KR20080009591A - Method for supplying treating liquid - Google Patents

Abstract

A method for supplying treatment liquid is provided to enhance a process yield of a substrate treating process by supplying new treating liquid after removing contaminated treating liquid. A method for supplying treatment liquid is applied to substrate treating equipment(1). The substrate treating equipment includes a treating liquid supplying unit(10) and a substrate treating unit(20). The substrate treating unit performs a predetermined treating process on the substrate. The substrate treating unit includes at least one process chamber(21). The process chamber includes a housing(22), a spin chuck(24), a driving unit(26), and a nozzle unit(28). The housing provides a space for performing a substrate treating process. The spin chuck holds the substrate at the time of the substrate treating process. The driving unit drives the spin chuck. The nozzle unit supplies the treating liquid to a wafer held on the substrate in a substrate treating process. The treating liquid supplying unit includes a first tank(110), a second tank, a supplying line(130), a recovering line(140), a supplemental line, a drain member(160), and a drainpipe(180).

Description

Treatment solution supply method {METHOD FOR SUPPLYING TREATING LIQUID}

1 is a configuration diagram schematically showing a substrate processing apparatus to which a treatment liquid supplying method according to the present invention is applied.

2 is a flowchart showing a treatment liquid supplying method according to the present invention.

3A to 3C are views for explaining a treatment liquid supply method according to the present invention.

* Explanation of symbols for the main parts of the drawings

1: substrate processing equipment

10: treatment liquid supply unit

20: substrate processing unit

110: first tank

120: second tank

130: supply line

140: recovery line

150: Replenishment Line

160: drainage member

170: drainage line

180: drain pipe

The present invention relates to a processing liquid supply method, and more particularly, to a method for supplying a processing liquid used in semiconductor and flat panel display manufacturing processes.

Generally, various kinds of chemicals and ultrapure water are used in the semiconductor and flat panel display manufacturing processes. These treatment liquids are supplied to a substrate treatment unit in which a substrate treatment process is performed while satisfying process conditions such as concentration, temperature, and flow rate required in the process. This treatment liquid is usually supplied by a treating-liquid supply system.

A general treatment liquid supply apparatus includes a supply line for supplying treatment liquid from a first tank and a second tank, a first tank and a second tank to a substrate treatment unit, and a treatment liquid used from the substrate treatment unit to the first and second tanks. Have a recovery line to recover. The supply line is provided with a pump, a densitometer, and a filter, and the main supply line supplies the processing liquid to the substrate processing unit, the first supply line supplying the processing liquid from the first tank to the main supply line, and the main supply from the second tank. And a second supply line for supplying the treatment liquid to the line.

Each of the first and second tanks alternately supplies the processing liquid to the substrate processing unit. For example, if the level of the processing liquid in the first tank falls below a predetermined level during the process of supplying the processing liquid to the substrate processing unit, the substrate processing unit may be removed from the second tank after the supply of the processing liquid of the first tank is stopped. Furnace treatment liquid is supplied.

However, in the above-mentioned substrate processing equipment, since the processing liquid supplied from the first tank remains on the supply line and the recovery line when replacing the first tank with the second tank, the first tank for a predetermined time even if the tank is replaced. The processing liquid supplied by is supplied to the substrate processing part. However, since the treatment liquid supplied by the first tank increases in contamination as the process proceeds, there is a problem that the contaminated treatment liquid is supplied to the substrate treatment unit for a predetermined time even when the tank is replaced.

In addition, conventionally, a process in which the processing liquid empty inside the supply line in the process of replacing from the first tank to the second tank described above, or bubbles generated in the processing liquid (hereinafter referred to as 'hunting phenomenon'). Is generated). Hunting is a temporary phenomenon in the supply line due to the opening and closing operation of the valve and the change of the pump pressurized line when the supply of the processing liquid is changed from the first supply line to the second supply line when the tank is replaced. A strong pressure change occurs due to a large shaking of the processing liquid in the supply line. In addition, the hunting phenomenon may occur due to the empty space in which the processing liquid is not filled in a part of the first supply line because the processing liquid in the first supply line is stagnant while the first tank is waiting for the supply of the processing liquid. have. In particular, this hunting phenomenon occurs a lot on the main supply line that receives the treatment liquid from each of the first supply line and the second supply line when the tank is replaced. When the hunting phenomenon occurs, when the inside of the pipe is not completely filled by the processing liquid and the processing liquid is supplied to the substrate processing part, the supply of the processing liquid becomes irregular and causes a defect in the substrate processing process.

