KR20070056451A - Apparatus for baking wafer - Google Patents

Abstract

An apparatus for baking a wafer is provided to improve the distribution of a bake temperature by setting exactly quickly a target temperature to a wafer using heat coils arranged in a chamber lid as well as a plate. An apparatus for baking a wafer includes a chamber for defining a sealed space, a plate, and a chamber lid. The plate(110) is installed in the chamber to load stably a wafer. The plate includes a first heat coil(118) for transferring the heat to the wafer. The chamber lid(120) is used as an upper portion of the chamber. The chamber lid includes a second heat coil(128) for transfer the heat to the atmosphere of the chamber. The first and second heat coils of the plate and chamber lid are simultaneously heated.

Description

Wafer baking apparatus {APPARATUS FOR BAKING WAFER}

1 is a cross-sectional view showing a wafer baking apparatus according to an embodiment of the present invention.

2 is a plan view showing a portion of a wafer baking apparatus according to an embodiment of the present invention.

3 is a cross-sectional view showing a wafer baking apparatus according to a modified embodiment of the present invention.

<Description of Symbols for Major Parts of Drawings>

100; Wafer baking apparatus 110; plate

112,122; Heater 114,124; temperature Senser

116,126; Controller 118,128; thermic rays

120; Chamber lead 190; chamber

The present invention relates to a semiconductor manufacturing apparatus, and more particularly to a wafer baking apparatus.

Generally, a semiconductor device is manufactured by forming a predetermined film on a wafer and then forming a desired pattern of the predetermined film. The formation of such a pattern is mainly performed by a photo etching process using a photo resist. The photolithography process includes a coating step of applying a photoresist on a wafer, an exposure step of exposing the photoresist, a developing step of developing the photoresist, and the like. In performing the photolithography process, a baking apparatus of a photo equipment which can mount a wafer and heat it to a predetermined temperature is mainly used.

Specifically, the solvent contained in the photoresist applied on the wafer is removed by mounting the wafer on a plate of the baking apparatus and heating the wafer to a predetermined temperature. Here, the temperature uniformity should be maintained when heating the wafer for solvent removal, and in the recent manufacture of semiconductor devices in which the pattern formed on the wafer is miniaturized, maintaining the temperature uniformity is an important factor in controlling the critical dimension (CD). do.

 However, in the conventional baking apparatus, the temperature of the wafer checks the temperature of the plate, and the plate is heated by using a heater to adjust it to a target temperature. This method is not the temperature of the actual wafer, but the temperature of the plate, and it is difficult to accurately match the actual wafer temperature because adjusting the target temperature also involves heating the plate. It is necessary to minimize the baking temperature spread, because the baking temperature spread will have a big impact on the CD distribution of the pattern drawn on the wafer. If the line width of the semiconductor device becomes finer in the future, the progress of the semiconductor process becomes difficult due to the existing temperature spread.

Accordingly, the present invention has been made to solve the problems of the prior art, an object of the present invention is to provide a wafer baking apparatus that can improve the temperature distribution of the wafer.

Wafer baking apparatus according to the present invention for achieving the above object is characterized in that it is possible to accurately match the temperature of the wafer by the method of heating the wafer by the plate and the method of controlling the atmosphere temperature inside the device.

Wafer baking apparatus according to an embodiment of the present invention that can implement the above features, the chamber defining a closed space; A plate installed in the chamber to mount a wafer, the plate having a heating wire transferring heat to the wafer; A chamber lead including a heat wire configured to form an upper end of the chamber and to transfer heat to an atmosphere inside the chamber, and the heat wires provided in the plate and the chamber lead are heated together to heat the wafer to a specific target temperature. It is characterized by setting.

In the present embodiment, the first heater for heating the heating wire of the plate and a first sensor for sensing the temperature of the plate; And a second heater that heats the heating wire of the chamber lid and a second sensor that senses a temperature of the chamber lid.

In the present embodiment, a first controller for controlling the operation of the first heater and the first sensor; And a second controller controlling the operation of the second heater and the second sensor.

In the present embodiment, the controller further includes a controller for simultaneously controlling operations of the first and second heaters and the first and second sensors.

In this embodiment, the arrangement of the heating wire to transfer heat to the wafer is different from the arrangement of the heating wire to transfer heat to the atmosphere inside the chamber.

