KR20070106266A - Air knife having zigzag type multiple hole nozzle - Google Patents

Abstract

An air knife of an sawing/sorting apparatus having a zigzag-type multi nozzle is provided to remove the moisture on a substrate strip by uniformly distributing dry air at uniform pressure to nozzle holes of a zigzag type that are arranged in a column in a lengthwise direction. A zigzag-type multi nozzle(50) has a plurality of nozzle holes(51) formed as a ling slit type in a lengthwise direction wherein the nozzle holes are arranged as a column along the lengthwise direction. The multi nozzle injects dry air to the nozzle holes. An air introduction hole(11) through which dry air is introduced and a nozzle coupling hole(12) to which the zigzag-type multi nozzle is coupled are formed in a body(10). The dry air introduced into the air introduction hole is injected to the zigzag-type multi nozzle, and the space of the body decreases as it goes from an opposite portion to the nozzle coupling hole to the nozzle coupling hole. The area of the zigzag-type multi nozzle except the area of the nozzle holes is not less than that of the nozzle holes.

Description

AIR KNIFE HAVING ZIGZAG TYPE MULTIPLE HOLE NOZZLE}

1 is a perspective view showing a state in which the drying process is progressing in the air knife according to the prior art and the failure occurred in the nozzle.

2 is a cutaway perspective view of an air knife according to the present invention;

3A is an enlarged plan view of the nozzle hole of the air knife according to the present invention;

3B to 3D are enlarged plan views showing modifications of nozzle holes of the air knife according to the present invention.

Figure 4 is a block diagram schematically showing the structure of a sawing / sorting device to which an air knife according to the present invention is applied.

5 is a cross-sectional view showing a drying process in the air knife according to the present invention.

* Description of symbols on the main parts of the drawings *

100,200; Air knife 10; Body

11; Air inlet hole 12; Nozzle coupling hole

15; Shroud 20,220; Air inlet

21; Auxiliary air supply 22; Air distribution

50,50b, 50c, 50d, 250; Nozzles 51, 51b, 51c, 51d, 251; Nozzle hole

60; Auxiliary air knife 61; Air supply pipe

65; Brush 70; Chuck table

71; Conveying means 75; Semiconductor chip package

76; Solder ball forming surface 101; Loading unit

102; Vision unit 103; Sawing unit

104; Drying unit 105; Unloading unit

106; Sorting unit 110; Sawing / Sorting Device

252; holder

The present invention relates to a semiconductor chip package manufacturing apparatus, and more particularly, a semiconductor chip package that has been cleaned and sawed in a sawing / sorting apparatus that separates the semiconductor chip packages formed on the substrate strip into unit semiconductor chip packages and classifies them according to quality. It relates to an air knife of a sawing / sorting device for drying the.

Recently used semiconductor chip packages such as fine pitch ball grid array (FBGA) and tape ball grid array (TBGA) packages are used for die attach, wire bonding and resin molding. In plural semiconductor chip packages are treated as substrate strips arranged successively on the substrate. The plurality of semiconductor chip packages formed on the substrate strip are separated and classified into unit semiconductor chip packages using a sawing / sorting device.

In general, a sawing / sorting apparatus is a sawing portion for cleaning the semiconductor chip packages formed on the substrate strip into a unit semiconductor chip package while washing with water, a drying unit for removing water from the unit semiconductor chip package that has been cleaned and sawed, and dried. After the inspection of the quality state of the unit semiconductor chip package is configured to include a sorting unit for classifying and loading according to good and bad.

The sawing process in the sawing section is carried out by a blade which rotates at high speed with the mold surface of each semiconductor chip package adsorbed on the chuck table in the substrate strip. At the same time, water is sprayed from the holes formed in the area of the chuck table corresponding to the scribing line of the substrate strip, and a cleaning process for removing dust generated by sawing is performed.

After the sawing is completed, the substrate strip is stopped for a while before being transferred to the drying unit by the operation of the chuck table, and air is ejected from the above-mentioned water jet holes to cool the heat generated in the substrate strip due to friction with the blades. Remove any dirt that could not be cleaned with water. The substrate strip is then transferred to the drying section.

1 is a perspective view showing a state in which the drying process is progressing in the air knife according to the prior art and the failure occurred in the nozzle.

