KR20060093574A - Display panel - Google Patents

Abstract

A display panel capable of inspecting the appearance of a pad portion is disclosed. The display panel includes a substrate, a driving chip, and a pad part. The driving chip is disposed in the peripheral area of the substrate to generate a driving signal for displaying an image. The pad part is formed in the peripheral area of the substrate and electrically connected to the driving chip, and has an inspection area for observing a connection state with the driving chip. As described above, since the inspection area for observing the connection state of the driving chip is formed on the pad part, the connection state of the pad part and the driving chip can be more easily inspected.

Description

Display panel {DISPLAY PANEL}

1 is a perspective view illustrating a display panel according to a first exemplary embodiment of the present invention.

FIG. 2 is an enlarged perspective view of portion A of the display panel of FIG. 1.

3 is a cross-sectional view taken along the line II ′ of FIG. 2.

4 is an enlarged perspective view of a part of a pad part of the display panel of FIG. 1.

5 is a cross-sectional view of a portion of a display panel according to a second exemplary embodiment of the present invention.

FIG. 6 is an enlarged perspective view of a part of a pad part of the display panel of FIG. 5.

7 is a perspective view illustrating a display panel according to a third exemplary embodiment of the present invention.

FIG. 8 is an enlarged perspective view of a portion B of the display panel of FIG. 7.

FIG. 9 is a cross-sectional view taken along the line II-II 'of FIG. 8.

FIG. 10 is a cross-sectional view of a portion of the display panel according to the fourth exemplary embodiment.

<Explanation of symbols for the main parts of the drawings>

10, 20, 30, 40: inspection area 100, 700: array substrate

110, 710: insulating layer 130a, 130b: output pad

740a, 740b: connection terminal 200: color filter substrate

300: driving chip 400, 800: flexible printed circuit board

500: printed circuit board 600: anisotropic conductive film

The present invention relates to a display panel, and more particularly, to a display panel capable of inspecting the appearance of a pad portion.

Recently, an information processing device has various forms and various functions, and processes information at a higher speed. The information processed in the information processing apparatus has an electrical signal format. Therefore, in order for the user to visually check the information processed by the information processing apparatus, display apparatuses displaying the information as an image are required.

One of the display devices, a liquid crystal display, displays an image using liquid crystals. The liquid crystal display device has advantages of thinner, lighter weight, lower power consumption, and lower driving voltage than other display devices.

Conventional liquid crystal display device is composed of a liquid crystal display panel for displaying an image using light, and a backlight assembly for providing light to the liquid crystal display panel. The liquid crystal display panel includes a first substrate on which a thin film transistor as a switching element is formed, a second substrate on which a color filter is formed, a liquid crystal layer interposed between the first and second substrates, and an image. And a flexible printed circuit board for electrically connecting the printed circuit board and the first substrate.

The liquid crystal display panel may further include a driving chip that converts the control signal into a driving signal for controlling the thin film transistor, and includes a chip on film (COF) type and a chip (COG) according to an arrangement position of the driving chip. On Glass) type. In this case, the chip on film (COF) type means that the driving chip is disposed on the flexible printed circuit board, and the chip on glass (COG) type means that the driving chip is disposed in the peripheral region of the first substrate. Say that.

In the case of the COF type liquid crystal display panel, the first substrate includes a signal line electrically connected to the thin film transistor, and a connection terminal formed in a peripheral area of the first substrate to be electrically connected to the signal line. It includes. In this case, the connection terminal is electrically connected to a transmission line formed on the flexible printed circuit board to transmit the driving signal to the thin film transistor.

Recently, as the resolution of the liquid crystal display panel is increased, the number of the connection terminals is also increased, and as a result, the connection terminals are densely arranged on the first substrate with a smaller size. Therefore, the connection terminal is electrically connected to the transmission line through an anisotropic conductive film containing a conductive ball. That is, the conductive ball is indented to the connection terminal or the transmission line by external compression, so that the connection terminal and the transmission line are electrically connected to each other.

However, when the distribution of the conductive balls interposed between the connection terminal and the transmission line is oriented to one side or a defect occurs in the shape of the conductive ball, the electrical contact between the connection terminal and the transmission line has a serious effect. .

In the COG (Chip On Glass) type liquid crystal display panel, the driving chip and the first substrate are electrically connected to each other through the anisotropic conductive film, and the driving may be caused by a shape defect and a distribution defect of the conductive ball. There is a serious effect on the electrical connection between the chip and the first substrate.

