KR20090108791A - Probe member and probe card including the same - Google Patents

Abstract

PURPOSE: A probe unit and a probe card using the same are provided to connect to a connection pad on a wafer stably at a low or high temperature by controlling the interval between tips according to the thermal displacement of the object between a first test temperature and a second test temperature. CONSTITUTION: A body(101) has elasticity. A tip part(106) includes a plurality of tips arranged in the end part of the body in contact with a connection pad of the object. An interval between tip parts is decided according to the thermal displacement of the object between a first test temperature and a second test temperature.

Description

PROBE MEMBER AND PROBE CARD INCLUDING THE SAME}

The present invention relates to a probe member and a probe card comprising the same. More particularly, the present invention relates to a probe member including a probe member for electrically contacting an electrical signal for testing a semiconductor chip with a connection pad on a wafer.

Generally, a semiconductor device generally includes a fab process for forming an electrical circuit including electrical devices on a silicon wafer used as a semiconductor substrate, and for inspecting electrical characteristics of the semiconductor devices formed in the fab process. An electronic die sorting (EDS) process and a package assembly process for encapsulating and individualizing each of the semiconductor devices with an epoxy resin are manufactured.

The EDS process is performed to determine a defective semiconductor device among the semiconductor devices. The ID process is performed using a test apparatus called a probe card. The probe card applies an electrical signal while the probe is in contact with the pads of the semiconductor elements, and determines a defect based on a signal checked from the applied electrical signal.

 The wafer inspected by the DS process is inspected at a high temperature in a temperature range of about 80 ° C to 100 ° C. This may improve the reliability of the operation of the semiconductor device when the chip is tested in the high temperature state as described above. In particular, the wafer is inspected not only at the high temperature state but also at the low temperature state of -30 ° C or lower as the reliability of the high temperature state and the low temperature state is simultaneously required in the manufacturing process for manufacturing the semiconductor device. When inspecting the wafer within the above temperature range, the probe is also exposed to a high temperature and a low temperature so that thermal expansion or heat shrinkage occurs. In particular, since the silicon-based probe and the metal-based probe have different thermal expansion coefficients, the probe / wafer expansion / contraction values are different from each other. Therefore, as the electrical contact between the probe and the pad formed on the wafer becomes unstable, there arises a problem that the reliability of the ID process is deteriorated.

Accordingly, the present invention has been made in view of such a problem, and an object of the present invention is to provide a probe member capable of stably contacting a connection pad on a wafer in a high temperature and a low temperature state.

Another object of the present invention is to provide a probe card comprising the probe member described above.

In order to achieve the above object of the present invention, a probe member for a probe card includes a tip having a body having elasticity and a plurality of tips disposed at an end of the body for connection with a connection pad of the test object, The spacing between the tips is determined according to the amount of thermal displacement of the test object between different first and second test temperatures.

In one embodiment of the present invention, the body is bent to include an elastic portion having an elastic, the tip portion may be disposed at the end of the elastic portion.

In one embodiment of the invention, the tips may be arranged in the extending direction of the body. Here, the tips may be spaced apart from 3 to 40㎛.

In one embodiment of the invention, the tips may be arranged in two rows in the extending direction of the body. Here, the tips may be arranged such that the separation distance in the extension direction of the body is greater than the separation distance in the direction perpendicular to the extension direction.

In one embodiment of the present invention, the probe member may further include a terminal portion extending from one end of the body, the input and output electrical signals for inspecting the object to be inspected.

In order to achieve the object of the present invention described above, a probe member for a probe card extends from one end of the body, the terminal portion for inputting and outputting an electrical signal for inspecting the inspected object, and a connection pad of the inspected object. And a tip portion disposed at an end of the body, wherein the length of the tip portion in the extending direction of the body is determined according to the amount of thermal displacement of the inspected object between different first and second inspection temperatures.

In order to achieve the above object of the present invention, the probe card is disposed under the first wiring board having the circuit wiring and the first wiring board, and is connected to the body and the connection pad of the test object. And a tip having a plurality of tips disposed at an end, wherein the spacing between the tips is determined according to the amount of thermal displacement of the inspected object between different first and second inspection temperatures. Here, the tips are arranged in two rows in the extending direction of the body, the tips may be arranged such that the separation distance in the extension direction of the body is greater than the separation distance in the direction perpendicular to the extension direction.

