KR20110135600A - LED lamp - Google Patents

Abstract

The present invention provides an LED lamp comprising: a heat sink having a polygonal heat dissipation fin formed therein and an air circulation passage through which air is circulated; A plurality of LED modules coupled to an outer surface of the body of the radiator and configured with a plurality of LEDs mounted on a driving circuit on a substrate; A heat dissipator having a heat dissipator mounted on a lower portion thereof, and a PCB fixing plate support part spaced at a predetermined interval from a partition wall having an air circulation port; A PCB fixing plate mounted inside the upper portion of the heat sink; A driving circuit mounted inside the PCB fixing plate to drive an LED mounted on the LED module; The socket is connected to the upper portion of the heat sink and the electrode is formed on one side so that the driving power can be applied from the outside and a plurality of air outlets are formed; The LED module is tightly coupled to the outer surface of the radiator body so that the heat generated from the LED chip is directly transferred to the radiator, so that the heat transfer efficiency is good, and an air circulation path configured with a radiating fin is formed inside the radiator to radiate heat on the radiator. It is composed of a sieve, a driving circuit and a socket in order to cool the radiator and the driving circuit by natural convection, so that the heat dissipation is good, and the LED module is slide-coupled, which is not limited to the length of the LED module. The workability of coupling the LED module to the radiator has a good effect.

Description

LED lamps

The present invention relates to an LED lamp, and more specifically, a plurality of LED modules are coupled to the outer surface and constitutes a polygonal radiator having an air circulation passage formed with a heat dissipation fin therein, the drive circuit for driving the radiator and the LED on the top of the radiator The furnace and the air outlet through the socket is configured in sequence, it is possible to horizontal lighting while the LED lamp that can achieve the heat dissipation effect by natural convection.

Currently, discharge lamps such as fluorescent lamps, incandescent lamps and halogen lamps are used as light sources for indoor lighting in homes and offices. Since the discharge lamp has a high driving voltage, the energy consumption is large due to the boost of the power, and when discharged, the discharge lamp discharges discharge gas such as mercury, which is harmful to the human body or the environment.

In particular, the European Union (EU) prohibits the use of heavy metals such as lead, mercury, cadmium, hexavalent chromium (Cr6 +), and hazardous substances such as PB (PolyBromide Binpenyl) and PBDE (PolyBrominated Diphenyl Ether). Established Restriction of Use of Hazardous Substances (RoHS) and Waste Electrical and Electronic Equipment Directives (WEEE) that require producers to bear the costs of recycling waste electrical and electronic products. This has been implemented since July 1, 2006.

Accordingly, the necessity of research and development of a new luminaire that can replace a luminaire such as a fluorescent lamp currently used is emerging.

In addition, with the rapid development of the technology related to light emitting diodes (LEDs), white LEDs emitting white light using blue LEDs and phosphors have emerged. It is an environmentally friendly light source that has low power, long life, no harmful waves such as ultraviolet light, and no mercury or discharge gas, and has been spotlighted as a powerful means to replace the existing light source.

The present applicant has applied for an LED lamp as 20-2008-0009483, wherein the LED lamp is a substrate 212 and a substrate 212 formed with a driving circuit to electrically connect the LED chip 214 as shown in FIG. The LED module 200, which is composed of a plurality of LED chips 214 mounted on the driving circuit on the) and used as a light source of the lamp, is mounted on the front of the LED module 200, the light emitted from the LED module 200 In order to improve the heat dissipation effect by increasing the surface area of the lens 100 and diffused to the outside, mounted on the rear of the LED module 200 and a plurality of hollows 310 are formed in the cylindrical body and the body surface A plurality of heat dissipation fins 320 along the longitudinal direction are coupled to the heat dissipation member 300 formed radially and the rear end of the heat dissipation member 300 for dissipating heat accumulated in the heat dissipation member 300. Cylindrical body and body which form an air circulation passage and open at the upper side A plurality of air outlets 71 formed through the side of the sieve and the air cap 400 is provided in the interior of the body spaced apart a predetermined distance from the inner diameter of the body and extending a predetermined length in the vertical direction from the bottom of the body consisting of a cylindrical inner wall (400) ) And an LED chip 214 mounted in the socket 600 and the socket 600, which are connected to the air cap 400, and having an electrode 610 formed therein, to receive driving power, and mounted on the LED module 200. It consists of a driving circuit 500 for driving the.

