KR20070063606A - Adhesive material tape and method of producing the tape - Google Patents

Abstract

A method of connecting adhesive material tapes, used for connecting one adhesive material tape wound on one reel and the other tape wound on the other reel, an adhesive agent being applied on base materials of the tapes. The end portion of the one adhesive material tape is turned over, and an adhesive agent face of the one adhesive material tape and an adhesive agent layer of the other adhesive material tape are laid over each other. Then, the laid over portion is heated and pressed so as to connect them. To exchange the adhesive material reels, the end portion of an adhesive material tape having been paid out and the start potion of an adhesive material tape to be newly installed are adhered to each other using the adhesive agents of the adhesive material tapes. Therefore, work including exchange of take- up tapes at every replacement of a new adhesive material tape and installation of the start portion of a new adhesive material tape to a take-up reel is not required. The replacement to a new adhesive material tape requires less time, and then productivity of electronic equipment is increased.

Description

Adhesive tape and its manufacturing method {ADHESIVE MATERIAL TAPE AND METHOD OF PRODUCING THE TAPE}

1: is a perspective view which shows the connection of adhesive material reels in the connection method of the adhesive material tape which concerns on 1st Embodiment.

2A and 2B are perspective views illustrating a connection process of the connection portion in FIG. 1.

3A and 3B are schematic diagrams illustrating a pressing process of the adhesive material in the bonding apparatus.

4 is a cross-sectional view showing adhesion of circuit boards.

5 is a flowchart showing a method for producing an adhesive tape.

6 is a perspective view illustrating a method for connecting an adhesive tape in a second embodiment of the present invention.

It is a perspective view which shows the connection method of an adhesive tape in the modified example of 2nd Embodiment of this invention.

8A to 8C are views showing a connection method of the adhesive tape according to the first embodiment, FIG. 8A is a perspective view showing the connection between the adhesive material reels, and FIG. 8B is a connection method of the connection portion in FIG. 8A. 8C is a plan view of the connecting portion in FIG. 8A.

9 is a cross-sectional view showing a connection method of an adhesive tape in a second embodiment of the present invention.

It is sectional drawing which shows the connection method of an adhesive tape in 3rd Embodiment of this invention.

It is sectional drawing which shows the connection method of an adhesive tape in 4th Embodiment of this invention.

12A and 12B are views showing a connection method of the adhesive tape according to the first embodiment, FIG. 12A is a perspective view showing the connection between the adhesive material reels, and FIG. 12B is a connection method of the connection portion in FIG. 12A. It is a perspective view showing.

It is sectional drawing which shows the connection method of an adhesive tape in 2nd Embodiment of this invention.

14A and 14B are sectional views showing the connection method of the adhesive tape in the third embodiment of the present invention, FIG. 14A shows a state before heating and pressing, and FIG. 14B shows a state after heating and pressing.

15A and 15B are views showing a connection method of the adhesive tape in the fourth embodiment of the present invention, FIG. 15A is a sectional view, and FIG. 15B is a plan view.

16A and 16B are views showing a connection method of the adhesive tape according to the first embodiment, Fig. 16A is a perspective view showing the connection between the adhesive material reels, and Fig. 16B is a connection portion (b) in Fig. 16A. It is a perspective view showing.

It is sectional drawing which shows the connection method of an adhesive tape in 2nd Embodiment of this invention.

It is sectional drawing which shows the connection method of an adhesive tape in 3rd Embodiment of this invention.

It is sectional drawing which shows the connection method of an adhesive tape in 4th Embodiment of this invention.

20A to 20C are views showing a connection method of the adhesive tape according to the first embodiment, FIG. 20A is a perspective view showing the connection between the adhesive material reels, and FIGS. 20B and 20C are connection portions in FIG. 20A. It is sectional drawing which shows the connection method of the.

It is a schematic diagram which shows the crimping | compression-bonding process of the adhesive material in the bonding apparatus.

22A to 22C are views showing an adhesive tape reel according to the first embodiment, FIG. 22A is a perspective view showing an adhesive tape reel, FIG. 22B is a front view in FIG. 22A, and FIG. 22C is a view in FIG. 22A. Top view of the connection tape.

It is a schematic diagram which shows the crimping | compression-bonding process of the adhesive material in the bonding apparatus.

It is a top view of the connection tape in 2nd Embodiment of this invention.

It is a top view of the connection tape in 3rd Embodiment of this invention.

It is a perspective view which shows the adhesive tape reel in 4th Embodiment of this invention.

27A to 27C are diagrams showing an adhesive tape reel according to the first embodiment, FIG. 27A is a perspective view showing an adhesive tape reel, FIG. 27B is a front view in FIG. 27A, and FIG. 27C is shown in FIG. 27A. It is sectional drawing of the connection part in this.

It is a schematic diagram which shows the crimping | compression-bonding process of the adhesive material in the bonding apparatus.

29 is a perspective view showing a state of use of the adhesive material in the PDP.

It is a perspective view which shows the adhesive tape reel in 2nd Embodiment of this invention.

Fig. 31A is a cross-sectional view of the adhesive tape when the adhesive tape of the adhesive tape reel of the present invention is used for a semiconductor device having a LOC structure.

Fig. 31B is a sectional view of the semiconductor device of the LOC structure when the adhesive tape of the adhesive tape reel of the present invention is used for the semiconductor device of the LOC structure.

32A to 32C are schematic views of an adhesive apparatus using the adhesive tape reel of the present invention, FIG. 32A is a front view, and FIG. 32B is a side view, and FIG. 32C is an adhesive tape punching and attachment portion 89 of FIG. 32B. It is an enlarged view of the main part.

33A and 33B are views of an adhesive tape, FIG. 33A is a perspective view of a reel wound around the adhesive tape, and FIG. 33B is a cross-sectional view along the line A-A in FIG. 33A.

34 is a perspective view showing a state of use of the adhesive material in the PDP.

It is sectional drawing which shows the process of apply | coating an adhesive material to a base material.

36A to 36C are cross-sectional views of the adhesive tape according to the second embodiment of the present invention.

37A to 37C are process charts showing an adhesive tape and a crimping method thereof according to a third embodiment of the present invention.

38A to 38C are process charts showing the manufacturing method of the adhesive tape according to the fourth embodiment of the present invention.

39A and 39B are views of an adhesive tape, and FIG. 39A is a perspective view of a reel wound around the adhesive tape, and FIG. 39B is a plan view of the adhesive tape of FIG. 39A seen from the adhesive material side.

40 is a schematic view showing a crimping step for bonding an adhesive in the bonding apparatus.

Fig. 41 is a schematic diagram showing a pressing step of the adhesive material in the bonding apparatus according to the second embodiment of the present invention.

42A to 42C are cross-sectional views of an adhesive tape according to a third embodiment of the present invention.

43A to 43C are process charts showing an adhesive tape and a crimping method thereof according to a fourth embodiment of the present invention.

44A to 44C are process charts showing the manufacturing method of the adhesive tape according to the fifth embodiment of the present invention.

45A and 45B are views of the adhesive tape cassette according to the first embodiment of the present invention, FIG. 45A is a perspective view of the adhesive tape cassette, and FIG. 45B is an A-A cutaway view of FIG. 45A.

FIG. 46 is a cross-sectional view illustrating a mounting state of a reel in the tape cassette shown in FIG. 45A.

It is a front view which shows the crimping | compression-bonding process of the adhesive material in the bonding apparatus.

48 is a process chart showing the manufacturing method of the adhesive tape cassette.

Fig. 49 is a schematic diagram showing the pressing step of the adhesive material in the bonding apparatus according to the second embodiment of the present invention.

It is sectional drawing of the adhesive tape which concerns on 3rd Embodiment of this invention.

51A and 51B are process drawings showing the adhesive tape and the pressing method thereof according to the fourth embodiment of the present invention.

52A and 52B are views showing the adhesive tape according to the first embodiment, FIG. 52A is a perspective view showing the connection between the adhesive material reels, and FIG. 52B is a cross-sectional view showing the connection portion in FIG. 52A.

It is sectional drawing which shows the adhesive tape which concerns on 2nd Embodiment.

54A to 54C are sectional views showing the connection process of the connecting portions in FIG. 55, FIG. 54A shows the state before discharging, FIG. 54B shows the state after discharging, and FIG. 54C shows the heat compression of the connecting portion. Drawing.

Fig. 55 is a perspective view illustrating the connection between adhesive material reels in the method for connecting an adhesive tape.

Fig. 56 is a schematic view showing the crimping step of the adhesive material in the bonding apparatus.

57A to 57C are views showing an adhesive tape reel according to the first embodiment, FIG. 57A is a perspective view showing an adhesive tape reel, FIG. 57B is a front view in FIG. 57A, and FIG. 57C is shown in FIG. 57A. It is a front view of the cover member in FIG.

Fig. 58 is a flowchart illustrating a method of manufacturing the adhesive tape reel.

Fig. 59 is a side view of the adhesive tape reel of the second embodiment of the present invention.

60A and 60B are front views of the adhesive tape reel in the third embodiment of the present invention, illustrating the exchange of the adhesive tape.

It is a perspective view which shows the side plate of a winding part in 4th Embodiment of this invention.

62A and 62B are views of the bonding tool according to the first embodiment of the present invention, FIG. 62A is a perspective view of the bonding tool, and FIG. 62B is an A-A cutaway view of FIG. 62A.

FIG. 63: is a side view explaining the usage method of the bonding tool shown in FIG. 62A and 62B. FIG.

64 is a process chart showing a method for manufacturing the bonding tool.

65A and 65B are views showing the adhesive tape according to the first embodiment, FIG. 65A is a perspective view in which the adhesive tape is wound on a reel, and FIG. 65A is a cross-sectional view A-A in FIG. 65A.

66A and 66B are views showing an adhesive material forming step of the adhesive tape according to the first embodiment, and FIG. 66A shows a step of overlapping each adhesive tape together to unify and winding one substrate onto a reel for winding. 66B is sectional drawing which shows the overlapping part of the adhesive materials in FIG. 66A.

Fig. 67 is a schematic diagram showing a step of forming an adhesive in the bonding apparatus on the adherend.

It is a perspective view of the reel which wound the adhesive tape.

It is sectional drawing which shows the adhesive material formation process of the adhesive tape in 2nd Embodiment.

FIG. 69B is a cross-sectional view showing the bonding between circuit boards using the adhesive material of FIG. 69A. FIG.

It is a schematic diagram of the supply form of the two-layered anisotropic conductive tape of this invention.

FIG. 71: is a schematic diagram of the supply form of the 3-layered anisotropically conductive tape of this invention.

The present invention provides an adhesive tape for electronically connecting an electronic component and a circuit board or circuit boards and electrically connecting both electrodes, a connecting method thereof, a manufacturing method, a pressing method, an adhesive reel, an adhesive device, and an adhesive material. The present invention relates to a tape cassette and a crimping method of an adhesive material using the same, in particular, an adhesive tape wound in a reel shape, a connecting method, a manufacturing method, a crimping method, an adhesive reel, an adhesive device, an adhesive tape cassette, a crimping method and anisotropic adhesive material using the same. It relates to a conductive tape.

Generally, as a means for adhesively fixing electronic components such as liquid crystal panels, plasma display panels (PDPs), EL (fluorescent display) panels, bare chip mounting, and circuit boards and circuit boards, and electrically connecting the electrodes. Adhesive tape is used.

Japanese Patent Laid-Open No. 2001-284005 discloses winding up an adhesive tape coated with an adhesive on a substrate in a reel form.

The conventional adhesive tape of this kind has a width of about 1 to 3 mm and a length of the tape wound on the reel is about 50 m.

In the case where the adhesive tape is attached to the adhesive device, an adhesive tape reel (hereinafter simply referred to as an "adhesive material reel") is attached to the adhesive device, the lead end of the adhesive tape is taken out, and the winding reel is mounted. Then, on the substrate side of the adhesive tape unwound from the adhesive reel, the adhesive is crimped with a heating press head, and the remaining substrate is wound on the take-up reel.

Then, when the adhesive tape of the adhesive reel is finished, the finished reel and the winding reel winding the base material are removed, a new winding reel and a new adhesive reel are attached to the adhesive device, and the beginning of the adhesive tape is attached to the winding reel. .

With the recent increase in the size of panel screens in PDPs and the like, the adhesive area (or dimensions of one side) of a circuit board has increased, and the amount of adhesive used at one time has increased. In addition, since the use of the adhesive material has also been expanded, the amount of the adhesive material used has increased. For this reason, in the manufacturing plant of an electronic device, there is a problem that the replacement frequency of the adhesive material reel increases, and since the exchange of the adhesive material reel takes many hands, the production efficiency of the electronic device cannot be improved.

In response to this problem, it is considered to increase the amount of adhesive material per reel and to reduce the reel replacement frequency by increasing the number of turns of the adhesive tape wound on the reel, but the tape width of the adhesive tape is 1 to 3 mm. Because it is narrow, if the number of turns is increased, there is a fear that the wound may be disturbed. In addition, increasing the number of turns increases the pressure acting on the adhesive tape wound on the tape, and the adhesive may bleed out from both widths of the tape and cause blocking.

Furthermore, when the number of turns of the adhesive tape is increased, the diameter of the reel also increases, and it is difficult to attach to the existing adhesive device, and there is a possibility that the existing adhesive device cannot be used.

Therefore, the present invention can simplify the replacement of the adhesive reel, the adhesive tape connection method and the adhesive tape, the manufacturing method, the pressing method, the adhesive tape reel, the adhesive device, which can improve the production efficiency of the electronic device An adhesive tape cassette, an adhesive method using the same, and an anisotropic conductive tape are provided.

The 1st invention of this application is a connection method of the adhesive tape which connects the one adhesive tape wound on one reel and the other adhesive tape wound on the other reel by which the adhesive material for electrode connection was apply | coated to the base material, It is characterized by inverting the end portion of one adhesive tape, overlapping the adhesive face of one adhesive tape and the adhesive face of the other adhesive tape, and connecting the overlapped portions by hot pressing.

In the first invention of the present application, the adhesive tape of the adhesive tape is replaced with the end of the adhesive tape after the unwinding and the beginning of the adhesive tape to be newly mounted to exchange the adhesive reels. The mounting of can be simplified. In addition, it is not necessary to replace the winding tape, install the beginning of the new adhesive tape on the winding reel, or set a guide pin in a predetermined path every time the new adhesive tape is replaced. Since the exchange time is short, the production efficiency of the electronic device is increased.

Since the end part of the adhesive tape in which unwinding was complete | finished is overturned, the adhesive material surface of an adhesive tape and the adhesive material surface of the adhesive tape to be newly mounted are superimposed, and adhesive strength is high.

The heat bonding of the connecting portion can be reasonably used by using a heat press head of an adhesive device in which an adhesive material reel is attached.

In the second invention of the present application, in the first invention of the present application, an end mark is attached to an end of one adhesive tape.

According to the second invention of the present application, the same effects as those of the first invention of the present application can be exhibited, and the cutting of the adhesive tape after the unwinding can be performed when the end mark is exposed. Since it is easy to understand and can be connected in the minimum necessary position, waste of an adhesive tape can be prevented.

The third invention of the present application is a connection method of an adhesive tape for connecting one adhesive tape wound on one reel and the other adhesive tape wound on the other reel, wherein the adhesive material for electrode connection is applied to the substrate, The beginning end of the other adhesive tape is attached to the base surface of the adhesive tape wound on the reel by the lead tape, and after the end of one adhesive tape is inverted, the adhesive tape face of the lead tape is terminated at the end of the adhesive tape. It overlaps with the adhesive material surface, It is characterized by hot-pressing the overlapped portion.

According to the third invention of the present application, as in the first invention of the present application, the mounting of the new adhesive tape to the bonding apparatus can be simplified, and the replacement time of the new adhesive reel is shortened, so that the production efficiency of the electronic device is reduced. Is higher.

Furthermore, since the lead tape of the adhesive tape is adhered to the end of the adhesive tape after the unwinding and the starting end of the adhesive tape to be newly mounted, the adhesive tapes can be easily bonded.

As a 4th invention of this application, as a connection method of the adhesive tape which connects the one adhesive tape wound on one reel and the other adhesive tape wound on the other reel by which the adhesive material for electrode connection was apply | coated to the base material, The beginning end of the other adhesive tape is attached to the base material surface of the adhesive tape wound on the reel by the lead tape, and the adhesive tape surface of the lead tape is overlapped with the adhesive material surface of the end portion of one adhesive tape, and the overlapped portion is heat-compressed. Characterized in that.

According to the fourth invention of the present application, as in the first invention of the present application, the mounting of the new adhesive tape to the bonding apparatus can be simplified, and the replacement time of the new adhesive reel takes less time, thus producing electronic devices. The efficiency is increased.

Moreover, since it is not necessary to turn over the adhesive tape after completion of unwinding, it is possible to prevent the possibility that the winding may be disturbed when the adhesive tape is wound on the winding reel.

5th invention of this application is a connection method of the adhesive tape which connects the one adhesive tape wound on one reel and the other adhesive tape wound on the other reel by which the adhesive material for electrode connection was apply | coated to the base material, The end part of one adhesive material tape and the start end part of the other adhesive material tape are overlapped, and a locking pin is inserted and connected to the overlapping part of both, It is characterized by the above-mentioned.

In the 5th invention of this application, since the end part of the adhesive material tape which unwinding | finished and the start end part of the adhesive material tape which are newly attached are fixed with an engagement pin, connection is easy. In addition, there is no need to replace the winding tape, install the beginning of the new adhesive tape on the winding reel, or set a guide pin in a predetermined path every time the replacement of the new adhesive reel is performed, so that the replacement time of the new adhesive reel is reduced. Therefore, the production efficiency of the electronic device is increased.

In the sixth invention of the present application, an adhesive member for connecting an adhesive tape, which connects one adhesive tape wound on one reel and the other adhesive tape wound on the other reel, wherein the adhesive material for electrode connection is applied to the substrate, is provided. As a method of connecting an adhesive tape to be connected by use, the locking member has a click portion provided at one end and the other end and an elastic member provided between the click portion, Abutting the end portion with the start end of the other adhesive tape, and engaging the click portion provided at one end of the locking member to the end portion of one adhesive tape, and the click portion provided at the other end to the start end of the other adhesive tape. It is characterized by pulling both click portions to the elastic member.

According to the sixth invention of the present application, one click portion of the locking member is locked to the end portion of one adhesive material tape, and then the other click portion of the locking member is locked to the start end portion of the other adhesive material tape. Since it connects with each other, connection is easy. Moreover, since the elastic member is provided between the one click part and the other click part, the elastic member is extended so that the other click part of the locking member can be locked at an arbitrary position of the start end of the other adhesive tape. As a result, the degree of freedom of connection is high.

In addition, since the ends of one adhesive tape and the other end of the adhesive tape are connected with each other, the tapes do not need to overlap each other and can be connected at the minimum position, thereby preventing waste of the adhesive tape. .

As a 7th invention of this application, as a connection method of the adhesive tape which connects the one adhesive tape wound on one reel and the other adhesive tape wound on the other reel by which the adhesive material for electrode connection was apply | coated to the base material, The end part of one adhesive material tape and the start end part of another adhesive material overlap each other, and the overlapping part of both adhesive parts is clamped and fixed to the elastically deformable clip whose cross section is substantially co-shaped.

According to the 7th invention of this application, since the connection part which overlapped the terminal part of one adhesive material tape and the start end part of the other adhesive material tape can be connected only by a clip, connection operation is easy.

In the eighth invention of the present application, the overlapped portion of one adhesive tape and the other adhesive tape is sandwiched between the overlapping portion of one adhesive tape and the other adhesive tape to a metal sandwich piece having a substantially cross-shaped cross section. The clamping piece is pressed and crushed from both sides of the overlapped portion to connect both of them.

According to the eighth invention of the present application, the clamping pieces are pressed and crushed from both surfaces of the overlapped portions to connect the two, so that the connection strength of the overlapped portions of the adhesive tape can be increased.

9th invention of this application is a connection method of the adhesive tape which connects the one adhesive tape wound on one reel and the other adhesive tape wound on the other reel by which the adhesive material for electrode connection was apply | coated to the base material, The end part of one adhesive material tape and the start end part of another adhesive material tape superimpose the other adhesive material surface on one base material surface, and the overlapping length of both in the range of 2 times-50 times the width of an adhesive tape. It is characterized in that the connection between the two by heat compression.

In the ninth invention of the present application, the end of the adhesive tape terminated by using the adhesive of the adhesive tape and the beginning of the newly attached adhesive tape are adhered to each other so that the adhesive reel is replaced. Mounting can be simplified. In addition, it is not necessary to replace the winding reel or to install the beginning of the new adhesive on the winding reel every time the replacement of the new adhesive reel is performed, so that the replacement time of the new adhesive reel is shortened, and the production efficiency of the electronic device is increased.

When the length of the overlapped portion is 2 to 50 times the width of the adhesive tape, when less than 2 times, sufficient connection strength is not obtained. When the length of the overlapped portion is larger than 50 times, the adhesive material used for the connecting portion is too large, Because it is wasted.

The hot pressing of the connecting portion can be reasonably used by using a heat press head of an adhesive device in which an adhesive material reel is mounted.

The adhesive material may be an anisotropic conductive adhesive material in which conductive particles are dispersed in the insulating adhesive material, may be only an insulating adhesive material, or may be one in which insulating spacer particles are dispersed in such adhesive material.

10th invention of this application is a connection method of the adhesive tape which connects the one adhesive tape wound on one reel and the other adhesive tape wound on the other reel by which the adhesive material for electrode connection was apply | coated to the base material, The ends of one adhesive tape are bent in the direction in which the adhesive faces, the other ends of the adhesive tape are bent in the direction in which the adhesive faces, and the bent portions of the adhesive tapes are overlapped with each other, and the surfaces of both adhesive materials face each other. It is characterized by heat-pressing the part.

According to the tenth invention of the present application, while exhibiting the same operation and effect as the first invention of the present application, the terminal end of one adhesive material tape and the start end of the other adhesive material tape are hooked with each other, Since both connect the adhesive material surfaces with each other, the connection strength is high.

In the ninth invention of the present application, in the ninth invention of the present application or the tenth invention of the application, an end mark is attached to an end of one adhesive tape.

According to the 11th invention of this application, while showing the same effect as the 9th invention of this application or the 10th invention of this application, the termination part of one adhesive material tape can be performed in an end mark part, Since the part can be easily understood and connected at the minimum required position, waste of the adhesive tape can be prevented. In addition, the end mark portion can be automatically detected, and the work efficiency can be increased by controlling the device or generating an alarm by the detection signal.

12th invention of this application is the invention in any one of 9th-11th of this application WHEREIN: The overlapping part of one adhesive material tape and the other adhesive material tape is matched with the one metal mold | die in which the unevenness | corrugation was formed, and this. Physics is characterized by hot pressing by inserting into the other mold.

According to the 12th invention of this application, while showing the same effect as the invention of any one of 9th-11th of this application, and forming an unevenness | corrugation in a connection part, a connection area can be enlarged and By joining the uneven portion, the connecting strength in the tensile direction (length direction) of the adhesive tape can be increased.

13th invention of this application WHEREIN: In any one of the 9th-11th invention of this application, after forming a through-hole in the overlapped part of one adhesive tape and the other adhesive tape, the overlapped part is heat-compression-bonded. Characterized in that.

According to the thirteenth invention of the present application, while exhibiting the same effect as the invention of any one of the ninth to eleven of the present application, and forming a through hole in the connecting portion, an adhesive material is exuded into the inner circumference of the through hole, Since the adhesive area by an adhesive material increases, connection strength can be raised further.

14th invention of this application is a connection method of the adhesive tape which connects the one adhesive tape wound on one reel and the other adhesive tape wound on the other reel by which the adhesive material for electrode connection was apply | coated to the silicon processing base material The two ends of the adhesive tape and the end of the other adhesive tape overlap or abut, and a portion of the two adhesive tapes covering the surface of the siliconized substrate is pasted with a silicone adhesive tape to connect both adhesive tapes. do.

In the fourteenth invention of the present application, an adhesive reel wound with one adhesive tape and a winding reel for winding only the base material of the adhesive tape are attached to the adhesive device, and the adhesive tape terminated when the adhesive tape of the adhesive reel is finished (one side) The end portion of the adhesive tape of the adhesive) and the start end of the adhesive tape (the other adhesive tape) of the newly attached adhesive reel are connected with a silicone adhesive tape, and a new adhesive reel is attached to the adhesive device instead of the finished adhesive reel.

In the present invention, since the reel is exchanged only by connecting the finished adhesive tape and the new adhesive tape, the mounting of the new adhesive reel to the adhesive device can be simplified. In addition, it is not necessary to replace the winding reel, install the beginning of the new adhesive tape on the winding reel, or fasten the adhesive tape on the guide every time the replacement of the new adhesive reel is performed, so that the replacement time of the new adhesive reel takes less time. Will increase the production efficiency.

Since the base material of the adhesive tape is surface-treated with silicone, and the adhesive tape to be used also uses a silicone adhesive, the difference in the surface tension of both is increased to increase the adhesion, so that the adhesion between the adhesive tapes, which has been difficult in the past, can be realized. .

The adhesive material of the adhesive tape may be an anisotropic conductive adhesive material in which conductive particles are dispersed in the insulating adhesive material, may be only an insulating adhesive material, or may be one in which insulating spacer particles are dispersed in these adhesive materials.

According to a fifteenth invention of the present application, the silicone adhesive tape according to the fourteenth invention of the present application has a difference of 10 mN / m (10 dyne / cm) or less between the surface tension of the adhesive surface and the surface tension of the silicone-treated substrate of the adhesive tape. It is characterized by that.

According to the fifteenth invention of the present application, the same effect as the fourteenth invention of the present application is achieved, and the difference between the surface tension of the pressure-sensitive adhesive surface in the silicone adhesive tape and the surface tension of the silicone-treated substrate in the adhesive tape By making 10 mN / m (10 dyne / cm) or less, strong adhesive force can be obtained and both can be reliably bonded. Surface tension can be measured with a wet reagent or a contact angle.

The difference in surface tension between the silicone treated base material of the adhesive tape and the adhesive face of the silicone adhesive tape is preferably 0 to 5 mN / m (5 dyne / cm). This is because the smaller the difference in surface tension is, the better the strength is over 10 mN / m (10 dyne / cm).

According to a sixteenth aspect of the present invention, in the second aspect of the present application, the silicone adhesive tape has an adhesive force of 100 g / 25 mm or more.

According to the sixteenth invention of the present application, the same effects as those of the second invention of the present application are exhibited, and in the connection of one and the other adhesive tapes, silicone adhesive tape can also be adhered to both surfaces of the adhesive materials. Therefore, adhesion | attachment with high intensity | strength can be carried out by adhering (or contact | adhering) one and the other adhesive tape from both surfaces.

In particular, by making the adhesive force 100 g / 25 mm or more, adhesion | attachment with both adhesive material surfaces of one and the other adhesive tape can be made stronger.

If the adhesive strength is large, strong adhesive strength can be obtained, but if it is smaller than 100 g / 25 mm, there is a fear that a predetermined strength cannot be obtained.

In the sixteenth invention of the present application, in the sixteenth invention of the present application, the silicone adhesive tape according to the sixteenth invention of the application overlaps or abuts the end of one adhesive tape and the start of the other adhesive tape. Then, it sticks across both surfaces of both adhesive tapes, and is characterized by the above-mentioned.

According to the seventeenth invention of the present application, the same effects as those of the sixteenth invention of the present application are exhibited, and one and the other adhesive tape are connected on both sides thereof, whereby a stronger connection can be obtained.

18th invention of this application is a connection method of the adhesive tape which connects the one adhesive tape wound on one reel and the other adhesive tape wound on the other reel by which the adhesive material for electrode connection was apply | coated to the silicon processing base material For example, between the end of one adhesive tape and the start end of the other adhesive tape, a silicone adhesive tape coated on both sides of a silicone adhesive is sandwiched between the two adhesive tapes. The difference from the surface tension is 10mN / m (10dyne / cm) or less, characterized in that the adhesive force is 100g / 25mm or more.

According to the eighteenth invention of the present application, since the double-sided pressure-sensitive adhesive silicone adhesive tape is used, the two-sided silicone pressure-sensitive adhesive tape can be sandwiched between one and the other adhesive tape, so that both can be bonded (or adhered to). Simple and easy.

19th invention of this application is a connection method of the adhesive tape which connects the one adhesive tape wound on one reel and the other adhesive tape wound on the other reel by which the adhesive material for electrode connection was apply | coated to the base material, The ends of one adhesive tape and the beginning of the other adhesive tape are overlapped or abutted, and the paste-like resin adhesive is attached to the overlapped or abutted portions to harden the paste-shaped resin adhesive to connect the two. It is characterized by.

In the nineteenth invention of the present application, the end portion of the adhesive material tape after the unwinding and the start end portion of the adhesive material tape to be newly attached are fixed by a paste-like resin adhesive, so that the connection is simple. In addition, there is no need to replace the winding tape, install the beginning of the new adhesive tape on the winding reel, or set a guide pin in a predetermined path every time the replacement of the new adhesive reel is needed, so that the replacement time of the new adhesive reel is reduced. Therefore, the production efficiency of the electronic device is increased.

Since a resin adhesive material is stuck in the overlapping part or the butt | matching part of the terminal part of one adhesive material tape, and the start end part of the other adhesive material tape, freedom of connection is high.

In a twentieth invention of the present application, in the nineteenth invention of the application, the resin adhesive is made of at least one material selected from the group of thermosetting resins, photocurable resins, and hot melt adhesives.

According to the twentieth invention of the present application, the resin has the same effect as the nineteenth invention of the present application, and is made of a resin suitable for connection of adhesive tapes among the group of thermosetting resins, photocurable resins and hot melt adhesives as resin adhesives. An adhesive material can be selected and the connection strength of adhesive tapes can be raised.

A twenty-first invention of the present application is characterized in that a charger for supplying a resin adhesive material according to the nineteenth invention of the application or the twentieth invention of the application is provided in the adhesive device to which the adhesive material tape is mounted.

According to the 21st invention of this application, since the charger which supplies the resin adhesive material of 19th invention of this application or 20th invention of this application is provided in an adhesion device, it is not necessary to prepare a battery charger separately, and is connected. Waste can be prevented.

Furthermore, in the bonding apparatus, in addition to a charger, in order to harden a thermosetting resin, you may be equipped with the ultraviolet-ray for light-irradiating a heater or photocurable resin.

Another aspect (A) of this invention is the adhesive tape reel which wound the adhesive tape in which the adhesive material for electrode connection was apply | coated to the base material on a reel, The adhesive tape reel makes a plurality of winding parts of an adhesive tape in the width direction of a tape. It is characterized by the installation.

In the invention described in the aspect A of the present invention, since a plurality of windings (winding portions) of the adhesive tape are provided, when the unwinding of the adhesive tape wrapped around one winding portion among the plurality of winding portions ends, the windings are disposed in the neighborhood of the winding portion where the winding is completed. Attach the adhesive tape of the winding of the other side to the take-up reel.

In this way, when the unwinding of one adhesive tape is completed, the other adhesive tape is attached to the take-up reel, and the adhesive tape is replaced, so that a new adhesive tape reel is not attached to the adhesive device. Therefore, the replacement work of the new adhesive tape reel takes less, and the production efficiency of the electronic device becomes high.

Since the adhesive tape wound around a plurality of windings can be used one by one, the amount of adhesive that can be used in one replacement operation can be significantly increased without increasing the number of turns of the adhesive tape per one adhesive tape. In addition, since the number of turns of the adhesive tape is not increased, it is possible to prevent the winding of the wound, and to prevent the so-called blocking of the adhesive tapes which have been wound up and leaked in the width direction of the tape and adhere to each other. Since the base material is lengthened, it is possible to prevent damage such as sagging of the base material, which is likely to occur.

Another aspect (B) of this invention WHEREIN: In the invention as described in aspect A of this invention, the connection tape which connects both is provided between the terminal part of one adhesive material tape, and the starting end part of the other adhesive material tape, When the unwinding of one adhesive tape is completed, the feeding of the other adhesive tape is started.

According to the invention described in the B aspect of the present invention, the same effect as the invention described in the A aspect of the present invention is exhibited, and the end of one adhesive tape and the start end of the other adhesive tape are connected by a connecting tape. Therefore, after the unwinding of the adhesive tape of one winding part is completed, the work of attaching the adhesive tape of the other winding part to the winding reel is unnecessary, and the production efficiency of the electronic device becomes higher.

Another aspect (C) of this invention is provided between the adhesive tape reel of the base material of B form of this invention, the winding reel of adhesive tape, and the adhesive tape reel and winding reel, An adhesive apparatus comprising a crimping part for crimping an adhesive material to a circuit board of an electronic device and a tape detecting means for detecting a connecting tape. When the tape detecting means detects the connecting tape, until the connecting tape passes through the crimping part. It is characterized by winding a connecting tape on a winding reel.

According to the invention described in the aspect C of the present invention, the connecting tape is automatically wound on the winding reel. Therefore, after the adhesive tape of one winding part is finished, the adhesive tape can be fed out from the next winding part in turn.

In addition, when the tape detecting means detects the connecting tape, the connecting tape is automatically wound on the winding reel until the connecting tape passes through the crimping portion, thereby reducing the labor of winding up.

Moreover, as a tape detection means, for example, an adhesive apparatus is provided with a pair of light emitting part and a light receiving part, and optically detects a connection tape. On the other hand, both ends of the connection tape are provided with a mark (for example, black) that gives a color, and the light receiving unit detects the marks on both ends of the connection tape by the laser light emitted from the light emitting part, thereby determining the connection tape. In addition to attaching a mark to the connecting tape, a method of making the width of the connecting tape different from the width of the adhesive tape and a method of forming a plurality of holes in the connecting tape may be used.

Another form (D) of this invention is the adhesive tape reel which connected the terminal part of one adhesive tape and the start end of the other adhesive tape using a gage | gear | pench tool, and a connection part is based on an adhesive tape. It is characterized by covering the earth.

In the invention described in the aspect D of the present invention, the end portion of the adhesive tape which has been unwound and the start end portion of the adhesive tape to be newly attached are connected by using a latching mechanism, and the adhesive tape reel is exchanged. Mounting of the adhesive tape reel can be simplified. In addition, it is not necessary to replace the winding tape, install the beginning of the new adhesive tape on the winding reel, or set the guide pin in a predetermined path every time the replacement of the new adhesive tape reel is performed. It takes less, and the production efficiency of an electronic device becomes high.

Since an adhesive tape can be used one by one, the amount of adhesive materials which can be used by one exchange operation can be significantly increased, without increasing the number of turns of the adhesive tape per one adhesive tape. In addition, since the number of turns of the adhesive tape is not increased, it is possible to prevent the dispersal of the wound and to prevent the so-called blocking of the adhesive tapes soaking in the width direction of the tape and adhering the adhesive tapes together. By increasing the length, it is possible to prevent damage such as sagging of the substrate which is likely to occur.

In addition, since the connecting portion between the end of one adhesive tape and the starting end of the other adhesive tape covers the locking strip with the adhesive tape, the appearance of the connecting strip is in contact with the adhesive tape. The adhesive tape can be prevented from being damaged or components such as the heating press head and the support of the adhesive apparatus are not damaged by the latch.

Further, as a method of covering the gage strip with the adhesive tape, after connecting the end portion of one adhesive tape and the start end portion of the other adhesive tape at the gage strip, the connection portion is returned by 180 degrees in the longitudinal direction of the tape. It is preferable to cover the earth with adhesive tape.

In addition, the connecting portion may be wound with another adhesive tape so as to cover the locking portion.

Another aspect (E) of this invention is provided between the adhesive tape reel of the D form of this invention, the winding reel of an adhesive tape, and the adhesive tape reel and winding reel, and the adhesive material of an adhesive tape by a heating press head. A bonding apparatus comprising a crimping part for crimping a circuit board of an electronic device and a connecting part detecting means for detecting a connecting part of a tape. When the connecting part detecting means detects the connecting part of a tape, the connecting part passes through the crimping part. It is characterized by winding the adhesive tape on one side until the winding reel.

According to the invention described in E aspect of the present invention, when the connecting portion detecting means detects the connecting portion, one adhesive tape is wound around the winding reel until the connecting portion passes the crimping portion, so that the connecting portion reaches the crimping portion, The defect that a crimping operation is performed can be prevented. Moreover, since one adhesive tape is automatically wound up to a winding reel until a connection part passes a crimping | compression-bonding part, the labor of winding can be saved.

According to another aspect (F) of the present invention, in the invention described in the E aspect of the present invention, the connecting portion detecting means is any one of a CCD camera, a thickness detecting sensor, and a transmittance detecting sensor.

According to the invention described in the F form of the present invention, the same effects as those of the invention described in the E form of the present invention can be exhibited, and the connection portion can be detected with a simple configuration. Moreover, the detection accuracy can be improved by using these means. Can be.

For example, when a CCD camera is used as the connection part detecting means, the connection part is detected by taking the surface of the connection part into the monitor screen and comparing the shades of pixels. In addition, when the thickness detection sensor is used, since the thickness of a connection part is larger than the thickness of an adhesive tape, the connection part is detected by comparing the change of thickness. In addition, when the transmittance sensor is used, the connection portion has a thicker thickness, and since there is a locking region, the transmittance is lowered, and the connection portion is detected by comparing the values of the transmittance.

In the method for connecting the adhesive tape according to the twenty-eighth invention of the present application, the terminal end of one adhesive tape and the start end of the other adhesive tape are connected by using the gage stop, and the connection part covers the gage strip with the adhesive tape. It features.

In the twenty-eighth invention of the present application, the end portion of the adhesive tape after the unwinding and the start end portion of the adhesive tape to be newly attached are connected by using the gage locator, and the adhesive tape reel is replaced, thereby providing a new adhesive tape to the bonding apparatus. I can simplify wearing of the reel. In addition, it is not necessary to replace the winding tape, install the beginning of the new adhesive tape on the winding reel, or set the guide pin in a predetermined path every time the replacement of the new adhesive tape reel is performed. It takes less, and the production efficiency of an electronic device becomes high.

Since an adhesive tape can be used one by one, the amount of adhesive materials which can be used by one exchange operation can be significantly increased, without increasing the number of turns of the adhesive tape per one adhesive tape. In addition, since the number of turns of the adhesive tape is not increased, it is possible to prevent the winding of the wound and to prevent the so-called blocking of the adhesive tape that has leaked out in the width direction of the tape and to which the wound adhesive tapes adhere to each other. By increasing the length of the substrate, it is possible to prevent damage such as sagging of the substrate which is likely to occur.

