KR20040009625A - connection pin for cellular phone mike - Google Patents
connection pin for cellular phone mike Download PDFInfo
- Publication number
- KR20040009625A KR20040009625A KR1020020043631A KR20020043631A KR20040009625A KR 20040009625 A KR20040009625 A KR 20040009625A KR 1020020043631 A KR1020020043631 A KR 1020020043631A KR 20020043631 A KR20020043631 A KR 20020043631A KR 20040009625 A KR20040009625 A KR 20040009625A
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- Prior art keywords
- microphone
- spring
- mobile phone
- guide member
- hole
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/08—Mouthpieces; Microphones; Attachments therefor
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
- H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Telephone Set Structure (AREA)
Abstract
Description
본 발명은 휴대폰용 마이크 접속핀에 관한 것으로서, 보다 상세하게는 장기간 사용하더라도 휴대폰의 마이크와 회로기판의 접속 불량이 발생되지 않도록 된 휴대폰용 마이크 접속핀에 관한 것이다.The present invention relates to a microphone connecting pin for a mobile phone, and more particularly, to a microphone connecting pin for a mobile phone such that the connection failure of the microphone and the circuit board of the mobile phone does not occur even if used for a long time.
일반적으로, 휴대폰의 내부에는 마이크와 인쇄회로기판이 장착되고, 상기 마이크와 인쇄회로기판을 상호 접속하는 접속핀(통상, 포고핀이라 칭함)이 설치되어, 상기 휴대폰을 사용하는 사용자의 음성이 마이크에 의해 입력되어 인쇄회로기판을 통해 상대방의 휴대폰에 전달되도록 되어 있다. 상기 포고핀에 의해 마이크와 인쇄회로기판이 서로 접속된다. 여기에 사용되는 포고핀은, 도 1에 도시된 바와 같이, 마이크(5)를 감싸서 휴대폰(10)의 내부에 고정하는 홀더(14)에 결합되며 내부에는 공간부(23)가 형성되고 그 일단부에는 가이드공(24)이 형성된 가이드부재(20)와, 상기 가이드부재(20)의 내부에 슬라이드 가능하게 결합되어 가이드공(24)을 통하여 그 일측이 돌출된 접촉부재(30)와, 상기 접촉부재(30)를 탄성지지하도록 가이드부재(20)의 내부에 설치된 스프링(40)으로 구성된다.In general, a microphone and a printed circuit board are mounted inside the mobile phone, and connection pins (commonly referred to as pogo pins) interconnecting the microphone and the printed circuit board are installed, so that a voice of a user who uses the mobile phone is a microphone. It is input by and transmitted to the mobile phone of the other party through the printed circuit board. The pogo pin is connected to the microphone and the printed circuit board. As used herein, the pogo pin, as shown in FIG. 1, is coupled to a holder 14 that surrounds the microphone 5 and is fixed to the inside of the mobile phone 10, and a space 23 is formed therein, and one end thereof. A guide member 20 having a guide hole 24 formed therein is slidably coupled to the inside of the guide member 20, and a contact member 30 whose one side protrudes through the guide hole 24, and It is composed of a spring 40 installed inside the guide member 20 to elastically support the contact member 30.
이와 같이 구성된 상기 포고핀에 의하면, 상기 스프링(40)에 의해 탄지되는 접촉부재(30)는 가이드공(24)을 통해 가이드부재(20)의 일단부로 돌출되어 인쇄회로기판(7)에 가압 접촉되고, 상기 가이드부재(20)의 타단부는 상기 마이크(5)에 접촉됨으로써, 상기 휴대폰(10) 내부의 마이크(5)와 인쇄회로기판(7)이 상호 접속된다. 그런데, 상기 포고핀은 제작시의 가공 오차와 조립 오차 및 휴대폰(10)의 사용중에 작용하는 외력 등에 의해 상기 접촉부재(30)와 가이드부재(20)의 단부가 각각 인쇄회로기판(7)과 마이크(5)에 제대로 접촉되지 못하고 떨어지는 경우가 많기 때문에, 상기 휴대폰(10)의 사용중에 통화 성능이 저하되는 등의 문제점이 있다.According to the pogo pin configured as described above, the contact member 30 carried by the spring 40 is protruded to one end of the guide member 20 through the guide hole 24 to be in pressure contact with the printed circuit board 7. The other end of the guide member 20 contacts the microphone 5 so that the microphone 5 and the printed circuit board 7 inside the mobile phone 10 are connected to each other. By the way, the pogo pin is the end of the contact member 30 and the guide member 20 and the printed circuit board (7) due to the machining error and assembly error during manufacturing and the external force acting during use of the mobile phone 10, respectively. Since the microphone 5 is not properly contacted and often falls, there is a problem that the call performance is degraded while the mobile phone 10 is in use.
