KR20080079086A - Image sensor module and camera module comprising the same and manufacturing method for the same - Google Patents

Abstract

An image sensor module, a camera module having the same, and a method of manufacturing the image sensor module are provided to reduce an overall height of the camera module by joining IR(InfraRed) filters with each other using an insulation tape. An image sensor module includes an image sensing element(111), a via-hole(113), a conductive member(114), and a bump ball(115). The image sensing element includes an imaging region and a bonding pad. The imaging region converts an input beam energy into an electrical signal. The bonding pad serves as a gate toward an external circuit. The via-hole penetrates the image sensing element from an upper surface to a lower surface. The conductive member is filled in the via-hole. The bump ball is formed on one side of the via-hole, where the conductive member is filled, to generate an electrical coupling between the image sensing element and the external circuit.

Description

An image sensor module and a camera module having the same and a method of manufacturing the same {Image sensor module and camera module comprising the same and manufacturing method for the same}

1 and 2 are cross-sectional views showing a conventional camera module.

3 is a cross-sectional view showing the structure of a camera module according to an embodiment of the present invention.

4 is a perspective view illustrating a structure of an image sensor module constituting a part of the camera module of FIG. 3.

5 is a flowchart illustrating a method of manufacturing an image sensor module and a camera module having the same, according to an exemplary embodiment.

6A to 6G are diagrams illustrating each step of performing a method of manufacturing the image sensor module and the camera module having the same shown in FIG. 5.

<Explanation of symbols for the main parts of the drawings>

100: camera module 110: image sensor module

111: image sensing element 112: bonding pad

113: via hole 114: conductive member

115: bump ball 116: insulating tape

120: optical system

The present invention relates to an image sensor module, a camera module having the same, and a method of manufacturing the same, and more particularly, to an image sensor module that manufactures an image sensor module by applying a wafer level package and has a simple manufacturing process and minimizes the size thereof. One camera module and a method of manufacturing the same.

The camera module is a device capable of capturing and transmitting video and pictures, and is used in mobile phones, notebook computers, PDAs, cameras for inserting monitors, rear view cameras for bumper mounting, and cameras for door / interphones.

In general, the camera module is composed of an image sensor module consisting of an image pickup device and a substrate and an optical system consisting of a lens. As an interconnection type between the image pickup device and the substrate, a wire bonding type and a flip chip type are used.

1 and 2 are cross-sectional views showing the configuration of a conventional camera module. 1 is a cross-sectional view showing the interconnection between the image sensing device and the circuit board in the form of wire bonding, and FIG. 2 is a cross-sectional view showing the interconnection between the image sensing device and the circuit board in the form of flip chip bonding. It is a cross section.

As shown in FIGS. 1 and 2, the camera modules 10 and 20 include image sensor modules 11 and 21 and optical systems 15 and 25.

The image sensor modules 11 and 21 include circuit boards 12 and 22 and image sensing elements 13 and 23.

A circuit pattern is formed on at least one side of the circuit boards 12 and 22, and one side on which the circuit pattern is formed is electrically connected to the image sensing elements 13 and 23.

The coupling between the image sensing elements 13 and 23 and the circuit boards 12 and 22 may be made by wire bonding electrically connected using the gold wire 14 as shown in FIG. As shown, it may be coupled by flip chip bonding formed by forming bumps 24.

The optical system 15, 25 includes lens housings 16, 26, protective covers 17, 27, IR filters 19, 29 for infrared blocking and antireflection, and lenses 18, 28. .

The protective covers 17 and 27 are installed at the outer ends facing the outside of the lens housings 16 and 26 through which the image to be photographed passes. In addition, IR filters 19 and 29 are mounted on inner ends of the lens housings 16 and 26 on the image sensing elements 13 and 23. Lenses 18 and 28 for image capturing are mounted in the lens housings 16 and 26, and screw threads for conveying the lens are formed on the inner surface thereof for focus adjustment.

