KR200266647Y1 - Multi squeeze device - Google Patents

Abstract

The present invention adopts double squeeze or multi squeeze in the process of applying ink to the remaining parts except the soldered part in the SR printing, PSR printing, or printing process of PCB, thereby reducing productivity and improving productivity by reducing the working time. The present invention relates to a multi-squeeze device capable of improving print quality. The multi-squeeze device is installed horizontally along the guide rails 24 and mounted on the table 30 while being raised and lowered in accordance with the printing process. The first squeeze 10 for applying the ink 34 onto the 32 and the first squeeze 10 having a predetermined height and distance from the first squeeze 10 are integrally coupled by the coupling means. The second squeeze 40 to apply ink on the PCB 32 and horizontally disposed at a predetermined interval on the upper portion of the PCB 32 and ejected from the first and second squeeze 40 Huh And a screen frame 28 for raising and lowering the screen mesh 26 to evenly spread on the PCB 32 and horizontally along the guide rail 24 and lowering during the return process after printing. It consists of a scrubber 20 for sweeping out the ink 34 applied on the PCB (32).

Description

Multi Squeeze Device {MULTI SQUEEZE DEVICE}

The present invention relates to a multi-squeeze device, and more specifically, by further comprising a second squeeze and a plurality of squeeze installed at a predetermined height and spaced apart from the first squeeze, the SR printing or PSR printing of the PCB, The present invention relates to a multi-squeeze device capable of shortening the working time at the time of ink application in the printing process to improve productivity and print quality of a product.

In general, various components constituting a circuit are soldered on a printed circuit board (hereinafter, referred to as a PCB) in which circuit parts of various electronic products are integrated. It should be applied with ink. To this end, SR (Solder Resist) printing, PSR (Photo Solder Resist) printing, or stamping (Marking) process.

Among them, SR printing is applied to the remaining parts except the soldering parts on the PCB board with ink to secure the insulation between the parts and protect the PCB from dust or foreign matter. In addition, PSR printing is a new method of improving the SR printing and has the same function as SR printing in terms of insulation and PCB protection on the PCB. On the other hand, the stamping process corresponds to a printing process of recording the name of each component on the PCB to which the SR ink is applied.

As such, the apparatus for printing on the PCB circuit is configured in-line according to the operation method, including a manual printing machine which directly performs most operations such as setting of the product and applying ink, such as setting of the product and applying ink. It can be divided into an automatic printing machine in which most operations are automatically performed through a squeeze, and a semi-automatic printing machine which automatically controls only some functions (for example, the setting of the product is performed by the operator and the ink application is automatically performed by the squeeze).

FIG. 1 schematically shows the configuration of a conventional squeeze apparatus used in such an SR printing process on a PCB, a PSR printing process, or a stamping process on a PCB. In its overall configuration, the squeeze is applied to the ink 34 on the PCB 32 placed on the table 30 while being installed to move horizontally along the guide rail 24 and ascending and descending in accordance with the printing process. (10) and the screen mesh 26, which is arranged horizontally at predetermined intervals on the upper part of the PCB 32 and evenly spreads the ink ejected from the squeeze 10 on the PCB 32, and raises and lowers it. And a scrubber 20 which is installed to be movable horizontally along the guide rail 24 and which is lowered in the return process after printing to sweep off the ink 34 applied on the PCB 32. Consists of

Looking at the process of performing SR printing or PSR printing using the squeeze device of such a configuration, as shown in FIG. 1A, the screen frame is placed on the table 30 with the PCB 32 finished after the soldering process. Lower 28 to place screen mesh 26 on PCB 32. The squeeze 10 is advanced to the right along the direction of the arrow as shown in FIG. 1A while the squeeze 10 is lowered at the same time as the screen frame 28 is lowered. At this time, the ink is discharged through the squeeze rubber 14 inserted into the rubber inserting groove 12 of the squeeze 10, and the discharged ink is transferred to the portion other than soldering on the PCB 32 through the screen mesh 26. Apply. After the printing is completed, after the PCB 32 product is discharged, the new product is set and the printing return process is performed at the same time.

During the return process, as shown in FIG. 1B, the squeeze 10 rises and the scrubber 20 descends, and the brush 22 attached to the rear of the scrubber 20 sweeps the ink residue on the screen mesh 26. Return to its original position.

