KR20020007990A - Electrostatic discharge device of surface mount type and fabricating method thereof - Google Patents

Abstract

PURPOSE: A surface mounted apparatus for discharging static electricity is provided to ensure simple manufacture and mounting to a printed circuit board by fabricating the apparatus via a layered ceramic process. CONSTITUTION: An upper cover plate(110) is made of an insulation material. A middle insulation plate(120) includes a plate body made of an insulation material under the upper cover plate, a static electricity-preventing space(121) and a first and second discharge terminals(121a,121b) at both sides of the discharge space. A lower cover plate(130) includes a plate body made of an insulation material under the middle insulation plate, a second signal electrode(131a) electrically connected to a first discharge terminal(121a) and a second earth electrode(131b) electrically connected to a second discharge terminal(121b). A gas for preventing static electricity is filled into the static electricity-preventing space.

Description

Surface-Mount Electrostatic Discharge Device and Manufacturing Method Thereof {ELECTROSTATIC DISCHARGE DEVICE OF SURFACE MOUNT TYPE AND FABRICATING METHOD THEREOF}

The present invention relates to an electrostatic discharge device and a method of manufacturing the same, and in particular, to form an electrostatic discharge device for protecting an electronic circuit or electronic components that can be fatally damaged by static electricity to be mounted on a printed circuit board, The present invention relates to a surface mounted electrostatic discharge device which can be easily mounted on a printed circuit board by manufacturing by a multilayer ceramic process, and a manufacturing method thereof.

In general, in an electronic circuit or an electronic component (hereinafter referred to as an electronic circuit), an electronic circuit including an electronic component such as a sensor malfunctions or loses a sensor function or worsens due to static electricity such as a high voltage supplied momentarily. It can cause fatal damages such as destruction of electronic devices. Especially, the circuit becomes more complicated due to the development of electronic devices, and as the sensitivity to signal increases, the possibility of damage of electronic components by static electricity is increasing. Can only be increased.

Accordingly, recently, measures to protect electronic circuits from static electricity have been introduced, and one of the alternatives to solve this problem has been developed and used ESD (Electrostatic Discharge) parts or devices.

An example of a conventional electrostatic discharge device associated with such a technique is shown in FIG. 1, and FIGS. 1A and 1B are sectional views of an installation state and a discharge device of a conventional electrostatic discharge device.

Referring to FIGS. 1A and 1B, an electronic circuit used with an antenna ANT receives a signal through a signal line from the antenna, wherein the signal line is prevented to prevent instantaneous high voltage from flowing into the electronic circuit. An electrostatic discharge device 30 is installed in parallel to the plasma to discharge the static electricity flowing through the signal line to protect the electronic circuit.

The conventional electrostatic discharge device 30 as shown in FIG. 1 inserts the disc covers 32a and 32b having through holes formed on both sides of the insulating cylindrical case 31 having an inner space, and then the disc covers 32a. The plasma discharge gas is filled through the through holes 32b, and then the through holes are sealed with the insulators 33a and 33b while the signal lines are inserted into the internal space through the through holes.

When the ionization property of the discharge gas filled in the internal space of the conventional electrostatic discharge device 30 manufactured as described above, that is, when static electricity higher than the ionization voltage is introduced, the discharge gas is ionized (ionized), thereby causing plasma discharge. As a result, the voltage on the signal line is lowered, which eventually protects the electronic circuit from high static electricity.

However, such a conventional electrostatic discharge device has a process of inserting both covers, filling the discharge gas through the through-holes of both covers, and inserting the through-holes into the insulator while the signal line is inserted into the through-holes of the both covers. Like the sealing process and the like, the manufacturing process is complicated and the manufacturing cost is increased. In addition, the size of the discharge device is large, which causes a large area on the substrate.

2A, 2B and 2C are perspective, plan and vertical cross-sectional views of another conventional discharge device. 2a, 2b and 2c, another conventional electrostatic discharge device is an improved welded seal structure including a discharge tube 10 filled with ionization gas, the discharge tube 10 is made of a conductive metal longitudinal axis It consists of a cylinder-shaped body member 11 including a plurality of holes 12 in the direction of (15), wherein the plurality of holes 12 of the body member 11 are inserted into both sides and ionized. An internal space 20 is formed to fill gas, and an electrode 19 is inserted through the internal space through a through hole formed in the center of the insulating tube 16. Such a structure is disclosed in detail in US Pat. No. 5,726,854.

If such a high voltage is present, the ionizing gas inside the body member 11 is ionized, and in response to the presence of an overvoltage between the electrode and the ground, a conductor path is generated between the electrode and the cylinder body to bypass the high voltage to ground. It is possible to protect the circuit components and semiconductor chips used in combination with the state response sensor.

