KR20080000807A - Organcic electro-luminescence dispaly and fabricating method tererof - Google Patents

Abstract

An organic electro-luminescence display device and a fabricating method thereof are provided to absorb gas and moisture by forming an absorbent on the interface between upper and lower plates and a sealant, thereby preventing the deterioration of an organic light emitting layer. An organic electro-luminescence display device includes a first substrate(100), a second substrate(200), a sealant(300), and absorbents(170,270). The first substrate has a sub pixel driving unit array. The second substrate has an organic light emitting diode array. The sealant bonds the first and second substrates. The surfaces of the first and second substrates, which are bonded with the sealant, are rough. The absorbents are formed on the surfaces of the first and second substrates, which are bonded with the sealant, to absorb moisture and gas.

Description

Organic electroluminescent display and its manufacturing method {ORGANCIC ELECTRO-LUMINESCENCE DISPALY AND FABRICATING METHOD TEREROF}

1 is a cross-sectional view illustrating an organic electroluminescent display device according to an embodiment of the present invention.

2A through 2B are cross-sectional views illustrating a method for treating an interface of an organic electroluminescent display according to an exemplary embodiment of the present invention.

3 is a cross-sectional view of an organic electroluminescent display device according to another embodiment of the present invention, mainly in a sealing region.

FIG. 4 is a cross-sectional view of an organic electroluminescent display device according to still another embodiment of the present invention, mainly in a sealing area. FIG.

FIG. 5 is a cross-sectional view of an organic electroluminescent display device according to another embodiment of the present invention, mainly in a sealing area. FIG.

<Brief description of symbols for the main parts of the drawings>

100: lower plate 110, 210: insulating substrate

112: gate electrode 114: second power line

116: lower gate pad 118, 128: dummy pattern

120 gate insulating film 122 semiconductor layer

124: source electrode 126: drain electrode

130: lower data pad 132: protective film

134, 136, 138, 140: contact hole 142: first contact electrode

144: second contact electrode 146: upper gate pad

148: upper data pad 150: gate pad

152: data pad 200: top plate

212: auxiliary electrode 214: second electrode

218: buffer film 220: separator

222 contact spacer 230 organic light emitting layer

232: first electrode 234: third contact electrode

300: sealing material 160: sub-pixel drive unit array

260: OLED array 170, 270: moisture absorbent

180, 280: photoactive layer 190, 290: micro powder

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic electroluminescent display, and more particularly, to an organic electroluminescent display and a method of manufacturing the same that can block water and gas inflow.

Recently, among electroluminescent display devices that can be made thin such as paper, various electroluminescent display devices that implement various information on a screen have attracted attention. An organic electroluminescent display is a self-luminous element using a thin organic light emitting layer between electrodes, called an organic EL or organic light emitting diode (OLED) display, and an OLED display is used hereinafter. OLED displays have advantages such as low power consumption, thinness, and self-luminous, compared to liquid crystal displays, but have shortcomings. The lifetime of an OLED display device has many factors, but deterioration of the organic light emitting layer mainly due to moisture and gas is pointed out as the biggest problem.

OLED displays are being developed based on an active matrix type suitable for displaying moving images by independently driving each of three color (R, G, B) sub-pixels constituting one pixel. Each subpixel of an active matrix OLED (hereinafter, AMOLED) display device includes an OLED composed of an organic light emitting layer between an anode and a cathode, and a subpixel driver for driving the OLED independently. The subpixel driver includes at least two thin film transistors and a storage capacitor to control the brightness of the OLED by controlling the amount of current supplied to the OLED according to the data signal. The OLED includes a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer laminated with an organic material between an anode and a cathode. When a forward voltage is applied between the anode and the cathode, electrons from the cathode move to the light emitting layer through the electron injection layer and the electron transport layer, and holes from the anode move to the light emitting layer through the hole injection layer and the hole transport layer. The light emitting layer emits light by recombination of electrons from the electron transport layer and holes from the hole transport layer, and brightness is proportional to the amount of current flowing between the anode and the cathode.

