KR200341665Y1 - Plating treatment apparatus - Google Patents

Abstract

The present invention relates to a plating treatment apparatus capable of stably supplying an anode metal while significantly suppressing infiltration of impurities into a cathode chamber. The plating treatment vessel is provided on both sides of the width direction in the plating treatment tank 10. In addition to mounting the sealed anode chamber structure 70 in which the surface facing the center in the center becomes the foam member 72 and forms the sealed anode chamber 10a as a whole, each sealed anode chamber structure ( Each anode unit 11 can be accommodated in 70), and a portion of the plating treatment Q outside the respective anode unit 11 can be extracted at the same time in each anode chamber 10A and impurities can be removed therefrom. In addition, the impurity removal means 80 is formed so that the extraction plating treatment liquid after impurity removal is returned to the cathode chamber 10K and formed so as to be supplied.

Description

Plating treatment apparatus

The present invention mounts a positive electrode unit, which is an anode surrounded by a wrapping material, on both sides in the width direction of the plating treatment tank, while immersing a work (cathode) which forms a cathode between both positive electrode units in the plating treatment liquid, The present invention relates to a plating treatment apparatus for supplying electricity between a workpiece in a plating treatment liquid and a positive electrode to apply a plating treatment to the surface of the workpiece.

Conventionally, as shown in FIG. 5, anodes 10P and 12P are mounted on both sides in the width direction in the plating vessel 10, and the cathode of the central cathode chamber 10K, that is, the workpiece (plating treatment object, W) Is immersed. Then, electricity is supplied from the external power supply 50P to the anode 12P and the workpiece W in the plating liquid Q to deposit and plate an anode metal on the surface of the workpiece W. In such plating treatment, it is important to prevent the incorporation of impurities (foreign substances) in the plating treatment Q in order to apply the treatment to a good surface state without boots in the precipitation coating, and to improve the quality (film quality, film thickness difference). In order to maintain uniformity, the plating treatment conditions (the properties and composition of the liquid Q, the current density, the distance between the poles, the liquid temperature, etc.) are maintained within a predetermined range.

However, in order to mass produce the workpiece | work W, such as a printed wiring, for example, it employ | adopted the method (apparatus) which thermally arranges and batch-processes many independent plating process tanks, and quality (film quality, film thickness difference, etc.) It was substantially difficult to maintain the uniformity of.

That is, conventionally, the plating process tank 10 is made into one set long in the conveyance direction (the perpendicular | vertical direction to the paper surface in FIG. 5) of the workpiece | work W, and the state as it immersed the workpiece | work W in the plating process liquid Q is carried out. It is common to form a continuous plating process while carrying out continuous reaction in the furnace.

Therefore, the anode 12P itself often contains a material for promoting the melting of the anode metal so that the anode metal ion Ion can be efficiently and stably supplied to the cathode chamber 10K. In other words, if the anode is eluted, an impurity (anode) metal melting promoting material) is eluted as a slim.

Thus, the anode chamber 10A surrounded by the wrapping material 13P is formed in both sides of the plating process tank 10, and the slime (impurity) eluted from each anode 12P accommodated in each anode chamber 10A is It was formed so as not to intrude into the cathode chamber 10K for inserting and immersing the workpiece | work W.

However, in the case where the workpiece W is, for example, plated with an electronic component (printed wiring, substrate, etc.), higher quality is required, and the narrowing of the mesh of the wrapping material 13P made of cloth Since it tends to be strong, intrusion prevention performance can be improved in proportion to the mesh narrowing degree in the cathode chamber 10K of the slime (impurity) eluted from this anode 12P.

However, such a conventional method cannot satisfy the practicality of operation, that is, at the beginning of operation, the initial intrusion prevention performance can be exhibited, but at the same time, the sieve enclosing member 13P is clogged with slime (impurity) as time passes. The original supply amount of the anode metal ions to the cathode chamber 10K is greatly reduced. In addition, since the current density between the anode cathodes cannot be maintained, there is a problem that the high quality plating treatment cannot be stably performed.