In addition, since the connecting portion between the end of one adhesive tape and the starting end of the other adhesive tape covers the locking zone with the adhesive tape, the appearance of the connecting zone is in contact with the adhesive tape. It is possible to prevent the adhesive tape from being damaged or to damage the components such as the heating press head and the support of the bonding apparatus with the latch.

Further, as a method of covering the gage strip with the adhesive tape, after connecting the end portion of one adhesive tape and the start end portion of the other adhesive tape to the gage strip, the connecting portion is returned by 180 degrees in the longitudinal direction of the tape. It is preferable to cover the earth with adhesive tape.

In addition, the connecting portion may be wound with another adhesive tape so as to cover the locking portion.

29th invention of this application is an adhesive material tape apply | coated to a base material and wound in the reel shape, The adhesive material is arrange | positioned in the longitudinal direction of a tape in the base material, It is characterized by the above-mentioned.

In the twenty-ninth invention of the present application, in the use of the adhesive tape, a reel and an empty reel wound with the adhesive tape are attached to the bonding apparatus, and the substrate is mounted to be wound around the empty reel after the adhesive is heated and pressurized onto the circuit board.

When heat-pressurizing the adhesive material to the circuit board, one set of a plurality of sets of adhesive materials provided in the width direction of the substrate is pressed against the circuit board, and the remaining adhesive group after the pressing is wound on an empty reel together with the substrate. And after dispensing of an adhesive tape from a reel is complete | finished, the rotation direction of a reel is reversed and the supply direction of an adhesive tape is reversed. Thus, after using an adhesive material for every pair, the remaining adhesive material and a base material are wound up, and the remaining adhesive material tank is used sequentially. Therefore, since a plurality of sets of adhesive materials can be used one by one, the amount of adhesives usable in one reel can be increased significantly (two times or more) without increasing the number of turns of the tape.

According to the present invention, the amount of the adhesive material to be used can be significantly increased without increasing the number of turns of the adhesive tape. Moreover, since the number of turns of the adhesive tape is not increased, it is possible to prevent the distraction of the wound and to prevent the blocking of the adhesive tape soaking in the width direction of the tape and bonding between the tapes. The elongation of the base material can prevent the damage (damage or cutting of the base material), such as sagging of the base material.

In the manufacturing plant of the electronic component, the number of replacements of the new adhesive tape is reduced, thereby increasing the manufacturing efficiency.

Moreover, in manufacture of an adhesive tape, since the amount of adhesive materials per reel can be increased, the usage-amount of a reel material and a moisture prevention material can be reduced, and a manufacturing cost can be reduced.

In addition, since after pressing the first set of adhesive materials is finished, the next set of adhesive materials is used after the adhesive tape is wound on an empty reel, so that the two reels attached to the adhesive apparatus may be replaced without inverting the rotation direction.

The adhesive material may be an anisotropic conductive adhesive material in which conductive particles are dispersed in the insulating adhesive material, may be only an insulating adhesive material, or may be one in which insulating spacer particles are dispersed in such adhesive material.

The width of the substrate is preferably 5 mm to 1000 mm, but is arbitrarily selected by the width of a set of adhesive materials or the number of adhesive materials. As for the width | variety of one set of an adhesive material, 0.5 mm-10.0 mm are preferable.

If the width of the base material is less than 5mm, the width of the base material is less than 5mm, and the width of the adhesive material or adhesive material provided on the base material is limited. Because there is a fear.

30th invention of this application is the 29th invention of this application WHEREIN: It is characterized by the adhesive agent group which mutually adjoins mutually space | interval of a plurality of sets.

According to the thirtieth invention of the present application, the same effects as those of the twenty-ninth invention of the present application are exhibited, and adjacent adhesive material vests are separated, so that the adhesive material can be easily pressed one by one.

31st invention of this application is 29th invention of this application WHEREIN: An adhesive material is isolate | separated into multiple sets by the slit formed in the longitudinal direction of a tape.

According to the thirty-first invention of the present application, the same effect as that of the twenty-ninth invention of the present application is achieved, and an adhesive is applied to the entire surface of one side of the substrate, and immediately before the adhesive is pressed onto the circuit board, that is, the adhesive tape. It is preferable to form a slit by engraving cutting gold into the adhesive with a cutting knife or the like immediately before use.

In addition, the slits may form a slit by engraving cutting gold into the adhesive with a cutting knife or the like during the production of the adhesive tape.

The slit may be formed by a laser, a heating wire, or the like in addition to the cutting knife.

According to the present invention, it is possible to increase the number of groups of the adhesive member arranged on the substrate.

32nd invention of this application is a manufacturing method of the adhesive material tape apply | coated to a base material, and wound in the reel form, and supplies an adhesive material to the base material continuously conveyed from the applicator arrange | positioned at intervals in the width direction of a base material. Thus, a plurality of sets of adhesive materials are applied to the substrate.

According to the 32nd invention of this application, the adhesive tape of the 30th invention of this application can be manufactured using existing equipment.

The applicator may be a roll provided in plural in the width direction of the substrate, or may be a nozzle.

33rd invention of this application is a manufacturing method of the adhesive tape apply | coated to a base material and wound in the reel shape, after apply | coating an adhesive material to the single side whole surface of one base material, and after forming a slit of the longitudinal direction in the adhesive material, Place the other substrate on the adhesive material surface, sandwich the adhesive between one and the other substrate, and then separate one substrate and the other substrate from each other and apply a plurality of sets of adhesive materials to each of the one and the other substrates. It adhere | attaches alternately and manufactures what arrange | positioned several sets of adhesive materials at intervals on one and the other base material, It is characterized by the above-mentioned.

According to the thirty-third invention of the present application, since two adhesive tapes described in the second invention of the present application can be produced at the same time, the production efficiency is excellent.

34th invention of this application is a crimping method of the adhesive material which crimps | bonds an adhesive material to a circuit board using the adhesive tape apply | coated to a base material, and wound up in a reel shape, The base material is apply | coated an adhesive material to the whole surface of one side, and an adhesive tape By pressing a portion of the adhesive material in the width direction of the substrate in the lateral direction along the longitudinal direction of the tape from the substrate side to press the circuit board while reducing the cohesion force of the adhesive material in the heated portion, The adhesive material is wound in a reel form together with the substrate, and the remaining adhesive material is heated and pressurized onto the circuit board by using the adhesive tape wound in the reel form again.

According to the thirty-fourth invention of the present application, if the cohesive force of the portion decreases by heating a portion of the adhesive material (hereinafter referred to as the "cohesive force lowering line"), the adhesive material of the portion heated from the cohesive force lowering line is pressed onto the circuit board. And is separated from the substrate. The remaining adhesive remains on the substrate and is wound on an empty reel with the substrate.

According to the present invention, since only the width of the adhesive tape is wider than before, the adhesive tape can be manufactured using the existing equipment as it is.

Further, the width of the adhesive material pressed against the circuit board can be arbitrarily set by changing the heating region, and the degree of freedom of the adhesive material width to be pressed is high.

In addition, as described in the twenty-ninth invention of the present application, after the feeding of the adhesive tape to the empty reel is finished, the reel rotation direction is reversed to reverse the supply direction of the tape, or the reel rotation direction remains the same. Replace it. Thereby, since it can heat and press 1 trillion steps sequentially from the adhesive material on a base material, and can crimp | bond a circuit board, the quantity of adhesive materials which can be used by 1 reel can be greatly increased, without increasing the number of turns of a tape.

In addition, as in the twenty-ninth invention of the present application, the amount of adhesive material can be increased without increasing the number of turns, and thus it is possible to prevent disturbance of the wound, and to prevent blocking due to the exudation of the adhesive material and to sag the substrate. The effect of being able to prevent the damage by this etc. can be acquired.

The tape width is preferably 5 mm to 1000 mm, and the adhesive material pressed against the circuit board is preferably 0.5 mm to 1.5 mm. The tape width of 5 mm to 1000 mm is less when the tape width is less than 5 mm, since the number of times of crimping of the adhesive material per one reel is reduced, and when the tape width is larger than 1000 mm, the tape may not be attached to the existing adhesive device. to be.

The adhesive material may be an anisotropic conductive adhesive material in which conductive particles are dispersed in the insulating adhesive material, may be only an insulating adhesive material, or may be one in which insulating spacer particles are dispersed in these adhesive materials.

35th invention of this application is the adhesive tape apply | coated to the base material and wound in the reel shape, The width | variety of an adhesive tape is equal to or more than the length of one side of a circuit board, and the adhesive material is arrange | positioned in multiple numbers in the width direction of a tape. It is characterized by.

In the thirty-fifth aspect of the present application, the adhesive tape is disposed so that its width overlaps one side of the circuit board, and a pair of adhesive materials provided in the width direction of the adhesive tape is heated and pressurized along one side of the circuit board as it is.

Since the width of the adhesive tape is equal to or greater than the length of one side of the circuit board, the adhesive tape may be drawn out by the width of the adhesive material.

Then, after the adhesive is pressed onto one side of the circuit board, the circuit board is turned, and the other side is positioned in the width direction of the adhesive tape to heat and press the adhesive bath to the other side. In this manner, when the adhesive material is sequentially pressed to the other side of the circuit board, the adhesive material can be easily pressed onto the four circumferences of the circuit board.

Therefore, since the adhesive material having the length of one side of a circuit board is used one by one, since the amount of one use is only the width dimension of the adhesive material tank, the amount of adhesive material which can be used by one reel can be greatly increased, without increasing the number of turns of an adhesive tape. Can be.

Moreover, since the number of turns of the adhesive tape is not increased, it is possible to prevent the distraction of the wound and to prevent the blocking of the adhesive tape soaking in the width direction of the tape and bonding between the tapes. By increasing the length, it is possible to prevent damages such as sagging of the base material (damage or cutting of the base material), which are likely to occur.

On the other hand, in the manufacturing plant of an electronic component, since the replacement | exchange frequency of a new adhesive tape is small, manufacturing efficiency becomes high.

Moreover, in manufacture of an adhesive tape, since the amount of adhesive materials per reel can be increased, the usage-amount of a reel material and a damp prevention material can be reduced, and manufacturing cost can be reduced.

The adhesive material may be an anisotropic conductive adhesive material in which conductive particles are dispersed in an insulating adhesive material, may be only an insulating adhesive material, or may be one in which insulating spacer particles are dispersed in such adhesive material.

Since the width | variety of an adhesive tape has more than the dimension of one side of a circuit board, it is 5 mm-3000 mm, for example. Moreover, even if it is an adhesive tape which does not have the dimension of one side of a circuit board, it is good to have a dimension of one side of a circuit board by arrange | positioning plural sets and adjoining in the width direction of an adhesive tape. In this case, production efficiency can be improved because it can be easily adapted to circuit boards of other dimensions. The width of one set of the adhesive is, for example, 0.5 mm to 10.0 mm.

The width of the adhesive tape is 5 mm to 3000 mm because the dimension of one side of the circuit board is less than 5 mm. When the thickness of the adhesive tape is larger than 3000 mm, the reel width becomes too wide, and the existing adhesive device cannot be mounted. Because there is concern.

In the thirty-sixth aspect of the present application, in the thirty-fifth aspect of the present application, in the plurality of sets of adhesive materials, adjacent groups of adhesive materials are spaced apart from each other.

According to the thirty sixth invention of the present application, the same effects as those of the thirty-fifth invention of the present application are exhibited, and adjacent adhesive material vests are separated, so that the adhesive material can be easily removed from the substrate one by one and pressed.

According to a thirty seventh aspect of the present application, in the thirty fifth aspect of the present application, the adhesive material is separated into a plurality of sets by slits formed in the width direction of the tape.

According to the thirty-seventh invention of the present application, while exhibiting the same effect as the thirty-fifth invention of the present application, the adhesive tape is coated with an adhesive on the entire surface of one side of the substrate and dried, and immediately before the adhesive is pressed onto the circuit board. That is, it is preferable to form a slit by injecting cutting gold into the adhesive with a cutting knife or the like immediately before using the adhesive tape.

In addition, in the manufacture of an adhesive tape, the slit may be formed by inserting cutting gold into the adhesive with a cutting knife or the like to form the slit, or may be formed by a laser, a heating wire, or the like in addition to the cutting knife.

According to the present invention, it is possible to increase the number of groups of the adhesive member arranged on the substrate, and at the same time, it is easy to manufacture the adhesive tape in which a plurality of adhesive members are arranged in the width direction of the tape.

38th invention of this application is a manufacturing method of the adhesive tape which apply | coated the adhesive material to the base material, wound in the reel shape, apply | coated the adhesive material to the whole surface of one base material, and then formed the slit along the width direction of the tape to the adhesive material. Then, the other substrate is placed on the adhesive material surface, an adhesive is sandwiched between one and the other substrate, and then one substrate and the other substrate are separated from each other, and a plurality of sets of each of the one and the other substrates are provided. By sticking an adhesive material alternately, the thing which arrange | positioned several sets of adhesive materials at intervals on one side and the other base material is produced, It is characterized by the above-mentioned.

According to 38th invention of this application, since the adhesive tape of 2nd invention of this application can be manufactured simultaneously using existing equipment, it is excellent in manufacturing efficiency.

The 39th invention of this application arrange | positions the adhesive material tape in any one of 35th-37th invention of this application on a circuit board, and heat-presses an adhesive tape along the width direction of 1st of a circuit board. It is the crimping method of the adhesive tape characterized by crimping | bonding an adhesive material tank to a side. In this crimping method, the adhesive tape is placed on the circuit board, and the adhesive tape is pressed on one side of the circuit board by heating and pressing the adhesive tape along the width direction, and then the position of the circuit board is changed to change the position of the circuit board. The next group of adhesives may be pressed on the other side of the circuit board by heating and pressing the adhesive tape on the side along the width direction thereof.

According to the thirty-ninth invention of the present application, the effect described in any one of the thirty-fifth to thirty-seventh inventions of the present application can be obtained, and one side of the circuit board is attached to the adhesive material after the adhesive tape is attached to the adhesive device. The adhesive material is pressed onto one side of the circuit board by arranging it in the width direction of the tape. Then, the circuit board is rotated about 90 degrees, for example, so that the other side of the circuit board is positioned parallel to the width direction of the adhesive tape. The adhesive is pressed onto the sides. As described above, by pressing the circuit board by turning the circuit board by 90 degrees in order, the adhesive material can be simply pressed onto the four circumferences of the circuit board, and the work efficiency of the electronic component manufacturing plant can be improved.

40th invention of this application arrange | positions at least 2 adhesive tapes in any one of 35th-37th invention of this application in the conveyance path which moves a circuit board, and one adhesive tape has the width direction. It arrange | positions in the direction orthogonal to a conveyance path, and the other adhesive tape arranges the width direction in the direction along a conveyance path, and in one adhesive tape, the adhesive tape in a width direction with respect to the two opposite sides of a circuit board. The pressure-sensitive adhesive bath is pressed on two opposing sides of the circuit board by heating and pressing along with each other. Then, the circuit board is moved to the other adhesive tape, and the adhesive tape is removed from the substrate side with respect to the remaining two sides of the circuit board. It is characterized by pressing the adhesive material bath on the four circumferences of the circuit board by heating and pressing in the width direction.

According to the forty-fifth invention of the application, the effect of the thirty-fifth invention to the thirty-seventh invention can be obtained, and the adhesive tape of one adhesive tape and the other adhesive tape are rotated without rotating the circuit board. By moving to a position and heat-pressing in the width direction at each position, an adhesive material can be easily crimped | bonded to the perimeter of a circuit board, and work efficiency is good.

According to a forty-first aspect of the present application, the adhesive material is applied onto the entire surface of one side of the substrate, and the adhesive tape is pressed onto the circuit board by using an adhesive tape wound in a reel shape, wherein the width of the adhesive tape is one side of the circuit board. The adhesive material is pressed onto the circuit board while having a length or more and lowering the cohesive force of the adhesive material in the heated portion by heating and pressing a part of the adhesive material in the width direction of the adhesive tape in the width direction.

According to the forty-first aspect of the present application, in the case of pressing the adhesive material around the circuit board, the adhesive force is attached to the adhesive device, and the pressure of the adhesive tape is heated and pressurized along the width direction, whereby the cohesive force of the portion is lowered. (Hereinafter referred to as "coagulation lowering line"), the adhesive material of the portion heated from the cohesive force lowering line is separated from the substrate and pressed to the circuit board. Next, the circuit board is rotated about 90 degrees, the neighboring side is positioned in the width direction of the adhesive tape, the next adhesive bath is heated and pressed along the width direction, and the adhesive is pressed onto the neighboring side. In this way, an adhesive can be crimped | bonded to the four sides of a sequential circuit board, and work efficiency is good.

In addition, since the adhesive tape may be applied to the entire surface of the adhesive tape, the adhesive tape may be manufactured using the existing equipment as it is.

Furthermore, the width of the adhesive material pressed onto the circuit board can be arbitrarily set by changing the heating press area, and the degree of freedom of the adhesive material width to be pressed is high.

In addition, as in the thirty-fifth invention of the present application, the amount of the adhesive material can be increased without increasing the number of turns, and thus it is possible to prevent the disturbance of the wound and prevent the blocking due to the exudation of the adhesive material, and the base material to sag. The effect of being able to prevent the damage by this etc. can be acquired.

Another aspect (G) of the present invention includes one reel, the other reel, and a case for storing the reels while keeping the reels freely rotated, and one reel is wound with an adhesive tape coated with an adhesive on a substrate. One end of the adhesive tape is fixed to the other reel, and at least two sets of adhesive materials are disposed on the adhesive tape along the longitudinal direction of the tape.

In the invention described in the aspect G of the present invention, the adhesive tape cassette is attached to the bonding apparatus, and a pair of adhesive materials formed along the longitudinal direction in at least two sets in the width direction of the adhesive tape is disposed so as to overlap one side of the circuit board, It heat-presses from a base material side, and a set of adhesive material is crimped | bonded to a circuit board. In this way, the adhesive material is sequentially pressed onto the circuit board, the adhesive tape is sequentially drawn from one reel, and the other adhesive reel is coated with the remaining adhesive tape on the other reel. Then, when the adhesive tape wound on one reel is finished, the cassette is turned over and reattached to the pressing device.

Thereby, since one reel and the other reel are replaced, this time, an adhesive tape is pulled out from the other reel and the other 1 set of adhesive materials is crimped | bonded.

When two or more sets of adhesive materials are formed in an adhesive tape, you may crimp | compress in order or space | interval by changing the position of the width direction.

As described above, in the present invention, at least two pairs of adhesive materials are arranged side by side in the width direction and used one by one, so that at least one reel can be used for at least one reel, and without increasing the number of turns of the adhesive tape, The amount of adhesive available for one reel can be increased more than twice.

In addition, since the number of turns of the adhesive tape is not increased, it is possible to prevent the distraction of the wound and to prevent the blocking of the adhesive tape soaking in the width direction of the tape and bonding of the tapes to each other. As the base material lengthens, it is possible to prevent damage such as sagging of the base material (damage or cutting of the base material), which is likely to occur.

On the other hand, when the adhesive material is formed in two sets, when the use of one reel (one set of adhesive materials) is finished in the electronic component manufacturing plant, the next mounting is easy by simply flipping the cassette.

In addition, since the adhesive tape is used as the cassette, the adhesive device does not take much time to install the adhesive tape on the reel, and only the cassette is attached to the adhesive device so that the handling is easy and the workability of installation and replacement is good. .

The adhesive material may be an anisotropic conductive adhesive material in which conductive particles are dispersed in an insulating adhesive material, may be only an insulating adhesive material, or may be one in which insulating spacer particles are dispersed in these adhesive materials.

Another aspect (H) of this invention WHEREIN: In the invention as described in G form of this invention, as for several sets of adhesive materials, adjacent adhesive material groups mutually space | interval, It is characterized by the above-mentioned.

According to the invention described in the H aspect of the present invention, the same effect as the invention described in the G aspect of the present invention is exhibited, and neighboring adhesive material vests are separated, so that the adhesive material can be easily removed from the substrate one by one and pressed. have.

According to another aspect (I) of the present invention, in the invention described in the G aspect of the present invention, the adhesive material is separated into a plurality of sets by slits formed in the width direction of the tape.

According to the invention described in the aspect I of the present invention, the adhesive tape exhibits the same effect as that of the form G, and at the same time, the adhesive tape is coated with the adhesive on the entire surface of one side of the substrate and dried immediately before the adhesive is pressed onto the circuit board. In other words, it is preferable to form a slit by severing the cutting gold into the adhesive with a cutting knife or the like immediately before using the adhesive tape.

Further, the slit may be formed by inserting the cutting gold into the adhesive material with a cutting knife or the like at the time of manufacturing the adhesive tape, or may be formed by a laser, a heating wire, or the like in addition to the cutting knife.

45th invention of this application is equipped with one reel, the other reel, and the case which accommodates these reels while rotating freely, The one reel wound the adhesive tape in which the adhesive material was apply | coated to the base material, and the other By attaching an adhesive tape cassette having one end of the adhesive tape fixed to the crimping device on the side reel, taking the adhesive tape out of the adhesive tape cassette onto the circuit board, and heating part of the width direction of the adhesive tape by heating and pressing. It is characterized in that the cohesive force of the adhesive material in the heated portion is lowered to compress a part of the adhesive material in the width direction onto the circuit board.

According to the forty-fifth invention of this application, by heat-pressing a part of the width direction in an adhesive tape, the cohesion force of the adhesive material of that part falls (henceforth a "coagulation force fall line"), and it heats from a cohesion force fall line. One part of the adhesive material is separated from the substrate and pressed onto the circuit board.

In the present invention, the adhesive tape can be applied to the entire surface of the substrate, so that the adhesive tape can be produced using the existing equipment as it is.

Furthermore, the width of the adhesive material pressed onto the circuit board can be arbitrarily set by changing the heating press area, and the degree of freedom of the adhesive material width to be pressed is high.

The 46th invention of this application is equipped with one reel, the other reel, and the case which accommodates these reels while rotating freely, The one reel wound the adhesive tape in which the adhesive material was apply | coated to the base material, and the other By attaching an adhesive tape cassette having one end of the adhesive tape fixed to the crimping device on the side reel, drawing the adhesive tape from the adhesive tape cassette onto the circuit board, and heating and pressing a part of the width direction of the adhesive tape by heating. After reducing the cohesive force of the adhesive material in the heated portion, the adhesive part in the width direction is pressed onto the circuit board, and after the adhesive tape wound on one reel is finished, the adhesive tape cassette is turned over, and the adhesive material in the remaining part is pressed onto the circuit board. It is a pressing method of the adhesive material using the adhesive tape cassette characterized by the above-mentioned.

According to the forty-sixth invention of the present application, the same effect as the forty-fifth invention of the present application is exhibited, and upon completion of the adhesive tape wound on one reel, the cassette is turned over, and the adhesive material of the remaining portion is mounted again. Since it is crimped | bonded to a circuit board, like the 1st invention of this application, the amount of adhesive materials can be increased without increasing the number of turns, and it is possible to prevent the disturbance of the winding and to prevent blocking by the exudation of the adhesive materials. The effect of being able to prevent the damage by sagging of a base material, etc. can be acquired. In addition, when the use of one reel (one trillion adhesives) is finished in the manufacturing plant of the electronic component, the cassette is simply turned over, so that the following mounting is easy. By using a cassette, handling is easy, and workability of installation and replacement is good.

Another aspect (J) of this invention is an adhesive tape apply | coated to a base material and wound in the reel shape, The base material is equipped with the heat-melting layer and the support layer, It is characterized by the above-mentioned.

In the invention described in the aspect J of the present invention, in the use of the adhesive tape, the reel and the empty reel wound with the adhesive tape are attached to the bonding apparatus, and the substrate is wound to reel to the empty reel after heat-pressurizing the adhesive to the circuit board. do. Then, the ends of one adhesive tape wound on one reel after the unwinding and the other ends of the adhesive tape wrapped on the other reel are overlapped or abutted, and these parts are heated to melt the hot melt layer. After making it melt | dissolve, the heat melter solidifies by cooling, and adhesive tapes are connected.

By using the base material of the adhesive tape, the end portion of the unbonded adhesive tape and the beginning end portion of the newly attached adhesive tape are adhered to each other to replace the adhesive reel, thereby simplifying the installation of a new adhesive reel to the adhesive device. Can be. In addition, it is not necessary to replace the winding reel or install the new adhesive material at the winding reel or wind around the guide pin every time the new adhesive material reel is replaced. As a result, production efficiency of electronic devices is increased.

The heat-pressing of the connection portion can be reasonably used by using a heat press head of an adhesive device in which an adhesive material reel is mounted.

Another aspect (K) of this invention WHEREIN: In the invention as described in J aspect of this invention, the support layer is sandwiched by the heat melter layer, It is characterized by the above-mentioned.

According to the invention described in the K aspect of the present invention, the same effect as that of the invention described in the J aspect of the present invention is exhibited, and the heat flux layer is started on the heat melt layer of the terminal portion of one adhesive tape on the surface of the substrate. Negative adhesive material surfaces are superimposed, these parts can be heated and pressed, and both can be connected, and connection is easy. In addition, since the hot melt layer is formed over the entire length direction of the tape, it is not necessary to precisely position the overlapped length, and the degree of freedom of connection is high.

Another aspect (L) of this invention WHEREIN: In the invention as described in J aspect of this invention, the heat-melting agent layer is pinched by the support layer, It is characterized by the above-mentioned.

According to the invention described in the L aspect of the present invention, the same effects as those of the invention described in the J aspect of the present invention are exhibited, and at the same time, the ends of one adhesive tape and the other adhesive tape are used to connect the adhesive tapes. In a position opposite the start end, it is heated by a heating pressurized head of the bonding apparatus. When heated, the melting agent melts and starts to bleed out, and the adhesive tapes are connected by solidifying the melting agent by cooling. In this case, since the hot melt layer is sandwiched between the support layers, the melt layer is exposed to the outside air, and the adhesive strength of the hot melt layer due to moisture absorption and adhesion of dust or the like can be prevented from being lowered.

50th invention of this application is a connection method of the adhesive tape which connects the one adhesive tape wound on one reel, and the other adhesive tape wound on the other reel, The adhesive tape is a base material and adhesive material surface-treated with the mold release agent. And a release agent at the end of the substrate of one of the adhesive tapes, and the adhesive material surface of the other adhesive tape is superimposed on the portion thereof, and the overlapped portions of the adhesive tape are heated and pressed to be connected.

In the 50th invention of this application, the adhesive material tape which overlaps the base material surface of one adhesive material tape, and the adhesive material surface of the other adhesive material tape, heat-presses an overlapping part, and mounts newly with the terminal part of the adhesive tape in which unwinding was completed. Since the start end of is connected and the adhesive reel is replaced, the mounting of a new adhesive reel to the adhesive device can be simplified.

It is not necessary to replace the winding reel, install the beginning of the new adhesive tape on the winding reel, set the guide pin in the predetermined path, and replace the new adhesive reel each time. The production efficiency of electronic equipment becomes high.

In addition, in the state which wound the adhesive tape on the reel on the surface of a base material, the release agent is provided in the surface of a base material so that an adhesive material surface and a base material surface may not adhere | attach. In this invention, since the mold release agent of one adhesive material tape is removed and the adhesive material surface of the other adhesive tape is superimposed on the part, it is easy to connect adhesive tapes.

The heat bonding of the connecting portion can be reasonably used by using the heat press head of the bonding apparatus in which the bonding material reel is attached.

In a fifty-ninth invention of the application, in the fifty invention of the application, the release agent is removed by any one of plasma discharge, ultraviolet irradiation, and laser irradiation.

According to the fifty-ninth invention of the present application, the same effect as that of the fifty-fifth invention of the present application is exhibited, and the release agent is removed using any one method of plasma discharge, ultraviolet irradiation, and laser irradiation. The release agent can be removed precisely and in a short time as compared to the case.

When plasma discharge is used as the method for removing the release agent, the release agent is removed by discharging the gas in the plasma state to make it easy to react (excitation state) and discharging the surface of the substrate. In the case of ultraviolet irradiation, for example, a mercury lamp is used as a light source and irradiated with ultraviolet light for a predetermined time from the mercury lamp. Moreover, in the case of laser irradiation, a mold release agent is heated and melt | dissolved by the laser beam irradiated by the laser oscillator, and a mold release agent is removed.

Another aspect (M) of this invention is the adhesive tape reel which wound the adhesive tape to the reel by which the adhesive material for electrode connection was apply | coated to the base material, The adhesive tape reel provided that the multiple winding part of the adhesive tape was provided in the width direction of the tape. It features.

In the invention described in the M form of the present invention, since a plurality of windings (winding portions) of the adhesive tape are provided, when the unwinding of the adhesive tape wound around one winding portion among the plurality of winding portions is completed, the winding portion is disposed in the neighborhood of the winding portion where the winding is completed. Attach the adhesive tape of the winding of the other side to the take-up reel.

In this way, when the unwinding of one adhesive tape is completed, the other adhesive tape is attached to the take-up reel, and the adhesive tape is exchanged. Therefore, the attachment of the new adhesive tape reel to the bonding apparatus is unnecessary. Therefore, the replacement work of the new adhesive tape reel takes less, and the production efficiency of the electronic device is increased.

Since the adhesive tape wound around a plurality of windings can be used in sequence, the amount of adhesive that can be used in one replacement operation can be significantly increased without increasing the number of turns of the adhesive tape per one adhesive tape. In addition, since the number of turns of the adhesive tape is not increased, it is possible to prevent the distraction of the wound and to prevent the so-called blocking of the adhesive tape that has leaked out in the width direction of the tape and to which the adhesive tapes adhere to each other. By increasing the length of the substrate, it is possible to prevent damage such as sagging of the substrate which is likely to occur.

Another aspect (N) of this invention WHEREIN: In the invention as described in M form of this invention, the connection tape which connects both is provided between the terminal part of one adhesive material tape, and the starting end part of the other adhesive material tape, When the unwinding of one adhesive tape is completed, the feeding of the other adhesive tape is started.

According to the invention described in the N aspect of the present invention, the same effects as those of the invention described in the M aspect of the present invention are exhibited, and the end of one adhesive tape and the start end of the other adhesive tape are connected by a connecting tape. Therefore, after the unwinding of the adhesive tape of one winding part is completed, the work of attaching the adhesive tape of the other winding part to the winding reel is unnecessary, and the production efficiency of the electronic device becomes higher.

Another aspect (O) of this invention is provided between the adhesive tape reel of the N-type base material of this invention, the winding reel of an adhesive tape, and an adhesive tape reel and a winding reel, and is an adhesive tape with a heating press head. Adhesive device comprising a crimping part for crimping an adhesive material on a circuit board of an electronic device and a tape detecting means for detecting a connecting tape, and when the tape detecting means detects the connecting tape, until the connecting tape passes the crimping part. It is characterized by winding a connecting tape on a winding reel.

According to the invention described in the O aspect of the present invention, the connecting tape is automatically wound on a winding reel. Therefore, after the adhesive tape in one winding portion is finished, the adhesive tape can be fed sequentially from the next winding portion.

In addition, when the tape detecting means detects the connecting tape, the connecting tape is automatically wound on the winding reel until the connecting tape passes through the crimping portion, thereby saving time for winding up.

Further, as the tape detecting means, for example, the bonding apparatus is provided with a pair of light emitting portions and a light receiving portion to optically detect the connecting tape. On the other hand, both ends of the connection tape are provided with marks (for example, black) that give color, and the light receiving unit detects the marks at both ends of the connection tape by the laser light emitted from the light emitting part, thereby determining the connection tape. In addition to attaching a mark to the connecting tape, a method of making the width of the connecting tape different from the width of the adhesive tape and a method of forming a plurality of holes in the connecting tape may be used.

Another aspect (T) of the present invention is a gear unit for interlocking rotation of one reel, the other reel, one reel and the other reel, a case accommodating these, and a case disposed in the opening of the case. An adhesive device having a heating member and a power supply means for supplying electric power to the heating member, wherein one reel is wound with an adhesive tape coated with a base material, and the other reel is fixed with one end of the adhesive tape. The member includes a heat transfer member that generates heat by the supplied electric power, draws out the adhesive tape wound on one reel to the opening of the case, and heats and presses the adhesive tape in the opening from the substrate side with the heating member. It is crimped | bonded to a board | substrate, and the base material from which the adhesive material was peeled off is wound up by the other reel, It is characterized by the above-mentioned.

In the invention described in the T aspect of the present invention, when the adhesive material is pressed onto the circuit board, the adhesive tape provided on the opening side is held by holding the case in one hand and pressing the opening exposed by the adhesive tape onto the circuit board. The heating member is pressed against the circuit board by pressing the adhesive tape in the opening. When the adhesive is advanced while pressing the adhesive tape positioned under the heating member, the adhesive tape is taken out from one reel, and the reel rotates when the adhesive tape is taken out from the reel, so that it is fixed to the coaxial of one reel. The gear rotates, and the gear of the other reel engaged with it rotates and winds around the base material on which the adhesive material is peeled off on the other reel.

The electric power may be supplied to the heating member by a switch provided in the case, or a pressure reducing switch may be provided on the heating member, and when the heating member is pressed, it may be sensed to supply power to the heating member.

The adhesive material may be anisotropic conductive adhesive in which conductive particles are dispersed in the insulating adhesive material, may be only an insulating adhesive material, or may be one in which insulating spacer particles are dispersed in these adhesive materials.

60th invention of this application is an adhesive tape apply | coated to the base material, The base material characterized by consisting of a metal film or an aromatic polyamide film.

In the 60th invention of this application, when the base material of an adhesive tape is made into a metal film (or metal foil) or an aromatic polyamide film, even if the thickness of a base material is made thin, the base material can be prevented from being stretched or cut | disconnected. have.

Therefore, by using the adhesive tape made of a thin base material, the number of turns per one reel can be increased, and the amount of adhesive material usable in one reel can be increased. In addition, when the adhesive tape of the present invention is used, the number of turns per reel is large, so that the number of replacements of the new adhesive tape decreases in the manufacturing plant of the electronic component, thereby increasing the work efficiency. In addition, in the manufacture of the adhesive tape, the number of reels to be produced can be reduced, so that the amount of the reel materials and the moisture barrier material can be reduced, and the manufacturing cost can be reduced.

As the metal film, a metal having high stretch property is preferable, and copper, aluminum stainless, iron, tin and the like can be used.

As an aromatic polyamide film, a para-aramid film (Mictron; brand name of Toray Industries, Ltd.) etc. are used specifically ,.

As the adhesive material, a thermoplastic resin, a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin is used. Typical examples of such resins include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, acrylic resins and silicone resins as thermosetting resins.

Electroconductive particle may be disperse | distributed to an adhesive material. Examples of the conductive particles include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like, and / or polymer core materials such as non-conductive glass, ceramics, plastics, and the like. The conductive layer may be formed by coating or the like. Moreover, the insulation coating particle | grains formed by coating the above-mentioned electrically conductive particle with the insulating layer, the combination of electrically conductive particle and insulating particle, etc. are also applicable. Forming a conductive layer on a hot melt metal such as solder or a polymer core material such as plastic has deformability by heating pressurization or pressurization, the distance between electrodes after connection decreases, and the contact area with the circuit increases during connection. It is preferable because the solution reliability is improved. In particular, when the polymers are used as the nucleus, the melting point is not shown as in the solder, and thus the softening state can be widely controlled at the connection temperature, and the connection member can be easily obtained to cope with variations in the thickness and flatness of the electrode.

In the sixty-sixth aspect of the present application, in the sixtieth aspect of the present application, the thickness of the substrate is 1 µm to 25 µm.

The thickness of the substrate is 1 µm to 25 µm because a sufficient tensile strength of the substrate is not obtained when the thickness of the substrate is less than 1 µm, and the substrate is easily broken. Moreover, when the thickness of a base material exceeds 25 micrometers, it is because it is difficult to obtain the number of turns for which satisfaction is obtained with respect to the number of turns per reel.

In the sixty-second invention of the present application, in the sixty-ninth invention or the sixty-first invention of the present application, the tensile strength of the substrate is 300 MPa or more at 25 ° C.

The tensile strength of the substrate is 300 MPa or more because when the tensile strength of the substrate is less than 300 MPa, the substrate is easily stretched and the adhesive tape is easily cut.

In the sixty-sixth aspect of the present application, in the sixtyth aspect of the invention to the sixty-second aspect of the application, the ratio of the thickness to the adhesive material of the substrate is 0.01 to 1.0.

The ratio of the thickness of the substrate to the adhesive material of 0.01 to 1.0 is because when the ratio of the thickness of the substrate to the adhesive material is less than 0.01, the substrate is too thin and the strength of the adhesive tape is not sufficiently obtained. When the ratio of the thickness of the substrate to the adhesive material exceeds 1.0, the thickness of the substrate is too thick, and the number of turns per reel cannot be increased.

In the sixty-sixth aspect of the present application, in the sixtyth aspect of the invention to the sixty-third aspect of the application, the surface roughness R _max of the substrate is 0.5 μm or less.

The surface roughness R _max of the base material is 0.5 μm or less because when R _max exceeds 0.5 μm, the adhesive material becomes difficult to separate from the base material when the adhesive material is pressed onto the circuit board by the unevenness of the surface of the base material. .

The 65th invention of this application is an adhesive material formation method of the adhesive tape which apply | coats an adhesive material to a base material, and forms an adhesive material on a to-be-adhered body using the adhesive tape wound on the reel, Comprising: Each adhesive material tape is taken out from several reels, The adhesive material tape is piled up and integrated, and one base material is peeled off, and the adhesive material integrated and integrated is formed as an adherend.

In the 65th invention of this application, the adhesive material surface of the adhesive tape extracted from one reel and the adhesive material surface of the adhesive tape taken out from the other reel are overlapped, and an adhesive tape is integrated. The base material of the other adhesive material tape is wound up to the reel for winding, and the adhesive material of the adhesive material tape which integrated together is crimped | bonded to a to-be-adhered body by a pressurized heating head. The adherend is an electronic component or a circuit board, and is a lead frame or a die of a lead frame.

As described above, in the step immediately before forming the adhesive on the adherend, the adhesive of one adhesive tape and the adhesive of the other adhesive tape are overlapped to form a desired thickness of the adhesive and then the adhesive is formed on the adherend. Even if the number of turns of the tape is increased, the wound diameter of the adhesive tape per reel can be reduced. Therefore, the number of turns of the adhesive tape per one reel can be increased, and the amount of adhesive material usable in one replacement work can be greatly increased. Therefore, the replacement work of the new adhesive tape takes less, and the production efficiency of the electronic device is increased.

66th invention of this application is a 65th invention of this application WHEREIN: A hardening | curing agent is contained only in the adhesive material of one adhesive material tape, It is characterized by the above-mentioned.