Therefore, in order to observe the shape defect and the distribution defect of the conductive ball, an inspection method for inspecting the electrical connection between the driving chip and the first substrate is required, and the non-destructive appearance inspection method is mainly used as the inspection method. do.

However, when performing the non-destructive visual inspection, there is a problem that the non-destructive visual inspection becomes difficult when the connecting terminal has an opaque or thick thickness.

Accordingly, the technical problem of the present invention is to solve such a conventional problem, and an object of the present invention is to provide a display panel capable of inspecting the appearance of the pad part by modifying the shape of the pad part.

In order to achieve the above object of the present invention, the display panel includes a substrate, a driving chip, and a pad unit. The driving chip is disposed in a peripheral area of the substrate to generate a driving signal for displaying an image. The pad part is formed in a peripheral area of the substrate and electrically connected to the driving chip, and has an inspection area for observing a connection state with the driving chip.

In accordance with another aspect of the present invention, a display panel includes a substrate, a flexible printed circuit board, and a connection terminal. The flexible printed circuit board transmits a driving signal for displaying an image to the substrate. The connection terminal is formed in a peripheral area of the substrate and electrically connected to the flexible printed circuit board, and has a test area for observing a connection state with the flexible printed circuit board.

According to the display panel, an inspection region for observing a connection state with a driving chip is formed on the pad portion, or an inspection region for observing a connection state with a flexible printed circuit board is formed on the connection terminal. The connection state between the pad unit and the driving chip and the connection state between the connection terminal and the flexible printed circuit board can be more easily inspected.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

<Example-1 of the Display Panel>

1 is a perspective view illustrating a display panel according to a first exemplary embodiment of the present invention, and FIG. 2 is an enlarged perspective view of part A of the display panel of FIG. 1.

1 and 2, the display panel includes an array substrate 100, a color filter substrate 200, a liquid crystal layer (not shown), a driving chip 300, a flexible printed circuit board 400, and a printed circuit board ( 500).

The array substrate 100 includes a plurality of thin film transistors (not shown) which are switching elements, and a plurality of pixel electrodes (not shown) electrically connected to the thin film transistors. An insulating layer covering the thin film transistors is formed on the array substrate 100. Each thin film transistor includes a source electrode, a gate electrode, and a drain electrode. The source electrodes are electrically connected to data lines formed in the X-axis direction on the array substrate 100, and the gate electrodes are formed on the array substrate 100 in the Y-axis direction. ) And the drain electrodes are electrically connected to the transparent and conductive pixel electrodes, respectively.

The color filter substrate 200 is disposed to face the array substrate 100. The color filter substrate 200 includes a plurality of color filters (not shown) for displaying color through light and a transparent and conductive common electrode (not shown) formed on the front surface of the color filter substrate 200. . The color filters include, for example, a red color filter, a green color filter, a blue color filter, and the like.

The liquid crystal layer is interposed between the array substrate 100 and the color filter substrate 200. The liquid crystal layer is composed of liquid crystals having an intermediate property of a liquid and a solid and arranged in a constant array. The liquid crystals are changed in an arrangement by an electric field formed between the pixel electrode and the common electrode. Liquid crystals of varying arrangements change light transmittance, and the light of which light transmittance is changed passes through the color filters to display a desired image.

The driving chip 300 is disposed in the peripheral region of the array substrate 100 and electrically connected to the data line or the gate line. The driving chip 300 includes a driving circuit for generating a driving signal for controlling the thin film transistor therein, and the driving signal controls the thin film transistor through the data line or the gate line to display an image. do.

The flexible printed circuit board 400 electrically connects the printed circuit board 500 and the array substrate 100. The flexible printed circuit board 400 includes transmission lines (not shown) for transmitting a control signal generated from the printed circuit board 500 to the array substrate 100. The flexible printed circuit board 400 may be flexible and flexible, and thus the printed circuit board 500 may be disposed at the side or the bottom of the array substrate 100.

The printed circuit board 500 receives an image signal from an external graphic controller (not shown), and generates a control signal for controlling the driving chip 300. The control signal is transmitted to the driving chip 300 formed on the array substrate 100 through the flexible printed circuit board 400.

3 is a cross-sectional view taken along line II ′ of FIG. 2, and FIG. 4 is an enlarged perspective view of a part of a pad part of the display panel of FIG. 1.

3 and 4, a plurality of pad portions are formed in the peripheral region of the array substrate 100 to electrically connect the driving chip 300 to the data line 120.

