KR20090084340A - Photocurable resin composition and method for preparing of mold using the same - Google Patents

Abstract

A photocurable resin composition is provided to ensure non-swelling property by an organic solvent, good mechanical property, high restoration, and transmissivity. A photocurable resin composition comprises (a) 30-90 parts by weight of reactive ester-based oligomer having a functional group; (b) 10-70 parts by weight of an epoxy-based oligomer having a functional group or a reactive fluorinated oligomer having a functional group; (c) based on 100.0 parts by weight of the oligomer of (a) + (b), 5-30 parts by weight of a mixture containing at least one selected from the group consisting of an olefin-based unsaturated compound, an unsaturated compound containing an epoxy group, and a silicon-based compound having an epoxy group, amine group and fluorine group; and (d) 0.1-10 parts by weight of a photoinitiator based on 100.0 parts by weight of the oligomer.

Description

Photocurable resin composition and method for preparing resin mold using same {Photocurable resin composition and method for preparing of mold using the same}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photocurable resin composition and a method of manufacturing a resin mold using the same. In particular, the present invention relates to a polydimethylsiloxane (PDMS), a thermosetting polymer, and a photocurable polymer resin material. The present invention relates to a photocurable resin composition having a non-swelling characteristic and having relatively large mechanical properties, high restoring force and transmittance, and a method of manufacturing a resin mold using the same.

As is well known, a photolithography method is widely used as a method of forming a fine pattern on a substrate. The photolithography method has the advantage that the fine pattern can be counted uniformly and stably on the substrate, but has the disadvantage of having to go through several steps (resin coating, heat treatment, exposure, development, cleaning, etching, etc.). This complex process requires expensive equipment in each step, and has a disadvantage in that it takes a lot of time to control patterns and pattern formation due to margins in each process. This, in turn, is a fundamental cause of an increase in manufacturing costs and a decrease in productivity.

Imprint lithography technology is one of several methods introduced to overcome the limitations of the conventional photolithography method and is recognized as a next generation lithography technology. Imprint lithography technology is an economical and effective technique for producing microstructures by transferring a stamped stamp of microstructures onto the surface of a spincoated or dispensed resist onto a substrate. Technology.

Early imprint techniques used a method in which the surface of a resist-coated substrate was pressed under high pressure at a high temperature above the glass transition temperature, and then cooled and separated. However, this method has the advantage of easy process and low equipment price, while long process time and high pressure are required. In particular, since high temperature and high pressure are required, there is a possibility of damage to the substrate, and separation of the mold and the substrate is difficult.

The advantage of the resin mold using polydimethylsiloxane (PDMS), which is a typical polymer elastomer used in existing resin molds, is that since polydimethylsiloxane is an elastomer, it is easy to make uniform contact with the surface of the substrate to form a pattern. Because of the low surface energy of the siloxane, the adhesion strength with the applied resist surface is small, so that it can be easily separated from the substrate surface after pattern formation. In addition, due to the high gas permeability due to the three-dimensional network structure there is an advantage that the absorption of the solvent is easy. On the other hand, the polydimethylsiloxane resin mold has a low mechanical strength, so deformation easily occurs, and deformation occurs due to swelling by a general organic solvent, which leads to a significant limitation in selecting a polymer and a solvent to be used for pattern formation. .

In order to solve the problems of the prior art as described above, the present invention has a non-swelling property by an organic solvent, unlike the polydimethylsiloxane (PDMS), which is a polymer elastomer used in a conventional resin mold, or a thermosetting or photocuring polymer resin material. It is an object of the present invention to provide a photocurable resin composition having good mechanical properties, high resilience and transmittance.

The present invention also provides a photocurable resin composition capable of stably and easily forming fine patterns required for various electronic device industrial processes including semiconductors and displays, a method of manufacturing a resin mold using the same, and a resin mold manufactured by the above method. It aims to provide.

In order to achieve the above object, the present invention

a) reactive ester oligomers having functional groups;

b) reactive epoxy oligomers having functional groups or reactive fluorine oligomers having functional groups;

c) iii) olefinically unsaturated compounds;

  Ii) unsaturated compounds containing epoxy groups; And

  Iii) a silicone-based compound containing an epoxy group, an amine group or a fluorine group

  Any one or more compounds selected from the group consisting of; And

d) photoinitiators

It provides a photocurable resin composition comprising a.

