KR200359949Y1 - Camera chip package - Google Patents

Abstract

The present invention relates to a camera chip package, and more particularly, an image sensor for detecting an image is mounted on a cover part instead of a substrate part to simplify a providing process, reduce the width of a circuit pattern, and perform a fine pitch to reduce a package size. A camera chip package can be reduced. The camera chip package includes an image sensor including an image chip for converting an optical signal into an electrical signal; A cover portion coupled to the image sensor in a flip chip manner using a circuit pattern formed at a lower portion thereof, to transfer an electrical signal of the image sensor to a substrate portion electrically connected to the circuit pattern, and to isolate the image chip from the outside; And a substrate unit configured to output an electrical signal output from the circuit pattern formed on the cover unit to the outside.

Description

Camera chip package

The present invention relates to a camera chip package, and more particularly, an image sensor for detecting an image is mounted on a cover part instead of a substrate part to simplify a providing process, reduce the width of a circuit pattern, and perform a fine pitch to reduce a package size. A camera chip package can be reduced.

With the popularization of camera phones, the demand for camera chips for acquiring images is increasing. Referring to FIG. 1, a configuration of a camera chip package according to the prior art is illustrated.

The camera chip package according to the related art is configured to acquire an optical signal incident through the lens unit 120 fixed to the housing 110 by an image chip 150 mounted therein and convert the optical signal into an electrical signal. Here, the image chip 150 may be mounted on the substrate 160 in a bonding manner, and the substrate 160 may be connected to an external circuit through the socket 170.

Here, the cover part 130 is provided between the lens part 120 and the image chip 150, and the optical signal incident through the lens part 120 is formed by the cover part 130 and the substrate part 160. It is incident on the image chip 150 through the opening. The cover 130 may basically protect the surface of the image chip from dust and prevent scratches or damage.

In general, when the image chip 150 is mounted on the substrate 160, an anisotropic conductive film (ACF) 140 is used. The camera chip package according to this method has the following problems.

First, a circuit for connecting to an image chip is formed in the substrate portion 160, and a flexible circuit board is mainly used as the substrate portion. In the case of using such a flexible circuit board, since the circuit pitch is generally 60 μm or more, the circuit line width is wide, thereby limiting the size reduction of the entire camera module, and the use of expensive female circuit boards increases, resulting in high cost. .

Second, due to the use of the anisotropic conductive film, the process and material costs are added, due to the complexity and difficulty of the process, the defect ratio is high, there is a problem that expensive equipment must be provided.

Third, and when the separation distance between the pixel and the bond pad of the image chip is narrow due to the use of the flexible circuit board, there are many problems in mounting. Therefore, the basic separation distance between the bond pad of the chip and the pixel of the chip must be maintained, which causes a problem that the size of the camera device increases.

Therefore, the present invention has been devised to solve the above problems, and the image sensor for sensing an image is mounted on a cover part instead of a substrate part to simplify the providing process, reduce the width of a circuit pattern, and perform a fine pitch package. A camera chip package can be reduced in size.

In addition, another object of the present invention is to provide a camera chip package device that can reduce the size by reducing the separation distance between the pixel and the chip bond pad. In addition, the present invention is to provide a camera chip package device that can remove the complexity and difficulty of the process, and reduce the defective rate through a process method capable of removing the anisotropic conductive film.

In addition, another object of the present invention is to provide a camera chip package device that can be formed in a circuit pattern of the glass material by configuring to mount the image chip on a filter or glass formed of a glass material.

In addition, another object of the present invention is to remove the additional labor due to the suppression of the generation of particles, to provide a camera chip package manufactured through an efficient manufacturing process with an increased average yield.

In addition, another object of the present invention is to provide a thin semiconductor package with improved electrical characteristics by mounting the image sensor through a flip chip method.

1 is a view showing the configuration of a camera chip package according to an embodiment of the prior art.

Figure 2a is a view showing the operating principle of the camera chip package according to an embodiment of the present invention.

