KR20100071658A - Apparatus for depositing thin film - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin film deposition apparatus, comprising: a first transfer unit for horizontally moving a transfer tray on which a substrate is placed in a horizontal direction; at least two target units and at least two targets provided in an area facing the first transfer unit; Provided is a thin film deposition apparatus including a process chamber including an exhaust portion provided between portions.

As described above, the present invention can prevent the deflection of the substrate by moving the transfer tray in which the substrate is placed in the horizontal direction from the inside of the chamber through the transfer part, and deposit a uniform thin film on the large-area substrate.

Description

Thin film deposition apparatus {APPARATUS FOR DEPOSITING THIN FILM}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin film deposition apparatus, and to a thin film deposition apparatus capable of simultaneously depositing different thin films on a substrate that is prevented from sagging and moves through sputtering.

Generally, a sputtering apparatus is used to fabricate a metal layer for fabricating a solar cell device.

Such a sputter device places a substrate in a chamber and places a target at an opposite position of the substrate. Subsequently, the target is irradiated with ions or neutral particles to cause atoms of the target to pop out. Protruding atoms adhere to the substrate and are deposited.

The conventional sputtering apparatus used a vertical type. That is, the target is disposed on the side of the chamber, and the substrate corresponding thereto is disposed in the vertical direction. However, in this case, the point of the substrate occurs, the device configuration for standing the substrate vertically had a disadvantage.

In addition, as the size of the substrate is increased, there is a disadvantage in that the uniformity of the metal thin film deposited is inferior. That is, a problem arises in that the thin film thickness in the immediately lower region of the target becomes thicker than other regions.

Recently, a target or a substrate has been moved to improve thin film uniformity. However, in order to apply this, the substrate or target must be moved vertically up and down in the conventional vertical type device. However, due to the increase in the weight of the substrate due to the increase in the size of the substrate, the device configuration for moving the substrate vertically up and down becomes complicated. In addition, due to an increase in the weight of the substrate, a problem that the deflection phenomenon of the substrate is further intensified.

In order to solve the problems described above, the substrate can be moved horizontally to improve the uniformity of the thin film deposited on the substrate and prevent the deflection of the substrate. Provided is a thin film deposition apparatus capable of being deposited.

A first transfer part for horizontally moving the transfer tray in which the substrate is placed according to the present invention horizontally in the front-rear direction, at least two target portion provided in an area facing the first transfer portion, and an exhaust portion provided between the at least two target portions. It provides a thin film deposition apparatus comprising a process chamber comprising.

A transfer tray connected to the process chamber and provided from the outside to the process chamber, the inlet chamber receiving the transfer tray from the process chamber and discharging it to the outside, and connected to the process chamber from the process chamber Preferably it includes a buffer chamber for temporarily storing the provided transfer tray and providing it back to the process chamber.

The entrance chamber includes a second transfer part for horizontally moving the transfer tray in the front-rear direction, and heating means for heating the substrate on the transfer tray, and it is effective to use a conveyor as the second transfer part.

The buffer chamber includes a third transfer part for horizontally moving the transfer tray in the front-rear direction, and it is effective to use a conveyor as the third transfer part.

The process chamber includes a first target portion located in an area adjacent to the entrance chamber, a second target portion located in an area adjacent to the buffer chamber, and the first and second target portions respectively include first and second targets, ions and It is possible to have a first and a second power supply for providing a sputter power for generating neutral particles.

At least one of Al, Nd, Ag, Ti, Ta, Mo, Cr, Mo, W, and Cu may be used as the first and second targets.

It is effective to use different materials for the first target and the second target.

The exhaust part may be provided in a space between the first and second target parts, and the first and second exhaust parts may be provided in both side regions of the first and second target parts.

A separator may be further provided in a space between the first and second target parts and the exhaust part.

A central separator may be provided in a space between the first and second target portions, and an exhaust portion may be provided between the central separator and the first and second target portions.

It is preferable to use a conveyor as the first transfer part.

