KR20090050755A - Substrate processing equipment of multi chamber type - Google Patents

Abstract

The present invention relates to a multi-chamber substrate processing facility comprising a plurality of processing modules provided around the transfer chamber. The multi-chamber substrate processing facility of the present invention includes a conveying chamber having sides in a polygonal shape and at the center thereof, a conveying apparatus for conveying a substrate; A plurality of processing chambers connected to each side of said transfer chamber; A processing chamber connected to any one side of the transfer chamber of the plurality of processing chambers is an aligner chamber that performs alignment with a substrate.

The substrate processing equipment of the present invention having the above-described configuration has high reliability of substrate alignment because the substrate can be aligned immediately before the substrate is loaded into the process chamber.

Description

SUBSTRATE PROCESSING EQUIPMENT OF MULTI CHAMBER TYPE}

1 is a block diagram showing a multi-chamber system according to an embodiment of the present invention.

2 is a plan view of the aligner chamber.

3 is a cross-sectional view of the aligner chamber.

4A through 4D are diagrams illustrating the process of substrate alignment in an aligner chamber.

* Explanation of symbols for the main parts of the drawings *

110: transfer chamber 120: process chamber

130: load lock chamber 140: aligner chamber

142: support plate 144: aligner member

146: centering member

The present invention relates to a substrate processing apparatus, and more particularly to a multi-chamber substrate processing equipment comprising a plurality of processing chambers provided around the transfer chamber.

Generally, in order to manufacture a semiconductor device, various semiconductor processes, such as film-forming (for example, chemical vapor deposition (CVD)), etching, sputtering, oxidation, and diffusion, are performed with respect to a semiconductor wafer. In this kind of processing, with the miniaturization and high integration of semiconductor devices, it is required to improve throughput and yield. From this point of view, a plurality of processing chambers that perform the same processing or a plurality of processing chambers that perform different processing can be combined with each other via a common transfer chamber to enable continuous processing of various processes without exposing the wafer to the atmosphere. So-called cluster toolized (ie, multi-chambered) semiconductor processing facilities are known.

Such a cluster tool substrate processing apparatus includes a common transfer chamber (transfer chamber) formed in a polygonal (for example, hexagonal) box shape, and each of the plurality of processing chambers (process chambers) and the load lock chamber is each of the common transfer chamber. It is connected one by one to the side. In such substrate processing facilities, there are many factors that affect the actual throughput, but how many substrates are supplied from the equipment front end module (EFEM) to the transfer chamber without bottleneck.

However, conventional processing systems are primarily bottlenecked in the load lock due to the aligners and robots installed in the EFEM. In addition, since the alignment of the substrate is performed before the substrate is transferred to the transfer chamber, the alignment of the substrate may be misaligned in the process from the aligner to the transfer of the substrate to the process chamber.

An object of the present invention to provide a multi-chamber substrate processing equipment that can reduce the bottleneck.

It is an object of the present invention to provide a multi-chambered substrate processing apparatus capable of aligning a substrate immediately before the substrate is loaded into the process chamber.

According to a feature of the present invention for achieving the above object, a multi-chambered substrate processing apparatus includes a conveying chamber having sides in a polygonal shape and at the center thereof, a conveying apparatus for conveying a substrate; A plurality of processing chambers connected to each side of said transfer chamber; A processing chamber connected to any one side of the transfer chamber of the plurality of processing chambers is an aligner chamber that performs alignment with a substrate.

According to an embodiment of the present invention, two aligner chambers are arranged side by side on one side of the transfer chamber.

According to an embodiment of the present invention, the aligner chamber includes: a lifting plate which takes over a substrate from the conveying apparatus; A rotating plate on which the substrate is placed by the lowering of the lifting plate; A detector detecting a flat zone or notch of the substrate rotating together with the rotating plate; And a centering member for centering the substrate such that the substrate is accurately positioned at the center of rotation of the rotating plate.