However, the LED lamp of the prior art is composed of a plurality of LED chips mounted on the driving circuit on the substrate toward the front part, that is, the downward direction, so that the light emitted from the LED module is emitted downward and thus is not emitted in the lateral direction or the horizontal direction. There is a problem.

In addition, LED lamps in the form of bulbs, such as LED lamps of the prior art, is embedded in the wall surface, such as the ceiling is installed and there is a problem that the lighting range is limited because the light emitted from the LED module is emitted downward.

In addition, the LED lamp of the prior art has a problem that the number of LED chips mounted in the driving circuit is limited by the installation area of the LED lamp.

In addition, the LED lamp of the prior art has a problem that the substrate on which the LED chip is mounted is not in direct contact with the radiator so that the heat emitted from the LED chip is not effectively radiated.

In addition, the LED lamp of the prior art has a problem that the compatibility of the substrate is reduced because the size of the substrate on which the LED chip is mounted is limited for each radiator.

In addition, the LED lamp of the prior art has a problem that the workability in the substrate assembly is degraded because the substrate and the heat dissipator on which the LED chip is mounted are assembled by screws.

The present invention has been created to solve the above problems, the plurality of LED modules are configured vertically to illuminate in the lateral direction or horizontal direction, and the LED module is coupled to the outer surface of the body of the radiator heat of the LED chip Improve heat transfer efficiency by direct transfer to radiator, air circulation passage formed with radiating fins inside radiator, and radiator, drive circuit and socket are formed on radiator in order to improve heat radiating effect by natural convection. And, regardless of the length of the LED module is to provide a LED lamp that can improve the compatibility and workability of the LED module by inserting the LED module slide insert coupled to the outer surface of the body of the radiator.

LED lamp according to the present invention, the heat dissipation fin is configured therein and a polygonal radiator having an air circulation passage through which air is circulated; A plurality of LED modules coupled to an outer surface of the body of the radiator and configured with a plurality of LEDs mounted on a driving circuit on a substrate; A radiator mounted to a lower portion of the radiator: a PCB fixing plate mounted inside the upper portion of the radiator; A driving circuit mounted inside the PCB fixing plate to drive an LED mounted on the LED module; The socket is connected to the upper portion of the heat sink and the electrode is formed on one side to receive the driving power from the outside.

In addition, the present invention is a cylindrical diffusion cover is formed on the outside of the radiator equipped with the LED module, the upper portion is open and the lower portion is formed in the air inlet opening only the center portion.

In addition, in the present invention, the radiator is a hollow portion is formed inside the body, the radiating fin is formed on the inner surface of the body of the radiator is a plurality of radially formed along the longitudinal direction of the radiator.

In addition, the present invention is that the radiator is configured to the LED module coupling protrusion in the longitudinal direction of the radiator on the outer edge of the polygon and the LED module coupling groove formed in the longitudinal groove on the side of the LED module coupling protrusion.

In addition, the present invention is the heat dissipating body is formed inside the partition and the air circulation port penetrated through the center, and formed integrally with the partition wall is formed protruding to the top of the partition and spaced apart at regular intervals while being spaced apart from the inner circumferential surface of the heat sink. The PCB fixing plate support is to be configured.

In addition, the present invention is the socket is composed of a hemispherical body having a lower opening and a hollow portion therein, the body is formed with a plurality of air outlets penetrated.

In addition, the present invention is to be configured with a stopper coupled to the front portion of the diffusion cover and the stopper air inlet is formed.

In addition, the present invention is the end of the heat dissipation fin is composed of a heat dissipation fin center is formed integrally coupled at the center of the hollow inside the body.

According to the LED (light emitting diode) according to the present invention, a plurality of LED modules consisting of a plurality of LED chips mounted in the driving circuit is configured vertically, there is an effect that can be illuminated in the lateral direction, that is, the horizontal direction.

In addition, the present invention has an indirect effect of adjusting the range of the lower illumination and side lighting according to the bending and size of the side reflection shade by attaching the side reflection shade on the top of the LED lamp.

In addition, the present invention is the LED module is closely coupled to the outer surface of the body of the radiator heat is generated from the LED chip is directly transferred to the radiator has a good heat transfer efficiency.