A conventional AMOLED display device has an encapsulation structure in which a packaging plate is bonded to a substrate on which a subpixel driver array and an OLED array are formed to emit light through the substrate. A getter is formed on the packaging plate to adsorb moisture and gas to prevent deterioration of the organic light emitting layer. However, the conventional AMOLED display device has a problem in that the overall process yield is low because if the defect occurs in the process of the OLED array after the process of the sub-pixel driver is completed, the entire substrate must be treated badly. In addition, the packaging plate has a problem of limiting the aperture ratio and being difficult to apply to a high resolution display device.

Recently, a dual plate type AMOLED has been proposed in which a subpixel driver array and an OLED array are separately formed and bonded to different substrates. However, the dual plate type AMOLED has a problem in that it is difficult to prevent getter formation due to difficulty in forming getters and deterioration of the organic light emitting layer due to moisture and gas introduced from the outside or contact failure due to substrate deformation.

Accordingly, an aspect of the present invention is to provide an OLED display device and a method of manufacturing the same, which can prevent deterioration and contact failure of an organic light emitting layer by preventing water and gas inflow.

In order to achieve the above object, an OLED display according to an aspect of the present invention comprises: a first substrate on which a sub-pixel driver array is formed; A second substrate on which an organic light emitting diode array is formed; A sealing material for bonding the first and second substrates together; The surfaces of each of the first and second substrates bonded to the sealing material are roughened. The surface of each of the first and second substrates is generally rough, or the sealing area bonded to the sealing material is partially roughened.

According to another aspect of the present invention, an OLED display includes: a first substrate on which an array of subpixel drivers is formed; A second substrate on which an organic light emitting diode array is formed; A sealing material for bonding the first and second substrates together; And a moisture absorbent formed on surfaces of the first and second substrates adhered to the sealing material to absorb moisture and gas. The moisture absorbent contains at least one of silica, calcium (Ca), barium (Ba), calcium oxide (Cao), and barium oxide (BaO) as a basic composition. The moisture absorbent is formed to extend from the first and second substrates to an inner region of the inner side of the sealing material.

According to another aspect of the present invention, an OLED display device includes: a first substrate on which a subpixel driver array is formed; A second substrate on which an organic light emitting diode array is formed; A sealing material for bonding the first and second substrates together; And an adhesive formed on surfaces of the first and second substrates adhered to the sealing material. The adhesive includes the hygroscopic material and is formed to extend from the first and second substrates to an inner region inside the sealing material.

According to another aspect of the present invention, an OLED display device includes: a first substrate on which a subpixel driver array is formed; A second substrate on which an organic light emitting diode array is formed; A sealing material for bonding the first and second substrates together; And a photoactive layer formed on surfaces of the first and second substrates adhered to the sealing material. The additive photoactive layer includes a photoactive agent, a surfactant, and a photocuring agent. The surfactant includes at least one of silicon (Si) and fluorine (F).

According to another aspect of the present invention, an OLED display device includes: a first substrate on which a subpixel driver array is formed; A second substrate on which an organic light emitting diode array is formed; A sealing material for bonding the first and second substrates together; And a micro powder containing a surfactant formed on the surfaces of the first and second substrates adhered to the sealing material. The micro powder further includes a hygroscopic material of at least one of calcium (Ca), barium (Ba), calcium oxide (Cao), and barium oxide (BaO).

According to still another aspect of the present invention, there is provided a method of manufacturing an OLED display, including: plasma processing a surface of a first substrate on which a subpixel driver array is formed; Plasma treating the surface of the second substrate on which the organic light emitting diode array is formed; Bonding the first and second substrates to each other using a sealing material. Surfaces of the first and second substrates may be subjected to the plasma treatment as a whole, or to the plasma treatment partially to a sealing region adhered to the sealing material.

According to still another aspect of the present invention, there is provided a method of manufacturing an OLED display, including forming a moisture absorbent in a sealing region of a first substrate on which a subpixel driver array is formed; Forming a moisture absorbent in a sealing region of the second substrate on which the organic light emitting diode array is formed; Bonding the first and second substrates to each other using a sealing material formed in the sealing region.

