KR20090006535A - 열전소자를 구비한 냉각장치 - Google Patents
열전소자를 구비한 냉각장치 Download PDFInfo
- Publication number
- KR20090006535A KR20090006535A KR1020070069962A KR20070069962A KR20090006535A KR 20090006535 A KR20090006535 A KR 20090006535A KR 1020070069962 A KR1020070069962 A KR 1020070069962A KR 20070069962 A KR20070069962 A KR 20070069962A KR 20090006535 A KR20090006535 A KR 20090006535A
- Authority
- KR
- South Korea
- Prior art keywords
- coolant
- cooling
- thermoelectric element
- coil
- branch
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 96
- 239000002826 coolant Substances 0.000 claims abstract description 107
- 239000000110 cooling liquid Substances 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims description 6
- 238000002560 therapeutic procedure Methods 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 239000000284 extract Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 235000012771 pancakes Nutrition 0.000 description 4
- 239000000498 cooling water Substances 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- OHMHBGPWCHTMQE-UHFFFAOYSA-N 2,2-dichloro-1,1,1-trifluoroethane Chemical compound FC(F)(F)C(Cl)Cl OHMHBGPWCHTMQE-UHFFFAOYSA-N 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 239000010726 refrigerant oil Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000002653 magnetic therapy Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20281—Thermal management, e.g. liquid flow control
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (5)
- 장치에서 발생하는 열을 흡수하기 위하여 상기 장치의 내부를 순환하는 냉각액을 냉각시키기 위한 시스템에 있어서,상기 냉각액의 흐름을 일정한 방향으로 유지시키는 펌프;상기 장치의 냉각액 배출구와 연결되고 상기 냉각액의 이동통로를 복수로 구성한 하우징과 상기 하우징에 부착되고 상기 냉각액을 냉각시키기 위한 열전소자를 포함하는 냉각장치; 및상기 냉각액을 저장하는 냉각액저장탱크를 포함하는 열전소자를 구비한 냉각시스템.
- 제 1항에 있어서,상기 냉각액의 이동통로는,상기 장치의 냉각액 배출구와 연결되고 하나의 관으로 형성되며 적어도 하나 이상의 냉각액 분기점을 갖는 유입부;상기 냉각액 분기점과 연결되는 복수의 관으로 형성되는 분기부; 및상기 분기부와 연결되는 하나의 관으로 형성되는 통합부로 구성되는 열전소자를 구비한 냉각시스템.
- 제 2항에 있어서,상기 분기부는 다단의 복수 분기점을 포함하는 열전소자를 구비한 냉각시스템.
- 제 2항에 있어서,상기 하우징은 제1 및 제2 하우징으로 구성되고, 상기 제1 또는 제2 하우징의 일측면에는 적어도 하나 이상의 상기 열전소자가 부착되며, 상기 제1 및 제2 하우징은 대칭으로 결합되어 상기 이동통로를 형성하는 열전소자를 구비한 냉각시스템.
- 제 4항에 있어서,상기 열전소자에 전원을 공급하는 전원부;상기 냉각액의 온도를 측정하는 온도센서; 및상기 온도센서로부터 온도를 추출하여 상기 전원부를 제어하는 제어부를 더 포함하는 열전소자를 구비한 냉각시스템.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070069962A KR100886951B1 (ko) | 2007-07-12 | 2007-07-12 | 열전소자를 구비한 냉각장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070069962A KR100886951B1 (ko) | 2007-07-12 | 2007-07-12 | 열전소자를 구비한 냉각장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20090006535A true KR20090006535A (ko) | 2009-01-15 |
KR100886951B1 KR100886951B1 (ko) | 2009-03-09 |
Family
ID=40487733
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070069962A KR100886951B1 (ko) | 2007-07-12 | 2007-07-12 | 열전소자를 구비한 냉각장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100886951B1 (ko) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110970209A (zh) * | 2020-01-06 | 2020-04-07 | 西安电掣风云智能科技有限公司 | 大功率中远距离无线传输的充电线圈及其制备方法 |
KR20220004494A (ko) * | 2020-07-03 | 2022-01-11 | 주식회사 바이오브레인 | 자기공명 영상장치용 경사 코일의 냉각장치 |
CN114129903A (zh) * | 2021-10-26 | 2022-03-04 | 北京大学(天津滨海)新一代信息技术研究院 | 热疗恒温系统及设备 |
KR102405970B1 (ko) * | 2021-11-26 | 2022-06-08 | 주식회사 위드썬바이오 | 내부 순환방식의 램프 냉각 및 순환 시스템 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3321624B2 (ja) * | 1993-06-25 | 2002-09-03 | 東洋ラジエーター株式会社 | 冷却装置 |
JPH08182985A (ja) * | 1994-12-28 | 1996-07-16 | Bridgestone Corp | 冷却機能を備えた浄水器 |
JPH09248313A (ja) * | 1996-03-14 | 1997-09-22 | Komatsu Denshi Kk | パッド冷熱装置 |
JP3326141B2 (ja) * | 1999-07-08 | 2002-09-17 | エスエムシー株式会社 | 恒温冷媒液循環装置 |
JP3771233B2 (ja) * | 2003-10-08 | 2006-04-26 | 株式会社日立製作所 | 液冷ジャケット |
JP4201762B2 (ja) * | 2004-12-17 | 2008-12-24 | 富士通株式会社 | 電子機器 |
-
2007
- 2007-07-12 KR KR1020070069962A patent/KR100886951B1/ko active IP Right Grant
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110970209A (zh) * | 2020-01-06 | 2020-04-07 | 西安电掣风云智能科技有限公司 | 大功率中远距离无线传输的充电线圈及其制备方法 |
KR20220004494A (ko) * | 2020-07-03 | 2022-01-11 | 주식회사 바이오브레인 | 자기공명 영상장치용 경사 코일의 냉각장치 |