In addition, the present invention is the heat of the LED module is directly transmitted to the radiator, the air circulation passage consisting of the heat radiation fin is formed inside the radiator, the radiator by the natural convection consisting of the radiator and the drive circuit and the socket sequentially on top of the radiator And cooling the drive circuit has a good heat dissipation effect.

In addition, the present invention is the LED module coupling groove is formed in the longitudinal direction on the outer edge of the radiator, the LED module is slide coupled between the LED module coupling groove and the LED module coupling groove is not limited to the length of the LED module to some extent LED While the compatibility of the module is good, the workability of coupling the LED module to the radiator has a good effect.

In addition, the present invention can extend the radiator and the LED module even if the installation area of the LED lamp is limited, the number of LED chips mounted in the driving circuit is not limited, there is an effect that can adjust the brightness of the LED lamp to any extent.

1 is an exploded perspective view of a LED lamp of the prior art.
2 is a front view of the LED lamp of the present invention.
3 is an exploded perspective view of the LED lamp of the present invention.
4 is a cross-sectional view of the diffusion cover of the present invention.
5: Bottom view of the heat sink of the present invention.
6 is a state of air circulation in the LED module, the radiator and the diffusion cover of the present invention assembled.
7: air circulation state in a state where the PCB fixing plate and the driving circuit is assembled to the heat sink of the present invention.
8 is an air circulation state of the socket of the present invention.
9 is a plan view of a heat sink of another embodiment in the present invention.

EMBODIMENT OF THE INVENTION Hereinafter, although the Example of this invention is described in detail, this invention is not limited to a following example, unless the summary is exceeded.

2 is an exploded perspective view of the present invention LED lamp of FIG. 3, a cross-sectional view of the diffusion cover of the present invention of FIG. 4, a bottom view of the heat sink of the present invention of FIG. 5, FIG. FIG. 8 is an air circulation state in a state in which the LED module, the radiator and the diffusion cover of the present invention are assembled, and an air circulation state in a state where the PCB fixing plate and the driving circuit are assembled in the heat sink of the present invention of FIG. The air circulation state of the socket of this invention and the top view of the heat sink of another Example in this invention of FIG. 9 are demonstrated.

The present invention comprises a large configuration of the radiator 40, 40-1, the LED module 30, the radiator 50, the PCB fixing plate 60, the drive circuit 90 and the socket 70 in the LED lamp. .

The radiator 40, 40-1 is composed of a body and a heat radiation fin 43, the body is composed of a polygonal footnote shape consisting of a quadrilateral, a hexagon, an octagon, etc., the heat radiation fin 43 is configured inside the body It acts as an air circulation passage through which air circulates.

The inside of the body of the radiator (40, 40-1) is formed with a hollow portion, the radiating fin 43 is formed on the inner surface of the body to increase the surface area and to improve the heat dissipation effect of the radiator (40, 40-1) A plurality of radially protruded toward the inner center to emit heat generated during the light emission of the LED described later along the longitudinal direction.

The heat dissipation fins 43 are spaced apart at regular intervals to serve as partition walls 57 while the air is circulated between the heat dissipation fins 43 and the heat dissipation fins 43 by introducing external air into the radiators 40 and 40-1. It is a passage.

External air flows into the bottom of the radiator 45, passes through the air circulation passage 42, flows out to the top of the radiator 45, and exchanges heat with the radiating fin 43. The body of the radiator 50 will be described later. After entering the inside of the socket 70 through the air circulation path 52 formed at regular intervals between the inner circumferential surface and the outer circumferential surface of the PCB fixing plate 60 is discharged to the outside from the socket 70 to radiate heat generated from the LED to the outside Let's do it.

In other words, heat generated when the LED is emitted is transferred to the radiators 40 and 40-1 and the radiating fins 43 so that the radiators 40 and 40-1 and the radiating fins 43 contain the heat to the outside air. Is sufficiently circulated through each of the radiating fins 43 to cool the radiator 40, 40-1 main body and the radiating fin 43 itself.

A plurality of screw grooves are formed at the lower end of the heat dissipation fin 43 so as to fix the diffusion cover 20 to be described later, and six heat dissipation fins 43 are formed in the drawings of the present embodiment. It may be formed in a larger number for cooling.

