KR20030025788A - Integrated apparatus for thermal dissipation - Google Patents

Abstract

The present invention relates to a heat dissipation integrator suitable for thermal dissipation of display chips and memory chips on a display card. The heat dissipation integration device includes a baseboard including a first side and a second side. A set of first fins and a set of second fins are located at the first face, the set of first fins is perpendicular to the first face and the set of second fins is at 90 degrees with the first face. Not to form an angle. The second side is in contact with both the display chip and the memory chip. A board hook is located on one side of the baseboard and fixed to the edge of the display card. A fan is also located on the first face between the set of first pins and the set of second pins.

Description

Integrated apparatus for thermal dissipation

The present invention relates to a thermal dissipation device. More specifically, the present invention relates to an integrated device for heat dissipation simultaneously for both display and memory chips on a display card.

Inside a computer system, a display card plays a very important role as an interface between the computer and the user because many important information and functions require the display card and screen to greatly improve its performance to help the user solve their problems. Do it. From early stage monochrome display cards to the latest three-dimensional (3D) graphics accelerated display cards, the development of faster and more powerful display cards is the result of decisive demands from computer users. Looking back at the development of display cards, as computer functions have become more powerful, display cards have thus evolved from plain text displays to graphic displays. Moreover, to meet the user's visual experience, displays have evolved from monochrome (black and white) to color and now multi-color three-dimensional (3D) displays. Due to advances in display technology, starting with the ISA bus (Industry Standard Architecture bus), the VESA Local Bus (Video Electronic Standard Association bus) ), PCI bus, Peripheral Component Interconnect bus, recent AGP bus, Advanced / Accelerated Graphics Port bus Have been introduced. With the development of the interfaces, the data flow bottleneck problem at the interface can be solved and a large amount of data can be transmitted.

However, when display cards increase their workload in connection with more memory devices to process enormous data calculations to produce complex graphics, the display chip and memory chip generate a significant amount of heat and at too high a temperature. This is likely to affect the performance of the entire system. To improve the heat dissipation of display chips, memory chips and other electronic components, conventionally, various heat sink devices located in heat generating components have been used. These heat sinks are usually made of high thermal conductive material so that heat can dissipate across to improve heat dissipation. The choice of material for the heat sink should be considered with regard to the properties of heat conduction and thermal expansion, the adhesive, the adhesive force of the adhesive and the properties of the heat dissipation direction. From the divergence of the heat generating components to convection from the fins, the thermal resistance in the path must be carefully calculated to devise the most suitable heat dissipation method. Especially for high thermal strength devices, the adhesion method will greatly affect heat dissipation due to the heat coefficient of the adhesive.

Conventional apparatus for heat dissipation used in display cards is a combination of two heat sinks: one for the display chip and the other for the memory chip. In FIG. 1, this assembled device for heat dissipation includes a main heat sink 200, a second heat sink 300 and a fan 400. The primary heat sink 200 is used to take heat generated from the display chip 110 and adheres directly onto the display chip 110 by a buckling structure (not shown) or screws on the display card 100. do. The second heat sink 300 is used to take heat generated by the memory chip 120. The fan 400 is located in the center of the main heat sink 200 and the wind of the fan takes the surface heat of the heat sink to improve heat dissipation.

The second heat sink 300 does not have any buckling structure and must be adhered to the memory chip 120 by heat conducting epoxy. The heat conducting epoxy requires a long time to cure and furthermore the second heat sink 300 needs to be installed before the main heat sink 200 is assembled. Thus such assembled devices for heat dissipation require tedious procedures that waste time and labor. Moreover, since the display card 100 has board warping problems, the thickness of the heat conducting epoxy may not be sufficient in some parts of the second heat sink 300 and the second heat sink 300 due to vibration during transportation. ) Can be separated. Furthermore, there is no fin on the second heat sink 300 so that the overall surface area is small and furthermore, it is not connected to the main heat sink 200, resulting in insufficient heat dissipation. In addition, fins 210 on the main heat sink 200 vertically provide a relatively small face area for heat dissipation and thus affect heat dissipation.

In the above description, conventional heat sinks are not easily assembled and are easily dropped. Moreover, the heat dissipation performance of this assembled device is relatively worse for heat dissipation of display and memory devices.

SUMMARY OF THE INVENTION The technical problem to be solved by the present invention is to solve the above disadvantages, to integrate heat dissipation of display chips and memory chips on display cards by integrating different heat sinks that exist in the past to improve heat dissipation and reduce labor time. To provide a suitable heat dissipation integrated device. Moreover, board hooks are added to prevent separation due to vibration.