In addition, a thin film deposition apparatus comprising a process chamber having at least two deposition regions for forming a thin film on a substrate, each including a target portion, and at least one exhaust region separating the at least two deposition regions. To provide.

The process chamber preferably includes a transfer part for horizontally moving the substrate in the front-rear direction through the deposition area and the separation area.

It is effective that the target portion in the deposition region have different targets.

As described above, the present invention can prevent the deflection of the substrate by moving the transfer tray in which the substrate is placed in the horizontal direction from the inside of the chamber through the transfer part, and deposit a uniform thin film on a large-area substrate.

In addition, the present invention can form a multi-layer thin film on the front of the substrate to move a plurality of targets in the chamber.

In addition, the present invention can be installed in the space between the target to prevent contamination by different targets.

In addition, the present invention enables the deposition of one or more thin films on the substrate through a variety of deposition methods by using a plurality of targets, and by moving the substrate horizontally in the front and rear directions.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention in more detail. It will be apparent to those skilled in the art that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, It is provided to let you know. Like numbers refer to like elements in the figures.

1 is a conceptual diagram of a thin film deposition apparatus according to an embodiment of the present invention. 2 is a cross-sectional view of a thin film deposition apparatus according to an embodiment.

1 and 2, the thin film deposition apparatus according to the present exemplary embodiment may include at least one of an entrance chamber 100 through which the substrate 11 enters and exits, and at least one substrate 11 moving through at least one target. A process chamber 200 for depositing a metal thin film and a buffer chamber 300 provided on one side of the process chamber 200 are provided.

The substrate 11 of the present embodiment is loaded into the entrance chamber 100. Thereafter, the process chamber 200 is moved to the buffer chamber 300 in the horizontal direction, and the buffer chamber 300 and the process chamber 200 are moved back to the entrance chamber 100. Thereafter, it is unloaded through the entrance chamber 100. Here, the metal thin film is formed on the entire upper surface of the substrate 11 by moving the lower region of the target () of the process chamber 200.

As shown in FIG. 2, the substrate 11 is placed in the transfer tray 10 and moves in a horizontal direction (that is, in a horizontal direction with respect to the bottom surface of the entrance chamber 100). The substrate 11 may stably move inside the thin film deposition apparatus through the transfer tray 10. Here, at least one substrate 11 may be placed inside the transfer tray 10. Through this, a metal thin film may be formed on the entire surface of the plurality of substrates 11.

In addition, a metal thin film for manufacturing a semiconductor device, a liquid crystal display device, and a solar cell (ie, a solar cell device) may be formed on the substrate 11 through the thin film deposition apparatus according to the present embodiment. Accordingly, the substrate 11 may be a glass substrate or a plastic substrate as well as a semiconductor substrate. Of course, a flexible substrate may be used as the substrate 11. In addition, since the substrate 11 is transferred by the transfer tray 10, the substrate 11 may be a substrate having various shapes.

Although not shown, a separate mounting means for mounting the substrate 11 to the transfer tray 10 may be provided outside the entrance chamber 100. Of course, the access chamber 100 may be connected to a separate transfer chamber (not shown) to receive the substrate 11.

The entrance chamber 100 loads and unloads the substrate 11.

The entrance chamber 100 includes an entrance transfer unit 110 for moving the transfer tray 10 on which the substrate 11 is placed in a horizontal direction. Through this, the entrance chamber 100 moves the provided substrate 11 to the process chamber 200 and discharges the substrate 11 provided from the process chamber 200 to the outside. It is effective to use a conveyor as the entry and exit unit 110.

The inlet / outlet transporter 110 includes a plurality of rollers 111 that rotate in a clockwise and counterclockwise direction, and a rotation belt 112 that moves by the rollers 111 to move the transfer tray 10. The rotary belt 112 is rotated by the roller 111 in the form of infinity. At this time, when the roller 111 rotates in the clockwise direction, the rotating belt 112 moves the transfer tray 10 to the process chamber 200. In addition, when the roller 111 rotates in the counterclockwise direction, the rotating belt 112 receives the transfer tray 10 from the process chamber 200 and discharges it to the outside. It is effective that the width of the rotating belt 112 is equal to or larger than the width of the transfer tray 10. Through this, the bottom surface of the transfer tray 10 may be in close contact with the rotating belt 112. This allows the transfer tray 10 to move in the horizontal direction.