According to the sixty-sixth invention of the application, the same effect as the sixty-seventh invention and the curing agent is contained only in the adhesive material of one adhesive tape, so that the curing agent is unnecessary in the adhesive material of the other adhesive tape. . Therefore, low temperature management is unnecessary for the adhesive tape of the adhesive material which does not contain a hardening | curing agent. Therefore, the number of adhesive tapes requiring low temperature management can be reduced, and efficient management of transport and storage of adhesive tapes can be performed. In addition, the adhesive material of the adhesive tape with which a hardening | curing agent is not mix | blended, and the adhesive material with the hardening | curing agent mixes the adhesive material which uses the component which reacts with a hardening | curing agent as the other adhesive material, and uses the component which does not react with a hardening | curing agent with a hardening | curing agent on one adhesive material. By doing so, the storage stability of the adhesive can be improved.

Another aspect (U) of this invention is the anisotropic conductive tape which wound and laminated the anisotropic conductive material which has a film-form adhesive material many times in the longitudinal direction of a core material, and was laminated.

Another aspect (V) of the present invention is the anisotropic conductive tape according to the U aspect of the present invention, wherein the anisotropic conductive material is an anisotropic conductive material having a two-layer structure in which a base film is provided on one side of a film-like adhesive.

Moreover, another aspect (W) of this invention is an anisotropic conductive tape of U form of this invention WHEREIN: The said anisotropic conductive material is a three-layered anisotropic conductive material which provided the base film on both surfaces of the film-form adhesive material. Anisotropic conductive tape.

Moreover, another aspect (X) of this invention is an anisotropic conductive tape in which the single side | surface or both surfaces of a base film are peeled off in the anisotropic conductive tape of the V form of this invention or W form of this invention.

Moreover, another aspect (Y) of this invention is an anisotropic conductive material whose width | variety of a film-form adhesive is 0.5-5 mm in the anisotropic conductive tape in any one of U form of this invention, or X form of this invention. It is a tape.

Moreover, another aspect (Z) of this invention WHEREIN: The anisotropically conductive material tape in any one of V form of this invention-Y form of this invention WHEREIN: The strength of a base film is 12 kg / mm <2> or more, and elongation is 60 It is -200% and the anisotropically conductive material tape whose thickness is 100 micrometers or less. And when a base film is colored by color transparency or color opacity, discrimination of a base film and an adhesive material becomes easy, and the position of a wound part becomes easy, and workability improves.

Best Mode for Carrying Out the Invention

EMBODIMENT OF THE INVENTION Next, embodiment of this invention is described, referring an accompanying drawing. In addition, in the following description, the same code | symbol is attached | subjected about the same or equivalent component.

EMBODIMENT OF THE INVENTION First, embodiment of 1st invention-4th invention of this application is described with reference to FIGS.

BRIEF DESCRIPTION OF THE DRAWINGS In the connection method of the adhesive tape which concerns on 1st Embodiment, it is a perspective view which shows the connection of adhesive material reels, and FIG. 2A and 2B show the connection process of the connection part A in FIG. 2A is a perspective view showing the cutting of the end tape of the adhesive tape used, FIG. 2B is a perspective view showing the connection with the new adhesive tape by inverting the used adhesive tape, and FIGS. 3A and 3B are adhesive materials in the bonding apparatus. 4 is a cross-sectional view showing adhesion of circuit boards, and FIG. 5 is a process chart showing a method for producing an adhesive tape.

The adhesive tape 1 is wound around the reels 3 and 3a, respectively, and the reel 3 and 3a is provided with the side plate 7 arrange | positioned at both width sides of the core 5 and the adhesive tape 1, respectively. That is, each reel 3 and 3a has the core 5 and the side plate 7 arrange | positioned at the both width side of the adhesive tape 1, respectively.

The adhesive tape 1 is comprised from the base material 9 and the adhesive material 11 apply | coated to one side surface of the base material 9.

The base material 9 is composed of OPP (stretched polypropylene), polytetrafluoroethylene, siliconized PET (polyethylene terephthalate) and the like from the viewpoint of strength and peelability of the adhesive constituting the anisotropic conductive material, but is not limited thereto. It doesn't happen.

As the adhesive material 11, a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin and a hot melt system are used. Typical examples of such resins include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, vinyl ester resins, acrylic resins, and silicone resins are used as the thermosetting resins.

The conductive particles 13 are dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like. The conductive particles 13 include these and non-conductive glass, A conductive layer made of a material constituting the conductive particles 13 described above may be formed by coating or the like on a polymer core material such as ceramics or plastic. Moreover, the insulation coating particle | grains which coat | cover the above-mentioned conductive particle 13 with the insulating layer, the combination of the conductive particle 13, and insulating particle, etc. are also applicable. The formation of a conductive layer on a hot melt metal such as solder or a polymer core material such as plastic has a deformability by heat pressurization or pressurization, the distance between electrodes after connection decreases, and the contact area with the circuit increases during connection. It is preferable because the solution reliability is improved. Particularly, in the case where the polymers are the nucleus, the conductive particles 13 do not exhibit melting points like solder, so that the softening state can be controlled widely at the connection temperature, and the connection member is easy to cope with variations in thickness and flatness of the electrode. It is more preferable because is obtained.

Next, the usage method of the adhesive tape 1 which concerns on this embodiment is demonstrated. As shown in FIG. 3A, the reel 3a of the adhesive tape 1 and the winding reel 17 are attached to the adhesive device 15, and the tip of the adhesive tape 1 wound on the reel 3a is attached. Is attached to the take-up reel 17 by hanging on a guide pin 22, and the adhesive tape 1 is fed out (arrow E in FIG. 3A). And the adhesive tape 1 is arrange | positioned on the circuit board 21, the adhesive tape 1 is press-contacted from the base material 9 side by the heating press head 19 arrange | positioned between both reels 3a and 17, The adhesive material 11 is pressed onto the circuit board 21. Then, the base material 9 is wound up by the winding reel 17.

After the above-mentioned crimping (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are aligned and connected. In this connection, as shown in FIG. 4, the wiring circuit (or electronic component) 23 is arrange | positioned to the adhesive material 11 crimped | bonded to the circuit board 21, and as needed, for example, polytetrafluoro; The wiring circuit 23 is heated and pressurized by the heating pressurizing head 19 via the ethylene material 24 to the circuit board 21. As a result, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 are connected.

The PDP using the adhesive tape 1 according to the present embodiment has a large size, which may be pressed over the entire periphery of the PDP, and there are many connecting portions. The adhesive material 11 is an adhesive material 11 used at one time. ), The usage amount is significantly higher than in the prior art. Therefore, the usage-amount of the adhesive tape 1 wound on the reel 3a also increases, and the adhesive tape 1 wound on the reel 3a is wound on the winding reel 17 in a relatively short time and wound on the reel 3a. The end mark 28 of the tape 1 is exposed (see FIG. 1).

In the method of connecting the adhesive tape of the present invention, (a) the winding reel 17 is used as it is, the used adhesive tape 1 is replaced with an adhesive tape with only a small amount of winding left, and a new adhesive tape and the winding reel ( 17) and the (b) winding material of the used adhesive tape 1 as the winding reel 17 using only a few adhesive tapes left, and connecting the new adhesive tape and the adhesive tape with only a few windings left. There is a case.

In the case of (b), as shown in FIG. 1, in order to replace the reel 3a with the new adhesive material reel 3 in the adhesive tape 1 of the reel 3a, the adhesive tape of the reel 3a (one side) The end portion 30 of the adhesive tape 1 is connected to the start end 32 of the adhesive tape (the other adhesive tape) 1 wound on the new adhesive reel 3.

When the end mark 28 of the adhesive tape 1 of the used reel 3a is exposed, the connection of this adhesive tape 1 is carried out, as shown in FIG. 2A, the end mark 28 of the adhesive tape 1 ) And the end part 30 of the adhesive tape 1 is reversed, and the adhesive material 11 surface of the adhesive tape 1 is turned upward (FIG. 2B). And the adhesive material of the starting end part 32 of the adhesive material tape 1 of the new adhesive material reel 3 to the adhesive material 11 surface of the terminal part 30 of the adhesive material tape 1 of the used reel 3a ( 11) Overlap the faces (FIG. 2B).

As shown in FIG. 4, the overlapped portions are placed on the table 104, and heated and pressed by the heat press head 19 of the bonding apparatus 15 to be bonded. Thereby, the adhesive tape 1 wound on the used reel 3a and the adhesive tape 1 wound on the new reel 3 are connected. Next, the used reel 3a and the new reel 3 are replaced, and the new reel 3 is attached to the bonding apparatus 15. Therefore, the work which attaches the adhesive tape 1 to the winding reel 17 is unnecessary. In addition, since the surfaces of the adhesive materials 11 overlap each other, the connection strength is high.

Moreover, the end mark 28 is the adhesive tape 1 in the adhesive tape 1 from the used reel (reel to which the adhesive tape 1 is fully fed out) 3a to the heating press head 19. When is increased, it is preferable to stick to the position of the length from the fixed position to the used reel 3a of the adhesive tape 1 to the heating press head 19. In this case, when the vicinity of the end mark 28 is cut off, the adhesive tape 1 is cut at the minimum required position, and the waste of the adhesive tape 1 can be prevented, and the used reel ( By removing 3a), cumbersome work of moving the used reel 3a so that the end mark 28 reaches the heating press head 19 can be prevented.

In this embodiment, the bonding apparatus 15 has the heating press head 19, and the terminal 30 of the adhesive tape 1 of the reel 3a which was used using this heating press head 19 was used. Connection between the adhesive material 11 and the adhesive material 11 of the start end portion 32 of the adhesive tape 1 of the new adhesive material reel 3 is performed, so that a crimping mechanism for pressing the adhesive materials 11 together is separately provided. The reels 3 and 3a wound around the adhesive tape 1 can be replaced without being used.

When using the winding reel 17 of (a) as it is, replacing the adhesive tape of which the wound of the used adhesive tape 1 remains with a new adhesive tape, and connecting a new adhesive tape and the winding reel 17 to it. When the end mark 28 of the adhesive tape 1 of the used reel 3a is exposed, the adhesive material cuts around the end mark 28 of the adhesive tape 1, and remains on the winding reel 17 side. The end of the tape is turned over, and the adhesive 11 face up. And the adhesive material 11 surface of the terminal part of this adhesive material tape 1 and the adhesive material 11 surface of the start end part 32 of the adhesive material tape 1 of the new adhesive material reel 3 overlap. Then, the overlapped portions are placed on the table 104 and heated and pressurized by the heat press head 19 of the bonding apparatus 15 to be bonded. Thereby, the adhesive tape 1 wound around the winding reel 17 and the adhesive tape 1 wound around the new reel 3 are connected. Thereby, since only the base material 9 is wound up in the winding reel 17, some of the adhesive material reels can be wound up and the frequency | count of replacement of the winding reel 17 can be reduced, and work efficiency is favorable.

Here, with reference to FIG. 5, the manufacturing method of the adhesive tape 1 which concerns on this embodiment is demonstrated.

A coater 27 is applied to the base material (separator) 9 unloaded from the unwinder 25 to apply an adhesive material 11 in which the resin and the conductive particles 13 are mixed, and in the drying furnace 29 After drying, the disk is wound up in the winder 31. After the raw material of the wound adhesive tape 1 is cut into a predetermined width by a slitter 33 and wound around the core, the side plates 7 are mounted on the core from both sides, or wound on the side plate attachment core. It packs together with a dehumidifier, and it manages at low temperature (-5 degreeC--10 degreeC), and is released.

Next, a description will be given of a second embodiment of the present invention. Hereinafter, differences from the above-described embodiment will mainly be described.

In 2nd Embodiment shown in FIG. 6, the adhesive material of the new adhesive material reel 3 is used using the lead tape 41 with which the start end part 32 of the adhesive material tape 1 of the new adhesive material reel 3 was equipped. The tape 1 and the adhesive tape 1 wound around the used reel 3a are connected. The lead tape 41 consists of the base material 63 and the adhesive material 43 surface of the back surface, and the start end part 32 of the adhesive material tape 1 of the new adhesive material reel 3 is connected by the lead tape 41. It sticks to the base material 9 surface of the adhesive tape 1 wound around the reel. And the lead tape 41 is peeled off from the base material 9 surface, and it overlaps with the adhesive material 11 surface of the terminal part 30 of the inverted adhesive tape 1. The overlapped portions of the two are placed on the table 104, and heated and pressurized by the heating press head 19 of the bonding apparatus 15 to be bonded. Thus, using the lead tape 41 of the adhesive tape 1, the terminal part 30 of the adhesive tape 1 which unwinding | finished is adhere | attached, and the start end part 32 of the adhesive tape 1 newly mounted is adhere | attached. Thus, the connection between the adhesive tapes 1 is easy. In this case, the surface of the adhesive material 43 provided on the back surface side of the base material 63 of the lead tape 41 is sticky, and the surface of the adhesive material 11 of the end portion 30 of the inverted adhesive tape 1 is adhered to. Since it connects only to overlap, this method may be sufficient.

This invention is not limited to embodiment mentioned above, A various deformation | transformation is possible in the range which does not deviate from the summary of this invention.

For example, in the above-described second embodiment, the start end portion 32 of the adhesive tape 1 to be newly mounted as shown in FIG. 7 without inverting the adhesive tape 1 wound on the used reel 3a. Peels off the lead tape 41 from the substrate 9 surface, attaches the lead tape 41 to the adhesive material 11 on the back surface, and attaches the lead tape 41 to the end portion 30 of the used adhesive tape 1. It may be connected to the surface and heated and pressurized by the heat press head 19 of the bonding apparatus 15, and may be bonded. In this case, since it is not necessary to turn over the adhesive tape 1 after unwinding, it can prevent the possibility that the winding | winding of the winding | winding arises when the adhesive tape 1 is wound up to the winding reel.

Furthermore, in this case, the lead tape 41 of the start end 32 of the adhesive tape 1 is peeled off from the base 9 surface, and the lead tape 41 is removed from the base 9 surface of the used adhesive tape 1. May be adhered to.

Next, the fifth to eighth inventions of the present application will be described.

The present invention relates to an adhesive tape for electrically connecting electronic components and circuit boards or circuit boards and electrically connecting both electrodes, and more particularly, to a method for connecting an adhesive tape wound in a reel shape.

Next, the background art of the fifth to eighth inventions of the present application will be described.

Generally, electronic components such as liquid crystal panels, PDPs (plastic display panels), EL (fluorescent display) panels, bare chip mounting, and the like are bonded and fixed to circuit boards and circuit boards, and are electrically connected to both electrodes. , Adhesive tape is used.

Japanese Patent Laid-Open No. 2001-284005 discloses winding up an adhesive tape coated with an adhesive on a substrate in a reel form.

The conventional adhesive tape of this kind has a width of about 1 to 3 mm and a length of the tape wound with a reel of about 50 m.

In the case where the adhesive tape is attached to the adhesive device, an adhesive tape reel (hereinafter simply referred to as "adhesive material reel") is attached to the adhesive device, the lead end of the adhesive tape is taken out, and attached to the winding reel. And the adhesive material is crimped | bonded by a heating press head from the base material side of the adhesive material tape unwound from the adhesive material reel to a circuit board etc., and the remaining base material is wound up by the winding reel.

When the adhesive tape of the adhesive reel is finished, the finished reel and the winding reel winding the base material are removed, a new winding reel and a new adhesive reel are attached to the adhesive device, and the beginning of the adhesive tape is attached to the winding reel. .

Moreover, with the recent increase in the size of panel screens in PDPs and the like, the adhesion area of circuit boards has increased, and the amount of adhesive materials used at one time has increased. In addition, since the use of the adhesive material has also been expanded, the amount of the adhesive material used has increased. For this reason, in the manufacturing plant of an electronic device, since the frequency of replacement of an adhesive reel becomes large and a lot of labor is required for replacement of an adhesive reel, the production efficiency of an electronic device cannot be improved.

In response to such a problem, it is considered to increase the amount of adhesive material per reel and to reduce the reel exchange frequency by increasing the number of turns of the adhesive tape wound on the reel. However, since the tape width of the adhesive tape is narrow to 1 to 3 mm, the number of turns If you increase the amount of winding, there is a risk of drift of the wound. In addition, when the number of turns is increased, the pressure applied to the adhesive tape wound on the tape is increased, and the adhesive may start to seep out from both widths of the tape and cause blocking.

Furthermore, increasing the number of turns of the adhesive tape also increases the diameter dimension of the reel, making it difficult to attach to the existing adhesive apparatus, and there is a concern that the existing adhesive apparatus cannot be used.

Therefore, the 5th invention-8th invention of this application are aimed at providing the adhesive tape connection method which can simplify replacement | exchange of an adhesive material reel, and can aim at the improvement of the production efficiency of an electronic device.

Next, a first embodiment of the present invention will be described with reference to FIGS. 8A to 8C and FIGS. 3A to 5. 8A to 8C are views showing a connection method of the adhesive tape according to the first embodiment, FIG. 8A is a perspective view showing the connection between the adhesive material reels, and FIG. 8B shows a connection method of the connection portions in FIG. 8A. It is a perspective view, and FIG. 8C is a top view of the connection part in FIG. 8A.

The adhesive tape 1 is wound around the reels 3 and 3a, respectively, and the reel 3 and 3a are provided with the side plates 7 arranged on both width sides of the core 5 and the adhesive tape 1. In this embodiment, the adhesive tape 1 is about 50 m in length and width W is about 5 mm.

The adhesive tape 1 is comprised from the base material 9 and the adhesive material 11 apply | coated to one side surface of the base material 9.

The base material 9 is composed of OPP (stretched polypropylene), polytetrafluoroethylene, siliconized PET (polyethylene terephthalate) and the like from the viewpoint of strength and peelability of the adhesive constituting the anisotropic conductive material, but is not limited thereto. It doesn't happen.

As the adhesive material 11, a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin and a hot melt system are used. Typical examples of such resins include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, vinyl ester resins, acrylic resins, and silicone resins as thermosetting resins.

The conductive particles 13 are dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like. The conductive particles 13 include these and non-conductive glass, A conductive layer made of a material constituting the conductive particles 13 described above may be formed by coating or the like on a polymer core material such as ceramics or plastic. Moreover, the insulation coating particle | grains which coat | cover the above-mentioned conductive particle 13 with the insulating layer, the combination of the conductive particle 13, and insulating particle, etc. are also applicable. Forming a conductive layer on a hot melt metal such as solder, or a polymer core material such as plastic has a deformability by heat pressurization or pressurization, the distance between electrodes after connection decreases, and the contact area with the circuit increases during connection. It is preferable because the solution reliability is improved. Particularly, in the case where the polymers are the nucleus, the conductive particles 13 do not exhibit melting points like solder, so that the softening state can be widely controlled at the connection temperature, and a connection member that is easy to cope with variations in thickness and flatness of the electrode can be obtained. It is more preferable because it can be obtained.

Next, the usage method of the adhesive tape 1 which concerns on this embodiment is demonstrated. As shown in FIG. 3A, the reel 3a of the adhesive tape 1 and the winding reel 17 are attached to the adhesive device 15, and the tip of the adhesive tape 1 wound on the reel 3a is guide pin. It hangs on (22), it is attached to the winding reel 17, and the adhesive tape 1 is pulled out (arrow E in FIG. 3A). And the adhesive tape 1 is arrange | positioned on the circuit board 21, the adhesive tape 1 is press-contacted from the base material 9 side by the heating press head 19 arrange | positioned between both reels 3a and 17, The adhesive material 11 is pressed onto the circuit board 21. Then, the base material 9 is wound up by the winding reel 17.

After the above-mentioned crimping (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are aligned and connected. In this connection, as shown in FIG. 4, the wiring circuit (or electronic component) 23 is arrange | positioned to the adhesive material 11 crimped | bonded to the circuit board 21, and as needed, for example, polytetrafluoro; The wiring circuit 23 is heated and pressurized by the heating pressurizing head 19 via the ethylene material 24 to the circuit board 21. As a result, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 are connected.

The PDP using the adhesive tape 1 according to the present embodiment has a large size, which may be pressed over the entire periphery of the PDP, and there are many connecting portions, and the adhesive 11 is an adhesive 11 used at once. ) Is significantly increased compared to the prior art. Therefore, the usage-amount of the adhesive tape 1 wound on the reel 3a also increases, and the adhesive tape 1 wound on the reel 3a is wound on the winding reel 17 in a relatively short time and wound on the reel 3a. The end mark 28 of the tape 1 is exposed (see FIG. 8A).

In the method of connecting the adhesive tape of the present invention, (a) the winding reel 17 is used as it is, the used adhesive tape 1 is replaced with the adhesive tape with only a few remaining turns, and the new adhesive tape and the winding reel ( 17) and the (b) winding material of the used adhesive tape 1 as the winding reel 17 using only a few adhesive tapes left, and connecting the new adhesive tape and the adhesive tape with only a few windings left. There is a case.

In the case of (b), when the end mark 28 is exposed to the adhesive tape 1 of the reel 3a, as shown in FIG. 8A, in order to replace the reel 3a with the new adhesive material reel 3, The end portion 30 of the adhesive tape (one adhesive tape) 1 of the reel 3a and the start end 32 of the adhesive tape (the other adhesive tape) wound on the new adhesive reel 3 are connected. (See Figure 8A).

The connection of this adhesive tape 1 is the terminal 30 of the adhesive tape 1 of the adhesive reel 3a, and the adhesive tape 1 of the new adhesive reel 3, as shown to FIG. 8B and FIG. 8C. The surface of the adhesive material 11 of the start end 32 is overlapped with the base 9 surface of the end 30 with respect to the start end 32 of the (). Then, a substantially U-shaped locking pin 46 is inserted in the overlapped portion to connect the end portion 30 of the adhesive tape 1 and the start end 32 of the adhesive tape 1 of the new adhesive material reel 3. do.

Thereby, the adhesive tape 1 wound on the used reel 3a and the adhesive tape 1 wound on the new reel 3 are connected. Thus, since the terminal part 30 of the adhesive material tape 1 which unwinding | finished and the start end part 32 of the adhesive material tape 1 which are newly attached are fixed with the locking pin 46, connection is easy.

Next, the used reel 3a and the new reel 3 are replaced, and the new reel 3 is attached to the bonding device 15. Therefore, the work which attaches the adhesive tape 1 newly to the winding reel 17 is unnecessary.

By using the winding reel 17 of (a) as it is, replacing the adhesive tape which is still left of the used adhesive tape 1 with a new adhesive tape, and connecting the new adhesive tape and the winding reel 17 In the case, when the end mark 28 of the adhesive tape 1 of the used reel 3a is exposed, the end mark 28 vicinity of the adhesive tape 1 is cut off and left on the winding reel 17 side. The end part 30 of the adhesive tape overlaps with the start end 32 of the adhesive tape 1 of the new adhesive reel 3. Then, a substantially U-shaped locking pin 46 is inserted into the overlapped portion so that the end portion 30 of the adhesive tape 1 and the start end portion 32 of the adhesive tape 1 of the new adhesive material reel 3 are inserted. Connect

Since only the base material 9 is wound by the winding reel 17, several parts of an adhesive material reel can be wound up. For this reason, the replacement | exchange frequency of the winding reel 17 can be made small, and work efficiency is good.

Next, although the 2nd-4th embodiment of 5th invention-8th invention of this application is described, in the embodiment demonstrated below, the same code | symbol is attached | subjected to the same part, and the detailed description of that part is carried out. Will be omitted, and differences from the first embodiment will be mainly described below.

In the second embodiment shown in FIG. 9, the locking member provided with the elastic members 50 which connect the click parts 48 and 49 provided in the one end and the other end, and the click parts 48 and 49 of both ends ( 47), the end portion 30 of one adhesive tape 1 and the start end 32 of the other adhesive tape 1 are connected. In detail, the click part 48 which provided the end part 30 of one adhesive material tape 1 and the start end part 32 of the other adhesive material tape 1, and was provided in one end of the locking member 47 is provided. To the end portion 30, the click portion 49 provided at the other end is locked to the start end portion 32, and one click portion 48 and the other click portion 49 are elastic members ( 50). Further, the click portions 48 and 47 are provided with a plurality of clicks 51 having sharp ends at the rear surface of the plate member.

Since the click portion 48 provided at one end of the locking member 47 is latched to the end portion 30, and then the click portion 49 provided at the other end is latched on the start end portion 32 so as to connect both to each other. , Connection is easy. Moreover, since the elastic member 50 is provided between the one click part 48 and the other click part 49, the elastic member 50 is extended and the other click part of the locking member 47 is extended. Since 49 can be latched in the arbitrary position of the start end part 32 of the other adhesive tape 1, the freedom of connection is high.

In the third embodiment shown in FIG. 10, the end portion 30 of the adhesive tape 1 wound around the used reel 3a and the start end portion 32 of the adhesive tape 1 of the new adhesive material reel 3. ), The adhesive material 11 surface of the start end portion 32 overlaps with the substrate 9 surface of the end portion 30, and the overlapped portion is sandwiched by an elastically deformable clip 53 having a substantially cross-shaped cross section. It is fixed. Since the overlapping part can be connected only by pinching | clipping the clip 53, connection operation is easy.

In 4th Embodiment shown in FIG. 11, in 1st Embodiment, the overlapping part is covered with the metal clamping piece 55 whose cross-section is substantially co-shaped, and the clamping piece 55 is attached from both sides of the overlapping part. Press and crush to connect both. Since the clamping piece 55 is pressed and crushed from both surfaces of the overlapped portion, a firm connection can be obtained at the overlapped portion.

5th invention-8th invention of this application is not limited to embodiment mentioned above, A various deformation | transformation is possible in the range which does not deviate from the summary of 5th invention-8th invention of this application.

For example, in the above-described first embodiment, the engagement pin 46 may be one linear pin without making the substantially U-shape, and in this case, it is preferable to fix it by using a plurality of pins in the overlapped portion. Do.

In the second embodiment, a plurality of locking members 47 may be used depending on the width of the adhesive tape 1.

In the third embodiment and the fourth embodiment, a plurality of clips 53 or clamping pieces 55 may be used, and may be fixed from both sides of the overlapped portions of the adhesive tape 1, respectively.

Next, the ninth to thirteenth inventions of the present application will be described.

The present invention relates to an adhesive tape for electrically connecting electronic components and circuit boards or circuit boards and electrically connecting both electrodes, and more particularly, to a method for connecting an adhesive tape wound in a reel shape.

Next, the background art of the ninth to thirteenth inventions of the present application will be described.

Generally, electronic components such as liquid crystal panels, plasma display panels (PDPs), fluorescent display panels (EL) panels, bare chip mounting, and circuit boards and circuit boards are bonded to each other and electrically connected to each other. As the adhesive tape, an adhesive tape is used.

Japanese Patent Laid-Open No. 2001-284005 discloses winding up an adhesive tape coated with an adhesive on a substrate in a reel form.

The conventional adhesive tape of this kind has a width of about 1 to 3 mm and a length of the tape wound with a reel of about 50 m.

When the adhesive tape is attached to the adhesive device, a reel of the adhesive tape (hereinafter simply referred to as "adhesive reel") is attached to the adhesive device, the lead end of the adhesive tape is taken out, and the winding reel is provided. And the adhesive material is crimped | bonded by a heating press head from the base material side of the adhesive material tape unwound from the adhesive material reel to a circuit board etc., and the remaining base material is wound up by the winding reel.

When the adhesive tape of the adhesive reel is finished, the finished reel and the winding reel on which the base material is wound are removed, a new winding reel and a new adhesive reel are attached to the adhesive device, and the beginning of the adhesive tape is attached to the winding reel. have.

However, with the recent increase in the size of panel screens in PDPs and the like, the adhesive area of circuit boards has increased, and the amount of adhesive materials used at one time has increased. In addition, since the use of the adhesive material has also been expanded, the amount of the adhesive material used has increased. For this reason, in the manufacturing plant of an electronic device, there exists a problem that the frequency of replacement of an adhesive reel increases, and since labor takes for exchanging an adhesive reel, the improvement of the production efficiency of an electronic device is not aimed at.

For this problem, it is considered to increase the amount of adhesive material per reel and to reduce the reel exchange frequency by increasing the number of turns of the adhesive tape wound on the reel, but the tape width of the adhesive tape is narrow to 1 to 3 mm. If you increase a lot of things, there is a risk of winding up. In addition, when the number of turns is increased, the pressure applied to the adhesive tape wound on the tape becomes high, and the adhesive may start to seep out from both widths of the tape and cause blocking.

Furthermore, if the number of turns of the adhesive tape is increased, the diameter dimension of the reel is also large, and it is difficult to attach to the existing adhesive device, and there is a fear that the existing adhesive device cannot be used.

Therefore, the ninth to thirteenth inventions of the present application aim to provide an adhesive tape connecting method which can simplify the replacement of the adhesive reel and can improve the production efficiency of the electronic device.

Next, an embodiment of the ninth to thirteenth inventions of the present application will be described with reference to the accompanying drawings. First, with reference to FIGS. 12A, 12B, and 3A to 5, the ninth to thirteenth inventions of the present application will be described. The first embodiment will be described. 12A to 12C are views showing a connection method of the adhesive tape according to the first embodiment, FIG. 12A is a perspective view showing the connection between the adhesive material reels, and FIG. 12B shows a connection method of the connection portions in FIG. 12A. Perspective view.

The adhesive tape 1 is wound around the reels 3 and 3a, respectively, and the reel 3 and 3a are provided with side plates 7 disposed on both width sides of the core 5 and the adhesive tape 1. In this embodiment, the adhesive tape 1 is about 50 m in length and width W is about 3 mm.

The adhesive tape 1 is comprised from the base material 9 and the adhesive material 11 apply | coated to one side surface of the base material 9.

Although the base material 9 uses OPP (stretched polypropylene), polytetrafluoroethylene, silicone-treated PET (polyethylene terephthalate) etc. from the surface of the peelability of the adhesive material which comprises an anisotropically conductive material, it restrict | limits to these It doesn't happen.

As the adhesive material 11, a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin and a hot melt system are used. Typical examples of such resins include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, vinyl ester resins, acrylic resins, and silicone resins as thermosetting resins.

The conductive particles 13 are dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like, and polymer core materials such as non-conductive glass, ceramics, and plastics. The above conductive layer may be formed by coating or the like. Moreover, the insulation coating particle | grains formed by coating the above-mentioned electrically conductive particle with the insulating layer, the combination of electrically conductive particle and insulating particle, etc. are also applicable. Forming a conductive layer on a hot melt metal such as solder or a polymer core material such as plastic has deformability by heating pressurization or pressurization, the distance between electrodes after connection decreases, and the contact area with the circuit increases during connection. It is preferable because the solution reliability is improved. In particular, when the polymers are used as the nucleus, the melting point is not shown as in the solder, and thus the softening state can be widely controlled at the connection temperature, and the connection member which is easy to cope with variations in the thickness and flatness of the electrode is obtained.

Next, the usage method of the adhesive tape which concerns on this embodiment is demonstrated. As shown in FIG. 3A, the reel 3a of the adhesive tape 1 and the winding reel 17 are attached to the adhesive device 15, and the end of the adhesive tape 1 wound on the reel 3a is wound. It installs in (7) and feeds out the adhesive tape 1 (arrow E in FIG. 3A). And the adhesive tape 1 is arrange | positioned on the circuit board 21, the adhesive tape 1 is press-contacted from the base material 9 side by the heating press head 19 arrange | positioned between both reels 3a and 17, The adhesive material 11 is pressed onto the circuit board 21. Then, the base material 9 is wound up by the winding reel 17.

After the above-mentioned crimping (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are aligned and connected. In this connection, as shown in FIG. 4, the wiring circuit (or electronic component) 23 is arrange | positioned to the adhesive material 11 crimped | bonded to the circuit board 21, and it is polytetrafluoro, for example as a cushion material as needed. The wiring circuit 23 is heated and pressurized by the heating pressurizing head 19 via the ethylene material 24 to the circuit board 21. As a result, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 are connected.

The PDP using the adhesive tape 1 according to the present embodiment has a large size, which may be compressed over the entire periphery of the PDP, and there are many connecting portions, and the adhesive material 11 is an adhesive material 11 used at one time. ) Is significantly increased compared to the prior art. Therefore, the usage-amount of the adhesive tape 1 wound on the reel 3a also increases, and the adhesive tape 1 wound on the reel 3a is wound on the winding reel 17 in a relatively short time, and the adhesive wound on the reel 3a is carried out. The end mark 28 of the ash tape 1 is exposed (see Fig. 12A).

In the method for connecting the adhesive tape of the ninth to thirteenth inventions of the present application, (a) the winding reel 17 is used as it is, and the used adhesive tape 1 is replaced with an adhesive tape having only a few remaining turns, When the new adhesive tape and the winding reel 17 are connected, and (b) the winding of the used adhesive tape 1 as the winding reel 17 is performed using a new adhesive tape and the winding of the new adhesive tape. There may be a case where the remaining adhesive tape is connected.

In the case of (b), as shown in FIG. 12A, when the end mark 28 is exposed to the adhesive tape 1 of the reel 3a, in order to replace the reel 3a with a new adhesive material reel 3, The end portion 30 of the adhesive tape (one adhesive tape) 1 of the reel 3a and the start end 32 of the adhesive tape (the other adhesive tape) wound on the new adhesive reel 3 are connected. (See Figure 12A).

As shown in FIG. 12B, the connection of the adhesive tape 1 is the beginning of the end portion 30 of the adhesive tape 1 of the adhesive reel 3a and the adhesive tape 1 of the new adhesive reel 3. About the part 32, the adhesive material 11 of the start end part 32 is overlapped with the base material 9 surface of the terminal part 30. As shown in FIG. The overlapped length H of both is set to about 2.5 of the width W of the adhesive tape 1, placed on the table 36, and heated and pressed by the heating press head 19 of the bonding apparatus 15 to be bonded. Thereby, the adhesive tape 1 wound on the used reel 3a and the adhesive tape 1 wound on the new reel 3 are connected. Next, the used reel 3a and the new reel 3 are replaced, and the new reel 3 is attached to the bonding apparatus 15. Therefore, it is not necessary to attach the adhesive tape to the winding reel 17.

In this embodiment, since the heating press head 19 is used, the reel 3 and 3a by which the adhesive material 1 was wound can be replaced, without using the crimping mechanism of adhesive materials separately.

By using the winding reel 17 of (a) as it is, replacing the adhesive tape which is still left of the used adhesive tape 1 with a new adhesive tape, and connecting the new adhesive tape and the winding reel 17 In the case, when the end mark 28 of the adhesive tape 1 of the used reel 3a is exposed, the end mark 28 vicinity of the adhesive tape 1 is cut off and left on the winding reel 17 side. The end part 30 of the adhesive tape overlaps with the start end 32 of the adhesive tape 1 of the new adhesive reel 3. Then, the overlapped portions are heated and pressurized by the heat press head 19 of the bonding apparatus 15 and bonded. Since only the base material 9 is wound by the winding reel 17, since some of the adhesive material reels can be wound, the frequency | count of replacement of the winding reel 17 can be reduced, and work efficiency is favorable.

Here, with reference to FIG. 5, the manufacturing method of the adhesive tape 1 which concerns on this embodiment is demonstrated.

After the coater 27 is applied to the base material (separator) wound from the unwinder 25, the adhesive material 11 in which the resin and the conductive particles 13 are mixed is applied and dried in the drying furnace 29, and then the winder Wind the disc in (31). After the raw material of the wound adhesive tape is cut into the predetermined width by the slitter 33 and wound around the core, the side plates 7 are mounted on both sides of the core, or wound around the core with the side plates, and together with the dehumidifying material. It is packed and, preferably, it is controlled and released at low temperature (-5 to 10 degreeC).

Next, although an embodiment different from the ninth to thirteenth inventions of the present application will be described, in the embodiments described below, the same reference numerals are given to the same parts as the above-described embodiments, and the detailed description of those parts is given. Will be omitted, and differences from the above-described embodiment will mainly be described.

In the second embodiment shown in FIG. 13, one mold 56 and the other mold on which the overlapped portions 34 of the adhesive tape 1 are aligned with the jagged portions (unevenness) 44 on the surface thereof are formed. It sandwiches with 57, and the unevenness | corrugation 58 is formed in the overlapped part 34. As shown in FIG. By forming the concave-convex 58 in this way, the adhesive area in the overlapped portion 34 can be increased, and the tensioning direction by the engagement of the concave-convex 58 in the overlapped portion 34 (the longitudinal direction of the adhesive tape). ) Can increase the strength. In the case of uneven formation, the end surfaces of the overlapped portions of the adhesive material 11 are flown together by the adhesive material, and the strength in the tensile direction of the overlapped portions 34 is increased.

In the 3rd Embodiment shown to FIG. 14A and 14B, the adhesive tape wound around the used reel 3a by bending the start end part 32 of the reel 3 by which the new adhesive material 1 was wound in substantially V shape. The end portion 30 of (1) is also bent in a substantially V-shape, hooked to the adhesive material 11 to face each other (Fig. 14A), and heated and pressurized by the heating press head 19, Is connected (FIG. 14B). In the third embodiment, the terminal 30 and the start end 32 are connected in a hooked form so that they can be firmly connected, and the adhesive material 11 is superimposed and connected to each other, whereby a stronger connection can be obtained. have. Since the adhesive material of the overlapped part flows and adheres also in the cross section as mentioned above, a more firm connection can be obtained.

In 4th Embodiment shown to FIG. 15A and FIG. 15B, the through-hole 59 is drilled in the part 34 which overlapped before heating pressurization or simultaneously with heating pressurization in 1st Embodiment. By drilling the through-hole 59, the adhesive material 11 seeps out of the periphery of the through-hole 59 at the time of heat pressurization, and since they adhere | attach, adhesive force can be raised and the overlap part 34 makes a firm connection. You can get it.

The ninth to thirteenth inventions of the present application are not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the ninth to thirteenth inventions of the present application.

For example, in the above-described second embodiment, the concave-convex portion 58 may be an annular shape rounded without being formed in a mountain shape.

In the fourth embodiment, the number of the through holes 59 may be any number without any particular limitation. In addition, the diameter of the through hole 59 is not limited. In the second and third embodiments, the through hole 59 may be further formed in the overlapped portion 34.

Next, the 14th to 18th inventions of the present application will be described.

The present invention relates to an adhesive tape for electrically connecting electronic components and circuit boards or circuit boards and electrically connecting both electrodes, and more particularly, to a method for connecting an adhesive tape wound in a reel shape.

Next, the background art of the 14th to 18th inventions of the present application will be described.

Generally, electronic components such as liquid crystal panels, plasma display panels (PDPs), fluorescent display panels (EL) panels, bare chip mounting, and circuit boards and circuit boards are bonded to each other and electrically connected to each other. As the adhesive tape, an adhesive tape is used.