According to an embodiment of the present invention, the centering member includes first and second grip portions in which the substrate grips the substrate on both sides.

According to an embodiment of the present invention, each of the first and second grip parts includes a support block having an arc shape so as to grip the outer peripheral surface of the edge of the substrate; It includes a drive for moving the support block in the front and rear direction.

According to still another aspect of the present invention, a multi-chamber substrate processing facility includes a square-shaped conveying chamber having four sides and a conveying apparatus for conveying a substrate in a center thereof; Two aligner chambers disposed side by side on either side of the transfer chamber; Two load lock chambers disposed side by side on another side of the transfer chamber; Two process chambers disposed side by side on each of the remaining sides of the transfer chamber.

According to an embodiment of the present invention, the aligner chamber may include a support plate that takes over a substrate from the conveying apparatus; And a centering member for centering the substrate placed on the support plate.

According to an exemplary embodiment of the present invention, the centering member includes first and second grip portions for correcting the position of the substrate by gripping the substrate on both sides of the substrate.

According to an embodiment of the present invention, the aligner chamber may include a support plate that takes over a substrate from the conveying apparatus; An aligner member for aligning the substrate by sensing a flat zone or notch of the substrate; And a centering member for centering the substrate placed on the support plate.

For example, embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. This embodiment is provided to more completely explain the present invention to those skilled in the art. Accordingly, the shape of the elements in the drawings and the like are exaggerated to emphasize a clearer description.

Hereinafter, an embodiment of the present invention will be described in more detail with reference to the accompanying drawings, FIGS. 1 to 4E. In the drawings, the same reference numerals are given to components that perform the same function.

1 is a block diagram showing a multi-chamber system according to an embodiment of the present invention.

Referring to FIG. 1, in the multi-chamber system 10, a rectangular transfer chamber 110 is installed at a center thereof, and two process chambers 120 in which processes are performed on two sides of the transfer chamber 110 are arranged side by side. The load lock chamber 130 is connected to the other side, and two aligner chambers 140 for aligning the substrate are connected to the other side. The center of the transfer chamber 110 includes a substrate conveying apparatus 200 having four arm portions 210 that are responsible for transferring substrates between the load lock chamber 130, the process chamber 120, and the aligner chamber 140. It is configured by.

The transfer chamber 110 is located at the center of the process equipment and is connected to the plurality of chambers (process chamber, load lock chamber, aligner chamber) through the slits 112, respectively. The transfer chamber 110 forms a moving space in which the substrate moves the chamber and the chamber, and maintains a constant vacuum inside.

The index 300 is disposed in front of the multi chamber system 10. The index 300 is a three pull opener (hereinafter referred to as a load port) on which a front open unified pod (FOUP) (aka carrier) 20 rests and which opens and closes the lid of the pull 20. 310 and an atmospheric pressure transport robot 320 operated at atmospheric pressure. The pull 20 is a carrier for a general lot for production and is mounted on the load port by a logistics automation device (eg, OHT, AGV, RGV). The index 300 is an interface called an equipment front end module (EFEM) or load lock chamber, which is now widely used as a 300mm wafer conveying device.

The atmospheric pressure transport robot 320 is operable to transport the substrate between the load port 310 and the load lock chamber 130. Atmospheric pressure transfer robot 320 is a two-arm structure that can take out a single substrate from the pull 20 placed in the load port 310 in a single operation to carry in a cassette (not shown) of the load lock chamber 130 It can be configured as a robot having a. In addition to the double arm structure shown in the present embodiment, the atmospheric pressure transfer robot 320 installed in the index 300 may use various robots used in a conventional semiconductor manufacturing process. For example, a robot having an arm having a double blade structure capable of handling two substrates as one arm, a robot having two or more arms, or a robot employing a mixture thereof may be used.