However, in the conventional camera modules 10 and 20, the image sensor modules 11 and 21 are manufactured in a chip scale package. However, such a chip-scale package has a limitation in its miniaturization, and therefore, there has been a problem that it is not suitable for the recent trend of miniaturization of the camera module.

In addition, there are a lot of manufacturing equipment and raw materials required to be added to the manufacture of the chip scale package, there is a problem that the price competitiveness is low due to the high manufacturing cost.

In addition, the manufacturing time is long due to the time required for the wire bonding or flip chip bonding process, there was a problem that the product yield is reduced.

An object of the present invention is to provide an image sensor module that can reduce the thickness and size of the camera module according to the trend of miniaturization and thinning of the device on which the camera module is mounted, a camera module having the same, and a manufacturing method thereof.

The present invention provides an image sensing device including an imaging area for converting incident light energy into an electrical signal and a bonding pad serving as a gate of an external circuit; A via hole penetrating from an upper surface to a lower surface of the image sensing device; A conductive member filled in the via hole; And a bump ball formed at one side of the via hole filled with the conductive member for electrical connection with the outside.

In the present invention, an IR filter may be disposed above the image sensing device.

In the present invention, the image sensing element and the IR filter may be coupled by an insulating tape.

In the present invention, the conductive member may include any one selected from the group consisting of copper, gold and tungsten.

In the present invention, the bump ball may be formed including a conductive material.

In the present invention, the bump ball may form an electrical connection with the outside by flip chip bonding.

According to another aspect of the present invention, there is provided an image sensor module having the above structure; And an optical system coupled to the image sensing device at an upper side of the image sensor module and receiving an external image to form an image in the imaging area.

In the present invention, the optical system has an opening opening toward the front surface so that the light of the front surface is incident toward the imaging area, a protective cover disposed on the front surface of the image sensor module, a lens housing disposed in the opening, It may include at least one lens installed in the lens housing.

In the present invention, a coupling portion having a shape corresponding to each other may be formed on an upper surface of the image sensing device and a lower surface of the optical system.

In the present invention, a protrusion is formed on one side of the coupling portion, a hole may be formed on the other side.

According to another aspect of the present invention, there is provided a method of preparing an image sensing device including an image sensing area for converting incident light energy into an electrical signal; Forming a via hole penetrating from a bonding pad formed on the image sensing device to a rear surface of the image sensing device; Filling the via hole with a conductive member; And forming a bump ball on one side of the via hole filled with the conductive member.

In the present invention, the manufacturing method of the image sensor module may further include the step of disposing an IR filter on one side of the image sensing element.

In the present invention, the step of disposing the IR filter on one side of the image sensing element, the step of attaching an insulating tape on the upper side of the image sensing element, and the step of combining the IR filter on the upper side of the insulating tape. can do .

In the present invention, the forming of the via hole may include at least one of using a laser drill and plasma etching.

The image sensing module 110 and the camera module 100 including the same according to an embodiment of the present invention may be formed as a wafer level package (WLP).

In detail, the recent trend of the electronics industry is to manufacture products having light weight, miniaturization, high speed, multifunction, high performance, and high reliability at low cost. One of the key technologies that enables these product design goals is package assembly technology. The semiconductor chip in which the integrated circuit is formed through the wafer assembly process has a package shape by package assembly technology, thereby realizing protection from external environments, easy mounting and operation reliability.

According to the package assembly technology, various types of package types have been introduced until recently, but among them, chip scale packages have attracted attention. A chip scale package is a package whose package size is about the chip level, and usually refers to a package having a package size of 1.2 times the chip size. Such a chip scale package has many advantages over a typical plastic package, in particular, a small package size. Because of these advantages, chip-scale packages are commonly used in products that require miniaturization and mobility, such as digital camcorders, mobile phones, notebook computers, memory cards, and so on. These include digital signal processors (DSPs), application specific integrated circuits (ASICs) and microcontrollers. Semiconductor devices such as microcontrollers are mounted in chip-scale packages. In addition, the use of chip-scale packages in which memory devices such as dynamic random access memory (DRAM), flash memory, and the like are mounted is increasingly spreading. Currently, more than 50 different chip scale packages are being developed or produced worldwide.