Figure 2b is a view showing the configuration of a camera chip package according to an embodiment of the present invention.

3A is a view showing the configuration of an image chip according to a preferred embodiment of the present invention.

Figure 3b is a view showing the configuration of the cover unit according to a preferred embodiment of the present invention.

4A illustrates a side view of an image sensor according to a preferred embodiment of the present invention.

Figure 4b is a view showing a bottom view of the image sensor according to a preferred embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

200: lens unit

250: housing part

300: cover part

350: substrate portion

400: image sensor

In order to achieve the above object, according to an aspect of the present invention, the image sensor for detecting an image is mounted on a cover part instead of a substrate part to simplify the providing process, reduce the width of the circuit pattern, and perform a fine pitch to reduce the package size. It is possible to provide a camera chip package that can be reduced.

According to a preferred embodiment, the camera chip package comprises an image sensor comprising an image chip for converting an optical signal into an electrical signal; A cover part coupled to the image sensor in a flip chip manner by using a circuit pattern formed at a lower part thereof, to transfer an electrical signal of the image sensor to a substrate part electrically connected to the circuit pattern, and to isolate the image chip from the outside; And a substrate part configured to output the electrical signal output from the circuit pattern formed on the cover part to the outside.

Here, the lower portion is opened, the housing portion having an opening formed in the center of the upper portion; And a lens part fixed by the housing part and fixed to the opening part, wherein the image sensor may be at least one of a charge coupling device and a CMOS image sensor.

Here, the line width and pitch of the circuit pattern is about 2㎛, the substrate portion may include a flexible printed circuit board, the cover portion may be a filter or a lens.

Hereinafter, a preferred embodiment of a camera chip package according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings, and in the following description with reference to the accompanying drawings, the same or corresponding components regardless of reference numerals are the same. Reference numerals will be given and duplicate description thereof will be omitted.

2A is a view illustrating an operating principle of a camera chip package according to a preferred embodiment of the present invention.

Referring to Figure 2a showing a camera chip package according to the present invention, the optical signal passing through the lens unit 200 is converted into an electrical signal in the image sensor 400 through the cover portion 300, the conversion The electrical signal may be output to the outside through the cover part 300 and the substrate part 350. Here, although the lens unit is configured separately, it can be configured to include only one lens that is filtered. Here, the image sensor 400 refers to an image sensor chip, and may include an image pixel for acquiring image information and a bond pad for mounting on the hot portion.

The image sensor may be mounted on a lower part of the cover part, and the cover part may be electrically connected by mounting a chip. Here, the image sensor may be mounted in a flip chip method without using an anisotropic conductive film. have.

Here, a circuit pattern for transmitting the electrical signal to the substrate portion is formed, the cover portion 300 may include a filter or glass. Since the circuit pattern formed on the cover part is formed of a glass material, the width and pitch of the circuit pattern can be significantly reduced compared to the width and pitch formed on a conventional printed circuit board.

Here, the image sensor is mounted directly on the cover part, and since the cover part has a light transmittance through which an optical signal can pass, there is no need to form a separate opening as in the prior art. In addition, by directly connecting the image sensor to the lid part, there is no need to use an ACF, and the cost can be greatly reduced.

The substrate part 350 connected to the cover part may be implemented as a flexible substrate part, and the substrate part 350 is electrically connected to a circuit pattern formed on the cover part, and a lead wire and an external part for connecting the electrical signal to the outside. It may be provided with a socket for connecting with the circuit of.

The image sensor 400 may detect the information of the subject and convert the information into an electrical image signal. Even if the same image chip is used, the package may be reduced in size compared to the size of the conventional package. The image sensor includes an image pickup tube and a solid state image sensor, and the solid state image sensor includes a complementary metal oxide semiconductor (CMOS) and a charge coupled device (CCD). And the like.

Figure 2b is a diagram showing the overall configuration of a camera chip package according to an embodiment of the present invention.