In the conventional multi-squeeze device having such a configuration, the above print job is repeatedly performed twice in a row due to the deterioration of the printing quality of the product. 14 seconds) is excessive, resulting in reduced productivity.

In addition, in the current working method, the screen frame is raised after the first printing to improve the printing quality and then lowered for the second printing. It causes a defect, there is a problem that the thickness of the ink is uneven for each product.

As a result, the expensive printing apparatus does not exhibit sufficient performance and causes a rise in manufacturing cost due to deterioration of product quality and productivity.

The present invention to solve the above problems is to apply the ink on the PCB by only one printing operation to reduce the working time by half, and at the same time reduce the manufacturing cost, improve the accuracy of the product and improve the printing quality The purpose is to provide a multi-squeeze device.

Another object of the present invention is to provide a multi-squeeze device that can improve the quality of the product by uniformly applying the thickness of the ink throughout the PCB in a single printing operation by a double or multiple squeeze.

1 is a configuration diagram schematically showing a conventional squeeze device, Figure 1a shows a printing process, Figure 1b shows a return process,

Figure 2 is a schematic view showing a multi-squeeze device according to the present invention.

3 is a schematic cross-sectional view showing a coupling state of a multi-squeeze device according to the present invention,

Figure 4 is a schematic side cross-sectional view showing the internal structure of the second squeeze employed in the present invention,

FIG. 5 is a front view of the second squeeze shown in FIG. 4. FIG.

♣ Explanation of symbols for main part of drawing ♣

10, 40: 1st, 2nd squeeze 12, 42: 1st, 2nd rubber insertion groove

14, 44: First and second squeeze rubber 20: Scrubber

22: brush 26: screen mesh

28: screen frame 30: table

32: PCB 34: Ink

40: hanger frame 52: hanger lever

56: adherence plate 60: fixed lever

62: horizontal screw 70: rubber fixing bolt

The multi-squeeze device of the present invention for achieving the above object is a squeeze device for applying ink for insulation and protection between components disposed on the PCB, it is installed to move horizontally along the guide rail and in accordance with the printing process A first squeeze for applying ink on a PCB placed on a table while being raised and lowered, and integrally coupled by a coupling means with a predetermined height and distance from the first squeeze, prior to the first squeeze; A screen for raising and lowering a second squeeze for applying ink to the screen and a screen mesh arranged horizontally at a predetermined interval on an upper portion of the PCB to evenly apply ink ejected from the first and second squeezes onto the PCB. It is installed to move horizontally along the frame and the guide rail. It characterized in that it comprises a scrubber to sweep the ink applied to.

Hereinafter, a multi-squeeze device according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings, and the same parts as in the conventional structure described with reference to FIG.

Figure 2 is a schematic view showing a multi-squeeze device according to the present invention, Figure 3 is a schematic cross-sectional view showing a coupling state of the multi-squeeze device according to the present invention, Figure 4 shows the internal structure of the second squeeze employed in the present invention A schematic side cross-sectional view and FIG. 5 are front views of the second squeeze shown in FIG. 4.

First, as shown in Figure 2, in the squeeze apparatus according to the present invention for applying the ink for the insulation and protection between the parts disposed on the PCB as a method for completing the ink coating operation in a single printing process, the guide The first squeeze 10 is installed to move horizontally along the rail 24 and to apply the ink 34 on the PCB 32 placed on the table 30 while raising and lowering in accordance with the printing process. In front of the first squeeze 10, one or more second squeeze 40 for applying ink on the PCB 32 in advance of the first squeeze 10 is disposed, the second squeeze ( 40) and the ink discharged sequentially from the first squeeze 10 illustrate a structure of sequentially applying the ink onto the PCB 32 through the screen mesh 26.

Here, the first squeeze 10, like the conventional structure described with reference to FIG. 1, is installed on the table 30 while being horizontally movable along the guide rail 24 and being raised and lowered in accordance with the printing process. The ink 34 is applied onto the 32. The first squeeze rubber 14 is fitted into the first rubber insertion groove 12 formed in the lower portion of the first squeeze 10.

