KR20110107630A - Light unit and display apparatus having thereof - Google Patents

Abstract

The embodiment relates to a light unit and a display device having the same.
Light unit according to the embodiment, the bottom cover having a receiving groove; A substrate disposed in the receiving groove of the bottom cover; A light emitting module including a plurality of light emitting diodes disposed on the substrate; And a transparent resin layer molded on the substrate to cover the plurality of light emitting diodes.

Description

LIGHT UNIT AND DISPLAY APPARATUS HAVING THEREOF}

The embodiment relates to a light unit and a display device having the same.

With the development of the electronics industry, various display devices are being developed that are small and have low energy consumption, and the liquid crystal display (LCD) that has appeared to reflect this trend has been spotlighted as a display device for a monitor, a TV, and a mobile communication terminal.

Since the liquid crystal display does not spontaneously generate light, it is common to have a backlight composed of a light source that generates light at the back of the LCD panel. In this case, the backlight generates white light so that the color of the image implemented by the LCD panel can be reproduced close to the actual color.

The embodiment provides a light unit having a new structure and a display device having the same.

The embodiment provides a light unit including a resin layer molded on an almost upper surface of a substrate on which a plurality of light emitting diodes are mounted, and a display device having the same.

Light unit according to the embodiment, the bottom cover having a receiving groove; A substrate disposed in the receiving groove of the bottom cover; A light emitting module including a plurality of light emitting diodes disposed on the substrate; And a transparent resin layer molded on the substrate to cover the plurality of light emitting diodes.

The light unit according to the embodiment may include a bottom cover having an accommodation groove and an insulating layer and a metal pattern; A plurality of light emitting diodes mounted in the accommodation grooves of the bottom cover; And a resin layer molded to a thickness covering the plurality of light emitting diodes on the bottom cover.

According to an exemplary embodiment, a display device includes a bottom cover; A light emitting module disposed on the bottom cover and including a substrate and a plurality of light emitting diodes arranged on the substrate; A transmissive resin layer molded on the substrate to cover a plurality of light emitting diodes; An optical sheet on the resin layer; And a display panel on the optical sheet.

The embodiment can improve the light efficiency of the light unit.

The embodiment can reduce the brightness loss in the light unit.

The embodiment has the effect of removing the air gap between the substrate and the resin layer of the light emitting module.

The embodiment can provide a light unit that does not have a light guide plate.

The embodiment can provide a light unit having a uniform color distribution.

The embodiment can improve the reliability of the light unit.

1 is a diagram illustrating a display apparatus according to a first embodiment.
2 is another side cross-sectional view of FIG. 1.
3 is a diagram illustrating a display device according to a second embodiment.
4 is a diagram illustrating a display device according to a third embodiment.
5 is a diagram illustrating a display device according to a fourth embodiment.
6 is a view illustrating a light unit of a display apparatus according to a fifth embodiment.
7 and 8 are views showing an example of forming a resin layer on a substrate according to the embodiment.

Hereinafter, with reference to the accompanying drawings as follows. In the description of the embodiment, the thickness of each component is an example and is not limited to the thickness of the drawings. In addition, the position above or below each component will be referred to the drawings.

1 is a side cross-sectional view illustrating a display device according to a first embodiment, and FIG. 2 is a cross-sectional view of another side of FIG. 1.

1 and 2, the display apparatus 100 includes a bottom cover 110, a light emitting module 120, a resin layer 140, an optical sheet 150, and a display panel 160.

The bottom cover 110 may include a metal material. For example, aluminum (Al), magnesium (Mg), zinc (Zn), titanium (Ti), tantalum (Ta), hafnium (Hf), and niobium (Nb) and the like.

A plurality of light emitting modules 120 are arranged in the bottom cover 110, and the plurality of light emitting modules 120 is arranged in an inner bottom surface of the bottom cover 110 by M rows * N columns (M> 1, N> Are arranged as 1).

The bottom cover 110 has an inclined side surface 112 disposed around the bottom cover 110, and an accommodation groove 111 may be formed therein by the side surface 112. Here, the side surface 112 may be formed perpendicular to the bottom surface of the bottom cover 110, and the bottom cover 110 and the side surface 112 may be made of different materials assembly, It is not limited to. A reflective material (eg, Ag) may be coated on the inner side of the bottom cover 110.