Referring to FIG. 2B, the camera chip package according to the present invention includes a cover part 300, an image sensor 400 mounted below the cover part 300, and a substrate part 350 electrically connected to the cover part 300. Include. The camera chip package may further include a housing 250 and a lens unit 200 fixed to the housing 250.

The cover part according to the present invention transmits an optical signal incident through the lens part to the image sensor 400, while protecting the surface of the image chip from dust and preventing scratches or damage, and electrically connected to the substrate part, the electrical signal It can perform a function to deliver the to the substrate portion. In addition, the cover part is formed with a circuit pattern according to the present invention, it is provided with a glass material can not only form a finer circuit pattern than the circuit pattern formed in the conventional substrate portion, but also to finely bump the case of mounting the image sensor Can be. And the upper portion and the lower portion can be combined after being manufactured in an independent process, thereby simplifying the manufacturing process can reduce the manufacturing cost.

Conventionally, an image sensor mounted on a substrate is mounted on a cover part in which a pattern is formed in the present invention. Here, since the circuit pattern formed on the cover part is made of glass, the circuit line width and pitch can be reduced, and there between the bond pad of the chip and the pixel can be reduced, thereby reducing the chip size.

In addition, the image sensor and the cover part are manufactured by being sealed to the outside in an independent process, and the image sensor is configured through an internal lead and a flip chip method, and may be mounted by a stud bump or the like.

3A is a diagram illustrating a configuration of an image chip according to a preferred embodiment of the present invention.

Referring to FIG. 3A, an image sensor 150 according to the related art and an image sensor 400 according to the present invention are illustrated. Here, the image sensor 150 and the image pixel 410 included in the image sensor 400 according to the present invention will be described based on the case of the same image chip. Of course, the chip included in the image sensor according to the present invention may include any chip capable of sensing an image of a solid-state image sensor, a CMOS image sensor, and the like.

According to the prior art, the chip itself can be miniaturized according to the development of semiconductor technology, but there is a limit to miniaturization due to the semiconductor package in which pads or lead wires are formed to mount such a chip on a substrate. Therefore, in order to mount the image sensor 150 including the image pixel 410 according to the prior art on a printed circuit board, a basic separation distance 315 is required between the pixel of the image chip and the pad of the chip. do.

However, the chip according to the present invention is not mounted on a substrate, but is mounted on a glass on which a pattern is formed, so that the precision of the chip is improved compared to the mounting on the substrate, thereby reducing the package size of the chip and consequently reducing the size of the camera device. .

According to a preferred embodiment, in the image sensor, the separation distance between the pixel of the image chip and the pad included in the image sensor can be reduced to about 2㎛ ~ several ten㎛.

Figure 3b is a view showing the configuration of the cover unit according to a preferred embodiment of the present invention.

Referring to FIG. 3B, a circuit pattern formed on a cover part according to the present invention is illustrated, and the circuit pattern may be electrically connected to the bond pad and the substrate unit 350 of the image sensor chip. The circuit pattern according to the present invention is not formed on the substrate, but because the circuit pattern is formed on the glass material, the pitch can be significantly reduced as compared with that formed on the conventional substrate.

Referring to Table 1 below, a table according to an embodiment of the present invention is shown.

division Existing Process (FPCB) Glass pitch 60 to 30 2 Line width 60 to 30 2

Here, in the case of using a flexible printed circuit board (FPCB), the circuit line width and the pitch between circuits is about 60 ~ 30㎛, when formed on the cover portion made of glass material, can be reduced to about 2㎛ have. According to a preferred embodiment, the line width and pitch of the circuit pattern is about 1 ~ 20㎛ about, the separation distance between the pixel of the image chip and the pad included in the image sensor may be about 2 ~ 100㎛.

4A and 4B illustrate side and bottom views of an image sensor according to a preferred embodiment of the present invention. 4a shows a side view of the present invention, and FIG. 4b shows a bottom view.