On the other hand, one or more second squeeze 40 which is integrally coupled with a predetermined height and distance from the first squeeze 10 by the coupling means is provided, and before the first squeeze 10 Ink is previously applied onto the PCB 32. The second squeeze rubber 44 is also fitted into the second rubber insertion groove 42 formed in the lower portion of the second squeeze 40.

On top of the PCB 32 placed on the table 30 is arranged a screen frame 28 for raising and lowering the screen mesh 26 together with the first and second squeezes 10, 40. Thus, the ink discharged from the first and second squeezes 10, 40 is evenly applied on the PCB 32 through the screen mesh 26.

After completion of the printing operation, the scrubber 20 sweeping out the ink 34 applied on the PCB 32 is installed to be movable horizontally along the guide rail 24. As the second squeezes 10 and 40 are raised, the scrubber 20 is lowered to sweep out the residual ink 34 through the brush 22 fitted at the lower end.

Next, referring to FIG. 3, a hanger frame 50 and a hanger lever 52 for fixing the first squeeze 10 are shown. The contact plate 56 is provided under the vertical screw 54 of the hanger lever 52. Therefore, when the first squeeze 10 is mounted and the hanger lever 52 is turned while the first squeeze 10 is hanged on the hanger frame 50, the contact plate provided at the lower end of the vertical screw 54 is provided. 56 tightly fixes the upper surface of the first squeeze 10 to complete the installation of the first squeeze 10.

On the other hand, in the present invention as a coupling means for integrally coupling the second squeeze 40 to the first squeeze 10, a fixed lever 60 is employed. The fixed lever 60 is provided with a horizontal screw 62, and the second squeeze 40 is screwed to one end of the horizontal screw 62. The fixed lever 60 is installed through the body of the first squeeze 10 and the second squeeze 40 screwed to one end of the horizontal screw 62 has a predetermined gap and height difference from the first squeeze 10. Is placed with.

Here, the second squeeze rubber 44 provided at the lower end of the second squeeze 40 is a predetermined distance (B) from the first squeeze rubber 14 provided at the lower end of the first squeeze 10 (eg, 5 to 50 mm) and spaced apart to the front. In addition, the lower end of the second squeeze rubber 44 installed at the lower end of the second squeeze 40 has a predetermined height A from the lower end of the first squeeze rubber 14 provided at the lower end of the first squeeze 10 ( For example, 2 to 10 mm) are spaced apart upwards. As described above, when the fixed lever 60 is turned in the state in which the second squeeze 40 is disposed with respect to the first squeeze 10 at a predetermined interval B and a height A, the second squeeze 40 ) Is firmly coupled to the front of the second squeeze 40 (the direction in which the squeeze proceeds).

The second squeeze 40 is not particularly limited, but is preferably made of an aluminum-based nonferrous metal alloy, and has a width of about 20 to 80 mm, a length of 400 to 800 mm, and smaller than the first squeeze 10. It is preferred to have a height of 30 to 80 mm. In addition, the shape of the second squeeze 40 is not particularly limited, but may be formed of a polyhedron such as a trihedron or a tetrahedron or a spherical body such as a circle or a semicircle.

4 and 5 show a state in which the second squeeze rubber 44 is mounted on the second squeeze 40 employed in the present invention. As shown, the second squeeze 40 of the present invention is fixed to one end of the fixing lever 60, the second squeeze in the second rubber insertion groove 42 formed on the lower end of the second squeeze 40 The rubber 44 is fitted. At this time, in order to fix the second squeeze rubber 44, a plurality of rubber fixing bolts 70 are installed in the body of the second squeeze 40. Therefore, when the rubber fixing bolt 70 is firmly tightened while the second squeeze rubber 44 is inserted into the second rubber insertion groove 42, the second squeeze rubber 44 is placed on the lower end of the second squeeze 40. It is fixed in a press-closed state to apply the ink.

The application of ink using the multi-squeeze apparatus of the present invention having such a double or multiple squeeze is generally similar to that described in FIGS. 1A and 1B.