본 발명은 전술한 바와 같은 문제점에 착안하여 제안된 것으로서, 본 발명의 목적은 장기간 사용하더라도 휴대폰 내부의 마이크와 회로기판의 접속 불량이 발생되지 않으므로, 통화 감도의 저하 등을 방지할 수 있도록 된 휴대폰용 마이크 접속핀을 제공하고자 하는 것이다.The present invention has been proposed in view of the above-mentioned problems, and an object of the present invention is that even if used for a long time, a poor connection between the microphone and the circuit board inside the mobile phone does not occur, thus preventing a decrease in call sensitivity. To provide a microphone connection pin for.
도 1은 종래 휴대폰용 마이크 접속핀의 단면도1 is a cross-sectional view of a conventional microphone connection pin for a mobile phone
도 2는 본 발명에 의한 휴대폰용 마이크 접속핀의 단면도2 is a cross-sectional view of the microphone connection pin for a mobile phone according to the present invention
도 3은 도 2의 접속핀이 마이크와 회로기판 사이에 설치된 상태의 단면도3 is a cross-sectional view of the connection pin of Figure 2 installed between the microphone and the circuit board
<도면의 주요부분에 대한 부호의 설명><Explanation of symbols for main parts of the drawings>
5. 마이크 7. 회로기판5. Microphone 7. Circuit Board
10. 휴대폰 20. 가이드부재10. Mobile phone 20. Guide member
24. 가이드공 30. 접촉부재24. Guide hole 30. Contact member
40. 스프링 46. 관통공40.Spring 46.Through Hole
50. 고정수단50. Fastening means
본 발명에 따르면, 휴대폰(10) 내부의 마이크(5)와 회로기판(7) 사이에 설치되며 내부에는 공간부(23)가 형성되고 일단부에는 가이드공(24)이 형성된 가이드부재(20)와, 상기 가이드부재(20)의 공간부(23)에 슬라이드 가능하게 삽입 결합되며 그 일측은 상기 가이드공(24)을 통해 가이드부재(20)의 외부로 돌출된 접촉부재(30)와, 상기 가이드부재(20)의 내부에 설치되어 접촉부재(30)를 탄성 지지하는 스프링(40)을 포함하는 휴대폰용 마이크 접속핀에 있어서, 상기 가이드부재(20)의 가이드공(24)과 대향되는 타단부에 형성된 관통공(46)과, 상기관통공(46)을 통해 스프링(40)의 일부가 노출되도록 스프링(40)을 가이드부재(20)의 내부에 고정하는 고정수단(50)을 포함하며, 상기 접촉부재(30)는 스프링(40)에 의해 가이드공(24)으로 돌출되도록 탄지되어 상기 회로기판(7)에 가압 접촉되고, 상기 관통공(46)을 통해 노출된 스프링(40)은 자체의 탄성력에 의해 상기 마이크(5)에 가압 접촉되도록 구성된 것을 특징으로 하는 휴대폰용 마이크 접속핀이 제공된다.According to the present invention, the guide member 20 is installed between the microphone 5 and the circuit board 7 inside the mobile phone 10 and has a space 23 formed therein and a guide hole 24 formed at one end thereof. And, the slidably inserted coupled to the space 23 of the guide member 20, one side thereof is a contact member 30 protruding to the outside of the guide member 20 through the guide hole 24, and A microphone connecting pin for a mobile phone, which is installed inside the guide member 20 and includes a spring 40 for elastically supporting the contact member 30, the other facing the guide hole 24 of the guide member 20. A through hole 46 formed at an end and a fixing means 50 for fixing the spring 40 to the inside of the guide member 20 so that a part of the spring 40 is exposed through the through hole 46; The contact member 30 is touched to protrude into the guide hole 24 by the spring 40 and is applied to the circuit board 7. Contact is, the through-hole 46, the spring 40 is exposed through is provided for by the elasticity of its own mobile phone, characterized in that is configured to be pressed in contact with the microphone 5, the microphone connecting pin.
본 발명의 다른 특징에 따르면, 상기 고정수단(50)은 스프링(40)의 둘레부에 반경 방향 외측으로 직경이 커지도록 형성된 걸림부(50)로 이루어진 것을 특징으로 하는 휴대폰용 마이크 접속핀이 제공된다.According to another feature of the invention, the fixing means 50 is provided with a microphone connection pin for a mobile phone, characterized in that consisting of the engaging portion 50 formed to increase in the radially outward diameter on the circumference of the spring (40) do.
이하, 본 발명의 바람직한 실시예를 첨부한 도면에 의거하여 설명하면 다음과 같다.Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.
