and the resin layer 230.

In addition, the resin layer 230 may include a plurality of scattering particles 231, and the scattering particles 231 scatter or refract incident light so that light emitted from the light source 220 may be diffused more widely. can do.

The scattering particles 231 may be formed of a material having a refractive index different from that of the material of the resin layer 230, and more particularly of the silicon of the resin layer 230 in order to scatter or refract light emitted from the light source 220. Or it may be made of a material having a higher refractive index than the acrylic resin.

For example, the scattering particles 231 may be polymethyl methacrylate / styrene copolymer (MS), polymethyl methacrylate (PMMA), polystyrene (PS), silicon, titanium dioxide (TiO2), silicon dioxide (SiO2). ), Or a combination of the above materials.

On the other hand, the scattering particles 231 may be made of a material having a lower refractive index than the material constituting the resin layer 230, for example, may be formed by forming a bubble in the resin layer (230). .

In addition, the material constituting the scattering particles 231 is not limited to the above materials, and may be formed using various polymer materials or inorganic particles.

According to the exemplary embodiment of the present invention, the resin layer 230 is a substrate 210 in which a plurality of light sources 220 and a reflective layer 240 are formed after mixing the scattering particles 231 in a liquid or gel resin. It may be formed by applying to the upper surface of the) and then curing.

Referring to FIG. 6, the LED package constituting the light source 220 in the direct type backlight unit 12 may be divided into a top view method and a side view method according to a direction in which the light emitting surface is directed. This is described below. 6 to 8 disclose the case of the direct type.

6 illustrates a top view type of the direct type.

Referring to FIG. 6, the light emitting surfaces of the plurality of light sources 220 included in the backlight unit 12 are disposed on an upper surface thereof, respectively, in a direction perpendicular to the upper direction, for example, the substrate 210 or the reflective layer 240. It can emit light.

7 illustrates a side view method of the direct method.

Referring to FIG. 7, each of the light sources 220 provided in the backlight unit 12 has a light emitting surface disposed on a side thereof, and emits light in a lateral direction, that is, in a direction parallel to the substrate 210 or the reflective layer 240. can do. For example, the plurality of light sources 220 may be configured using a side view LED package, thereby reducing the problem that the light source 220 is observed as a hot spot on the screen. In addition, the thickness T of the resin layer 230 may be reduced to reduce the thickness of the backlight unit 12 and further, the display device.

Referring to FIG. 8, the backlight unit 12 may include a plurality of resin layers 230 and 235.

Light emitted from the light source 220 to the side may pass through the first resin layer 230 and may proceed to an area where the adjacent light source 225 is disposed.

Some of the light that passes through the first resin layer 230 may be emitted to an upper side of the display panel 10. To this end, the first resin layer 230 may include a plurality of scattering particles 231 as described with reference to FIG. 5 to scatter or refract the advancing light in an upward direction.

In addition, some of the light emitted from the light source 220 may be incident on the reflective layer 240, and the light incident on the reflective layer 240 may be reflected and diffused upward.

On the other hand, a large amount of light may be emitted in an area adjacent to the light source 220 due to a strong scattering phenomenon near the light source 220 or light emitted from the light source 220 in a direction closer to the upper side, and the like. Light of brightness can be observed. In order to prevent this, as shown in FIG. 8, the first light blocking pattern 260 may be formed on the first resin layer 230 to reduce the luminance of light emitted from the region adjacent to the light source 220. Accordingly, light of uniform brightness may be emitted from the backlight unit 12. For example, the first light blocking pattern 260 may be formed on the first resin layer 230 to correspond to a position where the plurality of light sources 220 are disposed, and a part of the light incident from the light source 220 may be It can block and transmit the remaining part to reduce the brightness of the light emitted upwards.

The first light blocking pattern 260 may be formed of titanium dioxide (TiO ₂ ). In this case, a part of the light incident from the light source 220 may be reflected downward and transmit the remaining part.

According to an embodiment of the present invention, the second resin layer 235 may be disposed above the first resin layer 230. The second resin layer 235 may be made of the same or different material as that of the first resin layer 230, and diffuses light emitted from the first resin layer 230 in the upward direction of the backlight unit 12. The uniformity of optical brightness can be improved.

The second resin layer 235 may be made of a material having the same refractive index as the material constituting the first resin layer 230, or may be made of a material having a refractive index different from that.

