KR200364071Y1 - Water-cooled type computer cooling system - Google Patents

Abstract

The present invention relates to a water-cooled cooling device for a computer having a heating element including a central processing unit, the cooling device comprising: a pump for circulating a refrigerant for cooling the heating element through a circulation pipe; A main heat exchanger unit for circulating a heating element inside the computer to cool the refrigerant having a raised temperature; A thermoelectric element as a cooling source attached to the main heat exchanger unit; Provided is a water-cooled cooling device for a computer that is disposed adjacent to the thermoelectric element and includes a heat dissipation unit for dissipating heat generated from the thermoelectric element. In addition, the water-cooled cooling apparatus of the present invention is provided with a temperature sensing unit for measuring at least the temperature of the heating element, by setting the appropriate operating temperature of the heating element to apply power only when the temperature value measured from the temperature sensing unit is above the set temperature to the thermoelectric And a control unit for controlling the cooling action of the device. The heat dissipation unit is a heat dissipation plate forming a computer body casing, or a cooling cooler unit disposed at the cooling side portion of the thermoelectric element with the main heat exchanger unit interposed therebetween, and a heating cooler disposed at the heat generating side portion of the thermoelectric element. In a state in which the unit is configured, the radiator having a cooling fan for dissipating the high temperature refrigerant circulated through the heating cooler unit, characterized in that.

Description

Water-cooled chillers for computers {WATER-COOLED TYPE COMPUTER COOLING SYSTEM}

The present invention relates to a computer cooling device of the present invention, and more particularly, to adopt a water-cooled circulating cooling method and to reduce the temperature of a refrigerant by using a thermoelectric element. In addition, the present invention relates to a water-cooled cooling device for a computer which suppresses a rise in temperature of a heating element such as a hard disk drive to maximize the operating efficiency of the computer.

In recent years, with the rapid development of computer hardware technology, a computer including a personal computer has achieved ultra-high speed of its central processing unit (CPU), and continuous technical progress is foreseen.

However, the central processing unit having such an ultra-high processing capacity increases heat generation as its operating speed increases, so that if proper cooling is not achieved, the processing speed is decreased by raising the temperature of the central processing unit, and the processing result. The likelihood of errors increases, and in severe cases it can lead to a computer malfunction and result in loss of working data.

Conventionally, an air-cooled cooling device including a cooling fan and a heat sink is mainly used as a cooling device to prevent this. However, since the air-cooled cooling device mainly circulates air in the computer body to cool the heat generating element, Cooling efficiency is lowered by cooling the air already heated by the heat generated from the processing unit and peripherals, especially in the case of central processing units with a processing speed of 2GHz or higher, which requires cooling performance beyond the performance limit of air-cooled cooling units. And, there are various disadvantages, such as the problem of noise generated by the rotation of the cooling fan.

The object of the present invention is to solve the above-mentioned problems of the prior art, by adopting a water-cooled cooling device, by using a thermoelectric element to properly cool the temperature of the heating element of the computer, there is no problem of noise generation due to cooling, it is advantageous for miniaturization In addition, to provide a computer water-cooled cooling device using a thermoelectric element excellent in cooling efficiency.

Figure 1a is a schematic configuration diagram of a cooling device for radiating heat generated by the thermoelectric element in a water-cooled cooling device for a computer according to an embodiment of the present invention.

1B is a schematic configuration diagram of a cooling device cooled by a thermoelectric element in a water-cooled cooling device for a computer according to an embodiment of the present invention.

1C is a schematic diagram illustrating a structure in which a cooling device for cooling heat generated in a thermoelectric element and a cooling device cooled by a thermoelectric element are combined in a water-cooled cooling device for a computer according to an embodiment of the present invention.

FIG. 2 is a layout view of the water-cooled cooling device for a computer according to the configuration of FIG. 1C.

FIG. 3 is a layout view of a water-cooled cooling device for a computer of a combination of the configuration diagrams of FIGS. 1A and 1B.