Japanese Patent Laid-Open No. 2001-284005 discloses winding up an adhesive tape coated with an adhesive on a substrate in a reel form.

The conventional adhesive tape of this kind has a width of about 1 to 3 mm and a length of the tape wound with a reel of about 50 m.

In the case where the adhesive tape is attached to the adhesive device, an adhesive tape reel (hereinafter simply referred to as an "adhesive material reel") is attached to the adhesive device, the lead end of the adhesive tape is taken out, and the winding reel is installed. After mounting the adhesive reel, the adhesive is pressed onto a circuit board or the like from the substrate side of the adhesive tape unwound from the adhesive reel with a heating press head, and the remaining substrate is wound on the winding reel.

When the adhesive tape of the adhesive reel is finished, the finished reel and the winding reel wound around the substrate are removed, a new winding reel and a new adhesive reel are attached to the adhesive device, and the adhesive tape is fastened to the guide of the adhesive device. I install a start on a reel.

However, with the recent increase in the size of panel screens in PDPs and the like, the adhesion area of circuit boards has increased, and the amount of adhesive materials used at once has increased. In addition, since the use of the adhesive material has also been expanded, the amount of the adhesive material used has increased. For this reason, in the manufacturing plant of an electronic device, there is a problem that the frequency of replacement of the adhesive reel increases, and the effort for exchanging the adhesive reel increases, so that the production efficiency of the electronic device cannot be improved.

For this problem, it is considered to increase the amount of adhesive material per reel and reduce the reel exchange frequency by increasing the number of turns of the adhesive tape wound on the reel. However, the tape width of the adhesive tape is narrow to 1 to 3 mm. If it increases a lot, there is a possibility that the wound of the winding may occur. In addition, when the number of turns is increased, the pressure applied to the adhesive tape wound on the tape increases, which may cause the adhesive to seep from both widths of the tape and cause blocking.

Furthermore, if the number of turns of the adhesive tape is increased, the diameter dimension of the reel also increases, making it difficult to attach to the existing adhesive apparatus, and there is a possibility that the existing adhesive apparatus cannot be used.

On the other hand, even when it tried to stick an adhesive tape and an adhesive tape with an adhesive tape, it could not adhere with sufficient adhesive force. This is because a fluorine mold release agent, a silicone mold release agent, etc. are apply | coated to an adhesive tape in order to make peelability with an adhesive material favorable, and it is based on the influence.

Therefore, the invention of the fourteenth to eighteenth aspects of the present application can simplify the replacement of the adhesive reel and improve the production efficiency of the electronic device, even when the substrate of the adhesive tape uses a silicon-treated substrate. It is an object of the present invention to provide a method of connecting adhesive tapes.

EMBODIMENT OF THE INVENTION Next, although embodiment of 14th-18th invention of this application is described, referring an accompanying drawing, First of 14th-18th invention of this application with reference to FIG. 16A, 16B, FIG. 3B-FIG. The first embodiment will be described. 16A and 16B are views showing a connection method of the adhesive tape according to the first embodiment, Fig. 16A is a perspective view showing the connection between the adhesive material reels, and Fig. 16B is a connection of the connection portion b in Fig. 16A. It is a perspective view showing a method.

The adhesive tape 1 is wound on the reels 3 and 3a, respectively, and the side plates 7 disposed on both width sides of the core 5 and the adhesive tape 1 are provided on each reel 3 and 3a.

The adhesive tape 1 is comprised from the silicon processing base material 9 'and the adhesive material 11 apply | coated to one side surface of the silicon processing base material 9'.

The siliconization base material 9 'uses base materials, such as OPP (stretched polypropylene), polytetrafluoroethylene, PET (polyethylene terephthalate), from the surface of the peelability of the adhesive material which comprises an intensity | strength and anisotropic conductive material, The surface is surface-treated with silicone resin etc.

As the adhesive material 11, a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin and a hot melt system are used. Typical examples of such resins include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, vinyl ester resins, acrylic resins, and silicone resins as thermosetting resins.

The conductive particles 13 are dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like, and polymer core materials such as non-conductive glass, ceramics, and plastics. The above conductive layer may be formed by, for example, coating or the like. Moreover, the insulation coating particle | grains which coat | cover the above-mentioned electrically conductive particle with an insulating layer, the combination of electrically conductive particle and insulating particle, etc. are also applicable. Forming a conductive layer on a hot melt metal such as solder or a polymer core material such as plastic has deformability by heating pressurization or pressurization, the distance between electrodes after connection decreases, and the contact area with the circuit increases during connection. Therefore, since reliability improves, it is preferable. In particular, when the polymers are used as the nucleus, the melting point is not shown as in the solder, and thus the softening state can be widely controlled at the connection temperature, and the connection member can be easily obtained to cope with variations in the thickness and flatness of the electrode.

Next, the usage method of the adhesive tape which concerns on this embodiment is demonstrated. As shown in FIG. 3B, the reel 3a of the adhesive tape 1 and the winding reel 17 are attached to the adhesive device 15, and the end of the adhesive tape 1 wound on the reel 3a is wound. It attaches to (17) and feeds out the adhesive tape 1 (arrow E in FIG. 3B). And the adhesive tape 1 is arrange | positioned on the circuit board 21, and the adhesive tape 1 is moved from the silicon processing base material 9 'side by the heating press head 19 arrange | positioned between both reels 3a, 17. By pressing, the adhesive 11 is pressed against the circuit board 21. Thereafter, the silicon substrate 9 'is wound around the winding reel 17.

After the above-mentioned crimping (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are aligned and connected. In this connection, as shown in FIG. 4, the wiring circuit (or electronic component) 23 is arrange | positioned to the adhesive material 11 crimped | bonded to the circuit board 21, and it is polytetrafluoro, for example as a cushion material as needed. The wiring circuit 23 is heated and pressurized by the heating pressurizing head 19 via the ethylene material 24 to the circuit board 21. As a result, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 are connected.

The PDP using the adhesive tape 1 according to the present embodiment has a large size, which may be pressed over the entire periphery of the PDP, and there are many connecting portions. The adhesive material 11 is an adhesive material 11 used at one time. ) Is significantly increased compared to the prior art. Therefore, the usage-amount of the adhesive tape 1 wound on the reel 3a also increases, and the adhesive tape 1 wound on the reel 3a is wound on the winding reel 17 in a relatively short time and wound on the reel 3a. The end mark 28 of the tape 1 is exposed (see FIG. 16A).

The connection method of the adhesive tape of the 14th-18th invention of this application uses (a) winding reel 17 as it is, and replaces the adhesive tape of which the winding of the used adhesive tape 1 is few, When the new adhesive tape and the winding reel 17 are connected, and (b) the winding of the used adhesive tape 1 as the winding reel 17 uses only a few adhesive tapes, the new adhesive tape and the winding There may be a case where the remaining adhesive tape is connected.

In the case of (b), as shown in FIG. 16A, when the end mark 28 is exposed to the adhesive tape 1 of the reel 3a, in order to replace the reel 3a with a new adhesive material reel 3, The end portion 30 of the adhesive tape (one adhesive tape) 1 of the reel 3a and the start end 32 of the adhesive tape (the other adhesive tape) wound on the new adhesive reel 3 are connected. .

As shown in FIG. 16B, the connection of this adhesive tape 1 is the beginning of the end part 30 of the adhesive tape 1 of the adhesive reel 3a, and the beginning of the adhesive tape 1 of the new adhesive reel 3. As shown in FIG. The part 32 is abutted, the silicone adhesive tape 60 is affixed over the surfaces of both silicon-treated base materials 9 'of both adhesive tapes 1, and both adhesive tapes 1 are connected.

This silicone adhesive tape 60 is comprised from the base material 63 and the silicone adhesive 62 apply | coated to the single side | surface of the base material 63. As shown in FIG. Although the material of the base material 63 is not specifically limited, In this embodiment, it is a polyimide resin material. Moreover, in FIG. 16B, the adhesive material 11 of the adhesive tape and the adhesive part 43 of the silicone adhesive tape 60 are shown with the diagonal line, respectively.

Here, the adhesion by the silicone adhesive tape 60 will be described. In the adhesive tape 1 of one side and the other side, since both silicone processing bases 9 'were each coated with silicone, adhesion by the adhesive material is difficult, but in this embodiment, the silicone adhesive tape 60 By using a silicone resin as the pressure-sensitive adhesive 43, the end portion 30 of one adhesive tape 1 is made by reducing the difference in the surface tension with both silicon-treated substrates 9 'and bringing it into close contact (adhesion). And the start end 32 of the adhesive tape 1 on the other side are satisfactorily connected. The difference in the surface tension between the surface of the silicone adhesive 62 and the surfaces of both silicon-treated substrates 9 'in the silicone adhesive tape 60 is preferably 10 mN / m (10 dyne / cm) or less. In the form of, there is little difference in surface tension.

In general, the surface tensions of the end portions 30 of one adhesive tape 1 and both silicon-treated substrates 9 'of the other adhesive tape 1 are 25 mN / m to 60 mN / m (25 to 60 dyne). / cm) and, for example, when the surface tension is 30 mN / m, the surface tension of the silicone adhesive 62 in the silicone adhesive tape 60 is set to 20 mN / m or more and 40 mN / m or less.

The silicone pressure sensitive adhesive is mainly composed of a silicone gum and a silicone resin, and condensation reaction of both is performed to express the adhesiveness. Furthermore, the glass transition temperature is -100 by crosslinking by a hydrosilylation reaction with a peroxide and a platinum catalyst. It is common to set it as below. These are commercially available and can be used suitably.

Thus, using the adhesive tape 60, the adhesive tape 1 wound around the used adhesive reel 3a and the adhesive tape 1 wound on the new adhesive reel 3 are connected. Next, the used adhesive reel 3a and the new adhesive reel 3 are replaced, and the new adhesive reel 3 is attached to the adhesive device 15. Therefore, the adhesive tape 1 of the new adhesive reel 3 is taken out, and the adhesive tape 1 is mounted on the winding reel 17, or the new adhesive tape 1 is hung on the guide 36 of the adhesive device 15. Since no work is required, the work efficiency of replacing the adhesive material reels 3 and 3a is good. Thus, since the terminal part 30 of the adhesive material tape 1 which unwinding is complete | finished and the start end part 32 of the adhesive material tape 1 which are newly attached are connected with a silicone adhesive tape, connection is easy.

Next, the used reel 3a and the new reel 3 are replaced, and the new reel 3 is attached to the bonding apparatus 15. Therefore, the work which attaches the adhesive tape 1 newly to the winding reel 17 is unnecessary.

By using the winding reel 17 of (a) as it is, replacing the adhesive tape which is still left of the used adhesive tape 1 with a new adhesive tape, and connecting the new adhesive tape and the winding reel 17 In the case, when the end mark 28 of the adhesive tape 1 of the used reel 3a is exposed, the vicinity of the end mark 28 of the adhesive tape 1 is cut off to the winding reel 17 side. The end portion 30 of the remaining adhesive tape is brought into contact with the start end 32 of the adhesive tape 1 of the new adhesive reel 3. Then, the end portion 30 of the adhesive tape 1 and the start end portion 32 of the adhesive tape 1 of the new adhesive material reel 3 are connected to each other by using a silicone adhesive tape. Since only the base material 9 is wound by the winding reel 17, since some of the adhesive material reels can be wound, the frequency | count of replacement of the winding reel 17 can be reduced, and work efficiency is favorable.

Next, with reference to FIG. 5, the manufacturing method of the adhesive tape 1 which concerns on this embodiment is demonstrated.

The coater 27 is applied to the base material (separator) wound from the unwinder 25, and the adhesive material in which the resin and the conductive particles are mixed is applied, dried in the drying furnace 29, and the disk is wound up in the winder 31. . After the raw material of the wound adhesive tape is cut into a predetermined width by the slitter 33 and wound around the core, the side plates 7 are mounted on both sides of the core, or wound around the core with the side plates, and together with the dehumidifying material. It is packed and is preferably controlled at low temperature (-5 ° C to -10 ° C) and released.

Next, another embodiment of the fourteenth to eighteenth inventions of the present application will be described. However, in the embodiments to be described below, the same reference numerals are assigned to the same parts as the above-described embodiments, and the detailed description of those parts is given. Will be omitted, and differences from the above-described embodiment will mainly be described.

In the second embodiment shown in FIG. 17, in addition to the above-described first embodiment, the adhesive material between the end portion 30 of one adhesive tape 1 and the start end 32 of the other adhesive tape ( 11) The silicone adhesive tape 60 is also adhered to the surface side. The adhesive force of the silicone adhesive 62 of the silicone adhesive tape 60 in this 2nd Embodiment is 100 g / 25 mm or more, and is 700 g / 25 mm-1400 g / 25 mm in this embodiment. In addition, the surface tension of the silicone adhesive 62 in the silicone adhesive tape 60 is 10 mN / different from the surface tension of the silicone substrate in one and the other adhesive tapes as in the above-described embodiment. m (10 dyne / cm) or less. In this second embodiment, since both sides of the end portion 30 of one adhesive material tape 1 and the start end portion 32 of the other adhesive material tape are bonded with the silicone adhesive tape 60, Both adhesive tapes 1 can be bonded with higher strength than in the first embodiment.

In the 3rd Embodiment shown in FIG. 18, the terminal part 30 of one adhesive material tape 1 and the starting end part 32 of the other adhesive material tape 1 are piled up, and the silicone processing base material 9 ') The silicone adhesive tape 60 according to the second embodiment is adhered to the side surface and the adhesive member 11 side surface. According to the third embodiment, the same effects as in the second embodiment can be obtained. .

In the fourth embodiment shown in FIG. 19, a silicone pressure-sensitive adhesive is formed on both surfaces of a substrate between the end portion 30 of one adhesive material tape 1 and the start end portion 32 of the other adhesive material tape 1. The end part 30 and the start end part 32 are connected through the silicone adhesive tape 61 which apply | coated 62. According to this fourth embodiment, by using the double-sided silicone adhesive tape 61, the end portion 30 of one adhesive tape 1 and the start end portion of the other adhesive tape 1 are further reduced. The connection with (32) can be simple and easy.

Next, the 19th to 21st inventions of the present application will be described.

The present invention relates to an adhesive tape for electrically connecting electronic components and circuit boards or circuit boards and electrically connecting both electrodes, and more particularly, to a method for connecting an adhesive tape wound in a reel shape.

Next, the background art of the 19th to 21st inventions of the present application will be described.

In general, electronic components such as liquid crystal panels, plasma display panels (PDPs), fluorescent display (EL) panels, bare chip mounting, circuit boards, and circuit boards are adhesively fixed to each other and electrically connected to both electrodes. , Adhesive tape is used.

Japanese Patent Laid-Open No. 2001-284005 discloses winding up an adhesive tape coated with an adhesive on a substrate in a reel form.

The conventional adhesive tape of this kind has a width of about 1 to 3 mm, and a length of the tape wound on a reel is about 50 m.

When attaching an adhesive tape to an adhesive apparatus, an adhesive tape reel (henceforth simply called "adhesive reel") is attached to an adhesive apparatus, the lead end of an adhesive tape is taken out, and it is attached to a winding reel. And the adhesive material is crimped | bonded by a heating press head from the base material side of the adhesive material tape unwound from the adhesive material reel to a circuit board etc., and the remaining base material is wound up by the winding reel.

When the adhesive tape of the adhesive reel is finished, the finished reel and the winding reel winding the base material are removed, a new winding reel and a new adhesive reel are attached to the adhesive device, and the beginning of the adhesive tape is attached to the winding reel. have.

Moreover, with the recent increase in the size of panel screens in PDPs and the like, the adhesive area of circuit boards has increased, and the amount of adhesive materials used at one time has increased. In addition, since the use of the adhesive material has also been expanded, the amount of the adhesive material used has increased. For this reason, in the manufacturing plant of an electronic device, there is a problem that the frequency of replacement of the adhesive reel increases, and the effort for exchanging the adhesive reel is not improved, thereby improving the production efficiency of the electronic device.

For this problem, it is considered to increase the amount of adhesive material per reel and to reduce the reel exchange frequency by increasing the number of turns of the adhesive tape wound on the reel, but the number of turns is small because the tape width of the adhesive tape is narrow to 1 to 3 mm. If you increase a lot of things, there is a risk of the disheveled dish. In addition, increasing the number of turns increases the pressure acting on the adhesive tape wound on the tape, which may cause the adhesive to seep from both widths of the tape and cause blocking.

In addition, when the number of turns of the adhesive tape is increased, the diameter dimension of the reel also increases, and it is difficult to attach to the existing adhesive apparatus, and there is a possibility that the conventional adhesive apparatus cannot be used.

Accordingly, the inventions of the nineteenth to twenty-first aspects of the present application can provide a method of connecting an adhesive tape that can easily replace an adhesive reel and can improve the production efficiency of an electronic device.

EMBODIMENT OF THE INVENTION Next, although embodiment of 19th-21st invention of this application is described referring an accompanying drawing, 19th-21st application of this application with reference to FIGS. 20A-20C, FIG. 21, FIG. 4, and FIG. The first embodiment of the invention will be described. 20A to 20C are views showing a connection method of the adhesive tape according to the present embodiment, FIG. 20A is a perspective view showing the connection between the adhesive material reels, and FIGS. 20B and 20C are a connection method of the connection portion in FIG. 20A. It is sectional drawing which shows.

The adhesive tape 1 is wound on the reels 3 and 3a, respectively, and the reel 3 and 3a is provided with the side plate 7 arrange | positioned at both width sides of the core 5 and the adhesive tape 1, respectively.

The adhesive tape 1 is comprised from the base material 9 and the adhesive material 11 apply | coated to one side surface of the base material 9.

Although the base material 9 uses OPP (stretched polypropylene), polytetrafluoroethylene, silicone-treated PET (polyethylene terephthalate) etc. from the surface of the peeling property of the adhesive material which comprises an anisotropically conductive material, it restrict | limits to these It doesn't happen.

As the adhesive 11, a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin and a hot melt system are used. Typical examples of such resins include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, vinyl ester resins, acrylic resins, and silicone resins as thermosetting resins.

The conductive particles 13 are dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like, and polymer core materials such as non-conductive glass, ceramics, and plastics. The above conductive layer may be formed by coating or the like. Moreover, the insulation coating particle | grains formed by coating the above-mentioned electrically conductive particle with the insulating layer, the combination of electrically conductive particle and insulating particle, etc. are also applicable. Forming a conductive layer on a hot melt metal such as solder or a polymer core material such as plastic has deformability by heating pressurization or pressurization, the distance between electrodes after connection decreases, and the contact area with the circuit increases during connection. It is preferable because the solution reliability is improved. In particular, when the polymers are used as the nucleus, the melting point is not shown as in the solder, and thus the softening state can be widely controlled at the connection temperature, and the connection member can be easily obtained to cope with variations in the thickness and flatness of the electrode.

Next, the usage method of the adhesive tape which concerns on this embodiment is demonstrated. As shown in FIG. 21, the reel 3a of the adhesive tape 1 and the winding reel 17 are attached to the adhesive device 15, and the tip of the adhesive tape 1 wound on the reel 3a is guide pin. It hangs on (22), it is attached to the winding reel 17, and the adhesive tape 1 is pulled out (arrow E in FIG. 21). And the adhesive tape 1 is arrange | positioned on the circuit board 21, the adhesive tape 1 is press-contacted from the base material 9 side by the heating press head 19 arrange | positioned between both reels 3 and 17, The adhesive material 11 is pressed onto the circuit board 21. Then, the base material 9 is wound up by the winding reel 17.

After the above-mentioned crimping (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are aligned and connected. In this connection, as shown in FIG. 4, the wiring circuit (or electronic component) 23 is arrange | positioned to the adhesive material 11 crimped | bonded to the circuit board 21, and as needed, for example, polytetrafluoro; The wiring circuit 23 is heated and pressurized by the heating pressurizing head 19 via the ethylene material 24 to the circuit board 21. As a result, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 are connected.

The PDP using the adhesive tape 1 according to the present embodiment has a large size, which may be compressed over the entire periphery of the PDP, there are many connecting portions, and the adhesive material 11 is an adhesive material 11 used at one time. ) Is significantly increased compared to the prior art. Therefore, the usage-amount of the adhesive tape 1 wound on the reel 3a also increases, and the adhesive tape 1 wound on the reel 3a is wound on the winding reel 17 in a relatively short time and wound on the reel 3a. The end mark 28 of the tape 1 is exposed (see FIG. 20A).

As for the connection method of the adhesive tape of the 19th-21st invention of this application, (a) the winding reel 17 is used as it is, the used adhesive tape 1 replace | exchanges the adhesive tape which few leaves are left, When the new adhesive tape and the winding reel 17 are connected, and (b) the winding of the used adhesive tape 1 as the winding reel 17 uses only a few adhesive tapes, the new adhesive tape and the winding There may be a case where the remaining adhesive tape is connected.

In the case of (b), as shown in FIG. 20A, when the end mark 28 is exposed to the adhesive tape 1 of the reel 3a, in order to replace the reel 3a with a new adhesive reel 3, End portion 30 of the adhesive tape (one adhesive tape) 1 of the reel 3a and the start end 32 of the adhesive tape (the other adhesive tape) 1 wound on the new adhesive reel 3. Is connected using the resin adhesive 64.

As the resin adhesive 64, for example, epoxy resin, cyanate resin, bismaleimide resin, phenol resin, urea resin, melamine resin, alkyd resin, acrylic resin, unsaturated polyester resin, diallyl phthalate resin, silicone resin, Resorcinol formaldehyde resin, xylene resin, furan resin, polyurethane resin, ketone resin, triallyl cyanurate resin, etc. are mentioned.

As shown in FIG. 20B, the connection of this adhesive tape 1 is the beginning of the end part 30 of the adhesive tape 1 of the adhesive reel 3a, and the beginning of the adhesive tape 1 of the new adhesive reel 3. As shown in FIG. About the part 32, the adhesive material 11 surface of the start end part 32 overlaps with the base material 9 surface of the terminal part 30. As shown in FIG. And the paste-form resin adhesive 64 is apply | coated to the overlapped part from the charger 65 assembled to the bonding apparatus 15. Then, as shown in FIG. As shown in Fig. 20C, when the resin adhesive 64 is a thermosetting resin by heating of the heater 66 assembled in the bonding apparatus 15, the end portion of the adhesive tape 1 is cured by curing it. 30 and the start end 32 of the adhesive tape 1 of the new adhesive reel 3 are connected.

Thereby, the adhesive tape 1 wound on the used reel 3a and the adhesive tape 1 wound on the new reel 3 are connected. Thus, since the terminal part 30 of the adhesive material tape 1 which unwinding | finished and the start-end part 32 of the adhesive material tape 1 which are newly attached are fixed by the resin adhesive material 64, connection is easy.

Next, the used reel 3a and the new reel 3 are replaced, and the new reel 3 is attached to the bonding apparatus 15. Therefore, the work which attaches the adhesive tape 1 to the winding reel 17 is unnecessary.

By using the winding reel 17 of (a) as it is, replacing the adhesive tape which is still left of the used adhesive tape 1 with a new adhesive tape, and connecting the new adhesive tape and the winding reel 17 In the case, when the end mark 28 of the adhesive tape 1 of the used reel 3a is exposed, the end mark 28 vicinity of the adhesive tape 1 is cut off and left on the winding reel 17 side. The end part 30 of the adhesive tape overlaps with the start end 32 of the adhesive tape 1 of the new adhesive reel 3. Then, the paste-like resin adhesive 64 is applied to the overlapped portions, and the terminal 30 and the new adhesive material are heated, irradiated with ultraviolet rays, or the like so as to exhibit an adhesive force according to the type of resin adhesive used. The start end 32 of the adhesive tape 1 of the reel 3 is connected. Since only the base material 9 is wound by the winding reel 17, since some of the adhesive material reels can be wound, the frequency | count of replacement of the winding reel 17 can be reduced, and work efficiency is favorable.

Here, with reference to FIG. 5, the manufacturing method of the adhesive tape 1 which concerns on this embodiment is demonstrated.

The coater 27 is applied to the base material (separator) uncoiled from the unwinder 25, and the adhesive material 11 in which the resin and the conductive particles 13 are mixed is applied, dried in the drying furnace 29, and then wound up ( 31) wind the disc. After the disk of the wound adhesive tape is cut into the predetermined width by the slitter 33 and wound up to the core, the side plate 7 is attached to the core from both sides, or the core of the side plate attached to the core is wound together with the dehumidifying material. It is packed and is preferably released at a low temperature (-5 ° C to -10 ° C).

19th-21st invention of this application is not limited to embodiment mentioned above, A various deformation | transformation is possible in the range which does not deviate from the summary of 19th-21st invention of this application.

In this embodiment, although the thermosetting resin was used as the resin adhesive 64, the photocurable resin is hardened | cured by light irradiation, such as an ultraviolet-ray, using photocurable resin instead of a thermosetting resin, and an adhesive tape ( 1) You may make mutual connection.

In this case, as a photocurable resin, the epoxy resin containing the composition which mix | blended the photoinitiator with resin which has an acrylate group or a methacrylate group, and photocuring agents, such as aromatic diazonium salt, diallyl iodonium salt, a sulfonium salt, and the like. Etc. can be used.

As the resin adhesive, a hot melt adhesive mainly composed of ethylene vinyl acetate resin or polyolefin resin may be used. For example, in the case of a sheet-like hot melt adhesive, a sheet-like hot melt adhesive is wound around a portion where the adhesive tapes 1 overlap. After the hot melt adhesive is heated and melted by the heater 66, the hot melt adhesive is solidified by cooling, and the adhesive tapes 1 are connected to each other.

The resin adhesive used for the connection of the adhesive tape 1 may be used in plural from the group of thermosetting resins, photocurable resins and hot melt adhesives.

In the above-described embodiment, the base 9 surface of the end portion 30 of the adhesive tape 1 of the adhesive reel 3a and the start end 32 of the adhesive tape 1 of the new adhesive reel 3 are formed. Although the surface of the adhesive material 11 of () was overlapped and the thermosetting resin which is a resin adhesive material was apply | coated and connected, the edge part 30 of the adhesive tape 1 of the adhesive material reel 3a was reversed, and the surfaces of the adhesive material 11 surfaces were reversed. After laminating | stacking both on top of each other, you may fix with a thermosetting resin.

Next, the invention described in the forms A to C of the present invention will be described.

The present invention relates to an adhesive tape for electrically connecting electronic components and circuit boards or circuit boards and electrically connecting both electrodes, and more particularly, to an adhesive tape reel and an adhesive device wound in a reel shape.

Next, the background art of the invention described in the form A-C of this invention is demonstrated.

In general, electronic components such as liquid crystal panels, plasma display panels (PDPs), fluorescent display (EL) panels, bare chip mounting, and the like are bonded and fixed to circuit boards and circuit boards, and are electrically connected to both electrodes. , Adhesive tape is used.

Japanese Patent Laid-Open No. 2001-284005 discloses winding up an adhesive tape coated with an adhesive on a substrate in a reel form.

The conventional adhesive tape of this kind has a width of about 1 to 3 mm, and a length of the tape wound on a reel is about 50 m.

When attaching the adhesive tape to the adhesive apparatus, an adhesive tape reel wound around the adhesive tape is attached to the adhesive apparatus, the beginning end of the adhesive tape is taken out, and installed on the winding reel. And the adhesive material is crimped | bonded by a heating press head from the base material side of the adhesive material tape unwound from the adhesive material tape reel, a circuit board etc., and the remaining base material is wound up by the winding reel.

And when the adhesive tape of one adhesive tape reel is complete | finished, the finished reel and the winding reel which wound the base material are removed, a new winding reel and a new adhesive tape reel are attached to an adhesive device, and the beginning of an adhesive tape is wound up. I install it in a reel.

However, with the recent increase in the size of panel screens in PDPs and the like, the adhesion area of circuit boards has increased, and the amount of adhesive materials used at once has increased. In addition, since the use of the adhesive material has also been expanded, the amount of the adhesive material used has increased. For this reason, there exists a problem that the manufacturing frequency of an electronic device increases the frequency of replacement of an adhesive tape reel, and since the trouble of exchanging adhesive tape reels increases, the production efficiency of an electronic device is not aimed at.

In response to such a problem, it is considered to increase the amount of adhesive material per reel and to reduce the reel exchange frequency by increasing the number of turns of the adhesive tape wound on the reel. However, since the tape width of the adhesive tape is narrow to 1 to 3 mm, the number of turns If you increase a lot of things, there is a risk of the disheveled dish. In addition, increasing the number of turns increases the pressure acting on the adhesive tape wound on the tape, which may cause the adhesive to seep from both widths of the tape and cause blocking.

Moreover, when the number of turns of the adhesive tape is increased, the diameter dimension of the reel is also increased, and it is difficult to attach to the existing adhesive apparatus, and there is a fear that the conventional adhesive apparatus cannot be used.

Therefore, the invention described in the A to C aspects of the present invention is intended to provide an adhesive tape reel and an adhesive device that can easily replace an adhesive tape reel and can improve the production efficiency of an electronic device.

EMBODIMENT OF THE INVENTION Next, although embodiment of this invention described in the A-C form of this invention is described, referring an accompanying drawing, First, it is made with reference to FIGS. 22A-22C, FIG. 23, FIG. 4, and FIG. A first embodiment of the invention of 24 will be described. 22A to 22C are views showing an adhesive tape reel according to the first embodiment, FIG. 22A is a perspective view showing an adhesive tape reel, FIG. 22B is a front view in FIG. 22A, and FIG. 22C is a view in FIG. 22A. Fig. 23 is a schematic view showing a crimping step of the adhesive material in the bonding apparatus.

As shown to FIG. 22A, the adhesive tape reel A which concerns on this embodiment is equipped with the winding parts (hereafter winding) 2, 2a of several adhesive material tapes, and the winding parts 2, 2a are reels. Adhesive tape 1 is wound around 3 and 3a, respectively. Each reel 3, 3a is provided with side plates 7 disposed on both width sides of the core 5 and the adhesive tape 1. As shown in FIG. 23, the adhesive tape 1 is comprised from the base material 9 and the adhesive material 11 apply | coated to one side surface of the base material 9. As shown in FIG.

Among the plurality of windings 2, 2a, the adhesive tape wound on the other end portion 30 of the adhesive tape (hereinafter, one adhesive tape) 1 wound on one winding portion 2 (the other winding tape) (hereinafter, the other The connection tape 41 which connects both is provided between the start end part 32 of the adhesive tape 1 of this side. The connection tape 67 is disposed from the end portion 30 of one adhesive tape 1 over the inner side surface of the side plate 7 of the reel 3, and is cut and broken at an upper portion of the side plate 7. Locked to (68), it is connected to the start end 32 of the adhesive tape 1 on the other side.

In addition, marks 69 and 70 for recognizing the connection tape 67 are attached to the connection portion between the one and the other adhesive tape 1 and the connection tape 67, and the tape detection means (light emitting part) is provided. When the marks 69 and 70 are detected by the 71 and the light receiving portion 72, the connecting tape 67 is skipped so as not to be crimped at the connecting tape 67.

As the base material 9, OPP (stretched polypropylene), polytetrafluoroethylene, silicone-treated PET (polyethylene terephthalate) and the like are used in view of strength and peelability of the adhesive material constituting the anisotropic conductive material, but are not limited thereto. It is not.

As the adhesive material 11, a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin and a hot melt system are used. Typical examples of such resins include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, vinyl ester resins, acrylic resins, and silicone resins as thermosetting resins.

The conductive particles 13 are dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like, and polymer core materials such as non-conductive glass, ceramics, and plastics. The above conductive layer may be formed by coating or the like. Moreover, the insulation coating particle | grains formed by coating the above-mentioned electrically conductive particle with the insulating layer, the combination of electrically conductive particle and insulating particle, etc. are also applicable. Forming a conductive layer on a hot melt metal such as solder or a polymer core material such as plastic has deformability by heating pressurization or pressurization, the distance between electrodes after connection decreases, and the contact area with the circuit increases during connection. It is preferable because the solution reliability is improved. Particularly, when polymers are used as the nucleus, since melting point does not appear like solder, the softening state can be controlled widely at the connection temperature, and a connection member which is easy to cope with variations in the thickness and flatness of the electrode can be obtained. .

Next, the usage method of the adhesive tape reel A which concerns on this embodiment is demonstrated. As shown in FIG. 23, the adhesive tape reel A and the winding reel 17 are attached to the bonding apparatus 15, and the starting end 32 of one adhesive tape 1 is attached to the guide pin 22. As shown in FIG. It is attached to the winding reel 17, and the adhesive tape 1 is pulled out (arrow E in FIG. 23). And the adhesive tape 1 is arrange | positioned on the circuit board 21, the adhesive tape 1 is press-contacted from the base material 9 side by the heating press head 19 arrange | positioned between both reels 3 and 17, The adhesive material 11 is pressed onto the circuit board 21. Then, the base material 9 is wound up by the winding reel 17.

After the above-mentioned crimping (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are aligned and connected. In this connection, as shown in FIG. 4, the wiring circuit (or electronic component) 23 is arrange | positioned to the adhesive material 11 crimped | bonded to the circuit board 21, and as needed, for example, polytetrafluoro; The wiring circuit 23 is heated and pressurized by the heating pressurizing head 19 via the ethylene material 24 to the circuit board 21. As a result, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 are connected.

The PDP using the adhesive tape 1 according to the present embodiment has a large size, which may be compressed over the entire periphery of the PDP, and there are many connecting portions, and the adhesive material 11 is an adhesive material 11 used at one time. ) Is significantly increased compared to the prior art. Therefore, the usage-amount of the adhesive tape 1 wound on the reel 3 also increases, and the adhesive tape 1 wound on the reel 3 is wound up by the winding reel 17 in a comparatively short time.

When the unwinding of one adhesive tape 1 is finished, the connecting tape 67 is peeled off from the cut and broken portion 68, and the other adhesive tape 1 is subsequently fed out. In this embodiment, since the connection tape 67 which connects both is provided between the terminal part 30 of one adhesive material tape 1, and the start end part 32 of the other adhesive material tape 1, it is provided. When the unwinding of one adhesive tape 1 is finished, the feeding of the other adhesive tape 1 can be started continuously. Therefore, after the unwinding of one adhesive tape 1 is completed, the work of installing the new adhesive tape 1 on the winding reel 17 becomes unnecessary, and the production efficiency of the electronic device is increased.

In addition, the bonding apparatus 15 is provided with a pair of light emitting part 71 and the light receiving part 72, as shown in FIG. 23, and optically detects the connection tape 67. As shown in FIG. Black marks 69 and 70 are attached to both ends of the connecting tape 67 connecting both the adhesive tape 1 on the one side and the adhesive tape 1 on the other side. The light emitting part 71 emits laser light continuously toward the adhesive tape 1, the light receiving part 72 receives the reflected light, and transmits the detection signal to the control apparatus 79. FIG. And the light receiving part 72 receives the reflected light of the marks 69 and 70 of the both ends of the connection tape 67, and the detection signal is sent to the control apparatus 79. FIG.

The control device 79 that has received the detection signal outputs a control signal to the motor that drives both reels 3 and 17 of the bonding device 15 and starts outputting the drive pulse to the motor through the motor driver. . Then, the motor rotates in accordance with the number of pulses applied from the motor driver, and the adhesive tape 1 is moved by a distance corresponding to the length of the connecting tape 67 while moving the reels 3 and 17 at a speed faster than the normal speed. Move in the direction of unwinding.

As a result, the other adhesive tape 1 is automatically fed to the position of the heating press head 19, so that the start end 32 of the other adhesive tape 1 is The time for feeding out the connecting tape 67 can be saved until it is in position.

In addition, since only the base material 9 is wound around the winding reel 17, some of the adhesive tape reel can be wound, so that the number of replacements of the winding reel 17 can be reduced, resulting in good work efficiency.

Here, with reference to FIG. 5, the manufacturing method of the adhesive tape reel A which concerns on this embodiment is demonstrated.

The coater 27 is applied to the base material (separator) wound from the unwinder 25, and the adhesive material in which the resin and the conductive particles are mixed is applied, dried in the drying furnace 29, and the disk is wound up in the winder 31. . After the raw material of the wound adhesive tape is cut into the predetermined width by the slitter 33 and wound around the core, the side plates 7 are mounted on both sides of the core, or wound around the core with the side plates, and together with the dehumidifying material. It is packed and is preferably controlled at low temperature (-5 ° C to -10 ° C) and released.

Next, another embodiment of the invention described in embodiments A to C of the present invention will be described. However, in the embodiment to be described below, the same reference numerals are assigned to the same parts as the above-described embodiments, and the details thereof will be described. The description will be omitted, and the following will mainly describe differences from the above-described embodiment.

In the second embodiment shown in FIG. 24, the connecting tape 67 is recognized by making the width T of the connecting tape 67 narrower than the width W of the front and rear adhesive tape 1. In the bonding apparatus 15, the same light emitting portion and the light receiving portion as those of the first embodiment are provided at opposite positions of the adhesive tape 1. In this case, the light receiving portion receives the laser light transmitted through the narrow portion of the connection tape 67 to recognize the connection tape 67.

In the third embodiment shown in FIG. 25, a plurality of holes 53 are formed in the connecting tape 67 to recognize the connecting tape 67. Also in this case, the light receiving part receives the laser light transmitted through the hole 53 of the connection tape 67, thereby recognizing the connection tape 67.

In 4th Embodiment shown in FIG. 26, when unwinding of the one adhesive material tape 1 is complete | finished without connecting the adhesive material tapes 1 with a connection tape 67, the other adhesive material tape 1 is carried out. Is wound around the winding reel 17, and the adhesive tape 1 is replaced. Also in this case, since the attachment of the new adhesive tape reel to the adhesive device is unnecessary, the replacement work of the new adhesive tape reel takes less, and the production efficiency of the electronic device is increased.

The invention described in the A to C embodiments of the present invention is not limited to the embodiment described above, and various modifications can be made without departing from the gist of the invention described in the A to C embodiments of the present invention.

For example, in the above-described first and second embodiments, there may be any number of windings 2 and 2a without particular limitation.

In the first to third embodiments, the connecting tape 67 is optically detected. Alternatively, the magnetic tape may be wound around the connecting tape 67 to detect the magnetic tape.

Next, the D, E and F forms of the present invention to the twenty-eighth invention of the present application will be described.

These inventions relate to an adhesive tape for electrically fixing electronic components and circuit boards or circuit boards, and electrically connecting both electrodes. The present invention also relates to an adhesive tape used in a semiconductor device for bonding and fixing a semiconductor substrate (chip) to a support substrate for fixing a lead frame, a die of a lead frame, and a support substrate for mounting a semiconductor element, and in particular, an adhesive tape wound in a reel shape. A method of connecting a reel, an adhesive device, and an adhesive tape.