For example, when the second resin layer 235 is made of a material having a refractive index higher than that of the first resin layer 230, light emitted from the first resin layer 230 may be diffused more widely.

On the contrary, when the second resin layer 235 is made of a material having a refractive index lower than that of the first resin layer 230, the light emitted from the first resin layer 230 is reflected on the bottom surface of the second resin layer 235. The reflectance may be improved, and thus, light emitted from the light source 220 may be made to travel along the first resin layer 230 more easily.

Meanwhile, the first resin layer 230 and the second resin layer 235 may each include a plurality of scattering particles. In this case, the density of the scattering particles included in the second resin layer 235 may be the first resin layer. It may be higher than the density of the scattering particles included in (230). As such, when the scattering particles are included in the second resin layer 235 at a higher density, the light emitted upward from the first resin layer 230 may be diffused more widely, and accordingly, the backlight unit 12 The luminance of the light emitted from the screen can be made more uniform.

As illustrated in FIG. 8, the second light blocking pattern 265 is formed on the second resin layer 235 to make the luminance of the light emitted from the second resin layer 235 uniform. For example, when light emitted upward from the second resin layer 235 is concentrated at a specific portion and observed with high luminance on the screen, an area corresponding to the specific portion of the upper surface of the second resin layer 235 is observed. The second light blocking pattern 265 may be formed in the second light shielding pattern 265, thereby reducing the brightness of the light in the specific portion, thereby making the brightness of the light emitted from the backlight unit 12 uniform.

The second light blocking pattern 265 may be formed of titanium dioxide (TiO ₂ ), and in this case, a part of the light emitted from the second resin layer 235 is reflected downward in the second light blocking pattern 265 and the remaining part of the second light blocking pattern 265 is formed of titanium dioxide (TiO ₂ ). Can be transmitted.

Referring to FIG. 9, a pattern may be formed in the reflective layer 240 to facilitate the progress of light emitted from the light source 220 to the adjacent light source 225.

The pattern formed on the upper surface of the reflective layer 240 may include a plurality of protrusions 241, and the light incident on the plurality of protrusions 241 after being emitted from the light source 220 is scattered in the advancing direction. Can be refracted.

Meanwhile, as shown in FIG. 9, the densities of the protrusions 241 formed in the reflective layer 240 may increase as they are spaced apart from the light source 220. Accordingly, it is possible to prevent the luminance of light emitted upward from the region close to the region far from the light source 220 to be reduced, thereby maintaining the luminance of the light provided from the backlight unit 12 uniformly.

In addition, the protrusions 241 may be formed of the same material as the reflective layer 240, and in this case, the protrusions 241 may be formed by processing an upper surface of the reflective layer 240.

Alternatively, the protrusions 241 may be formed of a material different from that of the reflective layer 240, and may be formed by printing a pattern as shown in FIG. 9 on the upper surface of the reflective layer 240.

The shape of the protrusions 241 is not limited to that shown in FIG. 9, and various shapes such as a prism may be possible.

10 to 36 are views for explaining the display device according to the present invention in more detail. Hereinafter, the description of the parts described in detail above will be omitted. For example, in the display device according to the present invention, a direct type backlight unit may be applied, and an edge type backlight unit may be applied. In addition, the light source in the backlight unit may be a top-view method or a side-view method. In addition, in the display device according to the present invention, various types of display panels, such as a plasma display panel, may be applied in addition to the liquid crystal display panel.

Referring to FIG. 10, a frame 14 may be disposed behind the optical layer 11. Preferably, the backlight unit 12 is disposed behind the optical layer 11, and the frame 14 may be disposed behind the backlight unit 12.

In addition, the driving board 15 may be disposed behind the frame 14, and a heat insulating layer 1000 may be disposed between the driving board 15 and the frame 14. Although only the case where the heat insulation layer 1000 is arrange | positioned between the drive board 15 and the frame 14 is shown here, the frame 14 is not shown in the predetermined part between the display panel and the drive board 15 which are not shown in figure. It is possible to be deployed. Preferably, the heat insulation layer 1000 may be disposed between the driving board 15 and the optical layer 11.

The driving board 15 may include circuit elements such as a plurality of switching elements to supply driving signals to the display panel and / or the backlight unit 12. Due to the driving of these circuit elements, heat may be generated in the driving board 15.

The heat insulation layer 1000 may suppress the heat generated from the driving board 15 from being transferred to the backlight unit 12 and / or the optical layer 11.