4 is a schematic exploded view of the main heat exchange unit of the water-cooled cooling device for a computer according to the present invention.

5 is an exploded perspective view of a heat exchange unit for a CPU of a water-cooled cooling device for a computer according to the present invention.

6a and 6b is a view showing a jacket structure of the main heat exchange unit of the water-cooled cooling device for a computer according to the present invention.

7A and 7B are views illustrating a jacket structure of a heat exchange unit for a CPU of a water-cooled cooling device for a computer according to the present invention.

8a and 8b is a view showing a jacket structure of the heat exchange unit for the main board of the water-cooled cooling device for a computer according to the present invention.

9A and 9B are views illustrating a jacket structure of a heat exchange unit for a VGA graphic cart of a water-cooled cooling device for a computer according to the present invention.

FIG. 10 is a view similar to the main heat exchange unit shown in FIG. 6, including a heat exchange panel.

FIG. 11 is a view similar to the CPU heat exchange unit shown in FIG. 7, including the heat exchange panel.

FIG. 12 is a view similar to the heat exchange unit for the main board shown in FIG. 8, including the heat exchange panel.

FIG. 13 is a view similar to the heat exchange unit for the VGA graphic card shown in FIG. 9, including the heat exchange panel.

<Explanation of symbols for the main parts of the drawings>

10: heat exchanger panel

11: heat dissipation plate

13: heat sink fin

14: home

20: heat exchange unit for central processing unit

20 A: Cover jacket of heat exchange unit for central processing unit

20B: Base jacket of heat exchange unit for central processing unit

23,33,43; septum

30: heat exchange unit for main board

30 A: Cover jacket of heat exchange unit for main board

30B: Base jacket of heat exchange unit for main board

30 ': heat exchange unit for graphics card

30A ': Cover jacket of heat exchange unit for graphic card

30B ': Base jacket of heat exchange unit for graphic card

40: main heat exchange unit

40A: Cover jacket of main heat exchanger unit

40B: Base jacket of main heat exchange unit

44: thermoelectric element

50,50 ': heat dissipation unit

In order to achieve the above object, the present invention is a water-cooled cooling device of a computer having a heating element comprising a central processing unit, comprising: a pump for circulating a refrigerant for cooling the heating element through a circulation pipe; A main heat exchanger unit for circulating a heating element inside the computer to cool the refrigerant having a raised temperature; A thermoelectric element as a cooling source attached to the main heat exchanger unit; Provided is a water-cooled cooling device for a computer that is disposed adjacent to the thermoelectric element and includes a heat dissipation unit for dissipating heat generated from the thermoelectric element.

According to an embodiment of the present invention, at least the temperature sensing unit for measuring the temperature of the heating element is provided, and by setting the appropriate operating temperature of the heating element to apply power only when the temperature value measured from the temperature sensing unit is higher than the set temperature; And a control unit for controlling the cooling action of the thermoelectric element.

According to an embodiment of the present invention, the heating element including the central processing unit further includes a main board, a graphics card, a hard disk drive, a power supply, at least the central processing unit of these heating elements, the auxiliary heat exchanger through which the refrigerant flows Characterized in that the unit is installed.

According to an embodiment of the present invention, the heat dissipation unit is characterized in that the heat sink to form a computer body casing.

According to an embodiment of the present invention, the main heat exchanger unit is composed of a cooling cooler unit disposed on the cooling side portion of the thermoelectric element with a thermoelectric element therebetween and a heating cooler unit disposed on the heat generating side portion of the thermoelectric element, The heat dissipation unit is composed of a radiator having a cooling fan for dissipating the high temperature refrigerant circulated through the heating cooler unit, the pump is a first pump for circulating the refrigerant from the heating cooler unit through the radiator to the heating cooler unit; And a second pump circulating the refrigerant from the cooling cooler unit to the cooling cooler unit through the inside of the computer.

