KR20040014660A - 니오브 분말, 그것의 소결체 및 그것을 사용한 콘덴서 - Google Patents
니오브 분말, 그것의 소결체 및 그것을 사용한 콘덴서 Download PDFInfo
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- KR20040014660A KR20040014660A KR10-2004-7000208A KR20047000208A KR20040014660A KR 20040014660 A KR20040014660 A KR 20040014660A KR 20047000208 A KR20047000208 A KR 20047000208A KR 20040014660 A KR20040014660 A KR 20040014660A
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- South Korea
- Prior art keywords
- capacitor
- niobium powder
- niobium
- powder
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- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 title claims abstract description 89
- 239000003990 capacitor Substances 0.000 title claims abstract description 59
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 37
- 239000000843 powder Substances 0.000 claims abstract description 33
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 22
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 20
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 19
- 239000001301 oxygen Substances 0.000 claims abstract description 19
- 229910052715 tantalum Inorganic materials 0.000 claims abstract description 19
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 18
- 239000001257 hydrogen Substances 0.000 claims abstract description 18
- 239000011777 magnesium Substances 0.000 claims abstract description 18
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 16
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 11
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims abstract description 8
- 239000004065 semiconductor Substances 0.000 claims description 26
- 229920001940 conductive polymer Polymers 0.000 claims description 19
- 229910052758 niobium Inorganic materials 0.000 claims description 18
- 239000010955 niobium Substances 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 15
- 239000002245 particle Substances 0.000 claims description 15
- 125000004432 carbon atom Chemical group C* 0.000 claims description 12
- 229920006395 saturated elastomer Polymers 0.000 claims description 12
- 239000002019 doping agent Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 9
- 125000004122 cyclic group Chemical group 0.000 claims description 9
- 125000004417 unsaturated alkyl group Chemical group 0.000 claims description 9
- -1 CF 3 groups Chemical group 0.000 claims description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 6
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 claims description 6
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 6
- 239000008151 electrolyte solution Substances 0.000 claims description 5
- 229910000484 niobium oxide Inorganic materials 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 5
- 229920000128 polypyrrole Polymers 0.000 claims description 5
- 229930195734 saturated hydrocarbon Natural products 0.000 claims description 5
- 229920000123 polythiophene Polymers 0.000 claims description 4
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical group [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 3
- SIKJAQJRHWYJAI-UHFFFAOYSA-N Indole Chemical compound C1=CC=C2NC=CC2=C1 SIKJAQJRHWYJAI-UHFFFAOYSA-N 0.000 claims description 3
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 claims description 3
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims description 3
- 125000003545 alkoxy group Chemical group 0.000 claims description 3
- 125000005907 alkyl ester group Chemical group 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 150000001408 amides Chemical class 0.000 claims description 3
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 3
- 125000004093 cyano group Chemical group *C#N 0.000 claims description 3
- 150000002148 esters Chemical class 0.000 claims description 3
- 125000005843 halogen group Chemical group 0.000 claims description 3
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 3
- 125000001841 imino group Chemical group [H]N=* 0.000 claims description 3
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims description 3
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 3
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 claims description 3
- 229920000767 polyaniline Polymers 0.000 claims description 3
- 125000001424 substituent group Chemical group 0.000 claims description 3
- 125000000475 sulfinyl group Chemical group [*:2]S([*:1])=O 0.000 claims description 3
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 claims description 3
- 229910052717 sulfur Inorganic materials 0.000 claims description 3
- 125000004434 sulfur atom Chemical group 0.000 claims description 3