However, while chip-scale packages have absolute advantages in size, they still have several drawbacks over conventional plastic packages. One of them is that it is difficult to secure reliability, and the other is that there is a lot of manufacturing equipment and raw materials required for the manufacture of chip scale packages, and the manufacturing cost is low and the price competitiveness is low.

Wafer level chip scale packages (hereinafter referred to as "wafer level packages") have emerged as a way to solve this problem. The wafer level package is manufactured by rewiring, forming external connection terminals in the form of balls, and separating individual semiconductor chips in the state of semiconductor wafers manufactured by the wafer assembly process without the assembly being performed in the state of being separated into individual semiconductor chips. Form. Wafer-level packages have the advantages of thermal and electrical characteristics of the package, miniaturization of the package, and significant cost reduction and ripple effects from wafer-level test applications. Moreover, existing wafer assembly equipment and processes can be used in the manufacturing equipment or manufacturing process used to manufacture the package, minimizing additional raw materials needed to manufacture the package.

Accordingly, the present invention applies such a wafer level package (WLP) technology in the fabrication of the image sensing module 110 applied to the camera module 100 and the like, thereby miniaturizing the device to which the camera module is mounted and It is characterized by providing an image sensor module, a camera module having the same, and a method of manufacturing the same.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

3 is a cross-sectional view showing the structure of a camera module according to an embodiment of the present invention, Figure 4 is a perspective view showing the structure of an image sensor module constituting a part of the camera module of FIG.

3 and 4, the camera module 100 according to an embodiment of the present invention includes an image sensor module 110 and an optical system 120.

The image sensor module 110 includes an image sensing element 111, a bonding pad 112, a via hole 113, a conductive member 114, a bump ball 115, an insulating tape 116, and an IR filter 117. do.

The image sensing element 111 converts an image of light passing through the optical system 120 and the IR filter 117 into an analog signal. The image sensing element 111 includes an imaging area 111a that converts incident light energy into an electrical signal, and a coupling hole 111b for coupling with the optical system 120.

The image sensing device 111 is a semiconductor device that converts optical information into an electrical signal. A CCD (Charge Coupled Device) image sensor or a complementary metal oxide semiconductor (CMOS) image sensor may be used. However, it is preferable to use a CMOS image sensor suitable for using a chip on film (COF) method in order to reduce the light and small size of the camera module by miniaturization and multifunction of the camera phone. However, the protection scope of the present invention is not necessarily limited thereto.

Here, the present invention applies a wafer level package (WLP) technology in the fabrication of the image sensing module 110, the redistribution of the image sensing element 111 at the wafer level and the external connection terminal of the ball shape The image sensing device 111 is produced through the formation and the separation of the individual semiconductor chips. Therefore, since a separate printed circuit board is unnecessary, the overall width and height of the camera module can be reduced.

At least two coupling holes 111b are formed in the upper surface of the image sensing element 111. The coupling hole 111b is formed in a shape corresponding to each other so as to be coupled to the coupling protrusion 122a formed on the lower surface of the protective cover 122 of the optical system 120 to be described later. For example, the coupling hole 111b of the image sensing device 111 may be recessed in a hole shape, and the coupling protrusion 122a of the protective cover 122 may protrude in a protrusion shape to be coupled to each other. . However, the spirit of the present invention is not limited thereto, and the image sensing element 111 may have a coupling protrusion, and the coupling cover may be formed in the protective cover 122. Here, the image sensor module 110 and the optical system 120 is stably coupled, so that at least two coupling holes 111b and coupling protrusions 122a may be formed to support a fixed position.