According to still another aspect of the present invention, there is provided a method of manufacturing an OLED display, including: forming an adhesive on a sealing region of a first substrate on which a subpixel driver array is formed; Forming an adhesive on a sealing region of the second substrate on which the organic light emitting diode array is formed; Bonding the first and second substrates to each other using a sealing material formed in the sealing region. The pressure-sensitive adhesive is formed to extend from the first and the second substrate to the inner region of the inner side of the sealing material.

According to still another aspect of the present invention, there is provided a method of manufacturing an OLED display device, including: forming a photoactive layer in a sealing region of a first substrate on which a subpixel driver array is formed; Forming a photoactive layer in a sealing region of the second substrate on which the organic light emitting diode array is formed; Bonding the first and second substrates to each other using a sealing material formed in the sealing region. The photoactive layer is activated by ultraviolet light to cure the sealing material.

According to still another aspect of the present invention, there is provided a method of manufacturing an OLED display, including forming micropowder containing microsurfactant in a sealing region of a first substrate on which a subpixel driver array is formed; Forming a micro powder containing a surfactant in a sealing region of the second substrate on which the organic light emitting diode array is formed; Bonding the first and second substrates to each other using a sealing material formed in the sealing region. The micro powder further includes a hygroscopic material of at least one of calcium (Ca), barium (Ba), calcium oxide (Cao), and barium oxide (BaO).

Other objects and advantages of the present invention in addition to the above object will become apparent from the description of the preferred embodiment of the present invention with reference to the accompanying drawings.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to FIGS. 1 to 5.

1 is a cross-sectional view illustrating an OLED display according to an exemplary embodiment of the present invention.

The OLED display illustrated in FIG. 1 has a structure in which a lower plate 100 on which a subpixel driver array is formed and an upper plate 200 on which an OLED array is formed are bonded by a sealing material 300. Here, the subpixel driver array includes subpixel drivers of the plurality of subpixels constituting the image display unit, and the OLED array includes the OLEDs of the plurality of subpixels.

The lower plate 100 includes an array of subpixel drivers including a plurality of signal lines and a thin film transistor (TTF) formed on the insulating substrate 110. The subpixel driver array is formed in an inner region of the lower plate 100 sealed by the sealing material 300. The lower plate 100 may be divided into an inner region and an outer region based on a sealing region in which the sealing member 300 is formed.

The subpixel driver formed in each subpixel mainly includes two thin film transistors and one capacitor. For example, a switch thin film transistor which supplies a data signal from a data line in response to a scan signal of a gate line, a drive thin film transistor which controls an amount of current flowing through an OLED in response to a data signal from a switch thin film transistor, and a switch thin film It includes a storage capacitor that allows a constant current to flow through the driving thin film transistor even when the transistor is turned off. In this sub-pixel driver, the thin film transistor TFT shown in FIG. 2 corresponds to the driving thin film transistor connected to the OLED, and since the switch thin film transistor has the same cross-sectional structure as the driving thin film transistor, it is omitted.

The thin film transistor TFT illustrated in FIG. 1 includes a gate electrode 112 formed on an insulating substrate 110, a semiconductor layer 122 overlapping the gate electrode 112 with a gate insulating film 120 interposed therebetween, and a semiconductor. A source electrode 124 and a drain electrode 126 using the layer 122 as a channel, and an impurity semiconductor layer, that is, an ohmic contact, between the source electrode 124 and the drain electrode 126 and the semiconductor layer 122. Layers (not shown) are further included. The gate electrode 112 of the driving thin film transistor TFT is connected to the drain electrode (not shown) of the switch thin film transistor, the source electrode 124 is connected to the second power line (not shown), and the drain electrode 126. The silver is connected to the OLED formed on the upper plate 200, that is, the first electrode 232 of the OLED through the first contact electrode 142 and the conductive film 160. Here, the gate electrode (not shown) of the switch thin film transistor is connected to the gate line (not shown), and the source electrode is connected to the data line (not shown).

The first contact electrode 142 is connected to the drain electrode 126 through a contact hole 134 penetrating through the passivation layer 132 that protects the thin film transistor TFT. The first contact electrode 142 is electrically connected to the first electrode 232 of the OLED formed on the upper plate 200.

