KR20070027249A - Rfid tag - Google Patents

Abstract

An RFID(Radio Frequency IDentification) tag is provided to realize a structure having high self-combination with a tire and reinforce combining force in a position difficult to keep the combining force with adhesive agent. The RFID tag includes an RFID chip(120), at least one antenna(110) electrically connected to the RFID chip, and a base film(130) mounting the RFID chip and the antenna. At least one penetrating hole(135) is formed to the base film and the base film is combined to external material. Total area of the penetrating holes is 20-40% of total base film area. Each penetrating hole has a diameter over 2 millimeters. The adhesive agent is coated on one base film surface not mounting the RFID chip and is coated on the part excluding the penetrating holes.

Description

RFID tag {RFID tag}

1 is a plan view showing a conventional RFID tag from above.

2 is a cross-sectional view taken along the line II-II of the RFID tag of FIG.

3 is a plan view illustrating an RFID tag according to a preferred embodiment of the present invention.

4 is a cross-sectional view taken along line IV-IV of FIG. 3.

5 is an enlarged plan view of a portion A of FIG. 3.

6 is an enlarged plan view of a portion B of FIG. 3.

Explanation of symbols on the main parts of the drawings

100: RFID tag 105: foreign matter

110: antenna 120: RFID chip

130: base film 135: through hole

140: conductive wire 150: adhesive

a: through hole diameter

b: separation distance between through holes

c: separation distance between the through-hole and the base film end

d: separation distance between through hole and antenna

The present invention relates to an RFID tag (Radio Frequency IDentification tag), and more particularly, to an RFID tag of an improved structure in which damage or unrecognition of an RFID tag is prevented even in an operating environment in which an external force is applied.

In recent years, wireless communication technology has been widely used in all industrial fields including distribution, and examples of wireless communication technology include technology fields such as smart cards and radio frequency identification (RFID).

Such wireless communication technology may be used to obtain information about a product wirelessly. For this purpose, the wireless communication system includes a transponder attached to the product and a reader in wireless communication with the transponder. The transponder is equipped with an antenna and an RFID chip so that information from the reader is stored and updated in the RFID chip through the antenna, and information stored in the RFID chip is transmitted to the reader through the antenna.

Among the products to which the wireless communication technology can be applied, for example, in the case of a tire, if the operating environment such as pressure or temperature applied to the tire is not properly controlled, the tire may be damaged during the manufacturing process of the tire or during the operation of the vehicle. There is a risk of vehicle accidents, it is necessary to monitor the tire operating environment from time to time.

1 shows a prior art RFID tag, and FIG. 2 shows a sectional view taken along the line II-II of the RFID tag shown in FIG. 1 and 2, the RFID tag includes a base film 11, an antenna 10 formed on the base film 11, and an RFID chip 50 electrically connected to the antenna 10. The antenna 10 may be formed by laminating and etching a copper foil layer or a thin aluminum layer on the base film 11. The cover film 13 may be stacked on the antenna 10.

As shown in FIG. 2, an RFID chip 50 may be wire bonded to an end of the antenna 10. More specifically, by connecting the RFID chip 50 and the antenna 10 with the conductive wire 20, both 50, 10 can be electrically connected. The RFID chip 50 and the antenna 10 are embedded by the molding unit 30. The molding part 30 is usually made of an epoxy molding compound (EMC) material and fills the RFID chip connection part of the RFID chip and the antenna from above.

By the way, when the RFID tag is mounted on the tire 5, the rubber, which is a tire material, and the base film 11, which is usually a polymer plastic material, are installed to interface with each other, and the base film 11, which is the plastic film, and the tire rubber The friction force is not so large that the interface separation occurs. For this reason, there is a problem that breakage easily occurs in the RFID tag.

In order to prevent such an interfacial separation phenomenon, the adhesive force 60 is normally interposed between the tire 5 and the base film 11 to increase the adhesive force between the base film 11 and the tire 5. However, a delamination may occur at some interfaces due to tensile, compressive or bending loads acting on the RFID tag, or heat generated from a tire. However, since the RFID tag is not provided with its own coupling structure, a delamination phenomenon occurs from a surface close to the surface where the delamination phenomenon occurs on the other side of the thin film, resulting in a phenomenon in which the entire surface is not properly adhered.

