KR20120013795A - Light-emitting element package - Google Patents

Abstract

PURPOSE: A light emitting device package is provided to improve colored light mixing effects of red light, green light, and blue light by arranging a plurality of protrusions on a bottom surface. CONSTITUTION: A cavity is formed in a package body(110). First and second lead frames(120,130) are arranged on the lower surface of the package body. The first and second lead frames are formed in order to have a single layer or multi-layer structure. A light emitting device(140) is arranged on the first lead frame within the cavity. An encapsulation material(150) seals the cavity. The encapsulation material comprises one or more elements among a fluorescent substance and a light diffusion material.

Description

Light-emitting element package

Embodiments relate to a light emitting device package, and more particularly, to a light emitting device package having a structure that is easy to prevent the unmolding of the package body.

LED (Light Emitting Diode) is a device that converts electrical signals into infrared, visible light or light using the characteristics of compound semiconductors. It is used in household appliances, remote controls, display boards, The use area of LED is becoming wider.

In general, miniaturized LEDs are made of a surface mounting device for mounting directly on a PCB (Printed Circuit Board) substrate, and an LED lamp used as a display device is also being developed as a surface mounting device type . Such a surface mount device can replace a conventional simple lighting lamp, which is used for a lighting indicator for various colors, a character indicator, an image indicator, and the like.

In this way, as the usage area of the LED becomes wider, the luminance required for electric light used for living, electric light for rescue signals, and the like increases, and therefore, it is important to increase the luminance of the LED.

An object of the embodiment is to provide a light emitting device package having a structure that is easy to prevent the unmolding of the package body.

The light emitting device package according to the embodiment includes a light emitting device and a body having a cavity in which the light emitting device is disposed, and an inner wall of the cavity includes: a first inclined surface formed at a first angle with respect to a lower surface of the cavity; A second inclined surface formed between the lower surface and the first inclined surface and having a second angle with the first inclined surface and having a third angle with the lower surface, wherein the height of the second inclined surface is greater than that of the light emitting device. Lower than height

In the light emitting device package according to the embodiment, when the package body is molded, the height of the second inclined surface of the inner wall is lower than the height of the light emitting device, so that the lower surface of the cavity has an angle of 80 ° to 90 °, the injection molding forming the package body It is possible to prevent unmolding and to improve airtightness and reliability.

In addition, the light emitting device package according to the embodiment has the advantage of widening the directivity angle at the time of light extraction according to the first inclination angle of the first inclined surface of the inner wall.

1 is a cross-sectional view illustrating a cut surface of a light emitting device package according to an embodiment.
FIG. 2 is an enlarged view illustrating a first embodiment of an 'A' block shown in FIG. 1.
FIG. 3 is an enlarged view illustrating a second embodiment of the 'A' block shown in FIG. 1.
4 is a cross-sectional view showing the package body and the cavity shown in FIG.
5 is a perspective view illustrating a lighting device including a light emitting device package according to an embodiment.
FIG. 6 is a cross-sectional view illustrating a cross section taken along line AA ′ of the lighting apparatus illustrated in FIG. 4.
7 is a perspective view illustrating a first embodiment of a backlight device including a light emitting device package according to the embodiment.
8 is a perspective view illustrating a second embodiment of a backlight device including a light emitting device array according to the embodiment.

Prior to the description of the implementation, the substrate, each layer region, pad, or pattern of each layer (film), region, pattern, or structure referred to herein is "on", "under". "On" and "under" include all that is formed "directly" or "indirectly" through another layer, In addition, the reference | standard about the upper or lower of each layer is demonstrated based on drawing.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. Thus, the size of each component does not fully reflect its actual size.

In addition, angles and directions mentioned in the process of describing the structure of the light emitting device package herein are based on those described in the drawings. In the description of the structure constituting the light emitting device package in the specification, when the reference point and the positional relationship with respect to the angle is not clearly mentioned, reference is made to related drawings.

1 is a cross-sectional view illustrating a cut surface of a light emitting device package according to an embodiment.

Referring to FIG. 1, the light emitting device package 100 includes a package body 110 in which a cavity s is formed, first and second lead frames 120 and 130 disposed in the package body 110, and a cavity s. The light emitting device 140 may be disposed on the first lead frame 120.

The package body 110 may be made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), AlOx, photosensitive glass (PSG), polyamide 9T (PA9T), neo geotactic polystyrene (SPS), a metal material, sapphire (Al ₂ O ₃ ), beryllium oxide (BeO), and may be formed of at least one of a printed circuit board (PCB, PCB).

The top shape of the package body 110 may have various shapes such as triangles, squares, polygons, and circles depending on the use and design of the light emitting device 140.