The pad parts may include input pads (not shown) and output pads 130a, and the driving chip 300 may include input bumps (not shown) and the output pads 130a that are electrically connected to the input pads. ) And output bumps 310 connected to the battery. In this case, the pad part is electrically connected to the driving chip 300 through an anisotropic conductive film 600 including the conductive ball 610.

The output pads 130 are electrically connected to the data line 120 to transmit a driving signal generated from the driving chip 300 to the thin film transistor. The output pads 130 are arranged in a plurality of rows along the Y-axis direction to improve the resolution of the display panel. For example, the output pads 130 may be arranged in two rows in a zigzag.

The input pads are electrically connected to connection terminals arranged on the outer side of the pad unit by the connection line 150, and the connection terminals are electrically connected to the transmission line of the flexible printed circuit board 400. The input pads are preferably arranged in a line along the Y-axis direction.

Each output pad 130a includes a metal pad formed on the array substrate 100 and a transparent electrode 136a electrically connected to the metal pad and being transparent and conductive. In this case, the transparent electrode 136a is made of indium tin oxide (ITO), indium zinc oxide (IZO), amorphous indium tin oxide (a-ITO), or the like. When the pixel electrode is formed, it is preferably formed together.

The insulating layer 110 covering the metal pad is formed on the array substrate 100. A contact hole 112a is formed in the insulating layer 110 on the metal pad. The metal pad and the transparent electrode 136a are electrically connected by the contact hole 112a. The contact hole 112a may be formed to have a size equal to or smaller than that of the metal pad in order to reduce contact resistance between the metal pad and the transparent electrode 136a.

The metal pad includes first and second metal pads 132a and 134a disposed to be spaced apart from each other at a predetermined distance, and the first and second metal pads 132a and 134a are spaced apart from each other. An inspection area 10 for inspecting a connection relationship between the output pad 130a and the output bump 310 is formed.

The first metal pad 132a is electrically connected to the data line 120, and the second metal pad 134a is electrically connected to a test line 140 to which a test signal is applied. The test line 140 is electrically connected to a shorting bar 142 to collectively apply the test signal to the thin film transistors. At this time, after inspecting the thin film transistors, the test line 140 and the shorting bar 142 are cut along the cutting line 144 and electrically shorted.

As the array substrate 100, the insulating layer 110, and the transparent electrode 136a all have transparent properties, light generated under the array substrate 100 passes through the inspection region 10. By checking the connection between the output pad 130a and the output bump 310. That is, as the light generated from the array substrate 100 passes through the array substrate 100, the insulating layer 110, and the transparent electrode 136a formed in the inspection region 10, the anisotropic conductive film Shape defects and distribution defects of the conductive balls 610 included in the 600 may be inspected.

As such, as the inspection region 10 is formed as the first and second metal pads 132a and 134a are spaced apart from each other, the output pad 130a and the output bump 310 may be more easily formed. The connection can be checked.

In addition, in the above description, not only a connection relationship between the output pad 130a and the output bump 310 may be equally applied to a connection relationship between the output pad and the output bump and a connection relationship between the connection terminal and the transmission line.

<Example-2 of the display panel>

5 is a cross-sectional view of a portion of a display panel according to a second exemplary embodiment of the present invention, and FIG. 6 is an enlarged perspective view of a portion of a pad part of the display panel of FIG. Except for the pad portion and the contact hole, the display panel according to the second embodiment of the present invention has the same configuration as the display panel of the first embodiment described above, and thus a duplicated description thereof will be omitted. The same reference numerals and names are used.

1, 2, 5, and 6, the display panel includes an array substrate 100, a color filter substrate 200, a liquid crystal layer (not shown), a driving chip 300, and a flexible printed circuit board 400. ) And a printed circuit board 500.

A plurality of pads are formed in the peripheral area of the array substrate 100 to electrically connect the driving chip 300 to the data line 120.

The pad parts may include input pads (not shown) and output pads 130b, and the driving chip 300 may include input bumps (not shown) and the output pads 130b that are electrically connected to the input pads. ) And output bumps 310 connected to the battery. In this case, the pad part is electrically connected to the driving chip 300 through an anisotropic conductive film 600 including the conductive ball 610.

Each output pad 130b includes a metal pad 132b formed on the array substrate 100 and a transparent electrode 134b electrically connected to the metal pad 132b and being transparent. In this case, the metal pad 132b is electrically connected to the data line 120 and the test line 140. After inspecting the thin film transistors through the test line 140, the test line 140 and the shorting bar 142 are cut along the cutting line 144 to be electrically shorted.