The probe card according to an embodiment of the present invention may further include a second wiring board provided on the first wiring board and a connector for electrically connecting the first wiring board and the second wiring board.

According to such a probe member and a probe card including the same, the electrical connection between the probe member and the inspected object can be stabilized when the inspected object is inspected at a high temperature and a low temperature state, which is a temperature test condition. Therefore, when the probe member is applied to the probe card, the test object may be inspected by using one probe card under a plurality of temperature conditions.

With reference to the accompanying drawings will be described in detail a probe member for a probe card and a probe card including the same according to an embodiment of the present invention. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the drawings, similar reference numerals are used for similar elements. In the accompanying drawings, the dimensions of the structure is shown to be larger than the actual size for clarity of the invention, or to reduce the actual size to understand the schematic configuration.

In addition, terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

1A and 1B are cross-sectional views illustrating a probe member for a probe card according to an embodiment of the present invention.

1A and 1B, the probe member 100 for a probe card according to an embodiment of the present invention includes a body 101 and a tip portion 106. The probe member 100 directly contacts an object under test such as a semiconductor device and transmits an electrical signal to the object under test. As shown in FIG. 1A, the probe member 100 may be disposed without a separate guide member. Alternatively, the probe member 100 is accommodated in the receiving groove formed in the guide member 120 as shown in Figure 1b. Although not shown, only the terminal portion 103 of the probe member 100 may be inserted into the guide member 120. The guide member 120 may guide the position of the probe member 100. In addition, the guide member 120 may electrically insulate the adjacent probe members 100 from each other.

The body 101 is inserted into the receiving groove formed in the guide member 120 to fix the probe member 100 to the guide member 120. Alternatively, the body 101 may extend in parallel with the object under test from the end of the terminal portion 103.

On the other hand, the body 101 may be electrically connected to a connection pad (not shown) formed on a circuit board (not shown) for transmitting an electrical signal from the outside. For example, the body 101 may directly contact the connection pad.

In one embodiment of the present invention, the body 101 may further include an elastic portion 105 is bent and elastic. The elastic part 105 pressurizes the tip part 106 to keep the tip part 106 in contact with the object under test. In other words, when the tip portion 106 contacts the inspected object, the elastic portion 105 presses the tip portion 106 against the inspected object by using an elastic force to stably contact the tip 106 and the inspected object. Let's do it. In addition, the elastic part 105 suppresses the tip part 106 from pressurizing the said to-be-tested object too much when the tip part 106 contacts with the said to-be-tested object.

On the other hand, the elastic portion 105 may have a beam (beam) shape. As another example, the elastic part 105 may have an arc shape.

Tip portion 106 is provided at the second end of the body 101 opposite to the first end. For example, the tip portion 106 may be provided on the lower surface of the second end. The tip portion 106 has a pointed shape and directly contacts the test subject. For example, the tip portion 106 is in direct contact with a connection pad (not shown) formed in the object under test.

In one embodiment of the present invention, when the body 101 includes an elastic portion 105, the tip portion 106 may be disposed at one end of the elastic portion 105.

In one embodiment of the present invention, the probe member probe member 100 according to one embodiment of the present invention may further include a terminal portion (103).

The terminal portion 103 extends from the first end of the body 101. For example, the terminal portion 103 may extend in a direction substantially perpendicular to the extending direction of the body 101. The terminal unit 103 inputs and outputs an electrical signal for inspecting the object under test.

The terminal portion 103 protrudes to the upper surface of the guide member 120. Therefore, the terminal portion 103 can be easily connected with an external signal line for providing an electrical signal for inspecting the object under test. For example, the terminal unit 103 may be electrically connected to a circuit board on which an external signal line for providing an electrical signal for inspecting an object to be inspected is formed. As another example, the upper surface of the terminal portion 103 and the upper surface of the guide member 120 have the same height. As another example, the upper surface of the terminal unit 103 may be lower than the upper surface of the guide member 120.

Meanwhile, the terminal portion 103 may be fixed to the guide member 120 by an adhesive or solder paste.