According to an embodiment of the present invention, the refrigerant passing through the radiator is characterized in that is circulated to the heating cooler unit via the power supply and the radiator.

According to an embodiment of the present invention, the heat exchanger unit has a cover jacket having a refrigerant inlet and an outlet, a base jacket correspondingly coupled to the cover jacket and a cover / base jacket, and having a plurality of heat dissipation fins. And a conductive heat exchange panel.

According to an embodiment of the present invention, the cover / base jacket and the heat exchange panel are characterized in that the packing by silicone bonding.

According to an embodiment of the present invention, the conductive heat exchange panel is characterized in that the aluminum-based material.

According to one embodiment of the present invention, the cover jacket is formed with one or more straight or bent partitions to control the flow rate of the inflow refrigerant and evenly distribute the refrigerant, the plurality of heat sink fins to correspond to the arrangement of the partition Characterized in that arranged.

According to one embodiment of the present invention, the plurality of heat dissipation fins are characterized in that they are staggered with each other to face the incoming refrigerant.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The cooling device for a computer of the present invention has a great feature that it adopts a water cooling method using a refrigerant and a refrigerant cooling method using a thermoelectric element of the refrigerant, and a central processing unit, a main board, a graphics card, and a hard element which are the main heating elements inside the computer. Among the disk drives and / or power supplies, an auxiliary heat exchange unit directly applied to the central processing unit and a structure of the main heat exchange unit itself for cooling the high temperature refrigerant passing through the auxiliary heat exchange unit by using the thermoelectric element and these auxiliary heat exchange units. It is also characterized by the configuration of the cooling device itself for cooling the temperature inside the computer, including the interconnect structure between the main and the heat exchange unit.

The cooling device for a computer of the present invention is a cooling method for cooling heat generated from a thermoelectric element in a cooling method of a main heat exchange unit using a thermoelectric element on which one surface is cooled and the other surface generates heat when a predetermined power is applied (see FIG. 1A). And a cooling method (see Fig. 1B) for cooling the refrigerant by the thermoelectric element, and a cooling method (see Fig. 1C) in which these cooling methods are combined with each other.

These cooling schemes are shown in FIGS. 1A, 1B and 1C.

First, in the cooling method of cooling the heat generated from the thermoelectric element, as shown in FIG. 1A, heat generated in the thermoelectric element is transferred to the refrigerant circulating through the heating cooler unit of the main heat exchange unit by a pump, The refrigerant of the heat dissipation in the radiator is first, and after passing through the power supply, the second heat dissipation in the radiator is circulated back to the heating cooler unit of the main heat exchange unit. In this case, the heating cooler unit is a heat exchange unit that absorbs the heat generated by the thermoelectric element in the main heat exchanger unit as a refrigerant.

Second, the method of cooling the refrigerant by the thermoelectric element is, as shown in Figure 1b, the heat exchange unit for the central processing unit inside the computer by the pump, the heat exchange unit for the main board, the heat exchange unit for the graphics card, for the hard disk drive The high temperature refrigerant circulated through the heat exchange unit or the like is cooled by the thermoelectric element in the cooling cooler unit of the main heat exchange unit. At this time, the cooling cooler unit is a heat exchange unit for cooling the refrigerant by the cooling function of the thermoelectric element in the main heat exchanger unit.

Third, the cooling method of the combination of these two cooling methods, as shown in Figure 1c, the high-temperature refrigerant circulating inside the computer is cooled by the thermoelectric element through the cooling cooler of the main heat exchange unit, the thermoelectric element The heat generated from the heat dissipation unit through a heat dissipation unit such as a heating plate.

In this case, the heat dissipation unit such as the heating plate may take a cooling method using the radiator shown in FIG. 1A, and various other combination methods may be introduced.

Embodiments combining these cooling schemes are shown by way of example in FIGS. 2 and 3.

FIG. 2 is a layout view of the water-cooled cooling device for a computer according to the configuration of FIG. 1C.