In addition, the lower plate 100 may include a first power line 114 and a first power line 114 formed together with the gate electrode 112 at a periphery of the subpixel driver array in an inner region sealed by the sealing material 300. It further includes a connected second contact electrode 144. The first power line 114 is connected to the second electrode of the OLED formed on the upper plate 200 via the second contact electrode 144 formed on the lower plate 100 and the third contact electrode 234 formed on the upper plate 200. 214). The second contact electrode 144 is connected to the first power line 114 through the contact hole 136 penetrating through the passivation layer 132 and the gate insulating layer 120. The second contact electrode 144 is electrically connected to the third contact electrode 234 formed on the upper plate 200. In this case, a plurality of dummy patterns 118, 122, and 128 are disposed under the second contact electrode 144 to match the surface height of the second contact electrode 144 in contact with the upper plate 200 with the first contact electrode 142. ) Are stacked. For example, the plurality of dummy patterns 118, 123, and 128 may include a dummy pattern 118 formed together with the gate electrode 112, a semiconductor layer 122 on the gate insulating layer 120, and a source / drain electrode. And a dummy pattern 128 formed under the passivation layer 132 together with 124 and 126, and an impurity semiconductor layer (not shown) is further included between the semiconductor layer 122 and the dummy pattern 128.

In addition, a gate pad 150 connected to a gate line (not shown) and a data pad 152 connected to a data line (not shown) are formed in the outer region based on the sealing region in which the sealing material 300 is formed on the lower plate 100. Pad area is formed. The gate pad 150 is formed together with the gate electrode 112 to extend through the lower gate pad 116 and the lower gate through the contact hole 138 penetrating the passivation layer 132 and the gate insulating layer 120. An upper gate pad 146 connected to the pad 116. The data pad 152 is formed together with the source / drain electrodes 124 and 126 to extend from the data line, and the lower data pad (through the contact hole 140 through the passivation layer 132). An upper data pad 148 connected to 130. The upper gate pad 146 and the upper data pad 148 are formed of a transparent conductive layer.

The upper plate 200 includes a first electrode 232 connected to the sub-pixel driver of the lower plate 100, a second electrode 214 connected to the second power line 114, and first and second electrodes 232. , An OLED array including an organic light emitting layer 230 formed between 214 has a structure formed on an insulating substrate 210. The OLED array has a property deteriorated by moisture, gas, etc., and thus is formed in an inner region of the upper plate 200 sealed by the sealing material 300.

The second electrode 214 of the OLED is formed on the insulating substrate 210 and is formed of a transparent conductive layer in order to transmit light from the organic light emitting layer 230. The second electrode 214 is formed in a plate shape including all of the OLED arrays to supply a second power source from the second power line 114 to the OLED array in common. In addition, an auxiliary electrode 212 for compensating for the resistance component of the transparent conductive layer is formed between the second electrode 214 and the insulating substrate 210 as a metal layer. The auxiliary electrode 212 is formed in the non-light emitting region of the organic light emitting layer 230.

Next to the second electrode 214, a buffer film 218 is formed in the non-light emitting region of the organic light emitting layer 230 to provide the light emitting region of the organic light emitting layer 230 in units of subpixels. The emission regions of the organic emission layer 230 provided by the buffer layer 218 are arranged in a matrix form. In other words, the buffer film 218 provides an OLED region in which OLEDs of each sub-pixel are to be formed.

After the buffer layer 218, a separator 220 for separating the organic light emitting layer 230 and the first electrode 232 to be formed in a subpixel unit, and the first electrode 232 are formed on the lower plate 100. Relatively high contact spacers 222 are formed. The separator 220 is formed in a partition wall shape surrounding each subpixel, and the contact spacer 222 is aligned only at a portion requiring electrical connection in the upper and lower plates 200 and 100, that is, only at a connection portion between each subpixel driver and the OLED. It is formed in the form of a column. In addition, the side of the separator 220 has an inverse taper opposite to the contact spacer 222 to separate the organic light emitting layer 230 and the first electrode 232 stacked thereon. In other words, the contact spacer 222 gradually decreases in width from the bottom in contact with the buffer layer 218 to have a forward inclined surface, while the separator 220 moves upward from the bottom in contact with the buffer layer 218. Increasingly, the width gradually increases to have a reverse slope.