On the other hand, the tip portion 106 is an extension direction of the body 101 (hereinafter, referred to as a first direction) in response to thermal displacement due to thermal expansion or thermal contraction of the inspected object according to different first and second inspected temperatures of the inspected object. Has a separation distance d). For example, the first test temperature may be about 80 ° C. and the second test temperature may be about −30 ° C.

Thermal displacement of tip portion 106 is due to thermal expansion or thermal contraction of body 101. In addition, the thermal displacement of the tip 106 may be changed according to the material and size of the probe member 100 including the tip 106. In addition, the thermal displacement of the tip portion 106 may vary depending on the material and size of the holder (not shown) holding the probe member 100.

The separation distance d between the first and second tips 107 and 108 may be determined by the amount of thermal displacement in the first direction of the object. However, the amount of thermal displacement of the subject may vary depending on the measurement position. Therefore, the separation distance d between the first and second tips 107 and 108 may be adjusted according to the position of the connection pad to be connected. For example, the position change amount of the periphery of the inspected object is larger than the position change amount of the central portion of the inspected object. Accordingly, the separation distance d between the first and second tips 107 and 108 connected to the connection pad disposed at the periphery of the object is determined by the first and second tips connected to the connection pad disposed at the center of the object. It may be larger than the separation distance between (107, 108).

In addition, the displacement amount of the connection pad formed in the periphery of the subject is equal to the thermal displacement amount of the periphery of the subject. Therefore, the thermal displacement of the inspected object is limited to the thermal displacement of the periphery of the inspected object. Here, the size of the connection pad is not limited to be changed according to the design of the inspected object. For example, the width and length of the connection pad may be 70 μm × 70 μm.

In one embodiment of the present invention, the distance between the first and second tips 107, 108 according to the difference in the amount of thermal displacement of the center and the periphery of the object under test depends on the area where the probe member 100 is located in the probe card. It can also be adjusted. For example, the separation distance d between the first and second tips 107 and 108 positioned to correspond to the periphery of the test object is the first and second tips 107 and 108 positioned to correspond to the center of the test subject. It may be greater than the separation distance (d) between.

The separation distance d of the first and second tips 107 and 108 may take into account the diameter of the tip. In addition, the distance d of the first and second tips 107 and 108 may also consider the length of the scrub that slides when the tip 106 contacts the connection pads. Furthermore, the separation distance d may also consider the size of the connection pad and the distance between the connection pads.

In addition, when the probe member 100 comes into contact with the inspected object, a scrub, in which the tip portion 106 slides by elasticity, particularly in the first direction, is generated, whereas in the second direction, the guide member ( As guided by 120, the scrub can be suppressed. Accordingly, the tip part 106 including the plurality of tips 107 and 108 spaced apart in the first direction may stably contact the connection pad.

Table 1 below is an experimental example of the thermal expansion and thermal contraction for the test object. As temperature conditions, the amount of change in length due to thermal expansion and thermal contraction was measured on the test object at an initial temperature of 23 ° C. at 87 ° C. as the first test temperature and at −30 ° C. as the second test temperature. In addition, it is assumed that the length change amount of the inspected object is the same not only in the first direction but also in the second direction perpendicular to the first direction.

In addition, a silicon substrate including a semiconductor element formed on a silicon wafer as a test object and having a diameter of 300 mm was used as the test object. Connection pads were formed in the silicon substrate, and the lengths of the widths and widths of the connection pads were 70 μm × 70 μm.

Table 1

At this time, the displacement amount of the tip portion 106 of the probe card between the first and second inspection temperatures under the above temperature condition was 10 to 20 μm in the first direction. In the present experimental example, the displacement amount of the substrate under test and the connection pad formed on the periphery of the substrate were 83.47 μm. Therefore, the displacement amount of the connection pad formed on the board | substrate was 83.47 micrometers. As a result, a non-contact problem may occur in which the probe member 100 is not electrically connected to the connection pad according to the displacement of the connection pad 106 due to the temperature change.

In one embodiment of the present invention, the separation distance d of the first and second tips 107 and 108 may be 3 to 40 μm. When the separation distance is less than 3 μm, the probe member may not be electrically connected to the connection pad according to the change of the position of the tip part due to the temperature change because it does not correspond to the position change amount of the tip part 106. Meanwhile, when the separation distance is greater than 40 μm, a problem may occur in which the first and second tips 107 and 108 connect to adjacent connection pads, respectively. As a result, as the separation distance d of the first and second tips 107 and 108 is 3 to 40 μm, the tip part 106 can stably directly contact the connection pad in the high temperature state and the low temperature state. .

