KR20050096775A - Apparatus for cutting substrate and method for cutting thereof - Google Patents
Apparatus for cutting substrate and method for cutting thereof Download PDFInfo
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- KR20050096775A KR20050096775A KR1020040022447A KR20040022447A KR20050096775A KR 20050096775 A KR20050096775 A KR 20050096775A KR 1020040022447 A KR1020040022447 A KR 1020040022447A KR 20040022447 A KR20040022447 A KR 20040022447A KR 20050096775 A KR20050096775 A KR 20050096775A
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- laser beam
- mother substrates
- substrate
- scribing line
- mother
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- 239000000758 substrate Substances 0.000 title claims abstract description 107
- 238000000034 method Methods 0.000 title claims abstract description 19
- 230000001678 irradiating effect Effects 0.000 claims description 14
- 238000001179 sorption measurement Methods 0.000 claims description 6
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 claims description 4
- 239000002826 coolant Substances 0.000 claims description 4
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 claims description 4
- 230000010355 oscillation Effects 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 16
- 239000011521 glass Substances 0.000 description 12
- 239000000843 powder Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 4
- 238000004064 recycling Methods 0.000 description 4
- 238000003491 array Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 208000023504 respiratory system disease Diseases 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Liquid Crystal (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
본 발명은 기판 절단장치 및 그 절단방법에 관한 것으로, 기판 상에 제1레이저 빔을 사용하여 스크라이빙 라인을 형성한 다음 제2레이저 빔을 사용하여 스크라이빙 라인을 따라 기판을 절단하기 때문에 기판을 스크라이빙 라인을 따라 정밀하게 절단할 수 있게 된다.The present invention relates to a substrate cutting apparatus and a method for cutting the same, since the scribing line is formed on the substrate using a first laser beam and then the substrate is cut along the scribing line using a second laser beam. The substrate can be precisely cut along the scribing line.
Description
본 발명은 기판 절단장치 및 그 절단방법에 관한 것으로, 보다 상세하게는 복수의 액정 표시패널들이 형성된 대면적 기판을 레이저 빔(laser beam)으로 절단하여 액정 표시패널들을 개별적으로 분리시키기에 적당하도록 한 기판 절단장치 및 그 절단방법에 관한 것이다.The present invention relates to a substrate cutting apparatus and a cutting method thereof, and more particularly, to cut a large-area substrate on which a plurality of liquid crystal display panels are formed with a laser beam so as to be suitable for separating the liquid crystal display panels individually. A substrate cutting apparatus and a cutting method thereof.
일반적으로, 액정 표시장치는 매트릭스(matrix) 형태의 화소들에 데이터신호를 개별적으로 공급함으로써, 그 화소들의 광투과율을 조절하여 원하는 화상을 표시한다.In general, a liquid crystal display device individually supplies data signals to pixels in a matrix form, thereby adjusting a light transmittance of the pixels to display a desired image.
따라서, 상기 액정 표시장치는 화소들이 매트릭스 형태로 배열되는 액정 표시패널과, 그 액정 표시패널의 화소들을 구동시키는 구동부로 구성된다.Accordingly, the liquid crystal display device includes a liquid crystal display panel in which pixels are arranged in a matrix form, and a driver for driving pixels of the liquid crystal display panel.
상기 액정 표시패널은 일정한 셀-갭이 유지되도록 합착된 제1,제2기판과, 상기 제1,제2기판의 셀-갭에 형성된 액정층으로 구성되며, 상기 제1기판 상에는 박막 트랜지스터 어레이가 형성되고, 제2기판 상에는 컬러필터 어레이가 형성된다.The liquid crystal display panel includes a first and second substrates bonded to each other to maintain a constant cell gap, and a liquid crystal layer formed on the cell gaps of the first and second substrates. A thin film transistor array is disposed on the first substrate. The color filter array is formed on the second substrate.
상기한 바와같은 액정 표시장치를 제작함에 있어서, 최근 들어 대면적의 제1모기판에 복수의 박막 트랜지스터 어레이들을 형성하고, 대면적의 제2모기판에 복수의 컬러필터 어레이들을 형성하여 제1,제2모기판을 일정한 셀-갭이 유지되도록 합착함으로써, 복수의 액정 표시패널들을 동시에 제작한 다음 개별적으로 분리하는 방식을 통해 수율을 향상시키고 있다.In manufacturing a liquid crystal display as described above, recently, a plurality of thin film transistor arrays are formed on a first mother substrate having a large area, and a plurality of color filter arrays are formed on a second mother substrate having a large area. By bonding the second mother substrate to maintain a constant cell-gap, a plurality of liquid crystal display panels are simultaneously manufactured and then separated to improve yield.