The cross-sectional shape of the cavity s may be formed in a cup shape, a concave container shape, and the like, and an inner side surface of the cavity s may be an inner side surface inclined with respect to the lower portion.

In addition, the front shape of the cavity s may be a shape such as a circle, a rectangle, a polygon, an oval, and the like, but is not limited thereto.

At this time, the first and second lead frames 120 and 120 are disposed on the lower surface of the package body 110, and the first and second lead frames 120 and 130 are made of a metal material, for example, titanium (Ti), Copper (Cu), Nickel (Ni), Gold (Au), Chromium (Cr), Tantalum (Ta), Platinum (Pt), Tin (Sn), Silver (Ag), Phosphorus (P), Aluminum (Al) And one or more materials or alloys of indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge), hafnium (Hf), ruthenium (Ru), and iron (Fe). have.

In addition, the first and second lead frames 120 and 130 may be formed to have a single layer or a multilayer structure, but the embodiment is not limited thereto.

The package body 110, that is, the inner wall of the cavity s may form an inclined surface, and the reflection angle of the light emitted from the light emitting device 140 may vary according to the angle of the inclined surface, and thus the directing angle of the light emitted to the outside. Can be adjusted. Concentration of light emitted from the light emitting device 140 to the outside increases as the directivity of the light decreases, while concentration of light emitted from the light emitting device 140 to the outside decreases as the directivity of the light increases.

Here, a detailed description of the inner wall of the cavity (s) will be described later.

In addition, the light emitting device package 100 may include an encapsulant 150 that seals the cavity s, and the encapsulant 150 may be formed of a double molding structure or a triple molding structure. Do not.

In addition, the encapsulant 150 may be formed in a film shape, may include at least one of a phosphor and a light diffusing material, and a translucent material that does not include the phosphor and the light diffusing material may be used. Do not.

FIG. 2 is an enlarged view of a first embodiment of the 'A' block shown in FIG. 1, and FIG. 3 is an enlarged view of a second embodiment of the 'A' block shown in FIG. 1.

2 and 3 have the same configuration as that shown in FIG. 1, and therefore descriptions of overlapping portions will be omitted or briefly described.

Referring to FIG. 2, the inner surface of the package body 110 forming the cavity s is inclined at a first angle d1 based on the lower surface of the cavity s, that is, the first lead frame 120. The first inclined surface 112 and the first inclined surface 112 may include a second inclined surface 114 in contact with the second angle d2 and in contact with the first lead frame 120 at a third angle d3.

At this time, the first angle d1 of the first inclined surface 112 is lower than the second and third angles d2 and d3, and preferably 20 ° to 40 °.

That is, the first angle d1 of the first inclined surface 112 is related to the entire size of the light emitting device package 100, and the package designed when the first angle d1 of the first inclined surface 112 is smaller than 20 °. The overall size of the body 110 is increased, and if the height is greater than 40 °, the height or thickness of the package body 110 becomes thick, so that the efficiency of the mounting area and thickness of the product using the light emitting device package 100 is increased. Will fall.

In addition, the third angle d3 of the second inclined surface 114 may be 80 ° to 90 °, and 90 °, that is, the first lead frame 120 may be in contact with the first lead frame 120.

That is, since the third angle d3 of the second inclined surface 114 is preferably vertical or close to vertical so as to prevent unmolding at the time of molding the package body 110 and injection molding injected into the mold. to be.

In addition, the second angle d2 of the second inclined surface 114 is preferably 110 ° to 130 °, which may be determined by the first and third angles d1 and d3.

Here, the height h of the second inclined surface 114 may be formed lower than the height h1 of the light emitting device 140, and the height h of the second inclined surface 114 may be formed in the light emitting device 140. Included and may be formed lower than the height of the active layer (not shown) for generating light.

That is, the height h of the second inclined surface 114 may be 0.1 times to 0.6 times the height h1 of 2 / 100T (tera) to 6 / 100T (tera) or the light emitting device 140.

In other words, the height h of the second inclined surface 114 is formed to be lower than the height h1 of the light emitting device 140, that is, the active layer, so that the light generated from the light emitting device 140 is first inclined surface 112. It can be reflected by the front, and the bonding with the first lead frame 120 in the process of molding after the injection of the injection molding can be prevented to prevent the unmolding.

That is, the height h of the second inclined surface 114 is 0.1 / 100 or more than the height h1 of 2 / 100T (tera) or the light emitting element 140 that is higher than the material constituting the injection molded material and glass fiber. Can be prevented.

In addition, when the height h of the second inclined surface 114 is higher than 0.6 times the height h1 of the light emitting device 140, the light efficiency is lowered.

