KR20120033297A - 표시 패널의 제조 방법 및 그 제조 시스템 - Google Patents
표시 패널의 제조 방법 및 그 제조 시스템 Download PDFInfo
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Abstract
먼저, 진공 분위기 속에서 전기 광학 패널(1)과 기판(2)의 대향면(1a, 2a)끼리를 액상 접착제(3)를 사이에 끼워 Z방향으로 중첩함으로써, 액상 접착제(3)를 대향면(1a, 2a)을 따라 강제적으로 신장시킨다. 이어서, 전기 광학 패널(1)과 기판(2)의 사이에 액상 접착제(3)를 자연 신장시킴으로써, 액상 접착제(3) 내의 국부적인 진공 등이 소실되어 액상 접착제(3)는 대략 정지 안정된 상태가 되고, 액상 접착제(3)의 층 두께가 전기 광학 패널(1) 및 기판(2)의 대향면(1a, 2a) 전체에서 Z방향으로 대략 균일하게 되어, 더 이상의 갭 조정이 필요 없는 상태가 된다. 그 후, 대기 중에서 전기 광학 패널(1) 및 기판(2) 중 어느 한쪽을 다른 쪽에 대해 XYθ 방향으로 상호 이동시켜 위치맞춤하는 경우, 대략 균일한 층 두께의 액상 접착제(3) 상에 올려진 전기 광학 패널(1) 또는 기판(2) 중 어느 한쪽을 액상 접착제(3)의 계면을 따라 원활하게 슬라이딩시키기만 하면 되고, 가압하지 않기 때문에 액상 접착제(3)가 변형 유동하지 않아 공기가 말려들게 하는 일은 없다.
Description
도 2는 합착 유닛의 종단 정면도이며, (a)가 중첩 전 상태를 나타내고, (b)가 중첩 후의 상태를 나타내고 있다.
도 3은 무기포 정렬 유닛의 종단 정면도이며, (a)가 평면도, (b)가 일부 절결 정면도이다.
도 4는 본 발명의 실시 형태에 관한 표시 패널의 제조 방법을 나타내는 플로우차트이다.
2 : 기판 3 : 액상 접착제
11 : 진공 챔버 20 : 반송 유닛
30 : 무기포 정렬 유닛 40 : 경화 유닛
Claims (4)
- 전기 광학 패널과, 투광성을 가지며 상기 전기 광학 패널로부터 사출된 빛을 시인측에 사출하는 기판을 액상 접착제로 맞붙이는 표시 패널의 제조 방법으로서,
진공 분위기 속에서 상기 전기 광학 패널 및 상기 기판의 대향면을 그들 사이에 상기 액상 접착제가 끼워지도록 Z방향으로 중첩하는 합착 공정과,
상기 합착 공정에서 중첩된 상기 전기 광학 패널 및 상기 기판의 상기 대향면을 따라 상기 액상 접착제를 정해진 시간에 걸쳐 자연 신장시켜, 그 액상 접착제의 층 두께를 상기 전기 광학 패널 및 상기 기판의 대향면 전체에서 Z방향으로 대략 균일하게 하는 레벨링 공정과,
상기 레벨링 공정 후에 상기 전기 광학 패널 또는 상기 기판 중 어느 한쪽을 다른 쪽에 대해 대기 중에서 XYθ 방향으로 서로 슬라이딩 이동시켜 위치맞춤하는 무기포 정렬 공정과,
상기 무기포 정렬 공정에서 위치맞춤된 상기 전기 광학 패널 및 상기 기판의 상기 대향면 간에 배치되는 상기 액상 접착제를 경화시키는 경화 공정
을 포함하는 것을 특징으로 하는 표시 패널의 제조 방법. - 제1항에 있어서, 상기 합착 공정에서는 상기 전기 광학 패널과 상기 기판을 복수 조 각각이 서로 대향하도록 배치하여 동시에 중첩하고,
상기 무기포 정렬 공정에서는 상기 합착 공정에서 중첩된 복수 조의 상기 전기 광학 패널과 상기 기판을 차례로 위치맞춤하는 것을 특징으로 하는 표시 패널의 제조 방법. - 전기 광학 패널과, 투광성을 가지며 상기 전기 광학 패널로부터 사출된 빛을 시인측에 사출하는 기판을 액상 접착제로 맞붙이는 표시 패널의 제조 시스템으로서,
진공 챔버를 가지며, 그 진공 챔버 내에서 상기 전기 광학 패널과 상기 기판을 지지하여 그들 사이에 상기 액상 접착제가 끼워지도록 Z방향으로 중첩하는 합착 유닛과,
상기 합착 유닛에 의해 중첩된 상기 전기 광학 패널 및 상기 기판을 착탈 가능하게 지지하여 상기 진공 챔버 내로부터 대기 중으로 반송하는 반송 유닛과,
대기 중에 설치되며, 상기 반송 유닛에 의해 반송된 상기 전기 광학 패널 또는 상기 기판 중 어느 한쪽을 다른 쪽에 대해 XYθ 방향으로 상호 이동시켜 위치맞춤하는 무기포 정렬 유닛과,
상기 무기포 정렬 유닛에 의해 위치맞춤된 상기 전기 광학 패널과 상기 기판의 대향면 간에 배치되는 상기 액상 접착제를 경화시키는 경화 유닛
을 구비하고,
상기 반송 유닛은 상기 진공 챔버 내로부터 중첩된 상기 전기 광학 패널 및 상기 기판을 대기 중의 상기 무기포 정렬 유닛에 반송해 세트할 때까지의 정해진 시간 중에 상기 전기 광학 패널과 상기 기판의 대향면을 따라 상기 액상 접착제가 자연 신장하여, 그 액상 접착제의 층 두께가 상기 대향면 전체에서 Z방향으로 대략 균일하게 되도록 하는 것을 특징으로 하는 표시 패널의 제조 시스템. - 제3항에 있어서, 상기 합착 유닛은 상기 진공 챔버 내에서 상기 전기 광학 패널과 상기 기판을 복수 조 각각이 서로 대향하도록 지지하고, 이들 복수 조의 상기 전기 광학 패널과 상기 기판을 각각 접근 이동시켜 동시에 중첩하고,
상기 반송 유닛은 상기 합착 유닛에 의해 중첩된 복수 조의 상기 전기 광학 패널 및 상기 기판을 상기 진공 챔버 내로부터 상기 무기포 정렬 유닛에 반송하고,