Meanwhile, a plurality of bonding pads 112 are formed on the upper surface of the image sensing element 111 to serve as a gate between the image sensing element 111 and an external circuit. In the center of each bonding pad 112, a via hole 113 penetrates from the bonding pad 112 to the rear surface of the image sensing element 111. The via hole 113 is filled with the conductive member 114. The conductive member 114 is made of a conductive metal and can be electrically connected to the image sensing element 111. Usually, the conductive metal used therein may be made of a material having good dielectric properties, such as copper, gold, tungsten, etc. in consideration of desired characteristic impedance and power consumption.

The via hole 113 may be formed by using a laser drill or a method such as plasma etching. In addition, the conductive member 114 may be formed by forming a barrier metal layer on the inner wall of the via hole 113 by sputtering or evaporation, and performing electroplating. In the formation of the via hole 113, a mask is manufactured and a photographic process is required in the case of plasma etching. Therefore, the via hole 113 is preferably formed by a laser drill. The barrier metal layer may be formed of titanium, titanium nitride, titanium / tungsten, platinum / silicon, aluminum or an alloy thereof.

Meanwhile, a bump ball 115 is formed on the rear surface of the image sensing element 111 to serve as an external connection terminal and an adhesive member. The bump ball 115 may be formed of a gold material, or may be formed of a conductive material such as a nickel material having an outer surface plated with gold. The bump ball 115 may be electrically connected to a main board (not shown) of various small electronic devices on which the camera module 100 of the present invention, such as a mobile phone, is mounted. The bump ball 115 and the main substrate (not shown) may be bonded by various methods such as flip chip bonding or surface mount technology (SMT).

Meanwhile, an insulating tape 116 may be further disposed between the imaging region 111a and the bonding pad 112. In addition, an IR filter 117 may be further disposed on the insulating tape 116.

The IR filter 117 blocks the light in the infrared region among the light passing through the lens 123. The photodiode (not shown) used in the imaging region 111a of the image sensing element 11 transmits to the infrared region, and the infrared rays transmitted through the photodiode make the image appear red, thereby preventing the phenomenon. ) Is used. To this end, an IR cut coating is formed on the top surface of the IR filter 117. In addition, the IR filter 117 functions to prevent the light incident therein from being reflected. To this end, an anti-reflective coating (Anti-Reflecting coating) is formed on the lower surface of the IR filter 117. The IR filter 117 is mounted on the lower surface of the opening of the housing in the conventional camera module. However, in the camera module 100 according to the present invention, the IR filter 117 is mounted on the image sensor module 110 as described above. Therefore, since it is not necessary to separately provide a space for mounting the infrared filter in the housing, it is advantageous to miniaturize the camera module.

Thus, by bonding the IR filter 117 using the insulating tape 116, the effect of reducing the height of the entire camera module 100 can be obtained.

Meanwhile, the optical system 120 includes a lens housing 121, a protective cover 122, and a lens 123. The protective cover 122 may support the lens housing 121 and block light from entering an unwanted path from the outside. The protective cover 122 is formed with an opening through which the lens housing 121 is inserted. The protective cover 122 may further include a coupling protrusion 122a formed in a shape corresponding to each other so as to be coupled to the coupling hole 111b of the image sensing device 111. The protective cover 122 may perform a function of protecting the image sensing element 111. The lens housing 121 includes at least one lens 123 and is installed in the opening of the protective cover 122.

By such a configuration, the overall size of the camera module 100 can be reduced to have an effect of miniaturizing and thinning the device on which the camera module is mounted. In other words, in the conventional chip scale package, a separate PCB substrate is formed in the image sensor module. In this case, a space for flip chip bonding or wire bonding is additionally required to connect the image sensing device and the PCB substrate. In addition, since an image sensing device is disposed on the PCB substrate and the PCB substrate is coupled with the optical system, space for coupling the PCB substrate and the optical system is additionally required on the PCB substrate. In order to solve this problem, in the present invention, the PCB substrate is unnecessary by applying the wafer level package technology, thereby reducing the overall size of the image sensor module.