- 125000001302 tertiary amino group Chemical group 0.000 claims description 3
- 229930195735 unsaturated hydrocarbon Natural products 0.000 claims description 3
- 239000002574 poison Substances 0.000 claims description 2
- 231100000614 poison Toxicity 0.000 claims description 2
- 230000000052 comparative effect Effects 0.000 description 14
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 14
- 238000005121 nitriding Methods 0.000 description 13
- 238000006243 chemical reaction Methods 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 150000002431 hydrogen Chemical class 0.000 description 7
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- 229910001873 dinitrogen Inorganic materials 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 4
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 4
- YADSGOSSYOOKMP-UHFFFAOYSA-N dioxolead Chemical compound O=[Pb]=O YADSGOSSYOOKMP-UHFFFAOYSA-N 0.000 description 4
- 238000005469 granulation Methods 0.000 description 4
- 230000003179 granulation Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 238000010298 pulverizing process Methods 0.000 description 3
- 238000000746 purification Methods 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 2
- FTPUNAWAGWERLA-UHFFFAOYSA-G dipotassium;heptafluoroniobium(2-) Chemical compound [F-].[F-].[F-].[F-].[F-].[F-].[F-].[K+].[K+].[Nb+5] FTPUNAWAGWERLA-UHFFFAOYSA-G 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002354 inductively-coupled plasma atomic emission spectroscopy Methods 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- DSSYKIVIOFKYAU-XCBNKYQSSA-N (R)-camphor Chemical compound C1C[C@@]2(C)C(=O)C[C@@H]1C2(C)C DSSYKIVIOFKYAU-XCBNKYQSSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 241000723346 Cinnamomum camphora Species 0.000 description 1
- ZGRBQKWGELDHSV-UHFFFAOYSA-N N.[W+4] Chemical compound N.[W+4] ZGRBQKWGELDHSV-UHFFFAOYSA-N 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- PYLYNBWPKVWXJC-UHFFFAOYSA-N [Nb].[Pb] Chemical compound [Nb].[Pb] PYLYNBWPKVWXJC-UHFFFAOYSA-N 0.000 description 1
- ROSDCCJGGBNDNL-UHFFFAOYSA-N [Ta].[Pb] Chemical compound [Ta].[Pb] ROSDCCJGGBNDNL-UHFFFAOYSA-N 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229960000846 camphor Drugs 0.000 description 1
- 229930008380 camphor Natural products 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009837 dry grinding Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N ferric oxide Chemical compound O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229940046892 lead acetate Drugs 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- PIJPYDMVFNTHIP-UHFFFAOYSA-L lead sulfate Chemical compound [PbH4+2].[O-]S([O-])(=O)=O PIJPYDMVFNTHIP-UHFFFAOYSA-L 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- DOTMOQHOJINYBL-UHFFFAOYSA-N molecular nitrogen;molecular oxygen Chemical compound N#N.O=O DOTMOQHOJINYBL-UHFFFAOYSA-N 0.000 description 1
- ZKATWMILCYLAPD-UHFFFAOYSA-N niobium pentoxide Inorganic materials O=[Nb](=O)O[Nb](=O)=O ZKATWMILCYLAPD-UHFFFAOYSA-N 0.000 description 1
- UOVBPFDQEDOOIK-UHFFFAOYSA-I niobium(5+) pentachlorite Chemical compound Cl(=O)[O-].[Nb+5].Cl(=O)[O-].Cl(=O)[O-].Cl(=O)[O-].Cl(=O)[O-] UOVBPFDQEDOOIK-UHFFFAOYSA-I 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000414 polyfuran Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000007774 positive electrode material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- SDKPSXWGRWWLKR-UHFFFAOYSA-M sodium;9,10-dioxoanthracene-1-sulfonate Chemical compound [Na+].O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2S(=O)(=O)[O-] SDKPSXWGRWWLKR-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003481 tantalum Chemical class 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- OEIMLTQPLAGXMX-UHFFFAOYSA-I tantalum(v) chloride Chemical compound Cl[Ta](Cl)(Cl)(Cl)Cl OEIMLTQPLAGXMX-UHFFFAOYSA-I 0.000 description 1
- 238000001238 wet grinding Methods 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
- H01G9/052—Sintered electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
- H01G9/052—Sintered electrodes
- H01G9/0525—Powder therefor
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/045—Alloys based on refractory metals
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
- C22C27/02—Alloys based on vanadium, niobium, or tantalum
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Powder Metallurgy (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Ceramic Capacitors (AREA)
- Disintegrating Or Milling (AREA)
Abstract
Description
Claims (22)
- Mg와 Zr함량이 각각 50∼400질량ppm, W함량이 20∼200질량ppm, Ta함량이 300∼3,000질량ppm, 산소, 질소, 수소, Mg, Zr, W 및 Ta 이외의 원소 함량이 각각 50질량ppm 이하인 것을 특징으로 하는 니오브 분말.