The insulating layer 110 covering the metal pad 132b is formed on the array substrate 100. A contact hole 112b is formed in the insulating layer 110 on the metal pad 132b. The metal pad 132b and the transparent electrode 134b are electrically connected by the contact hole 112b.

The contact hole 112b is generally formed by etching part of the insulating layer 110 by plasma etching or the like. However, when a portion of the insulating layer 110 is etched, the metal pad 132b may have a serious adverse effect depending on what metal it is made of. Therefore, when the metal pad 132b is made of a highly reactive metal, the contact hole 112b should be limited in size, and thus the contact hole 112b has a circular and elliptical shape with a small size. .

Since the contact holes 112b are formed in plural, and the contact holes 112b are divided into two or more groups, the contact holes 112b are used to observe the connection relationship between the output pads 130b and the output bumps 310. The inspection area 20 is formed. For example, the contact holes 112b are arranged in four rows of three, and the two inspection areas 20 are formed by spaced apart from each other by a predetermined interval. As the number of the contact holes 112b increases, the contact resistance of the output pad 130b and the output bump 310 decreases, but the inspection area 20 decreases relatively, so that the contact holes 112b It is preferable to form an appropriate number.

The output pad 130b and the output bump 310 are connected to each other by an external heat and pressure with the anisotropic conductive film 600 interposed therebetween. The conductive balls 610 included in the anisotropic conductive film 600 form indentations on the transparent electrode 134b by the heat and pressure. By inspecting the shape defect and the distribution defect of the indentation formed in the inspection area 20 of the indentation, it is possible to examine the connection relationship between the output pad 130b and the output bump 310. In this case, the metal pad 132b preferably has a predetermined thickness or less to inspect the indentation through appearance.

As such, as the contact holes 122b are spaced apart from each other and the inspection region 20 is formed, the connection relationship between the output pad 130b and the output bump 310 can be more easily inspected.

In addition, in the above description, not only a connection relationship between the output pad 130b and the output bump 310 may be equally applied to a connection relationship between the output pad and the output bump and a connection relationship between the connection terminal and the transmission line.

<Example-3 of the Display Panel>

7 is a perspective view illustrating a display panel according to a third exemplary embodiment of the present invention, and FIG. 8 is an enlarged perspective view of part B of the display panel of FIG. 7.

7 and 8, the display panel includes an array substrate 700, a color filter substrate 200, a liquid crystal layer (not shown), a flexible printed circuit board 800, and a printed circuit board 500.

The array substrate 700 includes a plurality of thin film transistors (not shown), which are switching elements, and a plurality of pixel electrodes (not shown) electrically connected to the thin film transistors. An insulating layer covering the thin film transistors is formed on the array substrate 700.

Each thin film transistor includes a source electrode, a gate electrode, and a drain electrode. The source electrodes are electrically connected to data lines 720 formed in the X-axis direction on the array substrate 700, and the gate electrodes are formed on the array substrate 700 in the Y-axis direction. And the drain electrodes are electrically connected to the transparent and conductive pixel electrodes, respectively.

The color filter substrate 200 is disposed to face the array substrate 700. The color filter substrate 200 includes a plurality of color filters (not shown) for displaying color through light and a transparent and conductive common electrode (not shown) formed on the front surface of the color filter substrate 200. .

The liquid crystal layer is interposed between the array substrate 700 and the color filter substrate 200. The liquid crystal layer is composed of liquid crystals having an intermediate property of a liquid and a solid and arranged in a constant array. The liquid crystals are changed in an arrangement by an electric field formed between the pixel electrode and the common electrode. Liquid crystals of varying arrangements change light transmittance, and the light of which light transmittance is changed passes through the color filters to display a desired image.

The flexible printed circuit board 800 electrically connects the printed circuit board 500 and the array substrate 700. The flexible printed circuit board 800 may include transmission lines (not shown) for transmitting a control signal generated from the printed circuit board 500 to the array substrate 700, and are electrically connected to the transmission lines. And a driving chip 850 for converting the control signal into a driving signal for displaying an image.

The printed circuit board 500 receives an image signal from an external graphic controller (not shown) to generate a control signal for controlling the driving chip 850. The control signal is converted into the driving signal by the driving chip 850 disposed on the flexible printed circuit board 800 and applied to the array substrate 700.