Preferably, the photocurable resin composition is

a) 30 to 90 parts by weight of a reactive ester oligomer having a functional group;

b) 10 to 70 parts by weight of a reactive epoxy oligomer having a functional group or 10 to 70 parts by weight of a reactive fluorine oligomer having a functional group;

c) based on 100 parts by weight of the oligomer of a) + b)

  Iii) 5 to 30 parts by weight of olefinically unsaturated compound;

  Ii) 5 to 30 parts by weight of an unsaturated compound containing an epoxy group; And

  Iii) 5 to 30 parts by weight of a silicone compound containing an epoxy group, an amine group or a fluorine group

  5 to 30 parts by weight of any one or more mixtures selected from the group consisting of; And

d) 0.1 to 10 parts by weight of the photoinitiator based on 100 parts by weight of the oligomer of a) + b).

In addition, the present invention

S1) applying a pattern of the photocurable resin solution according to claim 1 on one surface of the disc mold on which the pattern is formed and transferring the pattern of the disc mold;

S2) releasing the cured polymer resin transferred from the disc mold;

S3) forming a plasma treatment surface on the back surface of the cured polymer resin in which the release pattern is formed or on one surface of the back support in contact with the cured polymer resin;

S4) forming a back support on the plasma processing surface formed on the back of the cured polymer resin; And

S5) preparing a polymer resin mold by adhering or curing the cured polymer resin having the back support formed thereon;

It provides a method for producing a resin mold comprising a.

In another aspect, the present invention provides a resin mold prepared by the method for producing a resin mold.

The present invention, unlike polydimethylsiloxane (PDMS), which is a polymer elastomer used in a conventional resin mold, or a thermosetting or photocuring polymer resin material, has a non-swelling property by an organic solvent, and has relatively large mechanical properties, high restoring force, and transmittance. It is possible to stably and easily form fine patterns required for various electronic device industrial processes including semiconductors and displays.

Hereinafter, the present invention will be described in detail.

The photocurable resin composition of the present invention comprises a) a reactive ester oligomer having a functional group; b) reactive epoxy oligomers having functional groups or reactive fluorine oligomers having functional groups; c) iii) olefinically unsaturated compounds; Ii) unsaturated compounds containing epoxy groups; And iii) at least one compound selected from the group consisting of silicone-based compounds comprising an epoxy group, an amine group or a fluorine group; And d) a photoinitiator.

The oligomer used for the photocurable resin composition of this invention contains the reactive ester type oligomer which has a functional group of said a), and b) the reactive epoxy type oligomer which has a functional group, or the reactive fluorine type oligomer which has a functional group. Preferably, the reactive ester oligomer having the functional group, the reactive epoxy oligomer having the functional group, and the reactive fluorine oligomer having the functional group may be included.

The oligomers form dense crosslinks upon curing and have strong adhesion to the mold support and non-swelling properties to organic solvents.

The reactive ester oligomer having the functional group of a) has a molecular weight of 200 or more, and has a carboxy group and a polyester structure having one or more functional groups. Preferably, the reactive ester oligomer having the functional group has a molecular weight of 200 to 50,000.

Preferably, the a) ester oligomer is included in an amount of 30 to 90 parts by weight, and if it is within the above range, the adhesion to the mold support is excellent, and at the same time, a long time exposure to the organic solvent can significantly reduce the breakage phenomenon.

The epoxy oligomer of b) is a phenyl epoxy acrylate oligomer, bisphenol A epoxy diacrylate oligomer, aliphatic alkyl diacrylate oligomer, pisphenol A epoxy dimethacrylate oligomer, l and aliphatic alkyl having at least one reactive functional group. Oligomers selected from the group consisting of epoxy triacrylate oligomers can be used.

The epoxy-based oligomer is preferably included in 10 to 70 parts by weight, and when it is below the above range, the cured resin may be detached from the support by low adhesion or adhesion with the support, and when it is above the range, swelling may be severe. Inner can not only reduce the swelling (phenomena) caused by the organic solvent but also improve the adhesion or adhesion of the support.