It is an object of the present invention to provide a plating treatment apparatus which is capable of stably and supplying an anode metal while significantly suppressing the ingress of impurities in the plating treatment liquid for immersing the work.

The present invention for achieving the above object is to mount a positive electrode unit which is an anode surrounded by a wrapping material on both sides of the width direction in the plating treatment tank while forming a cathode between both positive electrode units in the plating treatment liquid. A plating treatment apparatus in which a workpiece is immersed and a plating treatment is applied to the surface of the workpiece while supplying electricity between the workpiece in the plating treatment liquid and the anode, at least on both sides in the width direction of the plating treatment tank. In addition to mounting a sealed anode chamber structure that forms a hermetically sealed anode chamber as a whole, the surface facing to the center is formed as a whole, and accommodates the anode unit in each of the sealed anode chamber structures, and simultaneously While the plating treatment liquid other than each anode unit extracts a part and removes impurities in the extraction plating treatment liquid, It is a plating processing apparatus provided with the impurity removal means which returns the extraction plating process liquid after impurity removal in a plating process tank, and returns to a cathode chamber other than each sealed anode chamber structure so that supply is possible.

1 is an overall configuration diagram for explaining an embodiment of the present invention,

2 is a view for explaining a positive electrode case of the present invention,

3 is a plan view for explaining a state in which impurity leakage preventing means is installed in a plating treatment tank of the present invention;

4 is a side view of the present invention,

5 is a diagram for explaining a conventional example.

Explanation of symbols on the main parts of the drawing

1 body, 10 plating treatment tank,

10K: cathode chamber, 10A: anode chamber,

11: anode unit, 12: anode,

13: bag (bubble enclosure), 15: liquid circulation means,

16: supply box, 17 surface activation holding means,

18: nozzle pipe, 19: nozzle,

20: jig,

70: anode case (sealed anode chamber structure) impurity leakage preventing means,

71: frame (box structure), 71H: opening,

72: wrapping material member, 80: impurity removing means,

81: pump, 85: filter,

Q: plating treatment liquid, W: work (cathode)

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

In the plating apparatus according to the present invention, as shown in Figs. 1 to 4, at least both surfaces of the plating vessel 10 in the width direction toward the center of the tank become the foam member 72 and the closed anode chamber as a whole. While attaching the sealed anode chamber structure (anode case 71) which forms 10A, each anode unit 11 is accommodated in each sealed anode chamber structure, and it is in each anode chamber 10A, and each said Impurities in some of the plating treatment Q extracted from the anode unit 11 can be removed, and the extraction plating treatment Q after the removal of impurities is carried out in the plating treatment tank 10 and at the same time, the cathode chamber outside each sealed anode chamber structure 71. It is possible to stably and supply the anode metal while providing the impurity removing means 90 which is returned to (10K) and formed so as to be able to supply, and greatly suppresses the intrusion of impurities into the plating treatment Q which immerses the workpiece W. Make brother It is.

The basic configuration function of the plating apparatus is a positive electrode unit which is a positive electrode enveloping member 13 and a positive electrode 12 surrounded by the enveloping member 13 on both sides in the width direction in the plating processing tank 10 as shown in FIG. 5. 11 (11L, 11R), the work W which forms the cathode 10K between the positive electrode units 11L, 11R at the same time during the plating treatment liquid Q, and immersed the plating treatment liquid The surface of the said workpiece | work W which supplies electricity between the workpiece | work W in (Q) and the anodes 12 and 12 can be plated (precipitation of an anode metal).

In FIG. 1, a hanger 28 is provided on the jig 20, and the work W is held on the hanger 28 using a plurality of mounting screws 29. The supported jig 20 is lowered on the conveyance rail 37 provided in the center of the width direction (left-right direction to drawing) of the plating process tank 10 according to elevating means (not shown).

In addition, the lower end of the jig 20 is guided in the anti-vibration member 60, and the posture in the left and right directions of the work W, that is, the distance between the poles (the distance between the positive electrode 12 and the cathode (work W)). Can be kept constant, which can perform a high quality plating process.