Wafer baking apparatus according to a modified embodiment of the present invention that can implement the above features, the chamber providing a place where the baking process proceeds; A plate installed in the chamber to mount a wafer and having a first heating wire transferring heat to the wafer; A chamber lead constituting an upper end of the chamber and having a second heating wire to transfer heat to the atmosphere inside the chamber; First and second heaters respectively heating the first and second heating wires; First and second temperature sensors detecting a temperature of each of the plate and the chamber lid; And a controller for controlling the operation of the first and second heaters and the first and second temperature sensors.

In this modified embodiment, the controller, the first controller for controlling the operation of the first heater and the first temperature sensor; And a second controller controlling the operation of the second heater and the second temperature sensor.

In this modified embodiment, at least one of the first and second heating wires includes a plurality of concentric hot wires.

In the present exemplary embodiment, the first heating wire includes a plurality of concentric hot wires, and the second heating wire includes a plurality of concentric hot wires disposed at a position corresponding to the plurality of concentric hot wires constituting the first heating wire. It includes hot wires.

According to the present invention, by placing the hot wire not only on the plate but also on the chamber lid, it is possible to accurately set the wafer to the target temperature in a short time. In addition, by designing the hot wire arrangement of the plate and the hot wire arrangement of the chamber leads to each other, it is possible to further improve the temperature distribution of the bake and the wafer.

Hereinafter, a wafer baking apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

Advantages over the present invention and prior art will become apparent through the description and claims with reference to the accompanying drawings. In particular, the present invention is well pointed out and claimed in the claims. However, the present invention may be best understood by reference to the following detailed description in conjunction with the accompanying drawings. Like reference numerals in the drawings denote like elements throughout the various drawings.

(Example)

1 illustrates a wafer baking apparatus according to an embodiment of the present invention, and FIG. 2 illustrates a portion of a wafer baking apparatus according to an embodiment of the present invention.

As shown in FIG. 1, the wafer baking apparatus 100 according to the present embodiment includes a plate 110 that mounts the wafer W in the chamber 190, and the chamber 190. The chamber 190 is closed by a chamber lid 120 forming a top portion of the top surface).

The plate 110 is provided with a heating wire 118, as shown in FIG. 2, to transfer heat to the wafer and set the wafer to a specific temperature. The heating wire 118 is heated by the heater 112, the temperature of the plate 110 is sensed by the temperature sensor 114. The hot wire 118 and the temperature sensor 114 are electrically connected to the controller 116 such that the plate 110 is heated to an appropriate temperature, for example, a temperature sufficient to set the wafer to a target temperature. Hot wire 118 is preferably designed in a circular shape so as to be suitable for evenly heating the circular wafer (W). Hot wire 118 is more preferably designed in the form of a circle of small diameter surrounded by a large diameter circle.

The plate 110 directly heats the wafer W. However, the ambient temperature inside the chamber 190 also affects the temperature of the wafer (W). Therefore, in the embodiment of the present invention, as shown in FIG. 2, the chamber lead 120 is provided with a heating wire 128 in the chamber lead 120 to adjust the atmosphere temperature inside the chamber 190. The hot wire 128 is heated by the heater 122, and the temperature of the chamber lead 120 is sensed by the temperature sensor 124. The hot wire 128 and the temperature sensor 124 are electrically connected to the controller 126 so that the chamber lid 120 is heated to an appropriate temperature, for example, a temperature sufficient to set the wafer to a target temperature. The hot wire 128 is preferably designed in a circular shape so as to be suitable for evenly increasing the temperature of the atmosphere (air) in the chamber 190, and more preferably, a circle of small diameter is surrounded by a circle of large diameter. .

It may be desirable to arrange the arrangement of the hot wire 118 of the plate 110 and the hot wire 128 of the chamber lid 120 to be suitable for improving the temperature distribution of the wafer W. For example, as shown in FIG. 2, an arrangement capable of temperature control for each region in which the arrangement of the heating wire 118 and the arrangement of the heating wire 128 are complementary to each other, that is, the heating wire 118 is arranged between the heating wires 128. Design as possible. On the other hand, in the arrangement of the hot wires 118 and 128, in particular, in view of the exhaust position inside the chamber 190, strengthening the hot wire arrangement of the portion to be exhausted may compensate for the temperature drop in the portion.

As such, when the heating wire 128 is disposed not only on the plate 110 but also on the chamber lid 120 and heated at the same time, the plate 110 transfers heat directly to the wafer W, and the chamber lid 120 includes the chamber 190. Heat is transferred to the atmosphere (air) in the air. Therefore, the time for the wafer W to reach the target temperature can be shortened as compared with the conventional and more accurate control.