The organic emission layer 230 is formed on the second electrode 214 on which the buffer layer 218, the separator 220, and the contact spacer 222 are formed, and the first electrode 232 is formed on the organic emission layer 230. do. The organic emission layer 230 and the first electrode 232 are separated in subpixel units by the inclined surface of the separator 220. The organic light emitting layer 230 includes a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer. The organic light emitting layer 230 emits red, green, and blue light in sub-pixel units. The first electrode 232 has a height capable of contacting the lower plate 100 when the upper and lower plates 200 and 100 are bonded by the contact spacer 222. The contact spacer 222 may be aligned with the first contact electrode 142 of the lower plate 100. Accordingly, the first electrode 232 covering the contact spacer 222 is electrically connected while contacting the first contact electrode 142. As a result, the first electrode 232 of each subpixel receives the driving signal from the thin film transistor TFT of each subpixel driver via the first contact electrode 142.

The second electrode 214 of the upper plate 200 extends to the periphery of the OLED array to receive the second power signal from the lower plate 100 through the third contact electrode 234. Between the second electrode 214 and the third contact electrode 234 to contact the third contact electrode 234 connected with the second electrode 214 to the lower plate 100 at a height similar to that of the first electrode 232. The buffer layer 218 and the contact spacer 222 are formed in the substrate. The buffer layer 218 and the contact spacer 222 are aligned with the second contact electrode 144 of the lower plate 100. Accordingly, when the third contact electrode 234 covering the buffer layer 218 and the contact spacer 222 is in contact with the second contact electrode 142 of the lower plate 100 when the upper and lower plates 200 and 100 are bonded to each other, the third contact electrode 234 is electrically connected. Connected. As a result, the second electrode 214 receives the second power signal from the second power line 114 via the second contact electrode 142 and the third contact electrode 234. The third contact electrode 234 is formed together with the first electrode 232 and separated from the first electrode 232 by the separator 220.

In the lower plate 100, the first power line (not shown) supplies a power signal of any one of the driving voltage VDD and the ground voltage GND to the source electrode 124 of the thin film transistor TFT, and the second power source. Line 114 supplies the remaining power signal. Therefore, in the upper plate 200, the first electrode 232 of the OLED is used as one of the anode and the cathode, and the second electrode 214 is used as the remaining electrode.

Then, the sealing member 300 is formed in the sealing region of the lower plate 100 or the upper plate 200, the upper and lower plates 200 and 100 are aligned and vacuum-bonded, and then the upper and lower plates 200 and 100 are cured by ultraviolet rays. ) Is coalesced.

On the other hand, the gas such as moisture or oxygen from the outside is mainly introduced into the interior through the weak interface between the sealing material 300 and the upper and lower plates (200, 100). In order to prevent this, the present invention prevents the inflow of water and gas by strengthening the adhesive force by the interface treatment of the sealing material 300 and the upper and lower plates (200, 100). Hereinafter, the surface treatment methods according to the embodiment of the present invention will be described in detail.

2A to 2C are cross-sectional views illustrating a method of manufacturing an OLED display device according to an exemplary embodiment of the present invention. In particular, FIGS. will be.

Referring to FIG. 2A, the bottom plate 100 on which the subpixel driver array 160 is formed on the insulating substrate 110 is surface treated using plasma based on N ₂ , H ₂ , O ₂ , and CFx. At this time, the entire surface of the lower plate 100 is plasma-treated, or only the sealing region bonded to the sealing material using the mask is partially plasma-treated.

Referring to FIG. 2B, the top plate 200 on which the OLED array 260 is formed on the insulating substrate 210 is surface treated using plasma based on N ₂ , H ₂ , O ₂ , and CFx. At this time, the entire surface of the upper plate 200 is plasma-treated, or only the sealing region bonded to the sealing material using a mask is partially plasma-treated.