- 제 1항에 있어서, 산소 함량이 4,000∼100,000질량ppm인 것을 특징으로 하는 니오브 분말.
- 제 1항 또는 제 2항에 있어서, 질소 함량이 20∼200,000질량ppm인 것을 특징으로 하는 니오브 분말.
- 제 1항 또는 제 2항에 있어서, 수소 함량이 5∼200질량ppm인 것을 특징으로 하는 니오브 분말.
- 제 1항 또는 제 2항에 있어서, 1차 분말의 평균 입자 사이즈가 0.1∼5㎛인 것을 특징으로 하는 니오브 분말.
- 제 5항에 기재된 1차 분말을 입자화시킴으로써 얻어진 2차 분말의 평균 입자 사이즈가 50∼300㎛인 것을 특징으로 하는 니오브 분말.
- 제 1항 또는 제 2항에 있어서, BET비표면적이 0.5m2/g∼40m2/g인 것을 특징으로 하는 니오브 분말.
- 제 1항 또는 제 2항에 있어서, CV값이 80,000∼200,000㎌V/g인 것을 특징으로 하는 니오브 분말.
- 제 1항 또는 제 2항에 기재된 니오브 분말을 사용하는 것을 특징으로 하는 소결체.
- 제 9항에 있어서, BET비표면적이 0.5m2/g∼7m2/g인 것을 특징으로 하는 소결체.
- 제 9항에 기재된 니오브 소결체를 한쪽 전극으로 하고, 상기 소결체의 표면 상에 형성된 유전체, 및 상기 유전체 상에 형성된 다른쪽 전극을 포함하는 것을 특징으로 하는 콘덴서.
- 제 11항에 있어서, 유전체가 산화 니오브를 주성분으로서 포함하는 것을 특징으로 하는 콘덴서.
- 제 11항에 있어서, 다른쪽 전극의 재료가 전해질 용액, 유기 반도체, 및 무기 반도체로 이루어지는 군으로부터 선택된 1종 이상인 것을 특징으로 하는 콘덴서.
- 제 13항에 있어서, 다른쪽 전극의 재료가 유기 반도체이고, 상기 유기 반도체가 벤조피롤린 테트라머 및 클로라닐을 포함하는 유기 반도체, 테트라티오테트라센을 주성분으로서 포함하는 유기 반도체, 테트라시아노퀴노디메탄을 주성분으로서 포함하는 유기 반도체 및 도전성 폴리머로 이루어진 군으로부터 선택된 1종 이상인 것을 특징으로 하는 콘덴서.
- 제 14항에 있어서, 도전성 폴리머가 폴리피롤, 폴리티오펜, 폴리아닐린 및 그것의 치환 유도체로부터 선택된 1종 이상인 것을 특징으로 하는 콘덴서.
- 제 14항에 있어서, 도전성 폴리머가 하기 일반식(1) 또는 (2)으로 나타내어지는 반복단위를 포함하는 폴리머에 도판트를 도핑시킴으로써 얻어진 도전성 폴리머인 것을 특징으로 하는 콘덴서.(여기서, R1∼R4는 각각 독립적으로 수소원자, 1∼10의 탄소원자를 갖는 직쇄상 또는 분기상, 포화 또는 불포화 알킬기, 알콕시기 또는 알킬에스테르기, 할로겐 원자, 니트로기, 시아노기, 1급, 2급 또는 3급 아미노기, CF3기, 페닐기 및 치환된 페닐기로 이루어진 군으로부터 선택된 1가 기를 나타내고; R1과 R2, R3과 R4의 탄화수소쇄는 임의의 위치에서 서로 결합하여 이들 기에 의해 치환된 탄소원자와 함께 1개 이상의 3-, 4-, 5-, 6- 또는 7-원환 포화 또는 불포화 탄화수소 환상 구조를 형성하기 위한 2가 쇄를 형성해도 좋으며; 상기 환상 결합쇄는 임의의 위치에 카르보닐, 에테르, 에스테르, 아미드, 술피드, 술피닐, 술포닐 또는 이미노의 결합을 포함해도 좋고; X는 산소원자, 황원자 또는 질소원자를 나타내며; R5는 X가 질소원자일 때만 존재하여, 독립적으로 수소 또는 1∼10의 탄소원자를 갖는 직쇄상 또는 분기상, 포화 또는 불포화 알킬기를 나타낸다.)