The fluorine-based oligomer is a fluorine-based acrylate oligomer having one or more reactive functional groups, preferably 10 to 70 parts by weight, more preferably 10 to 50 parts by weight. When in the above range it is possible to significantly reduce the swelling or fracture phenomenon by the organic solvent.

The photocurable resin composition of this invention is said c) iii) an olefin type unsaturated compound; Ii) unsaturated compounds containing epoxy groups; And iii) a silicone-based compound comprising an epoxy group, an amine group or a fluorine group. Preferably, at least one selected from each group is preferably used by mixing two or more groups.

The components of c) not only serve as a diluent for the oligomer, but also increase the crosslinking density to prevent swelling and breakage caused by an organic solvent and to increase release property when forming a fine pattern.

The olefinically unsaturated compound of c) iii) is methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, sec-butyl methacrylate, tert-butyl methacrylate, methyl acrylate, isopropyl acrylate , Cyclohexyl methacrylate, 2-methylcyclohexyl methacrylate, dicyclopentenyl acrylate, dicyclopentanyl acrylate, dicyclopentenyl methacrylate, dicyclopentanyl methacrylate, 1-adamantyl acrylic Rate, 1-adamantyl methacrylate, dicyclopentanyloxyethyl methacrylate, isoboroyl methacrylate, cyclohexyl acrylate, 2-methylcyclohexyl acrylate, dicyclopentanyloxyethyl acrylate, iso Boronyl acrylate, phenyl methacrylate, phenyl acrylate, benzyl acrylate, 2-hydroxyethyl methacrylate, 1,6-hexane As diol diacrylate, etc. can be used.

Preferably, the olefinically unsaturated compound is included in an amount of 5 to 30 parts by weight based on 100 parts by weight of the a) + b), and in the above range, increases the crosslinking density to prevent swelling and breakage caused by an organic solvent and to form a fine pattern. Can increase dysplasia.

The unsaturated compound containing the epoxy group of c) ii) is glycidyl acrylate, glycidyl methacrylate, α-ethyl acrylate glycidyl, α-n-propyl acrylate glycidyl, α-n-butyl acrylate Cydyl, acrylic acid-β-methylglycidyl, methacrylic acid-β-methylglycidyl, acrylic acid-β-ethylglycidyl, methacrylic acid-β-ethylglycidyl, acrylic acid-3,4-epoxy Butyl, methacrylic acid-3,4-epoxybutyl, acrylic acid-6,7-epoxyheptyl, methacrylic acid-6,7-epoxyheptyl, α-ethylacrylic acid-6,7-epoxyheptyl, acrylic acid-3,4 -Epoxy cyclohexylmethyl, methacrylic acid-3,4-epoxy cyclohexylmethyl, 4-vinylcyclohexene oxide, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycid Dyl ether etc. can be used.

The unsaturated compound containing the epoxy group is preferably included in 5 to 30 parts by weight based on 100 parts by weight of the a) + b), in the above range to increase the crosslinking density to prevent swelling and breakage by the organic solvent, fine When the pattern is formed, the release property can be increased.

The silicone compound of c) iii) may be (3-glycidoxypropyl) trimethoxysilane, (3-glycidoxypropyl) triethoxysilane, (3-glycidoxypropyl) methyldimethoxysilane , (3-glycidoxypropyl) trimethoxysilane, (3-glycidoxypropyl) dimethylethoxysilane, (3-glycidoxypropyl) dimethylethoxysilane, 3- (methacryloxy) Propyltrimethoxysilane, 3,4-epoxybutyltrimethoxysilane, 3,4-epoxybutyltriethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltriethoxysilane, aminopropyltrimethoxy silane and the like can be used.

The silicon-based compound is preferably contained in 5 to 30 parts by weight based on 100 parts by weight of the a) + b), when within the range to increase the crosslinking density to prevent swelling and breakage caused by the organic solvent, and releasability when forming a fine pattern Can be increased.

C) i) olefinically unsaturated compounds as described above; Ii) unsaturated compounds containing epoxy groups; And iii) at least one mixture selected from the group consisting of silicone-based compounds comprising an epoxy group, an amine group or a fluorine group, even when two or more kinds thereof are mixed. It is good to use within the department. If the total content exceeds 30 parts by weight, mechanical strength and flexibility may be deteriorated.