The light emitting module 120 may include a substrate 121 and a plurality of light emitting diodes 125, and the substrate 121 may selectively use a single layer PCB, a multilayer PCB, a ceramic substrate, a metal core PCB, or the like. A wiring pattern (not shown) or a plated pattern having a predetermined pattern may be formed on the substrate 121 to supply power, but is not limited thereto.

A plurality of light emitting diodes 125 are mounted on the substrate 121. The light emitting diode 125 may be mounted in a chip form (COB) on the substrate 121 or in a package form (POB) on the substrate 121. In the present embodiment, a structure mounted in a package form will be described as an example.

In addition, an upper portion of the substrate 121 may be a flat plane or a plurality of cavities (not shown), and at least one light emitting diode 125 and the transparent resin may be disposed in the cavity. It does not limit to this. Hereinafter, a structure in which the upper portion of the substrate 121 is flat will be described as an example.

The light emitting diodes 125 are arranged in a structure in which a plurality of the light emitting diodes 125 are arranged in the transverse direction and / or the longitudinal direction, and may be arranged in a matrix form or a zigzag form, and the arrangement form may vary depending on the substrate size. Can be.

The plurality of light emitting diodes 125 may be arranged on the substrate 121 at predetermined intervals, but is not limited thereto.

An upper surface of the substrate 121 may be coated with a reflective layer, for example, white PSR (PHOTO SOLDER RESIST) ink, or a reflective material (for example, a reflective sheet) may be disposed on an area except for the region where the light emitting diode 125 is disposed. The reflective layer may reflect incident light. The plurality of light emitting diodes 125 may be connected in series with each other, or may be connected in parallel with each other. Such a connection method may vary according to a circuit pattern and a driving method.

The light emitting diode 125 may include at least one kind of LEDs such as a blue LED, a green LED, a red LED, an ultra violet (UV) LED, and the like. It describes with the blue LED or white LED which generate | occur | produces. The light emitting diodes 125 may be arranged in a multi rank, and the multi ranks may be arranged to match a target chromaticity through mixing of at least two adjacent light emitting diodes 125. In this case, the yield of the light emitting diodes 125 may be improved.

A translucent resin layer (hereinafter, abbreviated as a resin layer) 140 is formed on the substrate 121. The resin layer 140 may be made of a transparent resin such as silicon or epoxy. The resin layer 140 may be formed to have a predetermined thickness for light efficiency and light distribution. For example, the resin layer 140 may be formed to have a thickness of 100 μm or more from the top surface of the substrate 121 or more than the thickness of the light emitting diode 125. The resin layer 140 may be formed of 80% or more of the entire upper surface of the substrate 121.

At least one kind of phosphor may be added to the resin layer 140, and at least one kind of the phosphor, red phosphor, green phosphor, blue phosphor, etc. may be added, but is not limited thereto.

Since the resin layer 140 is molded on almost the entire upper surface of the substrate 121, the copper foil pattern exposed on the surface of the substrate 121 may be prevented from being oxidized or moisture penetration may be prevented.

The substrate 121 may be fixed to the bottom surface of the bottom cover 110 by a fastening means such as an adhesive or a screw, but is not limited thereto.

The upper surface of the resin layer 140 may be formed as a flat upper surface. The light transmittance may be adjusted according to the thickness and the material of the resin layer 140, and the thickness and the material may be changed within the technical scope of the embodiment.

According to an embodiment, a photo conversion fluorescent film (PLF) may be disposed between the resin layer 140 and the optical sheet 150 or the display panel 160. Some of the light emitted from 125 is converted into light of a different wavelength.

The optical sheet 150 is disposed on the bottom cover 110 and includes at least one optical sheet 150. The optical sheet 150 may be spaced apart from or in close contact with the resin layer 140. The optical sheet 150 may selectively include a diffusion sheet, a prism sheet, a brightness enhancement sheet, and the like, wherein the diffusion sheet diffuses the light emitted from the light emitting diodes 125, and the prism sheet is the diffusion sheet. Guided light to the light emitting area. Here, the brightness enhancement sheet enhances the brightness.