Next, the background art of D, E, and F forms of the present invention to the twenty-eighth invention of the present application will be described.

Generally, electronic components such as liquid crystal panels, plasma display panels (PDPs), fluorescent display (EL) panels, bare chip mounting, circuit boards, and circuit boards are adhesively fixed and electrically connected to both electrodes. , Adhesive tape is used. Moreover, adhesive tape is used for adhesive films, such as a lead fixing tape of a lead frame, a LOC tape, a die-bonding tape, a microBGA and a CSP, etc., and is used in order to improve the productivity and reliability of the whole semiconductor device.

Japanese Patent Laid-Open No. 2001-284005 discloses winding up an adhesive tape coated with an adhesive on a substrate in a reel form.

The conventional adhesive tape for electrode connection of this kind is about 1-3 mm in width, and the length of the tape wound on a reel is about 50 m.

When attaching the adhesive tape to the adhesive apparatus, an adhesive tape reel wound around the adhesive tape is installed in the adhesive apparatus, the lead end of the adhesive tape is taken out, and the winding reel is installed. And the adhesive material is crimped | bonded by a heating press head from the base material side of the adhesive material tape unwound from the adhesive material tape reel, a circuit board etc., and the remaining base material is wound up by the winding reel.

And when the adhesive tape of one adhesive tape reel is complete | finished, the finished reel and the winding reel which wound the base material are removed, a new winding reel and a new adhesive tape reel are attached to an adhesive device, and the beginning of an adhesive tape is wound up. I install it in a reel.

However, with the recent increase in the size of panel screens in PDPs and the like, the adhesion area of circuit boards has increased, and the amount of adhesive materials used at once has increased. In addition, since the use of the adhesive material has also been expanded, the amount of the adhesive material used has increased. For this reason, the manufacturing frequency of an electronic device has a problem that the frequency of replacement of an adhesive tape reel increases, and since labor takes for exchanging an adhesive tape reel, the improvement of the production efficiency of an electronic device cannot be aimed at.

For this problem, it is considered to increase the amount of adhesive material per reel and to reduce the reel exchange frequency by increasing the number of turns of the adhesive tape wound on the reel, but since the tape width of the adhesive tape is narrow to 1 to 3 mm, If you increase the number of turns, there is a risk that the wound of the winding may occur. In addition, increasing the number of turns increases the pressure acting on the adhesive tape wound on the tape, which may cause the adhesive to seep from both widths of the tape and cause blocking.

Furthermore, if the number of turns of the adhesive tape is increased, the diameter dimension of the reel also increases, and it is difficult to attach to the existing adhesive device, and there is a fear that the existing adhesive device cannot be used.

Therefore, the D, E and F forms of the present invention to the twenty-eighth invention of the present application can be easily replaced with an adhesive tape reel, and an adhesive tape reel, an adhesive apparatus, and the like, which can improve the production efficiency of an electronic device. To provide a connection method.

Next, with reference to the accompanying drawings, embodiments D, E and F of the present invention and embodiments of the twenty-eighth invention of the present application will be described. First, FIGS. 27A to 27C, 28, 4, 29, and 5 will be described. D, E, and F forms of the present invention and the first embodiment of the twenty-eighth invention of the present application will be described with reference to. 27A to 27C are views showing an adhesive tape reel according to the first embodiment, FIG. 27A is a perspective view showing an adhesive tape reel, FIG. 27B is a front view in FIG. 27A, and FIG. 27C is a view in FIG. 27A. It is sectional drawing of a connection part, FIG. 28 is a schematic diagram which shows the crimping | compression-bonding process of the adhesive material in a bonding apparatus, and FIG. 29 is a perspective view which shows the use state of the adhesive material in a PDP.

The adhesive tape reel A according to the present embodiment includes windings (hereinafter referred to as windings) 2 and 2a of the plurality of adhesive tapes 1, and the windings of the adhesive tapes are wound on the windings 2 and 2a. (3, 3a) is provided. Each reel 3, 3a is provided with side plates 7 disposed on both width sides of the core 5 and the adhesive tape 1. As shown in FIG. 28, the adhesive tape 1 is comprised from the base material 9 and the adhesive material 11 apply | coated to one side surface of the base material 9. As shown in FIG.

Among the plurality of windings 2 and 2a, the adhesive tape wound around the terminal portion 30 of the adhesive tape (hereinafter, one adhesive tape) 1 and the other winding portion 2a wound on one winding portion 2 ( Hereinafter, the start end part 32 of the other adhesive material tape 1 is connected using the latching | hanging tool 76. As shown in FIG. The locking strip 76 is, for example, a cross-shaped locking pin having a substantially U-shape, and overlaps the end portion 30 of one adhesive tape 1 with the start end 32 of the other adhesive tape 1. The retaining pin is inserted in the overlapped portion to connect the two.

Further, in the present embodiment, the connecting portion 74 is connected to the termination portion 30 and the starting end 32 by the locking mechanism 76, as shown in Fig. 27C, and then the connecting portion 74 is taped. By returning 180 degrees in the longitudinal direction of, the locking zone 76 is covered with the adhesive tape 1.

Although the base material 9 uses OPP (stretched polypropylene), polytetrafluoroethylene, silicone-treated PET (polyethylene terephthalate) etc. from the surface of the peeling property of the adhesive material which comprises an anisotropically conductive material, it restrict | limits to these It doesn't happen.

As the adhesive material 11, a thermoplastic resin, a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin is used. Typical examples of such resins include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, acrylic resins and silicone resins as thermosetting resins.

The conductive particles 13 may be dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like, and / or non-conductive glass, ceramics, plastics, and the like. Of the polymer core material may be formed by coating or the like. Moreover, the insulation coating particle | grains formed by coating the above-mentioned electrically conductive particle with the insulating layer, the combination of electrically conductive particle and insulating particle, etc. are also applicable. Forming a conductive layer on a hot melt metal such as solder or a polymer core material such as plastic has deformability by heating pressurization or pressurization, the distance between electrodes after connection decreases, and the contact area with the circuit increases during connection. It is preferable because the solution reliability is improved. In particular, when the polymers are used as the nucleus, the melting point is not shown as in the solder, and thus the softening state can be widely controlled at the connection temperature, and the connection member can be easily obtained to cope with variations in the thickness and flatness of the electrode.

Next, the usage method of the adhesive tape reel which concerns on this embodiment is demonstrated. As shown in FIG. 28, the adhesive tape reel A and the winding reel 17 are attached to the adhesive device 15, and the start end part 32 of one adhesive tape 1 is wound on the guide pin 22, and wound up. It installs in the reel 17 and draws out the adhesive tape 1 (arrow E in FIG. 28). And the adhesive tape 1 is arrange | positioned on the circuit board 21, the adhesive tape 1 is press-contacted from the base material 9 side by the heating press head 19 arrange | positioned between both reels 3 and 17, The adhesive material 11 is pressed onto the circuit board 21. Then, the base material 9 is wound up by the winding reel 17.

Next, as shown in FIG. 4, the wiring circuit (or electronic component) 23 is arrange | positioned to the adhesive material 11 crimped | bonded to the circuit board 21, and the polytetrafluoroethylene material 24 is interposed as a cushion material. The heating and pressing head 19 heats and presses the wiring circuit 23 to the circuit board 21. As a result, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 are connected.

As shown in FIG. 29, the connection portion of the PDP 26 using the adhesive tape 1 according to the present embodiment, the adhesive material 11 is pressed over the entire circumference of the PDP 26, and the adhesive material used at one time. It is clear that the use amount of (11) is particularly high compared with the prior art. Therefore, the usage-amount of the adhesive tape 1 also increases, and the adhesive tape 1 wound on the reels 3 and 3a is wound up by the winding reel 17 in a comparatively short time.

In this embodiment, when the unwinding of the one adhesive material tape 1 is complete | finished, the connection part 74 is peeled off from the cut-off damage part 75, and the other adhesive material tape 1 is continuously extracted. (FIG. 27B). In this embodiment, since the end part 30 of one adhesive material tape 1 and the start end 32 of the other adhesive material tape 1 are connected to the latching | hanging stop 76, one adhesive material tape ( When the unwinding of 1) ends, the feeding of the other adhesive tape 1 can be started continuously. Therefore, after the unwinding of one adhesive tape 1 is completed, the work of installing the new adhesive tape 1 on the winding reel 17 becomes unnecessary, and the production efficiency of the electronic device is increased. In addition, since the connecting portion 74 covers the locking portion 76 with the adhesive tape 1, the external appearance is good, and the locking portion 76 of the connecting portion 74 is in contact with the adhesive tape 1. The adhesive tape 1 can be prevented from being damaged.

In addition, as shown in FIG. 28, the bonding apparatus 15 is equipped with the thickness detection sensor as the connection part detection sensor 47, optically detects the connection part 74, and the connection part 74 heats and pressurizes. The part of the head 19 is skipped. The connecting portion 74 between one adhesive tape 1 and the other adhesive tape 1 is larger than the thickness of the adhesive tape 1, as shown in Fig. 27C, by detecting the difference in thickness. The connecting portion 74 is recognized. The thickness detection sensor 47 always detects the thickness of the adhesive tape 1, and transmits the detection signal to the control apparatus 79.

Receiving the detection signal, the control device 79 outputs a control signal to the motor that drives both reels 3 and 17 of the bonding device 15, and starts outputting a drive pulse to the motor through the motor driver. . Then, the motor rotates in accordance with the number of pulses applied from the motor driver, and the predetermined distance corresponding to the length of the conveyance direction of the connecting portion 74 while rotating both the reels 3 and 17 at a speed faster than the normal speed. The adhesive tape 1 is moved in the direction in which the adhesive tape 1 is unwound.

Thereby, since the other adhesive tape 1 is conveyed to the position of the heating press head 19, the connection part 74 of one and the other adhesive tape 1 is a position of the heating press head 19. FIG. Can be prevented from being defective. Moreover, since one adhesive tape 1 is automatically wound up to the winding reel 17 until the connection part 41 passes the heating press head 19, the time of winding can be saved.

Further, the adhesive tape 1 is effective if the thickness detecting sensor 47 recognizes the front end portion 41a and the rear end portion 41b of the connecting portion 74 and allows only the connecting portion 74 to be skipped. Can be used.

In addition, since only the base material 9 is wound around the winding reel 17, some of the adhesive tape reel can be wound, so that the number of replacements of the winding reel 17 can be reduced, resulting in good work efficiency.

Here, with reference to FIG. 5, the manufacturing method of the adhesive tape 1 which concerns on this embodiment is demonstrated.

The coater 27 is applied to the base material (separator) wound from the unwinder 25, and the adhesive material in which the resin and the conductive particles 13 are mixed is applied, dried in the drying furnace 29, and then the disc with the winder 31. Winding up. After the raw material of the wound adhesive tape is cut into the predetermined width by the slitter 33 and wound up to the core, the side plates 7 are mounted on both sides of the core, and are packed together with the dehumidifying agent, preferably, at a low temperature. It is controlled and released at (-5 ° C to -10 ° C).

Next, other embodiments of the D, E, and F forms of the present invention to the twenty-eighth aspect of the present invention will be described. In the embodiments described below, the same reference numerals are assigned to the same parts as the above-described embodiment. The detailed description of the part is omitted, and the following will mainly describe differences from the above-described embodiment.

In 2nd Embodiment shown in FIG. 30, the adhesive tape reel 2c provided with one winding part is used, without using the adhesive tape reel A provided with the some winding parts 2 and 2a. In this case, when the adhesive tape 1 is wound on the winding reel 17 and the end mark 28 is exposed on one adhesive tape 1, one adhesive tape reel 2b is replaced with a new adhesive tape reel ( In order to exchange with 2c), the end part 30 of one adhesive material tape 1 and the start end part 32 of the other adhesive material tape 1 are connected.

Also in this case, the connecting portion 74 is detected by the thickness detecting sensor 77 as the connecting portion detecting means, so that the connecting portion 74 skips the portion of the heating press head 19.

D, E, and F forms of the present invention to the twenty-eighth invention of the present application are not limited to the above-described embodiments, and do not deviate from the gist of the D, E and F forms of the present invention to the twenty-eighth aspect of the present application. Many variations are possible in the scope.

For example, in the above-mentioned 1st and 2nd embodiment, the engaging strip 76 which connects adhesive tape 1 comrades is not limited to a latching pin, The elasticity whose cross section is substantially co-shaped in the part in which both overlapped is overlapped. It may be fixed to a deformable clip or a method of connecting the overlapped portions to a metal piece having a substantially U-shaped cross section and pressing the sandwich pieces from both sides of the overlapped portion to connect them.

In the first and second embodiments, the connection portion 74 is recognized by detecting the thickness of the connection portion 74 using the thickness detection sensor 47, but not limited thereto. Transmittance detection The connection portion 74 may be recognized by using a sensor, or the connection portion may be detected by using a CCD camera to accept the surface of the connection portion on a monitor screen and compare shades of pixels.

31A, 31B, and 32A to 32C show the support frame for fixing the lead frame and the semiconductor element, among the support substrate for fixing the lead frame, the support substrate for mounting the semiconductor element, or the adhesive tape connecting the die and the semiconductor element of the lead frame. An example of a LOC (Lead on Chip) structure for bonding and fixing a to a lead frame is shown.

The adhesive tape of the structure of FIG. 31A which adhered to both surfaces of the support film 78, such as the polyimide film which surface-treated with a thickness of 50 micrometers, and the adhesive material layer 80, such as a polyamide-imide-type adhesive material layer with a thickness of 25 micrometers, on both surfaces. By using the above, the semiconductor device of the LOC structure shown in Fig. 31B is obtained. The adhesive tape shown in FIG. 31A is punched into a single step using a punching die 87 (male type (convex portion) 95, female type (concave portion) 96) of the adhesive apparatus shown in FIGS. 32A to 32C. For example, a 0.2 mm-thick inner lead on a lead frame made of an iron-nickel alloy having a thickness of 0.2 mm is brought into contact with each other, pressurized for 3 seconds at a pressure of 3 MPa at 400 ° C., and pressed. To produce. Subsequently, in a separate step, the semiconductor element is pressed onto the adhesive layer surface of the lead frame with an adhesive film for semiconductors for 3 seconds at a pressure of 3 MPa at a temperature of 350 ° C., and then the lead frame and the semiconductor element are wired with gold wires. Bonded and sealed by transfer molding using sealing materials, such as an epoxy resin molding material, and the semiconductor device as shown in FIG. 31B is obtained. In FIGS. 31A and 31B, 81 is an adhesive film for semiconductor punched from adhesive tape, 82 is a semiconductor element, 83 is a lead frame, 84 is an encapsulant, 85 is a bonding wire, and 86 is a bus bar. 32A, 32B, and 32C are adhesive apparatuses, in FIGS. 32A and 32B, 87 is a punching die, 88 is a lead frame conveying portion, 89 is an adhesive tape punching, an attachment portion, 90 is a heater portion, 91 is an adhesive tape reel. (Adhesive tape unwinding part), 92 are adhesive tapes (adhesive film for semiconductors), 93 are adhesive tape unwinding rollers. In Fig. 32C, 94 is an adhesive tape (adhesive film for semiconductor), 95 is a male type (convex portion), 96 is a female type (concave portion), and 97 is a film holding plate. The adhesive tape 92 is continuously unwound from the adhesive tape reel (adhesive tape unwinding portion) 91 and punched in a single step at the adhesive tape punching and attachment portion 89, and adhered to the lead portion of the lead frame, It is conveyed from a lead frame conveyance part as a lead frame with an adhesive film for semiconductors. The punched adhesive tape is taken out from the adhesive tape unwinding roller 93.

In the same manner to the above, the semiconductor element is connected to the support substrate for semiconductor element mounting using an adhesive tape. Similarly, the die of the lead frame and the semiconductor element are connected and bonded. The adhesive tape may be made of only an adhesive material and a case where the adhesive tape is simply adhered and fixed, an adhesive material which electrically connects the electrodes to each other by contact or via conductive particles is used depending on the purpose, and a support film is used.

Next, the twenty-ninth to thirty-fourth inventions of the present application will be described.

These inventions relate to an adhesive tape for electrically connecting electronic components and a circuit board or circuit boards and electrically connecting both electrodes, and in particular, a method for producing an adhesive tape and an adhesive tape wound in a reel shape and The present invention relates to a pressing method of an adhesive tape.

Next, the background art of the twenty-ninth to thirty-fourth inventions of the present application will be described.

In general, electronic components such as liquid crystal panels, plasma display panels (PDPs), fluorescent display (EL) panels, bare chip mounting, circuit boards, and circuit boards are adhesively fixed to each other and electrically connected to both electrodes. , Adhesive tape is used.

Japanese Patent Laid-Open No. 2001-284005 discloses winding up an adhesive tape coated with an adhesive on a substrate in a reel form.

This type of conventional adhesive tape has a width of about 1 to 3 mm, a length of the tape wound on the reel is about 50 m, and the adhesive tape is unwound from the reel once and then pressed again to the circuit board or the like. There is no work.

However, with the recent increase in the size of panel screens in PDPs and the like, the adhesion area of circuit boards has increased, and the amount of adhesive materials used at once has increased. In addition, since the use of the adhesive material has also been expanded, the amount of the adhesive material used has increased. For this reason, in the manufacturing plant of the electronic device mentioned above, the reel which wound the adhesive tape was increased, and since the labor of exchanging a new reel is troublesome, there exists a problem that the improvement of the production efficiency of an electronic device is not aimed at.

For this problem, it is considered to increase the amount of adhesive material per reel and to reduce the reel exchange frequency by increasing the number of turns of the adhesive tape wound on the reel, but the number of turns is small because the tape width of the adhesive tape is narrow to 1 to 3 mm. If you increase the amount of winding, there is a risk of drift of the wound. In addition, increasing the number of turns increases the pressure acting on the adhesive film wound on the tape, which may cause the adhesive to seep from both widths of the tape and cause blocking.

Furthermore, when the number of turns of the adhesive tape is increased, the diameter dimension of the reel is also increased, and it is difficult to attach to the existing adhesive apparatus, and there is a fear that the existing adhesive apparatus cannot be used.

Therefore, the thirty-ninth to thirty-fourth inventions of the present application aim to provide an adhesive tape, a manufacturing method of the adhesive tape, and a pressing method of the adhesive tape, which can increase the amount of adhesive, without increasing the number of turns of the adhesive tape.

Next, an embodiment of the twenty-ninth to thirty-fourth embodiments of the present application will be described with reference to the accompanying drawings. First, the present application will be described with reference to FIGS. 33A, 33B, 3A, 4, 5, and 35. The first embodiment of the twenty-ninth to thirty-fourth inventions will be described. 33A and 33B are views of the adhesive tape, FIG. 33A is a perspective view of a reel wound with the adhesive tape, FIG. 33B is a cross-sectional view taken along AA in FIG. 33A, and FIG. 34 is a perspective view showing the use state of the adhesive material in the PDP. 35 is a cross-sectional view showing a step of applying an adhesive to a substrate.

The adhesive tape 1 according to the present embodiment is wound on the reel 3, and the reel 3 is provided with side plates 7 disposed on both width sides of the core 5 and the adhesive tape 1. In this embodiment, the adhesive tape 1 is about 50 m in length and width W is about 10 mm.

The adhesive tape 1 consists of the base material 9 and the adhesive material 11 apply | coated on the base material 9, and the adhesive material 11 which is 0.5 mm in width of one set is spaced on the base material 9 at intervals. There are five sets.

Although the base material 9 uses OPP (stretched polypropylene), polytetrafluoroethylene, silicone-treated PET (polyethylene terephthalate) etc. from the surface of the peeling property of the adhesive material which comprises an anisotropically conductive material, it restrict | limits to these It is not.

As the adhesive material 11, a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin and a hot melt system are used. Typical examples of such resins include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, vinyl ester resins, acrylic resins, and silicone resins are used as the thermosetting resins.

The conductive particles 13 are dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like, and polymer core materials such as non-conductive glass, ceramics, and plastics. The conductive layer may be formed by, for example, coating or the like. Moreover, the insulation coating particle | grains formed by coating the above-mentioned electrically conductive particle with the insulating layer, the combination of electrically conductive particle and insulating particle, etc. are also applicable. Forming a conductive layer on a hot melt metal such as solder or a polymer core material such as plastic has deformability by heating pressurization or pressurization, the distance between electrodes after connection decreases, and the contact area with the circuit increases during connection. It is preferable because the reliability is improved. Particularly, when the polymers are used as the nucleus, the melting point is not shown as in the solder, and thus the softening state can be widely controlled at the connection temperature, and the connection member which is easy to cope with variations in the thickness and flatness of the electrode is obtained.

Next, the usage method of the adhesive tape which concerns on this embodiment is demonstrated. The reel 3 of the adhesive tape 1 and the empty reel 17 are attached to the adhesive device 15, and the tip of the adhesive tape 1 wound on the reel 3 is attached to the empty reel 17, The adhesive tape 1 is taken out (arrow E in FIG. 3A). And the adhesive tape 1 is arrange | positioned on the circuit board 21, the adhesive tape 1 is press-contacted from the base material 9 side by the heating press head 19 arrange | positioned between both reels 3 and 17. And a pair of adhesives 11 are pressed onto the circuit board. Thereafter, the remaining adhesive 11 is wound around the empty reel 17 together with the substrate 9.

After the above-mentioned crimping (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are aligned and connected. This connection arrange | positions the wiring circuit (or electronic component) 23 to the adhesive material 11 crimped | bonded to the circuit board 21, and if necessary, interposes polytetrafluoroethylene material 24 as a cushion material, for example. The wiring circuit 23 is heated and pressurized by the heating pressurizing head 19 to the circuit board 21. As a result, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 are connected.

As shown in FIG. 34, the connection part of the PDP 26 using the adhesive tape 1 which concerns on this embodiment is adhere | attached over the periphery of PDP, and the usage-amount of the adhesive material 11 used at once is conventionally used Compared to that much. Therefore, the usage-amount of the adhesive tape 1 wound on the reel 3 also increases, the adhesive tape 1 wound on the reel 3 is wound up to the empty reel 17 in a relatively short time, and the reel 3 becomes empty. .

When the reel 3 becomes empty, the reel 3 and the reel 17 are inverted, respectively, to be wound around the hollow reel 3 this time, and the moving direction of the adhesive tape 1 is reversed (Fig. Arrow F of 3A.

In this manner, the winding directions E and F of the adhesive tape 1 are sequentially changed for each pair of the adhesive materials 11, and the adhesive material 11 is pressed onto the circuit board 21.

Here, with reference to FIG. 5 and FIG. 35, the manufacturing method of the adhesive tape 1 which concerns on this embodiment is demonstrated.

The coater 27 is applied to the base material (separator) wound from the unwinder 25, and the adhesive material 11 in which the resin and the conductive particles 13 are mixed is applied and dried in the drying furnace 29, and then the winder 31 Wind the disc with). In the coater 27, as shown in FIG. 35, five coaters 27 are arrange | positioned with respect to the 10 mm width of the base material 9, and five sets of adhesive materials 11 are apply | coated in 10 mm width. The disk of the wound adhesive tape is cut into a predetermined width by the slitter 33 and wound around the core, and the side plates 7 are mounted on both sides of the core, or wound around the core with the side plates, and packed together with the dehumidifying material. It is preferably controlled at low temperature (-5 ° C to -10 ° C) and released.

Next, another embodiment of the twenty-ninth to thirty-fourth inventions of the present application will be described. In the embodiments to be described below, the same reference numerals are assigned to the same parts as the above-described embodiments, and the detailed description of those parts is given. Will be omitted, and differences from the above-described embodiment will mainly be described.

In 2nd Embodiment shown to FIG. 36A-36C, the adhesive material 1 is apply | coated to the adhesive tape 1 by the slit 35 formed in the longitudinal direction of the base material, and the adhesive material is apply | coated to the width | variety W on one side whole surface of a base material. It is separated into a plurality of sets in the width W direction. In the adhesive tape 1 of this second embodiment, the slit 35 immediately after the adhesive tape 1 is pressed onto the circuit board 21 after the reel 3 is attached to the adhesive device 15. It is preferable to form in. In this case, the slit 35 may be formed in the adhesive material 11 of the adhesive tape 1 which is provided by cutting blades in the vicinity of the reel mounting portion of the adhesive device 15 (indicated by S in FIG. 3A). The thing which formed the slit in the finishing process at the time of manufacture of the adhesive tape shown in FIG. 5 may be wound up to the reel, and in a coating process, the slit may be formed just before winding up by the winding machine 31 after drying.

When using the adhesive tape 1 according to the second embodiment in the bonding apparatus 15, in the same manner as in the first embodiment, one set of adhesive materials separated by the slits 35 are heated from the base 9 side. It is crimped | bonded by the pressurizing head 19, and it uses sequentially, as shown to FIG. 36A, 36B, 36C.

In this 2nd Embodiment, since a plurality of sets of adhesive materials 11 can be obtained only by forming the slit 35 in the adhesive material on the base material obtained by the process similar to the conventional thing, manufacture is easy.

In 3rd Embodiment shown to FIG. 37A-37C, the adhesive material 11 is apply | coated to the base material 9 in the whole surface (FIG. 37A), and the width W of the base material 9 and the adhesive material 11 was mentioned above. It is 5 to 1000 mm in the same manner as At the time of use, it is attached to the bonding apparatus 15 in the same manner as in the first embodiment, and the adhesive tape 1 drawn from the reel 3 is placed on the circuit board 21, and the adhesive tape 1 By heating and pressing a portion (one set) of the adhesive in the width W direction (FIG. 37B), the cohesive force of the portion is lowered, and only the adhesive of the heated and pressurized portion is separated from the substrate and pressed onto the circuit board 21. (FIG. 37C).

In this case, a cohesion declining line is formed along the peripheral line of the heat pressurizing head 19, so that most of the heat pressurized portion softens and flows (based on 1000 poise or less), and the curing reaction of the adhesive does not start or is low. It is preferable to set it as the state (20% or less of reaction rate is a reference | standard), and heating temperature is selected according to the adhesive material system to be used.

According to this third embodiment, the adhesive material 11 is softened and fluidized one by one in the width W only at the time of use, so that the adhesive material 11 is pressed against the substrate circuit. Thus, the reel 3 of the adhesive tape 1 is the same as in the above-described embodiment. ) And an empty reel can be used multiple times by electrostatic and inverting.

In addition, as in the above-described embodiment, there is no need to form the slits 35 in the adhesive material 11 or to separate and install the slits 35, and only the adhesive material 11 is applied to the entire surface of one side of the wide base material. It is easy to manufacture an adhesive tape.

The 4th Embodiment shown to FIG. 38A-38C shows another manufacturing method of the adhesive tape which concerns on 1st Embodiment, and provided the slit 98 in the adhesive material 11 apply | coated to the base material 9a. Subsequently (FIG. 38A), the other base material 9b is stuck on the adhesive material 11 so that the adhesive material 11 may be stuck to the base materials 9a and 9b (FIG. 38B). Next, one and the other base materials 9a and 9b are separated so as to be peeled off, and the adhesive material tanks 11a and 11b are arrange | positioned to each base material 9a and 9b by one space | interval. In this fourth embodiment, the adhesive material tanks 11a and 11b are alternately arranged on one side and the other base materials 9a and 9b, so that the adhesive material tanks 11a, By heating and pressurizing 11b) by one space | interval, you may arrange | position to each base material 9a, 9b by filtering out the adhesive material tank 11a, 11b.

The twenty-ninth to thirty-fourth inventions of the present application are not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the twenty-ninth to thirty-fourth aspects of the present application.

For example, in the above-described embodiment, the adhesive 11 may be an insulating adhesive material in which the conductive particles 13 are not dispersed.

In the above-described embodiment, any number of adhesive materials formed on the substrate 9 may be any number, and at least two or more sets may be used.

Next, the thirty-fifth inventions of the present application will be described.

The present invention relates to an adhesive tape, a method for producing an adhesive tape, and a method for compressing an adhesive tape for electrically connecting an electronic component and a circuit board or circuit boards and electrically connecting both electrodes.

Next, the background art of the thirty-fifty-first invention of the present application will be described.

Generally, a method of bonding and fixing electronic components such as liquid crystal panels, plasma display panels (PDPs), fluorescent display (EL) panels, bare chip mounting, circuit boards, and circuit boards to each other, and electrically connecting both electrodes. As the adhesive tape, an adhesive tape is used.

Japanese Patent Laid-Open No. 2001-284005 discloses winding up an adhesive tape coated with an adhesive on a substrate in a reel form.

The conventional adhesive tape of this kind has a width of about 1 to 3 mm, and a length of the tape wound on a reel is about 50 m. In the case where the adhesive material is pressed on the four circumferences of the circuit board, the adhesive tape is taken out along one side of the circuit board, and the adhesive material is squeezed, and the adhesive material is pressed on the four circumferences of the circuit board. It is squeezed.

However, with the recent increase in the size of panel screens in PDPs and the like, the bonding area (circumference of one side) of a circuit board has increased, and the amount of the adhesive used at one time has increased. In addition, since the use of the adhesive material has also been expanded, the amount of the adhesive material used has increased. For this reason, the manufacturing frequency of the electronic device mentioned above has the problem that the frequency of exchange of the reel which wound the adhesive tape becomes large, and since reel replacement takes time, production efficiency of an electronic device is not aimed at.

In response to such a problem, it is considered to increase the amount of adhesive material per reel and to reduce the reel exchange frequency by increasing the number of turns of the adhesive tape wound on the reel. However, since the tape width of the adhesive tape is narrow to 1 to 3 mm, the number of turns If you increase a lot of things, there is a risk of the disheveled dish. In addition, when the number of turns is increased, the pressure acting on the adhesive tape wound on the tape increases, which may cause the adhesive to seep out from both widths of the tape and cause blocking.

Therefore, the thirty-fifth to forty-first invention of the present application aims to provide an adhesive tape, a manufacturing method of the adhesive tape, and a pressing method of the adhesive tape, which can increase the amount of the adhesive, without increasing the number of turns of the adhesive tape.

Next, an embodiment of the thirty-fifth invention of the present application will be described with reference to the accompanying drawings, but first, with reference to FIGS. 39A, 39B, 40, 34, 5, and 41, EMBODIMENT OF THE INVENTION The 1st Embodiment of 35th-41st invention is demonstrated. 39A and 39B are views of the adhesive tape, FIG. 39A is a perspective view of a reel wound around the adhesive tape, FIG. 39B is a plan view of the adhesive tape of FIG. 39A seen from the adhesive material side, and FIG. 40 is a view of the adhesive material in the bonding apparatus. It is a perspective view which shows a crimping process.

The adhesive tape 1 according to the present embodiment is wound on the reel 3, and the reel 3 is provided with the core 5 and the side plates 7 disposed on both sides of the adhesive tape 1. In this embodiment, the adhesive tape 1 has a length of about 50 m, and a width W is about 1500 mm, which is approximately the same dimension as one side of the circuit board.

The adhesive tape 1 consists of the base material 9 and the adhesive material 11 apply | coated on the base material 9, On the base material 9, the adhesive material 11 which is 0.5 mm in width of one set is equidistantly spaced. It is provided in the width direction of the tape.

Although the base material 9 uses OPP (stretched polypropylene), polytetrafluoroethylene, silicone-treated PET (polyethylene terephthalate) etc. from the surface of the peeling property of the adhesive material which comprises an anisotropically conductive material, it restrict | limits to these It is not.

As the adhesive material 11, a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin and a hot melt system are used. Typical examples of such a resin include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, acrylic resins, vinyl ester resins, and silicone resins are used as the thermosetting resins.

The conductive particles 13 are dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like, and polymer core materials such as non-conductive glass, ceramics, and plastics. The above conductive layer may be formed by coating or the like. Moreover, the insulation coating particle | grains formed by coating the above-mentioned electrically conductive particle with the insulating layer, the combination of electrically conductive particle and insulating particle, etc. are also applicable. Forming a conductive layer on a hot melt metal such as solder or a polymer core material such as plastic has deformability by heating pressurization or pressurization, the distance between electrodes after connection decreases, and the contact area with the circuit increases during connection. It is preferable because the sea reliability is improved. In particular, when the polymers are used as the nucleus, the melting point is not shown as in the solder, and thus the softening state can be widely controlled at the connection temperature, and the connection member can be easily obtained to cope with variations in the thickness and flatness of the electrode.

Next, the usage method of the adhesive tape 1 which concerns on this embodiment is demonstrated. The reel 3 of the adhesive tape 1 and the empty reel 17 are attached to the adhesive device 15, and the tip of the adhesive tape 1 wound on the reel 3 is attached to the empty reel 17, The adhesive tape 1 is taken out (arrow E in FIG. 40). And the adhesive tape 1 is arrange | positioned on the circuit board 21, the adhesive tape 1 is press-contacted from the side of the base material 9 by the heating press head 19 arrange | positioned between both reels 3 and 17, And one trillion adhesives 11 are pressed onto one side of the circuit board in the width direction of the adhesive tape, and the adhesive 11 is wound around the empty reel 17 by the width thereof.

Next, the circuit board 21 is rotated about 90 degrees so that adjacent sides of the circuit board 21 are positioned in the width direction of the adhesive tape 1 so that the adhesive 11 is connected to the circuit 11 by the heating press head 19. The other side of the board | substrate 21 is crimped | bonded. In this way, the circuit board 21 is rotated about 90 degrees to press the adhesive 11, and the adhesive 11 is pressed over the four circumferences of the circuit board 21.

After the crimping (temporary connection) described above, the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are aligned to make the main connection. In this connection, after the adhesive material 11 is crimped on the four circumferences of the circuit board 21, the wiring circuit (or electronic component) 23 is disposed on the adhesive material 11, and as a cushion material, for example, polytetra The wiring circuit 23 is heated and pressed to the circuit board 21 by the heat press head 19 through the fluoroethylene material 24 (see FIG. 4). Thereby, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 are fixedly connected.

As shown in FIG. 34, the connection part of the PDP 26 using the adhesive tape 1 which concerns on this embodiment is adhere | attached over the periphery of PDP, and the usage-amount of the adhesive material 11 used at once is conventionally used Compared to that much. However, since the width W of the adhesive tape 1 is approximately equal to the length H of one side of the circuit board 21, the width W of the adhesive tape 1 becomes wider, and the amount of the adhesive material is larger than that of the prior art even if the width W of the adhesive tape 1 is the same as before. As there are very many, the reel exchange is very few than the conventional one.

Here, with reference to FIG. 5 and FIG. 41, the manufacturing method of the adhesive tape 1 which concerns on this embodiment is demonstrated.

The coater 27 is applied to the base material (separator) wound from the unwinder 25, and the adhesive material 11 in which the resin and the conductive particles 13 are mixed is applied and dried in the drying furnace 29, and then the winder 31 Wind the disc with). The coater 27 moves to the left and right to apply a coarse adhesive material to the substrate 9 at equal intervals. After the disk of the wound adhesive tape is cut by the slitter 33 to a predetermined width and wound around the core, the side plates 7 are mounted on both sides of the core, or the side plates are wound around the core, and together with the dehumidifying material It is packed and is preferably controlled at low temperature (-5 ° C to -10 ° C) and released.

Next, another embodiment of the thirty-fifth invention of the present application will be described. In the embodiments to be described below, the same parts as in the above-described embodiment are designated by the same reference numerals, and the detailed description of the parts will be given. In the following, differences from the above-described embodiment are mainly described.

In the second embodiment shown in FIG. 41, in the bonding apparatus 15, the adhesive tape 1 is attached to two places, and one adhesive tape 1 and the other adhesive tape 1 are mutually connected. We install in orthogonal direction. In one adhesive tape 1, the adhesive 11 is pressed against a pair of longitudinal sides N of the circuit board 21 facing each other (first step), and in the other adhesive tape 1 The adhesive 11 is pressed against a pair of opposite side edges M (second step), and the adhesive is pressed onto the four circumferences of the circuit board 21 in two steps. In this second embodiment, the circuit board 21 arranged in the first step is directly replaced with the second step without rotating the direction of the circuit board 21 between the first step and the second step. By moving, the automatic bonding of the adhesive material becomes possible, and the work efficiency can be further improved. In this case, the circuit board 21 may be loaded on the conveyance belt and automatically conveyed.

In 3rd Embodiment shown to FIG. 42A-42C, the adhesive material is apply | coated to the whole surface of the single side | surface of a base material with the width W, and the adhesive material is plural in a width W direction by the slit 35 formed in the width W direction of the base material. It is separated. In the adhesive tape 1 of this third embodiment, the slit 35 is immediately after the adhesive tape 1 is pressed onto the circuit board 21 after the reel 3 is attached to the bonding apparatus 15. It is preferable to form. In this case, the slit 35 may be formed in the adhesive material 11 of the adhesive tape 1 to which the cutting blade is provided in the vicinity of the reel mounting portion of the adhesive device 15 (indicated by S in FIG. 40). The thing which formed the slit in the finishing process at the time of manufacture of the adhesive tape shown in FIG. 5 may be wound up to the reel, and you may form a slit immediately before winding up in the winding machine 31 after drying in a coating process. In each case, the cutting blade may reciprocate in the width W direction of the adhesive sheet 1.

In addition, when using the adhesive tape 1 according to the third embodiment in the bonding apparatus 15, the adhesive material of each set separated by the slit 35 is the same as the first embodiment in the substrate 9 side. It is crimped | bonded by a heating pressurizing head from a front end side, and is used sequentially.

In this third embodiment, since a plurality of sets of the adhesive material 11 provided in the width direction can be obtained only by forming the slits 35 in the adhesive material on the substrate obtained by the same process as in the prior art, the production is easy.

In the fourth embodiment shown in FIGS. 43A to 43C, the adhesive material 11 is applied to the base material 9 on the single-sided front surface (FIG. 43A), and the width W of the base material 9 and the adhesive material 11 is described above. In the same manner as in the embodiment, the circuit board has the same dimensions as the length of one side of the circuit board. At the time of use, it mounts similarly to 1st Embodiment, and heat-presses a part (one set) of adhesive material in the width W direction of the adhesive tape 1 (FIG. 43B), and reduces the cohesion force of the part, Only the adhesive material of the heat-pressurized portion is separated from the substrate and pressed onto the circuit board 21 (FIG. 43C).

In this case, a cohesion declining line is formed along the peripheral line of the heating press head 19, so that the majority of the heat pressurized portion softens and flows (based on 1000 poise or less), and the curing reaction of the adhesive does not start or is low. It is preferable to set it as the state (20% or less of reaction rate is a reference | standard), and heating temperature is selected according to the adhesive material system to be used.

According to the fourth embodiment, the adhesive material 11 can be press-bonded to the substrate circuit by softening and fluidizing one trillion parts in the width W direction only during use.

