KR20070066421A - Temperature transfer apparatus having cooling plate equipped with fluid piping for cooling - Google Patents

Abstract

A temperature transfer apparatus having a cooling plate equipped with a cooling fluid pipeline is provided to cool a semiconductor device rapidly by approaching cooling conductive plate to the semiconductor device, respectively. A temperature transfer apparatus(60) transfers a temperature of a semiconductor device mounted on a test tray(5) in a test chamber through an approaching scheme. The temperature conversion apparatus includes a heating conductive plate(70) and a cooling conductive plate(80). The heating conductive plate is provided with a hot wire which is wired therein. The cooling conductive plate is positioned to a lower portion of the heating plate, and provided with a cooling fluid pipeline through which a cooling fluid is provided from an external cooling fluid source.

Description

TEMPERATURE TRANSFER APPARATUS HAVING COOLING PLATE EQUIPPED WITH FLUID PIPING FOR COOLING}

1 is a schematic diagram illustrating a test chamber having a temperature conversion device according to an embodiment of the present invention.

2 is a perspective view illustrating a temperature converter and a test tray according to an exemplary embodiment of the present invention.

3 is a cross-sectional view showing a cooling plate of a temperature conversion device according to an embodiment of the present invention.

4 is a graph showing a temperature change of a semiconductor device in a test chamber according to the related art and the present invention.

Explanation of symbols on the main parts of the drawings

1: semiconductor device

5: test tray

6: tray frame

7: insert

10: test chamber

12: inner space

20: heater pole

30: liquid nitrogen injection orifice

40: ventilation fan

50: space temperature sensor

60: temperature transfer apparatus

62: guide bar

70: heating plate

72: hot wire

80: cooling plate

82: fluid piping for cooling

83 inflow orifice

84: discharge orifice

91: device temperature sensor

93: control temperature sensor

The present invention relates to a semiconductor device test equipment, and more particularly, to a temperature conversion device for converting a temperature of a semiconductor device mounted on a test tray in a test chamber for testing a semiconductor device.

In general, semiconductor devices that have completed the assembly process are subjected to a test process to determine whether they are good or bad before being shipped. A test handler is a device in which a test process of such a semiconductor device is performed. Such a test handler is configured to perform a process of unloading the semiconductor device stored in the tray while automatically mounting it in the test tray, performing a desired test, classifying it as good or bad, and unloading the tray. .

Recently, as the environment in which semiconductor devices are used is diversified, semiconductor devices are required to operate stably in high temperature or low temperature environments as well as at room temperature. Accordingly, the test handler creates a harsh temperature condition of high or low temperature by itself, and performs a test for verifying reliability of operation of the semiconductor devices. In such a test handler, a substantial test of the semiconductor device is made in the test chamber. The test chamber is mounted on the test tray to test the semiconductor device supplied into the test chamber under a certain temperature condition.

A test chamber according to the prior art is disclosed in Korean Patent Laid-Open Publication No. 2003-0067798. The test chamber disclosed in Korean Patent Laid-Open Publication No. 2003-0067798 includes a heater rod, a liquid nitrogen injection port, and a blowing fan. The heater rods generate heat. The liquid nitrogen injection port injects liquid nitrogen LN ₂ transmitted from the outside. The blowing fan blows liquid nitrogen (LN ₂ ) injected by heat or liquid nitrogen injection holes generated from the heater rods.

In addition, the test chamber according to the prior art may further include a temperature conversion device. The temperature converter is a conductive plate having a hot wire wired therein, and rises or falls to approach a semiconductor device transferred to an internal space of a test chamber.

In the test chamber having such a configuration, when a high temperature test is performed on a semiconductor element, the temperature conversion device is brought close to the semiconductor element, and at the same time, the heat generated from the heater rod is blown by a blower fan, thereby reducing the internal space of the test chamber. The semiconductor device is heated to a high temperature. In addition, when the low temperature test of the semiconductor device is performed, the liquid nitrogen LN ₂ injected by the liquid nitrogen jet rod is blown by a blowing fan to cool the semiconductor device by making the internal space of the test chamber low temperature.