CN114129903A (zh) * | 2021-10-26 | 2022-03-04 | 北京大学(天津滨海)新一代信息技术研究院 | 热疗恒温系统及设备 |
KR102405970B1 (ko) * | 2021-11-26 | 2022-06-08 | 주식회사 위드썬바이오 | 내부 순환방식의 램프 냉각 및 순환 시스템 |
Also Published As
Publication number | Publication date |
---|---|
KR100886951B1 (ko) | 2009-03-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100841596B1 (ko) | 자기장 치료기의 냉각 장치 | |
CN101584262B (zh) | 用于变速驱动器和感应器的冷却系统 | |
JP4399006B2 (ja) | 空冷冷凍機用の電子構成部品冷却システム | |
EP1892484A1 (en) | Air cooling/heating device | |
CN102159058A (zh) | 液冷式散热结构 | |
KR100886951B1 (ko) | 열전소자를 구비한 냉각장치 | |
WO2013074057A1 (en) | Method and apparatus for thermoelectric cooling of fluids | |
US20080041066A1 (en) | Air cooling/heating device | |
KR102171833B1 (ko) | 관형태 코일의 수냉식 구조를 갖는 자기장치료기용 코일프로브 및 이를 포함하는 자기장치료기 | |
CN110975152A (zh) | 一种可连续工作的磁刺激装置及方法 | |
KR101454558B1 (ko) | 2중 전극을 갖는 히트파이프 열교환기 및 이를 이용한 전기 보일러 | |
KR20140041707A (ko) | 펌프형 루프 냉각 시스템 | |
KR20160010094A (ko) | 냉각 장치 및 그 제어 방법 | |
CN100399230C (zh) | 液体冷却系统 | |
CN217213630U (zh) | 一种液冷设备壳体、液冷设备及液冷系统 | |
KR102587588B1 (ko) | 냉각수 히터 | |
US20240079678A1 (en) | Energy storage apparatus | |
KR20080017609A (ko) | 공기 냉각/가열 장치 | |
CN218887242U (zh) | 一种燃料电池冷却系统 | |
CN105190343B (zh) | 用于超导磁体系统的气体流量减少的电引线 | |
KR101397086B1 (ko) | 랙장치를 위한 냉각장치 | |
CN108571814A (zh) | 净水器 | |
CN112870545A (zh) | Ecmo血液加温装置 | |
JP2006147431A (ja) | 流体加熱装置及び暖房システム | |
CN218047953U (zh) | 温控柜及生物安全柜 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20070712 |
|
PA0201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20080526 Patent event code: PE09021S01D |
|
E90F | Notification of reason for final refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Final Notice of Reason for Refusal Patent event date: 20081001 Patent event code: PE09021S02D |
|
E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20090107 |
|
PG1501 | Laying open of application | ||
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20090226 Patent event code: PR07011E01D |
|
PR1002 | Payment of registration fee |
Payment date: 20090227 End annual number: 3 Start annual number: 1 |
|
PG1601 | Publication of registration | ||
PR1001 | Payment of annual fee |
Payment date: 20120224 Start annual number: 4 End annual number: 4 |
|
FPAY | Annual fee payment |
Payment date: 20130228 Year of fee payment: 5 |
|
PR1001 | Payment of annual fee |
Payment date: 20130228 Start annual number: 5 End annual number: 5 |
|
FPAY | Annual fee payment |
Payment date: 20140210 Year of fee payment: 6 |
|
PR1001 | Payment of annual fee |
Payment date: 20140210 Start annual number: 6 End annual number: 6 |
|
FPAY | Annual fee payment |
Payment date: 20150225 Year of fee payment: 7 |
|
PR1001 | Payment of annual fee |
Payment date: 20150225 Start annual number: 7 End annual number: 7 |
|
FPAY | Annual fee payment |
Payment date: 20160226 Year of fee payment: 8 |
|
PR1001 | Payment of annual fee |
Payment date: 20160226 Start annual number: 8 End annual number: 8 |
|
FPAY | Annual fee payment |
Payment date: 20170222 Year of fee payment: 9 |
|
PR1001 | Payment of annual fee |
Payment date: 20170222 Start annual number: 9 End annual number: 9 |
|
FPAY | Annual fee payment |
Payment date: 20180226 Year of fee payment: 10 |
|
PR1001 | Payment of annual fee |
Payment date: 20180226 Start annual number: 10 End annual number: 10 |
|
FPAY | Annual fee payment |
Payment date: 20190225 Year of fee payment: 11 |
|
PR1001 | Payment of annual fee |
Payment date: 20190225 Start annual number: 11 End annual number: 11 |
|
FPAY | Annual fee payment |
Payment date: 20200224 Year of fee payment: 12 |
|
PR1001 | Payment of annual fee |
Payment date: 20200224 Start annual number: 12 End annual number: 12 |
|
PR1001 | Payment of annual fee |
Payment date: 20220228 Start annual number: 14 End annual number: 14 |
|
PR1001 | Payment of annual fee |
Payment date: 20230131 Start annual number: 15 End annual number: 15 |
|
PR1001 | Payment of annual fee |
Payment date: 20240123 Start annual number: 16 End annual number: 16 |
|
PR1001 | Payment of annual fee |
Payment date: 20250121 Start annual number: 17 End annual number: 17 |