The photoinitiator of d) used in the photocurable resin composition of the present invention is Irgacure 369, Irgacure 651, Irgacure 907, Irgacure 819 (Ciba Specialty Chemical Co., Ltd.), diphenyl- (2,4,6-trimethylbenzoyl) phosphine oxide, methyl Benzoylformate, ethyl (2,4,6-trimethylbenzoyl) phenylphosphinate, 2,4-bistrichloromethyl-6-p-methoxystyryl-s-triazine, 2-p-methoxysty Reyl-4,6-bistrichloromethyl-s-triazine, 2,4-trichloromethyl-6-triazine, 2,4-trichloromethyl-4-methylnaphthyl-6-triazine, benzophenone , p- (diethylamino) benzophenoneno, 2,2-dichloro-4-phenoxyacetophenone, 2,2-diethoxyacetophenone, 2-dodecyl thioxanthone, 2,4-dimethylthioxanthone, 2,4-diethyl thioxanthone, 2,2-bis-2-chlorophenyl-4,5,4,5-tetraphenyl-2-1,2-biimidazolo, etc., alone or in combination of two or more Can be used.

The photoinitiator may be included in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of the a) + b), and when it is within the above range, it is possible to satisfy curing and storage stability of the resin mold and curing.

In the photocurable resin composition of the present invention comprising the above components, a surfactant may be further added in order to improve applicability and to further improve releasability when removing the original mold and stripping.

As the surfactant, polyoxyethylene octyl phenyl ether, polyoxyethylene nonyl phenyl ether, F171, F172, F173 (Tokyo Ink, Inc.) FC430, FC431 (Tumitomotrim Co., Ltd.), KP341 (Shinwol Chemical Co., Ltd.) and the like may be used. Its content is preferably included in 0.01 to 2 parts by weight based on 100 parts by weight of the a) + b).

In addition, the present invention provides a method for producing a resin mold using the photocurable resin composition and a resin mold produced by the method.

The resin mold of the present invention comprises the steps of transferring the pattern of the disc mold by coating and curing the photocurable resin solution on one surface of the disc mold S1) pattern is formed; S2) releasing the cured polymer resin transferred from the disc mold; S3) forming a plasma treatment surface on the back surface of the cured polymer resin in which the release pattern is formed or on one surface of the back support in contact with the cured polymer resin; S4) forming a back support on the plasma processing surface formed on the back of the cured polymer resin; And S5) preparing a polymer resin mold by adhering or curing the cured polymer resin having the rear support formed thereon.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional view schematically showing a method of manufacturing a resin mold according to an embodiment of the present invention.

Referring to FIG. 1, first, the pattern of the disc mold 101 to be manufactured is turned upward, and then the polymer resin solution 102a is applied. In this case, the coating of the polymer resin solution 102a may be performed by a method such as spin coating or slit coating.

The polymer resin solution 102a applied to the disc mold 101 is cured by irradiation with light in nitrogen to an atmosphere in the atmosphere, and the cured polymer resin 102b from which the pattern of the disc mold 101 is transferred is transferred from the disc mold 101. Release.

A pattern transferred from the disc mold 101 is formed on one surface of the release cured polymer resin 102b. Back surface of the cured polymer resin 102b having the pattern formed Plasma treatment on one surface of the back support 104 in contact with the cured polymer resin 102a adheres the cured polymer resin 102b and the back support 104 having the pattern formed thereon. Alternatively, the plasma treatment surface 103 is formed to be bonded.

The back support 104 is adhered or adhered to the plasma treatment surface 103 formed on the back surface of the cured polymer resin 102b using an adhesive or an adhesive. In this case, the back support 104 is a transparent glass plate having a transmittance of at least 85% or more in a light source having a wavelength of 500 nm, an indium tin oxide (ITO) substrate, a cyclic olefin copolymer (COC), a polyacrylate (PAc), and a PC ( Polycarbonate, Polyethylene (PE), Polyetheretherketone (PEEK), Polyetherimide (PEI), Polyethylenenaphthalate (PEN), Polyethersulfone (PES), Polyethyleneterephtalate (PET), Polyimide (PO), Polyolefin (PMMA), Polymethylmethacrylate (PMMA) Polysulfone, PVA (Polyvinylalcohol), PVCi (Polyvinylcinnamate), TAC (Triacetylcellulose), polysilicon (Poly Silicone), polyurethane (Polyurethane), epoxy resin (Epoxy Resin) and the like can be used. Preferably, the transmittance is 97 to 99.9% in the light source of 500 nm wavelength.