On the other hand, the radiator (40, 40-1) is formed with the LED module coupling protrusions (41, 41-1) and the LED module coupling grooves (44, 44-1) for coupling the LED module 30, the LED The module coupling protrusions 41 and 41-1 are configured in the longitudinal direction of the heat sinks 40 and 40-1 at the outer edges of the polygons of the heat sinks 40 and 40-1, and the LED module coupling grooves 44 and 44-1. ) Is formed as a groove in the longitudinal direction on the side of the LED module coupling protrusion (41, 41-1).

The LED module coupling protrusions 41 and 41-1 and the LED module coupling grooves 44 and 44-1 are formed in an “Ω” shape on each of the outer edges of the polygons of the heat sinks 40 and 40-1 to form the LED module. Coupling grooves 44 and 44-1 are channels, and each LED module 30 is slide-coupled between the LED module coupling grooves 44 and 44-1 and the LED module coupling grooves 44 and 44-1. .

Since the LED module 30 is slide-coupled between the LED module coupling grooves 44 and 44-1 and the LED module coupling grooves 44 and 44-1, the LED module 30 is closely coupled to each of the outer surfaces of the radiator body and the LEDs. Heat generated from the chip 31 is directly transferred to the radiators 40 and 40-1.

The LED module 30 is coupled to each of the polygonal outer surface of the heat radiation fin 43, for example, in the case of the hexagonal heat radiation fin 43 takes six LED module 30.

However, the number of the LED module 30 can be less than the polygonal outer surface of the heat dissipation fin 43 in order to adjust the illuminance of the horizontal light. In this case, the LED module 30 is coupled across the outer circumferential plane of the heat dissipation fin 43. You may.

The heat dissipation fin 43 may be uniform in thickness and may be made thinner toward the end, or may be made thinner toward the end by the shape of two or three stages.

The reason that the heat dissipation fins 43 are thinner toward the ends is that the heat dissipation fins 43 are closer to the heat dissipation fins 43 so as to conduct more heat generated from the LED and reduce unnecessary weight of the heat dissipation fins 43. .

The heat dissipation fins 43 are formed to extend integrally inside the heat dissipator body, and are configured to be adjacent to the center of the heat dissipator body, and one end thereof becomes a free end, or the end fins are integrally formed at the center of the hollow inside the body. The center may be configured.

The heat dissipation fin center 46 is configured to reinforce the strength of the heat dissipation fin 43, and one end of the heat dissipation fin 43 configured to be adjacent to the inner center of the radiator body in the plurality of heat dissipation fins 43 is formed at the center of the heat dissipator body 45. The heat dissipation fins 43 are integrated.

When the radiating fin central portion 46 is formed, a plurality of air circulation passages are formed to form the same number as the number of radiating fins 43.

The body, the heat dissipation fin 43, and the heat dissipation fin center 46 of the radiators 40 and 40-1 may be formed of a metal material having high thermal conductivity, for example, aluminum, so as to have good thermal conductivity, and may be formed by an extrusion molding method.

The LED module 30 is composed of a plurality of used as a light source of the lamp, coupled to the outer surface of the body of the radiator 40, 40-1, is composed of a plurality of LED mounted on the drive circuit 90 on the substrate, The LED module 30 is configured vertically so that the light emitted from the LED is emitted horizontally to enable horizontal illumination.

The LED module 30 includes a substrate on which a driving circuit 90 is formed so as to electrically connect the LED chip 31, and a plurality of LED chips attached to the driving circuit 90 on the substrate and electrically connected to each other ( 31).

 The substrate is made of a resin-based material that is commonly used and has the same planar shape as the outer circumferential circumferential surface of the radiators 40 and 40-1, and radiates heat generated from the LED chip 31 to the radiators 40 and 40-1. It is also possible to use a metal substrate with high thermal conductivity so that it can be delivered quickly.

The substrate is connected to a wire connected to a controller (not shown) to supply power and control the light emitting operation of the LED.

The heat dissipator 50 has a projecting portion slightly protruded while being spaced apart at regular intervals on the outer surface, the heat dissipator 50, the radiator 40, 40-1 and the diffusion cover 20 will be described below The socket 70 is inserted and coupled to the upper portion.