Modification Example

3 illustrates a wafer baking apparatus according to a modified embodiment of the present invention. The wafer baking apparatus 200 of this modification is similar to the structure of the wafer baking apparatus 100 of the present Example demonstrated in FIG. 1 and FIG. 2 except having demonstrated below. Therefore, in the description of the present apparatus 200, different points from the above-described apparatus 100 will be described, and the same points will be outlined or omitted.

Referring to FIG. 3, the wafer baking apparatus 200 according to the present exemplary embodiment is provided in a plate 210 and a chamber 290 that are provided with a heating wire to transfer heat to the wafer W, and an upper end of the chamber 290 is provided. A chamber lead 220 is provided to provide heat to the atmosphere (air) in the chamber 290. In the plate 210, a heating wire such as the heating wire 118 described above is disposed concentrically, and the heating lead, such as the heating wire 128 described above, is also arranged in the chamber lid 220.

The plate 210 is provided with a heater 212 and a temperature sensor 214, and the chamber lead 220 is also provided with a heater 222 and a temperature sensor 224. However, the heaters 212 and 222 and the temperature sensors 214 and 224 are not connected to individual controllers but to one controller 232. Accordingly, the heating operation of the plate 210 and the chamber lid 220 can be simultaneously and simultaneously performed using one controller 232.

Although the wafer bake apparatus has been described so far that the temperature of the chamber can be properly controlled by placing a hot wire on both the plate and the chamber lid, the present invention can be applied to any apparatus for controlling the temperature in the chamber and various other apparatuses. It should be noted that

The foregoing detailed description illustrates the present invention. In addition, the foregoing description merely shows and describes preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. And, it is possible to change or modify within the scope of the concept of the invention disclosed in this specification, the scope equivalent to the written description, and / or the skill or knowledge in the art. The above-described embodiments are for explaining the best state in carrying out the present invention, the use of other inventions such as the present invention in other state known in the art, and the specific fields of application and uses of the present invention. Various changes are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to include other embodiments.

As described in detail above, according to the present invention, by placing the hot wire not only on the plate but also on the chamber lid, it is possible to accurately set the wafer to the target temperature in a short time. Therefore, it is possible to improve the distribution of the baking temperature and to improve the temperature distribution of the wafer, resulting in the effect of tightly managing the line width of the semiconductor device. In addition, the complementary design of the hot wire arrangement of the plate and the hot wire arrangement of the chamber lid has the effect of further improving the temperature distribution of the bake and the wafer.

Claims (9)

A chamber defining an enclosed space; A plate installed in the chamber to mount a wafer, the plate having a heating wire transferring heat to the wafer; Comprising an upper end of the chamber, including a chamber lead having a heating wire for transferring heat to the atmosphere inside the chamber, Wafer baking apparatus, characterized in that for setting the wafer to a specific target temperature by heating the heating wires provided in each of the plate and the chamber lid. The method of claim 1, A first heater for heating the hot wire of the plate and a first sensor for sensing a temperature of the plate; And A second heater for heating the heating wire of the chamber lid and a second sensor for sensing a temperature of the chamber lid; Wafer baking apparatus further comprises. The method of claim 2, A first controller controlling the operation of the first heater and the first sensor; And A second controller controlling the operation of the second heater and the second sensor; Wafer baking apparatus further comprises. The method of claim 2, And a controller for simultaneously controlling operations of the first and second heaters and the first and second sensors. The method according to any one of claims 1 to 4, The arrangement of the heating wire for transferring heat to the wafer is different from the arrangement of the heating wire for transferring heat to the atmosphere inside the chamber. A chamber providing a place for the baking process to proceed; A plate installed in the chamber to mount a wafer and having a first heating wire transferring heat to the wafer; A chamber lead constituting an upper end of the chamber and having a second heating wire to transfer heat to the atmosphere inside the chamber; First and second heaters respectively heating the first and second heating wires; First and second temperature sensors detecting a temperature of each of the plate and the chamber lid; A controller for controlling the operation of the first and second heaters and the first and second temperature sensors; Wafer baking apparatus comprising a. The method of claim 6, The controller, A first controller controlling the operation of the first heater and the first temperature sensor; And A second controller controlling the operation of the second heater and the second temperature sensor; Wafer baking apparatus comprising a. The method of claim 6, At least one of the first and second heating wires includes a plurality of concentric hot wires. The method of claim 6, The first heating wire includes a plurality of concentric hot wires, and the second heating wire includes a plurality of concentric hot wires disposed at a position corresponding to the plurality of concentric hot wires constituting the first heating wire. Wafer baking device.

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