When this phenomenon occurs, antenna performance is degraded in the RFID chip 50, and when the external stress occurs, the base film 11 does not distribute the force, and the force directly affects the RFID chip 50, thereby degrading chip performance. Let's go.

In addition, since the shape of the tire is curved and a protruding portion 6 or a recess is formed at a portion, a portion G in which the adhesive 60 is not completely adhered is generated, and thus in this portion, the tire 5 and There arises a problem that a delamination phenomenon occurs between the base film (11).

SUMMARY OF THE INVENTION The present invention has been made to solve various problems including the above problems, and an object thereof is to provide an RFID tag having a structure having high coupling with a tire.

Another object of the present invention is to provide a FID tag having a structure capable of reinforcing the bonding force in a position where it is difficult to maintain the bonding force using the adhesive.

In order to achieve the above object, an RFID tag according to an embodiment of the present invention comprises: an RFID chip; At least one antenna electrically connected to the RFID chip; By mounting the RFID chip and the antenna, a plurality of through holes are formed, and has a base film bonded to an external material.

In this case, it is preferable that the area obtained by adding the entire through holes occupies 20% to 40% of the base film area.

In addition, each of the through holes has a diameter of at least 2mm, a distance of at least 2mm between the adjacent through holes, and a distance of at least 2mm between the through hole and the end of the base film adjacent thereto. desirable.

In addition, the through hole may have a distance of at least 2 mm from an adjacent antenna and an RFID chip.

On the other hand, an adhesive may be attached to a surface on which the RFID chip of the base film is not mounted, and in this case, the adhesive may be disposed at a portion excluding the through hole.

Hereinafter, with reference to an embodiment shown in the accompanying drawings the present invention will be described in more detail. 3 is a plan view illustrating an RFID tag according to a preferred embodiment of the present invention, and FIG. 4 is a cross-sectional view taken along line IV-IV of FIG. 3.

Referring to FIG. 3, the RFID tag 100 according to the present embodiment includes an antenna 110, an RFID chip 120, and a base film 130. The antenna 110 functions to receive or transmit a predetermined operating frequency, for example, may be formed of a two-pole type wave antenna. The antenna 110 may be formed of leads of a lead frame used in a semiconductor manufacturing process.

The RFID chip 120 is bonded to the antenna 110, so that the antenna 110 and the RFID chip 120 are electrically connected to each other. As one example of the bonding coupling, the antenna 110 and the RFID chip 120 may be wire bonded. That is, the electrodes 121 formed on the RFID chip 120 and the silver plating layers formed on both ends of the antenna 110 may be connected to each other through the conductive wire 140. Alternatively, the antenna 110 and the RFID chip 120 may be connected to each other by an anisotropic conductive material, and other methods may be possible. The RFID chip 120 may be supported on a chip pad.

A portion of the RFID chip 120 and the antenna 110 may be molded by the molding unit 145. The molding part 145 may not be easily deformed by external force at the connection portion where the RFID chip 120 and the antenna 110 are connected. As a molding material which forms this molding part 145, an epoxy compound can be used, for example.

The antenna 110 and the RFID chip 120 may be formed on the base film 130. The base film 130 is formed of a polymer material such as polyethylene terephthalate (PET), polyvinyl chloride (PVC), polyethylene (PE), and PI as a thin film. In this case, the antenna 110 may be formed by laminating and etching a copper foil layer or a thin aluminum layer on the base film 130. On the other hand, the cover film 170 made of a resin may be formed on the upper surface of the antenna 110.

At least one through hole 135 is formed in the base film 130 to penetrate the base film 130. The through holes 135 may prevent sliding on the outer material 105 by acting as an obstacle when the base film 130 is de-laminated with the outer material 105. That is, assuming that the outer material 105 is a tire, even if the tire is fine, the protruding portion 106 is located inside the through hole 135, so that the base film 130 is slid from the tire by an external force. Even if the through-hole end is caught by the tire protrusion 106 can be prevented. The through hole has an effect of preventing deformation of the antenna by serving as a support for the pattern of the neighboring antenna by the external material to be filled into the through hole. In this case, it is preferable that the above-mentioned hole is formed at a position easily deformable in the neighboring antenna pattern.