And the entrance chamber 100 is equipped with the heating means 120 which heats the board | substrate 11. This heats the substrate 11 loaded into the entrance chamber 100 to the process temperature.

As the heating means 120, optical heating means or electric heating means can be used. In FIG. 2, the heating unit 120 is provided at an upper side of the entrance chamber 100, that is, at a position opposite to the entrance and exit unit 110. However, the present invention is not limited thereto, and the heating unit 120 may be located at side and bottom regions of the entrance chamber 100. As shown in the figure, it is effective that the heating means 120 is located above the substrate 11. Through this, it is possible to suppress excessive heating of the rotary belt 112 of the access transport unit 110.

In this way, the entrance chamber 100 manages entry and exit of the substrate 11 and preheats the substrate 11. In this case, the process chamber 200 is communicatively coupled to one side of the entrance chamber 100. At this time, the process chamber 200 and the entrance chamber 100 is through a separate valve

The process chamber 200 moves the transfer tray 10 provided from the entrance chamber 100 in the front-rear direction to form a thin film by sputtering on the substrate 11 inside the transfer tray 10.

The process chamber 200 includes a process transfer part 210 for horizontally moving the transfer tray 10 on which the substrate 11 is placed in the front-rear direction, and a first area provided in upper regions corresponding to both edges of the process transfer part 210. And an exhaust part 240 provided between the second target parts 220 and 230 and the first and second target parts 220 and 230.

Conveyor may be used as the process transfer unit 210. The process conveying unit 210 includes a plurality of rotating process rollers 211 and a process rotating belt 212 which moves by the process rollers 211 to horizontally move the feed tray 10 in the front-rear direction. Equipped.

The substrate 11 may be moved in the horizontal direction through the process transfer unit 210, and sagging due to its own weight may be prevented even when the size of the substrate 11 increases. That is, the process transfer part 210 is arrange | positioned so that the lower surface of the board | substrate 11 may be supported. Therefore, the process transfer part 210 can stably support the lower side of the substrate 11, thereby preventing sagging of the substrate 11. Through a simple structure, that is, a process conveying part 210 composed of a process roller 211 and a rotating belt 212, the transfer tray 10 having a large area substrate 11 or a plurality of substrates 11 placed therein is moved forward and backward. You can move it.

As described above, the process transfer part 210 of the present embodiment supports the lower side of the substrate 11 to move the tooth while preventing the deflection due to the load, and the manufacturing cost of the equipment through the process transfer part 210 having a simple structure. Can be reduced. In addition, productivity can be increased by shortening the maintenance time of the equipment. In addition, even if the size of the substrate 11 increases and its weight increases, the substrate 11 can be stably supported and freely moved.

Here, the process chamber 200 is manufactured in a substantially rectangular cylindrical shape. That is, the process chamber 200 has approximately four sidewalls, an upper wall, and a bottom surface. In this case, the process transfer part 210 is disposed in the long axis direction of the process chamber 200. Of course, the process transfer unit 210 is disposed adjacent to the bottom surface of the process chamber 200. In addition, the entrance chamber 100 and the buffer chamber 300 are located at both sides of the longitudinal direction of the process chamber 210. That is, the entrance chamber 100 and the buffer chamber 300 are respectively disposed adjacent to two opposing side wall surfaces of the process chamber 200.

The first and second target portions 220 and 230 are disposed adjacent the upper wall of the process chamber 200. The first target portion 220 is disposed in the edge region adjacent to the entrance chamber 100, and the second target portion 230 is disposed in the edge region adjacent to the buffer chamber 300.

When the first and second target parts 220 and 230 are cut into the cross section along the long axis of the process chamber 200, the first and second target parts 220 and 230 may be located at both edge regions of the cross section.