상기 합착된 제1,제2모기판으로부터 액정 표시패널들을 개별적으로 분리하기 위해서는 제1,제2모기판의 표면에 스크라이빙 라인을 형성한 다음 물리적으로 타격하여 절단하는 방식이 사용되고 있다. 이와같은 기판 절단방법을 첨부한 도면을 참조하여 상세히 설명하면 다음과 같다.In order to separately separate the liquid crystal display panels from the bonded first and second mother substrates, a scribing line is formed on the surfaces of the first and second mother substrates and then physically hit and cut. This substrate cutting method will be described in detail with reference to the accompanying drawings.
도1a 및 도1b는 종래 기술에 따른 기판 절단방법을 보인 예시도이다. 1A and 1B are exemplary views illustrating a substrate cutting method according to the prior art.
먼저, 도1a에 도시한 바와같이 기판(10) 상에 절단 휠(20)을 통해 스크라이빙 라인(31)을 형성한다. First, as shown in FIG. 1A, a scribing line 31 is formed on a substrate 10 through a cutting wheel 20.
그리고, 도1b에 도시한 바와같이 상기 기판(10)을 반전시킨 다음 브레이크바(40)로 타격하여 상기 스크라이빙 라인(31)을 따라 크랙(crack)이 전파되도록 함으로써, 기판(10)을 절단한다.As shown in FIG. 1B, the substrate 10 is inverted and then hit by the brake bar 40 so that cracks propagate along the scribing line 31. Cut.
상기한 바와같은 기판 절단방법은 기판 상에 스크라이빙 라인을 형성한 다음 기판을 반전시키고, 브레이크바로 타격하여 기판을 절단함에 따라 기판이 스크라이빙 라인을 따라 절단되지 않는 경우가 빈번하게 발생되어 기판의 파손으로 인한 수율 및 생산성이 저하되는 문제점이 있었다.In the substrate cutting method as described above, the substrate is not cut along the scribing line as the scribing line is formed on the substrate and then the substrate is inverted and the substrate is cut by hitting the brake bar. There was a problem that the yield and productivity are lowered due to breakage of the substrate.
특히, 상기한 바와같은 기판 절단방법은 기판을 물리적으로 타격하는 경우에 다량의 유리가루(glass chip)들이 발생되고, 이와같은 유리가루들이 기판 상에 점착되는 경우에 액정 표시장치의 화질을 저하시킬 수 있으며, 또는 액정 표시장치의 구동 불량의 원인이 될 수 있다.In particular, the substrate cutting method as described above may reduce the image quality of the liquid crystal display when a large amount of glass chips are generated when the substrate is physically hit and the glass powders are adhered to the substrate. It may be a cause of the driving failure of the liquid crystal display.
또한, 상기 유리가루들을 흡입하여 클린-룸 외부로 배출하기 위한 별도의 장비 및 상기 유리가루들을 폐기하거나 재활용하기 위한 별도의 장비가 요구되어 클린-룸의 구조가 복잡해지고, 클린-룸의 설비비가 증대되며, 유리가루들의 흡입, 배출, 폐기 및 재활용을 위한 별도의 장비를 설치 및 운용함에 따른 경제적 손실이 발생하는 문제점이 있었다.In addition, a separate device for sucking and discharging the glass powder to the outside of the clean-room and a separate device for disposing or recycling the glass powder are required, which complicates the structure of the clean-room and increases the equipment cost of the clean-room. Increased, there is a problem that the economic loss caused by the installation and operation of separate equipment for the suction, discharge, disposal and recycling of the glass powder.
그리고, 상기 유리가루들은 작업자의 호흡기 관련 질환을 발생시킬 수 있는 문제점이 있었다.In addition, the glass powder has a problem that can cause a worker's respiratory disease.
