KR20090100211A - Electronic component connecting apparatus, electronic unit, and electronic apparatus - Google Patents

Abstract

PURPOSE: An electronic component junction device, an electronic unit and an electronic device capable of electrically joining a circuit substrate are provided to prevent the complexity of the circuit and reduce the electrical resistance. CONSTITUTION: An electronic component junction device(1) includes an electronic component junction unit, a circuit substrate joint, and a conductive unit. The circuit substrate joint welds to the circuit board. The terminal and a circuit board of one are electrically joined in the circuit substrate. In the conductive section, it electrically welds to an outside except the circuit board with the terminal.

Description

ELECTRONIC COMPONENT CONNECTING APPARATUS, ELECTRONIC UNIT, AND ELECTRONIC APPARATUS

The present invention relates to an electronic component bonding apparatus, an electronic unit, and an electronic apparatus for electrically bonding an electronic component and a circuit board.

Prior to shipping a semiconductor component such as an LSI, an IC, or the like, a semiconductor test is conducted in which power is supplied to the semiconductor component to extract a signal, and the operation of the semiconductor component is confirmed. In this semiconductor test, it is common to use the test apparatus provided with the socket board which the board | substrate for electric power supply and the board | substrate for signal extraction overlapped, and the socket which penetrates the some probe through the resin case. In the semiconductor component and the socket board, a plurality of electrode pads for signal extraction (hereinafter referred to as signal pads) and electrode pads for power supply (hereinafter referred to as power pads) are arranged in a plurality and arranged on the socket board. The socket is mounted, and by mounting the semiconductor component on the socket, these semiconductor components and the electrode pads of the socket board are electrically connected by the probe of the socket.

However, in recent years, the amount of current flowing through a semiconductor component at the time of operation increases due to an increase in leakage current due to miniaturization of a semiconductor component, or an increase in power supply frequency due to a higher speed of a server device on which the semiconductor component is mounted. The power consumption has been up to over 100 [W], which was at most 50 [W]. In addition, as the data bus width of the server device expands, the ratio of the signal pads to the entire electrode pads increases, and conversely, the ratio of the power pads decreases, thereby reducing the power pads of the semiconductor components and the socket boards. The amount of current flowing per one power probe to be connected has increased rapidly. Since the probe is surrounded by a resin case, it is difficult to dissipate heat. If the amount of heat generated increases with the increase in the amount of current, the pressure spring or the like that presses the probe onto the electrode pad may be damaged.

In this regard, it is widely practiced to provide a fan and a heat sink in the socket to efficiently dissipate heat generated by the probe. In addition, a through hole is provided in the substrate for power supply in which the signal leader line is embedded, gold plating is applied to the inner wall, a contact pin is inserted into the through hole, and the substrate and the contact pin are pressed against the semiconductor component with an elastic material. There is also proposed a technique for directly contacting (see Patent Document 1). According to this technique, the current path between the power supply substrate and the contact pin can be shortened, so that the resistance can be reduced and the amount of heat generated can be suppressed.

[Patent Document 1] Japanese Patent Application Laid-Open No. 2001-13208

However, in the above-described technique, the signal leader line is embedded in the power supply substrate, and the circuit becomes complicated when the signal leader line is added. For this reason, although it is applicable as a high temperature test socket of a semiconductor component, there exists a problem that it is difficult to use as a normal socket actually mounted in a server apparatus etc. and used for connecting a semiconductor component and an external component.

In view of the above circumstances, there is provided an electronic component bonding apparatus, an electronic unit, and an electronic device that can reduce the complexity of a circuit, reduce an electrical resistance, suppress a heat generation amount, and can efficiently radiate heat.

The basic form of the electronic component bonding apparatus which achieves the said objective is the electronic component junction part joined with the electronic component which has a some terminal,

A circuit board bonding portion which is bonded to a circuit board and electrically joins at least one terminal and the circuit board,

It is characterized by having a conduction part electrically connected with at least one terminal and the exterior other than a circuit board.