The back support 104 adhered or adhered to the cured polymer resin 102b as described above performs an additional adhesion or curing process that additionally applies ultraviolet rays or heat for complete adhesion to the mold resin to form the final polymer resin mold 105. Manufacture.

Hereinafter, preferred examples are provided to help understanding of the present invention, but the following examples are merely to illustrate the present invention, and the scope of the present invention is not limited to the following examples.

EXAMPLE

Example 1

75 parts by weight of monofunctional polyester acrylate having a carboxy group and 25 parts by weight of phenyl epoxy acrylate and 100 parts by weight of oligomer 10 parts by weight of glycidyl methacrylate and (3-glycidoxypropyl) trimethoxysilane 10 20 parts by weight of a mixture of parts by weight, 1 part by weight of ethyl (2,4,6-trimethylbenzoyl) phenylphosphinate as a photoinitiator, 0.5 part by weight of methyl benzoyl formate, and 0.01 part by weight of KP341 (Shinwol Chemical) as a surfactant Injected and stirred uniformly at 300 ~ 400 rpm for 20 hours at room temperature to prepare a transparent liquid polymer resin solution (102a).

Thereafter, the pattern of the disc mold 101 was turned upward, and the slit coating was performed such that the thickness of the polymer resin solution 102a prepared above was 100 μm. The polymer resin applied to the disc mold 101 was cured by irradiation with ultraviolet rays in a nitrogen atmosphere, and the cured polymer resin 102b to which the pattern of the disc mold 101 was transferred was released from the disc mold 101.

Plasma treatment on the back surface of the surface on which the pattern of the release cured polymer resin 102b is formed so that the cured polymer resin 102b and the back support 104 having the pattern are adhered or adhered to each other. ) Was formed. Then, the back surface (plasma-treated surface 103) of the surface on which the pattern of the release cured polymer resin 102b is formed and the glass substrate serving as the back support 104 were contacted to adhere the resin and the support.

In order to completely adhere the adhered cured polymer resin 102b and the back support 104, the resultant was heated in a 100 ° C. convention oven for additional 1 hour to complete the final polymer resin mold 105.

Example 2

Except for using 50 parts by weight of monofunctional polyester acrylate and 50 parts by weight of phenyl epoxy acrylate as an oligomer in Example 1 was carried out in the same manner as in Example 1.

Example 3

Except for using 60 parts by weight of monofunctional polyester acrylate, 30 parts by weight of phenyl epoxy acrylate and 10 parts by weight of fluorine-based acrylate as an oligomer in Example 1 was carried out in the same manner as in Example 1.

Comparative Example 1

In Example 1, 100 parts by weight of the monofunctional polyester acrylate was used instead of the epoxy-based oligomer and the fluorine-based oligomer.

Comparative Example 2

Except for using the epoxy oligomer and fluorine oligomer as an oligomer in Example 1, 100 parts by weight of phenyl epoxy acrylate was used in the same manner as in Example 1.

Comparative Example 3

In place of the polymer resin solution prepared in Example 1, PDMS (Dow-Corning, sylgard (R) 184 silicone elastomer kit), which is an existing polymer resin mold material, was 100 μm in the disc mold 101 as in Example 1. After the coating was applied to a thickness and baked in an oven at 60 ° C. for 180 minutes to cure, the cured resin was released from the disc mold.

Using the polymer resin molds prepared in Examples 1 to 3 and Comparative Examples 1 to 3, the transmittance, recovery rate, and chemical resistance were measured in the following manner, and the results are shown in Table 1 below.

A) Transmittance-The light absorption spectrum of visible light of the polymer resin molds prepared in Examples 1 to 3 and Comparative Examples 1 to 3 was measured, and the light transmittance was measured and described at 400 nm.

B) Restoration rate-After pressurizing the planar indenter with the force of 10 gf for 5 seconds to the resin surface of the polymer resin molds prepared in Examples 1 to 3 and Comparative Examples 1 to 3, the planar indenter was removed and 10 seconds after the planar indenter was removed. The degree of restoration was measured and described.