도 2는 본 발명에 의한 휴대폰용 마이크 접속핀의 단면도를 도시한 것이고, 도 3은 도 2의 접속핀에 의해 휴대폰(15)의 마이크(10)와 인쇄회로기판(12)이 상호 접속된 상태의 단면도를 도시한 것이다. 이를 참조하면, 상기 휴대폰용 마이크 접속핀은 휴대폰(10)의 내부에 마이크(5)를 감싸는 장착하는 홀더(14)에 고정 설치되며 그 일단부에는 가이드공(24)이 형성된 가이드부재(20)와, 상기 가이드부재(20)의 공간부(23)에 슬라이드 가능하게 결합되어 그 일측이 가이드공(24)을 통해 가이드부재(20)의 외측으로 돌출된 접촉부재(30)와, 상기 가이드부재(20)의 내부에 설치되어 접촉부재(30)를 탄지하는 스프링(40)으로 구성된 것은 종래와 동일하다. 그리고, 상기 가이드부재(20)의 가이드공(24)과 대향되는 타단부에는 관통공(46)이 형성되고, 상기 관통공(46)을 통해 스프링(40)의 일단부가 가이드부재(20)의 타단부로 돌출되어 있고, 상기 스프링(40)은 그 둘레부의 고정수단(50)에 의해 가이드부재(20)의 내부에 고정되어 있다. 이때, 상기 고정수단(50)은 스프링(40)의 둘레부에 반경 방향 외측으로 직경이 커지도록 형성된 걸림부(50)로 이루어진다.2 is a cross-sectional view of a microphone connecting pin for a mobile phone according to the present invention, Figure 3 is a state in which the microphone 10 and the printed circuit board 12 of the mobile phone 15 is interconnected by the connecting pin of FIG. It is a cross-sectional view of the. Referring to this, the microphone connection pin for the mobile phone is fixedly installed in the holder 14 for mounting the microphone 5 inside the mobile phone 10 and the guide member 20 formed with a guide hole 24 at one end thereof. And, the contact member 30 is slidably coupled to the space 23 of the guide member 20 and one side thereof protrudes out of the guide member 20 through the guide hole 24, and the guide member Installed in the inside of the 20 is configured as a spring 40 for holding the contact member 30 is the same as in the prior art. In addition, a through hole 46 is formed at the other end of the guide member 20 opposite to the guide hole 24, and one end of the spring 40 is connected to the guide member 20 through the through hole 46. Protruding to the other end, the spring 40 is fixed to the inside of the guide member 20 by the fixing means 50 of the circumference. At this time, the fixing means 50 is composed of a locking portion 50 formed so as to increase the diameter in the radially outward portion on the circumference of the spring (40).
이러한 걸림부(50)는 상기 가이드부재(20)의 공간부(23)에서 관통공(46)의 둘레벽(46a)에 걸려지기 때문에, 상기 스프링(40)이 가이드부재(20)의 내부로부터 이탈되지 않음과 동시에 상기 접촉부재(30)가 스프링(40)에 의해 탄지되어서 접촉부재(30)의 일측이 가이드부재(20)의 일단부로 노출되어 있다. 또한, 상기 스프링(40)은 그 일단부가 상기 접촉부재(30)에 접촉되어 있고, 그 타단부는 가이드부재(20)의 타단부에 형성된 관통공(46)을 통하여 가이드부재(20)의 타단부로 노출되어 있다. 이에 따라, 상기 접촉부재(30)는 스프링(40)에 의해 가이드공(24)을 통해 가이드부재(20)의 일단부로 탄성 돌출되어 휴대폰(10) 내부의 인쇄회로기판(7)에 가압 접촉되고, 상기 관통공(46)을 통하여 가이드부재(20)의 타단부로 노출된 스프링(40)의 타단부는 자체의 탄성력에 의하여 마이크(5)에 가압 접촉된다.Since the engaging portion 50 is caught by the circumferential wall 46a of the through hole 46 in the space 23 of the guide member 20, the spring 40 is removed from the inside of the guide member 20. At the same time, the contact member 30 is touched by the spring 40 so that one side of the contact member 30 is exposed to one end of the guide member 20. In addition, one end of the spring 40 is in contact with the contact member 30, the other end of the guide member 20 through the through hole 46 formed on the other end of the guide member 20. Exposed to the end. Accordingly, the contact member 30 is elastically protruded through the guide hole 24 by the spring 40 to one end of the guide member 20 to be in pressure contact with the printed circuit board 7 inside the mobile phone 10. The other end of the spring 40 exposed to the other end of the guide member 20 through the through hole 46 is pressed into contact with the microphone 5 by its elastic force.