In addition, the size of the heat insulating layer 1000 may be substantially the same as the size of the drive board (15). In this case, after attaching the insulation layer 1000 cut in advance to the lower portion of the driving board 15, it is possible to attach the driving board 15 with the insulation layer 1000 to the frame 14.

In addition, the heat insulation layer 1000 may include an adhesive material. In this case, since the heat insulation layer 1000 can attach the driving board 15 to the frame 14, it is not necessary to use another adhesive layer.

The heat insulation layer 1000 may include a plurality of beads 1020, as in the case of FIG. 11, to block heat.

In detail, the heat insulation layer 1000 may include a base layer 1010 and a plurality of beads 1020 formed in the base layer 1010. Here, the base layer 1010 may include a resin material. Alternatively, the base layer 1010 may include an adhesive material. In addition, the beads 1020 may include bubbles filled with air.

In this case, the heat shielding efficiency may be improved by the beads 1020.

Unlike the present invention, a case in which the heat insulation layer 1000 is not used will be described with reference to FIG. 12.

When the heat insulation layer 1000 is not used, heat generated from the driving board 15 may be transferred to the backlight unit 12 without being blocked.

In this case, as in the case of FIG. 12A, the light sources 220 positioned in the region 1200 overlapping the driving board 15 may cause a malfunction by heat transmitted from the driving board 15. Can be. For example, the luminance of light generated by the light sources 220 positioned in an area overlapping the driving board 15 may be reduced. In this case, the image quality of the image displayed on the display panel may deteriorate.

Alternatively, when the heat insulation layer 1000 is not used, heat generated from the driving board 15 may be transmitted to the optical layer 11 without being blocked.

In this case, as in the case of FIG. 12B, the optical layer 11 may cause deformation in the region 1210 overlapping the driving board 15. In this case, the image quality of the image displayed on the display panel may deteriorate.

On the other hand, when the heat insulating layer 1000 is provided as in the present invention, the heat generated from the driving board 15 is suppressed from being transmitted to the backlight unit 12 and / or the optical layer 11, thereby driving the driving board ( It is possible to prevent the malfunction of the light source 220 and the structural deformation of the optical layer 11 due to the heat generated in 15).

Referring to FIG. 13, the width W2 of the heat insulation layer 1000 may be larger than the width W1 of the driving board 15.

In this case, after the heat insulation layer 1000 is formed in the frame 14 in advance, it is possible to attach the drive board 15 to the heat insulation layer 1000.

Alternatively, as in the case of FIG. 14, the width W3 of the heat insulating layer 1000 may be smaller than the width W1 of the driving board 15. In this case, an edge of the driving board 15 may be spaced apart from the frame 14 by a predetermined distance D1.

For example, the width W3 of the heat insulation layer 1000 is smaller than the width W1 of the drive board 15, so that the heat insulation layer 1000 may not be located at both end portions 1400 of the drive board 15. . In this case, both end portions 1400 of the driving board 15 may be spaced apart from the frame 14 by a predetermined distance D1. In this structure, since the driving board 15 may not directly contact the frame 14, heat generated from the driving board 15 is transferred to the backlight unit 12 and / or the optical layer 11. Can be suppressed.

Alternatively, as in the case of FIG. 15, the heat insulation layer 1000 may be formed on the rear surface of the frame 14 as a whole. In this case, the size of the thermal insulation layer 1000 may be approximately equal to the size of the frame 14.

Alternatively, as in the case of FIG. 16, the heat insulation layer 1000 may be located between the frame 14 and the backlight unit 12. In this case, the size of the heat insulating layer 1000 may be approximately the same as the size of the frame 14. Even in such a structure, it is possible to suppress heat generated in the driving board 15 from being transferred to the backlight unit 12 and / or the optical layer 11.

Referring to FIG. 17, it is possible to further include a heat spreader 1700 disposed between the display panel and the driving board 15. Preferably, the thermal diffusion layer 1700 may be disposed between the driving board 15 and the optical layer 11. For example, the thermal diffusion layer 1700 may be disposed between the driving board 15 and the frame 14.

The thermal diffusion layer 1700 may include a metal material in order to diffuse heat generated from the driving board 15 to a wide area.

