KR20040022818A - Testing socket jig for memory module - Google Patents

Abstract

PURPOSE: A socket jig is provided to prevent signal losses and noises, while allowing for ease of manufacture and reducing manufacturing costs. CONSTITUTION: A socket jig comprises a jig board(20) having a side inserted in a memory slot of a memory socket; and a jig socket(10) soldered to the other side of the jig board, wherein the jig socket has test slots(12) for mounting of a memory module. The jig board is a printed circuit board, and includes a plurality of connection terminals(23) inserted into the memory slots of the memory socket, a plurality of soldering terminals(22) soldered to the jig socket, and a plurality of connection lines(24) for interconnecting the connection terminals and soldering terminals. The jig socket includes a socket body(14) having a surface on which test slots for connection of the memory module are formed; a plurality of socket pins(13) accommodated into the socket body, wherein each of the socket pins has an end exposed to the inside of the test slot and the other end protruded to the other surface of the socket body such that the socket pins are soldered to the soldering terminals of the jig board; and an ejector(11) for fixing the memory module at both surfaces of the socket body.

Description

Test socket jig for memory module {TESTING SOCKET JIG FOR MEMORY MODULE}

The present invention relates to a test socket jig of a memory module. More particularly, the present invention relates to a test socket jig of a memory module that can simplify a structure to prevent loss of test signals and noise, and reduce manufacturing costs. .

The computer stores temporary instructions or data necessary to perform a series of tasks in a memory, and the central processing unit (CPU) quickly accesses the instructions and data stored in the memory to process a task.

Therefore, as the capacity of the memory increases, the performance of the computer is improved. To this end, various types of memory modules have been developed.

The memory module is testing the memory module using a separate specialized equipment to check the characteristics or reliability of the internal circuit after the assembly process.

However, since the memory module test apparatus is very expensive, it has been a cause of increasing the production cost of the memory module.

Therefore, the memory module should be installed in the memory socket installed on the system board of the server or the desktop computer to test the memory module in order to suit the environmental characteristics of the memory module and to reduce the production cost of the memory module. It became.

However, in the above test method, since the memory module is frequently detached from the system board, the memory socket is easily worn or damaged.

Therefore, an invention for solving the above problems has been proposed in Korean Patent Publication No. 2001-0044283 (name of the invention: Semiconductor Memory Tester).

As shown in FIG. 6, the "semiconductor memory tester" includes a memory socket 30, an intermediate board 25 connected to the memory socket 30, and a test socket 15 connecting the memory module 60. ) And a connection connector 50 for connecting the test socket 15 and the intermediate board 25. The memory socket 30 is generally installed on the system board of a desktop computer or a server computer, and FIG. 4 shows the system board 40 of the desktop computer.

In addition, the test socket 15 includes a test slot 12 to which the memory module 60 is connected, an ejector 11 to fix the memory module 60, and a plurality of socket pins 13. The connection connector 50 has a plurality of fitting holes 52 into which the socket pins 13 are inserted, and a fitting portion 51 through which the intermediate board 25 is inserted.

The intermediate board 25 may include a second terminal portion 27 connected to the fitting portion 51 of the connection connector 50, and a first terminal portion 26 inserted into the memory slot 32 of the memory socket 30. It consists of

The semiconductor memory tester connects the intermediate board 25 to the fitting portion 51 of the connecting connector 50, and connects the socket pin of the test socket 15 to the fitting hole 52 of the connecting connector 50. (13) is inserted and connected, wherein the socket pin 13 and the second terminal portion 27 of the intermediate board 25 are electrically connected in the connection connector 50.

In order to test the memory module in the semiconductor memory tester as described above, the intermediate board 25 is inserted into the memory socket 30, and then the memory module 60 is inserted into the test socket 15.

Therefore, when the test socket 15 is damaged due to frequent detachment of the memory module, only the semiconductor memory tester is replaced and used, thereby preventing damage to the memory socket 30 of the system board 40.

In the semiconductor memory tester as described above, since the socket pin 13 and the intermediate board 25 are connected to the multi-contact point inside the connection connector 50, the test signal is delayed or lost, and noise may be generated. In addition, due to frequent detachment and detachment of the memory module 60 in the test socket 15, disconnection and poor contact occurred inside the connection connector 50, thereby reducing the reliability of the test results.

In addition, there is a problem that the manufacturing cost is increased due to the complicated connection configuration of the connection connector 50.

The present invention is to solve the above problems, an object of the present invention is to provide a test socket jig for a reliable memory module by preventing the loss of the test signal and the generation of noise.

In addition, another object of the present invention is to provide a socket jig for testing a memory module that can simplify the structure and reduce manufacturing costs.