According to the present invention, a plurality of LED modules 30 are vertically configured to attach the side reflector to the top of the LED lamp while allowing the illumination in the lateral direction, that is, the horizontal direction, according to the bend and size of the side reflector. The range of illumination can be adjusted, and the length of the LED module 30 by sliding the LED module 30 is coupled between the LED module coupling grooves (44, 44-1) and the LED module coupling grooves (44, 44-1). Not limited to some extent, the compatibility of the LED module 30 and the workability of coupling the LED module 30 to the radiator 40, 40-1 is good.

The heat sink 50 is the upper side is open A cylindrical body is formed in the body and is formed inside the body and the air circulation port 51 is formed through the center and the partition wall 57 is formed integrally with the partition 57, protruding to the upper portion of the partition wall 57 and radiated heat The printed circuit board (PCB) fixed plate support part is spaced apart from the inner circumferential surface of the sieve 50 at a predetermined interval.

The partition 57 has a heat sink 50 in which a PCB fixing plate 60 on which a driving circuit 90 is mounted is seated, and an air circulation port 51 through which air passes through a lower portion of the barrier plate 57. ) Is formed in the center.

The partition wall 57 is formed at the bottom but is spaced apart at regular intervals from the bottom surface and integrally formed with the outer surface protruding inward toward the inside is formed in the air circulation port through which the air passes through.

The PCB fixing plate 60 is mounted inside the upper portion of the heat sink 50, and the PCB fixing plate 60 is spaced apart from the inner circumferential surface of the heat sink 50 at a predetermined interval within the heat sink 50 and the partition wall ( It is formed integrally at the upper surface of the 57 and protrudes upwardly from the partition wall 57 and is seated over the upper portion of the plurality of PCB fixing plate support 56 of a predetermined length spaced apart.

The PCB fixing plate 60 has a short cylindrical shape with one side sealed, and a hollow part is formed therein for mounting a driving circuit 90 for driving the LED.

The size of the PCB fixing plate 60 is configured to be smaller than the inner diameter of the heat sink 50 so that the outer circumferential surface of the PCB fixing plate 60 and the inner circumferential surface of the heat sink 50 are spaced apart at regular intervals, and the spaced apart portions are radiators 40. By forming the air circulation passage 52 through which the circulation air flowing out from the 40-1, 40-1) can be exhausted heat accumulated in the radiator (40, 40-1).

The PCB fixing plate 60 is configured inside the heat sink 50 so that heat generated from the LED module 30 is dissipated to the socket 70 through the heat sinks 40 and 40-1 and the heat sink 50. When it is blocked from being transmitted to the drive circuit 90 mounted inside the PCB fixing plate 60.

The PCB fixing plate 60 is seated on the PCB fixing plate support 56 so that the PCB fixing plate support 56 is spaced at a predetermined interval so that the circulating air flowing out of the radiators 40 and 40-1 is fixed to the PCB fixing plate 60. At the lower portion, the PCB is fixed to the socket 70 through the air circulation path 52 through the PCB fixing plate support 56 and the PCB fixing plate support 56.

The lower inner circumferential surface of the partition wall 57 in the radiator 50 extends integrally with the radiator coupling part 54 and the radiator coupling part 54 to which the radiators 40 and 40-1 are coupled, and the radiator coupling part ( The inner diameter is larger than that of 54, and is formed in two stages consisting of the diffusion cover coupling portion 53 to which the diffusion cover 20 described below is coupled.

The radiator coupling portion 54 has the same shape as the outer circumferential surface of the radiators 40 and 40-1 and has a polygonal inner circumferential surface. That is, when the radiators 40 and 40-1 have a hexagonal shape, they have a hexagonal inner peripheral surface.

The diffusion cover coupling portion 53 is also configured in the same shape as the upper outer peripheral surface shape of the diffusion cover 20, when the upper outer peripheral surface of the conversion cover is circular, the inner peripheral surface of the diffusion cover coupling portion 53 is also circular and these are screwed Can be combined

The diameter of the air circulation port 51 of the heat dissipator 50 is the heat dissipation fin center 46 so that the air circulation port 51 is not blocked when the outside air introduced into the heat dissipation fin 43 exits the heat dissipator 50. It is made larger than the diameter of.

The air circulation port 51 has the end of the air circulation port 51 at right angles to the partition wall 57 to reinforce the strength of the partition wall 57 and guide the circulating air flowing out from the radiators 40 and 40-1. It may be bent to protrude.