According to the basic aspect of this electronic component bonding apparatus, when a circuit board junction part joins a circuit board for signals, etc., an electronic component and a circuit board are electrically connected, and a electrically conductive part joins an electronic component, and also joins a power supply device etc., an electronic component And external devices are connected to the power source. Therefore, the current path between the electronic component and the external device can be shortened, the amount of heat generated can be suppressed, the device can be prevented from being damaged, and the complexity of the circuit can be suppressed to increase the signal line.

Moreover, the basic form of the electronic unit which achieves the said objective is

An electronic component junction part for joining with an electronic component having a plurality of terminals,

A circuit board electrically connected to at least one of the terminals;

It is characterized by having a conduction part electrically connected with at least one terminal and the exterior other than a circuit board.

According to the basic form of this electronic unit, the heat generation amount can be suppressed, the complexity of the circuit can be suppressed, and the present invention can be suitably applied as a socket for connecting electronic components and external circuits.

In addition, the basic form of the electronic device that achieves the above object,

An electronic component having a plurality of terminals,

Electronic component joint part which joins with electronic component,

A circuit board electrically connected to at least one terminal,

A power supply unit for supplying power to electronic components and circuit boards;

It is arrange | positioned between an electronic component junction part and a circuit board, and has a conducting part which supplies the electric power from a power supply part to an electronic component.

According to the basic form of this electronic device, the complexity of the circuit can be suppressed, the electrical resistance can be reduced, and the amount of heat generated can be suppressed.

As described above, according to the basic form of the electronic component bonding apparatus, the electronic unit, and the electronic device, the complexity of the circuit can be suppressed, the electrical resistance can be reduced, the amount of heat generated can be suppressed, and the heat radiation can be efficiently conducted.

EMBODIMENT OF THE INVENTION Hereinafter, with reference to drawings, specific embodiment regarding the basic form and application form mentioned above is demonstrated.

1 is a schematic plan view of the socket unit 10.

The socket unit 10 connects an electronic device such as a semiconductor package, a peripheral device or an external circuit, and executes a semiconductor test for confirming operation by applying a power supply voltage and a high frequency signal to the semiconductor package. As shown in FIG. 1, in the socket unit 10, a plurality of pins 21 penetrates from an upper surface of a circular socket case 20, and supplies power to an electronic device from the side of the socket case 20. The voltage side VDD plate 11 and the ground side GND plate 12 protrude.

2 is a side view of the electronic device 1 including the socket unit 10.

The electronic device 1 shown in FIG. 2 includes a signal board 30 for signal extraction, a socket unit 10 mounted on the signal board 30, and a semiconductor package mounted on the socket unit 10 ( 40, the power supply circuit 50 connected to the VDD plate 11 and the GND plate 12, the control circuit 60 connected to the signal substrate 30, the upper side of the semiconductor package 40 and the VDD plate. Blowing fan 71, 72, 73 attached to the side of 11 and GND plate 12, the heat sink 80 etc. which dissipate the heat in the electronic device 1 are provided. The semiconductor package 40 corresponds to one example of the above-described electronic components, and the signal board 30 corresponds to one example of the above-described circuit board, and the voltage side (VDD) plate 11 and the ground side (GND) plate 12 ) Corresponds to an example of the conductive section described above.

The semiconductor package 40 has an LSI 420 including semiconductor elements or the like mounted on an upper surface of the multilayer substrate 410, and the pins 21 of the socket unit 10 are connected to the lower surface of the multilayer substrate 410. A plurality of electrode pads 430 are attached. The plurality of electrode pads 430 are connected to the VDD pad 441 connected to the VDD plate 11, the GND pad 442 connected to the GND plate 12, and the signal substrate 30. A signal pad 443 is included. The electrode pad 430 of the semiconductor package 40 corresponds to an example of the plurality of terminals described above.

The signal board 30 includes an electrode pad 31 electrically connected to the signal pad 443 at a position corresponding to the signal pad 443 of the semiconductor package 40 with the socket unit 10 interposed therebetween. It is.