In the present embodiment, a thin film is formed on the substrate 11 passing through the first and second target portions 220 and 230 under the first and second target portions 220 and 230. Here, different thin films may be deposited through the first and second target parts 220 and 230, respectively. Of course, it is also possible to deposit the same thin films with each other quickly.

Here, in the conventional case, since the size of the substrate 11 is small, the size of the target was also manufactured in such a size. However, in order to increase the size of the substrate 11 or to work on a plurality of substrates 11 simultaneously, the size of the target must be increased. However, there is a great difficulty in increasing the size of the target by a predetermined size or more, and also a problem in that the uniformity of the thin film is inferior. Accordingly, in the present embodiment, instead of manufacturing the target to a smaller size than the substrate 11, the substrate 11 is moved to deposit a uniform thin film on the entire surface of the substrate 11.

This is because the thin film deposition rate in the lower region of the first and second target portions 220 and 230 is the highest and the thin film deposition rate rapidly drops in the peripheral region thereof. Accordingly, the thin film having a uniform thickness may be formed by passing the substrate 11 through the lower regions of the first and second target portions 220 and 230 at a constant speed.

The first target unit 220 described above includes a first target 221, a support plate 222 supporting the first target 221, and a first power supply unit for supplying sputter power through the support plate 222. 223).

A metallic material is used as the first target 221. At least one of Al, Nd, Ag, Ti, Ta, Mo, Cr, Mo, W, and Cu is used as the first target 221. Through this, a thin film corresponding to the material may be deposited on the substrate 11.

The support plate 222 is coupled to the upper wall of the process chamber 200 (ie, the chamber lid) to support and fix the first target 221. In addition, the support plate 222 may be used as an electrode plate for plasma generation.

The first power supply unit 223 provides power for plasma generation in a region below the first target 221. Although not shown, a gas supply means for supplying a gas for plasma generation is further provided in a region below the first target 221. In this case, the first power supply unit 223 generates a plasma directly under the first target 221 by providing RF or DC power. The ions or neutral particles of the plasma generated as described above strike the surface of the first target 221 to separate solid atoms (or target atoms) of the first target 221. In this way, the solid atoms separated from the first target 221 are deposited and deposited on the substrate 11 moving below. For example, when Al is used as the first target 221, an Al film is formed on the substrate 11 passing under the first target 221.

The second target portion 230 also has a configuration similar to the first target portion 220.

The second target unit 230 includes a second target 231, a support plate 232 for supporting the second target 231, and a second power supply unit 233 for providing sputter power through the support plate 232. It is provided.

Here, the second target 231 may use at least one of Al, Nd, Ag, Ti, Ta, Mo, Cr, Mo, W, and Cu. As a result, one metal material layer may be formed on the substrate 11 passing under the second target 231.

In the present embodiment, different materials may be used for the first target 221 and the second target 231. Through this, different thin films may be simultaneously deposited on the substrate 11 passing through the process chamber 200. For example, when Al is used as the first target 221 and Ag is used as the second target 231, an Al film and an Ag film may be laminated on the substrate 11.

Furthermore, in the present exemplary embodiment, an exhaust part 240 may be disposed between the first target part 220 and the second target part 230 to prevent the film quality of two thin films sequentially formed on the substrate 11 from changing. .

The exhaust unit 240 includes an intake unit 241 provided between the first target 221 and the second target 231, and an exhaust pump 242 in communication with the intake unit 241. Although not shown, the suction part 241 includes a plurality of exhaust holes.

As such, in the present exemplary embodiment, the exhaust unit 240 may be disposed between the first and second target units 220 and 230 to prevent the target atoms from affecting different regions.

That is, as described above, the process chamber 200 according to the present exemplary embodiment may include a first deposition region in which the first thin film is formed by the first target portion 220, and a second thin film by the second target portion 230. And a second deposition region to be formed. An exhaust region (separation region) separating these two regions is located between the first and second deposition regions. The exhaust region allows the first and second deposition regions to act as independent spaces.