In addition, since the PCB substrate becomes unnecessary, the height of the entire camera module can be reduced by the thickness of the PCB substrate. Furthermore, by bonding the IR filter 117 using the insulating tape 116, the effect of further reducing the height of the entire camera module 100 can be obtained.

In addition, the wafer-level package technology can be applied to simplify the manufacturing process, reduce manufacturing costs, and reduce the cost and effort required for model changes. In addition, packaging is performed at the wafer level, resulting in improved productivity and process efficiency.

Hereinafter, an image sensor module and a manufacturing method of a camera module having the same according to an embodiment of the present invention will be described.

5 is a flowchart illustrating a method of manufacturing an image sensor module and a camera module having the same according to an embodiment of the present invention, and FIGS. 6A to 6G illustrate the image sensor module of FIG. 5 and a method of manufacturing the camera module having the same. Figures show each step performed.

5 and 6, an image sensor module and a method of manufacturing a camera module including the same according to an embodiment of the present invention may include preparing an image sensing device 111 (S210) and an image sensing device ( Forming a via hole 113 penetrating from the bonding pad 112 formed on the 111 to the rear surface of the image sensing element 111 (step S220), and the conductive member 114 is filled in the via hole 113. Step (S230), the bump ball 115 is formed on one side of the via hole 113 filled with the conductive member 1114 (step S240), and IR filter on one side of the image sensing element 111 117 is disposed (step S250).

6A is a diagram illustrating an operation of preparing an image sensing device 111 (operation S210). As illustrated in FIG. 6A, the image sensing device 111 may include an image capturing region 111a that converts incident light energy into an electrical signal and a coupling unit for coupling the optical system 120 (see 111b of FIG. 4). It includes. In addition, a plurality of bonding pads 112 are formed on an upper surface of the image sensing element 111.

6B illustrates a step of forming a via hole 113 penetrating from a bonding pad 112 formed on the image sensing element 111 to a rear surface of the image sensing element 111. As shown in FIG. 6B, a via hole 113 is formed at the center of each bonding pad 112 by penetrating from the bonding pad 112 to the back surface of the image sensing element 111. As described above, the via hole 113 may be formed by using a laser drill, plasma etching, or the like.

6C is a view illustrating a step (S230) of filling the via hole 113 with the conductive member 114. The conductive member 114 is made of a conductive metal and can be electrically connected to the image sensing element 111. The conductive member 114 may be formed by forming a barrier metal layer on the inner wall of the via hole 113 by sputtering or evaporation, and performing electroplating.

FIG. 6D is a view illustrating a step in which a bump ball 115 is formed at one side of the via hole 113 filled with the conductive member 114 (step S240). As shown in FIG. 6D, a bump ball 115 serving as an external connection terminal and an adhesive member is formed on a rear surface of the image sensing element 111. The bump ball 115 may be formed of a gold material, or may be formed of a conductive material such as a nickel material having an outer surface plated with gold. The bump ball 115 may be electrically connected to a main board (not shown) of various small electronic devices on which the camera module 100 of the present invention, such as a mobile phone, is mounted.

6E and 6F are diagrams illustrating an operation in which an IR filter 117 is disposed on one side of the image sensing element 111 (operation S250). In detail, FIG. 6E is a diagram illustrating a step in which an insulating tape is disposed on one side of the image sensing element, and FIG. 6F is a diagram illustrating a step in which an IR filter 117 is coupled to an upper side of the insulating tape 116. In the camera module 100 according to the present invention, the IR filter 117 is mounted on the image sensor module 110 as described above. Thus, by bonding the IR filter 117 using the insulating tape 116, the effect of reducing the height of the entire camera module 100 can be obtained.