Referring to FIG. 1, an air knife 200 according to the related art installed in a drying unit of a sawing / sorting device includes a body 210 having an air inlet 220 into which dry air supplied from an air source is introduced. ) And a nozzle 250 through which dry air is injected. The nozzle 250 is provided with nozzle holes 251 having a long slit shape. A cradle 252 is formed between the nozzle holes 251 to maintain the shape of the nozzle hole 251. When the substrate strip is transferred to the drying unit by the movement of the chuck table and positioned above the air knife 200, dry air is injected from the nozzle 250 to remove moisture on the back surface of the mold surface of the substrate strip, for example, the solder ball forming surface. .

However, since the cradle formed between the nozzle holes is narrow, it may be broken by the pressure of the dry air injected through the nozzle as shown in the enlarged view of FIG. 1. The nozzle holes formed on both sides of the broken cradle are connected to each other and larger than the size of other nozzle holes, so that a large amount of dry air is injected into the nozzle hole of the broken cradle. The outside air is sucked in by the venturi phenomenon. Therefore, the moisture of the substrate strip is not completely removed. Here, the venturi phenomenon refers to a phenomenon in which when the air flows through a pipe, when the cross-sectional area flows through a portion having a small cross-sectional area, the pressure of the portion decreases, and a suction force occurs at a portion having a small cross-sectional area due to such a pressure difference.

And due to the water not removed, it causes various defects in the process after the drying process. For example, when the individual semiconductor chip package is seated in the tray of the unloading part for transfer to the sorting part after drying is completed, there is a problem that the semiconductor chip packages are not separated from the chuck table due to the remaining bite.

In addition, the cradle is frequently broken, and the cradle is broken because the air knife can no longer be used due to the problems described above, there is a need to frequently replace the air knife.

It is therefore an object of the present invention to provide an air knife of a sawing / sorting device that easily removes moisture from the substrate strip, thereby preventing defects that may be caused in subsequent processes.

Another object of the present invention is to provide an air knife of a sawing / sorting device which can be used semi-permanently.

In order to achieve the above object, the present invention provides a sawing part for separating a plurality of semiconductor chip packages formed on a substrate strip into unit semiconductor chip packages while washing with water, and the back surface of the mold surface of the unit semiconductor chip package in which sawing is completed by blowing dry air. Drying unit equipped with air knife to remove water, Sorting unit for classifying dried unit semiconductor chip package into good and defective products, and Chuck table for transporting semiconductor chip package by adsorbing mold surface to sawing unit, drying unit and sorting unit The air knife of the sawing / sorting apparatus containing this installed conveyance part is related. The air knife of the sawing / sorting apparatus according to the present invention has a plurality of nozzle holes formed in a long slit shape in the longitudinal direction, the nozzle holes are formed in a zigzag form in a row along the length direction, and dry air is A zigzag porous nozzle that is sprayed; A nozzle coupling hole is formed in which an air inlet hole through which dry air is introduced and the zigzag porous nozzle are combined, so that dry air introduced into the air inlet hole is injected into the zigzag porous nozzle, and the nozzle is formed at the opposite side where the nozzle coupling hole is formed. It includes a body that becomes narrower toward the portion where the engaging hole is formed.

In the air knife of the sawing / sorting apparatus according to the present invention, the zigzag porous nozzle preferably has an area excluding the area of the nozzle holes equal to or larger than the area of the nozzle holes.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the accompanying drawings, some of the components are somewhat exaggerated, schematically illustrated or omitted to facilitate a clear understanding of the drawings, and the actual size of each component is not entirely reflected.

Example

Figure 2 is a cutaway perspective view showing an air knife and a zigzag nozzle according to the present invention, Figure 3a is a plan view showing an enlarged nozzle hole of the air knife according to the present invention.

2 and 3A, the air knife 100 according to the present invention includes a body 10 and a zigzag-type porous nozzle 50.

The zigzag porous nozzle 50 has a plurality of nozzle holes 51 formed in a long slit shape in the longitudinal direction. Dry air is injected through the nozzle holes 51. The nozzle holes 51 form a row along the length direction, for example, arranged in two rows in a zigzag. Each nozzle hole 51 is crossed in the longitudinal direction, and is formed at predetermined intervals such as "A". And each nozzle hole 51 crossing in the width direction is formed so that there is no area which overlaps each other. When dry air is injected through the zigzag porous nozzle 50, the region where the nozzle holes 51 are not formed supports the spraying pressure of the drying air, so that the nozzle hole (the nozzle hole) can easily support the spraying pressure of the drying air. It is preferable that the area except the area where the 51s are formed is equal to or larger than the area where the nozzle holes 51 are formed.