That is, the screen frame 28 is lowered and the screen mesh 26 is arrange | positioned on the PCB 32 in the state which mounted the PCB 32 which completed the soldering process on the table 30. FIG. These squeezes 10 and 40 are moved forward while the first and second squeezes 10 and 40 are lowered simultaneously with the lowering of the screen frame 28. Therefore, the ink is first discharged onto the PCB 32 by the second squeeze rubber 44 fixed to the lower end of the second squeeze 20 and then immediately fixed to the lower end of the first squeeze 10. Ink is further discharged on the PCB 32 by the squeeze rubber 14. The discharged ink is applied homogeneously in sequence through the screen mesh 26 to portions other than soldering on the PCB 32. After the completion of printing, the PCB 32 product is discharged, and then a new product is set and the printing return process is performed at the same time. The return process is the same as described in FIG.

According to the present invention described above, a second squeeze and a plurality of squeezes, which are installed spaced apart from the first squeeze at a predetermined height and interval, are further provided, and the first squeeze immediately after application of ink through the second squeeze is ink By applying, since the printing operation is completed in a single process in the process of SR printing, PSR printing, printing of the PCB, it is possible to improve productivity by preventing the deterioration of print quality due to two printing and reducing the printing application time. In addition, the ink is uniformly discharged by sufficiently discharging ink through the additional second squeeze, and then again aligning the surface of the PCB coated with the second squeeze by the first squeeze that follows unbiased. It is possible to increase the print quality of PCB products, and there is an advantage to save resources by preventing excessive consumption of ink.

Claims (8)

A squeeze device for applying ink for insulation and protection between components disposed on a PCB, A first squeeze 10 for horizontally moving along the guide rail 24 and applying ink 34 onto the PCB 32 placed on the table 30 while raising and lowering in accordance with the printing process; A second squeeze 40 which is integrally coupled by a coupling means with a predetermined height and distance from the first squeeze 10 to apply ink onto the PCB 32 prior to the first squeeze 10 Wow, Raising and lowering the screen mesh 26 arranged horizontally on the upper portion of the PCB (32) to evenly apply the ink ejected from the first and second squeeze (40) on the PCB (32) A screen frame 28 to make, And a scrubber 20 which is installed to be movable horizontally along the guide rail 24 and which is lowered in the return process after printing to sweep the ink 34 applied onto the PCB 32. Squeeze device. The method of claim 1, The coupling means is installed through the body portion of the first squeeze 10, the multi-squeeze device, characterized in that the fixing lever 60 is screwed to the second squeeze 40 to one end of the horizontal screw 62 . The method of claim 1, The second squeeze rubber 44 installed at the lower end of the second squeeze 40 is spaced about 5 to 50 mm forward from the first squeeze rubber 14 installed at the lower end of the first squeeze 10. Multi squeeze device, characterized in that. The method of claim 1, The lower end of the second squeeze rubber 44 installed at the lower end of the second squeeze 40 is about 2 to 10 mm upward from the lower end of the first squeeze rubber 14 installed at the lower end of the first squeeze 10. Multi-squeeze device, characterized in that spaced apart. A squeeze device for applying ink for insulation and protection between components disposed on a PCB, A first squeeze 10 is installed to move horizontally along the guide rail 24 and to apply ink 34 onto the PCB 32 placed on the table 30 while being raised and lowered in accordance with the printing process. In front of the first squeeze 10, one or more second squeeze 40 for applying ink on the PCB 32 in advance of the first squeeze 10 is disposed, Multi squeeze device, characterized in that the ink is sequentially discharged from the second squeeze (40) and the first squeeze (10) is sequentially applied to the PCB (32) through the screen mesh (26). The method of claim 5, The second squeeze rubber 44 installed at the lower end of the second squeeze 40 is spaced about 5 to 50 mm forward from the first squeeze rubber 14 installed at the lower end of the first squeeze 10. Multi squeeze device, characterized in that. The method of claim 5, The lower end of the second squeeze rubber 44 installed at the lower end of the second squeeze 40 is about 2 to 10 mm upward from the lower end of the first squeeze rubber 14 installed at the lower end of the first squeeze 10. Multi-squeeze device, characterized in that spaced apart. The method of claim 5, The second squeeze 40 made of an aluminum-based nonferrous metal alloy has a width of approximately 20 to 80 mm, a length of 400 to 800 mm and a height of 30 to 80 mm, and includes a trihedron or a circular semicircle. Multi-squeeze device characterized by consisting of spherical body.