In addition, as in the above-described embodiment, there is no need to form the slits 35 in the adhesive material 11 or to separate and install the slits 35, and only the adhesive material 11 is applied to the entire surface of one side of the wide base material. It is easy to manufacture an adhesive tape.

44A-44C shows the other manufacturing method of the adhesive tape 1 which concerns on 1st Embodiment, and the slit 98 was attached to the adhesive material 11 apply | coated to the base material 9a. After forming (FIG. 44A), the other base material 9b is stuck on the adhesive material 11 so that the adhesive material 11 may be clamped on the base materials 9a and 9b (FIG. 44B). Next, one and the other base materials 9a and 9b are separated so as to be peeled off, and the adhesive material tanks 11a and 11b are arrange | positioned to each base material 9a and 9b by one space | interval. In this fifth embodiment, the adhesive material tanks 11a and 11b are arranged from one base material 9a or 9b so that the adhesive material tanks 11a and 11b are alternately arranged on one side and the other base materials 9a and 9b. The pressure-sensitive adhesive baths 11a and 11b may be adhered to the respective substrates 9a and 9b one by one by heating and pressing at intervals.

35th-41st invention of this application is not limited to embodiment mentioned above, A various deformation | transformation is possible in the range which does not deviate from the summary of invention of 35th-41st of this application.

For example, in the above-described embodiment, the adhesive 11 may be an insulating adhesive material in which the conductive particles 13 are not dispersed.

Next, the G, H and I forms of the present invention and the 45th to 46th inventions of the present application will be described.

These inventions are related to the crimping method of an adhesive material using an adhesive tape cassette and an adhesive tape cassette for adhesively fixing an electronic component, a circuit board, or circuit boards, and electrically connecting both electrodes.

Next, the background arts of the G, H and I forms of the present invention and the forty-fifty-seventh inventions of the present application will be described.

Generally, electronic components such as liquid crystal panels, plasma display panels (PDPs), fluorescent display (EL) panels, bare chip mounting, and the like are bonded and fixed to circuit boards and circuit boards, and electrically connected to both electrodes. , Adhesive tape is used.

Japanese Patent Laid-Open No. 2001-284005 discloses winding up an adhesive tape coated with an adhesive on a substrate in a reel form.

The conventional adhesive tape of this kind has a width of about 1 to 3 mm and a length of the tape wound on the reel is about 50 m. In the case where the adhesive material is crimped on the four circumferences of the circuit board, the adhesive tape is pulled out over one side of the circuit board, and the adhesive material is squeezed, and this is performed on the four circumferences of the circuit board. It is squeezed.

However, with the recent increase in the size of panel screens in PDPs and the like, the adhesive area (circumference of one side) of a circuit board has increased, and the amount of adhesive used at one time has increased. In addition, since the use of the adhesive material has also been expanded, the amount of the adhesive material used has increased. For this reason, the manufacturing frequency of the electronic device mentioned above has a problem that the reel which wound the adhesive tape was replaced frequently, and since reel replacement took time, the production efficiency of an electronic device was not improved.

In response to such a problem, it is considered to increase the amount of adhesive material per reel and to reduce the reel exchange frequency by increasing the number of turns of the adhesive tape wound on the reel. However, since the tape width of the adhesive tape is narrow to 1 to 3 mm, the number of turns If you increase a lot of things, there is a risk of the disheveled dish. In addition, when the number of turns is increased, the pressure applied to the adhesive tape wound on the tape increases, which may cause the adhesive to seep out from both widths of the tape and cause blocking.

Therefore, the G, H and I forms of the present invention and the 45th to 46th inventions of the present application can increase the amount of the adhesive material without increasing the number of turns of the adhesive tape, and also facilitate the exchange of the reels. An object of the present invention is to provide an adhesive tape pressing method using an adhesive tape cassette and an adhesive tape cassette.

Next, with reference to the accompanying drawings, embodiments of the G, H and I forms of the present invention and the forty-fifth to forty-ninth embodiments of the present invention will be described. First, FIGS. 45A, 45B, 46, 47, and FIG. 4, 34, and 48, the first embodiment of the G, H, and I forms of the present invention to the forty-ninth to forty-ninth inventions of the present application will be described. For convenience of explanation, the adhesive tape is described in the case where two sets of adhesive materials are arranged, but a plurality of sets may be formed. 45A and 45B are views of the adhesive tape cassette according to the G, H and I forms of the present invention to the first embodiment of the 45th to 46th inventions of the present application, and FIG. 45A is a perspective view of the adhesive tape cassette, FIG. 45B is a cross-sectional view taken along the line AA of FIG. 45A, FIG. 46 is a cross-sectional view showing the installation state of the reel in the tape cassette shown in FIGS. 45A and 45B, and FIG. 47 is a front view showing the pressing process of the adhesive material in the bonding apparatus. 48 is a process chart showing the manufacturing method of the adhesive tape cassette.

The adhesive tape cassette 100 according to the present embodiment is mainly composed of one reel 3, the other reel 17, and a case 99 for storing them, and one reel 3. The adhesive tape 1 is wound around the other end, and the other end 9a of the adhesive tape 1 is fixed to the other reel 17.

An opening 11 is formed in one side of the case 99, and the adhesive tape 1 is drawn out from the opening 11. Further, guides 13 and 13 for guiding the movement of the adhesive tape 1 are provided on both sides of the opening 11.

The case 99 is manufactured by fitting the half cases 99a and 99b, and the spool 17 provided in the bonding apparatus 27 (to be described later) on one and the other reels 3 and 5 (FIG. 46). Fitting) into each reel (3, 5).

Here, with reference to FIG. 46, the combination of each reel 3 and 5 and each reel 3 and 5 and the case 99 is demonstrated. Each reel 3, 5 is provided with a fitting tank 19 for fitting the spool 17 of the bonding device 27 to the inner circumferential side thereof, and rotatable to the protrusion 7c of the case 99 on the outer circumferential side thereof. Engaging holes 21 to be fitted together are formed.

As shown in FIG. 45B, the adhesive material 11a, 11b is apply | coated to the adhesive tape 1 side by side in the width direction on the single side | surface of the base material 9. As shown to FIG. Each of the two sets of adhesives 11a and 11b are provided at intervals from each other.

In this embodiment, the adhesive tape 1 is about 50 m in length and width W is about 4 mm. The width of each set of adhesives 11a and 11b is about 1.2 mm.

Although the base material 9 uses OPP (stretched polypropylene), polytetrafluoroethylene, silicone-treated PET (polyethylene terephthalate) etc. from the surface of the peeling property of the adhesive material which comprises an anisotropically conductive material, it restrict | limits to these It is not.

As the adhesive material 11, a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin and a hot melt system are used. Typical examples of such resins include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, acrylics, vinyl ester resins, and silicone resins as thermosetting resins.

The conductive particles 13 are dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like, and polymer core materials such as non-conductive glass, ceramics, and plastics. The above conductive layer may be formed by coating or the like. Moreover, the insulation coating particle | grains formed by coating the above-mentioned electrically conductive particle with the insulating layer, the combination of electrically conductive particle and insulating particle, etc. are also applicable. The formation of a conductive layer on a hot melt metal such as solder or a polymer core material such as plastic has a deformability by heat pressurization or pressurization, the distance between electrodes after connection decreases, and the contact area with the circuit increases during connection. It is preferable because the solution reliability is improved. Particularly, when the polymers are used as nuclei, they do not exhibit melting points like solders, and thus the softening state can be widely controlled at the connection temperature, and a connection member which is easy to cope with variations in thickness and flatness of the electrode is obtained.

Next, a method of using the adhesive tape cassette 100 according to the present embodiment will be described. As shown in FIG. 47, the adhesive tape cassette 100 is attached to the bonding apparatus 27. As shown in FIG. The spools 17 and 17 (refer FIG. 46) for cassettes are provided in the bonding apparatus 27 at intervals, and the spools 17 and 17 are attached to each reel 3 and 5 of the adhesive tape cassette 100. Engage. Therefore, the adhesive tape cassette 100 can be mounted in one touch, and there is no need for installing the other end 9a of the adhesive tape 1 wound on the reel to the empty reel as in the prior art.

Next, the adhesive tape 1 is taken out from the adhesive tape cassette 100 and crosses the guides 31 and 31 of the bonding apparatus 27.

Then, the spool 17 of the adhesive device 27 is driven to draw out the adhesive tape 1 (in the direction of arrow E in FIG. 47), and the adhesive tape 1 is disposed on the circuit board 21 to heat the pressurized head. (19) presses the adhesive tape 1 from the substrate 9 side, compresses one set of adhesives 11a on one side of the width direction to one side of the circuit board 21, and then presses the remaining adhesives 11b. ) And the base material 9 are wound on the other reel 17. In this way, the adhesive 11a is crimped over the four circumferences of the circuit board 21.

Then, after the adhesive tape 1 wound on one reel 3 is finished, the adhesive tape cassette 100 is removed once, and then it is placed upside down to repeat the above-described process. When two or more sets of adhesive materials are formed in an adhesive tape, you may perform crimping | compression_bonding in order or space | interval by changing the position of the width direction.

After the crimping (temporary connection) described above, the electrodes 33a of the circuit board 21 and the electrodes 37a of the wiring circuit (electronic component) 37 are aligned and connected. In this connection, after the adhesive material 11a is crimped on the four circumferences of the circuit board 21, the wiring circuit (or electronic component) 37 is disposed on the adhesive material 11a, and as a cushion material, for example, polytetra The wiring circuit 23 is heated and pressurized by the heating pressurizing head 19 via the fluoroethylene material 39 to the circuit board 21 (see FIG. 4). Thus, the electrode of the circuit board 21 ( 33a) and the electrode 37a of the wiring circuit 23 are fixed.

As shown in FIG. 34, the connection part of the PDP 26 bonded using the adhesive tape cassette 100 which concerns on this embodiment adheres to the whole periphery of the PDP 26 in this embodiment. Therefore, the usage-amount of the adhesive material 11 used at once becomes especially large compared with the conventional. However, since two sets of adhesives 11a and 11b are disposed on the width W in the adhesive tape 1, the number of replacements of the cassette is reduced since the amount of adhesive is doubled even in the same number of times.

Moreover, since the adhesive tape 1 is made into the cassette 1, it is easy to exchange, handle, and attach, and workability is good.

Here, with reference to FIG. 48, the manufacturing method of the adhesive tape cassette 100 which concerns on this embodiment is demonstrated.

After the coating material 28 coats the adhesive material 11 mixed with resin and the electroconductive particle 30 with the base material (separator) 23 unwound from the unwinder 25, and after drying in the drying furnace 29, The disk is wound up by the winder 31. The coater 28 applies a large number of sets of adhesive to the substrate 9. After the raw material of the wound adhesive tape is cut into the predetermined width (the width which becomes two sets of adhesive materials) by the slitter 33 in the finishing process, and wound up on the reel 3, the reel 3 and the empty reel 5 ) Is inserted into the half cases 99a and 99b to manufacture the adhesive tape cassette 100.

The adhesive tape cassette 100 is packed together with the dehumidifying material, and is preferably released at a low temperature (-5 ° C to -10 ° C).

Next, another embodiment of the G, H and I forms of the present invention to the forty-fourth to forty-ninth inventions of the present application will be described. However, in the embodiments described below, the same portions as those in the above-described embodiments are the same. The detailed description of that part is abbreviate | omitted by attaching a code | symbol, and a mainly different point from embodiment mentioned above is mainly demonstrated below.

In the second embodiment shown in FIG. 49, the adhesive material 11 is crimped all over one side of the circuit board 21 at one time, and the adhesive device 27 is attached to the adhesive material tape 1 from the adhesive tape cassette 100. The guide 101 which draws out and arrange | positions) is provided. According to this 2nd Embodiment, since the adhesive material can be crimped | bonded to the whole side of the circuit board 21 at once, work efficiency is good.

In 3rd Embodiment shown in FIG. 50, the adhesive material 11 is apply | coated to the whole surface of the single side | surface of the base material 9 by width W, and the adhesive material is isolate | separated into two sets by the slit 102. FIG. In the adhesive tape 1 of this third embodiment, the slit 102 compresses the adhesive tape 1 to the circuit board 21 after the adhesive tape cassette 100 is attached to the adhesive device 27. It is preferable to form immediately before. In this case, the slit 102 may be formed in the adhesive material 11 of the adhesive tape 1 to be cut off by providing a cutting blade in the vicinity of the cassette mounting portion of the adhesive device 27 (indicated by S in FIG. 47). What wound up the reel 3 in the finishing process at the time of manufacture of the adhesive tape shown in FIG. 48 may be wound up to the reel 3, and in the coating process, the slit 102 just before winding up with the winding machine 31 after drying is carried out. You may form.

In this third embodiment, since two sets of adhesives 11a and 11b can be obtained simply by forming the slits 102 on the adhesive 11 on the substrate 9 obtained by the same process as in the related art, manufacturing is easy. Do.

In the fourth embodiment shown in FIGS. 51A and 51B, the adhesive material 11 is applied to the base material 9 on the single-sided front surface (FIG. 51A), and the adhesive tape cassette 100 in which the adhesive tape 1 is accommodated. Is attached to the bonding apparatus 27 in the same manner as in the first embodiment, and a cohesive force of the portion is formed by heating and pressing a portion (one set) of the adhesive 11 in the width W direction of the adhesive tape 1. Then, only the adhesive 11a of the heat-pressurized portion is separated from the substrate 9 and pressed onto the circuit board 21 (Fig. 51B).

In this case, the cohesion force reduction line 103 (FIG. 51A) is formed around the heating press head 19, and the majority of the heat pressurized portion softens and flows the adhesive (1000 poise or less), and hardens the adhesive. It is preferable that reaction is not started or it is set as the low state (reaction rate 20% or less is a reference | standard), and a heating temperature is selected according to the adhesive material system to be used.

According to the fourth embodiment, the adhesive material 11 can be crimped to the substrate circuit by softening and fluidizing one pair of powders 25a in the width W direction only at the time of use.

Next, the invention described in the J-L form of this invention is demonstrated.

The present invention relates to an adhesive tape for electrically connecting electronic components and circuit boards or circuit boards and electrically connecting both electrodes, and more particularly, to an adhesive tape wound in a reel shape.

Next, the background art of the invention described in the J-L form of this invention is demonstrated.

Generally, electronic components such as liquid crystal panels, plasma display panels (PDPs), fluorescent display (EL) panels, bare chip mounting, circuit boards, and circuit boards are adhesively fixed and electrically connected to both electrodes. , Adhesive tape is used.

Japanese Patent Laid-Open No. 2001-284005 discloses winding up an adhesive tape coated with an adhesive on a substrate in a reel form.

The conventional adhesive tape of this kind has a width of about 1 to 3 mm, and a length of the tape wound on a reel is about 50 m.

When attaching an adhesive tape to an adhesive apparatus, an adhesive tape reel (henceforth simply called "adhesive reel") is attached to an adhesive apparatus, the lead end of an adhesive tape is taken out, and it is attached to a winding reel. And the adhesive material is crimped | bonded by a heating press head from the base material side of the adhesive material tape unwound from the adhesive material reel to a circuit board etc., and the remaining base material is wound up by the winding reel.

When the adhesive tape of the adhesive reel is finished, the finished reel and the winding reel winding the base material are removed, a new winding reel and a new adhesive reel are attached to the adhesive device, and the beginning of the adhesive tape is attached to the winding reel. have.

However, with the recent increase in the size of panel screens in PDPs and the like, the adhesion area of circuit boards has increased, and the amount of adhesive materials used at once has increased. In addition, since the use of the adhesive material has also been expanded, the amount of the adhesive material used has increased. For this reason, the manufacturing frequency of an electronic device has a problem that the replacement frequency of an adhesive reel increases, and since it takes time to replace an adhesive material reel, the improvement of the production efficiency of an electronic device is not aimed at.

For this problem, it is considered to increase the amount of adhesive material per reel and to reduce the reel exchange frequency by increasing the number of turns of the adhesive tape wound on the reel, but the number of turns is small because the tape width of the adhesive tape is narrow to 1 to 3 mm. If you increase a lot of things, there is a risk of the disheveled dish. In addition, increasing the number of turns increases the pressure acting on the adhesive tape wound on the tape, and the adhesive may leak out from both widths of the tape and cause blocking.

Moreover, when the number of turns of the adhesive tape is increased, the diameter dimension of the reel is also increased, and it is difficult to attach to the existing adhesive apparatus, and there is a fear that the conventional adhesive apparatus cannot be used.

Therefore, the invention described in the J-L form of this invention aims at providing the adhesive tape which can simplify replacement | exchange of an adhesive reel, and can aim at the improvement of the production efficiency of an electronic device.

EMBODIMENT OF THE INVENTION Next, embodiment of this invention described in J-L form of this invention is described, referring an accompanying drawing.

A first embodiment of the invention described in the J to L forms of the present invention will be described with reference to FIGS. 52A, 52B, 3A, 4, 29, and 5. 52A and 52B are views showing the connection of the adhesive tape according to the present embodiment, FIG. 52A is a perspective view showing the connection between the adhesive material reels, and FIG. 52B is a cross-sectional view showing the connection portion in FIG. 52A.

The adhesive tape 1 is wound around the reels 3 and 3a, respectively, and the reel 3 and 3a are provided with the side plate 7 arrange | positioned at both width sides of the core 5 and the adhesive tape 1, respectively.

The adhesive tape 1 is comprised from the base material 9 and the adhesive material 11 apply | coated to one side surface of the base material 9.

The base material 9 has a support layer 9b and a heat melter layer (hot melt layer) 9a sandwiched from both sides, and is a polyethylene that is a thermoplastic resin in the heat melter (hot melt) constituting the heat melter layer 9a. , SBS (styrene butadiene styrene block copolymer), nylon and the like, and for the support layer 9b, plastics such as OPP (stretched polypropylene), polytetrafluoroethylene, PET (polyethylene terephthalate), glass fibers, aramid Reinforcing fibers such as fibers and carbon fibers are used.

As the adhesive material 11, a thermoplastic resin, a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin is used. Typical examples of such resins include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, acrylic resins, and silicone resins are used as the thermosetting resins.

The conductive particles 13 may be dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like, and / or non-conductive glass, ceramics, plastics, and the like. Of the polymer core material may be formed by coating or the like. Moreover, the insulation coating particle | grains formed by covering the above-mentioned conductive particle with the insulating layer, the combination of electrically conductive particle and insulating particle, etc. are also applicable. Forming a conductive layer on a hot melt metal such as solder or a polymer nuclear material such as plastic has deformability by heating pressurization or pressurization, the distance between electrodes after connection decreases, and the contact area with the circuit increases during connection. It is preferable because the solution reliability is improved. Particularly, when the polymers are used as the nucleus, the melting point is not shown as in the solder, and thus the softening state can be widely controlled at the connection temperature, and the connection member which is easy to cope with variations in the thickness and flatness of the electrode is obtained.

Next, the usage method of the adhesive tape which concerns on this embodiment is demonstrated. As shown in FIG. 3A, the reel 3a of the adhesive tape 1 and the winding reel 17 are attached to the adhesive device 15, and the tip of the adhesive tape 1 wound on the reel 3a is guide pin. It hangs on (22), is attached to the winding reel 7, and draws out the adhesive tape 1 (arrow E in FIG. 3A). And the adhesive tape 1 is arrange | positioned on the circuit board 21, the adhesive tape 1 is press-contacted from the base material 9 side by the heating press head 19 arrange | positioned between both reels 3a and 17, The adhesive material 11 is pressed onto the circuit board 21. Then, the base material 9 is wound up by the winding reel 17.

Next, as shown in FIG. 4, the wiring circuit (or electronic component) 23 is arrange | positioned to the adhesive material 11 crimped | bonded to the circuit board 21, and the polytetrafluoroethylene material 24 is interposed as a cushion material. The heating and pressing head 19 heats and presses the wiring circuit 23 to the circuit board 21. As a result, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 are connected.

As shown in FIG. 29, the connection part of the PDP 26 using the adhesive tape 1 which concerns on this embodiment, the adhesive material 11 is crimped all over the periphery of the PDP 26, and is used at once. It is clear that the use amount of (11) is particularly high compared with the prior art. Therefore, the usage-amount of the adhesive tape 1 wound on the reel 3a also increases, and the adhesive tape 1 wound on the reel 3a is wound on the winding reel 17 in a relatively short time and wound on the reel 3a. The end mark 28 of the tape 1 is exposed (see FIG. 52A).

As shown in FIG. 52A, when the end mark 28 is exposed to the adhesive tape 1 of the reel 3a, in order to replace the reel 3a with a new adhesive material reel 3, the adhesive material of the reel 3a. The end part 30 of the tape (one adhesive tape) 1 and the start end 32 of the adhesive tape (the other adhesive tape) 1 wound on the new adhesive material reel 3 are connected.

As shown in FIG. 52B, the connection of this adhesive tape 1 is the beginning of the terminal part 30 of the adhesive tape 1 of the adhesive material reel 3a, and the beginning of the adhesive tape 1 of the new adhesive material reel 3; About the part 32, the adhesive agent 11 surface of the start end part 32 overlaps with the heat-melt layer 9a of the base material 9 of the terminal part 30, and this part is placed on the table 104. As shown in FIG. Then, the portion overlapped with the heating press head 19 of the bonding apparatus 15 is heated to melt the hot melt layer 9a, and the hot melt solidifies by cooling to terminate the end 30 and the start end 32. ). Thereby, the adhesive tape 1 wound on the used reel 3a and the adhesive tape 1 wound on the new reel 3 are connected.

Next, the used reel 3a and the new reel 3 are replaced, and the new reel 3 is attached to the bonding apparatus 15. Therefore, the work of attaching the adhesive tape 1 to the winding reel 17 is not necessary. Moreover, since only the base material 9 is mainly wound up in the winding reel 17, since some of the adhesive material reels can be wound, the replacement | recovery frequency of the winding reel 17 can be reduced, and work efficiency is good.

Here, with reference to FIG. 5, the manufacturing method of the adhesive tape 1 which concerns on this embodiment is demonstrated.

The coater 27 is applied to the base material (separator) uncoiled from the unwinder 25, and the adhesive material 11 in which the resin and the conductive particles 13 are mixed is applied, dried in the drying furnace 29, and then wound up ( 31) wind the disc. After the raw material of the wound adhesive tape 1 is cut into a predetermined width by the slitter 33 and wound around the core, side plates are mounted on both sides of the core and packed together with a dehumidifying material, and preferably a low temperature ( -5 ℃ ~ -10 ℃) is controlled and released.

Next, another embodiment of the invention described in the J to L embodiments of the present invention will be described. However, in the embodiments to be described below, the same reference numerals are given to the same parts as the above-described embodiments, and the detailed description of the parts will be given. Will be omitted, and differences from the above-described embodiment will mainly be described.

In 2nd Embodiment shown in FIG. 53, in the base material 9 of the adhesive tape 1, the heat melter layer 9a is sandwiched by the support layer 9b. In this case, as shown to FIG. 3A, in order to connect adhesive tape 1 comrades, the edge part 30 of one adhesive tape 1 and the start end part 32 of the other adhesive tape 1 are used. In the butt position, the hot melt layer 9a is heated by the heating press head 19 of the bonding apparatus 15. When heated, the thermal melter seeps out of the thermal melter layer 9a, and the adhesive tapes 1 are connected by solidifying the thermal melter by cooling. Thus, since the heat flux layer 9a is pinched by the support layer 9b, the adhesive strength of the heat flux layer 9a by moisture absorption by moisture, adhesion | attachment, etc. of dust can be prevented from falling.

The invention described in the J-L forms of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the invention described in the J-L forms of the present invention.

In 1st Embodiment, although the base material 9 is comprised from the support layer 9b and the three layers which sandwiched this from the both sides by the heat flux layer 9a, it is not limited to this, Four or more layers may be sufficient as it.

In this embodiment, although the heating press of the connection part used the heating press head 19 of the bonding apparatus 15, instead of the heating press head 19, a separate heater is used and the connection part is heated, and an adhesive material is used. The tapes 1 may be connected to each other.

Next, the 50th to 51st inventions of the present application will be described.

These inventions are related to the adhesive tape which electrically fixes an electronic component, a circuit board, or circuit boards, and electrically connects both electrodes. The present invention also relates to an adhesive tape used in a semiconductor device for attaching and fixing a semiconductor substrate (chip) to a support substrate for fixing a lead frame, a die of a lead frame, and a support substrate for mounting a semiconductor element, and in particular, an adhesive tape wound in a reel shape. The connection method of the.

Next, the background art of the 50th to 51st inventions of the present application will be described.

Generally, electronic components such as liquid crystal panels, plasma display panels (PDPs), fluorescent display (EL) panels, bare chip mounting, circuit boards, and circuit boards are adhesively fixed and electrically connected to both electrodes. , Adhesive tape is used.

Moreover, adhesive tape is used for adhesive films, such as a lead fixing tape of a lead frame, a LOC tape, a die-bonding tape, a microBGA and a CSP, etc., and is used in order to improve the productivity and reliability of the whole semiconductor device.

Japanese Patent Laid-Open No. 2001-284005 discloses winding up an adhesive tape coated with an adhesive on a substrate in a reel form.

Conventional adhesive tapes of this kind are treated with silicon on both sides of the substrate so that the adhesive does not adhere to the substrate or is easily peeled off.

In the case of attaching the adhesive tape to the adhesive apparatus, an adhesive tape reel (hereinafter simply referred to as an "adhesive reel") is attached to the adhesive apparatus, the lead end of the adhesive tape is taken out, and attached to the winding reel. And the adhesive material is crimped | bonded by a heating press head from the base material side of the adhesive material tape unwound from the adhesive material reel to a circuit board etc., and the remaining base material is wound up by the winding reel.

And when the adhesive tape of an adhesive reel is complete | finished, the finished reel and the winding reel which wound the base material are removed, the new adhesive reel is attached to an adhesive device, and the beginning of an adhesive tape is attached to the winding reel.

Moreover, with the recent increase in the size of panel screens in PDPs and the like, the adhesion area of circuit boards has increased, and the amount of adhesive materials used at one time has increased. In addition, since the use of the adhesive material has also been expanded, the amount of the adhesive material used has increased. For this reason, the manufacturing frequency of an electronic device increases the frequency of replacement | exchange of an adhesive material reel, and since it takes time to replace an adhesive material reel, there exists a problem that the improvement of the production efficiency of an electronic device cannot be aimed at.

In response to such a problem, it is considered to increase the amount of adhesive material per reel and to reduce the reel exchange frequency by increasing the number of turns of the adhesive tape wound on the reel. However, since the tape width of the adhesive tape is narrow to 1 to 3 mm, the number of turns If you increase a lot of things, there is a risk of the disheveled dish. In addition, increasing the number of turns increases the pressure acting on the adhesive tape wound on the tape, and the adhesive may leak out from both widths of the tape and cause blocking.

Furthermore, if the number of turns of the adhesive tape is increased, the diameter dimension of the reel is also increased, and it is difficult to attach to the existing adhesive apparatus, and there is a fear that the existing adhesive apparatus cannot be used.

Accordingly, the fifty to fifty-first invention of the present application aims to provide a method for connecting an adhesive tape in which the replacement of the adhesive reel can be simplified and the production efficiency of the electronic device can be improved.

EMBODIMENT OF THE INVENTION Next, embodiment of 50th-51st invention of this application is described, referring an accompanying drawing. First, with reference to FIGS. 54A-54C, 55, 56, 4, and 29, the 1st Embodiment of the 50th-51st invention of this application is demonstrated. 54A to 54C are cross-sectional views showing the connection process of the connecting portion in FIG. 55, FIG. 54A shows the state of the adhesive tape before discharge, FIG. 54B shows the state of the adhesive tape after discharge, and FIG. 54C shows the connection. It is a figure which shows the heat compression of a part. Fig. 55 is a perspective view showing the connection of the adhesive reels to each other in the method of connecting the adhesive tape, and Fig. 56 is a schematic view showing the pressing step of the adhesive in the bonding apparatus.

The adhesive tape 1 is wound around the reels 3 and 3a, respectively, and the reel 3 and 3a are provided with the side plate 7 arrange | positioned at both width sides of the core 5 and the adhesive tape 1, respectively.

The adhesive tape 1 is comprised from the base material 9 and the adhesive material 11 apply | coated to one side surface of the base material 9.

The base material 9 uses OPP (stretched polypropylene), polytetrafluoroethylene, PET (polyethylene terephthalate), etc. from the surface of the strength and the peelability of the adhesive material 11, and the surface treatment is carried out with the release agent 9a. It is carried out. As the mold release agent, low melting point waxes such as an olefin release agent, ethylene glycol montan ester, carnauba wax, petroleum wax, low molecular weight fluorocarbon resin, silicone or fluorine-based surfactant, oil, wax, resin, polyester modified silicone resin, etc. This is used, in particular silicone resins are common.

As the adhesive material 11, a thermoplastic resin, a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin is used. Typical examples of such resins include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, acrylic resins and silicone resins as thermosetting resins.

The conductive particles 13 may be dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like, and / or non-conductive glass, ceramics, plastics, and the like. The polymer nucleus material or the like may be formed by coating or the like. Moreover, the insulation coating particle | grains formed by coating the above-mentioned electrically conductive particle with the insulating layer, the combination of electrically conductive particle and insulating particle, etc. are also applicable. Forming a conductive layer on a hot melt metal such as solder or a polymer core material such as plastic has deformability by heating pressurization or pressurization, the distance between electrodes after connection decreases, and the contact area with the circuit increases during connection. It is preferable because the solution reliability is improved. In particular, when the polymers are used as the nucleus, the melting point is not shown as in the solder, and thus the softening state can be widely controlled at the connection temperature, and the connection member can be easily obtained to cope with variations in the thickness and flatness of the electrode.

Next, the usage method of the adhesive tape which concerns on this embodiment is demonstrated. As shown in FIG. 56, the reel 3a of the adhesive tape 1 and the winding reel 17 were attached to the adhesive device 15, and the tip of the adhesive tape 1 wound on the reel 3a was guide pin. It hangs on (22), is attached to the winding reel 17, and pulls out the adhesive tape 1 (arrow E in FIG. 56). And the adhesive tape 1 is arrange | positioned on the circuit board 21, the adhesive tape 1 is press-contacted from the base material 9 side by the heating press head 19 arrange | positioned between both reels 3 and 17, The adhesive material 11 is pressed onto the circuit board 21. Then, the base material 9 is wound up by the winding reel 17.

Next, as shown in FIG. 4, the wiring circuit (or electronic component) 23 is disposed in the adhesive material 11 pressed onto the circuit board 21, and the polytetrafluoroethylene material 24 is used as the cushioning material. The wiring circuit 23 is heated and pressed to the circuit board 21 by the heating press head 19. As a result, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 are connected.

Fig. 29 shows a connecting portion of the PDP 26 using the adhesive tape 1 according to the present embodiment, and the adhesive material 11 is pressed over the entire circumference of the PDP 26 and used at once. It is clear that the use amount of (11) is particularly high compared with the prior art. Therefore, the usage-amount of the adhesive tape 1 wound on the reel 3a also increases, and the adhesive tape 1 wound on the reel 3a is wound on the winding reel 17 in a relatively short time and wound on the reel 3a. The end mark 28 of the tape 1 is exposed (see FIG. 55).

As shown in FIG. 55, in order to replace the reel 3a with the new adhesive material reel 3 to the adhesive tape 1 of the reel 3a, the adhesive tape (one adhesive tape) 1 of the reel 3a 1 ) And the start end 32 of the adhesive tape (the other adhesive tape) 1 wound on the new adhesive reel 3.

As shown in FIG. 54B, this adhesive tape 1 is connected to the terminal 30 of the adhesive tape 1 of the used reel 3a at the irradiation position of the discharger 105. Then, the release agent 9a is removed by discharging the surface of the substrate 9.

And the surface of the base material 9 from which the mold release agent 9a was removed overlaps the surface of the adhesive material 11 of the start end part 32 of the other adhesive material tape 1 (FIG. 54C). The overlapped portions of the two are placed on a table, and heated and pressurized by the heating press head 19 of the bonding apparatus 15 to be bonded. Thereby, the adhesive tape 1 wound on the used reel 3a and the adhesive tape 1 wound on the new reel 3 are connected.

Next, the used reel 3a and the new reel 3 are replaced, and the new reel 3 is attached to the bonding apparatus 15. Therefore, the work which attaches the adhesive tape 1 to the winding reel 17 is unnecessary.

In this embodiment, since the heating press head 19 is used, the reel 3 and 3a by which the adhesive tape 1 was wound can be replaced without using the connection mechanism of adhesive tape 1 separately. Do. Moreover, since only the base material 9 is wound by the winding reel 17, since some of the adhesive material reels are wound, the replacement | recovery frequency of the winding reel 17 can be reduced, and work efficiency is good.

The 50th to 51st inventions of the present application are not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the 50th to 51st inventions of the present application.

For example, in the above-mentioned embodiment, the release agent 9a of the base material 9 of the one adhesive tape 1 after winding up is removed, and the adhesive material 11 surface of the novel adhesive tape 1 is attached to this part. , The adhesives were heated and pressurized with the heat press head 19 to be bonded to each other, but the release agent 9a of the base material 9 of the new adhesive tape 1 was removed, and the winding was completed on such a portion. You may connect the surface of the adhesive material 11 of the adhesive tape 1, overlapping them.

The method of removing the release agent 9a may be a method by ultraviolet irradiation or laser irradiation in addition to plasma discharge. In the case of ultraviolet irradiation, for example, a mercury lamp is used as a light source, and the ultraviolet light is irradiated for a predetermined time from the mercury lamp. By. Moreover, in the case of laser irradiation, the release agent 9a is decomposed and scattered by the laser light irradiated by the laser oscillator, and the release agent 9a is removed.

In the above, the case where the electronic component, the circuit board, and the circuit board are bonded to each other has been explained. The same applies to the adhesive tape for the semiconductor device to be fixed.

Next, the invention described in the M to O form of the present invention will be described.

These inventions are related to the adhesive tape which electrically fixes an electronic component, a circuit board, or circuit boards, and electrically connects both electrodes. The present invention also relates to an adhesive tape used in a semiconductor device for attaching and fixing a semiconductor substrate (chip) to a support substrate for fixing a lead frame, a die of a lead frame, and a support substrate for mounting a semiconductor element, and in particular, an adhesive tape wound in a reel shape. It's about reels.

Next, the background art of the invention described in the M-O form of this invention is demonstrated.

Generally, electronic components such as liquid crystal panels, plasma display panels (PDPs), fluorescent display (EL) panels, bare chip mounting, circuit boards, and circuit boards are adhesively fixed and electrically connected to both electrodes. , Adhesive tape is used.

Moreover, adhesive tape is used for lead fixing tape, LOC tape, die-bonding tape, etc. of a lead frame, for example, a lead fixing tape fixes the lead pin of a lead frame, and improves the productivity and reliability of the lead frame itself or the whole semiconductor device. Used to make

As electronic devices become smaller and lighter, semiconductor devices have a small size called microBGA (ball grid array) or CSP (chip size package) in which their external terminals are arranged in an area array below the semiconductor device (package). The development of the package of semiconductor is progressed, and these packages mount a semiconductor element (chip) via an adhesive material on support substrates for semiconductor element mounting, such as a glass epoxy board | substrate or a polyimide board | substrate which has a one-layer or multilayer wiring structure, and a semiconductor The terminal on the element side and the terminal on the wiring board side of the board are connected by a wire bond or flip chip method, and the connection portion and the upper or cross section of the chip are sealed with an epoxy encapsulating material or an epoxy liquid encapsulating material, and a solder ball or the like is provided on the back side of the wiring board. The structure in which the metal terminals of are arrange | positioned on an area array is employ | adopted. Adhesive tapes are also used for QFN (Quad Flat Non-1eaded Package), SON (Smll 0utline Non-1eaded Package), and the like. In addition, a method in which a plurality of these packages are surface-adhered in a high density by solder reflow method on a substrate of an electronic device is adopted. Furthermore, the die of the lead frame and the semiconductor element (chip) are mounted via an adhesive material, and the terminal on the semiconductor element side and the lead frame terminal are connected by wire bonds, and the connection portion and the chip upper surface portion or the end face portion are epoxy-based encapsulant or epoxy-based. It is sealed with a liquid encapsulant. Adhesive tape is also used for the adhesive of such a semiconductor device.

Japanese Unexamined Patent Application Publication No. 2001-284005 discloses a method of electrically connecting electrodes to each other in which a reel of an adhesive tape coated with an adhesive material on a substrate is wound.

The conventional adhesive tape of this kind has a width of about 1 to 3 mm, and a length of the tape wound on a reel is about 50 m.

When attaching the adhesive tape to the adhesive apparatus, an adhesive tape reel wound around the adhesive tape is attached to the adhesive apparatus, the beginning end of the adhesive tape is taken out, and installed on the winding reel. And the adhesive material is crimped | bonded by a heating press head from the base material side of the adhesive material tape unwound from the adhesive material tape reel, a circuit board etc., and the remaining base material is wound up by the winding reel.

And when the adhesive tape of one adhesive tape reel is complete | finished, the finished reel and the winding reel which wound the base material are removed, a new winding reel and a new adhesive tape reel are attached to an adhesive device, and the beginning of an adhesive tape is wound up. I install it in a reel.

Moreover, with the recent increase in the size of panel screens in PDPs and the like, the adhesion area of circuit boards has increased, and the amount of adhesive materials used at one time has increased. In addition, since the use of the adhesive material has also been expanded, the amount of the adhesive material used has increased. For this reason, the manufacturing frequency of an electronic device becomes large, and since the frequency of replacement of an adhesive tape reel becomes large and it takes time to replace an adhesive tape reel, there exists a problem that the improvement of the production efficiency of an electronic device is not aimed at.

For this problem, it is considered to increase the amount of adhesive material per reel and to reduce the reel exchange frequency by increasing the number of turns of the adhesive tape wound on the reel, but the number of turns is small because the tape width of the adhesive tape is narrow to 1 to 3 mm. If you increase a lot of things, there is a risk of wrecking of the wound. In addition, increasing the number of turns increases the pressure acting on the adhesive tape wound on the tape, which may cause the adhesive to seep out from both widths of the tape and cause blocking, and the diameter of the reel increases, making it difficult to attach to the existing adhesive device. There is a fear that the existing adhesive device will not be available.

In addition, the adhesive tape reel may cause deterioration in quality due to dust or moisture when the adhesive tape is directly weathered to the outside air.

Therefore, the invention described in the M to O aspects of the present invention is intended to provide an adhesive tape reel that can easily replace an adhesive tape reel, which can improve the production efficiency of electronic equipment and maintain the quality of the adhesive tape. It is done.