상기 무기포 정렬 유닛은 상기 반송 유닛에 의해 반송된 복수 조의 상기 전기 광학 패널과 상기 기판을 각각 착탈 가능하게 지지해 차례로 위치맞춤하는 것을 특징으로 하는 표시 패널의 제조 시스템.
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PCT/JP2010/064734 WO2012029110A1 (ja) | 2010-08-30 | 2010-08-30 | 表示パネルの製造方法及びその製造システム |
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KR1020137017175A Division KR101614591B1 (ko) | 2010-08-30 | 2010-08-30 | 표시 패널의 제조 방법 및 그 제조 시스템 |
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KR20120033297A true KR20120033297A (ko) | 2012-04-06 |
KR101471705B1 KR101471705B1 (ko) | 2014-12-10 |
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KR1020117006811A KR101471705B1 (ko) | 2010-08-30 | 2010-08-30 | 표시 패널의 제조 방법 및 그 제조 시스템 |
KR1020137017175A KR101614591B1 (ko) | 2010-08-30 | 2010-08-30 | 표시 패널의 제조 방법 및 그 제조 시스템 |
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KR1020137017175A KR101614591B1 (ko) | 2010-08-30 | 2010-08-30 | 표시 패널의 제조 방법 및 그 제조 시스템 |
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JP (1) | JP4657387B1 (ko) |
KR (2) | KR101471705B1 (ko) |
CN (1) | CN102598091B (ko) |
TW (1) | TW201209780A (ko) |
WO (1) | WO2012029110A1 (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101439876B1 (ko) * | 2012-12-13 | 2014-09-16 | 주식회사 성우하이텍 | 패널 접합방법 |
KR20140133450A (ko) * | 2013-05-09 | 2014-11-19 | 신에츠 엔지니어링 가부시키가이샤 | 접합 분리 방법 및 분리 장치 |
KR20150020310A (ko) * | 2013-08-13 | 2015-02-25 | 신에츠 엔지니어링 가부시키가이샤 | 접합 디바이스의 제조 장치 및 접합 디바이스의 제조 방법 |
Families Citing this family (15)
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KR101471705B1 (ko) | 2010-08-30 | 2014-12-10 | 신에츠 엔지니어링 가부시키가이샤 | 표시 패널의 제조 방법 및 그 제조 시스템 |
CN103009776B (zh) * | 2011-09-24 | 2017-09-22 | 宸鸿科技(厦门)有限公司 | 基板的贴合方法 |
JP2013167712A (ja) * | 2012-02-15 | 2013-08-29 | Hitachi High-Technologies Corp | 基板の貼り合せ装置及び基板の貼り合せ方法 |
JP2013218198A (ja) * | 2012-04-11 | 2013-10-24 | Hitachi High-Technologies Corp | 基板貼り合わせ装置 |
JP5346116B1 (ja) * | 2012-12-19 | 2013-11-20 | 信越エンジニアリング株式会社 | ワーク貼合方法及びワーク貼合装置 |
ITTV20120241A1 (it) * | 2012-12-21 | 2014-06-22 | Dario Toncelli | Metodo ed impianto per realizzare pannelli formati con lastre incollate |
CN104022057A (zh) * | 2013-02-28 | 2014-09-03 | 株式会社日立高新技术 | 基板贴合装置以及基板贴合用具 |
JP6040852B2 (ja) * | 2013-04-22 | 2016-12-07 | 富士通株式会社 | 接着剤による接着方法 |
CN105359203B (zh) * | 2013-06-27 | 2018-09-04 | 信越工程株式会社 | 贴合设备的制造方法 |
JP2015158603A (ja) * | 2014-02-24 | 2015-09-03 | 株式会社Sat | 基板の貼り合せ装置 |
TWI532588B (zh) * | 2014-02-24 | 2016-05-11 | To prevent the bubble generated by the adhesive tape and electronic components of the method | |
CN104635369A (zh) * | 2015-03-13 | 2015-05-20 | 信利光电股份有限公司 | 液晶模组的制作方法及液晶模组 |