The thermal diffusion layer 1700 may be disposed between the driving board 15 and the heat insulation layer 1000. In this case, heat generated in the driving board 15 may be diffused by the thermal diffusion layer 1700, and then blocked by the heat insulation layer 1000. In such a structure, since heat generated from the driving board 15 is diffused by the thermal diffusion layer 1700, heat concentration may be suppressed by the heat insulation layer 1000, because heat may be suppressed from being concentrated in a specific portion.

Since the thermal diffusion layer 1700 is used to diffuse heat generated from the driving board 15, the thickness T11 may be relatively thin. On the other hand, since the heat insulation layer 1000 includes a plurality of beads 1020 to block heat generated from the driving board 15, the thickness T10 may be relatively thick. That is, the thickness T10 of the heat insulation layer 1000 may be greater than the thickness T11 of the thermal diffusion layer 1700.

In order to increase the thermal barrier effect, the width of the thermal diffusion layer 1700 and the width of the thermal insulation layer 1000 may be substantially the same, or the width of the thermal insulation layer 1000 may be larger than the width of the thermal diffusion layer 1700.

On the other hand, the drive board 15 may be disposed in a specific area in the frame (14). For example, as in the case of FIG. 18, the frame 14 may have a substantially quadrangular plate shape, and the driving board 15 may be disposed in the second long side (LS2) region of the frame 14. Can be deployed.

Here, the second long side LS2 faces the first long side LS1, and the second long side LS2 has a first short side SS1 and a second short side SS1. May be disposed adjacent to SS2). Here, the first long side LS1 of the frame 14 may be referred to as a first region, and the second long side LS2 may be referred to as a second region.

In this case, referring to FIGS. 18 and 19, the distance L1 between the first area LS1 of the frame 14 and the driving board 15 is the second area L2 facing the first area LS1. ) And greater than the distance L2 between the driving board 15.

In addition, a portion positioned between the first region LS1 and the driving board 15 in the thermal diffusion layer 1700 is called a first portion, and a portion positioned between the second region LS2 and the driving board 15 is referred to as a first portion. When referred to as the second portion, the width of the first portion in the thermal diffusion layer 1700 may be larger than the width of the second portion. In other words, the width L10 of the thermal diffusion layer 1700 in the first portion may be larger than the width L11 of the thermal diffusion layer 1700 in the second portion.

In this case, it is possible to diffuse the heat generated from the drive board 15 to the first portion having a relatively large area, thereby improving the thermal diffusion efficiency.

As such, the distance L1 between the first area LS1 of the frame 14 and the driving board 15 is between the second area LS2 and the driving board 15 facing the first area LS1. If different from (L2), the width of the first portion located between the first area LS1 and the driving board 15 in the thermal diffusion layer 1700 is located between the second area LS2 and the driving board 15. It may be different from the width of the second part.

Alternatively, as in the case of FIG. 20, the width L10 of the thermal diffusion layer 1700 in the first portion may be substantially the same as the width L11 of the thermal diffusion layer 1700 in the second portion.

Alternatively, as in the case of FIG. 21, the thermal diffusion layer 1700 may be disposed between the heat insulation layer 1000 and the optical layer 11. For example, the thermal diffusion layer 1700 may be disposed between the heat insulation layer 1000 and the frame 14.

In this case, the heat generated from the driving board 15 may be diffused by the thermal diffusion layer 1700 after being primarily blocked by the heat insulation layer 1000.

In this structure, even when the heat generated from the driving board 15 is not sufficiently blocked by the heat insulating layer 1000 and passes through the heat insulating layer 1000, the heat diffusion layer 1700 may diffuse the heat passing through the heat insulating layer 1000 widely. have.

Alternatively, as in the case of FIG. 22, the thermal diffusion layer 1700 may be disposed between the frame 14 and the backlight unit 12.

Referring to FIG. 23, a heat sink 2300 may be disposed between the driving board 15 and the heat insulation layer 1000. The heat sink 2300 may include a plurality of protrusions 2301. Here, the protrusion 2301 formed on the heat sink 2300 may protrude in a direction toward the rear of the frame 14.

As such, when the heat sink 2300 is disposed at the rear of the frame 14 and the driving board 15 is disposed on the heat sink 2300, heat generated from the driving board 15 is transferred to the outside through the heat sink 2300. Can be released. Accordingly, it is possible to prevent the optical layer 11 from being deformed or the light source 220 malfunctioning due to heat generated from the driving board 15.

As in the case of FIG. 24, the heat sink 2300 may include a first portion A1 including the protrusion 2301 and a second portion A2 not including the protrusion 2301. have.