Referring to FIG. 3, the second inclined surface 114 may be formed in steps in a step shape.

In this case, the height h of the second inclined surface 114 may form first and second heights h_1 and h_2, and the first and second heights h_1 and h_2 may be formed in a step shape.

Here, each of the first and second heights h_1 and h_2 may be 0.1 times to 0.6 times the height h1 of the light emitting device 140, or may be 2 / 100T (tera) to 6 / 100T (tera). , As described in FIG. 2.

In addition, the heights of the first and second heights h_1 and h_2 may be different from each other, but should be greater than the thickness or diameter of the injection molded product.

And, the length of the surface parallel to the second lead frame 120 in the step shape of the second inclined surface 114 is formed longer than the thickness or diameter of the injection molding, to prevent unmolding when molding the injection molding, the length of the surface There is no limitation on.

In FIG. 3, the staircase shape is toward the light emitting device 140, but the staircase shape may be formed in the inner wall direction, without being limited thereto.

Also, unlike FIG. 2 and FIG. 3, irregularities or roughness may be formed in the cross section of the second inclined surface 114, without being limited thereto.

4 is a cross-sectional view showing the package body and the cavity shown in FIG.

FIG. 4 omits description of the overlapping parts of FIGS. 1 to 3.

Referring to FIG. 4, the upper width b1 of the cavity s may be 66% to 89% of the width b2 of the package body 110.

That is, the upper width b1 of the cavity s is determined according to the inclination angle with respect to the inner wall of the cavity s. In this case, when the upper width b1 is less than 66% of the width of the package body 110, the light emitting device ( 140, the efficiency of the light generated is lowered, if the greater than 89% compared to the width of the package body 110, the efficiency of the light can be increased compared to the overall size of the package is large and accordingly the first, second lead frame (120, 130) As the length of the wire increases, manufacturing cost increases.

Table 1 shows the upper width b1 of the cavity s according to the inclination angle of the inner wall when the width b2 of the package body 110 is 3.8 mm.

In Table 1, the width b2 of the package body 110 is limited to 3.8 mm, but the present invention is not limited thereto.

As shown in Table 1, the inner wall inclination angle is the third inclination angle d3 shown in FIGS. 2 and 3, and the upper width b1 of the cavity s is the most when the third inclination angle d3 is 20 °. When the inclination angle of the inner wall is greater than 20 °, the upper width b1 of the cavity s becomes closer to or larger than the width b2 of the package body 110, whereby the package body 110 is formed by the inner wall. May be broken or warpage may occur.

5 is a perspective view showing a lighting device including a light emitting device package according to the embodiment, Figure 6 is a cross-sectional view showing a cross-section A 'A of the lighting device shown in FIG.

On the other hand, in order to explain in more detail the shape of the lighting apparatus according to the embodiment, the longitudinal direction (Z) of the lighting apparatus, the horizontal direction (Y) perpendicular to the longitudinal direction (Z), and the longitudinal direction (Z) and the horizontal direction It will be described in the height direction X perpendicular to (Y).

That is, FIG. 6 is a cross-sectional view of the lighting apparatus 200 of FIG. 5 cut in the longitudinal direction Z and the height direction X, and viewed in the horizontal direction Y. As shown in FIG.

5 and 6, the lighting device 200 may include a body 210, a cover 230 coupled to the body 210, and a closing cap 250 positioned at both ends of the body 210. have.

The lower surface of the body 210 is fastened to the light emitting device module 240, the body 210 is conductive so that heat generated in the light emitting device package 244 can be discharged to the outside through the upper surface of the body 210 And it may be formed of a metal material having an excellent heat dissipation effect.

The light emitting device package 244 may be mounted on the printed circuit board 242 in multiple colors and in multiple rows. The light emitting device package 244 may be mounted at the same interval or may be mounted at various separation distances as necessary to adjust brightness. In addition, the printed circuit board 242 may be a metal substrate for effective heat dissipation.

The cover 230 may be formed in a circular shape to surround the lower surface of the body 210, but is not limited thereto.

The cover 230 protects the light emitting device module 240 from the outside and the like. In addition, the cover 230 may include diffusing particles to prevent glare of the light generated from the light emitting device package 244 and to uniformly emit light to the outside as described below, and also the inner surface of the cover 230 And a prism pattern may be formed on at least one of the outer surfaces, and a phosphor may be applied to at least one of the inner and outer surfaces of the cover 230.

On the other hand, since the light generated from the light emitting device package 244 is emitted to the outside through the cover 230, the cover 230 should be excellent in light transmittance, and sufficient heat resistance to withstand the heat generated in the light emitting package (244) It should be provided, the cover 230 is preferably formed of a material containing polyethylene terephthalate (PET), polycarbonate (PC) or polymethyl methacrylate (PMMA), etc. Do.