FIG. 9 is a cross-sectional view taken along the line II-II 'of FIG. 8.

9, a plurality of connection terminals 740a for electrically connecting the transmission line 810 of the flexible printed circuit board 800 to the data line 720 in the peripheral region of the array substrate 700. Are formed. In this case, the connection terminals 740a are electrically connected to the transmission line 810 of the flexible printed circuit board 800 through the anisotropic conductive film 600 including the conductive balls 610.

The connection terminals 740a are electrically connected to the data line 720 to receive the driving signal from the flexible printed circuit board 800 and transmit the driving signal to the thin film transistor. The connection terminals 740a may be arranged in a plurality of rows along the Y-axis direction to improve the resolution of the display panel. For example, the connection terminals 740a may be arranged in two rows in a zigzag.

Each connection terminal 740a includes a metal terminal formed on the array substrate 700, and a transparent terminal 736a electrically connected to the metal terminal and transparent and conductive.

An insulating layer 710 covering the metal terminal is formed on the array substrate 700. A contact hole 712a is formed in the insulating layer 710 on the metal terminal. The metal terminal and the transparent electrode 746a are electrically connected by the contact hole 712a. The contact hole 712a may be formed to have a size equal to or smaller than that of the metal terminal in order to reduce contact resistance between the metal terminal and the transparent electrode 746a.

The metal terminals include first and second metal terminals 742a and 744a spaced apart from each other by a predetermined distance, and the first and second metal terminals 742a and 744a are spaced apart from each other. An inspection area 30 for inspecting a connection relationship between the connection terminal 740a and the transmission line 810 is formed.

The first metal terminal 742a is electrically connected to the data line 720, and the second metal pad 744a is electrically connected to a test line 750 to which a test signal is applied. The test line 750 is electrically connected to a shorting bar (not shown) to collectively apply the test signal to the thin film transistors. At this time, after inspecting the thin film transistors, the test line 750 and the shorting bar are cut along the cutting line (not shown) and electrically shorted.

As the array substrate 700, the insulating layer 710, and the transparent electrode 746a all have transparent properties, light generated under the array substrate 700 passes through the inspection region 30. The connection relationship between the connection terminal 740a and the transmission line 810 may be examined. That is, as the light generated from the array substrate 700 passes through the array substrate 700, the insulating layer 710, and the transparent electrode 746a formed in the inspection region 30, the anisotropic conductive film Shape defects and distribution defects of the conductive balls 610 included in the 600 may be inspected.

As such, as the inspection region 30 is formed as the first and second metal terminals 742a and 744a are spaced apart from each other, the connection terminal 740a and the transmission line 810 may be more easily formed. You can check the connection between.

In addition, although the connection terminal 740a connected to the data line 720 has been described as an example, a person skilled in the art may easily apply to other connection terminals connected to the gate line 730.

<Example 4 of the display panel>

FIG. 10 is a cross-sectional view of a portion of the display panel according to the fourth exemplary embodiment. Except for the connection terminal and the contact hole, the display panel according to the fourth embodiment of the present invention has the same configuration as that of the display panel of the above-described embodiment, and thus a duplicated description thereof will be omitted. Reference numerals and names will be used.

Referring to FIG. 10, the display panel includes an array substrate 700, a color filter substrate 200, a liquid crystal layer (not shown), a flexible printed circuit board 800, and a printed circuit board 500.

A plurality of connection terminals 740b are formed in the peripheral area of the array substrate 700 to electrically connect the transmission line 810 of the flexible printed circuit board 800 to the data line 720. In this case, the connection terminals 740b are electrically connected to the transmission line 810 of the flexible printed circuit board 800 through the anisotropic conductive film 600 including the conductive balls 610.

The connection terminals 740b are electrically connected to the data line 720 to receive the driving signal from the flexible printed circuit board 800 and transmit the driving signal to the thin film transistor.

The connection terminals 740b include a metal terminal 132b formed on the array substrate 700 and a transparent electrode 744b that is electrically connected to the metal terminal 742b and is transparent and conductive. In this case, the metal terminal 742b is electrically connected to the data line 720 and the test line 750. After inspecting the thin film transistors through the test line 750, the test line 750 and the shorting bar (not shown) are cut along the cutting line (not shown) and electrically shorted.

An insulating layer 710 covering the metal terminal 742b is formed on the array substrate 700. A contact hole 712b is formed in the insulating layer 710 on the metal terminal 742b. The metal terminal 742b and the transparent electrode 744b are electrically connected by the contact hole 712b.