Here, the driving board 15 may be disposed in the second portion A2 not including the protrusion 2301. In this case, the contact area between the driving board 15 and the heat sink 2300 may be increased, so that heat generated from the driving board 15 may be more effectively discharged.

In addition, it may be preferable that the maximum height of the protrusion 2301 is lower by the predetermined height T30 than the maximum height of the driving board 15 while the driving board 15 is located in the second portion A2 of the heat sink 2300. Can be.

In this case, even if the heat sink 2300 is applied, the total thickness of the display device may be prevented from being excessively thick.

In addition, as in the case of FIG. 25, the thickness T20 of the second portion A2 of the heat sink 2300 may be smaller than the minimum thickness T21 of the first portion A1. That is, it may be lower than other portions of the heat sink 2300 of the second portion A2. In other words, the second portion A2 may be formed by recessing a portion of the heat sink 2300 by a predetermined depth T22. In this case, the total thickness of the display device may be further reduced while effectively dissipating heat generated from the driving board 15.

In addition, referring to FIG. 26, a portion positioned between the first region LS1 and the driving board 15 of the frame 14 is called a first portion, and is disposed between the second region LS2 and the driving board 15. When the part to be located is called a second part, the width L20 of the heat sink 2300 in the first part may be larger than the width L21 of the heat sink 2300 in the second part.

Here, the first, second, third, and fourth regions LS1, LS2, LS3, and LS4, the first portion, and the second portion have been described in detail with reference to FIGS. 18 and 19.

Alternatively, as shown in FIG. 27, although the protrusion 2301 of the heat sink 2300 is positioned at the first portion of the frame 14 between the first region LS1 and the driving board 15. It is possible that the protrusion 2301 is not positioned at the second portion of the frame 14 between the second region LS2 and the driving board 15.

Referring to FIG. 28A, a frame 2800 including a thermal diffusion layer may be disposed between the driving board 15 and the optical layer 11. For example, in FIG. 21, the thermal diffusion layer 1700 and the frame 14 may be merged into one. To this end, the frame 2800 including the thermal diffusion layer may include a material having high thermal conductivity.

Alternatively, the frame 2800 including the thermal diffusion layer may include a base frame 2810 and a thermal conductive layer 2820 formed on the surface of the base frame 2810 as shown in FIG. 28B. The thermal conductive layer 2820 may be formed by applying a paint containing a thermally conductive material to the surface of the base frame 2810.

Alternatively, as in the case of FIG. 29, a frame 2900 including the protrusion 2901 may be disposed between the driving board 15 and the heat insulation layer 1000. For example, in FIG. 23, the heat sink 2300 and the frame 14 may be merged into one.

The frame 2900 including the protrusion 2901 may be a case in which a heat sink is used as a frame for supporting the driving board 15 and the backlight unit 12. In this case, the thickness of the display device can be further reduced.

Referring to FIG. 30, the back cover 13 may be disposed behind the driving board 15.

In addition, the back cover 13 may cover only a part of the frame 14 without covering the entire area of the frame 14.

For example, as in the case of FIGS. 30 and 31, the driving board 15 disposed at the rear of the frame 14 is close to the second long side LS2 of the frame 14. 13 may also be disposed to be biased toward the second long side LS2 of the frame 14.

As shown in FIG. 32, the back cover 13 may be disposed in an area overlapping the heat insulating layer 1000, and the back cover 13 may be connected to the frame 14.

For example, when the region overlapping the back cover 13 in the frame 14 is called the tenth region A10, the heat insulation layer 1000 may be located in the tenth region A10.

In addition, as in the case of FIG. 33, even when the heat sink 2300 is disposed between the driving board 15 and the heat insulation layer 1000, the heat sink 2300 and the heat insulation layer 1000 are in the tenth region A10. It can be located within.

Meanwhile, referring to FIG. 34, the resin layer 3400 may be disposed between the optical layer 11 and the backlight unit 12. The resin layer 3400 may be formed of a substantially transparent material to transmit light generated by the backlight unit 12.

In addition, the thickness H1 of the resin layer 3400 in a region overlapping the driving board 15 may be thicker than the thickness H2 of the resin layer 3400 in another region. In this case, it is possible to suppress deformation of the optical layer 11 due to heat by suppressing transfer of heat generated in the drive board 15 to the optical layer 11.