1 is an exploded perspective view of a test socket jig of a memory module according to an embodiment of the present invention;

Figure 2a is a perspective view of the combination of the test socket jig of the memory module according to an embodiment of the present invention

FIG. 2B is a bottom view seen from the direction A of FIG. 2A

Figure 3 is a state diagram used in the test socket jig of the memory module according to an embodiment of the present invention

4 is a desktop system board for testing a memory module.

5A to 5H are signal waveform diagrams output through a memory socket and a test socket jig of a memory module according to the present invention.

Figure 6 is an exploded perspective view showing a test socket jig of a conventional memory module

<Description of Symbols for Main Parts of Drawings>

10 Jig socket 11, 31 ejector

12 Test Slot 13 Socket Pin

14 Socket Body 20 Jig Board

21 Fixed end 22 Soldering terminal

23 Connector 24 Connector

30 Memory Socket 32 Memory Slot

40 System Board 42 ISA Slot

43 PCI Slot 60 Memory Module

The test socket jig of a memory module according to the present invention is a test socket jig of a memory module mounted on a memory socket of a computer, wherein the socket jig includes a jig board having one side inserted into a memory slot of the memory socket; And a jig socket having a test slot to which the other side of the jig board is soldered and having a test slot to which the memory module is detachable, wherein the jig board has a rectangular plate shape and ends are formed at both ends of the other side. A printed circuit board having a length shorter than that of a plurality of connection terminals, the plurality of connecting terminals being inserted into and connected to the memory slots of the memory sockets on both sides of one side of the substrate, and soldered to the jig sockets on both sides of the other side of the substrate. A plurality of soldering terminals to be connected, and a plurality of connecting lines connecting the plurality of connecting terminals and the soldering terminals are formed. The jig socket includes: a socket body having a test slot to which the memory module is connected; and a socket body formed at one side thereof, and being accommodated in the socket body, one end of which is exposed to the inside of the test slot and the other end of the socket body. And a plurality of socket pins protruding from and soldered to the plurality of soldering terminals of the jig board, and an ejector for fixing the memory module to both sides of the socket body.

In addition, the test socket jig of the memory module according to the present invention is characterized in that the width of the plurality of connection terminals of the jig board is larger than the width of the solder terminal of the jig board.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is an exploded perspective view of a test socket jig of a memory module according to an embodiment of the present invention, and FIG. 2a is a combined perspective view of a test socket jig of a memory module according to an embodiment of the present invention, and FIG. 2A is a bottom view as viewed from the A direction, and FIG. 3 is a state diagram of a test socket jig for a memory module according to an embodiment of the present invention. FIG. 4 is a desktop system board for testing a memory module. 5A through 5H are signal waveform diagrams output through a memory socket and a test socket jig of a memory module according to the present invention.

As shown in Figures 1 to 4, the present invention, the jig board 20 is inserted into and mounted in the memory socket 30 mounted on the system board of the server or desktop computer, and the memory module is repeatedly removed It consists of a jig socket 10.

4 illustrates a system board of a desktop computer, in which an ISA slot 42, a PC slot 43, a CPU, and the like are mounted. Is installed on the system board of a server or desktop computer.

The jig board 20 is a printed circuit board (PCB) having a plurality of connection lines 24 formed on both surfaces thereof, and one end of the connection line 24 is inserted into and connected to a memory slot 32 formed in the memory socket 30. A plurality of connecting terminals 23 are formed, and a plurality of soldering terminals 22 connected to the jig socket 10 are formed at the other end of the connecting line 24. In addition, the width of the plurality of connection terminals 23 is larger than the width of the soldering terminal 22 to facilitate contact, and the soldering terminal 22 is preferably narrowed so as not to short-circuit with neighboring soldering terminals. Do.

The number of the connection lines 24 can be changed according to the number of terminals of the memory module 60 to be tested. If the memory module 60 to be tested is a dual inline memory module (DIMM) type, the number is 168. In the case of a double data rate (DDR) DRAM, the number is 184, and it can be used for SDRAM II or the like.

The jig socket 10, the test slot 12 to which the memory module 60 is connected is formed on one side of the socket body 14, the jig board 20 on the other side of the socket body 14 The plurality of socket pins 13 connected to the soldering terminals 22 of the protrusions are formed to protrude.

In addition, both sides of the socket body 14 is configured with an ejector 11 for fixing the memory module 60.

The socket pins 13 are connected to the test slots 12 and protrude in four rows of two rows each. Accordingly, when the jig board 20 is tightly inserted into the socket body 14 between the socket pins 13 formed by two lines, and the solder pins 22 and the solder terminals 22 are soldered. The jig board 20 is fixed by the socket pin 13.

In addition, the jig board 20 is coupled to the ejector 31 of the memory socket 30, the contact terminal 23 to be in close contact with the socket pin 13 protruding from the socket body (14) The fixed end 21 is formed so that it may be small.

Therefore, the jig board 20 is tightly sandwiched between the socket pins 13 and soldered to complete the socket jig.