The VDD plate 11 of the socket unit 10 has through holes 11A and 11B at positions corresponding to the VDD pad 441, the GND pad 442, and the signal pad 443 of the semiconductor package 40, respectively. , 11C), and through holes 12A, 12B, and 12C are provided in the GND plate 12 at positions corresponding to the VDD pad 441, the GND pad 442, and the signal pad 443, respectively. It is installed. In addition, through holes 20A, 20B, and 20C are provided on the upper surface of the socket case 20 at positions corresponding to the VDD pad 441, the GND pad 442, and the signal pad 443, respectively. The through hole 20D is provided in the lower surface of the socket case 20 at a position corresponding to the signal pad 443. In addition, pressure pins 91 and 92 protruding to a height at which each of the VDD plate 11 and the GND plate 12 are provided are fixed to the lower surface of the socket case 20, and these pressure pins 91 and 92 are fixed. Springs 93 and 94 for pressing the upper side) are attached. The pressing pins 91 and 92 are made of nonmetals such as resin, and the upper end side is spherical processed.

The signal pad 443 of the semiconductor package 40 and the electrode pad 31 of the signal substrate 30 each have a through hole 11C provided in each of the VDD plate 11, the GND plate 12, and the socket case 20. And pogo pins 95 penetrating through 12C, 20C, and 20D. The pogo pin 95 has a spring mounted therein, and the front end and the rear end are pressed against each of the signal pad 443 of the semiconductor package 40 and the electrode pad 31 of the signal substrate 30. In addition, the through holes 11C and 12C of the VDD plate 11 and the GND plate 12 through which the pogo pins 95 pass are formed larger than the outer shape of the pogo pins 95, and the pogo pins 95 The VDD plate 11 and the GND plate 12 are insulated without contact. The pogo pin 95 corresponds to an example of the above-mentioned circuit board junction part.

The plungers 96 and 97 supported by the pressing pins 91 and 92 are connected to the VDD pad 441 and the GND pad 442 of the semiconductor package 40 from below.

Here, once, the description of FIG. 2 is stopped, and the connection of the plungers 96 and 97, the VDD plate 11 and the GND plate 12 will be described in detail.

3 is a view for explaining the connection between the plungers 96 and 97, the VDD plate 11 and the GND plate 12, and FIG. 4 is a plan view in each of positions A to J shown in FIG. .

As shown in FIG. 3A, the pressing pin 91 fixed at a position corresponding to the VDD pad 441 of the semiconductor package 40 protrudes to the height of the VDD plate 11, and the plunger ( In the state that it is not in contact with 96, the pressing spring 93 extends.

In addition, the socket unit 10 is mounted on the signal board 30, and a guide plate made of resin supporting the plungers 96 and 97 and the pressing pins 91 and 92 in the socket case 20. (23A, 23B, 23C, 23D), and the VDD plate 11 and GND plate 12 sandwiched by these guide plates 23A, 23B, 23C, and 23D are arrange | positioned. As shown in Fig. 4A, the upper surface of the socket case 20 has a through hole 20A, at a position corresponding to each of the VDD pad 441, the GND pad 442, and the signal pad 443, respectively. 20B, 20C (integrated and shown as the through-hole 101 in FIG. 4) is provided, and as shown in FIG. 4 (B), the socket case 20 has a hollow cylinder shape in the center. 4 (C), (E), (G), (H), and (I), the guide plates 23A, 23B, 23C, 23D, and 23E accommodated in the socket case 20 are provided. The through hole 102 is provided at a position corresponding to each of the through holes 20A, 20B, and 20C on the upper surface of the socket case 20, and as shown in Figs. 4D and 4F, VDD In the plate 11 and the GND plate 12, the through holes 11A, 11B, 11C, 12A, 12B, 12C at positions corresponding to the through holes 20A, 20B, 20C on the upper surface of the socket case 20, respectively. 4 is collectively shown as through holes 103 and 104. As described later, the through holes 11A, 11B, 11C, 12A, 12B, and 12C provided in the VDD plate 11 and the GND plate 12 differ in size by position. In addition, the through hole 20D is provided in the lower surface of the socket case 20 only at a position corresponding to the signal pad 443.