In the present embodiment, a second thin film is formed on the entire surface of the substrate 11 moving by the second target portion 230. However, in this case, the substrate 11 is separated out of the process chamber 200 even before all the second thin films are deposited on the entire surface of the substrate 11. Therefore, in the present embodiment, the buffer chamber 300 is disposed on the side surface of the process chamber 200 (that is, on an extension line in the traveling direction of the substrate 11) in order to prevent external exposure of the substrate 11. As a result, the buffer chamber 300 temporarily stores the substrate 11 while the second thin film is deposited on the entire surface of the substrate 11 by the second target portion 230.

The buffer chamber 300 includes a ferber transfer part 310 for moving the transfer tray 10 on which the substrate 11 is placed in a horizontal direction. The purver conveyance part 310 is provided with the rotating roller 311 and the rotating belt 312. As shown in FIG.

In addition, the buffer chamber 300 may be provided with cooling means (not shown) for cooling the substrate 11 for the transfer of the substrate (11). Of course, a heating means (not shown) for improving the film quality on the substrate 11 may be provided.

The thin film deposition apparatus of this embodiment is not limited to the above description, and various modifications are possible.

3 to 5 are cross-sectional views of the thin film deposition apparatus according to the modifications of the embodiment.

First, as shown in FIG. 3, a roller-type conveyor is used to move in and out of the entrance chamber 100, the process transfer unit 210 of the process chamber 200, and the buffer transfer unit 310 of the buffer chamber 300, respectively. Can be used.

Of course, it is not limited to the belt type and roller type conveyors mentioned above, but a chain type conveyor or an air conveyor can be used.

The access transfer unit 110 may include an opening and closing means such as the gate valve 130. Of course, it may be connected to the external substrate transfer device through the opening and closing means. Of course, it can also be connected to other substrate processing apparatus.

The process chamber 200 includes a plurality of detection sensors that detect movement of the transfer tray 10. In FIG. 3, four sensing sensors are provided. As shown in FIG. 3, the first to fourth sensing sensors 201, 202, 203, and 204 are located in the bottom region of the process chamber 200. Of course, the present invention is not limited thereto and its position may be changed according to its function.

In the following description, a case in which the transfer tray 10 moves from the entry chamber 100 to the buffer chamber 300 is defined as forward movement, and the transfer tray 10 moves from the buffer chamber 300 toward the entry chamber 100. When moving to, it is defined as backward movement.

The first detection sensor 201 detects whether the transfer tray 10 is provided from the entrance chamber 100 or detects whether the transfer tray 10 is completely discharged to the entrance chamber 100. That is, the first detection sensor 201 is disposed in the region adjacent to the entrance chamber 100 to inform the start of the forward movement of the substrate 11 inside the process chamber 200 or the end of the reverse movement. Preferably, the first detection sensor 201 is effectively located in the space between the side wall surface in which the entrance chamber 100 is in close contact with the first target portion 210. Through this, the first target unit 210 may be operated by notifying the first target unit 210 of the start of the forward movement.

The second detection sensor 202 detects whether the transfer tray 10 has exited the first deposition region by the first target portion 210. Through this, the operation of the first target unit 210 may be stopped. The second detection sensor 202 is preferably located in a space between the first target portion 210 and the exhaust portion 240.

The third detection sensor 203 senses that the transfer tray 10 moves to the second deposition region. That is, the third detection sensor 203 is effectively located in the space between the second target portion 220 and the exhaust portion 240. As a result, when the transfer tray 10 flows into the second deposition region, the transfer tray 10 may detect the moment and drive the second target unit 230.

The fourth detection sensor 204 detects whether the transfer tray 10 is provided to the buffer chamber 300 out of the second deposition area, or whether the transfer tray 10 is completely discharged to the transfer chamber 300. Detect. That is, the fourth sensor 204 notifies the string of the forward movement or the start of the reverse movement.

Of course, in the above description, the operation of the detection sensor has been described based on the operation of the first and second target parts 220 and 230 when the transfer tray 10 moves forward. However, the present invention is not limited thereto, and the first and second target units 220 and 230 may operate when the transfer tray 10 moves backward. Accordingly, the internal operation of the process chamber 200 may be changed according to the detection of the detection sensor.