The driving circuit 90 for driving the LED is mounted inside the PCB fixing plate 60 to be mounted on the LED module 30. The driving circuit is mounted inside the PCB fixing plate 60 to fix the PCB fixing plate 60. It is configured to be electrically connected to the electrode formed on the upper side of the socket 70 from the inside, and the LED module 30 may be electrically connected through the wiring through the PCB fixing plate 60 and the heating element.

The socket 70 is connected to the upper portion of the heat sink 50, the electrode 72 is formed on one side to receive the driving power from the outside, the lower portion is open and consists of a hemispherical body formed with a hollow inside The body has a plurality of air outlets 71 formed therethrough.

The socket 70 has a screw thread or stepped portion 21 formed at a lower side thereof to be coupled to an upper end of the heat sink 50 along an inner diameter thereof, and an upper threaded thread along an outer diameter so as to receive driving power from the outside. The formed electrode 72 is formed.

The outside air flows into the radiator 40, 40-1, passes through the air circulation passage, passes through the inside of the radiator 50 and the socket 70, and then, through the air outlet 71 in the socket 70. The heat emitted from the LED is radiated to the outside.

Meanwhile, a cylindrical diffusion cover 20 having an air inlet 22 having an upper portion open and only a central portion thereof is formed outside the radiators 40 and 40-1 on which the LED module 30 is mounted. It is coupled to the heat sink (50).

The diffusion cover 20 has a cylindrical shape in which an upper part is opened, a lower part is opened through a part of the center, and an inlet for inflow of air is formed. A flange extending and integral with 21 is configured, wherein the inlet is formed in the flange.

Since the radiators 40 and 40-1 having the LED module 30 inserted therein are formed in the diffusion cover 20, the diffusion cover 20 is mounted at the front of the LED module 30 to be emitted from the LED chip 31. The incident light is diffused to the outside.

Unlike the discharge lamp of the LED chip 31, since the angle of light diffusion is small, the angle at which light is irradiated by mounting the diffusion cover 20 in front of the LED module 30, that is, the direction in which the light is emitted. This is to increase the area to be illuminated by expanding to obtain a more efficient lighting effect.

As the material of the diffusion cover 20, transparent acrylic, polycarbonate, or glass may be used to improve light transmittance, but opaque acrylic, polycarbonate, or glass may be used to prevent glare. Various colors of acrylic, polycarbonate or glass may be used to produce various lighting effects.

The diffusion cover 20 and the radiator 50 may be coupled to each other by a screw coupling or a ring-shaped fixing device.

The LED module 30 is seated on the outer circumferential surface of the radiator 40, 40-1, and then the radiator 40, 40-1, on which the LED module 30 is seated, is coupled to the diffusion cover 53 of the radiator 50. ) And then the upper portion of the diffusion cover 20 may be integrated into the diffusion cover coupling portion 53 of the heat sink 50.

In addition, a stopper 80 coupled to the front part of the diffusion cover 20 and having a plurality of stopper air inlets 82 spaced at regular intervals is formed, and the stopper 80 includes a diffusion cover 20. It serves to prevent the entry of foreign matter into the air circulation passage of the radiator (40, 40-1) inside.

The stopper 80 is a hemispherical plug hemisphere 81 is formed in the center and is composed of a flange flange 83 is formed of a flange protruding horizontally integrally to the edge of the plug hemisphere 81, the air inlet 22 ) Is composed of a plurality of spaced apart at regular intervals in the stopper hemisphere (81).

The stopper 80 and the diffusion cover 20 may be coupled to each other by forming a plurality of screw grooves in the stopper 80 and forming a female screw in a position corresponding to the screw groove in the diffusion cover 20.

External air introduced through the plug air inlet 82 formed in the plug hemisphere 81 in the assembled state of the present invention is introduced into the inlet of the diffusion cover 20 to provide an air circulation passage of the radiators 40 and 40-1. While passing through the upper and lower parts of the radiators 40 and 40-1 through 42 and 42-1, the LED module 30 is generated and heat-exchanged with the radiator body 45 and the radiator fin 43 to radiate the radiator body 45. And absorbs heat transferred to the heat dissipation fin 43.