4A and 4B, the image sensor part includes a cover part 300 and an image sensor 400 mounted below the cover part, and the circuit pattern formed on the cover part 300 is a substrate part 350. It may be electrically connected to a circuit pattern formed in the. Herein, the substrate unit 350 may include a flexible substrate FPCB as well as a general substrate PCB. Mechanical and electrical connections between the chip and the lid can be made in a flip chip fashion. Of course, wire flip, tape automated bonding (TAB), etc. may be used in addition to the flip chip method.

Here, the image sensor 400 may be bonded to a circuit pattern formed on the cover part through a flip chip method through a thermosonic or thermocompression method. According to the embodiment of the present invention, the flip bump bonding may be performed by raising the gold bump 270 on the pad electrode. For example, in performing the flip chip bonding, bonding may be performed by forming a solder bump having a protruding shape made of a solder or a metallic material such as Au or Sn-Ag-based alloy.

In this case, it is preferable to perform an underfill 275 sealed with a non-conductive resin on the outer circumference of the gold bump 270. That is, mounting reliability can be improved by arrange | positioning an underfill resin between a cover part and an image sensor. In this way, the underfill resin can disperse the shear stress acting on the bump joint portion existing between the image sensor and the ceramic package, thereby improving the mounting reliability. At this time, the underfill material is not located in the pixel portion of the image sensor.

Although the technical spirit of the present invention has been described in detail according to the above-described embodiments, the above-described embodiments are for the purpose of description and not of limitation, and those skilled in the art of the present invention will appreciate It will be understood that various embodiments are possible within the scope.

As described above, according to the present invention, an image sensor for detecting an image may be mounted on a cover part instead of a substrate part to simplify a providing process, reduce a width of a circuit pattern, and perform a fine pitch to reduce a package size. It works.

In addition, another object of the present invention is to provide a camera chip package device that can reduce the size by reducing the separation distance between the pixel and the chip bond pad. In addition, the present invention has the effect of removing the complexity and difficulty of the process, through the process method that can remove the anisotropic conductive film, and reduce the defective rate.

In addition, another object of the present invention is to configure the image chip on a filter or glass formed of a glass material, there is also an effect that can be formed in a more detailed circuit pattern of the glass material.

In addition, another object of the present invention is to remove the additional labor due to the suppression of the generation of particles, there is an effect that can increase the average yield.

In addition, another object of the present invention is to mount the image sensor through a flip chip method, there is an effect that can provide a thin semiconductor package with improved electrical characteristics.

In the above described with reference to a preferred embodiment of the present invention, those of ordinary skill in the art to devise the present invention within the scope without departing from the spirit and scope of the present invention described in the utility model registration claims It will be understood that various modifications and changes can be made.

Claims (7)

In the camera chip package, An image sensor chip comprising image pixels for converting an optical signal into an electrical signal; Coupled to the bond pad of the image sensor chip by a flip chip method using a circuit pattern formed on the lower side, and transfers the electrical signal of the image sensor chip to the substrate portion electrically connected to the circuit pattern, the image sensor chip A cover portion for isolating; And A substrate portion for outputting the electrical signal output from the circuit pattern formed on the cover portion to the outside Camera chip package comprising a. The method of claim 1, A housing part of which a lower part is opened and an opening is formed in the center of the upper part; And A lens part fixed by the housing part and fixed to the opening part; Camera chip package, characterized in that it further comprises. The method of claim 1, The image sensor chip, At least one of a charge coupled device and a CMOS image sensor. The method of claim 1, The line width and pitch of the circuit pattern is about 1 ~ 20㎛ the camera chip package. The method of claim 1, The camera chip package of claim 1, wherein a distance between a pixel of the image sensor chip and the bond pad included in the image sensor is about 2 to 100 μm. The method of claim 1, The board portion camera chip package, characterized in that it comprises a flexible printed circuit board. The method of claim 1, The cover part is a camera chip package, characterized in that the filter or lens.