C) Chemical resistance-The polymer resin molds prepared in Examples 1 to 3 and Comparative Examples 1 to 3 were completely deposited on acetone, and the weight change of the resin molds was measured after being left for 7 days. When the ratio of weight change to initial stage is 0-3%, it is excellent, 3-5% is good, and when 5% or more, it is indicated as bad.

TABLE 1

division Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 Comparative Example 3 Transmittance (%) 97.5 98.1 97.3 96.9 97.5 98.0 Recovery rate (%) 79 87 82 75 70 92 Chemical resistance Great Great Great Bad Good Bad

As shown in Table 1, the polymer resin molds of Examples 1 to 3 prepared using the photocurable resin composition of the present invention showed that the transmittance and recovery rate were equal or more than those of Comparative Examples 1 to 3, It was confirmed that it was very excellent in chemical resistance.

1 is a cross-sectional view schematically showing a method of manufacturing a resin mold according to an embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

101: disc mold 102a: polymer resin solution

102b: cured polymer resin 103: plasma-treated surface

104: back support 105: polymer resin mold

Claims (12)

a) reactive ester oligomers having functional groups; b) reactive epoxy oligomers having functional groups or reactive fluorine oligomers having functional groups; c) iii) olefinically unsaturated compounds;   Ii) unsaturated compounds containing epoxy groups; And   Iii) a silicone-based compound containing an epoxy group, an amine group or a fluorine group   Any one or more compounds selected from the group consisting of; And d) photoinitiators Photocurable resin composition comprising a. a) 30 to 90 parts by weight of a reactive ester oligomer having a functional group; b) 10 to 70 parts by weight of a reactive epoxy oligomer having a functional group or 10 to 70 parts by weight of a reactive fluorine oligomer having a functional group; c) based on 100 parts by weight of the oligomer of a) + b)   Iii) 5 to 30 parts by weight of olefinically unsaturated compound;   Ii) 5 to 30 parts by weight of an unsaturated compound containing an epoxy group; And   Iii) 5 to 30 parts by weight of a silicone compound containing an epoxy group, an amine group or a fluorine group   5 to 30 parts by weight of any one or more mixtures selected from the group consisting of; And d) 0.1 to 10 parts by weight of the photoinitiator based on 100 parts by weight of the oligomer of a) + b) Photocurable resin composition comprising a. The method of claim 1, The ester type oligomer of a) iii) has a carboxy group and is an ester type oligomer having a molecular weight of 200 to 50,000. The method of claim 1, The epoxy oligomer of b) is a phenyl epoxy acrylate oligomer, bisphenol A epoxy diacrylate oligomer, aliphatic alkyl diacrylate oligomer, pisphenol A epoxy dimethacrylate oligomer and aliphatic alkyl epoxy tree having at least one reactive functional group. Photocurable resin composition, characterized in that any one or more selected from the group consisting of acrylate oligomers. The method of claim 1, The oligomer of b) comprises a reactive epoxy oligomer having a functional group and a reactive fluorine oligomer having a functional group, characterized in that the photocurable resin composition. The method of claim 1, The olefinically unsaturated compound of c) iii) is methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, sec-butyl methacrylate, tert-butyl methacrylate, methyl acrylate, isopropyl acrylate , Cyclohexyl methacrylate, 2-methylcyclohexyl methacrylate, dicyclopentenyl acrylate, dicyclopentanyl acrylate, dicyclopentenyl methacrylate, dicyclopentanyl methacrylate, 1-adamantyl acrylic Rate, 1-adamantyl methacrylate, dicyclopentanyloxyethyl methacrylate, isoboroyl methacrylate, cyclohexyl acrylate, 2-methylcyclohexyl acrylate, dicyclopentanyloxyethyl acrylate, iso Boronyl acrylate, phenyl methacrylate, phenyl