Referring to FIG. 2C, the sealing material 300 is formed on the lower plate 100 or the upper plate 200 treated with the plasma surface, and the upper and lower plates 200 and 100 are aligned to be vacuum-bonded. Then, the upper and lower plates 200 and 100 are bonded to each other by irradiating the sealing region with ultraviolet rays to cure the sealing material 300. At this time, the upper and lower plates 200 and 100 have a rough surface by plasma treatment and are bonded to the sealing material 300, so that the adhesion area is increased, thereby enhancing the adhesion between the upper and lower plates 200 and 100 and the sealing material 300. Accordingly, water and gas may be blocked from flowing through the interface between the upper and lower plates 200 and 100 and the sealing member 300 to prevent deterioration and contact failure of the organic light emitting layer.

FIG. 3 is a cross-sectional view of an OLED display according to another exemplary embodiment of the present invention, mainly with a sealing area.

Referring to FIG. 3, the absorbents 270 and 170 are formed between the upper and lower plates 200 and 100 and the sealing material 300, respectively. The moisture absorbents 270 and 170 absorb moisture and gas introduced from the outside and block the flow of the moisture into the display device. To this end, the moisture absorbents 270 and 170 contain at least one of silica, calcium (Ca), barium (Ba), calcium oxide (Cao), and barium oxide (BaO) as a basic composition. In addition, the moisture absorbents 270 and 170 may be formed in an inner region than the sealing region adhered to the sealing member 300 to absorb moisture and gas generated therein. On the contrary, instead of the moisture absorbents 270 and 170, an adhesive for blocking moisture and gas inflow may be applied by strengthening the adhesion between the upper and lower plates 200 and 100 and the sealing material 300. In this case, the pressure-sensitive adhesive may contain the above-described hygroscopic material to absorb moisture and gas.

Looking at the manufacturing method, the moisture absorbent 170 is applied to the sealing region to be bonded to the sealing material 300 in the lower plate 100 on which the sub-pixel driving unit array is formed, and also the adhesion to the sealing material 300 in the upper plate 200 on which the OLED array is formed. The moisture absorbent 270 is applied to the sealing area to be. At this time, each of the moisture absorbents 170 and 270 is applied wider than the sealing area. Then, the sealing material 300 is formed on the absorbent 170 of the lower plate 100 or the absorbent 270 of the upper plate 200, aligned to face the upper and lower plates 200 and 100, and vacuum-bonded, and then irradiated with ultraviolet rays to the sealing area. The upper and lower plates 200 and 100 are bonded to each other by curing the sealing material 300. On the contrary, instead of the moisture absorbents 270 and 170, an adhesive or an adhesive containing the above-described moisture absorbing material may be applied to enhance adhesion between the upper and lower plates 200 and 100 and the sealing material 300.

Accordingly, the moisture absorbents 270 and 170 between the upper and lower plates 200 and 100 and the sealing member 300 absorb moisture and gas generated from the outside or generated therein, thereby preventing deterioration and contact failure of the organic light emitting layer. On the contrary, the upper and lower plates 200 and 100 and the sealing material 300 may be strengthened by the adhesive to block water and gas inflow. Furthermore, the upper and lower plates 200 and 100 and the sealing material 300 further strengthen the adhesive force by an adhesive containing a hygroscopic material and absorb moisture and gas generated from the outside and the inside to more effectively prevent deterioration and contact failure of the organic light emitting layer. can do.

FIG. 4 is a cross-sectional view of an OLED display according to still another embodiment of the present disclosure, with a sealing area in focus.

Referring to FIG. 4, photoactive layers 280 and 180 are formed between the upper and lower plates 200 and 100 and the sealing material 300. The photoactive layers 280 and 180 are activated by the irradiated light to enhance the adhesion between the upper and lower plates 200 and 100 and the sealing member 300 to block water and gas from the outside. To this end, the photoactive layers 280 and 180 are formed of a polymer including a surfactant including silicon (Si), fluorine (F), a photoreactive agent, and a photocuring agent. The photoactive layers 280 and 180 are activated by ultraviolet rays irradiated to cure the sealing material 300 to strengthen the interfacial adhesion between the upper and lower plates 200 and 100 and the sealing material 300.