TWI596070B (zh) * | 2016-05-11 | 2017-08-21 | 登峰製造股份有限公司 | 顯示面板之貼合裝置及貼合方法 |
FR3065677B1 (fr) * | 2017-04-27 | 2019-05-03 | Faurecia Interieur Industrie | Procede de fabrication d'un module d'affichage pour un habitacle de vehicule automobile |
CN112147803A (zh) * | 2019-06-26 | 2020-12-29 | 夏普株式会社 | 贴合基板的制造方法以及基板贴合装置 |
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JPH07114010A (ja) * | 1993-10-14 | 1995-05-02 | Matsushita Electric Ind Co Ltd | 液晶表示装置 |
JP3545076B2 (ja) * | 1995-01-11 | 2004-07-21 | 富士通ディスプレイテクノロジーズ株式会社 | 液晶表示装置及びその製造方法 |
JP3742000B2 (ja) * | 2000-11-30 | 2006-02-01 | 富士通株式会社 | プレス装置 |
JP2003233080A (ja) * | 2002-02-05 | 2003-08-22 | Lg Phillips Lcd Co Ltd | 合着装置及びこれを用いた液晶表示装置の製造方法 |
JP2006071766A (ja) | 2004-08-31 | 2006-03-16 | Makushisu Wan:Kk | 光学部品の製造装置及び製造方法 |
TWI296732B (en) * | 2004-12-28 | 2008-05-11 | Chi Mei Optoelectronics Corp | Method of assembling liquid crystal display panel and apparatus of assembling the same |
JP2007079374A (ja) * | 2005-09-16 | 2007-03-29 | Seiko Epson Corp | 電気光学装置の製造方法 |
KR20070051422A (ko) * | 2005-11-15 | 2007-05-18 | 삼성전자주식회사 | 액정 표시 패널의 편광판 부착 장치와 방법 및 이를 이용한액정 표시 패널의 제조 방법 |
JP2009103833A (ja) * | 2007-10-22 | 2009-05-14 | Sharp Corp | 表示装置 |
KR101471705B1 (ko) | 2010-08-30 | 2014-12-10 | 신에츠 엔지니어링 가부시키가이샤 | 표시 패널의 제조 방법 및 그 제조 시스템 |
-
2010
- 2010-08-30 KR KR1020117006811A patent/KR101471705B1/ko active IP Right Grant
- 2010-08-30 JP JP2010541632A patent/JP4657387B1/ja not_active Expired - Fee Related
- 2010-08-30 WO PCT/JP2010/064734 patent/WO2012029110A1/ja active Application Filing
- 2010-08-30 KR KR1020137017175A patent/KR101614591B1/ko active IP Right Grant
- 2010-08-30 CN CN201080003057.7A patent/CN102598091B/zh not_active Expired - Fee Related
- 2010-10-18 TW TW099135508A patent/TW201209780A/zh not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101439876B1 (ko) * | 2012-12-13 | 2014-09-16 | 주식회사 성우하이텍 | 패널 접합방법 |
KR20140133450A (ko) * | 2013-05-09 | 2014-11-19 | 신에츠 엔지니어링 가부시키가이샤 | 접합 분리 방법 및 분리 장치 |
KR20150020310A (ko) * | 2013-08-13 | 2015-02-25 | 신에츠 엔지니어링 가부시키가이샤 | 접합 디바이스의 제조 장치 및 접합 디바이스의 제조 방법 |
Also Published As
Publication number | Publication date |
---|---|
TWI356359B (ko) | 2012-01-11 |
KR101614591B1 (ko) | 2016-04-21 |
CN102598091B (zh) | 2014-09-10 |
JP4657387B1 (ja) | 2011-03-23 |
WO2012029110A1 (ja) | 2012-03-08 |
KR20130086654A (ko) | 2013-08-02 |
KR101471705B1 (ko) | 2014-12-10 |
TW201209780A (en) | 2012-03-01 |
JPWO2012029110A1 (ja) | 2013-10-28 |
CN102598091A (zh) | 2012-07-18 |
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