acrylate, benzyl acrylate, 2-hydroxyethyl methacrylate and 1,6-hex Photocurable resin composition, characterized in that any one or more selected from the group consisting of acid diol diacrylate. The method of claim 1, The unsaturated compound containing the epoxy group of c) ii) is glycidyl acrylate, glycidyl methacrylate, α-ethyl acrylate glycidyl, α-n-propyl acrylate glycidyl, α-n-butyl acrylate Cydyl, acrylic acid-β-methylglycidyl, methacrylic acid-β-methylglycidyl, acrylic acid-β-ethylglycidyl, methacrylic acid-β-ethylglycidyl, acrylic acid-3,4-epoxy Butyl, methacrylic acid-3,4-epoxybutyl, acrylic acid-6,7-epoxyheptyl, methacrylic acid-6,7-epoxyheptyl, α-ethylacrylic acid-6,7-epoxyheptyl, acrylic acid-3,4 -Epoxy cyclohexylmethyl, methacrylic acid-3,4-epoxy cyclohexylmethyl, 4-vinylcyclohexene oxide, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether and p-vinylbenzyl glycid Photocurable resin composition, characterized in that any one or more selected from the group consisting of dil ether. The method of claim 1, The silicone compound of b) iii) is (3-glycidoxypropyl) trimethoxylylane, (3-glycidoxypropyl) triethoxysilane, (3-glycidoxypropyl) methyldimethoxysilane , (3-glycidoxypropyl) trimethoxysilane, (3-glycidoxypropyl) dimethylethoxysilane, (3-glycidoxypropyl) dimethylethoxysilane, 3- (methacryloxy) Propyltrimethoxysilane, 3,4-epoxybutyltrimethoxysilane, 3,4-epoxybutyltriethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, Resin composition for photocuring, characterized in that any one or more selected from the group consisting of 2- (3,4-epoxycyclohexyl) ethyltriethoxysilane and aminopropyltrimethoxy silane. The method of claim 1, The photoinitiators of c) are Irgacure 369, Irgacure 651, Irgacure 907, Irgacure 819, diphenyl- (2,4,6-trimethylbenzoyl) phosphineoxide, methylbenzoylformate, ethyl (2,4,6-trimethylbenzoyl Phenylphosphinate, 2,4-bistrichloromethyl-6-p-methoxystyryl-s-triazine, 2-p-methoxystyryl-4,6-bistrichloromethyl-s-tri Azine, 2,4-trichloromethyl-6-triazine, 2,4-trichloromethyl-4-methylnaphthyl-6-triazine, benzophenone, p- (diethylamino) benzophenoneno, 2, 2-dichloro-4-phenoxyacetophenone, 2,2-diethoxyacetophenone, 2-dodecyl thioxanthone, 2,4-dimethyl thioxanthone, 2,4-diethyl thioxanthone and 2,2- Photocurable resin composition, characterized in that any one or more selected from the group consisting of bis-2-chlorophenyl-4,5,4,5-tetraphenyl-2-1,2-biimidazole. S1) transferring a pattern of the disc mold by applying and curing the photocurable resin solution of claim 1 on one surface of the disc mold on which the pattern is formed; S2) releasing the cured polymer resin transferred from the disc mold; S3) forming a plasma treatment surface on the back surface of the cured polymer resin in which the release pattern is formed or on one surface of the back support in contact with the cured polymer resin; S4) forming a back support on the plasma processing surface formed on the back of the cured polymer resin; And S5) preparing a polymer resin mold by adhering or curing the cured polymer resin having the back support formed thereon; Method of producing a resin mold comprising a. The method of claim 10, The back support of S4) is a bare glass, an indium tin oxide (ITO) substrate, a cyclic olefin copolymer (COC), a polyacrylate (PAC), a polycarbonate (PC) having a transmittance of at least 85% or more under a 500 nm wavelength light source. , Polyethylene (PE), Polyetheretherketone (PEEK), Polyetherimide (PEI), Polyethylenenaphthalate (PEN), Polyethersulfone (PES), Polyethyleneterephtalate (PET), Polyimide (PO), Polyolefin (PMMA), Polymethylmethacrylate (PSF), Polysulfone (PSF) , PVA (Polyvinylalcohol), PVCi (Polyvinylcinnamate), TAC (Triacetylcellulose), polysilicon (Poly Silicone), polyurethane (Polyurethane) and epoxy resin (Epoxy Resin) of any one or more selected from the group consisting of Manufacturing method. Resin mold prepared according to claim 10.

Images