In addition, in the modified example of FIG. 3, the inlet / outlet part 250 is provided in the region between the first target portion 220 and the inlet / outlet chamber 100, and in the region between the second target portion 230 and the buffer chamber 300. The buffer exhaust unit 260 may be further provided. In addition, a lower exhaust part 270 may be provided in a lower region of the process chamber 200. This may effectively separate the first and second deposition regions described above. Each of the entry and exit exhaust unit 250, the buffer exhaust unit 260, and the lower exhaust port 270 includes suction units 251, 261, and 271 and exhaust pumps 525, 262, and 272 connected thereto.

In addition, as in the modification shown in FIG. 4, separate separation for separating the first and second deposition regions and the exhaust region by the first and second target portions 220 and 230, and the exhaust portion 240. Plate parts 281 and 282 are provided.

The separation plate parts 281 and 282 may include a first separation plate 281 provided between the first target part 220 and the exhaust part 240, and a second separation part provided between the second target part 230 and the exhaust part 240. 2 separator plate 282 is provided. The separator plates 281 and 282 are manufactured in a plate shape extending downward from the upper region of the process chamber 200. At this time, the extension length of the plate may be variable. That is, the amount of displacement by the exhaust unit 240 may be adjusted by adjusting the extension length of the plate according to the process conditions. To this end, the first and second separation plates 281 and 282 are not shown, but may include a separate extension guide and a driving unit for moving the extension guide. In addition, the first and second separation plates 281 and 282 may be separately manufactured by a plurality of plate parts. Of course, the present invention is not limited thereto, and the first and second separation plates 281 and 282 may be provided with opening and closing holes. Through this, the communication area between the first and second deposition regions and the exhaust region can be adjusted. As such, the separation plate portions 281 and 282 may be provided to separate the thin film deposition regions, and process conditions for each region may be individually controlled.

In addition, a first opening / closing means 205 such as a gate valve is provided between the entrance chamber 100 and the process chamber 200, and the second opening / closing means 206 is provided between the process chamber 200 and the buffer chamber 300. This can be arranged. Through this, the process by-products can be prevented from entering the entrance chamber 100 and the buffer chamber 300.

In addition, as in the modification of FIG. 5, the process chamber 200 may be separated into two regions by using the central separator 283. Accordingly, exhaust parts may be disposed in the first area and the second area, respectively.

The central separator 283 is positioned between the first and second target parts 220 and 230. In addition, a second region exhaust portion 2 between the central separator 283 and the first target portion 220 is disposed between the first region exhaust portion 293 and the central separator 283 and the second target portion 230. 296). The separation plate 283 separates the first and second target parts 220 and 230, and exhausts the areas separated by the first and second area exhaust parts 293 and 296, respectively. Therefore, each area can be operated independently. In addition, the first and second region exhaust parts 293 and 296 may be disposed on both sides of the central separator 283 to prevent movement of process by-products in each region. The first and second zone exhausts 293 and 296 have intake portions 291 and 294 and exhaust pumps 292 and 295 communicating therewith, respectively. Of course, the present invention is not limited thereto, and the suction units 291 and 294 may be connected to one exhaust pump.

In addition, although the thin film deposition apparatus of the present embodiment has been described based on two target portions, a larger number of target portions may be provided.

In addition, in the present embodiment, the transfer tray 10 in which the substrate 11 is placed has moved. However, the present invention is not limited thereto, and the transfer tray 10 may be fixed and the target parts 220 and 230 may move. To this end, a target transfer means such as an LM guide or a conveyor may be provided on the upper side (ie, chamber lid) of the chamber in which the target unit is installed. In addition, the transfer tray and the target portion may move together.

Hereinafter, various thin film deposition methods using the thin film deposition apparatus of this embodiment having the above-described configuration are possible.

This is because the thin film deposition apparatus of this embodiment can move the substrate horizontally in the forward and reverse directions and has at least two target portions. That is, a forward one layer thin film deposition method, a reverse one layer thin film deposition method, a forward two layer thin film deposition method, a reverse two layer thin film deposition method, and a forward one layer and a reverse one layer thin film deposition method may be performed.