1 is a schematic representation of a conventional assembled device for heat dissipation of the prior art.

2 is a schematic diagram of a heat dissipation integration device according to a preferred embodiment.

3 is a schematic cross-sectional view of an apparatus for integrating heat dissipation in the A-A direction according to a preferred embodiment.

<Explanation of symbols for the main parts of the drawings>

1100 ... display card, 1110 ... display chip,

1120 memory chips, 1200 heat dissipation integrated devices,

1210 ... heat dissipation pins, 1211 ... first pins,

1212 ... second pins, 1220 ... board hook,

1230 ... baseboard, 1400 ... fan

The present invention provides a heat dissipation integrated device suitable for thermal dissipation of a display chip and a memory chip on a display card in order to achieve the above technical problem. The heat dissipation integration device includes a baseboard, a set of first fins, a set of second fins, a board hook and a fan. The baseboard includes a first side and an opposite second side. The set of first pins and the set of second pins are located at the first face, the set of first pins is perpendicular to the first face and the set of second pins are at 90 degrees with the first face. Not to form an angle. The second side is in contact with both the display chip and the memory chip. Furthermore, the board hook is located on one side of the baseboard and fixed to the edge of the display card. The fan is located on the first face between the set of first pins and the set of second pins.

Preferably, the integration of the display chip and the memory chip heat sink has one unit that replaces the assembled unit, thereby improving the discomfort and heat dissipation of the assembly.

Preferably, the second set of fins has an inclined design, thus improving heat dissipation by increasing the surface area for heat dissipation.

Preferably, a board hook is added to one side of the heat sink to attach the PCB board of the display card to reduce the spacing between the heat generating components (display chip and memory chip) and the heat sink. Moreover, the board hook prevents poor contact between heat generating components and the heat sink due to bending of the PCB board of the display card. In addition, the board hook eliminates the thermally conductive epoxy bonding method to prevent separation due to vibration and reduce the labor time required for installation of the heat sink.

Preferably, the board hook has an inclined edge to simplify installation of the operator and prevent separation of the PCB board of the heat sink and the display card.

Preferably, an active fan is placed in the center of the heat sink to take the surface heat of the heat sink to improve heat dissipation.

Both the foregoing general description and the following detailed description are to be understood as illustrative and are intended to provide further explanation of the invention as claimed.

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and together with the description serve to explain the principles of the invention.

2 is a schematic three-dimensional view of a heat dissipation integration device according to a preferred embodiment. The heat dissipation integrator 1200 includes a baseboard 1230, a first face 1201 and a second face 1202, and the first face 1201 includes multiple heat dissipation fins 1210. The heat dissipation fins 1210 include a set of first fins 1211 and a set of second fins 1212, the set of first fins 1211 forming an angle perpendicular to the first face and The second set of fins 1212 forms an angle that is not directly perpendicular to the first face. The second set of fins 1212 has an inclined design, which greatly increases surface area than conventional vertical fin designs, improving heat dissipation and further creating a visual layer effect.

An active type fan 1400 is positioned in the center of the first surface 1201 and connected to the display card 1100 to receive power via the power cable 1410. The amount of wind generated by the fan is sufficient to bring surface heat collected in the heat sink 1200 and both the set of first fins 1211 and the set of second fins 1212 have a heat dissipation rate. Enough to improve.

When the heat dissipation integrator 1200 is attached to the display card 1100 by a buckling structure (not shown), the second surface 1202 is the display chip 1110 of the display card 1100. And the heat dissipation integrator 1200 in contact with both the memory chips 1120 simultaneously perform heat dissipation of both the display chip 1110 and the memory chips 1120. In addition, when the heat dissipation integrated device 1200 is attached to the display card 1100, the entire area including the display chip 1110 and the memory chip 1120 is covered.

3 is a schematic cross-sectional view in the A-A direction according to a preferred embodiment. The heat dissipation integrator 1200 may include a baseboard 1230 and a board on one surface of the baseboard 1230 to attach the heat dissipation integrator 1200 to the edge 1101 of the display card 1100. A hook 1220 is provided. This attachment reduces the spacing between heat generating components (display chip 1110 and memory chips 1120) and the heat dissipation integrator 1200, and reduces heat generation components due to board bending and also due to vibration. Prevents poor contact between the surface and the heat dissipation integration device 1200. Moreover, the board hook 1220 has a beveled edge 1221 to simplify installation of the operator and improve performance.