2A and 2C are plan views illustrating an arrangement of a plurality of tips included in a probe member according to another exemplary embodiment of the present invention.

Referring to FIG. 2A, the plurality of tips may be arranged in parallel in the first direction. When the object under test causes thermal displacement in the first direction, tips arranged in parallel in the first direction may be connected to the connection pad of the object under test.

Referring to FIG. 2B, an imaginary line formed along the plurality of tips may have a triangular shape. In consideration of the scrub phenomenon in the first direction, the triangle may have a longer side than the other side.

Referring to FIG. 2C, the plurality of tips may be arranged in two rows in parallel with the first direction. Considering the thermal expansion along the extension direction of the elastic portion 103 and the scrub occurring in the first direction, the tips have a separation distance a in the first direction more than the separation distance b in the second direction. Can be arranged to be large. Therefore, the probe member having a plurality of tips arranged in two rows can be stably arranged on the connection pad formed on the object under test.

3 is a cross-sectional view for explaining a probe member for a probe card according to another embodiment of the present invention.

Referring to FIG. 3, a probe member for a probe card according to another embodiment of the present invention includes a body 201, a terminal portion 203, an elastic portion 205, and a tip portion 206. The body 201, the terminal portion 203 and the elastic portion 205 are substantially the same as the body 101, the terminal portion 103, and the elastic portion 105 described with reference to FIG. 1, and thus a detailed description thereof will be omitted. do.

The tip portion 206 is disposed at the second end of the elastic portion 205. The tip portion 206 may have a length L in the first direction determined according to the amount of thermal displacement of the object under different first and second inspection temperatures.

Meanwhile, the length L of the tip portion 206 in the first direction may be determined in consideration of the diameter of the tip. In addition, the extension length L of the tip portion 206 may also take into account the length at which the tip portion 206 slips when it comes in contact with the connection pads. Furthermore, the extension length L of the tip portion 206 may also consider the size of the connection pad and the spacing between the connection pads.

For example, the extension length L of the tip portion 206 may be 3 to 40 μm. When the extension length L of the tip portion 206 is less than 3 μm, the probe member may not be electrically connected to the connection pad due to a change in the position of the tip portion due to temperature change because the tip portion 206 does not correspond to the position change amount. May occur. On the other hand, when the extension length L of the tip portion 206 is greater than 40 μm, a problem may occur in that the tip portion 206 simultaneously connects to adjacent connection pads. As a result, as the extension length L of the tip portion 206 is 3 to 40 µm, the tip portion 206 can stably contact the connection pad stably in the high temperature state and the low temperature state.

4 is a cross-sectional view for describing a probe card according to an exemplary embodiment of the present invention.

Referring to FIG. 4, the probe card 300 according to an exemplary embodiment of the present invention may apply an electrical signal to semiconductor devices and inspect a defect by a signal checked from the applied electrical signal. The probe card 300 includes a probe member 310, a guide member 315, a first wiring board 320, a second wiring board 330, and a connector 340.

The probe member 310 is inserted into and fixed to the guide member 315. Detailed description of the probe member 310 is substantially the same as the description of the probe member 100 with reference to FIG. 1.

The guide member 315 is formed with a receiving groove for receiving the probe member 310.

The first wiring board 320 is disposed on the probe member 310. The first wiring board 320 has a first pad 321, a second pad 322, and a first wiring 323. The first pad 321 is provided on the top surface of the first wiring board 320, and the second pad 322 is provided on the bottom surface of the first wiring board 320. The first wire 323 electrically connects the first pad 321 and the second pad 322.

The first wiring board 320 is electrically connected to the probe member 310. For example, the second pad 322 of the first wiring board 320 is connected to the probe of the probe member 310.

The second wiring board 330 is provided on the first wiring board 320. The second wiring board 330 has a second wiring (not shown), and a connection hole 331 connected to the second wiring penetrates up and down. A conductive film (not shown) is formed on the inner wall of the connection hole 331. The second wiring is electrically connected to a separate test device (not shown).