따라서, 본 발명은 상기한 바와같은 문제점들을 해결하기 위하여 창안한 것으로, 본 발명의 목적은 복수의 액정 표시패널들이 형성된 대면적 기판을 레이저 빔으로 절단하여 액정 표시패널들을 개별적으로 분리시킬 수 있는 기판 절단장치 및 그 절단방법을 제공하는데 있다.Accordingly, the present invention has been made to solve the above problems, and an object of the present invention is to cut a large area substrate on which a plurality of liquid crystal display panels are formed with a laser beam to separate the liquid crystal display panels individually. The present invention provides a cutting device and a cutting method thereof.
상기 본 발명의 목적을 달성하기 위한 기판 절단장치는 합착된 제1,제2모기판의 표면에 제1레이저 빔을 조사하여 스크라이빙 라인을 형성하는 제1,제2레이저빔 발진부와; 상기 제1,제2모기판의 표면에 제2레이저 빔을 조사하여 상기 스크라이빙 라인을 따라 제1,제2모기판을 절단하는 제3,제4레이저빔 발진부를 구비하여 구성되는 것을 특징으로 한다.The substrate cutting device for achieving the object of the present invention comprises: a first laser beam oscillator for forming a scribing line by irradiating the first laser beam on the surface of the first and second mother substrate bonded; And a third and fourth laser beam oscillator for cutting the first and second mother substrates along the scribing line by irradiating a second laser beam to the surfaces of the first and second mother substrates. It is done.
상기 본 발명의 목적을 달성하기 위한 기판 절단방법은 합착된 제1,제2모기판의 표면에 제1레이저 빔을 조사하여 스크라이빙 라인을 형성하는 단계와; 상기 제1,제2모기판의 표면에 제2레이저 빔을 조사하여 상기 스크라이빙 라인을 따라 제1,제2모기판을 절단하는 단계를 포함하여 이루어지는 것을 특징으로 한다.The substrate cutting method for achieving the object of the present invention comprises the steps of forming a scribing line by irradiating the first laser beam on the surface of the first and second mother substrate bonded; And cutting the first and second mother substrates along the scribing line by irradiating a second laser beam onto the surfaces of the first and second mother substrates.
상기한 바와같은 본 발명에 의한 기판 절단장치 및 그 절단방법을 첨부한 도면을 참조하여 상세히 설명하면 다음과 같다.The substrate cutting apparatus and the cutting method according to the present invention as described above will be described in detail with reference to the accompanying drawings.
도2는 본 발명에 의한 기판 절단장치를 보인 예시도이다.Figure 2 is an exemplary view showing a substrate cutting apparatus according to the present invention.
도2를 참조하면, 본 발명에 의한 기판 절단장치는 합착된 제1,제2모기판(110,111)의 표면에 제1레이저 빔을 조사하여 스크라이빙 라인(131)을 형성하는 제1,제2레이저빔 발진부(120A,120B)와; 상기 제1,제2모기판(110,111)의 표면에 제2레이저 빔을 조사하여 상기 스크라이빙 라인(131)을 따라 제1,제2모기판(110,111)을 절단하는 제3,제4레이저빔 발진부(140A,140B)로 구성된다. 이때, 제1,제3레이저빔 발진부(120A,140A)는 제1지지대(150A)에 정렬 및 고정되어 제1모기판(110)의 양측면 상부에 배치되고, 제2,제4레이저빔 발진부(120B,140B)는 제2지지대(150B)에 정렬 및 고정되어 제2모기판(110)의 양측면 하부에 배치된다.Referring to Figure 2, the substrate cutting apparatus according to the present invention is the first, second to form a scribing line 131 by irradiating the first laser beam on the surface of the first and second mother substrate (110, 111) bonded Two laser beam oscillators 120A and 120B; Third and fourth lasers which cut the first and second mother substrates 110 and 111 along the scribing line 131 by irradiating a second laser beam onto the surfaces of the first and second mother substrates 110 and 111. It consists of beam oscillation parts 140A and 140B. In this case, the first and third laser beam oscillators 120A and 140A are aligned and fixed to the first support 150A and are disposed on both sides of the first mother substrate 110, and the second and fourth laser beam oscillators ( 120B and 140B are aligned and fixed to the second support 150B and are disposed below both side surfaces of the second mother substrate 110.
상기 제1,제2레이저빔 발진부(120A,120B)는 합착된 제1,제2모기판(110,111)의 전면 및 배면 상에서 서로 교차하면서, 제1,제2모기판(110,111)의 표면에 스크라이빙 라인(131)을 형성한다.The first and second laser beam oscillators 120A and 120B intersect each other on the front and rear surfaces of the first and second mother substrates 110 and 111 to which the first and second laser beam oscillators 120A and 120B are attached. The scribe line 131 is formed.