The body 10 is provided with an air inlet hole 11 and a nozzle coupling hole 12. The air inlet 20 is coupled to the air inlet hole 11 so that dry air supplied from the air source is introduced into the body 10. The above-described zigzag porous nozzle 50 is coupled to the nozzle engagement hole 12. Side plates 15 are coupled to both sides of the body 10. Dry air introduced into the air inlet 20 is injected into the zigzag porous nozzle 50. In order to increase the pressure at which the introduced dry air is injected, the body 10 preferably has a narrower space from the opposite portion where the nozzle coupling hole 12 is formed to the portion where the nozzle coupling hole 12 is formed. For example, it is preferable that the side wall 15 is fan-shaped. Reference numerals 21 and 22 are described below when describing the operation of the air knife according to the present invention as an auxiliary air supply and an air distribution piece.

Meanwhile, the nozzle holes 51 of the zigzag porous nozzle 50 may be variously modified in various forms. 3b to 3d are plan views showing modifications of the nozzle holes of the air knife according to the present invention.

Referring to FIG. 3B, the zigzag porous nozzle 50b is formed such that there is almost no gap between the nozzle holes 51b crossing in the longitudinal direction, such as "B", and each nozzle hole 51b crossing in the width direction. Are formed so that there is no overlapping area with each other. When dry air is injected through the zigzag porous nozzle 50b, since there is almost no gap between the nozzle holes 51b, it is sprayed to the entire upper surface of the zigzag porous nozzle 50b without a portion where dry air is not injected. The drying process can be made easily. However, because the gap between the nozzle holes 51b is too narrow, the portion B may be broken by the injection pressure of dry air.

3C, the zigzag porous nozzle 50c is formed with each nozzle hole 51c intersecting in the longitudinal direction such as "C" having a wider space than the space A of FIG. 3A. Each nozzle hole 51c crossing in the direction is formed such that there is no overlapping area with each other. When dry air is injected through the zigzag porous nozzle 50c, the zigzag porous nozzle 50c of FIG. 3C has a region where the nozzle hole 51c is not formed than the zigzag porous nozzle 50 of FIG. 3A. It is much larger and can more easily support the injection pressure of dry air than the zigzag porous nozzle 50 of FIG. 3A. However, by widening the interval between the nozzle holes 51c, the number of nozzle holes 51c that can be formed in the zigzag porous nozzle 50c of the same length is reduced, thereby reducing the amount of dry air injected.

3D, the zigzag porous nozzle 50d is formed with each nozzle hole 51d intersecting in the longitudinal direction such as "D" at predetermined intervals, and intersecting in the width direction. The holes 51d are formed to overlap each other. When dry air is injected through the zigzag porous nozzle 50d, the width W of the nozzle holes 51d is larger than that of the nozzle holes 51, 51b, and 51c of FIGS. 3A to 3C. Since the amount of dry air increases, the drying process can be easily performed. However, since the area where the nozzle holes 51d are not formed is much smaller than the area where the nozzle holes 51d are formed, it is difficult to support the injection pressure of the dry air, and the injection pressure may be lowered because the area where the dry air is injected is large. have.

Therefore, the air knife 100 of the sawing / sorting apparatus according to the present embodiment preferably includes a zigzag porous nozzle 50 having nozzle holes 51 formed in the shape shown in FIG. 3A. Through such a zigzag porous nozzle 50, dry air is evenly sprayed at a constant pressure and a constant distribution.

On the other hand, the nozzle hole of the zigzag porous nozzle is not limited to the above-described form, it can be variously modified within the scope not departing from the technical spirit of the present invention.

The air knife of the sawing / sorting apparatus according to the present invention can easily remove moisture from the substrate strip because a certain amount of dry air is injected into the nozzle holes formed in the zigzag form. Hereinafter, the installation position of the air knife according to the present invention in the sawing / sorting apparatus will be described.

4 is a block diagram schematically showing the structure of a sawing / sorting device to which an air knife according to the present invention is applied.

Referring to FIG. 4, the sawing / sorting device 110 to which the air knife 100 according to the present invention is applied may include a loading unit 101, a vision unit 102, a sawing unit 103, a drying unit 104, and an unloading unit. A loading portion 105 and a sorting portion 106.

The air knife 100 according to the present invention is installed in the drying unit 104 located on the path where the substrate strip is transferred from the sawing unit 103 to the unloading unit 105. The sawing portion 103 is a portion where the substrate strip is separated into a unit semiconductor chip package by a blade which rotates at a high speed at the same time as the cleaning. The unloading unit 105 is a portion for loading the unit semiconductor chip package, which has been cleaned and separated, into the tray before being transferred to the sorting unit 106 which is classified into a good tray and a defective tray, respectively. At this time, the substrate strip is adsorbed and transferred to the chuck table to adsorb the mold surface.