FIG. 3 is a layout view of a water-cooled cooling device for a computer of a combination of the configuration diagrams of FIGS. 1A and 1B.

2, the water-cooled cooling device for a computer of the present invention is a pump (P) for circulating a refrigerant through a circulation pipe, and a heating element such as a central processing unit, a main board, a graphics card, a hard disk drive, and a power supply in the computer. The thermoelectric element 44 which cools the high temperature refrigerant which circulates the heat generating element inside a computer, which is attached to the main heat exchange unit as a cooling source, and which cools the high temperature refrigerant | coolant which circulated, and this thermoelectric element 44 And a heat sink 50 disposed adjacently to dissipate heat generated from the thermoelectric element.

The main heat exchange unit is composed of a cooling cooler unit (CC) cooling the refrigerant by the thermoelectric element 44, the refrigerant cooled by the cooling cooler unit (CC) is at least the center of the various heat sources inside the computer Including a processing unit, a main board, a graphics card, a hard disk drive (HDD), etc., are circulated, and each heat source thereof includes a heat exchange unit 20 for a central processing unit, a heat exchange unit 30 for a main board, and a graphics card. An auxiliary heat exchange unit including a heat exchange unit 30 'and a heat exchange unit for a hard disk drive is arranged.

Accordingly, the high temperature refrigerant circulated in the auxiliary heat exchange unit inside the computer is cooled by the thermoelectric element 44 in the cooling cooler unit CC of the main heat exchange unit, and the heat generated in the thermoelectric element is disposed adjacent to the heat sink. Heat dissipation to the outside through 50).

On the other hand, in the cooling apparatus of the above embodiment, a cooling apparatus of another embodiment in which the main heat exchange unit has a double structure and the heat dissipation unit of the heat sink is replaced with a radiator including a cooling fan is shown in FIG. 3.

According to this embodiment, the main heat exchange unit includes a cooling cooler unit (CC) cooled by the thermoelectric element with two thermoelectric elements 44 interposed therebetween, and a heating cooler unit (HC) that absorbs heat from the thermoelectric element. The refrigerant cooled by the cooling cooler unit (CC) is a heat exchange unit 20 for a central processing unit, a heat exchange unit 30 for a main board, a heat exchange unit 30 'for a graphics card, and a hard disk inside a computer. The heat that is cooled in the cooling cooler unit CC through a heat exchange unit for a disk drive HD, and the like, is absorbed by the refrigerant in the heating cooler unit HC from the thermoelectric element 44 instead of the heat sink 50 of the embodiment of FIG. 2. A cooling system that radiates heat from the radiator 50 'having a cooling fan (not shown) is adopted.

At this time, the heat exchange unit for the power supply PS is connected to the radiator 50 ', and the refrigerant cooled in the radiator 50' further cools the power supply PS, and then passes through the radiator to the heating cooler unit HC. Cycles to).

Thus, there is a first circulation of a refrigerant for cooling the heat of the heating cooler unit and the power supply and a second circulation for cooling the heat of the main heat exchange unit and the auxiliary heat exchange unit, and these two types of circulation are the first and the first circulation. It is executed by two pumps P1 and P2, respectively.

In the computer water-cooled cooling device of the present invention, the cooling action using the thermoelectric element is performed in the main heat exchange unit, and the cooling is performed while the refrigerant cooled in the main heat exchange unit passes through the auxiliary heat exchange unit disposed in the main heat generating source inside the computer. .

A schematic configuration of such a main heat exchange unit and an auxiliary heat exchange unit is shown in FIGS. 4 and 5.

4 is a schematic exploded view of the main heat exchange unit of the water-cooled cooling device for a computer according to the present invention, Figure 5 is an exploded perspective view of the heat exchange unit for the central processing unit of a water-cooled cooling device for a computer according to the present invention.