6G is a step in which the camera module 100 is assembled by combining the image sensor module 110 and the optical system 120. As described above, at least two coupling holes 111b are formed in the upper surface of the image sensing element 111. In addition, a coupling protrusion 122a having a shape corresponding to each other is formed on the lower surface of the protective cover 122 so as to be coupled to the coupling hole 111b of the image sensing element 111. For example, the coupling hole 111b of the image sensing device 111 may be recessed in a hole shape, and the coupling protrusion 122a of the protective cover 122 may protrude in a protrusion shape to be coupled to each other. .

 Finally, the bump ball 115 may be electrically connected to a main board (not shown) of various small electronic devices on which the camera module 100 of the present invention, such as a mobile phone, is mounted. The bump ball 115 and the main substrate (not shown) may be bonded by various methods such as flip chip bonding or surface mount technology (SMT).

By such a configuration, the overall size of the camera module 100 may be reduced to have an effect of miniaturizing and thinning the device on which the camera module is mounted. That is, in the present invention, the PCB substrate is unnecessary by applying the wafer level package technology, thereby reducing the overall size of the image sensor module. In addition, since the PCB substrate becomes unnecessary, the height of the entire camera module can be reduced by the thickness of the PCB substrate.

In addition, by bonding the IR filter 117 using the insulating tape 116, the effect of further reducing the height of the entire camera module 100 can be obtained. In addition, the wafer-level package technology can be applied to simplify the manufacturing process, reduce the manufacturing cost, reduce the cost and effort of model change, and improve productivity and process efficiency.

According to the present invention, the thickness and size of the camera module can be reduced, the manufacturing process can be simplified, and the manufacturing cost can be reduced in accordance with the tendency of miniaturization and thinning of the device on which the camera module is mounted.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (14)

An image sensing element having an imaging area for converting incident light energy into an electrical signal and a bonding pad serving as a gate to an external circuit; A via hole penetrating from an upper surface to a lower surface of the image sensing device; A conductive member filled in the via hole; And And a bump ball formed at one side of the via hole filled with the conductive member for electrical connection with the outside. The method of claim 1, And an IR filter disposed above the image sensing device. The method of claim 2, And the image sensing device and the IR filter are coupled by an insulating tape. The method of claim 1, The conductive member includes any one selected from the group consisting of copper, gold and tungsten. The method of claim 1, The bump ball is an image sensor module formed of a conductive material. The method of claim 1, The bump ball is an image sensor module to form an electrical connection to the outside by flip chip bonding. An image sensor module having the structure of any one of claims 1 to 6; And And an optical system coupled to the image sensing device at an upper side of the image sensor module, and receiving an external image to form an image in the imaging area. The method of claim 7, wherein the optical system A protective cover having an opening opening toward the front surface so that light of the front surface is incident toward the imaging area, and disposed on the front surface of the image sensor module; A lens housing disposed in the opening; At least one lens installed in the lens housing. The method of claim 7, wherein And a coupling portion having a shape corresponding to each other on an upper surface of the image sensing device and a lower surface of the optical system. The method of claim 9, A projection module is formed on one side of the coupling portion, the hole is formed on the other side. Preparing an image sensing device having an imaging area for converting incident light energy into an electrical signal; Forming a via hole penetrating from a bonding pad formed on the image sensing device to a rear surface of the image sensing device; Filling the via hole with a conductive member; And And forming a bump ball on one side of the via hole filled with the conductive member. The method of claim 11, The manufacturing method of the image sensor module, And an IR filter disposed on one side of the image sensing device. The method of claim 12, The IR filter is disposed on one side of the image sensing device, Attaching an insulating tape to an upper side of the image sensing device; A method of manufacturing an image sensor module comprising coupling an IR filter to an upper side of the insulating tape. The method of claim 11, Forming the via hole, A method of manufacturing an image sensor module comprising at least one of using a laser drill and a plasma etching step.

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