KR20110037508A - Apparatus and method for processing substrate - Google Patents
Apparatus and method for processing substrate Download PDFInfo
- Publication number
- KR20110037508A KR20110037508A KR1020090094986A KR20090094986A KR20110037508A KR 20110037508 A KR20110037508 A KR 20110037508A KR 1020090094986 A KR1020090094986 A KR 1020090094986A KR 20090094986 A KR20090094986 A KR 20090094986A KR 20110037508 A KR20110037508 A KR 20110037508A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- loading
- transfer means
- horizontal
- horizontal transfer
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention is to provide a substrate processing apparatus that can reduce the tack time by having a horizontal transfer means for loading and unloading.
The present invention for implementing this, the horizontal transfer means for loading 200 taking over the substrate from the outside and the unloading horizontal transfer means 200 'for taking over the processed substrate to the outside; Shanghai transport means (300) for receiving the substrate from the horizontal transport means for loading (200) or take over the substrate to the unloading horizontal transport means (200 '); And a lower transfer means 400 which receives the substrate from the shanghai transfer means 300 and transfers the substrate to the substrate processing unit 500.
Description
The present invention relates to a substrate processing apparatus and a substrate processing method, and more particularly, to a substrate processing apparatus and a substrate processing method that can reduce the tack time according to the processing of the substrate.
In general, a flat panel display manufacturing process, such as the deposition of a thin film, the formation of a mask, the etching, etc. are selectively repeated on a large glass substrate to manufacture the devices required. In the process of such a process, a cleaning process is performed to remove foreign substances from the substrate before, after, or before and after the process.
In order to shorten the overall manufacturing process time, it is necessary to minimize the moving distance of the substrate. For this purpose, a device is used to withdraw a substrate from a cassette including a plurality of substrates using a single transfer robot, and then perform a specific process again. There is a need to load and unload substrates in sequence over and over.
That is, the substrate taken out from the cassette is supplied to the first processing apparatus using a single transfer robot, the substrate which has been processed by the first processing apparatus is again supplied to the second processing apparatus, and then the process is performed at the second processing apparatus. A method of storing the finished substrate back in the cassette has been proposed.
As an example of such a device, Korean Patent No. 500170, "Horizontal and vertical conveying apparatus of substrate," has been proposed.
The Republic of Korea Patent No. 500170 is a horizontal transfer means for transporting the loaded substrate in the horizontal direction after the substrate withdrawal from the cassette is loaded, disposed on the frame so that it can be lifted / lowered and the substrate processing by taking the substrate from the horizontal transfer means Disclosed is a vertical conveying means for supplying a unit, and a conveying unit disposed between the vertical conveying means and the substrate processing unit to receive and convey a substrate from the vertical conveying means.
The horizontal conveying means is provided with a sliding plate and a rail for horizontally transporting the substrate, and an upper base and a lower base are provided on an upper portion of the sliding plate.
According to this structure, since the substrate is loaded from the outside by one horizontal conveying means or the substrate is unloaded to the outside, when the horizontal conveying means loads the substrate, the unloading operation of the substrate which has been processed cannot be performed. There was a problem of increasing time.
In addition, since the height of the rail is located higher than the substrate transfer line of the substrate processing unit, particles are generated when the upper base and the lower base slide on the sliding plate, and these particles are attached to the surface of the substrate. .
The present invention has been made to solve the above-mentioned problems, and to provide a substrate processing apparatus that can reduce the tack time by having a horizontal transfer means for loading and unloading.
Another object of the present invention is to provide a substrate processing apparatus capable of preventing particles from adhering to a substrate by placing a driving portion for transferring the substrate on the substrate transport line side of the substrate processing unit or under the substrate. There is this.
Substrate processing apparatus of the present invention for achieving the above object, the horizontal transfer means 200 for receiving the substrate from the outside and the unloading horizontal transfer means 200 'for taking over the processed substrate to the outside. ; Shanghai transport means (300) for receiving the substrate from the horizontal transport means for loading (200) or take over the substrate to the unloading horizontal transport means (200 '); And a lower transfer means 400 which receives the substrate from the shanghai transfer means 300 and transfers the substrate to the
The substrate processing method of the present invention comprises the steps of: a) loading the substrate from the outside at the same time as the substrate is loaded in the horizontal transfer means 200 for loading the unloading from the horizontal transfer means (200 ') for unloading; b) transferring the substrate by the loading horizontal transfer means 200 in a direction opposite to the substrate transport direction of the
According to the present invention, it is possible to simultaneously process loading and unloading of the substrate, thereby reducing the substrate processing time, and preventing particles from the components of the driving unit from being attached to the substrate.