In addition, when the hunting phenomenon occurs, the concentration meter installed on the supply line does not detect the concentration of the processing liquid normally, so that the concentration management of the processing liquid is not efficiently performed. In particular, in the case of using a mixed solution in which two or more treatment liquids are mixed, the stability of the concentration management is deteriorated due to the hunting phenomenon, thereby lowering the yield of the substrate treatment process.

In order to solve the above problems, an object of the present invention is to provide a processing liquid supplying method for efficiently supplying the processing liquid. In particular, it is an object of the present invention to provide a treatment liquid supplying method which prevents the supply efficiency of the treatment liquid from decreasing when the tank is replaced.

In addition, an object of the present invention is to provide a treatment liquid supply method for preventing the contaminated treatment liquid from being supplied to the substrate treatment unit when the tank is replaced.

In addition, an object of the present invention is to provide a treatment liquid supplying method for preventing hunting from occurring in the line where the treatment liquid is supplied when the tank is replaced.

In addition, an object of the present invention is to provide a treatment liquid supply method for preventing the phenomenon that the treatment liquid is supplied in an uneven flow when the tank is replaced.

The treatment liquid supply method according to the present invention for achieving the above object is connected to each of the first tank and the second tank, the first tank and the second tank for storing the treatment liquid and the first tank and the second tank A processing liquid supply apparatus having a supply line for supplying a processing liquid from a tank to a substrate processing unit for performing a substrate processing process, and a recovery line for recovering the processing liquid used from the substrate processing unit to the first tank and the second tank; And supplying the processing liquid from the first tank and the second tank to the substrate processing unit, wherein the supply line and the supply line are replaced from the first tank where the supply is made to the second tank waiting for supply. The treatment liquid used in the recovery line is drained or recovered to the first tank.

According to an embodiment of the present invention, the treatment liquid supplying method may be configured such that when the level of the treatment liquid in the first tank where the treatment liquid is supplied to the substrate processing part drops below a predetermined level, In order to remove the used processing liquid, the processing liquid is supplied from the first tank and the second tank to the substrate processing unit at the same time through the supply line, and from the substrate processing unit through the recovery line to remove the used processing liquid. After recovering the processing liquid, when the set time has elapsed, the processing liquid supply to the first tank is stopped, and the processing liquid is supplied from the second tank to the substrate processing unit.

According to an embodiment of the present invention, the processing liquid used in the substrate processing unit is recovered to the tank in which the processing liquid is supplied, and while the processing liquid is simultaneously supplied to the first tank and the second tank, the processing liquid is transferred to the first tank. Recover.

According to an embodiment of the present invention, the supply line includes a main supply line for installing a pump and supplying the processing liquid to the substrate processing unit, a first supply line for supplying the processing liquid from the first tank to the main supply line; And a second supply line for supplying the processing liquid from the second tank to the main supply line, wherein the processing liquid supply device is branched from the main supply line to drain the processing liquid in the first tank. And a second drain line branched from the main supply line to drain the treatment liquid in the second tank, and a drain pipe draining the used treatment liquid branched from the recovery line and moved along the recovery line. However, the first drain line and the while the process liquid supply of the first tank and the second tank is simultaneously performed The used treatment liquid is drained through a second drain line and the drain pipe.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments introduced herein are provided so that the disclosure may be made thorough and complete, and to fully convey the spirit of the invention to those skilled in the art. Portions denoted by like reference numerals denote like elements throughout the specification.

In addition, in the present embodiment, a substrate processing facility having one process chamber will be described as an example. However, a plurality of process chambers may be provided. In addition, in the present embodiment, a process chamber for processing a substrate by a general sheet type is illustrated, but the present invention may be applied to all semiconductor and flat panel display manufacturing equipment that performs a process using a processing liquid.

(Example)

1 is a configuration diagram schematically showing a substrate processing apparatus to which a treatment liquid supplying method according to the present invention is applied. Referring to FIG. 1, the substrate processing facility 1 according to the present invention has a processing liquid supply unit 10 and a substrate processing unit 20.

The processing liquid supply unit 10 generates, supplies, and recovers processing liquids required in the process. The treatment liquid supply unit 10 receives the completed treatment liquid and supplies and recovers the same, or mixes two treatment liquids to generate a mixed liquid, and then supplies and recovers the mixed liquid.