Looking at the manufacturing method, the photoactive layer 180 is applied to the sealing region to be bonded to the sealing material 300 in the lower plate 100 on which the sub-pixel drive unit array is formed, and the sealing material 300 and the upper plate 200 in which the OLED array is formed. The photoactive layer 280 is applied to the sealing region to be bonded. Then, the sealing member 300 is formed on the photoactive layer 180 of the lower plate 100 or the photoactive layer 280 of the upper plate 200, aligned to face the upper and lower plates 200 and 100, and vacuum-bonded to the sealing area. The upper and lower plates 200 and 100 are bonded by irradiating ultraviolet rays to cure the sealing material 300. At this time, as the photocuring agent of the photoactive layer 280 is cured by ultraviolet rays, the photoactive agent and the surfactant are activated to enhance the interfacial adhesion between the upper and lower plates 200 and 100 and the sealing material 300. Accordingly, the inflow of moisture and gas through the interface between the upper and lower plates 200 and 100 and the sealing member 300 may be prevented to prevent deterioration and contact failure of the organic light emitting layer.

FIG. 5 is a cross-sectional view of an OLED display according to another exemplary embodiment of the present invention, mainly with a sealing area.

Referring to FIG. 5, micro powders 290 and 190 are formed between the upper and lower plates 200 and 100 and the sealing material 300, respectively. The micro powders 290 and 190 block the inflow of water and gas from the outside by enhancing the interfacial adhesion between the upper and lower plates 200 and 100 and the sealing material 300. To this end, the micro powders 290 and 190 contain a surface active material such as silicon (Si), fluorine (F), CH, or the like. In addition, the micro powders 290 and 190 may be formed of at least one of silica, calcium, barium, calcium oxide, barium oxide, and barium oxide as basic compositions for adsorption of water and gas. It may also contain.

Looking at the manufacturing method, the micro-powder 190 is formed by the spreading or spraying method in the sealing area to be bonded to the sealing material 300 in the lower plate 100 on which the sub-pixel drive unit array is formed, and also in the upper plate 200 in which the OLED array is formed. The micro powder 290 is formed on the sealing region to be adhered to the sealing material 300 by a scattering or spraying method. Then, the sealing member 300 is formed on the lower plate 100 on which the micro powder 190 is formed or the upper plate 200 on which the micro powder 290 is formed, and the upper and lower plates 200 and 100 are aligned to be vacuum-bonded, and then the sealing area is formed. The upper and lower plates 200 and 100 are bonded by irradiating ultraviolet rays to harden the sealing material 300. At this time, since the adhesion of the upper and lower plates 200 and 100 and the sealing material 300 is enhanced by the surfactant of the micro powders 290 and 190 to block moisture and gas inflow, deterioration of the organic light emitting layer and contact failure may be prevented. .

As described above, the OLED display device and the method of manufacturing the same according to the present invention induce the inflow of moisture and gas by plasma treatment of the interface between the upper and lower plates and the sealing material, or by forming an adhesive, a photoactive layer, and micro powder at the interface to enhance adhesion. Blocking may prevent degradation of the organic light emitting layer and poor contact.

In addition, the OLED display device and the method of manufacturing the same according to the present invention to prevent the deterioration and contact failure of the organic light emitting layer by forming a moisture absorbent at the interface between the upper and lower plates and the sealing material to absorb moisture and gas inflow generated from the outside and inside. Can be.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

Claims (28)