Closing cap 250 is located at both ends of the body 210 may be used for sealing the power supply (not shown). In addition, the closing cap 250 is a power pin 252 is formed, the lighting device 200 according to the present invention can be used immediately without a separate device in the terminal from which the existing fluorescent lamps are removed.

7 is a perspective view illustrating a first embodiment of a backlight device including a light emitting device package according to the embodiment.

7 illustrates a vertical backlight device, and referring to FIG. 7, the backlight device may include a lower accommodating member 350, a reflector plate 320, a plurality of light emitting device modules 340, and a plurality of optical sheets 330. have.

In this case, the light emitting device module 340 may include a printed circuit board 342 such that a plurality of light emitting device packages 344 and a plurality of light emitting device packages 344 are mounted to form an array.

On the other hand, a plurality of protrusions and the like may be formed on the bottom surface of the light emitting device package 344, it is possible to improve the color mixing effect of the red light, green light and blue light.

The reflector 320 may reduce light loss by using a plate having a high light reflectance. The optical sheet 330 may include at least one of the brightness improving sheet 332, the prism sheet 334, and the diffusion sheet 336.

The diffusion sheet 336 directs the light incident from the light emitting device module 340 toward the front of the liquid crystal display panel (not shown), and diffuses the light to have a uniform distribution in a wide range. You can investigate. The prism sheet 334 serves to change the light incident at an oblique angle among the light incident on the prism sheet 334 to be emitted vertically. That is, at least one prism sheet 334 may be disposed under the liquid crystal display panel (not shown) in order to vertically convert the light emitted from the diffusion sheet 336. The brightness improving sheet 332 transmits light parallel to its transmission axis and reflects light perpendicular to the transmission axis.

8 is a perspective view illustrating a second embodiment of a backlight device including a light emitting device array according to the embodiment.

8 illustrates an edge type backlight device. Referring to FIG. 8, the backlight device includes a lower accommodating member 400, a light emitting device module 410 for outputting light, and a light guide plate 420 disposed adjacent to the light emitting device module 410. And a plurality of optical sheets (not shown). A plurality of optical sheets (not shown) may be located on the light guide plate 420, which is the same as the plurality of optical sheets 430 shown and described with reference to FIG.

In the light emitting device module 410, a plurality of light emitting device packages 414 may be mounted on the printed circuit board 412 to form an array. The printed circuit board 412 may be a metal core PCB (MCPCB) or a PCB made of FR4. In addition, the printed circuit board 412 may be manufactured in various forms according to the structure of the backlight assembly as well as the rectangular plate shape.

The light guide plate 420 converts the light output from the light emitting device package 414 into a surface light source shape and provides the light to the liquid crystal display panel (not shown). A plurality of optical films (not shown) for improving the light efficiency and a reflective sheet (not shown) for reflecting light emitted to the rear of the light guide plate 420 to the light guide plate 420 may be disposed on the rear surface of the light guide plate 620.

Meanwhile, the structure of the vertical backlight device shown in FIG. 7 and the edge-type backlight device shown in FIG. 8 may be mixed.

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in each embodiment may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

In addition, the above description has been made with reference to the embodiment, which is merely an example, and is not intended to limit the present invention. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

Claims (11)

A light emitting element; And
And a body having a cavity in which the light emitting device is disposed.
The inner wall of the cavity,
A first inclined surface formed at a first angle with respect to the lower surface of the cavity; And
And a second inclined surface formed between the lower surface and the first inclined surface, the second inclined surface having a second angle with the first inclined surface and having a third angle with the lower surface.
The height of the second inclined surface,
A light emitting device package lower than the height of the light emitting device. The height of the second inclined surface,
A light emitting device package of 0.1 times to 0.6 times the height of the light emitting device. The height of the second inclined surface,
A light emitting device package of 2 / 100T (tera) to 6 / 100T (tera). The method of claim 1, wherein the first angle is,
A light emitting device package lower than the second and third angles. The method of claim 1, wherein the first angle is,
20 ° to 40 ° light emitting device package. The method of claim 1,
The second angle is 110 ° to 130 °,
The third angle is a light emitting device package of 80 ° to 90 °. According to claim 1, wherein the cross section of the inner wall,
A light emitting device package in which irregularities are formed. According to claim 1, wherein the cross section of the inner wall,
Light emitting device package having a step shape. The method of claim 1, wherein the upper surface width of the cavity,
Light emitting device package of 66% to 89% of the width of the body. 10. A backlight device comprising the light emitting device package of claim 1. 10. A lighting device comprising the light emitting device package of claim 1.

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