따라서, 상기 휴대폰용 마이크 접속핀에 의하면, 상기 가이드부재(20) 내부의 스프링(40)에 의해 접촉부재(30)의 단부가 인쇄회로기판(7)에 가압접촉됨과 동시에 상기 가이드부재(20)의 관통공(46)을 통하여 노출된 스프링(40)의 타단부는그 자체의 탄성력에 의해 마이크(5)에 가압접촉되기 때문에, 비록 제작시의 가공오차나 조립오차 또는 사용중의 외력 등의 요인이 작용하더라도, 상기 휴대폰(10) 사용중에 상기 마이크(5)와 인쇄회로기판(7) 사이의 접촉 불량이 발생되지 않게 된다. 또한, 이처럼 상기 마이크(5)와 인쇄회로기판(7)의 접촉 불량이 발생되지 않으므로, 휴대폰(10)을 장기간 사용하더라도 통화 음질이 저하되는 경우를 방지할 수 있다.Therefore, according to the microphone connecting pin for the mobile phone, the end of the contact member 30 is pressed against the printed circuit board 7 by the spring 40 in the guide member 20 and the guide member 20 at the same time. Since the other end of the spring 40 exposed through the through hole 46 of the spring 40 is pressurized in contact with the microphone 5 by its own elastic force, factors such as processing error during assembly, assembly error, or external force during use are used. Even if this works, a poor contact between the microphone 5 and the printed circuit board 7 is not generated while using the mobile phone 10. In addition, since the poor contact between the microphone 5 and the printed circuit board 7 does not occur as described above, even when the mobile phone 10 is used for a long time, the call sound quality may be prevented from deteriorating.
이상에서와 같이 본 발명에 의하면, 제작시의 가공오차나 조립오차 또는 사용중의 외력 등이 작용하더라도 마이크와 인쇄회로기판 사이의 접촉 불량이 발생되는 경우를 방지할 수 있으므로, 휴대폰의 사용중에 통화 음질이 저하되는 것을 방지할 수 있도록 된 새로운 구성의 휴대폰용 마이크 접속핀이 제공된다.As described above, according to the present invention, it is possible to prevent the occurrence of poor contact between the microphone and the printed circuit board even if the processing error, assembly error or external force during use is applied, so that the sound quality of the call during use of the mobile phone The microphone connection pin of the mobile phone is provided with a new configuration which can prevent this deterioration.
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KR10-2002-0043631A KR100470694B1 (en) | 2002-07-24 | 2002-07-24 | connection pin for cellular phone mike |
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KR10-2002-0043631A KR100470694B1 (en) | 2002-07-24 | 2002-07-24 | connection pin for cellular phone mike |
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KR100470694B1 KR100470694B1 (en) | 2005-03-10 |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2323017A3 (en) * | 2005-03-23 | 2011-07-13 | Epos Development Ltd. | Method and system for digital pen assembly |
US8861312B2 (en) | 2007-03-14 | 2014-10-14 | Qualcomm Incorporated | MEMS microphone |
US9195325B2 (en) | 2002-04-15 | 2015-11-24 | Qualcomm Incorporated | Method and system for obtaining positioning data |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP4440143A1 (en) * | 2023-03-31 | 2024-10-02 | GN Hearing A/S | A hearing device |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6128385A (en) * | 1997-09-30 | 2000-10-03 | Lucent Technologies, Inc. | Impact-tolerant mounting of acoustic components |
KR100341564B1 (en) * | 1999-12-13 | 2002-06-22 | 김낙현 | Condenser microphone |
KR200189069Y1 (en) * | 2000-01-28 | 2000-07-15 | 명태성 | A micro-connector |
KR100376594B1 (en) * | 2002-05-15 | 2003-03-15 | 이남균 | Pin type Connecter of microphone |
KR20040009626A (en) * | 2002-07-24 | 2004-01-31 | (주)제이엠씨 | connection pin for cellular phone mike |
-
2002
- 2002-07-24 KR KR10-2002-0043631A patent/KR100470694B1/en not_active IP Right Cessation
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9195325B2 (en) | 2002-04-15 | 2015-11-24 | Qualcomm Incorporated | Method and system for obtaining positioning data |
US9446520B2 (en) | 2002-04-15 | 2016-09-20 | Qualcomm Incorporated | Method and system for robotic positioning |
EP2323017A3 (en) * | 2005-03-23 | 2011-07-13 | Epos Development Ltd. | Method and system for digital pen assembly |
EP1861771B1 (en) * | 2005-03-23 | 2012-01-04 | Epos Development Ltd. | Method and system for digital pen assembly |
US8963890B2 (en) | 2005-03-23 | 2015-02-24 | Qualcomm Incorporated | Method and system for digital pen assembly |
US9632627B2 (en) | 2005-03-23 | 2017-04-25 | Qualcomm Incorporated | Method and system for digital pen assembly |
US8861312B2 (en) | 2007-03-14 | 2014-10-14 | Qualcomm Incorporated | MEMS microphone |
Also Published As
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