The outside air absorbing heat passes through the air circulation passages 42 and 42-1 of the radiators 40 and 40-1, and flows into the air circulation port 51 of the radiator 50, thereby preventing the PCB fixing plate 60. On the lower side of the radiator 50 between the PCB fixing plate support 56 and the PCB fixing plate support 56 flows out into the air circulation path 52 and enters into the socket 70 to enter the air outlet 71 of the socket 70. Outflow through the outside.

Therefore, in the present invention, the LED module 30 is in close contact with the radiators 40 and 40-1, and the heat generated from the LED module 30 is directly transmitted to the radiators 40 and 40-1, and the radiators 40 and 40- are 1) The air circulation passage formed with the heat dissipation fins 43 is formed inside the heat dissipator 50, the driving circuit 90 and the socket 70 on the top of the heat dissipator 40, 40-1 in order to form a natural The condenser cools the radiators 40 and 40-1 and the drive circuit 90.

In addition, the present invention can extend the radiator (40, 40-1) and the LED module 30 even if the installation area of the LED lamp is limited, the number of the LED chip 31 is not limited, so the brightness of the LED lamp Can be adjusted.

As described above, in the detailed description of the present invention, specific embodiments have been described, but various modifications are possible without departing from the scope of the present invention. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be defined not only by the utility model registration claims described below, but also by those equivalent to the claims.

20: diffusion cover 21: step
22: air inlet 30: LED module
31: LED chip 40, 40-1: radiator
41, 41-1: LED module coupling protrusion 42, 42-1: air circulation passage
43, 43-1: heat sink fin 44, 44-1: LED module coupling groove
45: heat sink body 46: heat sink fin center
50: radiator 51: air circulation port
52: air circulation path 53: diffusion cover coupling portion
54: radiator coupler 56: PCB fixing plate support
57: partition 60: PCB fixing plate
70: socket 71: air outlet
72: electrode 80: plug
81: plug hemisphere 82: plug air inlet
83: plug flange 90: drive circuit

Claims (8)

In the LED lamp,
A polygonal radiator having a heat dissipation fin formed therein and an air circulation passage through which air is circulated;
A plurality of LED modules coupled to an outer surface of the body of the radiator and configured with a plurality of LEDs mounted on a driving circuit on a substrate;
A heat sink mounted at a lower portion of the heat sink;
A PCB fixing plate mounted inside the upper portion of the heat sink;
A driving circuit mounted inside the PCB fixing plate to drive an LED mounted on the LED module;
Consists of a socket connected to the upper portion of the heat sink and the electrode is formed on one side to receive a driving power from the outside,
Since the LED module is vertically configured, the light emitted from the LED is horizontally emitted to allow horizontal illumination, and outside air flows into the radiator, passes through the air circulation path, passes through the inside of the radiator and the socket, and then from the socket LED lamp which is discharged to the outside to radiate heat generated from the LED to the outside. The method of claim 1,
The LED lamp, characterized in that the cylindrical diffusion cover is formed on the outside of the radiator equipped with the LED module, the upper portion is opened and the lower portion is formed only the air inlet opening. The method of claim 1,
The radiator is a hollow portion is formed in the body, the radiating fin is formed on the inner surface of the body of the radiator, LED lamp, characterized in that a plurality of radially formed along the longitudinal direction of the radiator. The method of claim 1,
The radiator is composed of an LED module coupling protrusion in the longitudinal direction of the radiator on the outer edge of the polygon, the LED module coupling groove formed in the longitudinal groove on the side of the LED module coupling protrusion is configured, the LED module coupling groove and the LED LED lamp, characterized in that the LED module is slide coupled between the module coupling groove. The method of claim 1,
The heat dissipating body is formed inside the partition wall is formed through the air circulation port, and integrally formed in the partition wall protruding to the upper portion of the partition wall and the PCB fixing plate support portion spaced at regular intervals spaced apart from the inner peripheral surface of the heat sink LED lamp, characterized in that configured.
The method of claim 1,
The socket is an LED lamp, characterized in that the lower portion is open and composed of a hemispherical body having a hollow portion formed therein, the body is formed through a plurality of air outlets. The method of claim 2,
LED lamp, characterized in that the stopper is coupled to the front portion of the diffusion cover is formed with a stopper air inlet. The method of claim 3,
LED lamp, characterized in that the heat dissipation fin central portion is formed by combining the end of the heat dissipation fin integrally in the center of the hollow inside the body.

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