As shown in FIG. 3, the jig board 20 is inserted into the memory socket 30 installed on the system board 40, as shown in FIG. 3. And the ejector 31 installed on both sides of the memory socket 30 to the fixed end 21 of FIG.

The memory module 60 to be tested is mounted on the jig socket 10 to test the memory module 60 with the system board.

The socket jig according to the present invention and six SYNC type M366S3323DTS-C7A and three M366S3253DTS-C7A on the system board, one DD type M368L3313CT1-CB0, two M368L3313DTL-CB0, two M368L3223DTL-CB The test results of two M368L6423CTL-CB0s were identical.

In addition, the signal length added by the jig board and socket pins delays all signals by about 240 ps (pico second) and loss of about 500 ps in the chipset lead time (tSAC) in the defect-free signal test, but the data setup and hold time There is enough margin in, so there is no problem in operation and all other signals worked similarly. Tables 1 to 3 below show the defect signal test results.

division Rise time Descent time Upper pulse width Lower pulse width Voltage Voltage Memory socket 732 ps 824ps 3.93ns 3.56ns 3.41 V -0.42V Socket jig 664 ps 968 ps 3.88ns 3.61ns 3.18V 0.10 V

signal Memory socket Socket jig Voltage Voltage Rise time Descent time Voltage Voltage Rise time Descent time CS 3.42 V -0.42V 752ps 648 ps 3.48 V -0.34V 724ps 660 ps RAS 3.50 V -0.22V 1956 ps 1944 ps 3.50 V -0.22V 1708 ps 2008 ps CAS 3.58 V -0.20V 1888 ps 1788 ps 3.62V -0.14V 1916 ps 1748 ps WE 3.52 V -0.12V 1348 ps 1860 ps 3.48 V -0.12V 1632 ps 1808ps A0 3.48 V -0.10V 1072ps 924 ps 3.56 V -0.16V 904 ps 796 ps DQ0-W 3.70 V -0.74V 328 ps 500 ps 3.66 V -0.60V 336 ps 636 ps

signal Memory socket Socket jig setup time hold time setup time hold time CS 4.76 ns 2.84ns 4.80ns 2.68ns RAS 11.04 ns 3.44ns 11.36 ns 3.28ns CAS 18.40ns 3.76 ns 18.80ns 3.52ns WE 11.28 ns 3.76 ns 11.44 ns 3.60ns A0 11.36 ns 3.68ns 11.60ns 3.52ns DQ0 4.24ns 3.12 ns 4.00ns 3.12 ns

Table 1 shows clock signal data, and Table 2 shows overshoot, undershoot, and rising time and fall time of the pulse. Table 3 also shows setup and hold time.

5A to 5H show signal waveforms of a synchronous DRAM, FIG. 5A shows a clock pulse CLK, FIG. 5B shows a chip select signal CS, and FIG. 5c shows the ras signal RAS, FIG. 5d shows the cas signal CAS, FIG. 5e shows the above signal WE, and FIGS. 5f and 5g show the data signal A0 and The lighter signal DQ0 is shown, and FIG. 5H shows a waveform diagram of the memory slot, which is almost the same.

That is, it can be seen that the signal characteristics mounted on the socket jig according to the present invention when mounted on the system board is almost similar.

According to the present invention as described above, while providing a socket jig for reliable dual in-line memory module test by preventing the signal loss and noise caused by the socket jig, while simplifying the structure and manufacturing cost reduction effect have.

The embodiments of the present invention described above and illustrated in the drawings should not be construed as limiting the technical spirit of the present invention. The protection scope of the present invention is limited only by the matters described in the claims, and those skilled in the art can change and change the technical idea of the present invention in various forms. Therefore, such improvements and modifications will fall within the protection scope of the present invention, as will be apparent to those skilled in the art.

Claims (2)

In the socket jig for testing a memory module mounted on a memory socket of a computer, The socket jig is composed of a jig socket having a jig board, one side is inserted into the memory slot of the memory socket and mounted, a test slot connected to the other side of the jig board by soldering and detachable from the memory module. The jig board has a rectangular plate shape, and ends are formed at both ends of the other side and are shorter in length than the length of the one side. The jig board is inserted into and connected to memory slots of the memory socket on both sides of the substrate. A plurality of connecting terminals, a plurality of soldering terminals for soldering and connecting with the jig socket on both sides of the other side of the substrate, and a plurality of connecting lines for connecting the plurality of connecting terminals and the soldering terminals, The jig socket has a socket body in which a test slot to which the memory module is connected is formed on one side, and is accommodated in the socket body so that one end is exposed to the inside of the test slot and the other end protrudes from the other side of the socket body. And a plurality of socket pins soldered to a plurality of soldering terminals of the jig board, and an ejector for fixing the memory modules to both sides of the socket body. The method of claim 1, And a width of the plurality of connection terminals of the jig board is larger than a width of the solder terminals of the jig board.