In addition, as shown in FIG. 3B, when the plunger 96 is inserted into the socket case 20, the pressing spring 93 contracts to press the pressing pin 91 upwards. The plunger 96 is pressed against the pad 441 for the VDD of the semiconductor package 40. In the position corresponding to the pad 441 for VDD, the through hole 11A of the VDD plate 11 has a smaller hole diameter than the through hole 12A provided in the GND plate 12, and the plunger 96 has a VDD plate. By contacting the inner wall of the through hole 11A of 11, it is directly connected to the VDD plate 11. In addition, since the upper end of the pressing pin 91 is formed in a spherical shape, and the lower end of the plunger 96 is formed obliquely, the plunger 96 slides in an inclined direction by the pressing pin 91 to form a VDD plate. (11) can be contacted in a large surface, and can be reliably connected.

In addition, as shown in FIG. 3C, the pressing pin 92 fixed at a position corresponding to the GND pad 442 of the semiconductor package 40 protrudes to the height of the GND plate 12. When the plunger 97 is inserted, the pressing spring 94 contracts to press the pressing pin 92 upward, and the plunger 97 is pressed against the GND pad 442 of the semiconductor package 40. In the position corresponding to the GND pad 442, the through hole 12B provided in the GND plate 12 is smaller than the through hole 11B of the VDD plate 11, and the plunger 97 has a smaller hole diameter. The inner wall of the through hole 11B of the GND plate 12 is not in contact with the through hole 11B of the VDD plate 11. That is, the plunger 97 is insulated from the VDD plate 11 and is directly connected to the GND plate 12.

2 will be described again.

When the semiconductor test is conducted, when electric power is supplied from the power supply device 50, current flows from the VDD plate 11 to the semiconductor package 40 through the plunger 96, and from the plunger 97 to the GND plate 12. Flows further into. In addition, the signal drawn out from the semiconductor package 40 is provided to the signal substrate 30 via the pogo pin 95, and is transmitted to the control circuit 60. Here, in the electronic device 1 shown in FIG. 2, since the electric current flows only to the plungers 96 and 97 without being transmitted to the resin pressing pins 91 and 92, the VDD plate 11 and the GND plate 12. ), The current path between the semiconductor package 40 and the semiconductor package 40 can be shortened, thereby reducing the resistance to suppress the amount of heat generated, and preventing breakage of the pressing springs 93 and 94.

In addition, when the semiconductor package 40 is mounted on the socket unit 10, the plungers 96 and 97 are urged downward toward the pressing pins 91 and 92, and the pressing pins 91 and 92 are pressurized springs. The upper end of the plunger 96, 97 slides in an oblique direction along the spherical shape of the pressing pins 91, 92, and the plunger 96, 97 is pressed against the VDD plate (93, 94). 11) and the inner wall of the through-holes 11A and 12B of the GND plate 12 in wide contact. For this reason, the resistance between the plungers 96 and 97, the VDD plate 11 and the GND plate 12 is reduced, and the amount of heat generated can be suppressed.

In the electronic device 1, the VDD plate 11, the GND plate 12, and the signal substrate 30 are arranged side by side in the height direction, and the VDD plate 11, the GND plate 12, and the signal are arranged side by side. Since the lengths of the plungers 96 and 97, the pogo pins 95 and the pressing pins 91 and 92 supporting the plungers 96 and 97 are adjusted according to which of the substrates 30 is connected, Signal line can be increased by suppressing the complexity, and it can be applied not only as a socket for high frequency test but also as a normal socket for connecting the semiconductor package 40 and an external circuit.

5 is a diagram illustrating the flow of heat in the electronic device 1.