The bottom cover 110, the light emitting module 120, and the resin layer 140 may function as a light unit, and the light unit may provide target light, for example, light required by the display panel 160. do. The light unit may implement local dimming according to a driving method of the plurality of light emitting modules 120, but is not limited thereto.

A display panel (eg, an LCD panel) 160 is positioned on the optical sheet 150 to display information by using light emitted to the optical sheet 150. The display panel 160 may be implemented as, for example, a liquid crystal panel in which a pair of substrates having transparent electrodes formed on surfaces facing each other with a liquid crystal layer interposed therebetween are bonded to each other. The light transmittance is changed by artificially adjusting the arrangement direction of liquid crystal molecules according to the electric field size between the transparent electrodes. The display panel 160 may include polarizers on one or both surfaces thereof, but is not limited thereto.

The resin layer 140 may be molded to a uniform thickness on the substrate 121 to perform a light guide plate function, and may improve light extraction efficiency by removing an air gap between the substrate 121 and the substrate 121. have. In addition, a fixing protrusion such as a hook protrusion or a screw may protrude from the substrate 121, and the fixing protrusion may be combined with the resin layer 140, and the resin layer 140 may be separated from the substrate 121. The separation can be prevented.

The optical sheet 150 may be supported by the sheet support protrusion 155. The sheet support protrusion 155 may be coupled to the bottom surface of the substrate 121 or the bottom cover 110, and the height of the sheet support protrusion 155 may be formed such that the optical sheet 150 is not struck.

The bottom coupling structure of the seat support protrusion 155 may be coupled to a fastening member such as a screw, a hook, and a locking protrusion, but is not limited thereto. Here, the sheet support protrusion 155 may be formed to integrally protrude on the resin layer 140, but is not limited thereto.

The sheet support protrusion 155 may be formed of a material such as a reflector or a transmissive body, and the shape of the sheet support protrusion 155 may be formed in a horn shape or a pillar shape, but is not limited thereto.

3 is a diagram illustrating a display device according to a second embodiment. In describing the second embodiment, the same parts as in the first embodiment are referred to the first embodiment, and redundant description thereof will be omitted.

Referring to FIG. 3, in the display apparatus 101, an upper surface 141A of the resin layer 140 is formed in a lens shape. The lens shape of the upper surface 140A may be, for example, an array of convex lens shapes having a predetermined period, and lenses having a predetermined diameter may be formed in a matrix shape or a stripe shape. The spacing B between the lenses may be disposed as the spacing A of the light emitting diodes 125, and the spacing B may vary depending on the direction angle distribution of the light emitting diodes 125. Here, one or a plurality of light emitting diodes 125 may be disposed under each lens, but is not limited thereto.

 Here, the boundary line between the lenses may be formed to be disposed between the light emitting diodes 125, and the distance between the lenses may be changed according to light extraction efficiency and light distribution. In addition, the intervals A and B between the lens and the light emitting diode 125 may be formed at the same period from the light emitting diode 125, but the present invention is not limited thereto.

An optical sheet may be disposed or removed between the display panel 160 and the resin layer 140, but is not limited thereto. For example, when the light distribution by the resin layer 140 is uniform over the entire region, the diffusion sheet or the like can be removed.

4 is a diagram illustrating a display device according to a third embodiment. In the description of the third embodiment, the same parts as those of the first embodiment will be referred to the first embodiment.

Referring to FIG. 4, the display device 102 has a plurality of resin layers 142 and 144 stacked on the bottom cover 110. The first resin layer 142 is formed to have a uniform thickness on the substrate 121 of the light emitting module 120, and the second resin layer 144 has a lens shape on the first resin layer 142. Can be.