Next, although embodiment of invention described in the M-O form of this invention is described as an example using the adhesive tape for electrode connection, referring also to an accompanying drawing, the same also applies to the adhesive tape for semiconductor element connection. First, with reference to FIGS. 57A-57C, FIG. 3A, FIG. 4, FIG. 29, and FIG. 58, the 1st Embodiment of invention described in the M-O form of this invention is demonstrated. 57A to 57C are views showing the adhesive tape reel according to the first embodiment, FIG. 57A is a perspective view showing the adhesive tape reel, FIG. 57B is a front view of FIG. 57A, and FIG. 57C is a view of FIG. 57A. It is a front view of the cover part material of FIG. 58, and FIG. 58 is process drawing which shows the manufacturing method of an adhesive tape.

The adhesive tape reel A according to the present embodiment includes the windings (hereinafter, the windings) 2 and 2a of the plurality of adhesive tapes 1, and the adhesive tape 1 is attached to the windings 2 and 2a. Is provided with the reels 3 and 3a wound thereon. Each reel 3, 3a is provided with side plates 7, 7a, 7b arranged on both width sides of the core 5 and the adhesive tape 1. As shown to FIG. 3A, the adhesive tape 1 is comprised from the base material 9 and the adhesive material 11 apply | coated to one side surface of the base material 9. As shown in FIG. In the unused (unused) winding part 2a, the cover member 8 which covers the periphery of the adhesive tape 1 wound on the reel 3a is detachably attached to the reel 3a.

Moreover, the accommodating part (storage space) 12 of the desiccant 10 is provided in the side plate 7a of the inside of the winding part 2, 2a, and the desiccant 10, such as a silica gel, is stored in the accommodating part 12. As shown in FIG. By storing, moisture in the unused winding part 2a is removed from the inside.

Although the base material 9 uses OPP (stretched polypropylene), polytetrafluoroethylene, silicone-treated PET (polyethylene terephthalate) etc. from the surface of the peeling property of the adhesive material which comprises an anisotropically conductive material, it restrict | limits to these It doesn't happen.

As the adhesive material 11, a thermoplastic resin, a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin is used. Typical examples of such resins include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, acrylic resins and silicone resins as thermosetting resins.

The conductive particles 13 may be dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like, and / or non-conductive glass, ceramics, plastics, and the like. The polymer nucleus material or the like may be formed by coating or the like. Moreover, the insulation coating particle | grains which coat | cover the above-mentioned electrically conductive particle with an insulating layer, the combination of electrically conductive particle and insulating particle, etc. are also applicable. Forming a conductive layer on a hot melt metal such as solder or a polymer core material such as plastic has deformability by heating pressurization or pressurization, the distance between electrodes after connection decreases, and the contact area with the circuit increases during connection. It is preferable because the solution reliability is improved. In particular, when the polymers are used as the nucleus, the melting point is not shown as in the solder, and thus the softening state can be widely controlled at the connection temperature, and the connection member can be easily obtained to cope with variations in the thickness and flatness of the electrode.

Next, the usage method of the adhesive tape which concerns on this embodiment is demonstrated. As shown in Fig. 3A, the adhesive tape reel A and the winding reel 17 are attached to the adhesive device 15, and the start end of one adhesive tape 1 is hooked on the guide pin 22 to wind up the reel ( 17), and the adhesive tape 1 is taken out (arrow E in Fig. 3A). And the adhesive tape 1 is arrange | positioned on the circuit board 21, the adhesive tape 1 is pressed against the base material 9 side by the heating press head 19 arrange | positioned between both reels 3 and 17, The adhesive material 11 is pressed onto the circuit board 21. Then, the base material 9 is wound up by the winding reel 17.

Next, as shown in FIG. 4, the wiring circuit (or electronic component) 23 is arrange | positioned to the adhesive material 11 crimped | bonded to the circuit board 21, and the polytetrafluoroethylene material 24 is interposed as a cushion material. The wiring circuit 23 is heated and pressurized by the heating pressurizing head 19 to the circuit board 21. As a result, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 are connected.

As shown in FIG. 29, the connection portion of the PDP 26 using the adhesive tape 1 according to the present embodiment, the adhesive material 11 is pressed over the entire circumference of the PDP 26, and the adhesive material used at one time. It is clear that the use amount of (11) is particularly high compared with the conventional one. Therefore, the usage-amount of the adhesive tape 1 also increases, and the adhesive tape 1 wound on the reels 3 and 3a is wound up by the winding reel 17 in a comparatively short time.

When an end mark is exposed to the adhesive tape 1 of the one winding part 2, it replaces with the adhesive tape 1 of the new winding part 2a. In this embodiment, the cover member 8 is provided in the unused winding part 2a, and after removing this cover member 8, the adhesive tape 1 is extracted and attached to the winding reel 17. In FIG. .

Thus, when the unwinding of one winding part 2 is complete | finished, the adhesive tape 1 of the other winding part 2a is attached to the winding reel 17, and the adhesive tape 1 is exchange | exchanged, No attachment of a new adhesive tape reel to the device 15 is necessary. Therefore, the replacement work of the new adhesive tape reel takes less, and the production efficiency of the electronic device becomes high.

In addition, since the cover member 8 is provided in the unused winding part 2a, the adhesive tape 1 does not directly wind outside, and the adhesive tape 1 reduces the adhesive force by dust and moisture. It becomes difficult to produce a back. Therefore, even when the some winding parts 2 and 2a are provided, the fall of the quality of the adhesive tape 1 can be prevented by providing the cover member 8 in the unused winding part 2a.

In addition, since only the base material 9 is wound around the winding reel 17, some of the adhesive tape reel can be wound, so that the number of replacements of the winding reel 17 can be reduced, resulting in good work efficiency.

Here, with reference to FIG. 58, the manufacturing method of the adhesive tape reel A which concerns on this embodiment is demonstrated.

The coater 27 is applied to the base material (separator) unwound from the unwinder 25, and the adhesive material mixed with the resin and the conductive particles 13 is coated, dried in the drying furnace 29, and then wound into the winder 31. Wind up the disc. After the raw material of the wound adhesive tape is cut into a predetermined width by the slitter 33 and wound around the core, side plates 7, 7a, and 7b are mounted on the core from both sides, and the cover member 8 is mounted. It is packed with a dehumidifying material, and it is controlled and released at low temperature (-5 degreeC--10 degreeC) preferably.

Next, another embodiment of the invention described in the M to O embodiments of the present invention will be described. However, in the embodiment to be described below, the same reference numerals are assigned to the same parts as the above-described embodiments, and the details thereof will be described. The description will be omitted, and the following will mainly describe differences from the above-described embodiment.

In the second embodiment shown in FIG. 59, the cover member 8 provided on the winding portions 2, 2a is provided with a take-out port 106 of the adhesive tape 1. In this case, since the adhesive tape 1 can be taken out from the outlet opening 106 of the cover member 8, it is possible to remove the cover member 8 of the wound portions 2, 2a from the wound portions 2, 2a. The adhesive tape 1 can be fed out directly.

In 3rd Embodiment shown to FIG. 60A and FIG. 60B, the winding parts 2, 2a, and 2b are separate, respectively, and perturbation is provided in the shaft 107 provided in the main body of the bonding apparatus 15 freely. And when the unwinding of one winding part 2 is complete | finished, the cap 108 provided in the front-end | tip of the shaft 107 is removed, and one winding part 2 is removed from the bonding apparatus 15. As shown in FIG. And after moving the other winding part 2a to an adhesion position and removing the cover member 8, the adhesive tape 1 of the other winding part 2a is wound around the winding reel 17, and an adhesive tape (1) is exchanged. In this case, since the some winding part 2, 2a, 2b is respectively separate, handling is easy.

In the fourth embodiment shown in FIG. 61, as in the third embodiment, the windings 2, 2a and 2b are respectively separated, and the side plates 7 and 7a of each of the windings 2, 2a and 2b are different. ) Are fitted to the bonding apparatus 15 by being fitted together. As shown in FIG. 61, the side plate 7a of the other winding part 2a is provided with the to-be-fitted part 110 whose cross section is substantially co-shaped, and the to-be-held body provided in the side plate 7 of one winding part 2 is shown. Both are connected by fitting the fitting part 49 to the to-be-fitted part 110 from the upper side. In the case of removing one winding portion 2 from which the unwinding is completed from the bonding apparatus 15, the fitting is released only by lifting one winding portion 2 upward, and one winding portion 2 can be easily removed. Can be.

The invention described in the M-O form of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the invention described in the M-O form of the present invention.

For example, in the above-described embodiment, there may be any number of the winding portions 2 and 2a without particular limitation.

In the fourth embodiment, the side plates 7 and 7a are slid up and down to fit the one and the other winding parts 2 and 2a, but a fitting hole is formed in one side plate 7. The fitting protrusion may be provided in the other side plate 7a, and the fitting protrusion may be pushed into the fitting hole in the width direction of the tape to fit the both.

31A and 31B show bonding of a support frame for fixing a lead frame and a semiconductor element to the lead frame, among the supporting substrate for fixing the lead frame, the support substrate for mounting a semiconductor element, or an adhesive tape connecting the die and the semiconductor element of the lead frame. An example of a fixed lead on chip (LOC) structure is shown.

The adhesive tape of the structure of FIG. 31A in which the adhesive material layer 80, such as the polyamide-imide-type adhesive material layer of thickness 25micrometer, was formed on both surfaces of both support films 78, such as a polyimide film which surface-treated with a thickness of 50 micrometers. By using the above, the semiconductor device of the LOC structure shown in Fig. 31B is obtained. Punching the adhesive tape shown in FIG. 31A using a punching die 87 (male type (convex portion) 95, female type (concave portion) 96) of the adhesive apparatus shown in FIGS. 32A to 32C in a single step. For example, a 0.2 mm-thick inner lead is placed on a lead frame made of an iron-nickel alloy with a thickness of 0.2 mm so as to be in contact with each other, pressurized for 3 seconds at a pressure of 3 MPa at 400 ° C., and adhered to an adhesive film for semiconductors. Build a lead frame. Next, in a separate step, the semiconductor element is pressed onto the adhesive layer surface of the lead frame with an adhesive film for semiconductors for 3 seconds at a pressure of 3 MPa at a temperature of 350 ° C., and then the lead frame and the semiconductor element are gold wired. Wire-bonded and sealed by transfer molding using a sealing material such as an epoxy resin molding material to obtain a semiconductor device as shown in Fig. 31B. 31A and 31B, 81 is an adhesive film for semiconductor punched from adhesive tape, 54 is a semiconductor element, 83 is a lead frame, 84 is an encapsulant, 85 is a bonding wire, and 86 is a bus bar. 32A, 32B, and 32C are adhesive devices, and in FIGS. 32A and 32B, 87 is a punching die, 88 is a lead frame conveying part, 89 is an adhesive tape punching, an attachment part, 90 is a heater part, 91 is an adhesive tape reel. (Adhesive tape unwinding part), 92 are adhesive tapes (adhesive film for semiconductors), 93 are adhesive tape unwinding rollers. In Fig. 32C, 94 is an adhesive tape (adhesive film for semiconductor), 95 is a male type (convex part), 96 is a female type (concave part), and 97 is a film pressing plate. The adhesive tape 92 is punched out of the adhesive tape reel (adhesive tape unwinding portion) 91 in a continuous manner from the adhesive tape punching and the attachment portion 89, and is bonded to the lead portion of the lead frame, thereby adhering to the semiconductor. It is conveyed from a lead frame conveyance part as a lead frame with an adhesive film for resin. The punched adhesive tape is taken out from the adhesive tape unwinding roller 93.

In the same manner to the above, the semiconductor element is connected to the support substrate for semiconductor element mounting using an adhesive tape. Similarly, the die of the lead frame and the semiconductor element are connected and bonded. The adhesive tape may be made of only an adhesive material and a case of simply adhering and fixing the adhesive material and an adhesive material which electrically connects the electrodes to each other by contact or via conductive particles, depending on the purpose. .

Next, the invention described in the T form of the present invention will be described.

The present invention relates to an adhesive tool for crimping an electronic component, a circuit board, or circuit boards together, and simultaneously bonding an adhesive material for electrically connecting both electrodes to a circuit board.

Next, the background art of the invention described in the T form of the present invention will be described.

Generally, as a method of adhesively fixing electronic components, such as liquid crystal panels, plasma display panels (PDPs), fluorescent display (EL) panels, bare chip mounting, and circuit boards and circuit boards, and electrically connecting the electrodes. , Adhesive tape is used.

Japanese Patent Laid-Open No. 2001-284005 discloses winding up an adhesive tape coated with an adhesive on a base material in a reel form, and attaching a reel of the adhesive tape (hereinafter referred to as an adhesive reel) to an automatic adhesive machine. Use is described.

The automatic bonding machine includes a mounting portion of an adhesive reel, a mounting portion of an empty reel, a heating press member provided between these reels, and a table on which a substrate is placed. The adhesive tape is drawn out from the adhesive reel onto the substrate, and the heating press member This pressurizes an adhesive tape from the back side of a base material, and compresses an adhesive material on a board | substrate.

However, the conventional automatic bonding machine is large in size, and there is a problem in that it is difficult to change and operate the adhesive material to the substrate partly, the area for pressing the adhesive material is small, or the pressure bonding method, because it is large. .

On the other hand, apart from such a large automatic bonding machine, there is a need for a mechanism that can be compactly and easily operated so that the adhesive material can be crimped without using a large apparatus in the case of localized parts or pressure bonding. .

Therefore, the invention described in the T form of the present invention is aimed at providing a bonding tool which is compact and can be operated by one hand and which can easily press the adhesive material to a part of the substrate.

EMBODIMENT OF THE INVENTION Next, embodiment of invention described in T form of this invention is described, referring an accompanying drawing. 62A and 62B are views of a splicer according to the first embodiment of the invention described in the T form of the present invention, FIG. 62A is a perspective view of the splicer, FIG. 62B is an AA cutaway view of FIG. It is a side view explaining the usage method of the bonding tool shown to 62A and 62B, and FIG. 64 is a process chart which shows the manufacturing method of a bonding tool.

The bonding tool 111 according to the present embodiment is mainly composed of one reel (supply reel) 3, the other reel (empty reel) 5, and a case 99 for storing them. The adhesive tape 1 is wound around one reel 3, and one end 9a of the adhesive tape 1 is fixed to the other reel 5.

The case 99 is formed in a dimension which can be grasped by one hand, and when viewed from the side, the case 99 has a substantially triangular shape in which an angle is curved, and is easy to hold. Opening 113 is formed in each part of the substantially triangular case 99, and the adhesive tape 9 is exposed from this opening 113. FIG.

Moreover, the heating member 114 protrudes in the opening part 113, and this heating member 114 is substantially triangular when viewed from the side, and it is extended out from the upper surface 13a to the lower surface 13b. The adhesive tape 1 is guided and the heat transfer plate 115 is provided on the lower surface side.

In the case where the shape of the heating member 114 is in the shape of a rod, and the adhesive tape 9 is taken out by covering the heating member 114 with the heat transfer plate 115, the heating member 114 is rotated to smooth the tape 9. It is possible to withdraw. In addition, it is preferable to provide polytetrafluoroethylene, silicone rubber, or both of them on the outer side of the heat transfer plate 115, since the pressure is uniformly applied when the adhesive material 9 is pressed.

The case 99 is made by fitting the half cases 99a and 99b, and one and the other reels 3 and 5 are housed in the case. Furthermore, the guide 16 is provided in the case, and guides the movement of the adhesive tape 1. In addition, a plate-shaped guide is formed on one side of the bottom of either of the casings 99a or 7b, and when the guide is pressed against the edge of the circuit board, the adhesive material is pressed onto the circuit board so that the adhesive material can be precisely pressed along the circuit board. Can be.

One gear 116 is fixed to one reel 3 on the same shaft, and the other gear 117 is fixed to the same shaft on the other reel 17, and one gear 116 and When the other gear 117 is joined together and one reel 3 is rotated and the adhesive tape 1 is pulled out, the other reel 17 is rotated by the amount of drawing of the adhesive tape 1. Thus, the substrate 9 is wound up. Furthermore, the gear unit 118 is comprised by one gear 116 and the other gear 117.

In addition, a third case (power supply means) 119 for supplying electric power to the heating member 114 is provided on the side surface of the case 99. In the third case 119, a battery is stored, The adjustment circuit of the electric power supplied to the heating member 114 is accommodated. In addition, a power switch 120 is provided in the third case 119. The ON / OFF operation is possible by the finger of the hand holding the bonding tool 111.

62B, the adhesive material 11 is apply | coated to the single side | surface of the base material 9 on the adhesive tape 1.

In this embodiment, the adhesive tape 1 is about 20 m in length and width W is about 1.2 mm.

Although the base material 9 uses OPP (stretched polypropylene), polytetrafluoroethylene, silicone-treated PET (polyethylene terephthalate) etc. from the surface of the peeling property of the adhesive material which comprises an anisotropically conductive material, it restrict | limits to these It doesn't happen.

As the adhesive material 11, a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin and a hot melt system are used. Typical resins include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, vinyl ester resins, acrylic resins and silicone resins are used as the thermosetting resins.

The conductive particles 13 are dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like, and polymer core materials such as non-conductive glass, ceramics, and plastics. The above conductive layer may be formed by coating or the like. Moreover, the insulation coating particle | grains which coat | cover the above-mentioned electrically conductive particle with an insulating layer, the combination of electrically conductive particle and insulating particle, etc. are also applicable. Forming a conductive layer on a hot melt metal such as solder or a polymer core material such as plastic has deformability by heating pressurization or pressurization, the distance between electrodes after connection decreases, and the contact area with the circuit increases during connection. It is preferable because the sea reliability is improved. Particularly, when the polymers are used as the nucleus, the melting point is not shown as in the solder, and thus the softening state can be widely controlled at the connection temperature, and the connection member which is easy to cope with variations in the thickness and flatness of the electrode is obtained.

Next, a method of using the bonding tool 111 according to the present embodiment will be described. As shown in Fig. 63, the bonding tool 111 is held by one hand, and the power switch 120 is turned ON. Then, the opening 113 exposed by the adhesive tape 1 is pressed against the circuit board 27. Since the heating member 114 is provided in the opening part 11 in the base material 9 side of the adhesive tape 1, by pressing the adhesive tape 1 in the lower surface side of the heating member 114, The adhesive material 11 is heated and pressed to the circuit board 27.

When the adhesive sphere 111 is pressed downward and proceeds to the front (arrow E in FIG. 63), the adhesive tape 1 is sequentially drawn out, and the heating member 114 proceeds in the E direction and at the same time, a new adhesive 9 Is placed under the heating member 114 so that the adhesive 11 is sequentially pressed onto the circuit board 27.

In this way, when the adhesive tape 1 is pulled out from one reel 3, one reel 3 rotates, so that one gear 116 fixed to the same axis of one reel 3 is rotated. It rotates and the other gear 117 fitting to this rotates, and winds around the base material 9 after peeling off the adhesive material 25 to the other reel 17.

According to the present embodiment, when the adhesive material 11 is to be pressed at an arbitrary position on the circuit board 27, the adhesive material 11 can be simply pressed by simply holding the adhesive sphere 111 with one hand to advance. There is a number. In this way, the adhesive 11 can be easily pressed, for example, when pressing the electronic component (wiring circuit) 37 on the circuit board 27 or the like, or only a part of the circuit board 27. This is particularly effective when the electronic component (wiring circuit) 37 is crimped.

After the above-mentioned crimping (temporary connection), the electrodes of the circuit board 27 and the electrodes of the electronic component (wiring circuit) 37 are aligned and connected. In this connection, after bonding the adhesive 11 to the circuit board 27, the electronic component (wiring circuit) 37 is placed on the adhesive 11, and as necessary, a polytetrafluoroethylene material 39 ), The electronic component (wiring circuit) 37 is heated and pressurized by the heating press head 19 to the circuit board 27 (see FIG. 4). Thereby, the electrode 27a of the circuit board 27 and the electrode 37a of the electronic component (wiring circuit) 37 are connected and fixed.

Moreover, since the adhesive tape 1 is accommodated in the case 99 and used as it is, it is easy to handle and good workability.

Here, with reference to FIG. 64, the manufacturing method of the bonding tool 111 which concerns on this embodiment is demonstrated.

The coater 28 is applied to the base material (separator) 23 unwound from the unwinder 25, and the adhesive material in which the resin and the conductive particles 13 are mixed is applied and dried in the drying furnace 29, and then the winder ( 31) wind the disc. After the raw material of the wound adhesive tape is cut into the predetermined width by the slitter 33 in the finishing step and wound up on the reel 3, one reel 3 and the other reel (empty reel) 5 ) Is fitted to the half cases 99a and 99b, and the bonding tool 111 is manufactured by assembling and attaching the third case 119 in which the heating member 114 and the battery are stored.

The adhesive sphere 111 is packed together with the dehumidifying material, and is preferably released at a low temperature (-5 ° C to -10 ° C).

Next, the 60th to 64th inventions of the present application will be described.

The present invention relates to an adhesive tape for electrically connecting electronic components and circuit boards or circuit boards and electrically connecting both electrodes, and more particularly, to an adhesive tape wound in a reel shape.

Next, the background art of the 60th-64th inventions of this application is demonstrated.

Generally, electronic components such as liquid crystal panels, plasma display panels (PDPs), fluorescent display (EL) panels, bare chip mounting, circuit boards, and circuit boards are adhesively fixed and electrically connected to both electrodes. , Adhesive tape is used.

Japanese Patent Laid-Open No. 2001-284005 discloses winding up an adhesive tape coated with an adhesive on a substrate in a reel form.

This type of conventional adhesive tape has a width of about 1 to 3 mm, a length of the tape wound on the reel is about 50 m, and the adhesive tape is once unwound from the reel and pressed again after the adhesive is pressed onto a circuit board or the like. There is no case.

Moreover, with the recent increase in the size of panel screens in PDPs and the like, the adhesion area of circuit boards has increased, and the amount of adhesive materials used at one time has increased. In addition, since the use of the adhesive material has also been expanded, the amount of the adhesive material used has increased. For this reason, the manufacturing frequency of an electronic device has a problem that the replacement frequency of an adhesive reel increases, and since it takes time to replace an adhesive material reel, the improvement of the production efficiency of an electronic device cannot be aimed at.

For this problem, it is considered to increase the amount of adhesive material per reel and to reduce the reel exchange frequency by increasing the number of turns of the adhesive tape wound on the reel. However, since the thickness of the adhesive tape is thick, the number of turns per reel is increased. it's difficult.

In addition, although it is considered to reduce the thickness of the adhesive tape, since PET (polyethylene terephthalate) treated with silicon is used as the base material, there is a fear that if the thickness of the base material is reduced, defects such as sagging of the base material and cutting are likely to occur. have.

Therefore, the 60th-64th invention of this application aims at providing the adhesive tape which can increase the number of turns per reel, and can aim at the improvement of the production efficiency of an electronic device.

EMBODIMENT OF THE INVENTION Next, embodiment of 60th-64th invention of this application is described, referring an accompanying drawing. 65A, 65B, 3A, 4, 29, and 5 illustrate a first embodiment of the sixty-fourth invention of the present application. 65A and 65B are views of the adhesive tape according to the first embodiment, FIG. 65A is a perspective view showing an adhesive reel, and FIG. 65B is an A-A cross-sectional view in FIG. 65A.

The adhesive tape 1 is wound on the reel 3, and the reel 3 is provided with side plates 7 disposed on both width sides of the core 5 and the adhesive tape 1.

The adhesive tape 1 is comprised from the base material 9 and the adhesive material 11 apply | coated to one side surface of the base material 9.

The copper film (copper foil) was used for the base material 9. The thickness of the substrate 9 (indicated by S in FIG. 65B) is 10 μm, the tensile strength at 25 ° C. of the substrate 9 is 500 MPa, and the ratio of the thickness to the adhesive 11 of the substrate 9 (S / T) was 0.5 and the thickness of the adhesive material 11 was 20 micrometers. The surface roughness R _max of the substrate 9 was 0.25 μm.

Moreover, what used aromatic polyamide film (mixtron) for the base material 9 was also produced. The thickness (S / T) of the thickness of the base material 9, the tensile strength, and the thickness of the base material 9 with respect to the adhesive material 11 was produced to be the same as that of the copper film.

Next, the use method of the adhesive tape mentioned above is demonstrated. As shown in FIG. 3A, the reel 3 of the adhesive tape 1 and the winding reel 17 are attached to the adhesive device 15, and the tip of the adhesive tape 1 wound on the reel 3 is guided. It attached to the winding-up reel 17 on (22), and pulled out the adhesive tape 1 (arrow E in FIG. 3A). And the adhesive tape 1 is arrange | positioned on the circuit board 21, the adhesive tape 1 is press-contacted from the base material 9 side by the heating press head 19 arrange | positioned between both reels 3 and 17, The adhesive material 11 was pressed onto the circuit board 21. Then, the base material 9 was wound up to the winding reel 17.

Next, as shown in FIG. 4, the wiring circuit (or electronic component) 23 is arrange | positioned to the adhesive material 11 crimped | bonded to the circuit board 21, and the polytetrafluoroethylene material 24 is interposed as a cushion material. The wiring circuit 23 was heat-pressed to the circuit board 21 by the heating press head 19. As a result, the electrodes 21a of the circuit board 21 and the electrodes 23a of the wiring circuit 23 were connected.

As shown in FIG. 29, the connection part of the PDP 26 using the adhesive tape 1 which concerns on this embodiment, the adhesive material 11 is crimped | bonded all around the PDP, and the adhesive material 11 used at once is shown. It is evident that the amount of used is significantly higher than in the prior art. Therefore, the usage amount of the adhesive tape 1 wound on the reel 3 also increases, and the adhesive tape 1 wound on the reel 3 is wound on the winding reel 17 in a relatively short time, and the reel 3 is empty. You lose.

When the reel 3 became empty, the used reel 3 and the new reel were replaced, and a new reel was attached to the bonding apparatus 15. Then, as described above, the adhesive material 11 was pressed onto the circuit board 21 and the operation of winding the base material 9 to the winding reel 17 was repeated.

As a result, the thing using the copper film for the base material 9, the thing using the aromatic polyamide film, and both were easy to handle similarly to the conventional adhesive tape 1, and there was no sagging or cutting | disconnection of the base material 9, either. . And as the thickness of the base material 11 became thin compared with the conventional product (50 micrometers), the number of turns of the adhesive tape became large, the frequency of reel replacement became small, and productivity improved.

Here, with reference to FIG. 5, the manufacturing method of the adhesive tape 1 which concerns on this embodiment is demonstrated.

The coater 27 is applied to the base material (separator) uncoiled from the unwinder 25, and the adhesive material 11 in which the resin and the conductive particles 13 are mixed is applied, dried in the drying furnace 29, and then wound up ( 31) wind the disc. After the disk of the wound adhesive tape 1 is cut into the predetermined width by the slitter 33 and wound up to the core, the side plates 7 are attached to the core 5 from both sides, and are packed together with the dehumidifying material. Preferably, it is released at a low temperature (-5 ° C.-10 ° C.).

Furthermore, also in the case of 4 micrometers, 20 micrometers, and 25 micrometers copper film and aromatic polyamide film, the thickness of the base material 9 produced the adhesive tape 1, and actually used it as mentioned above, No defects such as sagging and cutting of (9) were generated.

Moreover, also about the case of the copper film and aromatic polyamide film which made ratio (S / T) of thickness with respect to the adhesive material 11 of the base material 9 into 0.01, 0.05, 1.0, the adhesive tape 1 is produced, As described above, when actually used, no defects such as sagging of the base material 9 and cutting occurred.

Next, the 65th to 66th inventions of the present application will be described.

These inventions are related with the adhesive material formation method of the adhesive tape which adhesively fixes an electronic component, a circuit board, or a circuit board, and electrically connects both electrodes. The present invention also relates to a method of forming an adhesive material for an adhesive tape used in a semiconductor device for bonding and fixing a semiconductor substrate (chip) to a support substrate for fixing a lead frame, a die of a lead frame, and a support substrate for mounting a semiconductor element. It relates to a method for forming an adhesive of the adhesive tape reel wound with a.

Next, the background art of the 65th to 66th inventions of the present application will be described.

Generally, electronic components such as liquid crystal panels, plasma display panels (PDPs), fluorescent display (EL) panels, bare chip mounting, circuit boards, and circuit boards are adhesively fixed and electrically connected to both electrodes. , Adhesive tape is used. Moreover, adhesive tape is used for adhesive films, such as a lead fixing tape of a lead frame, a LOC tape, a die-bonding tape, a microBGA and a CSP, etc., and is used in order to improve productivity and reliability of the whole semiconductor device.

Japanese Patent Laid-Open No. 2001-284005 discloses winding up an adhesive tape coated with an adhesive on a substrate in a reel form.

The conventional adhesive tape of this kind has a width of about 1 to 3 mm and a length of the tape wound on the reel is about 50 m.

In the case of attaching the adhesive tape to the adhesive apparatus, an adhesive tape reel (hereinafter simply referred to as "adhesive reel") is attached to the adhesive apparatus, the lead end of the adhesive tape is taken out, and attached to the winding reel. And the adhesive material is crimped | bonded by a heating press head from the base material side of the adhesive tape wound up from the adhesive material reel with a circuit board etc., and the remaining base material is wound up by the winding reel.

When the adhesive tape of the adhesive reel is finished, the finished reel and the winding reel winding the base material are removed, a new adhesive reel and a new winding reel are mounted on the adhesive device, and the beginning of the adhesive tape is attached to the winding reel. have.

Moreover, with the recent increase in the size of panel screens in PDPs and the like, the adhesion area of circuit boards has increased, and the amount of adhesive materials used at one time has increased. In addition, since the use of the adhesive material has also been expanded, the amount of the adhesive material used has increased. For this reason, the manufacturing frequency of an electronic device becomes large, and since the replacement frequency of an adhesive material reel becomes large and it takes time to replace an adhesive material reel, there exists a problem that the improvement of the production efficiency of an electronic device is not aimed at.

In response to this problem, it is considered to increase the amount of adhesive material per reel by reducing the number of turns of the adhesive tape wound on the reel, and to reduce the frequency of reel replacement.However, increasing the number of turns of the adhesive tape increases the number of turns of the adhesive tape of the reel. The dimension (hereinafter referred to as "winding diameter") is also large, and it is difficult to attach to the existing adhesive device, there is a fear that the existing adhesive device can not be used.

Therefore, the 65th-66th invention of this application aims at providing the formation method of the adhesive tape which can aim at the improvement of the production efficiency of an electronic device, without increasing the winding diameter of an adhesive tape.

EMBODIMENT OF THE INVENTION Next, embodiment of 65th-66th invention of this application is described, referring an accompanying drawing. EMBODIMENT OF THE INVENTION The 1st Embodiment of the 65th-66th invention of this application is described with reference to FIG. 66A and 66B, 67, 68, 4, 29, and 5. FIG. 66A and 66B are views showing an adhesive material forming step of the adhesive tape according to the first embodiment, and FIG. 66A shows a step of overlapping each adhesive tape together to unify and winding one substrate onto a reel for winding. 66B is sectional drawing which shows the overlapping part of the adhesive materials in FIG. 66A, FIG. 67 is a schematic diagram which shows the process of forming the adhesive material in a bonding apparatus in a to-be-adhered body, FIG. 68 is the adhesive tape wound up. 4 is a cross-sectional view showing adhesion of circuit boards, FIG. 29 is a perspective view showing a state of use of the adhesive material in the PDP, and FIG. 5 is a process chart showing the manufacturing method of the adhesive tape.

The adhesive tape 1 is wound on the reels 3 and 121, respectively, and each reel 3 and 121 is provided with side plates 7 arranged on both width sides of the core 5 and the adhesive tape 1. . The adhesive tape 1 is comprised from the base material 9 and the adhesive material 11 apply | coated to one side surface of the base material 9.

Although the base material 9 uses OPP (stretched polypropylene), polytetrafluoroethylene, silicone-treated PET (polyethylene terephthalate) etc. from the surface of the strength and the peelability of an adhesive material, it is not limited to these.

As the adhesive material 11, a thermoplastic resin, a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin is used. Typical examples of such resins include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, acrylic resins and silicone resins as thermosetting resins.

The conductive particles 13 may be dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like, and / or non-conductive glass, ceramics, plastics, and the like. The polymer nucleus material or the like may be formed by coating or the like. Moreover, the insulation coating particle | grains formed by coating the above-mentioned electrically conductive particle with the insulating layer, the combination of electrically conductive particle and insulating particle, etc. are also applicable. Forming a conductive layer on a hot melt metal such as solder or a polymer core material such as plastic has deformability by heating pressurization or pressurization, the distance between electrodes after connection decreases, and the contact area with the circuit increases during connection. It is preferable because the solution reliability is improved. Particularly, when the polymers are used as the nucleus, the melting point is not shown as in the solder, and thus the softening state can be widely controlled at the connection temperature, and the connection member which is easy to cope with variations in the thickness and flatness of the electrode is obtained.

Next, the usage method of the adhesive tape which concerns on this embodiment is demonstrated. As shown in FIG. 66A, the reel 3 and 121 of the two adhesive tapes 1 and the reels 17 and 18 for winding are attached to the bonding apparatus 15 and wound on one reel 3. The tip of the adhesive tape 1 is hooked on the guide pin 22 to be attached to one winding reel 17, and the adhesive tape 1 is fed out (arrow E in Fig. 66A). Moreover, the front end of the adhesive tape 1 wound on the other reel 121 is also attached to the other winding reel 18, and the adhesive tape 1 is fed out.

The adhesive tape 1 drawn out from the reels 3 and 121 is formed by pressing rollers 122 disposed between the reels 3 and 121 and the heating press head 19. Put them together. And the base material 9 of the other adhesive tape 1 is wound up to the winding reel 18. As shown in FIG.

Then, one adhesive tape 1 is placed on the circuit board 21, the adhesive tape 1 is press-contacted from the substrate 9 side by the heating press head 19, and the adhesive material 11 is a circuit as an adherend. It forms by crimping | bonding to the board | substrate 21. Then, the base material 9 is wound up by the winding reel 17.

Next, as shown in FIG. 4, the wiring circuit (or electronic component) 23 is arrange | positioned to the adhesive material 11 crimped | bonded to the circuit board 21, and the polytetrafluoroethylene material 24 is interposed as a cushion material. The wiring circuit 23 is heated and pressurized by the heating pressurizing head 19 to the circuit board 21. As a result, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 are connected.

Fig. 29 shows a connecting portion of the PDP 26 using the adhesive tape 1 according to the present embodiment, and the adhesive material 11 is pressed over the entire circumference of the PDP 26 and used at once. It is clear that the use amount of (11) is particularly high compared with the prior art. Therefore, the usage-amount of the adhesive tape 1 wound on the reels 3 and 121 also increases, and the adhesive tape 1 wound on the reels 3 and 121 is wound around the winding reels 17 and 18 in a relatively short time.

In this embodiment, the adhesive 11 of one adhesive tape 1 and the adhesive 11 of the other adhesive tape 1 in the step immediately before the adhesive 11 is crimped to the circuit board 21. ), The adhesive material 11 is pressed onto the circuit board 21 after the thickness of the desired adhesive material 11 is overlapped, so that the thickness of each adhesive tape 1 can be made half. Therefore, the number of turns of the adhesive tape 1 per reel can be increased, and the amount of adhesive which can be used in one replacement operation can be significantly increased. Therefore, the replacement work of the new adhesive tape 1 takes less time, and the production efficiency of the electronic device becomes high.

Here, with reference to FIG. 5, the manufacturing method of the adhesive tape which concerns on this embodiment is demonstrated.

On the substrate (separator) wound from the unwinder 25, a coater 27 is applied to the adhesive material 11, in which the resin and the conductive particles 13 are mixed, in a thickness of about half the normal thickness, and then in the drying furnace 29. After drying, the disk is wound up with a winder 31. After the disk of the wound adhesive tape 1 is cut into the predetermined width by the slitter 33 and wound up to the core 5, the side plates 7 are mounted on the core 5 from both sides, and the dehumidifying material and It is packed together and preferably released at a low temperature (-5 ° C to -10 ° C). Moreover, the adhesive tape 1 may contain the hardening | curing agent mentioned later in the adhesive material 11.

Next, another embodiment of the sixty-ninth to sixty-sixth inventions of the present application will be described. In the embodiments to be described below, the same reference numerals are assigned to the same parts as the above-described embodiments, and the detailed description of the parts will be given. Will be omitted, and differences from the above-described embodiment will mainly be described.

In the second embodiment shown in FIG. 69A, the adhesive tape 1a containing the curing agent and the conductive particles 13 in the adhesive 11a and the adhesive tape 1b not containing the curing agent and the conductive particles 13 are shown. Both production is performed, and as shown in FIG. 69A, the adhesive material tape 1a containing a curing agent or the like and the adhesive material tape 1b containing no curing agent or the like are overlapped and integrated, so that the overlapping is pressed onto the circuit board 21. You may also In this case, since a hardening | curing agent is contained only in the adhesive material 11a of one adhesive material tape 1a, a hardening | curing agent is unnecessary for the adhesive material 11b of the other adhesive material tape 1b. Therefore, low-temperature management becomes unnecessary for the adhesive tape 1b of the adhesive 11b which does not contain a hardening | curing agent. Therefore, the number of adhesive tapes 1a requiring low temperature management can be reduced, and efficient management of transportation and storage of adhesive tapes can be performed.

Moreover, when an adhesive material is an epoxy resin type, as a hardening | curing agent of an epoxy resin, an imidazole type, an amine imide, an onium salt, polyamines, a polymercaptan, etc. are mentioned.

In addition, as shown in FIG. 69B, the conductive material 13 is contained in the adhesive material 11a of one adhesive tape 1a containing a hardening | curing agent, and it has a 2-layered constitution, and the electroconductive particle is not contained in the side to be crimped | bonded. Therefore, the conductive particles do not flow out between the circuits in which the conductive particles oppose each other with the flow of the resin, and the conductive particles 13 are reliably held between the electrodes 21a and the electrodes 23a in the case of heating and pressing. Can be.

The 65th to 66th inventions of the present application are not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the 65th to 66th inventions of the present application.

In the first embodiment, the conductive material 13 is included in the adhesive material 11, but the adhesive material 11 that does not contain the conductive particles 13 may be used.

In the above, the case where the electronic component, the circuit board, and the circuit boards are bonded and fixed has been described. The same can be done for the semiconductor device to be fixed.

Next, the invention described in the U to Z form of the present invention will be described.

These inventions provide, for example, an electronic component such as a liquid crystal panel, a PDP panel, an EL panel, a bare chip mounting, and an electronic conductive material such as a circuit board and a circuit board, and for supplying an anisotropic conductive material for electrically connecting the electrodes. It relates to anisotropically conductive tapes, and in particular to the shape of the anisotropically conductive material.