The substrate processing unit 20 performs a predetermined processing process on the substrate W. The substrate processing unit 20 includes at least one process chamber 21. The process chamber 21 includes a housing 22, a spin chuck 24, a driver 26, and a nozzle unit 28. The housing 22 provides a space in which the substrate treating process is performed. The spin chuck 24 mounts, supports and rotates the substrate W during the process. The drive unit 26 drives the spin chuck 24. The nozzle unit 28 receives the processing liquid from the processing liquid supply unit 10 and supplies the processing liquid to the processing surface of the substrate W seated on the spin chuck 24 during the process.

The treatment liquid supply unit 10 includes a first tank 110, a second tank 120, a supply line 130, a recovery line 140, a replenishment line 150, a drain member 160, and a drain line 170. , And a drain pipe 180. The first tank 110 and the second tank 120 stores the chemical liquid. The first tank 110 and the second tank 120 are provided with level sensors for detecting the level of the processing liquid stored therein. Each level sensor detects the level of the processing liquid in the first tank 110 and the second tank 120 at a predetermined height. For example, the level sensors are turned on / off depending on the presence or absence of the treatment liquid at a predetermined height. Therefore, the water level in the first tank 110 and the second tank 120 may be detected according to whether the level sensor detects the treatment liquid. Since the technology for detecting the level of the processing liquid in the tank using the above-described level sensors is easily understood by those skilled in the art of semiconductor and flat panel displays, a detailed description of the method and method for detecting the level of the level sensor will be omitted. .

The supply line 130 supplies the processing liquid from the first tank 110 and the second tank 120 to the substrate processing unit 20. The supply line 130 includes a main supply line 132, a first supply line 134, and a second supply line 136. The main supply line 132 receives the treatment liquid from each of the first tank 110 and the second tank 120, and supplies the treatment liquid to the nozzle unit 28. The main supply line 132 is provided with a pump 132a, a filter member 132b, and a densitometer 132c. The pump 132a provides a flow pressure to the main supply line 132 for supplying the treatment liquid. The filter member 132b filters contaminants in the treatment liquid that is moved along the main supply line 132. The densitometer 132c measures the concentration of the processing liquid supplied to the nozzle unit 28 through the main supply line 132. The first supply line 134 supplies the chemical liquid from the first tank 110 to the main supply line 132, and the second supply line 136 supplies the main liquid supply line 132 from the second tank 120. Supply chemical solution.

The recovery line 140 recovers the treatment liquid, which has been subjected to the substrate treatment in the substrate processing unit 20, to the first and second tanks 110 and 120. The recovery line 140 includes a main recovery line 142, a first recovery line 144, and a second recovery line 146. The main recovery line 142 recovers the processing liquid from the housing 22 of the process chamber 21 to the first recovery line 144 and the second recovery line 146. The first recovery line 144 recovers the treatment liquid used as the first tank 110 from the main recovery line 142, and the second recovery line 146 from the main recovery line 142 to the second tank 120. Recover the used treatment liquid).

The replenishment line 150 replenishes the treatment liquid to the first and second tanks 110 and 120. The replenishment line 150 includes a first replenishment line 152 and a second replenishment line 154. The first replenishment line 152 replenishes the chemical liquid in the first tank 110 and the first tank 110, and the second replenishment line 154 replenishes the chemical liquid in the second tank 110.

The drain member 160 drains the chemical liquid used in the process. The drain member 160 includes a drain container 162 and a discharge pipe 164. The drain container 162 accommodates the used chemical liquid. The discharge pipe 164 discharges the used chemical liquid contained in the drain container 162 to the outside of the facility 1.

The drain line 170 drains the treatment liquid in the first tank 110 and the second tank 120 to the drain member 160. The drain line 170 includes a first drain line 172 and a second drain line 174. The first drain line 172 branches from the main supply line 132 to drain the chemical liquid in the first tank 110 to the drain container 162. The second drain line 174 branches from the main supply line 132 to drain the chemical liquid in the second tank 120 to the drain container 162.

The drain pipe 180 drains the chemical liquid used in the recovery line 140 to the drain member 160. The drain pipe 180 branches from the recovery line 140 to drain the chemical liquid used in the recovery line 140 from the recovery line 140 to the recovery container 162.

Hereinafter, the chemical liquid supply method of the substrate processing equipment 1 having the above-described structure will be described in detail. Here, the same reference numerals of the same components as the above-described components, and the detailed description of the components are omitted.

2 is a flowchart showing a treatment liquid supplying method according to the present invention. 3A to 3C are views for explaining the treatment liquid supplying method according to the present invention.