A first substrate on which a subpixel driver array is formed; A second substrate on which an organic light emitting diode array is formed; A sealing material for bonding the first and second substrates together; And the surface of each of the first and second substrates adhered to the sealing material is rough. The method of claim 1, And the surface of each of the first and second substrates is generally rough or the sealing area bonded to the sealing material is partially rough. A first substrate on which a subpixel driver array is formed; A second substrate on which an organic light emitting diode array is formed; A sealing material for bonding the first and second substrates together; And an absorbent formed on surfaces of the first and second substrates adhered to the sealing material and absorbing moisture and gas. The method of claim 3, wherein And the moisture absorbent comprises at least one of silica, calcium, barium, calcium oxide, and barium oxide as a basic composition. The method of claim 3, wherein And the moisture absorbent extends from the first and second substrates to an inner region inside the sealing material. A first substrate on which a subpixel driver array is formed; A second substrate on which an organic light emitting diode array is formed; A sealing material for bonding the first and second substrates together; And an adhesive formed on surfaces of the first and second substrates adhered to the sealing material. The method of claim 6, The pressure-sensitive adhesive is an organic electroluminescent display device further comprising a moisture absorbing material of at least one of silica (Silica), calcium (Ca), barium (Ba), calcium oxide (Cao), barium oxide (BaO). The method of claim 7, wherein And the adhesive is formed to extend from the first and second substrates to an inner region of an inner side of the sealing material. A first substrate on which a subpixel driver array is formed; A second substrate on which an organic light emitting diode array is formed; A sealing material for bonding the first and second substrates together; And an photoactive layer formed on surfaces of the first and second substrates adhered to the sealing material. The method of claim 9, The additive photoactive layer comprises a photoactive agent, a surfactant, and a photocuring agent. The method of claim 10, The surfactant includes at least one of silicon (Si) and fluorine (F). A first substrate on which a subpixel driver array is formed; A second substrate on which an organic light emitting diode array is formed; A sealing material for bonding the first and second substrates together; And a micro powder containing a surfactant formed on surfaces of the first and second substrates adhered to the sealing material. The method of claim 12, The surfactant includes at least one of silicon (Si), fluorine (F), and CH. The method of claim 13, The micro powder further comprises a hygroscopic material of at least one of calcium (Ca), barium (Ba), calcium oxide (Cao), and barium oxide (BaO). Plasma processing the surface of the first substrate on which the subpixel driver array is formed; Plasma treating the surface of the second substrate on which the organic light emitting diode array is formed; And bonding the first and second substrates to each other using a sealing material. The method of claim 15, Surfaces of the first and second substrates are entirely plasma-treated, or partially plasma-treated in a sealing region bonded to the sealing material. Forming a moisture absorbent in a sealing region of the first substrate on which the subpixel driver array is formed; Forming a moisture absorbent in a sealing region of the second substrate on which the organic light emitting diode array is formed; And bonding the first and second substrates to each other using a sealing material formed in the sealing area. The method of claim 17, The moisture absorbent may include at least one of silica, calcium, barium, calcium oxide, barium oxide, and barium oxide as a basic composition of an organic electroluminescent display. Manufacturing method. The method of claim 17, And the moisture absorbent extends from the first and second substrates to an inner region inside the sealing material. Forming an adhesive in a sealing region of the first substrate on which the subpixel driver array is formed; Forming an adhesive on a sealing region of the second substrate on which the organic light emitting diode array is formed; And bonding the first and second substrates to each other using a sealing material formed in the sealing area. The method of claim 20, The pressure-sensitive adhesive of the organic electroluminescent display device further comprises a hygroscopic material of silica, calcium (Ca), barium (Ba), calcium oxide (Cao), barium oxide (BaO). Manufacturing method. The method of claim 21, And the adhesive is formed to extend from the first and second substrates to an inner region of an inner side of the sealing material. Forming a photoactive layer in a sealing region of the first substrate on which the subpixel driver array is formed; Forming a photoactive layer in a sealing region of the second substrate on which the organic light emitting diode array is formed; And bonding the first and second substrates to each other using a sealing material formed in the sealing area. The method of claim 23, The photoactive layer is a method of manufacturing an organic electroluminescent display device, characterized in that activated by ultraviolet light curing the sealing material. The method of claim 23, The additive photoactive layer includes a photoactive agent, a surfactant, and a photocuring agent, wherein the organic electroluminescent display device is manufactured. Forming a micro powder containing a micro surfactant in a sealing region of the first substrate on which the subpixel driver array is formed; Forming a micro powder containing a surfactant in a sealing region of the second substrate on which the organic light emitting diode array is formed; And bonding the first and second substrates to each other using a sealing material formed in the sealing area. The method of claim 26, The surfactant may include at least one of silicon (Si), fluorine (F), and CH. The method of claim 27, The micro powder further comprises a hygroscopic material of at least one of calcium (Ca), barium (Ba), calcium oxide (Cao) and barium oxide (BaO).

Images