The main heat exchange unit 40 includes a cover jacket 40A having a refrigerant inlet and an outlet (not shown), a base jacket 40B hermetically coupled to the cover jacket, and a heat exchange panel disposed between the cover / base jacket. (10). The base jacket 40B is formed with an opening 44a of a corresponding shape for mounting the quadrangular planar thermoelectric element 44, and the heat exchange panel 10 is attached to the base jacket via a silicon layer. The cover / base jacket is preferably made of ABS plastic material.

An auxiliary heat exchange unit disposed inside the computer, for example, the heat exchange unit 20 for the central processing unit, has a cover jacket 20A having a refrigerant inlet 25a and an outlet 25b and a base that is hermetically coupled to the cover jacket. And a heat exchange panel 10 disposed between the jacket 20B and the cover / base jacket. The heat exchange panel 10 has a structure in which a plurality of heat dissipation fins 13 protrude from the top of the heat dissipation plate 11, and a groove 14 is formed around the heat dissipation plate so that the silicon layer 4 is attached to the heat dissipation plate 11. Form a packing structure. A silicon layer (not shown) is also attached between the heat exchange panel 10 and the base jacket 20B to realize a packing structure.

The main heat exchange unit 40 and the auxiliary heat exchange unit are shown in detail in FIGS. 6 to 9.

The main heat exchange unit 40 shown in FIG. 6 includes a cover jacket 40A having refrigerant inlets 45a and outlets 45b extending in both sides, a base jacket 40B corresponding thereto, and these covers. It consists of a heat exchange panel 10 arranged between the / base jacket.

The cover jacket 20A is provided with a partition wall 43 for controlling the speed of the inflow refrigerant and evenly dispersing the refrigerant, and the edges of the cover jacket are provided with the first grooves 41a and the second for coupling with the base jacket. The groove 42a is formed.

The base jacket 20B has an opening 44a for mounting the thermoelectric element 44 to which the electrical cables 44in and 44out are connected, and the edges of the base jacket are formed in the first and second grooves of the cover jacket ( First and second protrusions 41b and 42b are respectively fixed to 41a and 42a.

The coupling method of the cover / base jacket using the groove and the protrusion is not limited thereto, and a coupling structure of various methods such as adhesion, fusion, and clamp may be adopted.

FIG. 7 is a view exemplarily illustrating a heat exchange unit 20 for a central processing unit among auxiliary heat exchange units.

The heat exchange unit for the central processing unit is disposed between the cover jacket 20A having the refrigerant inlet 25a and the outlet 25b extending in the vertical direction, the base jacket 20B corresponding thereto, and the cover / base jacket. Consisting of a heat exchange panel 10.

The cover jacket 20A is provided with a partition wall 23 for controlling the speed of the inflow refrigerant and evenly dispersing the refrigerant.

The coupling structure of the grooves 21a; 22a and the protrusions 21b; 22b for mutually coupling the cover / base jacket is applied in the same manner as that of the main heat exchange unit described above.

8 exemplarily illustrates a heat exchange unit 30 for a main board of the auxiliary heat exchange unit.

The heat exchange unit for the main board is disposed between the cover jacket 30A having the refrigerant inlet 35a and outlet 35b extending in the vertical direction, the base jacket 30B corresponding thereto, and the cover / base jacket. It consists of a heat exchange panel 10.

The cover jacket 30A is provided with a bent partition 33 for controlling the speed of the inflow refrigerant and for evenly dispersing the refrigerant.

The coupling structure of the grooves 31a; 32a and the projections 31b; 32b for mutually engaging the cover / base jacket is applied in the same manner as that of the main heat exchange unit described above.

9 is a diagram exemplarily showing a heat exchange unit 30 'for the graphics card of the auxiliary heat exchange unit.

The heat exchange unit for the graphics card includes a cover jacket 30A 'having a refrigerant inlet 35a' and a outlet 35b 'extending in one side, a base jacket 30B' corresponding thereto, and a cover / base thereof. It consists of a heat exchange panel 10 disposed between the jackets.