Alternatively, as in FIG. 35, the thickness of the resin layer 230 included in the backlight unit 12 may vary depending on the position of the driving board 15. For example, the thickness H10 of the resin layer 230 in the region overlapping the driving board 15 may be thicker than the thickness H11 of the resin layer 230 in the other region.

Even in this case, it is possible to suppress deformation of the optical layer 11 due to heat by suppressing transfer of heat generated in the driving board 15 to the optical layer 11.

34 to 35, at least one of the heat insulating layer 1000, the thermal diffusion layer 1700, and the heat sink 2300 may be applied.

Alternatively, as in the case of FIG. 36, a heat sink 3610 including protrusions is disposed behind the driving board 15, and a Peltier device (Peltier Device,) is disposed between the heat sink 3610 and the driving board 15. It is possible that 3600 is arranged. Here, the heat insulation layer 1000 may be disposed between the display panel and the driving board 15, for example, between the frame 14 and the driving board 15.

The Peltier device 3600 is a device that cools and heats by using applied electric power. The Peltier device 3600 cools the driving board 15 when electric power is applied, while the heat sink 3610 heats the driving board 15 to reduce heat generated in the driving board 15.

As described above, it is to be understood that the technical structure of the present invention can be embodied in other specific forms without departing from the spirit and essential characteristics of the present invention.

Therefore, the exemplary embodiments described above are to be understood as illustrative and not restrictive in all respects, and the scope of the present invention is indicated by the appended claims rather than the foregoing detailed description, and the meaning and scope of the claims are as follows. And all changes or modifications derived from the equivalent concept should be interpreted as being included in the scope of the present invention.

Claims (23)

Display panel;
A frame disposed on a rear surface of the display panel;
A driving board disposed on a rear surface of the frame; And
A heat insulating layer disposed between the display panel and the driving board;
. The method of claim 1,
The insulation layer is disposed between the drive board and the frame. The method of claim 1,
The heat insulation layer includes a resin layer including a plurality of beads (Bead). The method of claim 3, wherein
And the bead comprises bubbles. The method of claim 1,
And a heat spreader further disposed between the display panel and the driving board. The method of claim 5, wherein
The thermal diffusion layer is disposed between the drive board and the frame. The method according to claim 6,
And the heat insulation layer is disposed between the frame and the thermal diffusion layer. The method of claim 5, wherein
The thermal diffusion layer includes a metal material. The method of claim 5, wherein
The distance between the first area of the frame and the drive board is different from the distance between the drive area and the second area facing the first area,
And a width of a first portion of the thermal diffusion layer positioned between the first region and the driving board is different from a width of a second portion of the thermal diffusion layer located between the second region and the driving board. The method of claim 9,
The distance between the first area of the frame and the drive board is greater than the distance between the drive area and the second area facing the first area,
And a width of the first portion in the thermal diffusion layer is greater than that of the second portion. The method of claim 1,
And a heat sink disposed between the driving board and the heat insulation layer. The method of claim 11,
The heat sink includes a first portion including a plurality of protrusions and a second portion not including the protrusions. The method of claim 12,
The driving board is located in the second portion. The method of claim 12,
The maximum height of the protrusion is lower than the maximum height of the drive board. The method of claim 13,
And a thickness of the second portion is less than a minimum thickness of the first portion. The method of claim 1,
The frame includes a heat spreader (Heat Spreader). The method of claim 1,
The frame includes a plurality of projections. The method of claim 1,
And a back cover is disposed behind the driving board. The method of claim 18,
The back cover is disposed in an area overlapping with the heat insulation layer, and the back cover is connected to the frame. Display panel;
A frame disposed on a rear surface of the display panel;
A driving board disposed on a rear surface of the frame;
A heat sink disposed at the rear of the driving board; And
A Peltier device disposed between the heat sink and the driving board;
Display device comprising a. 21. The method of claim 20,
And a heat insulating layer further disposed between the display panel and the driving board. Display panel;
A backlight unit disposed on a rear surface of the display panel;
An optical layer disposed between the backlight unit and the display panel;
A frame disposed on a rear surface of the backlight unit;
A driving board disposed on a rear surface of the frame; And
A heat insulating layer disposed between the display panel and the driving board;
. The method of claim 22,
A resin layer is disposed between the optical layer and the backlight unit,
And a thickness of the resin layer in a region overlapping the driving board is thicker than a thickness in other regions.

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