즉, 제1레이저빔 발진부(120A)는 제1모기판(110) 전면의 상부에서 하부으로 이동하면서 제1모기판(110)의 표면에 스크라이빙 라인(131)을 형성하고, 제2레이저빔 발진부(120B)는 제2모기판(111) 배면의 좌측에서 우측으로 이동하면서 제2모기판(111)의 표면에 스크라이빙 라인(131)을 형성한다. 이때, 제1,제2레이저빔 발진부(120A,120B)가 제1,제2모기판(110,111)의 중앙에서 교차하는 순간에는 제1,제2레이저빔 발진부(120A,120B) 중의 어느 하나가 이동 및 제1레이저 빔 조사를 중지하고, 다른 하나가 통과한 다음 속행함으로써, 제1,제2레이저빔 발진부(120A,120B)의 제1레이저 빔이 중첩되지 않도록 할 수도 있다.That is, the first laser beam oscillator 120A forms a scribing line 131 on the surface of the first mother substrate 110 while moving from the upper portion to the lower portion of the front surface of the first mother substrate 110 and the second laser beam. The beam oscillator 120B forms a scribing line 131 on the surface of the second mother substrate 111 while moving from the left side to the right side of the rear surface of the second mother substrate 111. At this time, when the first and second laser beam oscillators 120A and 120B intersect at the center of the first and second mother substrates 110 and 111, one of the first and second laser beam oscillators 120A and 120B The first laser beam of the first and second laser beam oscillators 120A and 120B may not be overlapped by stopping the moving and the first laser beam irradiation and continuing after the other one passes.
상기 제1,제2레이저빔 발진부(120A,120B)로부터 조사되는 제1레이저 빔은 0~50W 정도의 출력을 갖는 야그(Yttrium Aluminum Garnet : YAG) 레이저 빔이 적용될 수 있다. A Yttrium Aluminum Garnet (YAG) laser beam having an output of about 0 to 50W may be applied to the first laser beam emitted from the first and second laser beam oscillators 120A and 120B.
상기 제1레이저 빔으로 0~50W 정도의 출력을 갖는 야그 레이저 빔이 적용된 경우에 제1,제2모기판(110,111)의 표면에 스크라이빙 라인(131)이 형성되지 않을 수 있기 때문에 스크라이빙 라인(131)이 형성될 제1,제2모기판(110,111)의 모서리에 휠(wheel)이나 팁(tip)을 이용하여 노치(notch)를 형성한 다음 제1,제2레이저빔 발진부(120A,120B)를 통해 제1,제2모기판(110,111)의 표면에 스크라이빙 라인(131)을 형성할 수도 있다.When a yag laser beam having an output of about 0 to 50 W is applied to the first laser beam, a scribing line 131 may not be formed on the surfaces of the first and second mother substrates 110 and 111. A notch is formed at the edges of the first and second mother substrates 110 and 111 on which the ice line 131 is to be formed using a wheel or a tip, and then the first and second laser beam oscillator ( The scribing line 131 may be formed on the surfaces of the first and second mother substrates 110 and 111 through 120A and 120B.
상기 제3,제4레이저빔 발진부(140A,140B)는 합착된 제1,제2모기판(110,111)의 전면 및 배면 상에서 서로 좌우 방향으로 교차하면서, 상기 스크라이빙 라인(131)을 따라 제1,제2모기판(110,111)을 절단한다.The third and fourth laser beam oscillators 140A and 140B may cross each other in left and right directions on the front and rear surfaces of the first and second mother substrates 110 and 111 that are bonded to each other, along the scribing line 131. The first and second mother substrates 110 and 111 are cut.