The cover jacket 30A 'is provided with a bent partition 33 for controlling the speed of the inflow refrigerant and for evenly dispersing the refrigerant.

A part of the side wall of the base jacket 30B 'is formed with a supporting wall 37 having recesses 37a for supporting and supporting the refrigerant inlets and outlets 35a' and 35b 'extending side by side in the one direction. . This support wall 37 is applicable to any cover jacket as long as the cover jacket has a lateral inlet or outlet.

The coupling structure of the groove and the projection for mutually joining the cover / base jacket is applied in the same manner as that of the heat exchange unit for the main board described above.

A heat exchange panel 10 is disposed between the main heat exchange unit and the cover / base jacket of the auxiliary heat exchange unit, and mediates heat exchange between the refrigerant and the heat generating source inside the computer. The structure of the heat exchange unit including the heat exchange panel is illustrated in FIGS. 13 is shown.

10 shows a main heat exchange unit, FIG. 11 shows a heat exchange unit for a central processing unit, FIG. 12 shows a heat exchange unit for a main board, and FIG. 13 shows an exchange unit for a graphics card. The overall configuration of the above has already been described with reference to FIGS. 6 to 9.

The heat exchange panel included in these heat exchange units has a structure in which a plurality of heat dissipation fins 13 protrude from the heat dissipation plate 11, and is made of aluminum-based material to facilitate heat exchange.

The plurality of heat dissipation fins are arranged to be partitioned by partition walls formed in the cover jacket of the heat exchange unit, and are arranged in a staggered manner with respect to the refrigerant traveling direction, thereby maximizing a heat exchange efficiency by maximizing a contact area with the refrigerant.

The configuration of the water-cooled cooling device for a computer of the present invention has been described above, but the description and illustrated configuration are not limited thereto, and various modifications are possible.

For example, the refrigerant inlet and outlet of the cover jacket of the heat exchange unit may be disposed in the vertical direction or the horizontal direction, and the inlet and the outlet may be simultaneously installed on one side or may be installed in both directions.

In addition, the number and arrangement of the heat radiation fins of the heat exchange panel are also not limited to the arrangements applied to the above-described specific heat generating position, but may be changed and applied to each other.

On the other hand, as described above, the water-cooled cooling device for a computer of the present invention may further include a control unit (not shown) having a temperature sensing unit for measuring at least the temperature of the heating element in order to properly control the temperature of the heating element inside the computer. Can be.

Such a control unit sets a predetermined temperature of a heating element known to those skilled in the art, in particular, a proper operating temperature range of the central processing unit, and applies power only when the measured temperature of the temperature sensing unit of the heating element is equal to or higher than the set temperature. To control the cooling action. When the control unit employs a radiator structure having a cooling fan that employs a heat radiating unit that cools heat generated from the thermoelectric element, the same control method may be applied to the cooling fan.

However, even in the absence of a control operation by such a control unit, the temperature inside the computer is selected by selecting a thermoelectric element having a suitable cooling performance in consideration of the normal operating temperature range of the heating element such as a central processing unit which is commonly known to those skilled in the art. It can be maintained to a certain degree.

According to the above-described configuration, the present invention employs a water-cooled cooling device and uses a thermoelectric element to adequately control the temperature of the heating element of the computer so as to solve the disadvantages of the prior art computer cooling device that has had problems of noise generation and cooling efficiency limitation. By cooling, it is possible to provide a water-cooled cooling device for a computer using a thermoelectric element, which has no problem of noise generation due to cooling, which is advantageous in miniaturization and excellent in cooling efficiency.