In addition, an adhesive 150 may be attached to a surface of the base film 130 on which the RFID chip 120 is not mounted. The adhesive 150 may be a double-sided tape or other adhesive material, and serves to fix the base film 130 to an external material. The adhesive 150 is disposed at a portion except the through hole 135. Here, due to the bending and protrusions 106 of the external material, a portion that is not bonded to the RFID chip 100 may be generated by the adhesive 150 alone. In this case, the through hole 135 may be located at the portion, thereby providing a bonding force. Can be increased.

In addition, since the through hole 135 serves to disperse the impact from the outside, the impact can be prevented from being transmitted to the RFID chip 100.

On the other hand, the total area of the through-holes 135 is preferably occupied 20% to 40% of the area of the base film 130, if the value is less than 20% due to the through-holes 135 This is because when the adhesive force becomes small and the value exceeds 40%, the stiffness of the base film 130 itself may be weakened and thus may be broken even with a slight impact.

In addition, as shown in FIG. 5, in order to maintain the rigidity of the base film 130 itself, each of the through holes 135 has a diameter (a) of 2 mm or more and the adjacent through holes 135. It has a separation distance (b) of 2mm or more, and preferably has a separation distance (c) of 2mm or more between the through hole 135 and the end of the base film adjacent thereto.

In particular, in this case, each of the through holes 135 has a diameter (a) of 2mm to 3mm, the adjacent through holes 135 has a separation distance (b) of 2mm to 3mm, the through hole ( 135) and an adjacent base film end portion may have a separation distance c of 2 mm to 3 mm.

In addition, as shown in FIG. 6, the through hole 135 may have a predetermined distance d from the antenna 110 to improve the frequency transmission / reception state of the antenna 110. For this purpose, it is desirable to have a distance d of at least 2 mm from the antenna.

On the other hand, the through holes 135, the left and the right of the RFID chip 120 may be arranged in the same number, which is because the two-pole antenna 110 is usually formed in both sides from the RFID chip, To support the antennas located on both sides of the RFID chip sufficiently and with almost the same force.

Meanwhile, the foreign material 105 (see FIG. 4) may be a tire. Substantial pressure is applied to the tire while the vehicle is running, and the tire is rapidly stretched and compressed at a stage before the final form is obtained even in the manufacturing process of the tire. As a result, the delamination may occur frequently between the RFID tags 100 adhered to the tire. Accordingly, the present invention may allow the through hole 135 to have sufficient coupling force with the tire in its entire surface, despite the stretching and compression of the tire.

According to the present invention having the structure as described above, the RFID tag has its own binding force, it is possible to maintain a high adhesive force with the external material. Therefore, it is possible to prevent the RFID tag from being delaminated from an external material by external force.

 In addition, the adhesive that bonds between the foreign material and the RFID tag can structurally reinforce the bonding force by placing the through holes in a position where it is difficult to maintain the bonding force.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and any person skilled in the art to which the present invention pertains may have various modifications and equivalent other embodiments. Will understand. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (5)

RFID chip; At least one antenna electrically connected to the RFID chip; And Mounting the RFID chip and the antenna, at least one through hole is formed, the RFID tag having a base film bonded to an external material. The method of claim 1, The area obtained by adding the entire through holes occupies 20% to 40% of the base film area. The method of claim 2, Each through hole has a diameter of at least 2 mm, Between the adjacent through holes has a separation distance of 2mm or more, RFID tag having a separation distance of 2 mm or more between the through hole and an end portion of the base film adjacent thereto. The method according to any one of claims 1 to 3, The through hole is an RFID tag, characterized in that it has a separation distance of at least 2mm with an adjacent antenna. The method according to any one of claims 1 to 3, Adhesive is attached to the surface of the base film where the RFID chip is not mounted, And the adhesive is disposed at a portion excluding the through hole.

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