즉, 제3레이저빔 발진부(140A)는 제1모기판(110) 전면의 좌측에서 우측으로 이동하면서 제1모기판(110)을 절단하고, 제4레이저빔 발진부(140B)는 제2모기판(111) 배면의 우측에서 좌측으로 이동하면서 제2모기판(111)을 절단한다.이때, 제3,제4레이저빔 발진부(140A,140B)가 제1,제2모기판(110,111)의 중앙에서 교차하는 순간에는 제3,제4레이저빔 발진부(140A,140B) 중의 어느 하나가 이동 및 제2레이저 빔 조사를 중지하고, 다른 하나가 통과한 다음 속행함으로써, 제3,제4레이저빔 발진부(140A,140B)의 제2레이저 빔이 중첩되지 않도록 할 수도 있다.That is, the third laser beam oscillator 140A cuts the first mother substrate 110 while moving from the left side to the right side of the front surface of the first mother substrate 110, and the fourth laser beam oscillator 140B is the second mother substrate. (111) The second mother substrate 111 is cut while moving from the right side to the left side of the rear surface. At this time, the third and fourth laser beam oscillators 140A and 140B are centered on the first and second mother substrates 110 and 111. At the moment of crossing, any one of the third and fourth laser beam oscillators 140A and 140B stops moving and irradiating the second laser beam, and after the other passes, the third and fourth laser beam oscillators are continued. The second laser beams 140A and 140B may not overlap each other.
상기 제3,제4레이저빔 발진부(140A,140B)로부터 조사되는 제2레이저 빔은 0~250W 정도의 출력을 갖는 CO2 레이저 빔이 적용될 수 있다.As the second laser beam irradiated from the third and fourth laser beam oscillators 140A and 140B, a CO 2 laser beam having an output of about 0 to 250W may be applied.
상기 제1 내지 제4레이저빔 발진부(120A,120B,140A,140B)는 제1,제2레이저 빔이 조사되는 헤드(head)에 냉각제를 분사하는 유닛(unit)이 개별적으로 구비될 수 있으며, 이때 냉각제로는 DI Water, N2 또는 He 등이 적용될 수 있다.The first to fourth laser beam oscillator (120A, 120B, 140A, 140B) may be provided with a unit for injecting a coolant to the head (head) to which the first and second laser beam is irradiated separately, In this case, DI water, N 2, or He may be used as the coolant.
도3은 상기 제1,제2레이저빔 발진부(120A,120B)에 의해 표면에 스크라이빙 라인(131)이 형성된 제1,제2모기판(110,111)을 절단하는 다른 예를 보인 예시도이다.3 is a diagram illustrating another example of cutting the first and second mother substrates 110 and 111 having the scribing line 131 formed on the surface by the first and second laser beam oscillators 120A and 120B. .
도3을 참조하면, 상기 제1,제2모기판(110,111)은 제1,제2테이블(160A,160B)에 로딩되며, 제1,제2모기판(110,111)의 표면에 형성된 스크라이빙 라인(131)이 제1,제2테이블(160A,160B) 사이에 정렬된다. Referring to FIG. 3, the first and second mother substrates 110 and 111 are loaded on the first and second tables 160A and 160B, and scribing is formed on the surfaces of the first and second mother substrates 110 and 111. Line 131 is aligned between first and second tables 160A and 160B.
상기 제1,제2테이블(160A,160B)의 표면에는 복수의 진공흡착홀(170)들이 구비되어 상기 제1,제2모기판(110,111)을 진공 흡착한다. 이때, 진공흡착홀(170)들을 통해 제1,제2모기판(110,111)을 진공 흡착하기 위한 진공압은 40~50 Kpa 정도로 설정될 수 있다.A plurality of vacuum adsorption holes 170 are provided on surfaces of the first and second tables 160A and 160B to vacuum-adsorb the first and second mother substrates 110 and 111. At this time, the vacuum pressure for vacuum adsorption of the first and second mother substrates 110 and 111 through the vacuum adsorption holes 170 may be set to about 40 ~ 50 Kpa.
상기한 바와같이 제1,제2모기판(110,111)의 표면에 형성된 스크라이빙 라인(131)이 제1,제2테이블(160A,160B) 사이에 정렬되고, 제1,제2모기판(110,111)이 제1,제2테이블(160A,160B)에 로딩되어 진공 흡착된 다음에는 상기 제1,제2테이블(160A,160B)이 서로 멀어지는 방향으로 구동됨으로써, 제1,제2모기판(110,111)을 스크라이빙 라인(131)을 따라 절단한다.As described above, the scribing lines 131 formed on the surfaces of the first and second mother substrates 110 and 111 are aligned between the first and second tables 160A and 160B, and the first and second mother substrates ( After the 110 and 111 are loaded on the first and second tables 160A and 160B and vacuum-adsorbed, the first and second tables 160A and 160B are driven in a direction away from each other, whereby the first and second mother substrates ( 110 and 111 are cut along the scribing line 131.