Referring to FIG. 2, when the processing liquid supply of the substrate processing equipment 1 is started, the valves 152a and 154a are opened so that the refill line 150 is processed in the first tank 110 and the second tank 120. Fill the treatment liquid into a tank whose liquid is below the preset level. When the level sensor S1 of the first tank 110 or the level sensor S1 ′ of the second tank 120 is turned on, the valve 152a or the valve 154a is closed and the replenishment line 150 is closed. Supply of processing liquid is stopped. In the present embodiment, the first tank 110 will be described taking as an example the replenishment of the treatment liquid. When the processing liquid in the first tank 110 and the second tank 120 reaches a predetermined level, the supply of the processing liquid from the first tank 110 to the substrate processing unit 20 and the first from the substrate processing unit 20 are performed. Recovery of the processing liquid used as the tank 110 is made (S110).

That is, referring to FIG. 3A, the valves 134a and 144a are opened, and the pump 136a is driven so that the treatment liquid in the first tank 110 is supplied with the first supply line 134 and the main supply line 132. It is supplied to the nozzle part 28 via this. At this time, the filter member 132b removes contaminants in the treatment liquid, and the densitometer 132c measures the concentration in the treatment liquid. The nozzle unit 28 sprays the supplied processing liquid onto the processing surface of the substrate W. The injected treatment liquid is received in the housing 22 and then recovered to the first tank 110 through the main recovery line 142 and the first recovery line 144.

When the treatment liquid is supplied to the first tank 110 described above, the level of the treatment liquid in the first tank 110 is gradually reduced. In addition, when the processing liquid is supplied to the first tank 110, the processing liquid supplied by the first tank 110 gradually performs a substrate processing process, thereby increasing the contamination of the processing liquid. At this time, when the level sensor S2 is off, the supply of the processing liquid from the first tank 110 and the second tank 120 to the substrate processing unit 20 and the first tank 110 from the substrate processing unit 20. Recovery of the used treatment liquid and the removal of the used chemical liquid remaining on the supply line 130 and the recovery line 140 is made (S120).

That is, referring to FIG. 3B, the valves 134a, 136a, 172a, and 182 are opened while the pump 132a is operated. At this time, the valve 144a may optionally be opened. Therefore, the processing liquid in the first tank 110 and the second tank 120 is supplied to the nozzle unit 28 through the supply line 130 for a set time. The treatment liquid sprayed through the nozzle unit 28 is received in the housing 22 and then recovered to the recovery container 162 through the main recovery line 142 and the drain pipe 180. In addition, the used chemical liquid remaining on the supply line 130 and the recovery line 140 is drained to the sump 162 through the first drain line 172. Here, when the valve 144a is opened, some of the treatment liquid injected through the nozzle unit 28 is recovered to the first tank 110 and then the first supply line 134 and the first drain line 172a. It is drained to the recovery container 162 through. Therefore, when the tank is replaced, all of the treatment liquid used in the first tank 110 may be drained to the recovery container 162.

At this time, the set time is supplied from the first tank 110, the treatment fluid with increased contamination is drained from both the supply line 130 and the recovery line 140 to the sump 162, the second tank 120 It is time for the new treatment liquid supplied from to be replaced by the supply line 130 and the recovery line 140. Thus, the treatment liquid that has been supplied by the first tank 110 is completely removed from the supply line 130 and the recovery line 140 and drained into the sump 162, and the new liquid supplied by the second tank 120 is supplied. The treatment liquid fills the supply line 130 and the recovery line 140.

When the simultaneous supply of the first tank 110 and the second tank 120 is performed for a predetermined time, the supply of the processing liquid from the second tank 120 to the substrate processing unit 20 and the second tank from the substrate processing unit 20. Recovery of the processing liquid used as 120 is made (S130).

That is, referring to FIG. 3C, in a state in which the pump 136a is operated, the valves 134a, 144a, 172a, and 182 are closed and the valves 136a and 146a are opened to treat the processing liquid in the second tank 120. The silver is supplied to the nozzle unit 28 via the second supply line 136 and the main supply line 132. The treatment liquid supplied to the nozzle unit 28 is accommodated in the housing 22 and then received in the second tank 120 via the main recovery line 142 and the second recovery line 146. Therefore, the supply of the processing liquid of the second tank 120 is made. At this time, the first replenishment line 152 supplies the treatment liquid to the first tank 110.

In the above-described processing liquid supplying method, in the process of replacing the first tank 110 with the second tank 120, the first tank 110 and the second tank 120 simultaneously supply the processing liquid and use the processing liquid used. After completely removed from the supply line 130 and the recovery line 140 to drain to the drain member (160). Therefore, compared to the treatment liquid supply method in which the tank is replaced from the first tank 110 directly to the second tank 120, the contaminated treatment liquid is prevented from being supplied to the substrate treatment unit 20 when the tank is replaced. This improves the process yield of the substrate processing process.