In the forward one-layer thin film deposition method, one layer of a thin film is deposited on the substrate 11 while moving the transfer tray 10 on which the substrate 11 is placed in the forward direction.

First, the transfer tray 10 is heated in the entrance chamber 100 and then provided to the process chamber 200. In this case, one of the first and second target parts 220 and 230 may operate to form a thin film layer on the entire surface of the substrate 11. Subsequently, the transfer tray 10 moves in the reverse direction through the buffer chamber 300 and is discharged. In this case, when the first and second target units 220 and 230 use the same target, the first and second target units 220 and 230 may operate simultaneously. This can increase the deposition thickness of the thin film layer.

The reverse one layer thin film deposition method forms one layer of thin film on the substrate 11 when the transfer tray 10 moves in the reverse direction.

The transfer tray 10 moves in the forward direction to the buffer chamber 300. Thereafter, the transfer tray 10 moves in the reverse direction and moves from the buffer chamber 300 to the process chamber 200. In this case, one of the first and second target units 220 and 230 may operate to form a thin film layer on the entire surface of the substrate 11. Subsequently, the transfer tray 10 is discharged to the outside via the entrance chamber 100. In this case, a heating means may be provided inside the buffer chamber 300 to heat the substrate 11.

In the forward two-layer thin film deposition method, when the transfer tray 10 moves in the forward direction, two layers of different physical properties are formed on the substrate 11.

The transfer tray 10 moves the entrance chamber 100 forward to the process chamber 200. In this case, the first and second target units 220 and 230 operate respectively. As a result, the first thin film layer is formed on the entire surface of the substrate 10 moving forward by the first target portion 220, and the second thin film layer is formed on the entire surface of the substrate by the second target portion 230. In this case, the first and second thin films may be continuously formed on the substrate or sequentially formed according to the distance between the first and second target parts 220 and 230 and the size of the substrate 11. In this case, the continuous formation refers to the formation of the second thin film layer on the other side of the substrate at the moment the first thin film layer is formed on one side of the substrate. Thereafter, the transfer tray 10 moves to the buffer chamber 300 and then moves in the reverse direction to be discharged to the outside. At this time, the operations of the first and second target units 220 and 230 are stopped.

In the reverse two-layer thin film deposition method, when the transfer tray 10 moves in the reverse direction, two layers of thin films having different physical properties are formed on the substrate 11.

The transfer tray 10 moves in the forward direction to the buffer chamber 300. Thereafter, the process moves backward from the buffer chamber 300 to the process chamber 200. In this case, the first and second target units 220 and 230 operate respectively. As a result, the first thin film layer is formed on the entire surface of the substrate by the second target unit 230. The second thin film layer is formed on the first thin film layer by the first target portion 220. Subsequently, the transfer tray 10 is discharged to the outside via the entrance chamber 100.

In the forward 1 layer and reverse 1 layer thin film deposition methods, one layer of a first thin film is formed when the transfer tray 10 moves in a forward direction, and a second layer having different physical properties from the first thin film layer when the transfer tray 10 moves in a reverse direction is formed on the upper layer. Is formed.

At this time, when the first target unit 220 is operated when the transfer tray 10 moves forward, the second target unit 230 is operated when the transfer tray 10 moves backward. In addition, when the second target unit 230 is operated at the forward movement, the first target unit 220 is operated at the reverse movement.

In addition, the present invention is not limited thereto, and the forward two-layer and reverse one-layer thin film depositions are possible, and the forward one-layer and the reverse two-layer thin film depositions are possible. At this time, it is effective that the physical properties of at least two of the three thin film layers deposited are the same. In addition, two layers of forward and two layers of reverse deposition are possible.

Various electromagnetic devices (for example, semiconductor devices, liquid crystal display devices, light emitting diodes, and solar cells) may be manufactured through a system in which a plurality of thin film deposition apparatuses are connected.

6 is a diagram of a thin film deposition system according to one embodiment of the invention.