상기한 바와같은 본 발명에 의한 기판 절단장치 및 그 절단방법은 기판 상에 제1레이저 빔을 사용하여 스크라이빙 라인을 형성한 다음 제2레이저 빔을 사용하여 스크라이빙 라인을 따라 기판을 절단하기 때문에 기판을 스크라이빙 라인을 따라 정밀하게 절단할 수 있게 되어 종래의 브레이브바를 통한 절단방법에 비해 절단 불량으로 인한 기판 파손을 방지함으로써, 수율 및 생산성이 저하되는 것을 방지할 수 있는 효과가 있다.The substrate cutting apparatus and the cutting method according to the present invention as described above forms a scribing line using a first laser beam on the substrate and then cuts the substrate along the scribing line using a second laser beam. Therefore, since the substrate can be precisely cut along the scribing line, the substrate can be prevented from being damaged due to the poor cutting compared to the conventional cutting method through the brave bar, thereby preventing the yield and productivity from being lowered. .
특히, 본 발명에 의한 기판 절단장치 및 그 절단방법은 기판 상에 제1레이저 빔을 사용하여 스크라이빙 라인을 형성한 다음 제2레이저 빔을 사용하여 스크라이빙 라인을 따라 기판을 절단하기 때문에 유리가루의 발생을 차단할 수 있게 된다.In particular, the substrate cutting apparatus and the cutting method according to the present invention forms a scribing line using the first laser beam on the substrate and then cuts the substrate along the scribing line using the second laser beam. It is possible to block the generation of glass powder.
따라서, 유리가루의 흡착으로 인한 액정 표시장치의 화질 저하나 구동불량을 방지할 수 있는 효과가 있다.Therefore, there is an effect of preventing the deterioration of image quality or driving failure of the liquid crystal display due to the adsorption of glass powder.
또한, 유리가루를 흡입하여 클린-룸 외부로 배출하기 위한 별도의 장비 및 유리가루를 폐기하거나 재활용하기 위한 별도의 장비가 요구되지 않게 되어 클린-룸의 구조를 단순화할 수 있는 효과가 있고, 클린-룸의 설비비를 감소시킬 수 있는 효과가 있으며, 상기 유리가루의 흡입, 배출, 폐기 및 재활용을 위한 별도의 장비를 설치 및 운용함에 따른 경제적 손실이 발생되는 것을 방지할 수 있는 효과가 있다.In addition, separate equipment for sucking and discharging the glass powder to the outside of the clean room and separate equipment for disposing or recycling the glass powder are not required, thereby simplifying the structure of the clean room, -There is an effect that can reduce the equipment cost of the room, there is an effect that can prevent the economic loss caused by installing and operating a separate equipment for the suction, discharge, disposal and recycling of the glass powder.
그리고, 유리가루로 인한 작업자의 호흡기 관련 질환이 발생되는 것을 방지할 수 있는 효과가 있다.And, there is an effect that can prevent the worker's respiratory diseases caused by the glass powder.
도1a 및 도1b는 종래 기술에 따른 기판 절단방법을 보인 예시도.Figures 1a and 1b is an exemplary view showing a substrate cutting method according to the prior art.
도2는 본 발명에 의한 기판 절단장치를 보인 예시도.Figure 2 is an exemplary view showing a substrate cutting apparatus according to the present invention.
도3은 도2에 있어서, 제1,제2레이저빔 발진부에 의해 표면에 스크라이빙 라인이 형성된 제1,제2모기판을 절단하는 다른 예를 보인 예시도.FIG. 3 is an exemplary view showing another example of cutting the first and second mother substrates on which a scribing line is formed on the surface by the first and second laser beam oscillators.
***도면의 주요부분에 대한 부호의 설명****** Explanation of symbols for main parts of drawing ***
110:제1모기판 111:제2모기판110: first mother substrate 111: second mother substrate
120A:제1레이저빔 발진부 120B:제2레이저빔 발진부120A: first laser beam oscillator 120B: second laser beam oscillator
131:스크라이빙 라인 140A:제3레이저빔 발진부131: scribing line 140A: third laser beam oscillator
140B:제4레이저빔 발진부 150A:제1지지대140B: fourth laser beam oscillator 150A: first support
150B:제2지지대150B: second support
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