However, the test chamber according to the related art has, for example, about 56.7 minutes to cool the semiconductor device to about −5 ° C. in order to perform a low temperature test on the semiconductor device heated to about 75 ° C. as the high temperature test proceeds. It takes That is, it takes a long time to cool a high temperature semiconductor element to low temperature only by making the internal space of a test chamber low temperature. As a result, productivity for the semiconductor device is lowered.

Accordingly, an object of the present invention is to provide a cooling fluid that can shorten the time required to cool a semiconductor device to a low temperature in order to perform a low temperature test on a high temperature semiconductor device having a high temperature test completed to increase productivity of the semiconductor device. It is to provide a temperature conversion device having a cooling plate provided with piping.

In order to achieve the above object, the present invention provides a temperature conversion device for converting a temperature of a semiconductor device mounted on a test tray through an approach in a test chamber for testing a semiconductor device, the conductive wire having a heating wire inside A cooling fluid comprising a heating plate and a conductive cooling plate disposed therein, the cooling fluid pipe being disposed therein and serving as a passage of the cooling fluid supplied from an external cooling fluid source. Provided is a temperature conversion device having a cooling plate provided with piping.

The temperature conversion device according to the present invention is installed on the cooling plate, and is installed on the cooling plate separately from at least one device temperature sensor and the device temperature sensor to detect the temperature of the semiconductor device by accessing the semiconductor device integrally with the cooling plate. The apparatus may further include at least one control temperature sensor that senses the temperature of the cooling plate and transmits the temperature of the cooling plate to the automatic control device connected to the outside so that the temperature of the heating plate and the cooling plate is automatically controlled.

In the temperature conversion device according to the present invention, the cooling fluid may be liquid nitrogen.

Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of the present invention.

1 is a schematic diagram illustrating a test chamber having a temperature conversion device according to an embodiment of the present invention. 2 is a perspective view illustrating a temperature converter and a test tray according to an exemplary embodiment of the present invention. 3 is a cross-sectional view showing a cooling plate of a temperature conversion device according to an embodiment of the present invention.

Referring to FIG. 1, the test chamber 10 according to the present invention is mounted on a test tray 5 and heated or cooled to convert a temperature of a semiconductor device transferred to an internal space 12 of the test chamber 10. Test the device. The test chamber 10 includes a temperature conversion device 60, a heater rod 20, a liquid nitrogen injection port 30, a blowing fan 40, and a space temperature sensor 50.

The temperature conversion device 60 is positioned above the test tray 5 transferred to the internal space 12 of the test chamber 10, and has a structure that can be raised or lowered through the guide bar 62. The temperature converter 60 heats or cools the semiconductor element mounted on the test tray 5 through an approach.

The heater rod 20, the liquid nitrogen injection port 30, and the blowing fan 40 are located at one side of the internal space 12 of the test chamber 10. The heater rod 20 generates heat to increase the temperature of the internal space 12 of the test chamber 10. The liquid nitrogen injection port 30 injects the liquid nitrogen LN ₂ transmitted from the outside into the internal space 12 of the test chamber 10 so that the temperature of the internal space 12 of the test chamber 10 decreases. Blowing fan 40 is a liquid nitrogen (LN) is injected by the heat or liquid nitrogen injection port 30 generated from the heater rod 20 to smoothly raise or lower the temperature of the interior space 12 of the test chamber 10 ₂ ) blow. The heater rod 20, the liquid nitrogen injection port 30, and the blowing fan 40 raise or lower the temperature of the internal space 12 of the test chamber 10 to heat or cool the semiconductor device.

The space temperature sensor 50 is located opposite the heater rod 20, the liquid nitrogen injection port 30, and the blowing fan 40, and thus the heater rod 20, the liquid nitrogen injection port 30, and the blowing fan 40. The temperature of the internal space 12 of the test chamber 10 rising or falling by is sensed. The temperature of the interior space 12 of the test chamber 10 sensed by the space temperature sensor 50 is transmitted to and displayed by a display unit (not shown) outside the test chamber 10.

2 and 3, the temperature conversion device 60 according to the embodiment of the present invention will be described in more detail. The temperature conversion device 60 according to the present embodiment may include a heating plate 70 and a cooling plate 80. And a device temperature sensor 91 and a control temperature sensor 93.