Drying unit 104 includes an air knife 100 according to the present invention. The air knife 100 removes moisture from the solder ball forming surface, which is the back surface of the mold surface of the substrate strip, which has been cleaned and sawed by dry air injected through the zigzag porous nozzle 50.

Here, the loading unit 101 is a portion in which a substrate strip on which a plurality of semiconductor chip packages for separation and classification are formed is loaded, and the vision unit 102 confirms the alignment of the substrate strip before being introduced into the sawing unit 103. That's the part. The substrate strip, which has been cleaned and separated in the sawing section 103, is temporarily stopped at the stop of the chuck table before being transferred to the drying section 104, and blows air from the chuck table, which is generated in the substrate strip due to friction with the blades. Cool the heat and remove any dirt that could not be cleaned with water.

The operation of the air knife according to the present invention will be described below.

5 is a cross-sectional view showing a drying process in the air knife according to the present invention.

Referring to FIG. 5, as described above, the substrate strip 75 separated into the unit semiconductor chip package due to the cleaning and sawing process may have the chuck table (the solder ball forming surface 76, which is the back surface of the mold surface, facing downward). It is conveyed to the air knife 100 of the sawing / sorting apparatus in the state adsorbed by 70).

The chuck table 70 allows the dry air to be evenly sprayed on the solder ball forming surface 76 of the substrate strip 75 while moving forward, backward, left, and right by the movement of the transfer means 71. At this time, the dry air supplied from the air source is injected into the nozzle holes 51 of the zigzag porous nozzle 50 via the air inlet 20, the body 10, and the nozzle coupling hole 12. Dry air is sprayed on the zigzag porous nozzle 50 to remove moisture from the solder ball forming surface 76 of the substrate strip 75.

The dry air introduced into the air inlet 20 is discharged to the auxiliary air supply 21 formed on both sides of the air inlet 20 by the air distribution piece 22 formed in the air inlet 20. The dry air discharged to the auxiliary air supply unit 21 moves along the air supply pipe 61 to the auxiliary air knife 60 located at the top of the chuck table 70 so that the chuck is the opposite portion to which the substrate strip 75 is adsorbed. Dry air is sprayed on the upper part of the table 70. The auxiliary air knife 60 removes splashes and dust on the chuck table 70 during the cleaning and sawing process of the substrate strip 75. Here, reference numeral 65 denotes a brush, which prevents dust or water from splashing into the sprayed drying air when the drying step is carried out while the conveying means 71 is conveyed.

On the other hand, the air knife of the sawing / sorting device having a zigzag porous nozzle according to the present invention can be variously modified within the scope not departing from the above-described embodiment and without departing from the technical spirit of the present invention. This will be readily apparent to those skilled in the art.

According to the air knife of the sawing / sorting device having a zigzag porous nozzle according to the present invention as described above, since dry air is uniformly sprayed with a constant pressure and a constant distribution to the nozzle holes formed in a zigzag form in a longitudinal direction The moisture of the substrate strip can be easily removed. This solves the problem caused by the moisture of the substrate strip not being removed. And air knife can be used semi-permanently.

Claims (2)

A sawing part for separating a plurality of semiconductor chip packages formed on the substrate strip into a unit semiconductor chip package while washing with water, and an air knife for spraying dry air to remove moisture on the back surface of the mold surface of the unit semiconductor chip package where the sawing is completed. a chuck table for transporting the semiconductor chip package by adsorbing the mold surface to a drying unit equipped with a knife), a sorting unit for classifying the dried unit semiconductor chip package into good and defective products, and a sawing unit, a drying unit and a sorting unit. An air knife of a sawing / sorting device including the installed transfer unit, A zigzag porous nozzle having a plurality of nozzle holes formed in a long slit shape in a longitudinal direction, and the nozzle holes are arranged along a length direction in a zigzag shape, and in which dry air is injected into the nozzle holes; , A nozzle coupling hole is formed in which an air inlet hole through which dry air is introduced and the zigzag porous nozzle are formed, so that dry air introduced into the air inlet hole is injected into the zigzag porous nozzle, and the nozzle coupling hole is formed in the opposite direction. An air knife of a sawing / sorting device, characterized in that it comprises a body in which the space is narrowed from the portion to the portion where the nozzle engaging hole is formed. According to claim 1, And the zigzag porous nozzle has an area excluding the area of the nozzle holes equal to or larger than that of the nozzle holes.

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