Next, the background art of the invention described in the U-Z form of this invention is demonstrated.

A method for connecting electronic components, circuit boards, and circuit boards by means of anisotropic conductive tape, by inserting an anisotropic conductive material, which is a film-like adhesive material, between electrodes facing each other, and heating and pressurizing the connection between the electronic parts, circuit boards, and circuit boards. It is supposed to. In the film-like adhesive material, conductive particles for obtaining conduction between electrodes are mixed, and as a resin, a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin, and a photocurable resin are used (for example, in Japanese Patent Laid-Open). 55-104007).

Moreover, the circuit connection method using the anisotropic conductive material which does not contain electroconductive particle but consists only of resin is also known (for example, refer Unexamined-Japanese-Patent No. 60-262430).

Typical resins include styrene resins and polyester resins as thermoplastic resins, and epoxy resins, silicone resins and acrylic resins are known as thermosetting resins. In order to connect both a thermoplastic resin system and a thermosetting resin system, heating pressurization is required. In a thermoplastic resin system, resin is made to flow and the adhesive force with a to-be-adhered body is obtained, and in a thermosetting resin system, it is for further hardening reaction of resin. In recent years, from the standpoint of connection reliability, the mixed system of a thermoplastic resin and a thermosetting resin and a thermosetting resin system have become mainstream. In addition, photocurable resins that can be connected at low temperatures are also being used industrially.

Moreover, in recent years, in order to prevent the to-be-bent and droop of a to-be-connected body, the connection temperature at the time of the connection of an anisotropic conductive material is required to be lowered. In addition, the demand for shortening the tact time at the time of connection is increasing with the expansion of the connection use of anisotropic conductive materials and the expansion of demand for liquid crystal panels, PDP panels, EL panels, bare chip mounting, and the like.

In addition, as connection demands and applications of anisotropic conductive materials expand, productivity as well as short-term connections are demanded. As the demand for liquid crystal panels, PDP panels, EL panels, and bare chip mounting increases, the use of anisotropic conductive materials is increasing. Han Hyun, along with the growing demand for large screen flat panels, such as large screens for liquid crystal panels and PDP panels, also increased the amount of used for one panel of anisotropic conductive materials. Conventionally, the anisotropic conductive material is supplied in the shape of a reel in which a film-shaped adhesive material is wrapped around a core material having a circular cross section, and the reel replacement time has hindered the improvement of productivity.

On the other hand, as the liquid crystal panel softens, narrowing of the anisotropic conductive material is progressing, and in the conventional reel shape wound on the same centrifuge, the winding of the wound occurs, and the yield in manufacturing process deteriorates. Was doing.

The present invention described in the U-Z form of the present invention has been made in view of the above-described drawbacks, and the anisotropic degree which contributes to the improvement of productivity by lengthening the interval of exchange time of the reel and eliminating the fall of workability due to the disturbance of the winding. It was an object to provide a transfer tape.

Next, embodiment of invention described in the U-Z form of this invention is described.

It is a schematic diagram which shows 1st Embodiment of invention described in U-Z form of this invention.

As shown in FIG. 70, the anisotropic electrically conductive material tape of this embodiment uses the anisotropic electrically conductive material which consists of a two-layered structure of the film-form adhesive 11 and the base film (base material) 9 which peeled off both surfaces. It is formed by winding a plurality of times in a phase of failure in the longitudinal direction of), and FIG. 70 shows a supply mode of the anisotropic conductive material. In FIG. 70, side plates 7 are provided at both ends of the core 5. Moreover, the anisotropically conductive tape consists of the film-form adhesive material 11 which is an anisotropically conductive material apply | coated on the base film 9 and the base film 9, and in an anisotropically conductive tape, the highly detailed electronic component In order to prevent foreign substances and contamination of inorganic and organic substances, it is used for the connection of the base film 9 to the outer side of an adhesive material.

The connection using the anisotropic conductive material is required to improve the tact time, and the rapid transferability of the anisotropic conductive material is required. As described above, the anisotropic conductive material is wound several times in the longitudinal direction of the core material (the core) 5 with the side plate 7, laminated, and wound in a failure phase, so that the wound is not disturbed. It is possible to supply long anisotropic conductive materials. For this reason, the space | interval of the exchange time of an anisotropically conductive material tape can be lengthened, and productivity can be improved.

In the anisotropic conductive tape, the tensile strength of the base film 9 is preferably 12 kg / mm 2 or more, and the breaking elongation of the base film 9 is preferably 60 to 200%. Thereby, since the base film 9 has strength and small sagging, in the process before transferring the film adhesive 11 which comprises an anisotropic conductive material to connection members, such as a circuit board, a film adhesive ( 11) can be prevented from sagging, thinning, or narrowing in width. In addition, the thickness of the base film 9 is preferably 100 μm or less in consideration of handling and environment. Since the said effect becomes inferior when the base film 9 is thin, it is preferable that the thickness of the base film 9 shall be 0.5 micrometer or more.

Moreover, as the base film 9 used for the said anisotropic conductive tape, PP (polypropylene), OPP (stretched polypropylene) which carried out the silicone and fluorine peeling process from the peelable surface of the adhesive material which comprises an anisotropic conductive material, Although PET (polyethylene terephthalate) etc. are used, it is not limited to these.

The peeling treatment of the base film 9 can be easily carried out by performing a silicon or fluorine treatment. If the peeling treatment is carried out only on one side of the base film 9, the difference in the releasability in the front and back of the base film 9 is different. It can design, and the back transfer with respect to the base film 9 can be prevented. In addition, when performing peeling process on both surfaces of the base film 9, silicone and a fluorine process are performed with respect to the film adhesive material 11 surface, and it has a peelable property on the film adhesive material 11 surface.

As the film-like adhesive 11, a epoxy resin system which is a thermosetting resin system having high reliability, a silicone resin system which is effective in reducing the stress of the adhesive and which is effective in compatibility of the adhesive, and which can be connected at a low temperature and a short time more than these. Although what is system type is used, the film-form adhesive 11 is not limited to these. As the radical adhesive 11, an acrylic adhesive is mainly used.

It is a schematic diagram which shows 2nd Embodiment of this invention as described in U-Z form of this invention. In addition, in FIG. 71, the same code | symbol is attached | subjected to the same component as FIG. 70, and detailed description is abbreviate | omitted.

As shown in FIG. 71, the anisotropically conductive tape of this embodiment has two types of base films, and except for using the anisotropically conductive material of 1st Embodiment except having used the anisotropically conductive material comprised so that an adhesive material might be interposed therebetween. Have the same configuration. That is, as shown in FIG. 71, the anisotropic electrically conductive material in this embodiment becomes a three-layered structure of the two types of base materials 9a and 9b which peeled the film-like adhesive material 11 and the adhesive material 11 surface. .

When the adhesive material which comprises an anisotropic conductive material is soft, deformation | transformation of the adhesive material by the following base film on the core side can be prevented.

Moreover, it is preferable that the tensile strength of the base film 9a, 9b which is the physical property value of the base film 9a, 9b shall be 12 kg / mm <2> or more, and the breaking elongation of the base film 9a, 9b shall be 60-200%. The same as in the case of the first embodiment. Thereby, physical strength is obtained in the base films 9a and 9b, and it is possible to prevent thinning and thinning in the width direction with the sagging of the film-like adhesive material. In addition, it is preferable that the thickness of the base materials 9a and 9b be 100 micrometers or less, and, by this, handling and an environment can respond.

Moreover, in the said 1st and 2nd embodiment, if the film-form adhesive material 11 which comprises an anisotropic conductive material does not have adhesiveness, and does not show blocking phenomenon, the film-form adhesive material 11 is made into the base film 9 or 9a. 9b) can be wound alone without failure.

Although an Example is described next, the invention described in the U-Z form of this invention is not restrict | limited to these Examples.

(Example 1)

(1) Production of anisotropic conductive film

A 30 wt% solution of ethyl acetate was prepared, and 5 vol% of Ni powder having an average particle diameter of 2.5 µm was added thereto. Then, 50 g of phenoxy resin (high molecular weight epoxy resin), 20 g of epoxy resin, and 5 g of imidazole were added to the ethyl acetate solution as a film forming material to obtain a solution for forming an adhesive. On the other hand, the base film which carried out the siliconization on both surfaces of the transparent 50-micrometer polyethylene terephthalate film (breaking strength 25kg / mm <2>, breaking elongation 130%) colored in light blue was prepared. And the said solution was apply | coated to the single side | surface of this base film using the roll coater, it dried at 110 degreeC for 5 minutes, and the roll of the anisotropically conductive material film of thickness 50micrometer was obtained.

(2) Production of anisotropic conductive tape

Anisotropically 300m long by slitting the roll of said anisotropically conductive material film to width 1.5mm, winding it several times in the longitudinal direction of the core material (winding core) of diameter 48mm and width 100mm with a side plate, and winding it in a failure phase. A conductive tape was obtained.

When anisotropic conductive material, that is, anisotropic conductive tape, which is wound around this failure phase, is installed in an anisotropic conductive tape squeezing automatic machine and supplied with an anisotropic conductive material, good results are obtained in the transferability and elongation test of the anisotropic conductive material. In addition, the number of times of reel adhesion was reduced, and the repetition of the attachment work due to time required for attachment, transferability, and sagging of the adhesive material was eliminated, and these effects improved productivity.

(Example 2)

In the same manner as in Example 1, a roll of an anisotropic conductive tape was produced. Then, a laminate of the base film and the adhesive material was further laminated with one kind of polyethylene terephthalate base film having a thickness of 25 μm (break strength of 25 kg / mm 2 and elongation at break of 130%) so as to sandwich the adhesive material with two base films. A roll of a three-layered anisotropic conductive film was obtained. Then, in the same manner as in Example 1, while winding the roll of this film at a width of 1.5 mm, an anisotropic conductive tape having a length of 300 m was wound around a core material (winding core) having a diameter of 48 mm and a width of 100 mm with a side plate. Got.

Also in Example 2, the favorable productivity similar to Example 1 was obtained.

(Example 3)

As in Example 1, except that a polytetrafluoroethylene film having a thickness of 50 µm (breakage strength of 4.6 kg / mm 2, elongation at break of 350%) was used in the same manner as in Example 1, a roll of the anisotropic conductive film was prepared. The 300-m length anisotropic conductive tape was obtained by winding a roll of this film with a width of 1.5 mm in the same manner as in Example 1, and winding the core material (wound) with a diameter of 48 mm and a width of 100 mm with a side plate. In this case too, it could be wound up to a length of 300 m.

(Comparative Example 1)

In the same manner as in Example 1, a roll of the anisotropic conductive film was obtained. Further, in the same manner as in Example 1, the roll of the film was wound in the same centrifugal shape on a conventional reel while slitting the roll of the film in a width of 1.5 mm. A transfer tape was obtained.

When the anisotropic conductive tape wound by this failure phase is installed in the anisotropic conductive tape squeezing automatic machine and the anisotropic conductive material is supplied, good results are obtained in the transferability and elongation test of the anisotropic conductive material. The number of times was three times higher than in the examples, and the time required for adhesion and the time used for adjustment were increased.

As explained above, according to the 1st invention of this application, the edge part of the adhesive tape (one adhesive tape) which unwinding was completed using the adhesive material of an adhesive tape, and the adhesive tape (another adhesive tape) newly mounted Since the end portion of the adhesive material is bonded to each other and the adhesive material reel is replaced, the mounting of a new adhesive material tape to the adhesive device can be simplified.

In addition, there is no need to replace the winding tape, install the beginning of the new adhesive tape on the winding reel, or set the guide pin in a predetermined path every time the replacement of the new adhesive tape is required. The production efficiency of electronic equipment becomes high.

Since one adhesive tape and the other adhesive tape overlap and adhere the adhesive material surfaces, connection strength is high.

According to the second invention of the present application, the same effects as those of the first invention of the present application can be exhibited, and the cutting of the adhesive tape after the unwinding can be performed when the end mark is exposed. Since it is easy to understand and can be connected in the minimum position required, waste of an adhesive tape can be prevented.

According to the third invention of the present application, as in the effect of the first invention of the present application, the mounting of a new adhesive tape to the bonding apparatus can be simplified, and the replacement time of the new adhesive reel takes less time, and the production of electronic equipment The efficiency is increased.

Moreover, since the end part of the adhesive material tape which unwinding | finished and the start end part of the newly attached adhesive material tape are adhere | attached using the lead tape of an adhesive material tape, adhesion of adhesive tapes can be simplified.

According to the fourth invention of the present application, as in the effect of the first invention of the present application, the mounting of a new adhesive tape to the bonding apparatus can be simplified, and the replacement time of the new adhesive reel is shortened, and the production of electronic equipment The efficiency is increased.

Moreover, since it is not necessary to turn over the adhesive tape after completion of unwinding, it is possible to prevent the possibility that the winding of the wound may occur when the adhesive tape is wound on the winding reel.

According to the 5th invention of this application, since the end part of the adhesive material tape which unwinding | finished and the start end part of the adhesive material tape to be newly attached are fixed with an engagement pin, connection is easy. In addition, there is no need to replace the winding tape, install the beginning of the new adhesive tape on the winding reel, or set the guide pin in a predetermined path every time the replacement of the new adhesive reel is performed. The less it takes, the higher the production efficiency of the electronic device.

According to the sixth invention of the present application, one click portion of the locking member is locked to the end portion of one adhesive material tape, and then the other click portion of the locking member is locked to the start end portion of the other adhesive material tape. Since it connects with each other, connection is easy.

Since the elastic member is provided between the one click portion and the other click portion, the elastic member is extended so that the other click portion of the locking member can be latched at an arbitrary position of the start end portion of the other adhesive tape. , The degree of freedom of connection is high.

In addition, since the ends of one adhesive tape and the other end of the adhesive tape are connected together, the tapes do not need to overlap each other and can be connected at the minimum position, so that the waste of the adhesive tape can be prevented. .

According to the 7th invention of this application, since the overlapped part of the terminal part of one adhesive material tape and the start end part of the other adhesive material tape can be connected only to a clip, connection operation is easy.

According to the eighth invention of the present application, the clamping pieces are pressed and crushed from both surfaces of the overlapped portions to connect the two, so that the connection strength of the overlapped portions of the adhesive tape can be increased.

According to the ninth invention of the present application, the end portion of the adhesive material tape terminated using the adhesive material of the adhesive material tape and the start end portion of the newly attached adhesive material tape are adhered to each other so that the adhesive material reel is replaced. Reel mounting can be simplified. In addition, it is not necessary to replace the take-up reel of the base material or install the beginning end of the new adhesive material on the take-up reel each time the replacement of the new adhesive material reel is performed, so that the replacement time of the new adhesive material reel takes less, and the production efficiency is increased.

According to the tenth invention of the present application, the same effects as in the ninth invention of the present application are exhibited, and both the end of one adhesive tape and the start of the other adhesive tape are hooked with each other, and both Since the surfaces of the adhesive materials are connected to each other, the connection strength is high.

According to the 11th invention of this application, while showing the same effect as the 9th or 10th invention of this application, the termination part of one adhesive material tape can be performed in an end mark part, and it is easy to know the part which performs a connection work, In addition, the waste of the adhesive tape can be prevented.

According to the twelfth invention of the present application, the same effects as in the invention of any of the ninth to eleventh aspects of the present application are exhibited, and at the same time, irregularities are formed in the connecting portion. The connection area can be widened and the strength in the tensile direction (length direction) of the adhesive tape in the connection portion can be increased.

According to the thirteenth invention of the present application, while exhibiting the same effect as the invention of any one of the ninth to eleventh aspects of the present application, by forming a through hole in the connecting portion, an adhesive material is exuded into the inner circumference of the through hole, Since the adhesion area by is increased, connection strength can be further improved.

According to the fourteenth invention of the present application, the reel is replaced only by connecting the finished adhesive tape (one adhesive tape) and the new adhesive tape (the other adhesive tape), so that a new adhesive material reel is attached to the adhesive device. Can be simplified. In addition, it is not necessary to replace the winding reel, install the beginning of the new adhesive tape on the winding reel, or to fasten the adhesive tape to the guide every time the replacement of the new adhesive reel is performed. Will increase the production efficiency.

Since the treatment agent used for the processing base material of an adhesive tape is silicone resin, and also using a silicone adhesive for an adhesive tape, since the difference of both surface tension is made small and adhesive force is raised, adhesion | attachment of both which was conventionally difficult can be achieved.

According to the fifteenth invention of the present application, the same effects as in the fourteenth invention of the present application are exhibited, and the difference between the surface tension of the pressure-sensitive adhesive surface in the silicone adhesive tape and the surface tension of the silicone-treated substrate in the adhesive tape By setting it as 10 mN / m (10 dyne / cm) or less, strong adhesive force can be obtained and both can be reliably bonded.

According to the sixteenth invention of the present application, the same effects as those of the fifteenth invention of the present application are exhibited, and furthermore, the adhesive force is 100 g / 25 mm or more, thereby adhering the adhesive to both adhesive material surfaces of one and the other adhesive tapes. I can make it stronger.

According to the seventeenth invention of the present application, the same effects as those of the sixteenth invention of the present application are exhibited, and one and the other adhesive tape are connected on both sides thereof, whereby a stronger connection can be obtained.

According to the eighteenth invention of the present application, since the double-sided pressure-sensitive adhesive silicone adhesive tape is used, the two-sided silicone pressure-sensitive adhesive tape can be sandwiched between one and the other adhesive tape, so that both can be bonded (or adhered to). Simple and easy.

According to the 19th invention of this application, since the end part of the adhesive material tape which unwinding | finished and the start end part of the adhesive material tape to attach newly are fixed by paste-type resin adhesive material, connection is easy. In addition, there is no need to replace the winding tape, install the beginning of the new adhesive tape on the winding reel, or set a guide pin in a predetermined path every time the replacement of the new adhesive reel is performed, so that the replacement time of the new adhesive reel is reduced. Therefore, the production efficiency of the electronic device is increased.

According to the twentieth invention of the present application, a resin suitable for the connection of adhesive tapes among the groups of thermosetting resins, photocurable resins, and hot melt adhesives is exhibited while exhibiting the same effect as those of the nineteenth invention of the present application. An adhesive material can be selected and the connection strength of adhesive tapes can be raised.

According to the twenty-first aspect of the present application, since the charger for supplying the resin adhesive of the nineteenth or twentieth aspect of the present application is provided in the bonding apparatus, it is not necessary to separately prepare the charger and prevent waste of connection work. Can be.

According to the invention described in the aspect A of the present invention, when the unwinding of the adhesive tape wound on one winding part is completed, the adhesive tape wound on the adjacent winding part is provided on the winding reel, and the adhesive tape is exchanged, thereby making it possible to obtain a new adhesive device. It is not necessary to mount the adhesive tape reel. Therefore, the replacement work of the new adhesive tape reel takes less, and the production efficiency of the electronic device becomes high.

According to the invention described in the B aspect of the present invention, the same effects as those of the invention described in the A aspect of the present invention are exhibited, and the end of one adhesive tape and the start end of the other adhesive tape are connected by a connecting tape. After the unwinding of the adhesive tape of one adhesive tape reel is completed, the work of attaching the adhesive tape of the other winding portion to the take-up reel is unnecessary, resulting in higher production efficiency of the electronic device.

According to the invention described in the aspect C of the present invention, the connecting tape is automatically wound on a winding reel. Therefore, after the adhesive tape of one winding part is finished, the adhesive tape can be taken out from the next winding part sequentially.

In addition, when the tape detecting means detects the connecting tape, the connecting tape is automatically wound on the winding reel until the connecting tape passes through the crimping portion, so that the time for winding can be saved.

According to the invention described in the aspect D of the present invention, since the connection portion between the end portion of one adhesive material tape and the start end portion of the other adhesive material tape covers the locking portion with the adhesive material tape, the appearance is good and the connection portion It is possible to prevent the interlock of the adhesive tape from contacting the adhesive tape and damaging the adhesive tape or the adhesive device.

According to the invention described in E aspect of the present invention, when the connecting portion detecting means detects the connecting portion, one adhesive tape is wound around the winding reel until the connecting portion passes through the pressing portion, so that the connecting portion comes to the pressing portion, The defect that a crimping operation is performed can be prevented. Moreover, since one adhesive tape is automatically wound up to a winding reel until a connection part passes a crimping | compression-bonding part, the time of winding can be saved.

According to the invention described in the form F of the present invention, the same effect as the invention described in the form E of the present invention can be exhibited, and the connection portion can be detected with a simple configuration. Moreover, the detection accuracy can be improved by using these means. have.

According to the twenty-ninth invention of the present application, since a plurality of sets of adhesive materials can be used one by one, the amount of adhesives usable in one reel can be increased by two times or more conventionally without increasing the number of turns of the tape.

Since the number of turns is not increased, the distraction of the wound can be prevented, and the blocking of the tapes that the adhesive material seeps out in the width direction of the tape and prevents the tapes from sticking to each other can be prevented. This can prevent damages such as sagging of the base material (damage or cutting of the base material) which are likely to occur.

In the manufacturing plant of an electronic component, the replacement | exchange frequency of a new adhesive tape is small, and work efficiency becomes high.

In addition, in manufacture of an adhesive tape, since the number of reels to manufacture can be reduced, the usage-amount of a reel material and a damp prevention material can be reduced, and a manufacturing cost can be reduced.

According to the thirtieth invention of the present application, the same effects as those of the twenty-ninth invention of the present application are exhibited, and adjacent adhesive material vests are separated, so that they can be easily separated one by one, so that the crimping to the circuit board becomes easy. Can be.

According to the thirty-first invention of the present application, the same effects as those of the twenty-ninth invention of the present application can be achieved, and only a slit is formed in the adhesive material coated on the single-sided front surface of the base material, so that the production is easy and the adjacent adhesive baths Since there is little gap, the number of adhesive material tanks arrange | positioned on a base material can be increased.

According to the 32nd invention of this application, the adhesive tape described in the 30th invention of this application can be manufactured easily.

According to the thirty-third invention of the present application, since two adhesive tapes can be produced simultaneously, the production efficiency is excellent.

According to the thirty-fourth invention of the present application, by heating a portion of the adhesive, the cohesive force of the portion is reduced to compress the circuit board. Therefore, since the adhesive tape is used by applying the adhesive on the entire surface of one side of the substrate, the existing equipment The adhesive tape can be manufactured as it is.

The width | variety of the adhesive material crimped | bonded to a circuit board can be arbitrarily set by changing a heating area, and the freedom degree of the adhesive material width crimped | bonded is high.

In the same way as the twenty-ninth invention of the present application, it is possible to press a set of substrates from the adhesive on the substrate and press them onto the circuit board, thereby increasing the amount of adhesive that can be used in one reel more than twice without increasing the number of turns of the tape. .

Since the amount of the adhesive can be increased without increasing the number of turns, similarly to the twenty-ninth invention of the present application, it is possible to prevent disturbance of the wound, and to prevent blocking due to the exudation of the adhesive and to sag the substrate. Harm caused by this can be prevented.

According to the thirty-fifth invention of the present application, since the width of the adhesive tape has the length of one side or more of the circuit board, the number of turns of the adhesive tape can be reduced while increasing the amount of the adhesive.

Since the amount of adhesive material to be used can be greatly increased without increasing the number of turns of the adhesive tape, it is possible to prevent disturbance of the wound and to prevent blocking or damage to the substrate or cutting. Moreover, in the manufacturing plant of an electronic component, the replacement | exchange frequency of a new adhesive tape takes little, and manufacturing efficiency becomes high.

Moreover, in manufacture of an adhesive tape, since the amount of adhesive materials per reel can be increased, the usage-amount of a reel material and a moisture prevention material can be reduced, and a manufacturing cost can be reduced.

According to the 36th invention of this application, since the same effect as the 35th invention of this application is exhibited, and adjacent adhesive material vests are isolate | separated, an adhesive material can be easily removed from a base material and crimped | bonded one by one.

According to the thirty-seventh invention of the present application, the same effects as those of the thirty-fifth invention of the present application can be exhibited, and the number of groups of the adhesive member disposed on the substrate can be increased, and the production is easy.

According to 38th invention of this application, since the adhesive tape of 36th invention of this application can be manufactured simultaneously using existing equipment, it is excellent in manufacturing efficiency.

According to the thirty-ninth invention of the present application, the effect of the invention of any one of the thirty-fifth to thirty-seventh embodiments of the present application can be obtained, and the adhesive material can be simply pressed onto one side of the circuit board, and the electronic component manufacturing plant Work efficiency can be improved.

According to the forty-fifth invention of the present application, the effects of the thirty-fifth to thirty-seventh inventions can be obtained, and at the same time, they are moved to the positions of one adhesive tape and the other adhesive tape without rotating the circuit board. Since the adhesive material can be easily crimped on the four circumferences of the circuit board, the work efficiency is good.

According to the forty-first aspect of the present application, in the case of pressing the adhesive material around the circuit board, it is possible to facilitate the pressing of the adhesive material on the circuit board by heat-pressing the adhesive tape in the form of an oil along the width direction. Can work, and work efficiency is good.

In addition, the adhesive tape may be applied to the entire surface of the adhesive tape so that the adhesive tape can be manufactured using the existing equipment as it is.

Furthermore, the width of the adhesive material pressed onto the circuit board can be arbitrarily set by changing the heating press area, and the degree of freedom of the adhesive material width to be pressed is high.

In addition, as in the thirty-fifth invention of the present application, the amount of the adhesive material can be increased without increasing the number of turns, and thus it is possible to prevent the disturbance of the wound and prevent the blocking due to the exudation of the adhesive material, and the base material to sag. The effect of being able to prevent the damage by this etc. can be acquired.

According to the invention described in the form G of the present invention, since the adhesive material is disposed at least two sets of adhesive materials in the width direction and used one by one, at least two reels can be used in one reel, without increasing the number of turns of the adhesive tape, The amount of adhesive available for one reel can be greatly increased.

In addition, since the number of turns of the adhesive tape is not increased, it is possible to prevent the distraction of the winding and to prevent blocking of the tapes that the adhesive tapes are exuded in the width direction of the tape and adhered to each other. By lengthening, the damage (damage of a base material, cutting | disconnection), such as sagging of a base material which is easy to produce can be prevented.

Since the adhesive tape is used as the cassette, no effort is required to install the adhesive tape on the reel in the bonding apparatus, so that only the cassette is attached to the bonding apparatus, so that it is easy to handle and the workability of installation and replacement is good.

According to the invention described in the H aspect of the present invention, the same effects as those of the invention described in the G aspect of the present invention are exhibited, and adjacent adhesive material jugs are separated, so that the adhesive material can be easily removed from the substrate one by one and pressed. .

According to the invention described in the aspect I of the present invention, the adhesive tape exhibits the same effect as that of the form G, and at the same time, the adhesive tape is easy to manufacture because the adhesive tape is only applied to the entire surface of one side of the substrate to form a slit.

According to the forty-fifth invention of the present application, the adhesive tape may be coated with the adhesive on the entire surface of the substrate, so that the adhesive tape can be manufactured using existing equipment as it is.

The width | variety of the adhesive material crimped | bonded to a circuit board can be arbitrarily set by changing a heating press area | region, and the freedom degree of the adhesive material width crimped | bonded is high.

According to the forty-sixth invention of the present application, the same effects as the forty-fifth invention of the present application can be exhibited, and in addition, the amount of adhesive material can be increased without increasing the number of turns, similarly to the first invention of the present application. It is possible to prevent the disturbance of the thing, and to prevent the blocking caused by the exudation of the adhesive material and to prevent the damage caused by the sagging of the substrate. At the time of use, when use of one reel is finished, only a cassette is reversed, and the following installation is easy. Since it is a cassette, handling is easy and workability of installation and replacement is good.

According to the invention described in the aspect J of the present invention, the base material of the adhesive tape is unbonded with the base material of the adhesive tape, and the start end of the adhesive tape to be newly attached is bonded to replace the adhesive reel. The mounting of a new adhesive reel to the device can be simplified. In addition, since it is not necessary to replace the winding reel or install the beginning of the new adhesive reel on the winding reel every time the replacement of the new adhesive material reel is performed, the replacement time of the new adhesive material reel is shortened, and the production efficiency of the electronic device is increased.

According to the invention described in the K aspect of the present invention, the same effects as those of the invention described in the J aspect of the present invention are exhibited, and since the heat flux layer is on the surface of the substrate, the start end portion is formed in the heat melt layer of the end portion of one adhesive tape. Since the surface of an adhesive material is overlapped and these parts are heated and crimped and both are connected, connection is easy.

Moreover, since the hot melt layer is formed over the entire length direction of the tape, it is not necessary to precisely position the overlapped length, and the degree of freedom of connection is high.

According to the invention described in the L form of the present invention, the same effect as the invention described in the J form of the present invention is exhibited, and the heat flux layer is sandwiched by the support layer, so that the heat melter layer is weatherproof to the outside air and absorbs moisture by moisture. It is possible to prevent the adhesive strength of the hot melt layer from adhering to dust, dust or the like to decrease.

According to the 50th invention of this application, the part surface-treated with the mold release agent of the base material part is removed, the edge part of the adhesive material tape which unwinding | finished was finished using the adhesive material of an adhesive material tape, and the start end part of the adhesive material tape which is newly mounted is bonded, Since the adhesive material reel is replaced, the attachment of a new adhesive material reel to the adhesive device can be simplified.

According to the fifty-ninth invention of the present application, the same effect as in the fifty-fifth invention of the present application is exhibited, and the release agent is removed using any one method of plasma discharge, ultraviolet irradiation, and laser irradiation, so that the removal of the release agent is precisely performed. It can also be performed in a short time.

According to the invention described in the M form of the present invention, since a plurality of windings (winding portions) of the adhesive tape, which is wound around the adhesive tape on the reel, is provided in the adhesive tape reel, when the unwinding of the adhesive tape of one winding portion of the plurality of winding portions ends. Since the adhesive tape of the other winding which is disposed adjacent to the winding portion where the unwinding has been completed is used, it is unnecessary to attach a new adhesive tape reel to the adhesive device, so that the replacement work of the new adhesive tape reel takes less, and the production efficiency of the electronic device is reduced. Is higher. Moreover, since a some adhesive tape can be used one by one, the quantity of adhesive which can be used by one exchange operation can be significantly increased, without increasing the number of turns of the adhesive tape per one adhesive tape. In addition, since the number of turns of the adhesive tape is not increased, it is possible to prevent the distraction of the wound and at the same time prevent the so-called blocking of the adhesive tape soaked in the width direction of the tape and bonding of the wound adhesive tapes together. By increasing the length of the substrate, it is possible to prevent damage such as sagging of the substrate which is likely to occur.

According to the invention described in the N aspect of the present invention, since the accommodating portion of the reel is provided on the side plate of the reel, the same effects as the invention described in the M aspect of the present invention are exhibited, and the moisture in the adhesive tape reel is reliably removed from the inside. As a result, the degradation in quality caused by the moisture absorption of the adhesive tape can be further suppressed.

According to the invention described in the aspect O of the present invention, since the cover member covering the periphery of the adhesive tape wound on the reel is detachably attached to the reel, the adhesive tape does not directly weather the outside air, and the adhesive tape is dusty or outside air. It can prevent the bad effect caused by moisture. Therefore, even when a plurality of windings are provided, by providing the cover member in the unused windings, it is possible to prevent the deterioration of the quality of the adhesive tape.

In addition, since the cover member is detachably attached, the cover member can be removed and the adhesive tape can be simply fed from the adhesive tape reel.

According to another variation of the O form of the present invention, the adhesive tape can be fed from the outlet of the cover member while exhibiting the same effect as the invention described in any of the M form of the present invention or the O form of the present invention. The adhesive tape can be fed directly from the adhesive tape reel without removing the cover member of the adhesive tape reel.

According to another variation of any one of the M form of the present invention and the O form of the present invention, the winding portion exhibits the same effect as the invention described in any one of the M form of the present invention and the O form of the present invention. Since the desorption is freely fitted to each other, after the adhesive tape of one of the windings is finished, the adhesive tape can be fed out sequentially from the next winding by releasing the fitting with the other winding.

According to still another variation of any one of the M form of the present invention and the O form of the present invention, the same effect as the invention described in any of the M form of the present invention and the O form of the present invention is obtained, and in particular, an adhesive tape (A) The adhesive tape for the electrode connection connecting the electrodes facing each other is an adhesive tape coated on a base material, or the adhesive tape is a support substrate for fixing a lead frame, or a support substrate for mounting a semiconductor element or a die of a lead frame and a semiconductor element. It is especially useful in the case of an adhesive tape for connecting the.

According to the invention described in the T form of the present invention, the hand is held, and the opening exposed by the adhesive tape is pressed on the circuit board so that the heating member is heat-compressed from the substrate side, and the adhesive is pressed onto the circuit board. Moreover, it can be operated by one hand and can also be crimped easily when crimping | bonding an adhesive material to a part of board | substrate.

According to the 60th invention of this application, when making the base material of an adhesive tape into a metal film or an aromatic polyamide film, even if the thickness of a base material is made thin, it can prevent that a base material hangs and cut | disconnects.

Therefore, by using the adhesive tape which consists of a thin base material, the number of turns per one reel can be made large, and the quantity of adhesive materials which can be used by one reel can be increased. Moreover, when the adhesive tape of this invention is used, since the number of turns per reel is large, in the manufacturing plant of an electronic component, the replacement | exchange frequency of a new adhesive tape takes little, and work efficiency becomes high. Moreover, in manufacture of an adhesive tape, since the number of reels to manufacture can be reduced, the usage-amount of a reel material and a damp prevention material can be reduced, and a manufacturing cost can be reduced.

According to the sixty-first invention of the present application, an adhesive tape having a thin and high tensile strength is obtained while exhibiting the same effect as the sixty-ninth invention of the present application.

According to the sixty-second aspect of the present application, the same effects as those of the sixty-sixth or sixty-first aspects of the present application are exhibited, and the tensile strength of the substrate is 300 MPa or more, so that the substrate is less liable to be cut and is more difficult to cut.

According to the sixty-third invention of the present application, the same effects as in the invention of any one of the sixty-second to sixty-eighth embodiments of the present application can be achieved, and the thinner and higher tensile strength can be achieved by setting the ratio of the thickness of the substrate to the adhesive material of 0.01 to 1.0. An adhesive tape can be obtained.

According to the sixty-fourth aspect of the present application, the surface of the substrate is smoothed by exhibiting the same effects as those of the invention of any one of the sixty-sixth to sixty-six of the present application, and by setting the surface roughness R _max of the substrate to 0.5 µm or less. When the adhesive material is pressed onto the circuit board, the adhesive material is easily separated from the substrate.

According to the 65th invention of this application, in the process immediately before forming an adhesive material in a to-be-adhered body, the adhesive material of one adhesive material tape and the adhesive material of the other adhesive material tape are piled up, and it is made into the thickness of a desired adhesive material, and an adhesive material is attached to a to-be-adhered body. Since the thickness of each adhesive tape can be reduced, and the number of turns of the adhesive tape is increased, the perimeter of the adhesive tape per reel can be reduced in diameter.

Therefore, the number of turns of the adhesive tape per reel can be increased, and the amount of adhesive material usable in one replacement operation can be greatly increased. Therefore, the replacement work of the new adhesive tape takes less time, and the production efficiency of the electronic device is increased.

According to the sixty sixth aspect of the present application, the same effects as those of the sixty sixth aspect of the present application can be exhibited, and the number of adhesive tapes required for low temperature management can be reduced, and the adhesive tape can be efficiently transported and stored. .

According to the invention described in any one of the U to Z forms of the present invention, it has good transferability (adhesiveness) to the member to be connected, has good connection reliability, thereby increasing the yield in the process and It also improves the properties, and it is possible to supply a longer anisotropic conductive tape than in the past, thereby improving productivity and workability.

Claims (14)

An adhesive tape applied to a substrate and wound in a reel, wherein the adhesive material is disposed on the substrate in a plurality of sets in the longitudinal direction of the tape. The adhesive tape according to claim 1, wherein a plurality of sets of adhesive materials are spaced apart from each other by adjacent adhesive material groups. The adhesive tape according to claim 1, wherein the adhesive material is separated into a plurality of sets by slits formed in the longitudinal direction of the tape. An adhesive tape applied to a base material and wound in a reel, wherein the width of the adhesive tape is equal to or greater than the length of one side of the circuit board, and the adhesive material is disposed in plural sets in the width direction of the tape. The adhesive tape according to claim 4, wherein a plurality of sets of adhesive materials are spaced apart from each other by adjacent adhesive material groups. The adhesive tape according to claim 4, wherein the adhesive material is separated into a plurality of sets by slits formed in the width direction of the tape. An adhesive tape having an adhesive applied to the substrate, wherein the substrate is made of a metal film or an aromatic polyamide film. The adhesive tape according to claim 7, wherein the base material has a thickness of 1 µm to 25 µm. The adhesive tape according to claim 7 or 8, wherein the base material has a tensile strength of 300 MPa or more at 25 ° C. The adhesive tape of Claim 7 or 8 whose ratio of the thickness with respect to the adhesive material of a base material is 0.01-1.0. The adhesive tape according to claim 7 or 8, wherein the surface roughness R _max of the substrate is 0.5 µm or less. As a manufacturing method of the adhesive tape apply | coated to a base material and wound in a reel form, by supplying an adhesive material on the surface of a base material continuously conveyed from the applicator arrange | positioned at intervals in the width direction of a base material, a plurality of adhesives are provided to a base material. A method for producing an adhesive tape, characterized in that the coating. An adhesive material is applied to a base material, and a method of manufacturing an adhesive tape wound in a reel. The adhesive material is applied to one surface of one side of one base material, and then a longitudinal slit is formed on the adhesive material, and then the other base material is placed on the adhesive material surface. The adhesive material is sandwiched between one substrate and the other substrate, and then, one substrate and the other substrate are separated from each other, and a plurality of sets of adhesive materials are alternately attached to each of the one and the other substrates. The manufacturing method of the adhesive tape characterized by manufacturing what arrange | positioned several sets of adhesive materials at intervals to the base material. An adhesive material is applied to a base material, and a manufacturing method of the adhesive tape wound in a reel. The adhesive material is applied to the entire surface of one base material, and then a slit is formed along the width direction of the tape on the adhesive material, and then the other side on the adhesive material surface. By arranging the base material, sandwiching the adhesive material between one and the other base material, and then separating one base material and the other base material from each other and alternately adhering a plurality of sets of adhesive materials to each of the one and the other base material. A method of producing an adhesive tape, characterized in that the one and the other base material are arranged with a plurality of sets of the adhesive material at intervals.

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