The heating wire 70 is wired inside with a heating wire 72 that generates heat by electrical energy. In this case, the heating wire 72 may be divided into two parts to facilitate temperature control of the heating plate 70. The heating plate 70 is made of a conductive material so as to be uniformly heated by the heating wire 72.

The cooling plate 80 is a portion substantially approaching the semiconductor element 1 mounted on the test tray 5, and is located below the heating plate 70, and is coupled to the heating plate 70 to guide the bar. And ascending or descending integrally through 62). In addition, the cooling plate 80 has a structure in which a cooling fluid pipe 82 serving as a passage of the cooling fluid is provided therein. Both ends of the cooling fluid pipe 82 have an inlet port 83 through which cooling fluid is supplied from an external cooling fluid source (not shown) and an outlet port through which the cooling fluid introduced through the inlet port 83 is discharged to the outside. It is used as (84). The cooling fluid pipe 82 is piped so that the cooling fluid is uniformly distributed over the entire surface of the cooling plate 80 with the inlet 83 and the outlet 84 exposed to the outside. In this case, the cooling fluid pipe 82 may be divided into two parts to facilitate temperature control of the cooling plate 80, and liquid nitrogen LN ₂ may be used as the cooling fluid.

The cooling plate 80 is not only uniformly cooled by the cooling fluid flowing along the cooling fluid pipe 82 but also receives heat from the heating plate 70 as the heating plate 70 is heated. So that it is made of a conductive material.

At least one device temperature sensor 91 is installed on the cooling plate 80. When the cooling plate 80 approaches the semiconductor device 1, the device temperature sensor 91 approaches the semiconductor device 1 integrally with the cooling plate 80 to sense the temperature of the semiconductor device 1. . The temperature of the semiconductor device 1 sensed by the device temperature sensor 91 is transmitted to a display unit (not shown) outside the test chamber 10 and displayed.

At least one control temperature sensor 93 is installed on the cooling plate 80 separately from the element temperature sensor 91. The control temperature sensor 93 detects a temperature change of the cooling plate 80 when the cooling plate 80 approaches the semiconductor element 1. The control temperature sensor 93 transmits the changed temperature of the cooling plate 80, which senses that the temperatures of the heating plate 70 and the cooling plate 80 are automatically controlled, to an automatic control device (not shown) connected to the outside. do.

Meanwhile, a method of testing a semiconductor device 1 in a test chamber 10 having a temperature conversion device 60 according to an embodiment of the present invention having such a configuration will be described below with reference to FIGS. 1 to 3. same.

First, a step in which the semiconductor device 1 is transferred is performed. That is, the semiconductor devices 1 in which the assembly process is completed are transferred to the internal space 12 of the test chamber 10 while being mounted on the test tray 5. At this time, the test tray 5 has a structure in which a plurality of inserts 7 are provided in the tray frame 6, and each insert 7 accommodates one semiconductor element 1.

Subsequently, a high temperature test of the semiconductor device 1 proceeds. That is, when the test tray 5 is transferred to the internal space 12 of the test chamber 10, the heater rod 20 and the blower fan 40 operate to blow heat generated from the heater rod 20 into the blower fan ( 40 blows into the interior space 12 of the test chamber 10, thereby bringing the interior space 12 of the test chamber 120 into a high temperature state. At the same time, the temperature converter 60 descends to approach the semiconductor element 1 mounted on the test tray 5, and heats the heating wire 70 of the heating plate 70 to heat the heating plate 70. do. Accordingly, the semiconductor element 1 is heated by receiving heat from the internal space 12 in a high temperature state and receiving heat from the heating plate 70 through the cooling plate 80. The semiconductor element 1 thus heated is tested through a test socket (not shown) connecting with the test tray 5.

Subsequently, a low temperature test of the semiconductor device 1 proceeds. That is, when the high temperature test for the semiconductor device 1 is completed, the liquid nitrogen injection port 30 and the blowing fan 40 operate to blow the liquid nitrogen LN ₂ injected from the liquid nitrogen injection port 30 into the blowing fan 40. ) Blows into the internal space 12 of the test chamber 10, thereby making the internal space 12 of the test chamber 10 low temperature. At the same time, in a state where the temperature converter 60 approaches the semiconductor element 1, the cooling fluid is circulated through the cooling fluid pipe 82 of the cooling plate 80 to cool the cooling plate 80. . Accordingly, the semiconductor element 1 is cooled by transferring heat to the internal space 12 in a low temperature state and transferring heat to the cooling plate 80. The semiconductor element 1 thus cooled is tested through a test socket (not shown) connecting with the test tray 5.