Claims (16)

A water-cooled cooling apparatus for a computer having a heating element including a central processing unit, comprising: a pump for circulating a refrigerant for cooling the heating element through a circulation pipe; A main heat exchanger unit for circulating a heating element inside the computer to cool the refrigerant having a raised temperature; A thermoelectric element as a cooling source attached to the main heat exchanger unit; And a heat dissipation unit disposed adjacent to the thermoelectric element and dissipating heat generated from the thermoelectric element. The heating element of claim 1, wherein the heating element including the central processing unit further includes a main board, a graphics card, a hard disk drive, and a power supply, and at least one of the heating elements is provided with an auxiliary heat exchange unit through which the refrigerant flows. Water-cooled cooling device for a computer, characterized in that. The water-cooled cooling apparatus for a computer according to claim 1 or 2, wherein the heat dissipation unit is a heat dissipation plate forming a computer body casing. The heat exchanger unit of claim 1, wherein the main heat exchanger unit includes a cooling cooler unit disposed at a cooling side portion of the thermoelectric element with a thermoelectric element interposed therebetween, and a heating cooler unit disposed at a heat generating side portion of the thermoelectric element. The heat dissipation unit may include a radiator having a cooling fan for dissipating high temperature refrigerant circulated through a heating cooler unit, and the pump may include a first pump circulating refrigerant from the heating cooler unit to a heating cooler unit through a radiator. And a second pump configured to circulate the refrigerant from the cooling cooler unit to the cooling cooler unit through the inside of the computer. 5. The water-cooled cooling apparatus for a computer according to claim 4, wherein the refrigerant passing through the radiator is circulated to the heating cooler unit through the power supply and the radiator. The heat exchanger unit of claim 1, wherein the heat exchanger unit is disposed between a cover jacket having a refrigerant inlet port and an outlet port, a base jacket that is hermetically coupled to the cover jacket, and a cover / base jacket. Water-cooled cooling device for a computer comprising a conductive heat exchange panel having a. 7. The water-cooled cooling apparatus for a computer as claimed in claim 6, wherein the cover / base jacket and the heat exchange panel are packed by silicone bonding. 8. The computer-cooled water cooling device according to claim 7, wherein the conductive heat exchange panel is made of aluminum-based material. The computer according to claim 6, wherein the cover jacket has at least one partition wall for controlling the flow rate of the inflow refrigerant and evenly disperses the coolant, and the plurality of heat dissipation fins are arranged to correspond to the layout of the partition wall. Water Cooled Chiller 10. The computer-cooled water cooling device of claim 9, wherein the partition wall is bent. 10. The water-cooled cooling apparatus for a computer as claimed in claim 9, wherein the plurality of heat dissipation fins are staggered from each other to face the inflow refrigerant. According to claim 1 or claim 2, At least a temperature sensing unit for measuring the temperature of the heating element is provided, by setting the proper operating temperature of the heating element and applying power only when the temperature value measured from the temperature sensing unit is above the set temperature And a control unit for controlling the cooling action of the thermoelectric element. The thermoelectric device of claim 3, further comprising: a temperature sensing unit measuring at least a temperature of the heating element, and setting a proper operating temperature of the heating element to apply power only when the temperature value measured from the temperature sensing unit is equal to or higher than a set temperature. A water-cooled cooling device for a computer, further comprising a control unit for controlling the cooling action. The thermoelectric device of claim 4, further comprising: a temperature sensing unit measuring at least a temperature of the heating element, and setting an appropriate operating temperature of the heating element to apply power only when the temperature value measured from the temperature sensing unit is equal to or greater than a set temperature. A water-cooled cooling device for a computer, further comprising a control unit for controlling the cooling action. The thermoelectric device of claim 6, further comprising: a temperature sensing unit measuring at least a temperature of the heating element, and setting an appropriate operating temperature of the heating element to apply power only when the temperature value measured from the temperature sensing unit is equal to or greater than a set temperature. A water-cooled cooling device for a computer, further comprising a control unit for controlling the cooling action. The thermoelectric device of claim 9, further comprising: a temperature sensing unit measuring at least a temperature of the heating element, and setting a proper operating temperature of the heating element to apply power only when the temperature value measured from the temperature sensing unit is equal to or greater than a set temperature. A water-cooled cooling device for a computer, further comprising a control unit for controlling the cooling action.