Hereinafter, the configuration and operation of the preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.
1 is a perspective view showing a substrate processing apparatus of the present invention, Figure 2 is a front view showing a substrate processing apparatus of the present invention, Figure 3 is a right side view showing a substrate processing apparatus of the present invention.
Substrate processing apparatus of the present invention, the
The horizontal transfer means 200 transfers the
The
In addition, the
The driving unit may provide a driving force for horizontally moving the
The
The driving unit may be installed at both sides of the
However, in order to reduce the installation area and simplify the structure, the driving unit may be installed on only one side of the
That is, the
When the substrate is horizontally transferred by the horizontal transfer means 200, the transferred substrate is taken over by the vertical transfer means 300.
The
Here, the 'horizontal direction' means a direction perpendicular to the moving direction of the horizontal transfer means 200.
The
The
The horizontal and vertical driving means may be a cylinder or a motor.
The slide rails of the
Meanwhile, in the present invention, the center line of the substrate loaded on the
Therefore, in order to receive the substrate from the horizontal conveying means 200 and move it downward by the
When the substrate is transferred downward by the vertical transfer means 300, the transferred substrate is taken over by the lower transfer means 400.
The lower conveying means 400 is composed of a plurality of large diameter rollers and driving means for driving the rollers.
In order to avoid interference with the
On the opposite side of the horizontal conveying means 200, the vertical conveying means 300, and the lower conveying means 400 with the
Since the lower conveying means 400 'and the vertical conveying means 300' have the same configuration as the lower conveying means 400 and the upper and lower conveying means 300, detailed description thereof will be omitted.
The horizontal transfer means 200 may be configured to include only one horizontal transfer means 200 to load the substrate from the outside or to unload the substrate having been processed. However, in this case, the loading and unloading of the substrate cannot be performed at the same time. Therefore, when the loading of the substrate is performed, the substrate to be unloaded should wait. Loss occurs.
Therefore, in the present embodiment, the loading horizontal transfer means 200 and the unloading horizontal transfer means 200 ′ are provided so that the loading and unloading of the substrate can be simultaneously performed.
The unloading horizontal transfer means 200 ′ includes a
The substrate loading portion 210 'of the unloading horizontal transfer means 200' has a 'c' shape, and the substrate of the loading horizontal transfer means 200 in a space between the 'c' shape. The height of the
With this structure, the
In addition, the
The driving unit may horizontally move the
In order to prevent particles generated during operation of the
In this embodiment, the loading horizontal transfer means 200 and the unloading horizontal transfer means 200 'are configured to move independently, but the loading horizontal transfer means 200 and the unloading horizontal transfer means ( 200 ') may be configured in a structure that is integrally connected to each other to move at the same time.
Hereinafter, an operation of the substrate processing apparatus of the present invention will be described with reference to FIGS. 4 to 11.
4 is a front view showing a state in which the substrate is horizontally transferred by the horizontal transfer means for loading, FIG. 5 is a side view of the substrate processing apparatus shown in FIG. 4 from the right, and FIG. 6 is a state in which the upper and lower transfer means take over the substrate. 7 is a front view showing a state where the substrate is lowered by the up and down conveying means, FIG. 8 is a side view of the substrate processing apparatus shown in FIG. 7 from the right, and FIG. 9 is after passing through the substrate processing unit. 10 is a front view showing a state in which the substrate is transferred by the lower transfer means, Figure 10 is a front view showing the process of taking over the substrate from the lower transfer means to the horizontal transfer means for unloading, Figure 11 is a horizontal transfer means for the unloading substrate This is a front view showing the state moved to the unloading position by acquiring.
First, when the substrate is taken over by the robot from the outside into the substrate processing apparatus of the present invention, the substrate is loaded in the horizontal transfer means 200 for loading as shown in FIG.
In this state, when the substrate is transferred in the horizontal direction along the
Subsequently, the substrate is handed over from the horizontal conveying means 200 to the vertical conveying means 300 as shown in FIG. 6, and after the substrate is turned over to the vertical conveying means 300, the upper and lower parts as shown in FIG. 7. The transfer means 300 descends the substrate and takes over the lower transfer means 400.
As described above, the substrate is lowered by the vertical transfer means 300 in a diagonal direction as shown in FIG. 8. That is, since the center line of the substrate transferred by the upper transfer means 200 is eccentric to one side with respect to the center line in the direction in which the substrate is conveyed from the
In this case, by controlling the
The substrate transferred onto the roller of the lower conveying
Thereafter, as shown in FIGS. 10 and 11, the substrate is transferred diagonally upward by the vertical conveying means 300 ′, and is taken over by the unloading horizontal conveying means 200 ′, and then the substrate is taken out to the external robot. .