In addition, according to the conveying means (not shown), the jig 20 is moved along the conveying rail 37 in the paper vertical direction (conveying direction) in the drawing. That is, the workpiece | work W which forms a cathode is continuously conveyed in the conveyance direction in plating process liquid Q in the cathode chamber 10K of the width direction center of the plating process tank 10.

In addition, the anode case 70 (70L, 70R) forms a hermetically sealed anode chamber structure in which at least a surface directed toward the center of the tank becomes the foam member 72 and forms the sealed anode chamber 11A as a whole, and the plating process is performed. It is attached to the width direction both sides in the tank 10. The attachment hook 73 which also serves as a feeding bar is used to be attached to and detached from the plating treatment tank 10.

That is, the entire closed anode chamber structure 70 is formed in a box structure detachable from the plating treatment tank 10 so that the holding state including attachment and detachment in the plating treatment tank 10 can be easily performed. Since it is a box structure, it is easy to avoid the interference with the interior goods (for example, the nozzle pipe 18) in the plating process tank 10. FIG.

In addition, the sealed anode chamber structure 70 is formed of the plating member 10 in which the surface facing the workpiece W is mounted in the plating treatment tank 10, and the other surfaces (back and both sides) are formed of a sealed plate. In this way, the structure can be produced easily and at low cost.

The positive electrode unit 11 is attached and detached to the hermetically sealed anode chamber structure 70 using a hook member 14 which also serves as an electric supply. That is, the foam member 72 is eluted from the anode 12 while allowing the anode 12 and the cathode (work W) to conduct electricity, and the impurities passing through the foam envelope member 13 are disposed on the cathode chamber 10K side. Since the leakage is prevented, the sealed anode chamber structure 70 may constitute an impurity leakage preventing means.

In other words, the anode metal and slime eluted from the anode 12 are not directly supplied to the cathode chamber 10K through the enveloping enclosure 13, but slime removed through the impurity removal means 80 to be described later. The containing plating liquid Q is supplied to the cathode chamber 10K without passing the foam enveloping member 13.

Therefore, a high quality plating process can be performed with a clean plating liquid Q without slime in the cathode chamber 10K, and an increase in the slime concentration in the anode unit 11 can be suppressed, and at the same time, Since the loading can be prevented while maintaining the electrical conductivity, a high quality plating treatment can be safely performed for a long time. That is, high quality products such as printed wiring boards can be produced in large quantities.

In addition, when loading occurs in the enveloping enclosing member 13 of the positive electrode unit 11, the anode unit 11 itself is taken out from the sealed anode chamber structures 70L and 70R, and the enveloping enclosing member 13 is simply removed. I can exchange it.

In addition, the enveloping enclosing member 13 is structured to cover the periphery of the rectangular frame with the enveloping enveloping member due to the ease of elution of the anode metal from the anode 12 and the like.

As shown in Fig. 2 (C), the anode case 70 has an opening 71H provided on the bottom plate of the bottom side ((B), the front axis of the paper to the bottom side) with the top opening, and the other surface. The frame 71 of an airtight structure composed of a plate (back plate and both side plates), and the foam subsidiary 72 mounted to block the opening 71H are fixed to the front plate by vis or the like.

Moreover, two opening parts 71H are provided in the frame 71, and as the positive electrode case 70, as shown in FIG. 3, FIG. 4, the plurality is arranged in the conveyance (X) direction.

The sealed anode chamber structures 70 (70L, 70R) can be replaced only with the fabric member 72 in a state where they are mounted in the plating treatment tank 10.

Therefore, the replacement of the fabric member 72 can be performed in a relatively short time, and at the same time, the replacement work is comfortable, and the regular period of the plating treatment operation can be significantly shortened, that is, the plating treatment operation period can be extended. In addition, high quality uniformity can be achieved.

In addition, when the width direction dimension of the plating process tank 10 is small, since the whole closed anode chamber structure 70 can be taken out on the plating process tank, adaptability improves.