Moreover, the baseboard 1230 of the heat dissipation integrator 1200 is made of a high thermal conductivity material, such as a high thermal conductivity metal, including aluminum having a high thermal conductivity coefficient.

The set of first pins and the set of second pins are manufactured by, for example, aluminum pressing the pins and the baseboard 1230 together as an integrated body. Furthermore, the board hook is produced by, for example, pressing the hook and the baseboard together as an integrated body.

The fan 1400 is an active fan and its direction is parallel to the first surface 1201.

According to the above embodiment, the present invention has at least the following advantages.

1. The integration of heat dissipation of both the display chip and the memory chips by having one unit replacing multiple heat sink units simplifies installation and improves heat dissipation of the overall system.

2. The second set of fins has an inclined design, thus improving the heat dissipation by improving the surface area for heat dissipation.

3. A board hook is located on one side of the heat sink to attach the heat sink to the display card, thereby minimizing the gap between the heat generating components (display chips and memory chips) and the heat dissipation integrator, It also prevents poor contact between the surface of the heat generating components and the heat dissipation integration device due to board bending. The board hook eliminates thermally conductive epoxy bonding methods to prevent separation due to vibration and reduce installation time. Moreover, the board hooks have sloped edges to simplify installation of the operator.

4. An active fan is located at the center of the heat dissipation integration device. By combining an active fan with a large surface area of the heat sink, the heat dissipation integrator effectively takes the surface heat of the heat sink and improves heat dissipation.

It will be apparent to those skilled in the art that various modifications and variations can be made in the structure of the present invention without departing from the spirit and scope of the invention. Thus, it is intended that the present invention cover the modifications and variations of this invention provided they come within the scope of the following claims and their equivalents.

Claims (15)

A heat dissipation integrator suitable for thermal dissipation of display chips and memory chips on a display card, A baseboard having a first side and a second side opposite the first side, the second side being in contact with the display chip and the memory chip simultaneously; A plurality of first fins and a plurality of second fins positioned on the first surface, wherein the plurality of first fins are perpendicular to the first surface and the plurality of second fins is 90 degrees with the first surface. A plurality of first fins and a plurality of second fins forming an angle other than degrees; And And a board hook positioned at an edge of the baseboard and fixed to an edge of the display card. The heat dissipation integration device of claim 1, wherein the baseboard, the plurality of first fins and the plurality of second fins are made of a material comprising a high conductivity metal. 3. The heat dissipation integration device of claim 2, wherein the high conductivity metal comprises aluminum. The heat dissipation integrating apparatus according to claim 1, wherein the plurality of first fins and the plurality of second fins are manufactured together with the baseboard by an aluminum integrated crimping method. The heat dissipation integrating apparatus according to claim 1, wherein said board hook is manufactured together with said baseboard by an integrated crimping method. 2. The heat dissipation integration device of claim 1, wherein the board hook includes an inclined edge to be secured to an edge of the display card. The heat dissipation integration device of claim 1, further comprising a fan located on the first surface between the plurality of first fins and the plurality of second fins. 8. The heat dissipation integration device of claim 7, wherein the fan comprises an active fan. 8. The heat dissipation integration device of claim 7, wherein the fan further comprises a power cord that connects directly to the display card to receive power. A heat dissipation integrator suitable for heat dissipation of a display chip and a memory chip on a display card, A metal plate having a first face and a second face opposite the first face, the metal plate covering an area of at least the display chip and the memory chip; And A plurality of first fins and a plurality of second fins positioned on the first surface, wherein the plurality of first fins are perpendicular to the first surface and the plurality of second fins is 90 degrees with the first surface. And a plurality of first fins and a plurality of second fins forming an angle other than degrees. The heat dissipation integrating apparatus according to claim 10, further comprising a board hook positioned at an edge of the metal plate to be fixed to an edge of the display card. The apparatus of claim 10, wherein the metal plate, the plurality of first fins and the plurality of second fins comprise aluminum. 13. The apparatus as claimed in claim 12, wherein the plurality of first fins and the plurality of second fins are manufactured together with the metal plate by an integrated crimping method. 12. The apparatus as claimed in claim 11, wherein said board hook is manufactured with said metal plate by an integrated crimping method. 12. The heat dissipation integration device of claim 11, wherein the board hook includes an inclined edge to be secured to an edge of the display card.