The first resin layer 142 and the second resin layer 144 may include one or more kinds of transparent material particles, and the transparent material particles are particles having a refractive index higher than the refractive index of the resin, for example, 1.5 or more. , GaP (n = 3.5), Si (n = 3.4), TiO ₂ (n = 2.9), SrTiO ₃ (n = 2.5), SiC (n = 2.7), cubic or amorphous carbon (n = 2.4), carbon nano tube

(n = 2.0) ZnO (n = 2.0), AlGaInP (n = 3.4), AlGaAs (n = 2.8 ~ 3.2), SiN (n = 2.2 ~ 2.3), SiON (n = 2.2), ITO (n = 1.8 ~ 1.9), SiGe (n = 2.8 to 3.2), AlN (n = 2.2) and GaN (n = 2.4) can be selected and used.

The first resin layer 142 or the second resin layer 144 may be formed to have different refractive indices by selectively adding the transparent material particles. For example, when the transparent material particles are added to the first resin layer 142, the refractive index of the second resin layer 144 may be lower than that of the first resin layer 142. The refractive index may be arranged to be lowered in the order of the first resin layer 142 to the second resin layer 144. Light emitted from the light emitting diode 125 may pass through the first resin layer 142 and may be emitted to the outside through the second resin layer 144.

The first resin layer 142 and the second resin layer 144 may be formed of materials having different densities, but are not limited thereto.

In addition, phosphors may be added to the first resin layer 142 or the second resin layer 144. For example, a phosphor is added to the first resin layer 142 to convert a portion of the light emitted from the light emitting diodes 125 into wavelength conversion.

When the first resin layer 142 and the second resin layer 144 are disposed, the light guide plate may be removed and an air gap between the substrate 121 and the first resin layer 142 may be removed. .

The second resin layer 144 may have a flat top surface or a lens shape, and may adjust light uniformity according to the shape change.

In addition, at least one kind of phosphor, a scattering agent, and the like may be selectively added to at least one of the first resin layer 142 and the second resin layer 144.

The thickness of the first resin layer 142 may be formed to have a thickness that covers the light emitting diode 125 or a thickness lower than an upper end of a wire of the light emitting diode 125 mounted in a chip form. The thickness of the first resin layer 142 may enhance the adhesion of the wire.

5 is a diagram illustrating a display device according to a fourth embodiment. In the description of the fourth embodiment, the same parts as in the first embodiment will be described with reference to the first embodiment, and redundant description thereof will be omitted.

Referring to FIG. 5, the display apparatus 103 includes a light emitting diode 125 mounted on the bottom cover 110B. That is, the light emitting module may include a bottom cover 110B having a light emitting diode 125 and a receiving groove 111.

The bottom cover 110B uses, for example, a metal substrate such as a metal core substrate (MCPCB), and has an insulating layer and a metal pattern formed thereon, and a metal plate formed thereon. The light emitting diode 125 may be mounted on the metal pattern.

The bottom cover 110B may have the light emitting diode 125 mounted in a chip form or a package form to serve as a substrate and a cover. Accordingly, the substrate as shown in FIG. 1 can be removed.

The metal plate of the bottom cover 110B may efficiently radiate heat emitted from the light emitting diodes 125.

A resin layer 140 is molded on the bottom surface of the bottom cover 110B to cover the plurality of light emitting diodes 125, and the resin layer 140 is 100 μm or more based on the bottom cover 110B. It may be formed in a thickness.

The resin layer 140 may optionally include phosphors, scattering agents, transparent material particles, and the like, but is not limited thereto.

6 is a view illustrating a light unit of a display apparatus according to a fifth embodiment. In the description of the fifth embodiment, the same parts as those of the first embodiment will be described with reference to the first embodiment, and redundant description thereof will be omitted.

Referring to FIG. 6, the display device 104 includes a light unit of a side view type.

The light emitting module 120 includes a substrate 121 and a light emitting diode 125 mounted on one side of the substrate 121. The substrate 121 may be a flexible substrate or a metal PCB, a general PCB, or the like.

A resin layer 140 is formed on one side of the substrate 121, and the resin layer 140 is formed to about 80% of one side of the substrate 121 to mold the plurality of light emitting diodes 125. .

The light exit surface of the resin layer 140 may be flat or include a lens shape. The resin layer 140 emits light toward one side of the light guide plate 170, and the light guide plate 170 guides and reflects the light incident to the resin layer 140 to the entire area to face the light exit surface. The light source is emitted.