The impurity removal means 80 includes liquid circulation means 15 in this embodiment, extracts a part of the plating treatment Q in the anode chamber 10A and other than the corresponding anode unit 11 and extracts the portion. Impurities (positive metal melting promoting substance) in the plating treatment liquid Q are removed, and the extraction plating treatment Q after the removal of impurities is carried out in the plating treatment tank 10 and at the cathode outside each sealed anode chamber structure 70. It returns to the chamber 10K, and is formed so that supply is possible.

In detail, a part of the plating treatment Q in each of the anode chambers 10A and 10A is cyclically moved back to the liquid circulation means 15. In other words, the processing liquid Q0 in each of the anode chambers 10A and 10A is discharge paths 10BT and 10BT, discharge boxes 10BT, and discharged by the partition wall 10T on the bottom side of the plating chamber 10. The suction pipe 82 connected to the flange 10F82 is sucked into the pump 81 installed outside the plating bath 10 and extracted while passing through the filter 85 and the impurities are removed and returned to the supply pipe 83. , The supply flange 10F83 and the supply box 15 are returned from the supply box 15 to the inside of the cathode 10K and are supplied with the plating treatment liquid clean circulation recycling method.

Since the filter 85, the pump 81, etc. are provided outside the said plating process tank, filter replacement etc. can be confirmed easily and it is easy to maintain.

Furthermore, in this embodiment, the surface of the workpiece W can be kept activated while uniformly supplying the plating treatment liquid Q to the cathode chamber 10K in the vertical direction using the surface activation holding means 17.

That is, the surface activation holding means 17 consists of a pair of left and right nozzle pipes 18 standing up and connected to the supply box 16 and a plurality of spare nozzles 19 in each nozzle pipe 18, and the supply box 16. By directing and sorting the plating treatment liquid Q supplied to the workpiece at right angles to the workpiece W, the activation of the surface of the workpiece W can be enhanced and the current density can be uniformly secured in time, that is, the quality is improved. Can be planned.

In the second embodiment of the present invention, the basic configuration functions are the same as those in the first embodiment, but the structure of the sealed anode chamber structure (anode case) is different from that in the first embodiment.

That is, although the anode case 70 is in a form in which the frame 71 and the entire surface of the box structure are covered with the fabric member 72, in the second embodiment, the anode case 70 is formed as a whole in the form of a back. Can be implemented at low cost.

As described above, the plating apparatus according to the present invention can stably produce high-quality products without abnormality of the precipitation film (surface state) of the workpiece W to be plated, and the maintenance is easy while the plating treatment liquid is in a clean circulation method. It has one advantage.

Claims (3)

Mounting the anode unit, which is the anode surrounded by the enveloping enclosing member, on both sides of the width direction in the plating treatment tank, and immersing the workpiece forming the cathode between the two anode units in the plating treatment liquid, and the workpiece in the plating treatment liquid. In the plating treatment apparatus for applying a plating treatment to the surface of the workpiece while supplying electricity between and the positive electrode, On both sides in the width direction of the plating chamber, at least a surface facing the center of the tank becomes a fabric member, and a hermetically sealed anode chamber structure is formed to form a hermetically sealed anode chamber as a whole. It accommodates the unit and extracts a part of the plating solution outside each anode unit at the same time as the inside of each anode, and removes impurities in the extraction plating treatment liquid, and seals the extraction plating treatment liquid after removing impurities in the plating treatment tank and at the same time. A plating treatment apparatus comprising a supplyable impurity removing unit returning to a cathode chamber other than an anode chamber structure. 2. The plating treatment liquid according to claim 1, wherein the impurity removing means is provided outside the plating treatment tank, and extracts a portion of the plating treatment liquid inside each of the anode chambers by suction with a pump, and returns and supplies the mixture to the cathode interior after passing through a filter. Plating treatment apparatus characterized in that the clean circulation reuse method. The plating treatment apparatus according to claim 1 or 2, wherein each of the sealed anode chamber structures has a box structure detachable from the plating treatment tank, and a surface facing the work is formed from the fabric member.