On the other hand, the horizontal transfer means 200 for loading and the horizontal transfer means 200 'for unloading have different heights of the
1 is a perspective view showing a substrate processing apparatus of the present invention;
2 is a front view showing a substrate processing apparatus of the present invention;
3 is a right side view showing the substrate treating apparatus of the present invention;
4 is a front view showing a state in which the substrate is horizontally transported by the horizontal transport means for loading;
FIG. 5 is a side view of the substrate treating apparatus shown in FIG. 4 viewed from the right side; FIG.
6 is a front view showing a state in which the up and down transfer means take over the substrate;
7 is a front view showing a state where the substrate is lowered by the vertical transfer means,
8 is a side view of the substrate processing apparatus shown in FIG. 7 seen from the right side;
9 is a front view showing a state in which the substrate is transferred by the lower transfer means after passing through the substrate processing unit,
10 is a front view showing a process of taking over the substrate from the lower transfer means to the horizontal transfer means for unloading,
Figure 11 is a front view showing a state in which the unloading horizontal transfer means has taken over the substrate and moved to the unloading position.
Explanation of symbols on the main parts of the drawings
100:
210, 210 ':
230, 230 ': Slide rail 300: vertical conveying means
310: arm 320: horizontal drive unit
330: up and down drive unit 400: lower transfer means
500: substrate processing unit
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090094986A KR20110037508A (en) | 2009-10-07 | 2009-10-07 | Apparatus and method for processing substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090094986A KR20110037508A (en) | 2009-10-07 | 2009-10-07 | Apparatus and method for processing substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20110037508A true KR20110037508A (en) | 2011-04-13 |
Family
ID=44044972
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020090094986A KR20110037508A (en) | 2009-10-07 | 2009-10-07 | Apparatus and method for processing substrate |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR20110037508A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101347200B1 (en) * | 2011-12-07 | 2014-01-10 | 주식회사 케이씨텍 | Substrate processing device capable of self-testing |
CN111483810A (en) * | 2020-04-16 | 2020-08-04 | 林杰 | Intelligent detection equipment for glass |
-
2009
- 2009-10-07 KR KR1020090094986A patent/KR20110037508A/en not_active Application Discontinuation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101347200B1 (en) * | 2011-12-07 | 2014-01-10 | 주식회사 케이씨텍 | Substrate processing device capable of self-testing |
CN111483810A (en) * | 2020-04-16 | 2020-08-04 | 林杰 | Intelligent detection equipment for glass |
CN111483810B (en) * | 2020-04-16 | 2021-02-19 | 林杰 | Intelligent detection equipment for glass |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4744427B2 (en) | Substrate processing equipment | |
JP5152469B2 (en) | Substrate transfer device | |
JP4969138B2 (en) | Substrate processing equipment | |
KR20070116745A (en) | Apparatus and method for receiving and transferring glass substrate plates | |
JP2008100774A (en) | Conveying carrier and method for transferring article to be conveyed by the conveying carrier | |
KR100962362B1 (en) | apparatus for cleaning substrate | |
JP2007039157A (en) | Conveying device, vacuum treatment device and conveying method | |
WO2008068845A1 (en) | Pallet conveyance device and substrate inspection device | |
KR20110037508A (en) | Apparatus and method for processing substrate | |
KR102141200B1 (en) | Transfer robot and transfer apparatus including the same | |
KR101179563B1 (en) | Apparatus and method for processing substrate | |
JP2005064431A (en) | Apparatus and method for substrate transfer | |
JP4633294B2 (en) | Transfer robot transfer type transfer device and transfer robot transfer method | |
JP3862514B2 (en) | Work conveying apparatus and work conveying method | |
KR102189275B1 (en) | Transfer robot and transfer apparatus including the same | |
JPH10310240A (en) | Substrate processing device and substrate processing method | |
JP4282379B2 (en) | Wafer inspection equipment | |
KR101069154B1 (en) | Apparatus for processing substrate | |
JPWO2008129603A1 (en) | Substrate transfer system | |
JP2000124288A (en) | Board carrying method and board carrier | |
JP5688838B2 (en) | Substrate processing equipment | |
KR101198239B1 (en) | Processing apparatus for large area substrate | |
KR101199441B1 (en) | Treatment device for substrate | |
KR101553611B1 (en) | A buffer for inline printing system | |
CN210837694U (en) | Substrate transfer mechanism and substrate processing apparatus |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |