KR20100037355A - Radiator and bulb type led lighting apparatus using the same - Google Patents

Abstract

PURPOSE: A radiator and a bulb type LED lighting device thereof are provided to implement high brightness LED lighting device by releasing heat transferred from an LED package through a radiator which has two different shapes. CONSTITUTION: An LED package(10) comprises a metallic board(11) consisted of a polygon pipe and a plurality of LEDs(13). A board-shape radiating unit(310) extends and forms a plurality of plate cooling fins along the circular outer circumference of the LED package. A corrugation type radiating unit(330) extends and forms a plurality of corrugation cooling fins along the circular outer circumference of the LED package. The corrugation type radiating unit has relatively wide air inflow area than the board-shape radiating unit. A body(311) forms a lower part path(31b) communicated with an LED mounting unit(33). A plurality of heat radiation fins(312) is extended and formed along the longitudinal direction of the body to the circular plate type.

Description

Radiator and Bulb Type LED Lighting Apparatus Using the Same

The present invention relates to a heat dissipation device and a bulb-type LED lighting device using the same, in particular, a heat dissipation device that maximizes the light emission characteristics and life of the LED by efficiently radiating heat generated from the bulb-type LED lighting device and bulb-type LED lighting using the same Relates to a device.

Generally, in order to use a light emitting diode (LED) as a white light source for lighting, red, green, and blue LEDs are produced in a single package to generate white light by three-element light (in this case, The voltage and current applied to each LED must be precisely adjusted so that the illumination of each light is uniform.), And the light emitted from the blue or yellow LED passes through the yellow or blue phosphor so that the short wavelength is light of various wavelengths. In this case, a pseudo white is obtained, or near ultraviolet rays pass through a phosphor, and a white color is produced like a fluorescent lamp.

Among them, a white light source combining a blue LED, an ultraviolet LED, and a fluorescent material is the mainstream.

The fluorescent material may be coated on a hemispherical cover of a lighting fixture, or a method of attaching a phosphor tape to the front surface, and in some cases, may be configured by coating a phosphor on the surface of the LED.

The white light source using the LED as described above has been spotlighted as a new illumination light source because of its excellent luminous efficiency, high luminous intensity, high speed response and long life.

That is, the illuminance of 40 to 60W incandescent light bulbs can be replaced with 5-10W power using about 80 LEDs, and the 100W incandescent light bulb can implement the same illuminance at about 13W power using 128 LEDs. As a result, much less power is consumed to achieve the same illuminance environment as compared to conventional "A" type (ie bulb type) incandescent bulbs as well as fluorescent lamps.

By the way, the lighting LED having the above characteristics is generated a lot of heat in the process of converting electrical energy into light, this heat not only lowers the light emitting characteristics of the LED, but also acts as a factor to shorten the life of the LED Have

Therefore, in order to use LED lighting efficiently, it is essential to have a temperature condition for LED to operate normally.

In order to solve the heat dissipation problem, there is also a method of reducing the amount of current supplied to the LED to emit light. However, since it directly lowers the brightness of the LED, it is a method of lowering utility as a light source.

In order to solve this problem, conventionally, as shown in Figure 1 and 2, the LED (LED) light fixture 100 is a light source unit in which a plurality of LEDs 111 are installed on the PCB 113, and the PCB 113 And a heat dissipation means (130) bonded to the housing and a housing (150) for receiving and supporting the light source unit and the heat dissipation means (130), and a power connection part for connecting the PCB (113) and the power to the housing (150). 151).

The heat dissipation means 130 is formed in a vertical cylindrical shape around the housing 150 and the heat dissipation fins 133 for extending the heat dissipation area are protruded at a predetermined interval around the heat dissipation fins 133 and the heat dissipation fin gap space 131 is alternately arranged unevenly.

That is, the heat dissipation fin 133 and the clearance space 131 is arranged in a cylindrical shape at a predetermined interval around the heat dissipation means 130, this configuration is the surface area by the heat dissipation fin 133 in an environment where the ventilation is smoothly Due to expansion, heat dissipation is achieved.

However, in an environment in which ventilation is not naturally achieved, such as when the lighting device having such a structure is inserted into a buried hole formed in the ceiling, the lower point 133a adjacent to the PCB 113 and the PCB 113 are most The temperature difference between the distant upper point 133b is less than 10% (see FIG. 1), and the temperature difference between the heat dissipation fin 133 and the clearance gap 131 is less than 10% (see FIG. 2).

Heat dissipation for heat dissipation increases efficiency as the temperature difference between the heat dissipation fin 133 and the gap space 131 increases, but when the temperature difference is less than 10% as described above, heat dissipation is not performed properly.

This is because the air staying in the gap space 131 of the heat dissipation fin 113 is stagnant in the state of absorbing heat, so that the heat dissipation is not properly performed in most spaces except the outermost part of the heat dissipation fin 113. There is this.

In some cases, a fan is used to force air convection for efficient heat dissipation. However, the life of the fan is shorter than that of the LED. .

In order to solve the problems of the above-described technology, a fanless heat dissipation LED lighting device of Patent No. 10-0778235 is disclosed, which will be described with reference to FIG.

Referring to FIG. 3, the heat dissipation area is far from the luminaire body by attaching a heat dissipation plate 230 having a lamp structure on the side end of the PCB 200 on which the LED 210 is mounted and having an uneven portion 231 formed thereon. It is a technology that expands the convection space required for heat dissipation by expanding.

However, since the PCB 200 and the heat sink 230 are not integrated, the interface is formed on the heat transfer path, so that the heat transfer is poor due to the interface effect. In contrast, due to the limitations of heat transfer rate and heat dissipation area, there is an unsuitable problem.

In addition, the lighting fixture having a structure as shown in Figure 3 has a problem that can not be used as a fully embedded lighting fixture due to the structure of the heat sink 230, the LED is mounted on a flat structure PCB, but the direct portion is bright but side As it is relatively dark, the light distribution characteristics are bad, and in order to solve this problem, when a separate reflector is to be installed and used at the center, there is a problem in that the size of the lighting fixture is increased.

Meanwhile, there is an LED package having a structure in which a plurality of LEDs are mounted on a plurality of metal PCBs for high illumination and attached to a polygonal pipe serving as a heat sink, but this is the same as described above between the metal PCB and the pipes. Due to the heat transfer interface is not a smooth heat discharge is not suitable as a heat dissipation structure of the high illumination (that is, high watts) LED lighting fixtures.

Accordingly, an object of the present invention is to mount a plurality of LEDs on the surface of the substrate using a polygonal metal PCB, and at the same time, the heat dissipation device to maximize the heat dissipation effect by arranging two different heat dissipation devices; It is to provide a bulb type LED lighting device using the same.

Another object of the present invention is to form a plurality of LEDs on the surface of the substrate using a polygonal metal PCB (metal PCB) and the light distribution characteristics as the LED light is scattered using a globe having a sphere one-to-one correspondence on the surface of the polygonal metal substrate To provide an LED lighting device that can maximize the.

Still another object of the present invention is to realize a high illumination by implementing an LED lighting device having a high illumination by combining a LED package mounted with a plurality of LEDs on the surface of the substrate using a polygonal metal PCB (metal PCB) with a heat radiator It is to provide an LED lighting device that can be easily utilized as a recessed lighting fixture by implementing the LED lighting fixture of a compact size.

Still another object of the present invention is to provide an LED lighting apparatus that can easily and easily manufacture an LED lighting apparatus having high light intensity and excellent light distribution characteristics, thereby increasing assembly and mass productivity and reducing manufacturing costs.

In order to achieve the above object, the heat dissipation device for LED lighting apparatus according to the present invention has a plurality of plate-type heat dissipation fins along a circular outer circumferential surface to dissipate heat transferred from the LED package at the top of the LED package in which a plurality of LEDs are integrated Plate-shaped heat dissipation unit is formed; And a corrugation type heat dissipation unit in which a plurality of corrugated heat dissipation fins extend along a circular outer circumferential surface to dissipate heat transferred from the LED package, including heat radiated from the plate heat dissipation unit, on the top of the plate heat dissipation unit. It includes, wherein the corrugated heat dissipation portion is characterized in that it has a relatively large air inlet area compared to the plate-shaped heat dissipation portion.

Bulb-type LED lighting device according to a feature of the present invention comprises a LED package mounted with a plurality of LEDs on a metal substrate; A screw cap for applying power to the LED package; A heat dissipation device in which the LED package is mounted at one side and the screw cap is mounted at the other side; And a glove coupled to one side of the heat dissipating device to casing the LED package, wherein the heat dissipating device is configured to dissipate heat transferred from the LED package on top of the LED package in which the plurality of LEDs are integrated. A plate heat dissipation unit in which a plurality of plate heat dissipation fins extend along a circular outer circumferential surface; And a corrugation type heat dissipation unit in which a plurality of corrugated heat dissipation fins extend along a circular outer circumferential surface to dissipate heat transferred from the LED package, including heat radiated from the plate heat dissipation unit, on the top of the plate heat dissipation unit. It includes, and the corrugated heat dissipation portion has a relatively large air inlet area compared to the plate-shaped heat dissipation portion.

According to another feature of the invention, the bulb-type LED lighting device includes a LED package mounted with a plurality of LEDs on a metal substrate; A screw cap for applying power to the LED package; A heat dissipation device in which the LED package is mounted at one side and the screw cap is mounted at the other side; And a glove coupled to one side of the heat dissipation device to casing the LED package, wherein the glove scatters light emitted from the LED in a curved shape corresponding to a metal substrate on the side of the LED package. To diverge.

According to another feature of the invention, the bulb type LED lighting device includes a LED package mounted with a plurality of LEDs on a metal substrate; A screw cap for applying power to the LED package; The LED package is mounted at one side, and the screw cap is mounted at the other side, and a plurality of plate-type heat dissipation fins are provided along a circular outer circumferential surface to dissipate heat transferred from the LED package at the top of the LED package in which the plurality of LEDs are integrated. Plate-shaped heat dissipation unit is formed; And a corrugation type heat dissipation unit in which a plurality of corrugated heat dissipation fins extend along a circular outer circumferential surface to dissipate heat transferred from the LED package, including heat radiated from the plate heat dissipation unit, on the top of the plate heat dissipation unit. A heat dissipation device having a relatively larger air inflow area than the plate heat dissipation part; And a glove coupled to one side of the heat dissipation device for casing the LED package, and scattering and emitting light emitted from the LED in a curved shape corresponding to a metal substrate on the side of the LED package one-to-one. .

Here, the plate-shaped heat dissipation unit is coupled to the upper portion of the LED package and having a central passage; And a plurality of heat dissipation fins integrally formed with the body and extending in a circular plate shape at equal intervals along the longitudinal direction of the body on an outer circumferential surface, and air rising by convection in each space between the heat dissipation fins. Form an inlet air inlet space.

On the other hand, the corrugated heat dissipation portion is a cylindrical body formed on the upper plate-shaped heat dissipation portion; A plurality of heat dissipation fins coupled to an outer circumferential surface of the body and extending in a corrugated form at equal intervals along the longitudinal direction of the body; And a spacer ring for forming a gap between the plurality of heat dissipation fins, and forms an air inflow space through which air rising by convection occurs in each space between the heat dissipation fins.

      Here, the globe may be emitted by scattering the light emitted from the LED in the shape of a curved surface corresponding to the metal substrate on the side of the LED package.

      On the other hand, the metal substrate is made of a polygonal surface including a lower surface, a plurality of unit substrates or integral single substrate bent into a polygon.

As described above, in the present invention, even though a plurality of LEDs are densely mounted on the surface of the substrate using a metal substrate made of polygonal pipe, the heat transferred from the LED package is prevented through a heat radiator having two different shapes. The thermal efficiency can be increased to realize a high illumination LED lighting device.

This effective heat dissipation allows more LEDs to be mounted as compared to conventional LED lighting devices that consume the same power, and thus may have greater illuminance than conventional methods.

Therefore, the present invention provides the effect of high heat dissipation efficiency of the heat transmitted from the LED in the high illumination LED lighting device and excellent light distribution characteristics of the LED.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration of the heat dissipation device and the bulb-type LED lighting device using the same according to an embodiment of the present invention.

Figure 4 is a perspective view of a bulb-type LED lighting apparatus according to an embodiment of the present invention.

Referring to FIG. 4, the bulb-type LED lighting device 1 according to an embodiment of the present invention includes an LED package 10, a heat sink 30, a globe 50, and a screw cap 70.

The LED package 10 includes a plurality of LEDs 13 mounted on an outer surface of a metal PCB 11 made of an octagonal pipe including a bottom surface. The LED package 10 is cased by the glove 50 to the outside. The glove 50 uses a transparent or translucent material and casings the LED package 10 into a shape having a curved surface corresponding to one-to-one on each side of the metal substrate 11 of the LED package 10. A heat dissipation device 30 for dissipating heat from the plurality of LEDs 13 is formed above the casing-treated LED package 10 by the glove 50. The heat dissipation device 30 is formed of a plate-shaped heat dissipation unit 310 having a plate-shaped heat dissipation fin and a corrugation type heat dissipation unit 330 having a corrugation-shaped heat dissipation fin formed thereon. The screw cap 70 is coupled to the upper portion of the corrugated heat dissipation part 330 to be inserted into a conventional socket.

Hereinafter, the bulb-type LED lighting apparatus according to an embodiment of the present invention will be described in more detail with reference to the A-A 'line cross-sectional view and the B-B' line cross-sectional view of FIG. 4.

5 is a cross-sectional view taken along line AA ′ of the bulb-type LED lighting apparatus of FIG. 4.

Referring to FIG. 5, the bulb type LED lighting device 1 includes a LED package 10 from below, a globe 50 casing the LED package 10, and a heat radiating device 30 above the globe 50. ) Is a plate-shaped heat dissipation unit 310, the other one of the heat dissipation device (30) includes a concave-type heat dissipation unit 330, and a screw cap 70 for the socket connection.

The LED package 10 includes a metal PCB 11 made of a polygonal (eg, octagonal) pipe including a bottom surface of a metal material, and a plurality of mounted on the outer surface of the metal substrate 11. LED 13 is provided.

The metal substrate 11 is preferably made of a plate of a material having excellent thermal conductivity (for example, aluminum, copper, iron, or an alloy thereof). For example, the metal substrate 11 corresponding to the side of the octagonal pipe is composed of eight rectangular unit boards or an integral single board bent in an octagon. A plurality of LEDs 13 are mounted on these unit substrates, for example, five LEDs 13 can be mounted in two rows. In addition, the LED 13 can be mounted on the metal substrate 11 of the octagonal lower surface. This is to improve the light distribution to the lower side as well as the side light distribution.

The metal substrate 11 forms a plurality of through holes (not shown) through which the screws (not shown) penetrate, and the LED mounting portion is formed by using a screw (not shown) in the screw holes (not shown) formed in the LED mounting portion 33. Coupled to (33). In addition, the upper portion of the LED mounting portion 33 is provided with a wiring hole 39 for connecting the wiring of the plurality of LEDs 13 to the top.

Such a preferable structure of the metal substrate 11 is that the direct mounting of a plurality of LEDs 13 on the surface of the metal substrate 11 eliminates the presence of an interface on the heat transfer path, thereby degrading the heat transferability by the interface effect. Can be prevented. However, it is also possible to mount a plurality of LEDs 13 on a plurality of plate-shaped metal substrates and fix them using a plurality of screws (not shown) on each side of the LED mounting part 33.

In the present invention, the metal substrate 11 is composed of an octagonal structure including a lower surface in the embodiment of Figure 4, it is possible to use a hexagonal, 10 or 12 polygonal pipe structure other than the octagon. In this case, since a plurality of LEDs 13 are mounted on the outer surface of the polygonal substrate and the lower surface of the polygonal substrate to form a three-dimensional lighting structure, a problem in which a large illuminance difference is generated between the direct portion and the side of the lighting device can be solved. Properties are greatly improved.

The plate-shaped heat dissipation part 310 coupled by the LED mounting portion 33 and the bolt 32 to the upper portion of the LED package 10 described above is one of the heat dissipation devices 30. The plate heat dissipation unit 310 is for dissipating heat generated from the LED package 10 to the outside of the LED lighting device 1, the heat radiation fin formed in a plate shape along the body 311, and the outer peripheral surface of the body 311 312 and are integrally formed.

The plate heat dissipation part 310 is made of a material having excellent thermal conductivity (for example, aluminum, copper, iron, or an alloy thereof).

The body 311 has a lower passage 31b communicating with the lower LED mounting portion 33 inward along the longitudinal direction. The lower passage 31b passes through a wire (not shown) wired through the wiring hole 39 and is led out along the upper passage 31a.

In addition, the body 311 is formed on the rear surface of the heat dissipation fins 312, the upper and lower screw coupling portions 34 and 35, the lower screw coupling portion 34 is detachably coupled to the glove 50, the upper side The screw coupling portion 35 is coupled to the lower body connecting portion 334 for connecting with the lower end of the corrugated heat dissipation portion 330.

A plurality of circular plate heat dissipation fins 312 are disposed along the outer circumferential surface of the body 311 at equal intervals. In this case, the space between the heat dissipation fins 312 forms a plurality of air inflow spaces S1. The heat dissipation fin 312 radiates heat generated from the LED 13, and at this time, heat radiates into the air inlet space S1.

In addition, the corrugation type heat dissipation unit 330 coupled to the lower body connection part 334 by the screw coupling unit 35 to the upper portion of the plate heat dissipation unit 310 is the other one of the heat dissipation devices 30. The corrugated heat dissipation unit 330 is for dissipating heat transmitted from the LED package 10 including heat dissipated by the lower plate heat dissipation unit 310, and the body 331 and the body 331. And a plurality of heat dissipation fins 332 formed in a corrugated form along the outer circumferential surface thereof with the screw 36. The spacer ring 333 is formed between the plurality of heat dissipation fins 332 to secure the air inflow space S2 so that the heat dissipation fins 332 are equally spaced apart from each other.

Similarly, the corrugated heat dissipation unit 330 is also made of a material having excellent thermal conductivity (for example, aluminum, copper, iron, or an alloy thereof).

The body 331 forms an upper passage 31a in communication with the lower passage 31b inwardly along the longitudinal direction. The upper passage 31a has a larger diameter than the lower passage 31b and passes through an electric wire (not shown) drawn upward from the lower passage 31b so as to be connected to the upper LED driving circuit 12.

In addition, the body 331 is configured to form a screw coupling portion 36 for screwing the heat dissipation fin 332 on the upper outer peripheral surface to form a combination of the body 331 and the heat dissipation fin 332.

A plurality of heat dissipation fins 332 of the corrugation shape are arranged along the outer circumferential surface of the body 331 at the same intervals in a corrugation shape. Here, the plurality of heat dissipation fins 332 of the corrugated shape receives heat radiated from the plate-shaped heat dissipation part 310 to radiate heat once again. In addition, the space between the heat dissipation fins 332 forms a plurality of air inflow spaces S2 by the spacer ring 333. The air inlet space (S2) has a relatively large area compared to the air inlet space (S1) of the lower side to maximize the heat radiation effect of the rising air.

On the other hand, the body 331 of the corrugated heat dissipation unit 330 is connected to the upper body connecting portion 335 and the screw coupling portion 37, which seats the LED driving circuit 12 formed on the PCB (not shown) to the top Are combined by.

The upper body connecting portion 335 screwed with the corrugated heat dissipating portion 330 is coked with the lower end of the base 71 of the upper screw cap 70 and the caulking coupling portion 73.

The screw cap 70 has a plurality of holes 72 formed in the base 71, and a pair of caulking joints with the upper body connecting portion 335 on the top of the heat dissipation device 30 to be inserted into a conventional socket. Electrical contacts 70a and 70b are formed.

The wires (not shown) drawn from the LED package 10 are sequentially passed through the lower passage 31b and the upper passage 31a, and are connected to the LED driving circuit 12, and then the wires (not shown) from the LED driving circuit 12 again. C) is connected to a pair of electrical contacts 70a and 70b of the screw cap 70.

On the other hand, the glove 50, which is casing the LED package 10 is detachably coupled to the open portion of the upper portion by the lower screw engaging portion 34 of the plate-shaped heat dissipation portion (310).

The glove 50 has a shape having a curved surface one-to-one corresponding to eight sides of the octagonal metal substrate 11. This shape of the globe 50 is for scattering the light generated from the LED 13 to improve the light distribution characteristics.

Such a globe 50 will be described in detail with reference to FIG. 6.

6 is a cross-sectional view taken along line B-B 'of the bulb-type LED lighting apparatus of FIG.

Referring to FIG. 6, the globe 50 has a one-to-one corresponding curved surface on eight sides of the octagonal metal substrate 11 on which the plurality of LEDs 13 are mounted. The light (arrow notation) emitted from the LED 13 is incident on the inner incidence surface A of the glove 50 to be scattered and diverged through the diverging surface B. FIG. Therefore, the light distribution characteristic can be improved since the emitted light of the LED 13 can be scattered and diverged.

The bulb-type LED lighting device 1 described above with reference to FIGS. 4 to 6 may obtain higher heat dissipation efficiency due to the heat dissipation device having two different heat dissipation parts, and correspond to the metal substrate 11 one-to-one. It is possible to improve the light distribution characteristics by employing the globe 50 having a curved surface.

For reference, a front view and a plan view of the bulb-type LED lighting device 1 described above are shown.

7 is a front view of the bulb-type LED lighting apparatus according to an embodiment of the present invention.

Referring to FIG. 7, the heat dissipation device 30 having two heat dissipation parts 310 and 330 to the upper portion of the glove 50, that is, the plate heat dissipation part 310 having a plate heat dissipation fin 312 and a convoluted shape. Shows a corrugated heat dissipation unit 330 having a heat dissipation fin 332, and a screw cap having two contacts 70a and 70b in a base 71 having a hole 72 formed on the top of the heat dissipation unit 30. 70).

8 is a plan view of the bulb-type LED lighting apparatus according to an embodiment of the present invention.

Referring to FIG. 8, a base 71 having two contacts 70a and 70b and holes 72 is illustrated, and a corrugated heat dissipation unit 330 and a plate heat dissipation unit 310 are shown.

As described above, in the present invention, the heat dissipation of two heat dissipation parts having different shapes to dissipate heat transferred from the LED package despite mounting and mounting a plurality of LEDs on the substrate surface using a metal substrate made of a polygonal pipe. The device can have a more efficient heat dissipation characteristics and can implement a high illumination LED lighting device. This efficient heat dissipation allows more LEDs to be mounted compared to conventional LED lighting devices that consume the same power, and thus may have greater illuminance than conventional methods. In addition, the LED lighting apparatus according to the present invention can deform the shape of the globe casing the LED package to scatter the LED light to emit in the form of divergent light can improve the light distribution characteristics.

LED lighting apparatus according to the present invention can be applied to a new lighting device that can replace incandescent bulbs and fluorescent lamps.

1 is a front view showing the structure of a conventional LED lighting fixture.

2 is a cross-sectional view showing the structure of a conventional LED lighting fixture shown in FIG.

3 is a cross-sectional view showing the structure of another conventional LED lighting fixture.

Figure 4 is a perspective view of the bulb-type LED lighting apparatus according to an embodiment of the present invention,

5 is a cross-sectional view taken along the line A-A 'of the bulb-type LED lighting apparatus of FIG.

6 is a cross-sectional view taken along line B-B 'of the bulb-type LED lighting apparatus of FIG. 4;

7 is a front view of the bulb-type LED lighting device of Figure 4,

8 is a plan view of the bulb-type LED lighting apparatus of FIG.

* Description of Signs for Main Parts in Drawings *

10: LED package 11: metal substrate

13: LED 30: heat sink

330: corrugated heat dissipation unit 310: plate-shaped heat dissipation

312,332: heat sink fin 33: LED mounting

50: glove 70: screw cap

Claims (20)

A plate heat dissipation unit in which a plurality of plate heat dissipation fins extend along a circular outer circumferential surface to dissipate heat transferred from the LED package on an LED package in which a plurality of LEDs are integrated; And A corrugation type heat dissipation unit in which a plurality of corrugated heat dissipation fins are extended along a circular outer circumferential surface to dissipate heat transferred from the LED package including heat dissipated from the plate heat dissipation unit at an upper portion of the plate heat dissipation unit; Include, The heat dissipation device for LED lighting apparatus, characterized in that the corrugated heat dissipation unit has a relatively large air inflow area compared to the plate heat dissipation unit. According to claim 1, The plate heat dissipation portion is coupled to the top of the LED package and the body having a central passage; And a plurality of heat dissipation fins formed integrally with the body and extending in a circular plate shape at equal intervals along the longitudinal direction of the body on an outer circumferential surface thereof, The heat dissipation device for the LED lighting device, characterized in that for forming the air inflow space in which the air rising by the convection phenomenon in each space between the heat radiation fins. The cylindrical body of claim 1, wherein the corrugated heat dissipation unit comprises: a cylindrical body formed on the plate-shaped heat dissipation unit; A plurality of heat dissipation fins coupled to an outer circumferential surface of the body and extending in a corrugated form at equal intervals along the longitudinal direction of the body; And It includes a spacer ring for forming a gap between the plurality of radiating fins, The heat dissipation device for the LED lighting device, characterized in that for forming the air inflow space in which the air rising by the convection phenomenon in each space between the heat radiation fins. An LED package having a plurality of LEDs mounted on a metal substrate; A screw cap for applying power to the LED package; A heat dissipation device in which the LED package is mounted at one side and the screw cap is mounted at the other side; And, And a glove coupled to one side of the heat dissipation device for casing the LED package. The heat dissipation device A plate heat dissipation unit in which a plurality of plate heat dissipation fins extend along a circular outer circumferential surface to dissipate heat transferred from the LED package on an upper part of the LED package in which a plurality of LEDs are integrated; And a corrugation type heat dissipation unit in which a plurality of corrugated heat dissipation fins extend along a circular outer circumferential surface to dissipate heat transferred from the LED package, including heat radiated from the plate heat dissipation unit at an upper portion of the plate heat dissipation unit. To include, wherein the corrugated heat dissipation unit bulb type LED lighting device, characterized in that having a relatively large air inlet area compared to the plate-shaped heat dissipation unit. 5. The apparatus of claim 4, wherein the plate heat dissipation unit is coupled to an upper portion of the LED package and has a central passage; And a plurality of heat dissipation fins formed integrally with the body and extending in a circular plate shape at equal intervals along the longitudinal direction of the body on an outer circumferential surface thereof, Bulb-type LED lighting device, characterized in that for forming the air inlet space in which the air rising by the convection phenomenon between the space between the heat radiation fins. The cylindrical body of claim 4, wherein the corrugated heat dissipation unit comprises: a cylindrical body formed on the plate-shaped heat dissipation unit; A plurality of heat dissipation fins formed on the outer circumferential surface of the body at equal intervals along the longitudinal direction of the body and extending in a corrugated form; and a spacer ring for forming a gap between the plurality of heat dissipation fins, Bulb-type LED lighting device, characterized in that for forming the air inlet space in which the air rising by the convection phenomenon between the space between the heat radiation fins. The light bulb type LED lighting apparatus of claim 4, wherein the globe scatters and emits light emitted from the LED in a curved shape corresponding to a metal substrate on the side of the LED package. The bulb type LED lighting apparatus according to claim 4, wherein the metal substrate is formed of a polygonal surface including a lower surface. The method of claim 8, wherein the metal substrate is a bulb type LED lighting device, characterized in that consisting of a plurality of unit substrates or integral single substrate bent in a polygon. An LED package having a plurality of LEDs mounted on a metal substrate; A screw cap for applying power to the LED package; A heat dissipation device in which the LED package is mounted at one side and the screw cap is mounted at the other side; And, And a glove coupled to one side of the heat dissipation device for casing the LED package. The globe is Bulb-type LED lighting device, characterized in that for scattering the light emitted from the LED in the shape of a curved surface corresponding to the metal substrate on the side of the LED package. The heat dissipating device of claim 10, wherein the heat dissipation device comprises: a plate heat dissipation unit in which a plurality of plate heat dissipation fins extend along a circular outer circumferential surface of the heat dissipation unit to dissipate heat transferred from the LED package at an upper portion of the LED package in which the plurality of LEDs are integrated; And a corrugation type heat dissipation unit in which a plurality of corrugated heat dissipation fins are extended along a circular outer circumferential surface to dissipate heat transferred from the LED package, including heat radiated from the plate heat dissipation unit at an upper portion of the plate heat dissipation unit. To include, wherein the corrugated heat dissipation unit bulb type LED lighting device, characterized in that having a relatively large air inlet area compared to the plate-shaped heat dissipation unit. The apparatus of claim 11, wherein the plate heat dissipation unit is coupled to an upper portion of the LED package and has a central passage; And a plurality of heat dissipation fins formed integrally with the body and extending in a circular plate shape at equal intervals along the longitudinal direction of the body on an outer circumferential surface thereof, Bulb-type LED lighting device, characterized in that for forming the air inlet space in which the air rising by the convection phenomenon between the space between the heat radiation fins. 11. The apparatus of claim 10, wherein the corrugated heat dissipation unit comprises: a cylindrical body formed on the plate-shaped heat dissipation unit; A plurality of heat dissipation fins formed on the outer circumferential surface of the body and extending in a corrugated form at equal intervals along the longitudinal direction of the body; And a spacer ring for forming a gap between the plurality of heat dissipation fins. Bulb-type LED lighting device, characterized in that for forming the air inlet space in which the air rising by the convection phenomenon between the space between the heat radiation fins. The bulb type LED lighting apparatus of claim 13, wherein the metal substrate is formed of a polygonal surface including a lower surface. 15. The bulb type LED lighting apparatus according to claim 14, wherein the metal substrate is formed of a unitary single substrate bent into a plurality of unit substrates or polygons. An LED package having a plurality of LEDs mounted on a metal substrate; A screw cap for applying power to the LED package; The LED package is mounted at one side, and the screw cap is mounted at the other side, and a plurality of plate-type heat dissipation fins are provided along a circular outer circumferential surface to dissipate heat transferred from the LED package at the top of the LED package in which the plurality of LEDs are integrated. Plate-shaped heat dissipation unit is formed; And a corrugation type heat dissipation unit in which a plurality of corrugated heat dissipation fins extend along a circular outer circumferential surface to dissipate heat transferred from the LED package, including heat radiated from the plate heat dissipation unit, on the top of the plate heat dissipation unit. A heat dissipation device having a relatively larger air inflow area than the plate heat dissipation part; And, It is coupled to one side of the heat dissipating device for casing the LED package, a globe for scattering the light emitted from the LED in the shape of a curved surface corresponding to the metal substrate on the side of the LED package; Bulb-type LED lighting equipment. The apparatus of claim 16, wherein the plate heat dissipation unit is coupled to an upper portion of the LED package and has a central passage; And a plurality of heat dissipation fins formed integrally with the body and extending in a circular plate shape at equal intervals along the longitudinal direction of the body on an outer circumferential surface thereof, Bulb-type LED lighting device, characterized in that for forming the air inlet space in which the air rising by the convection phenomenon between the space between the heat radiation fins. 17. The apparatus of claim 16, wherein the corrugated heat dissipation unit comprises: a cylindrical body formed on the plate-shaped heat dissipation unit; A plurality of heat dissipation fins formed on the outer circumferential surface of the body and extending in a corrugated form at equal intervals along the longitudinal direction of the body; And a spacer ring for forming a gap between the plurality of heat dissipation fins. Bulb-type LED lighting device, characterized in that for forming the air inlet space in which the air rising by the convection phenomenon between the space between the heat radiation fins. The bulb type LED lighting apparatus of claim 16, wherein the metal substrate is formed of a polygonal surface including a lower surface. 20. The bulb type LED lighting apparatus of claim 19, wherein the metal substrate is formed of a plurality of unit substrates or an integral single substrate bent into polygons.

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