Since the VDD plate 11 and the GND plate 12 are plates for supplying electric power, they are made of a conductive metal or the like. 2, the VDD plate 11 and the GND plate 12 are directly connected with the plungers 96 and 97 which are heat generating sources. Heat generated by the plungers 96 and 97 is transferred by the VDD plate 11 and the GND plate 12 having good thermal conductivity, and the blowing fan 71 provided on the side of the VDD plate 11 and the GND plate 12. 72 to radiate heat from the heat sink 80. In addition, the plungers 96 and 97 are in contact with one of the VDD plate 11 and the GND plate 12, but since a gap is provided between the other, the air layer is formed. This air layer also dissipates heat from the plungers 96 and 97.

In addition, as shown in FIG. 5, since the socket case 20 has a circular shape, the wind sent from the blower fan 73 flows to both sides along the edge of the socket case 20, and the VDD plate 11 and It is transmitted to the upper surface of the GND plate 12. As described above, according to the electronic device 1, the amount of heat generated can be suppressed and the heat dissipation efficiency can be improved. In fact, in the conventional socket, the pressure spring or the like has been damaged by the heat generation amount of about 20 [W] to 50 [W], but according to the socket unit 10 of the present embodiment, one plunger 96, 97 Even if the amount of generated heat of approximately 4 [A] x voltage 1.00 [V] x 100 = 400 [W] flowed, damage could be prevented.

Here, although the example which used the socket unit which is a specific embodiment of an electronic component bonding apparatus as a socket for a semiconductor test was demonstrated, the above-mentioned socket unit is applied as a normal socket for connecting a semiconductor component, an external circuit, etc., Also good.

1 is a schematic plan view of a socket unit;

2 is a side view of an electronic device 1 including a socket unit.

3 is a diagram for explaining connection of a plunger, a VDD plate, and a GND plate.

4 is a plan view in each of positions A to J shown in FIG. 3.

5 is a diagram illustrating a heat flow in an electronic device.

<Explanation of symbols for the main parts of the drawings>

10: socket unit 11: VDD plate

12: GND plate 20: socket case

30: signal substrate 40: semiconductor package

50: power supply circuit 60: control circuit

71, 72, 73: blower fan 80 heat sink

Claims (10)

An electronic component junction part for joining with an electronic component having a plurality of terminals, A circuit board bonding portion which is bonded to a circuit board and electrically joins at least one of the terminals and the circuit board; A conductive portion electrically connected to the outside of the circuit board and at least one of the terminals; Electronic component bonding apparatus comprising a. The electronic component bonding apparatus according to claim 1, wherein the conductive portion supplies power to the electronic component for driving the electronic component. The electronic component bonding apparatus according to claim 1, wherein the conductive portion conducts heat generated by the electronic component to the outside. The electronic component bonding apparatus according to claim 1, wherein the conductive portion is electrically bonded to the terminal in accordance with the bonding of the electronic component bonding portion and the electronic component. An electronic component junction part for joining with an electronic component having a plurality of terminals, A circuit board electrically connected to at least one of the terminals; A conductive portion electrically connected to the outside of the circuit board and at least one of the terminals; Electronic unit comprising a. 6. The electronic unit according to claim 5, wherein the conductive portion supplies power to the electronic component for driving the electronic component. 6. The electronic unit according to claim 5, wherein the conductive portion conducts heat generated by the electronic component to the outside. The electronic unit according to claim 5, wherein the conductive portion is electrically bonded to the terminal in accordance with the bonding of the electronic component bonding portion and the electronic component. An electronic component having a plurality of terminals, An electronic component joint part to be joined to the electronic component, A circuit board electrically connected to at least one of the terminals; A power supply unit supplying power to the electronic component and the circuit board; A conducting portion disposed between the electronic component bonding portion and the circuit board to supply the power from the power supply portion to the electronic component; Electronic device comprising a. The electronic device of claim 9, wherein the conductive portion heat conducts heat generated by the electronic component.

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