The light guide plate 170 may be formed of, for example, acrylic resin (PMMA), and the like, and the material may be changed within the technical scope of the embodiment.

The light guide plate 170 and the light emitting module 120 may be accommodated in a bottom cover, which is not shown, but is not limited thereto.

7 and 8 are views illustrating an example in which a resin layer is formed on a substrate according to an embodiment.

Referring to FIG. 7, the resin layer 140 is molded to a predetermined thickness on the injection molding 181, and then the light emitting diode 125 mounted below the substrate 121 is pressed in the direction of the resin layer 140. do. In this state, the resin layer 140 is cured, and the resin layer 140 is separated from the injection molded product 181.

Referring to FIG. 8, the injection molding 182 is placed in close contact with the substrate 121, and then a resin material is injected through the injection hole 183 disposed at one side of the injection molding 182. After this process, the resin layer 140 is cured, and the injection molded product 182 is separated to manufacture the light emitting module 120.

The resin layer 140 may be integrally molded on the substrate 121 of the light emitting module 120 to improve light extraction efficiency.

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in each embodiment may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

Although the above description has been made based on the embodiments, these are merely examples and are not intended to limit the present invention. Those skilled in the art to which the present invention pertains may not have been exemplified above without departing from the essential characteristics of the present embodiments. It will be appreciated that many variations and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

100, 101, 102, 103, 104: display device, 110, 110B: bottom cover, 120: light emitting module, 121: substrate, 125: light emitting diode, 140: resin layer, 142: first resin layer, 144: second resin layer, 150: optical sheet, 160 : Display panel, 155: Seat support protrusion

Claims (15)

A bottom cover having a receiving groove;
A substrate disposed in the receiving groove of the bottom cover; A light emitting module including a plurality of light emitting diodes disposed on the substrate; And
And a light transmitting resin layer molded on the substrate to cover the plurality of light emitting diodes. A bottom cover having a receiving groove and having an insulating layer and a metal pattern;
A plurality of light emitting diodes mounted in the accommodation grooves of the bottom cover; And
The light unit is molded to a thickness covering the plurality of light emitting diodes on the bottom cover. The light unit according to claim 1 or 2, wherein the resin layer comprises a transparent epoxy or silicon. The light unit according to claim 1 or 2, wherein the resin layer includes a plurality of sheet support protrusions protruding in a direction perpendicular to the bottom surface of the bottom cover. The light unit of claim 1 or 2, further comprising a plurality of sheet support protrusions protruding from the bottom cover. The method of claim 1, wherein the resin layer comprises: a first resin layer on the plurality of light emitting diodes; And a second resin layer on the first resin layer, the second resin layer having a refractive index different from that of the first resin layer. The light unit of claim 6, wherein the second resin layer has a refractive index lower than that of the first resin layer. The light unit according to claim 1 or 2, wherein the upper surface of the resin layer includes lens shapes arranged at intervals of the light emitting diodes. The light unit of claim 1, wherein the resin layer is molded to 80% or more of the entire upper surface of the substrate. The light unit of claim 1 or 2, further comprising a reflective material formed around the light emitting diode. The light unit according to claim 1 or 2, wherein the resin layer contains at least one of a phosphor, a scattering agent, and transparent material particles. The light unit according to claim 1 or 2, comprising a plurality of light conversion fluorescent films, diffusion sheets, prism sheets, and brightness enhancement sheets on the resin layer. According to claim 1, wherein the plurality of light emitting diodes each chip is bonded to the substrate by a wire,
The resin layer includes a first resin layer having a thickness lower than an uppermost end of the wire and a second resin layer having a thickness covering the wire on the first resin layer. Bottom cover;
A light emitting module disposed on the bottom cover and including a substrate and a plurality of light emitting diodes arranged on one side of the substrate;
A transmissive resin layer molded on one side of the substrate to cover a plurality of light emitting diodes;
An optical member on one side of the resin layer; And
And a display panel on the optical sheet. The display apparatus of claim 14, wherein the optical member comprises at least one of a prism sheet, a diffusion sheet, a brightness enhancement sheet, a light conversion fluorescent film, and a light guide plate.

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