In one embodiment of the present invention, the second wiring board 330 may have the same structure as the first wiring board. For example, the second wiring board 330 may have a third pad (not shown), a fourth pad (not shown), and a second wiring (not shown). The third pad is provided on the top surface of the second wiring board 330, and the fourth pad is provided on the bottom surface of the second wiring board 330. The second wiring electrically connects the third pad and the fourth pad. Here, the connection body 340 may directly contact the fourth pad.

The connector 340 electrically connects the first wiring board 320 and the second wiring board 330. In detail, the connector 340 electrically connects the conductive film of the connection hole 331 and the first pad 321. The connector 340 includes a conductive material. Examples of the conductive material include metals.

The lower end of the connector 340 is electrically connected to the first pad 321 of the first wiring board 320. For example, the lower end of the connector 340 may contact the first pad 321. As another example, the lower end of the connector 340 may be fixed to the first pad 321.

The upper end of the connection body 340 is inserted into the connection hole 331 of the second wiring board 330. For example, an upper end of the connection body 340 may contact the conductive film of the connection hole 331. As another example, an upper end of the connection body 340 may be fixed to the conductive film of the connection hole 331.

Although the detailed description of the present invention has been described with reference to the preferred embodiments of the present invention, those skilled in the art or those skilled in the art will have the idea of the present invention described in the claims to be described later. It will be understood that various modifications and variations can be made in the present invention without departing from the scope of the present invention.

According to such a probe member and a probe card including the same, the electrical connection between the probe member and the inspected object may be stabilized when the inspected object is inspected at a high temperature and a low temperature state, which is a temperature test condition. Therefore, when the probe member is applied to the probe card, the test object may be inspected by using one probe card under a plurality of temperature conditions. Obviously, the probe member and the probe card including the same of the present invention can be applied to inspection of a flat panel display device as well as a semiconductor device.

1A and 1B are cross-sectional views illustrating a probe member for a probe card according to embodiments of the present invention.

2A and 2C are plan views illustrating an arrangement of a plurality of tips included in a probe member according to another exemplary embodiment of the present invention.

3 is a cross-sectional view for explaining a probe member for a probe card according to another embodiment of the present invention.

4 is a cross-sectional view for describing a probe card according to an exemplary embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

100, 200: probe member 101, 201: body

103, 203: terminal portion 105, 205: elastic portion

106,206: Tip part 107,207: First tip

108, 208: second tip 300: probe card

Claims (11)

An elastic body; And A tip portion having a plurality of tips disposed at an end of the body for connection with a connection pad of a test subject; The interval between the tips is probe member for a probe card, characterized in that determined according to the amount of thermal displacement of the test object between the different first test temperature and the second test temperature. The probe member of claim 1, wherein the body includes an elastic portion that is bent and elastic, and the tip portion is disposed at an end portion of the elastic portion. The probe member of claim 1, wherein the tips are arranged in an extending direction of the body. The probe member of claim 1, wherein the tips are spaced 3 to 40 μm apart. The probe member of claim 1, wherein the tips are arranged in two rows in the extending direction of the body. 6. The probe member of claim 5 wherein the tips are arranged such that the separation distance in the extension direction of the body is greater than the separation distance in a direction perpendicular to the extension direction. The probe member of claim 1, further comprising a terminal unit extending from one end of the body and configured to input and output an electrical signal for inspecting the object under test. Body; A terminal unit extending from one end of the body and configured to input and output an electrical signal for inspecting an object to be inspected; And A tip portion disposed at an end of the body for connection with a connection pad of the object under test; And a length in the extending direction of the body of the tip portion is determined according to the amount of thermal displacement of the object under test between different first and second inspection temperatures. A first wiring board having circuit wiring; And A tip part disposed under the first wiring board, the tip part including a plurality of tips disposed at an end of the body to be connected to the body and the connection pad of the object under test, and the gaps between the tips are different from each other; 1. A probe card comprising a probe member determined according to an amount of thermal displacement of the test object between a test temperature and a second test temperature. The method of claim 9, wherein the tips are arranged in two rows in the extending direction of the body, the tips are arranged so that the separation distance in the extending direction of the body is greater than the separation distance in the direction perpendicular to the extending direction. Probe card. The semiconductor device of claim 9, further comprising: a second wiring board on the first wiring board; And And a connector for electrically connecting the first wiring board and the second wiring board.

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