One side of the load lock chamber 130 is connected to the index 300 by one gate valve 132, and the other side thereof is connected to the transfer chamber 110 by the other gate valve 132. The load lock chamber 130 forms the same (close) vacuum atmosphere as the transfer chamber 110 at the time when the substrate transfer device 200 of the transfer chamber 110 loads or unloads the substrate, and the index 300 When the raw substrate is supplied from the substrate or the substrate which has already been processed is conveyed to the index 300, it is switched to the atmospheric pressure state. That is, the load lock chamber 130 has a feature that maintains the pressure itself while crossing the vacuum state and the atmospheric pressure state in order to prevent the atmospheric pressure state of the transfer chamber 110 is changed. The load lock chamber 130 has a cassette in which substrates are temporarily waiting.

The substrate conveying apparatus 200 is disposed at the center of the transfer chamber 110 and has four arm portions that independently process substrate transfer between the load lock chamber 130, the process chamber 120, and the aligner chamber 140. 210). The substrate transfer apparatus 200 has a rotatable base 220 and four arm portions 210 provided on the base 220. Each arm portion 210 includes an end effector 212 on which a substrate to be processed is placed.

The substrate transfer apparatus 200 having such a structure may load / unload a substrate from two chambers in which four arm portions are arranged side by side on one side.

Meanwhile, since the aligner is not located at the indexer, the multi-chamber system 10 of the present invention can quickly supply substrates to the transfer chamber 110 through the load lock chambers 130 without causing a bottleneck in the indexer. In particular, by arranging two aligner chambers 140 side by side on the transfer chamber 110, a throughput improvement of 30% or more can be expected when using the conventional atmospheric aligner.

2 is a plan view of the aligner chamber, and FIG. 3 is a cross-sectional view of the aligner chamber.

2 to 3, the aligner chamber 140 may include a support plate 142 which takes over a substrate from the substrate transfer device 200, and a centering member for sensing the substrate placed on the support plate 142. 146 and an aligner member 144 that senses the flat zone or notch of the substrate to align the substrate.

The support plate 142 is a position to take over the substrate from the substrate transfer device 200 (first height; a position as shown in FIG. 4A) and a position to wait after placing the substrate on the rotating plate of the aligner member 144. It is connected with the lifting shaft 142b of the lifting device 142a so as to move up and down (the position lower than the rotating plate, the second height) (the position shown in FIG. 3). The support plate 142 has a plurality of support pins 143 supporting the bottom surface of the substrate, and has a C shape that partially covers the rotation plate 144a when viewed in plan view.

The aligner member 144 includes a rotating plate 144a on which the substrate is placed, a rotating device 144b for rotating the rotating plate 144a, and a sensing unit installed at the bottom of the chamber to detect a flat zone or notch of the substrate ( 144c). The rotating plate 144a is located outside of the support plate 142 in a disc shape.

The centering member 146 is for centering the substrate placed on the support plate 142 and includes first and second grip parts 146a and 146b which are installed to face each other on both sides of the chamber. The first grip part 146a and the second grip part 146b include an arc-shaped support block 147 that grips the outer circumferential surface of the substrate, and a driving part 148 that moves the support block 147 in the front-rear direction. Any one of the support blocks 147 of the first and second grip parts 146a and 146b is short and one is formed long, but this is only one embodiment and both may be formed long. The support block 147 has a support surface 147a having the same arc shape as the outer peripheral surface of the substrate edge. The support blocks 147 of the first and second grip portions 146a and 146b are waiting on both sides of the support block 147, and the support blocks 147 are provided when the substrate placed on the support plate 142 takes over (first height). ) Is moved forward by the driving unit to grip the both sides of the substrate to position the substrate. As described above, the aligner chamber of the present invention enables the alignment of the substrate and the centering of the substrate.

 4A through 4D are diagrams illustrating the process of substrate alignment in an aligner chamber.