As shown in FIG. 6, the thin film deposition system includes an entrance chamber 100, a process chamber 200 having a plurality of target parts 220 and 230, and a buffer chamber 300 connected to the process chamber 200. A plurality of thin film deposition apparatus 1000, a load lock device 2000 that accommodates the transfer tray 10 on which the substrate 11 is placed, and the plurality of thin film deposition apparatus 1000 and the load lock device 2000 And a transfer apparatus 3000 connected to the transfer tray 10 to the plurality of thin film deposition apparatuses 1000 and the load lock apparatus 2000.

Through this, the thin film deposition system may deposit a plurality of thin layers on the substrate. Of course, the thin film deposition system is not limited to the above-described structure, and may further include a deposition apparatus using a chemical vapor deposition method in addition to the thin film deposition apparatus using sputtering, and may further include an etching apparatus.

The present invention is not limited to the above-described embodiments, but may be implemented in various forms. That is, the above embodiments are provided to make the disclosure of the present invention complete and to fully inform those skilled in the art the scope of the present invention, and the scope of the present invention should be understood by the claims of the present application. .

1 is a conceptual diagram of a thin film deposition apparatus according to an embodiment of the present invention.

2 is a cross-sectional view of a thin film deposition apparatus according to an embodiment.

3 to 5 are cross-sectional views of the thin film deposition apparatus according to the modifications of the embodiment.

6 is a diagram of a thin film deposition system according to one embodiment of the invention.

<Explanation of symbols for major symbols in the drawings>

100: access chamber 110: access transfer unit

200: process chamber 210: process transfer unit

220, 230: target portion 240, 250, 260, 270: exhaust portion

300: buffer chamber 310: buffer transfer unit

Claims (14)

A first transfer part for horizontally moving the transfer tray on which the substrate is placed in the front-rear direction; At least two target portions provided in an area facing the first transfer portion; And And a process chamber including an exhaust part provided between the at least two target parts. The method according to claim 1, An entrance chamber connected to the process chamber and providing the transfer tray from the outside to the process chamber, the entrance chamber receiving the transfer tray from the process chamber and discharging it to the outside; And And a buffer chamber connected to the process chamber for temporarily storing the transfer tray provided from the process chamber and providing the transfer tray back to the process chamber. The method according to claim 2, And the entrance chamber includes a second transfer part for horizontally moving the transfer tray horizontally and a heating means for heating the substrate on the transfer tray, and uses a conveyor as the second transfer part. The method according to claim 2, The buffer chamber includes a third transfer part for horizontally moving the transfer tray in the front-rear direction, and uses the conveyor as the third transfer part. The method according to claim 2, The process chamber comprises a first target portion located in an area adjacent to the entrance chamber and a second target portion located in an area adjacent to the buffer chamber, And the first and second target units respectively include first and second targets, and first and second power sources for supplying sputter power for generating ions and neutral particles. The method according to claim 5, A thin film deposition apparatus using at least one of Al, Nd, Ag, Ti, Ta, Mo, Cr, Mo, W, and Cu as the first and second targets. The method according to claim 6, Thin film deposition apparatus using different materials as the first target and the second target. The method according to claim 5, The thin film deposition apparatus of claim 1, wherein the exhaust part is provided in a space between the first and second target parts, and the first and second exhaust parts are provided in both side regions of the first and second target parts. The method according to claim 5 or 8, And a separator provided in a space between the first and second target parts and the exhaust part. The method according to claim 5 or 8, The thin film deposition apparatus of claim 1, wherein a central separator is provided in a space between the first and second target parts, and an exhaust part is provided between the central separator and the first and second target parts. The method according to claim 1, Thin film deposition apparatus using a conveyor as the first transfer unit. And a process chamber having at least two deposition regions each forming a thin film on a substrate including a target portion, and at least one exhaust region separating the at least two deposition regions. The method according to claim 12, The process chamber includes a transfer unit for moving the substrate horizontally in the front and rear direction through the deposition region and the separation region. The method according to claim 12, The thin film deposition apparatus of claim 1, wherein the target portion in the deposition region has a different target.

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