In addition, when the tank is replaced, a sudden pressure change is prevented from occurring in the supply line 130, thereby preventing a hunting phenomenon from occurring in the supply line 130. Therefore, bubbles are generated in the supply line 130 due to the hunting phenomenon in the related art, thereby preventing the processing liquid supplied to the substrate processing unit 20 from being supplied in an uneven flow.

In addition, the present invention by preventing the hunting phenomenon in the supply line 130 when the tank is replaced, the concentration meter improves the concentration measurement efficiency of the treatment liquid flowing through the supply line to improve the stability of the concentration management.

The foregoing detailed description illustrates the present invention. In addition, the foregoing description merely shows and describes preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications may be made within the scope of the concept of the invention disclosed in this specification, the scope equivalent to the disclosed contents, and / or the skill or knowledge in the art. The above-described embodiments are for explaining the best state in carrying out the present invention, the use of other inventions such as the present invention in other state known in the art, and the specific fields of application and uses of the present invention. Various changes are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to include other embodiments.

As described above, the treatment liquid supply method according to the present invention efficiently supplies the treatment liquid. In particular, the treatment liquid supply method according to the present invention prevents the supply efficiency of the treatment liquid from being lowered in the process of replacing the tank for supplying the treatment liquid.

In addition, the treatment liquid supply method according to the present invention removes all the contaminated treatment liquid remaining in the supply line and the recovery line when the tank is replaced, and then supplies a new treatment liquid, thereby improving the process yield of the substrate treatment process.

In addition, the treatment liquid supplying method according to the present invention prevents the hunting phenomenon from occurring in the line in which the treatment liquid is supplied. In particular, the treatment liquid supply method according to the present invention prevents the hunting phenomenon from occurring in the supply line in the process of replacing the tank for supplying the treatment liquid. Therefore, the process yield of a substrate processing process is improved and stability of the concentration control of a process liquid is improved.

In addition, the treatment liquid supplying method according to the present invention allows the treatment liquid to be uniformly supplied from the tank to the substrate treatment unit. In particular, the treatment liquid supplying method according to the present invention allows the treatment liquid to be uniformly supplied in the process of replacing the tank for supplying the treatment liquid.

Claims (4)

A process liquid is connected to a first tank and a second tank for storing a process liquid, and each of the first tank and the second tank is supplied to a substrate processing unit performing a substrate processing process from the first tank and the second tank. From the first tank and the second tank to the substrate processing unit using a processing liquid supply device having a supply line and a recovery line for recovering the processing liquid used from the substrate processing unit to the first tank and the second tank. In the method for supplying the treatment liquid, The treatment liquid used in the supply line and the recovery line is drained or recovered to the first tank during the replacement from the first tank where the supply is made to the second tank waiting to be supplied. Way. The method of claim 1, The treatment liquid supply method, When the level of the processing liquid in the first tank to which the processing liquid is supplied to the substrate processing unit falls below a predetermined level, the used processing liquid is removed from the supply line and the recovery line so as to remove the used processing liquid for a predetermined time. After supplying the processing liquid from the first tank and the second tank to the substrate processing unit through the supply line at the same time and recovering the used processing liquid from the substrate processing unit through the recovery line, when the set time has elapsed, the The processing liquid supplying method of Claim 1 which stops supplying the processing liquid of a 1st tank and supplies a processing liquid from the said 2nd tank to the said substrate processing part. The method of claim 2, The processing liquid used in the substrate processing unit is recovered to the tank to which the processing liquid is supplied, and is recovered to the first tank while the processing liquid is simultaneously supplied to the first tank and the second tank. Supply method. The method according to claim 1 or 2, The supply line, A main pump supply line for supplying the processing liquid to the substrate processing unit, a first supply line for supplying the processing liquid from the first tank to the main supply line, and a processing liquid from the second tank to the main supply line It includes a second supply line for supplying, The treatment liquid supply device, A first drain line branched from the main supply line to drain the treatment liquid in the first tank, a second drain line branched from the main supply line to drain the treatment liquid in the second tank, and a branch from the recovery line Further comprising a drain pipe for draining the used treatment liquid is moved along the recovery line, While the processing liquid is supplied to the first tank and the second tank at the same time, the used processing liquid is drained through the first drain line, the second drain line, and the drain pipe. Way.

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