As in FIG. 4A, the substrate enters the aligner chamber 140 by the end effector 212 of the substrate transfer device. The support plate 142 rises to the first height and takes over the substrate from the end effector 212 of the substrate transfer device. When the substrate is placed on the support plate 142, the support plate 142 is lowered to the second height, and the substrate is placed on the rotating plate 144a. When the substrate is placed on the rotating plate 144a, the rotating plate 144a is rotated by the rotating device 144b, and the sensing unit 144c senses the flat zone or notch of the substrate to perform substrate alignment (FIG. 4B). Reference). When substrate alignment is completed, the support plate 142 is raised from the second height to the first height and the substrate placed on the rotating plate 144a is placed on the support plate 142 (see FIG. 4C). When the substrate is positioned at the first height, the support blocks 147 of the first and second grip portions 146a and 146b of the centering member 146 move forward to align the centering of the substrate (see FIG. 4D). When the centering of the substrate is completed, the end effector 212 of the substrate transfer device enters the chamber 140, and the support plate 142 descends to the second height while placing the substrate on the end effector 212 of the substrate transfer device. (See FIG. 4E), the substrate is unloaded from the chamber 140 by the substrate transfer device. The unloaded substrate from aligner chamber 140 is provided directly to process chamber 120. Therefore, since the conveyance distance until the aligned substrate is conveyed to the process chamber is very short, the possibility of substrate distortion during the conveyance process is unlikely.

Here, the process chambers 120 may be configured to perform an etching chamber or other various substrate processing operations configured to etch apertures or openings in the insulating film to form interconnect structures. For example, the process chamber can be a CVD chamber configured to deposit an insulating film; The process chamber may be a PVD chamber configured to deposit a barrier film.

In the above, the configuration and operation of the multi-chamber substrate processing equipment according to the present invention is shown in accordance with the above description and drawings, but this is merely described, for example, and various changes and modifications without departing from the spirit of the present invention. Of course this is possible.

Such a present invention can reduce the bottleneck in the indexer. In addition, the present invention provides high reliability of substrate alignment because the substrate can be aligned immediately before the substrate is loaded into the process chamber.

Claims (9)

In a multi-chamber substrate processing facility: A conveying chamber having sides in a polygonal shape and at the center thereof, a conveying apparatus for conveying a substrate; A plurality of processing chambers connected to each side of said transfer chamber; And a processing chamber connected to any one side of the transfer chamber among the plurality of processing chambers is an aligner chamber for aligning a substrate. The method of claim 1, The two aligner chambers are arranged side by side on one side of the transfer chamber multi-chamber substrate processing equipment, characterized in that. The method of claim 1, The aligner chamber A lifting plate receiving the substrate from the conveying device; A rotating plate on which the substrate is placed by the lowering of the lifting plate; A detector detecting a flat zone or notch of the substrate rotating together with the rotating plate; And And a centering member for centering the substrate such that the substrate is positioned precisely at the center of rotation of the rotating plate. The method of claim 3, The centering member is A multi-chambered substrate processing apparatus comprising: first and second grip portions for gripping the substrate on both sides thereof. The method of claim 4, wherein Each of the first and second grip parts includes a support block having an arc shape to grip the outer circumferential surface of the substrate; And a driving unit for moving the support block in the front-rear direction. In a multi-chamber substrate processing facility: A square conveying chamber in which a conveying apparatus for conveying a substrate is disposed in the center and having four sides; Two aligner chambers disposed side by side on either side of the transfer chamber; Two load lock chambers disposed side by side on another side of the transfer chamber; And two process chambers disposed side by side on each of the remaining sides of the transfer chamber. The method of claim 6, The aligner chamber A support plate that takes over the substrate from the conveying apparatus; And And a centering member for centering the substrate placed on the support plate. The method of claim 7, wherein The centering member is A multi-chambered substrate processing apparatus, comprising: first and second grip portions for correcting the position of the substrate by gripping the substrate on both sides. The method of claim 7, wherein The aligner chamber A support plate that takes over the substrate from the conveying apparatus; An aligner member for aligning the substrate by sensing a flat zone or notch of the substrate; And And a centering member for centering the substrate placed on the support plate.

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