- 제 16항에 있어서, 도전성 폴리머가 하기 일반식(3)으로 나타내어지는 반복단위를 포함하는 도전성 폴리머인 것을 특징으로 하는 콘덴서.(여기서, R6및 R7은 각각 독립적으로 수소원자, 1∼6의 탄소원자를 갖는 직쇄상 또는 분기상, 포화 또는 불포화 알킬기, 또는 상기 알킬기가 임의의 위치에서 서로 결합할 때, 2개의 산소원소를 함유하는 1개 이상의 5-, 6- 또는 7-원환 포화 탄화수소 환상 구조를 형성하기 위한 치환기이며, 상기 환상 구조는 치환되어도 좋은 비닐렌 결합을 갖는 구조, 및 치환되어도 좋은 페닐렌 구조가 열거된다.)
- 제 17항에 있어서, 도전성 폴리머가 폴리(3,4-에틸렌디옥시티오펜)에 도판트를 도핑시킴으로써 얻어진 도전성 폴리머인 것을 특징으로 하는 콘덴서.
- 제 11항에 있어서, 다른쪽 전극은 적어도 일부분이 층구조를 갖는 재료로 형성되는 것을 특징으로 하는 콘덴서.
- 제 11항에 있어서, 다른쪽 전극은 도판트로서, 유기 술포네이트 음이온을 함유하는 재료로 형성되는 것을 특징으로 하는 콘덴서.
- 제 11항 내지 제 20항 중 어느 한 항에 기재된 콘덴서를 사용하는 것을 특징으로 하는 전자 회로.
- 제 11항 내지 제 20항 중 어느 한 항에 기재된 콘덴서를 사용하는 것을 특징으로 하는 전자 기기.
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JPJP-P-2002-00125083 | 2002-04-26 | ||
JP2002125083A JP3624898B2 (ja) | 2002-04-26 | 2002-04-26 | ニオブ粉、それを用いた焼結体及びそれを用いたコンデンサ |
PCT/JP2003/005351 WO2003091466A1 (en) | 2002-04-26 | 2003-04-25 | Niobium powder, sintered body thereof and capacitor using the same |
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KR20040014660A true KR20040014660A (ko) | 2004-02-14 |
KR100580296B1 KR100580296B1 (ko) | 2006-05-16 |
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US (1) | US6855184B2 (ko) |
EP (1) | EP1501956B1 (ko) |
JP (1) | JP3624898B2 (ko) |
KR (1) | KR100580296B1 (ko) |
CN (2) | CN100368576C (ko) |
AT (1) | ATE319866T1 (ko) |
AU (1) | AU2003231526A1 (ko) |
BR (1) | BRPI0304557B8 (ko) |
DE (1) | DE60303922T2 (ko) |
TW (1) | TWI301121B (ko) |
WO (1) | WO2003091466A1 (ko) |
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US6540810B2 (en) * | 2000-04-21 | 2003-04-01 | Showa Denko Kabushiki Kaisha | Niobium powder for capacitor, sintered body using the powder and capacitor using the same |
US6652619B2 (en) * | 2000-08-10 | 2003-11-25 | Showa Denko K.K. | Niobium powder, sintered body thereof, and capacitor using the same |
JP2004143477A (ja) * | 2002-10-22 | 2004-05-20 | Cabot Supermetal Kk | ニオブ粉末およびその製造方法、並びにそれを用いた固体電解コンデンサ |
JP4689381B2 (ja) * | 2004-07-16 | 2011-05-25 | 昭和電工株式会社 | コンデンサ素子の製造方法 |
US7727273B2 (en) * | 2005-01-13 | 2010-06-01 | Boston Scientific Scimed, Inc. | Medical devices and methods of making the same |
JP2007131476A (ja) * | 2005-11-09 | 2007-05-31 | Tdk Corp | 誘電体磁器組成物、電子部品および積層セラミックコンデンサ |
US20080078268A1 (en) * | 2006-10-03 | 2008-04-03 | H.C. Starck Inc. | Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof |
CN100528418C (zh) * | 2008-01-11 | 2009-08-19 | 宁夏东方钽业股份有限公司 | 含氮均匀的阀金属粉末及其制造方法,阀金属坯块和阀金属烧结体以及电解电容器的阳极 |
WO2013179996A1 (ja) * | 2012-05-29 | 2013-12-05 | 昭和電工株式会社 | 固体電解コンデンサ素子の製造方法 |
US10329644B2 (en) | 2014-09-11 | 2019-06-25 | Ishihara Chemical Co., Ltd. | Ta—Nb alloy powder and anode element for solid electrolytic capacitor |
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JP3254163B2 (ja) * | 1997-02-28 | 2002-02-04 | 昭和電工株式会社 | コンデンサ |
WO2000067936A1 (en) * | 1998-05-06 | 2000-11-16 | H.C. Starck, Inc. | Metal powders produced by the reduction of the oxides with gaseous magnesium |
BR0108905A (pt) * | 2000-03-01 | 2003-03-18 | Cabot Corp | Metais nitrificados para válvula e processos para fabricação dos mesmos |
US6540810B2 (en) * | 2000-04-21 | 2003-04-01 | Showa Denko Kabushiki Kaisha | Niobium powder for capacitor, sintered body using the powder and capacitor using the same |
EP1340235B1 (en) * | 2000-11-30 | 2006-08-09 | Showa Denko K.K. | Powder for capacitor, sintered body thereof and capacitor using the sintered body |
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- 2003-04-25 CN CNB038006529A patent/CN100368576C/zh not_active Expired - Fee Related
- 2003-04-25 DE DE60303922T patent/DE60303922T2/de not_active Expired - Lifetime
- 2003-04-25 TW TW092109760A patent/TWI301121B/zh not_active IP Right Cessation
- 2003-04-25 CN CNA2005101092497A patent/CN1767103A/zh active Pending
- 2003-04-25 AU AU2003231526A patent/AU2003231526A1/en not_active Abandoned
- 2003-04-25 AT AT03725680T patent/ATE319866T1/de active
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Also Published As
Publication number | Publication date |
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CN1533444A (zh) | 2004-09-29 |
DE60303922T2 (de) | 2006-11-09 |
EP1501956A1 (en) | 2005-02-02 |
EP1501956A4 (en) | 2005-06-08 |
US6855184B2 (en) | 2005-02-15 |
KR100580296B1 (ko) | 2006-05-16 |
CN1767103A (zh) | 2006-05-03 |
BRPI0304557B8 (pt) | 2015-12-22 |
CN100368576C (zh) | 2008-02-13 |
TWI301121B (en) | 2008-09-21 |
JP3624898B2 (ja) | 2005-03-02 |
JP2003321724A (ja) | 2003-11-14 |
BR0304557B1 (pt) | 2014-03-04 |
ATE319866T1 (de) | 2006-03-15 |
WO2003091466A1 (en) | 2003-11-06 |
AU2003231526A1 (en) | 2003-11-10 |
TW200307645A (en) | 2003-12-16 |
BR0304557A (pt) | 2004-08-03 |
US20040182199A1 (en) | 2004-09-23 |
EP1501956B1 (en) | 2006-03-08 |
DE60303922D1 (de) | 2006-05-04 |
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