Finally, the step of discharging the semiconductor device 1 proceeds. That is, when the low temperature test on the semiconductor device 1 is completed, the temperature conversion device 60 is raised, and the semiconductor device 1 mounted on the test tray 5 is placed in the internal space 12 of the test chamber 10. Is discharged to outside. At this time, the discharged semiconductor elements 1 are classified and stacked according to the results of the high temperature and low temperature tests.

At this time, the test chamber according to the present invention, as described above, by cooling the semiconductor device, for example, in order to conduct a low temperature test on the semiconductor device heated to about 75 ℃ as the high temperature test proceeds, It takes about 17 minutes to cool to about -5 ° C.

Meanwhile, in the above-described embodiment, the cooling plate cooled by the cooling fluid is disclosed, but the temperature conversion device according to the present invention may be implemented by using the cooling plate cooled by various refrigerants. For example, cooling water, cooling air, and a thermoelectric element may be used as the refrigerant.

When the coolant is used as the refrigerant, the cooling plate has a structure in which an empty space is formed therein and is connected to an external freezer. This cooling plate is cooled as the cooling water cooled from the freezer is injected into the empty space. That is, when the high temperature test for the semiconductor element is completed, the cooling water is injected into the empty space of the cooling plate to absorb the surrounding heat and vaporize, thereby cooling the cooling plate. At this time, the vaporized cooling water is returned to the refrigerator and compressed to liquefy.

In addition, when cooling air is used as the refrigerant, the cooling plate has a structure in which an empty space is formed therein and is connected to an external cooling air source. This cooling plate is cooled as air cooled to the empty space is supplied.

In addition, when a thermoelectric element is used as the refrigerant, the cooling plate has a form of a plate provided with a modular thermoelectric element. The cooling plate is cooled by the cooling effect caused by the peltier effect of the thermoelectric element.

Therefore, according to the structure of the present invention, when performing a high temperature test on a semiconductor element, the internal space of the test chamber is made high temperature and at the same time the heated temperature conversion device approaches the semiconductor element, thereby heating the semiconductor element, When a low temperature test is performed on the device, the internal space of the test chamber is cooled to a low temperature to cool the semiconductor device, and the cooled temperature converter is approached to the semiconductor device to cool the semiconductor device, thereby completing the high temperature test. In order to perform a low temperature test on a semiconductor device, the time required to cool the semiconductor device to a low temperature can be shortened.

For example, in the test chamber, in order to conduct a low temperature test on a semiconductor device heated to about 75 ° C. as the high temperature test proceeds, the time required to cool the semiconductor device to about −5 ° C. is shown in FIG. 4. As shown, in the conventional test chamber according to the present invention, about 39.7 minutes can be shortened to about 17 minutes, as shown.

As such, the time required for cooling the high temperature semiconductor element to a low temperature can be shortened, thereby increasing productivity for the semiconductor element.

Claims (3)

In the temperature conversion device for converting the temperature of the semiconductor device mounted on the test tray in a test chamber (test chamber) for testing the semiconductor device through the approach, A conductive heating plate having heated wires therein; And A cooling fluid pipe disposed under the heating plate and having a cooling fluid pipe installed therein, the cooling fluid pipe being a passage of a cooling fluid supplied from an external cooling fluid source; Temperature conversion device having a cooling plate installed. The method of claim 1, At least one device temperature sensor installed at the cooling plate and configured to sense the temperature of the semiconductor device by accessing the semiconductor device integrally with the cooling plate; And At least one control temperature installed on the cooling plate separately from the element temperature sensor and sensing the temperature of the cooling plate so as to automatically control the temperature of the heating plate and the cooling plate and transferring the temperature to the automatic control device connected to the outside. Sensor; Temperature conversion device having a cooling plate is installed, further comprising a cooling fluid pipe. The method of claim 1, And the cooling fluid is a liquid nitrogen (LN ₂ ).

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