The contact hole 712b is generally formed by etching part of the insulating layer 710 by plasma etching or the like. However, when a part of the insulating layer 710 is etched, the metal terminal 742b may have a serious adverse effect depending on which metal is formed. Therefore, when the metal terminal 742b is made of a highly reactive metal, the contact hole 712b should be limited in size, and thus the contact hole 112b has a small circular and elliptical shape. .

As the contact holes 712b are formed in plural, and the contact holes 712b are divided into two or more groups, the connection relationship between the connection terminal 740b and the transmission line 810 is observed. The inspection area 40 is formed. For example, the contact holes 712b are arranged in four rows of three, and the two inspection areas 40 are formed by spaced apart from each other by a predetermined interval. As the number of the contact holes 712b increases, the contact resistance between the connection terminal 740b and the transmission line 810 decreases, but the inspection area 40 decreases relatively, so that the contact holes 712b It is preferable to form the appropriate number.

The connection terminal 740b and the transmission line 810 are connected to each other by an external heat and pressure with the anisotropic conductive film 600 interposed therebetween. The conductive balls 610 included in the anisotropic conductive film 600 form indentations on the transparent electrode 744b by the heat and pressure.

By examining the shape defect and the distribution defect of the indentation formed in the inspection area 40 of the indentation, it is possible to examine the connection relationship between the connection terminal 740b and the transmission line 810. At this time, the metal terminal 742b preferably has a predetermined thickness or less to inspect the indentation through appearance.

As such, as the contact holes 722b are spaced apart from each other and the inspection area 40 is formed, the connection relationship between the connection terminal 740b and the transmission line 810 may be more easily examined. .

In addition, although the connection terminal 740a connected to the data line 720 has been described as an example, a person skilled in the art may easily apply to other connection terminals connected to the gate line 730.

According to the display panel, as the first and second metal pads or the first and second connection terminals are spaced apart from each other to form an inspection area, the connection between the output pad and the output bump or the connection terminal can be more easily performed. The connection with the transmission line can be checked.

In addition, as the contact holes are spaced apart from each other to form an inspection area, the connection relationship between the output pad and the output bump or the connection between the connection terminal and the transmission line can be more easily examined.

In the detailed description of the present invention described above with reference to the preferred embodiments of the present invention, those skilled in the art or those skilled in the art having ordinary skill in the art will be described in the claims to be described later It will be understood that various modifications and variations can be made in the present invention without departing from the scope of the present invention.

Claims (12)

Board; A driving chip disposed in a peripheral area of the substrate to generate a driving signal for displaying an image; And And a pad part formed in a peripheral area of the substrate and electrically connected to the driving chip, the pad part having an inspection area formed to observe a connection state with the driving chip. The display panel of claim 1, wherein the pad part comprises a conductive metal pad formed on the substrate and a transparent electrode electrically connected to the metal pad. The method of claim 2, wherein an insulating layer covering the metal pad is formed on the substrate, and a contact hole from which a portion of the insulating layer is removed is formed. And the transparent electrode and the metal pad are electrically connected to each other via the contact hole. The display panel of claim 3, wherein the metal pads include first and second metal pads spaced apart from each other to define the inspection area. The display panel of claim 4, wherein a connection state between the driving chip and the pad unit is observed as light passes through the inspection area. The display panel of claim 3, wherein the contact hole is provided in plurality, and the contact holes are divided into two or more groups to define the inspection area. The display panel of claim 1, further comprising an anisotropic conductive film including a plurality of conductive balls therein and electrically connecting the driving chip and the pad to each other. Board; A flexible printed circuit board which transmits a driving signal for displaying an image to the substrate; And And a connection terminal formed in a peripheral area of the substrate and electrically connected to the flexible printed circuit board and having a test area for observing a connection state with the flexible printed circuit board. The display panel of claim 8, wherein the connection terminal comprises a conductive metal terminal formed on the substrate and a transparent electrode electrically connected to the metal terminal. The method of claim 9, wherein an insulating layer covering the metal terminal is formed on the substrate, and a contact hole from which a portion of the insulating layer is removed is formed. And the transparent electrode and the metal terminal are electrically connected to each other via the contact hole. The display panel of claim 10, wherein the metal terminals include first and second metal terminals spaced apart from each other to define the inspection area. The display panel of claim 10, wherein the contact hole is provided in plural, and the contact holes are divided into two or more groups to define the inspection area.

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