This conventional electrostatic discharge device has the advantage that can be used by selecting a plurality of electrodes, but the manufacturing process is more complicated than the conventional electrostatic discharge device shown in Figure 1 has a problem that the manufacturing cost is much higher, and, There is a problem that the size of the discharge device is large and occupies a large area on the substrate.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and therefore, an object of the present invention is to mount an electrostatic discharge device on a printed circuit board to protect an electronic circuit or an electronic component that may be fatally damaged by static electricity. The present invention provides a surface-mount type electrostatic discharge device and a method of manufacturing the same, which are simple to manufacture and can be easily mounted on a printed circuit board.

1A and 1B are state diagrams of a conventional electrostatic discharge device and cross-sectional views of the discharge device.

2A, 2B and 2C are a perspective view, a plan view and a vertical sectional view of another conventional discharge device.

3A and 3B are exploded perspective and combined cross-sectional views of a surface mounted electrostatic discharge device according to an exemplary embodiment of the present invention.

Figures 4a, 4b and 4c is an exploded perspective view, a coupling cross-sectional view and a rear view of the intermediate insulating plate of the surface-mount electrostatic discharge device according to another embodiment according to the present invention.

5A and 5B are exploded perspective and combined cross-sectional views of a surface mounted electrostatic discharge device according to still another embodiment of the present invention.

6 is a flowchart showing a method of manufacturing a surface mounted electrostatic discharge device according to the present invention.

Explanation of symbols on the main parts of the drawings

100,400,500: Electrostatic discharge device 110,410,510: Upper and lower cover plate

120,420,520: Intermediate insulation plate 121,421: Discharge space

121a, 421a: first discharge terminal 121b, 421b: second discharge terminal

122a, 422a: first signal electrode 122b, 422b: first ground electrode

130,430: lower cover plate 131a, 431a: second signal electrode

131b and 431b: second ground electrode

511a, 522a, 531a: first, second and third signal electrodes

511b, 522b, 531b: First, second and third ground electrodes

As a technical means for achieving the above object of the present invention, the discharge device of the present invention comprises an upper cover plate made of an insulator; A body of a plate made of an insulator and formed under the upper cover plate, wherein the body includes a discharge space formed so as to penetrate the body up and down, and formed to face each other on both sides of the discharge space. An intermediate insulation plate including two discharge terminals; A plate body made of an insulator and formed under the intermediate insulation plate, wherein the body includes a second signal electrode electrically connected to the first discharge terminal, and a second ground electrically connected to the second discharge terminal. And a lower cover plate including an electrode, wherein a discharge gas is filled in the discharge space sealed by the upper and lower cover plates.

In this invention, since the electrostatic discharge device is easily manufactured by a lamination ceramic process, the manufacturing is simple and can be easily mounted on a printed circuit board.

Hereinafter, a surface mount type electrostatic discharge device according to the present invention will be described in detail with reference to the accompanying drawings.

The surface mount electrostatic discharge device according to the present invention includes an upper cover plate made of an insulator, and a body of a plate made of an insulator formed under the upper cover plate, wherein the body is formed so as to penetrate the body up and down. An intermediate insulation plate including a discharge space, first and second discharge terminals formed to face each other at both sides of the discharge space, and a plate body formed of an insulator and formed below the intermediate insulation plate. And a lower cover plate including a second signal electrode electrically connected to the first discharge terminal and a second ground electrode electrically connected to the second discharge terminal. In addition, discharge gas is filled in the discharge space sealed by the upper and lower cover plates.

The intermediate insulating plate may include a first signal electrode electrically connecting the first discharge terminal and the second signal electrode of the lower cover plate, and electrically connect the second discharge terminal and the second ground electrode of the lower cover plate. It further comprises a first ground electrode.

In the surface-mounted electrostatic discharge device of the present invention, the present invention describes an embodiment of the electrostatic discharge device capable of efficiently discharging static electricity through various experiments and studies.

First, FIGS. 3A and 3B are exploded perspective and combined cross-sectional views of a surface mounted electrostatic discharge device according to an embodiment of the present invention. Referring to these drawings, the surface mounted electrostatic discharge device according to an embodiment of the present invention may include an upper cover. The plate 110 includes an intermediate insulating plate 120 and a lower cover plate 130 having a discharge space 121 penetrating up and down near the center.

The upper cover plate 110 is made of a ceramic insulator and, together with the lower cover plate 130, a function of tightly sealing the gas filled discharge space 121 of the intermediate insulation plate 120 to prevent gas leakage. Form to perform. The sealing structure of the three plates 110, 120, and 130 is formed by the firing process described below.

The intermediate insulating plate 120 performing such a function includes a body of a plate formed of an insulator formed under the upper cover plate 110, and the discharge space 121 penetrates the body up and down. And first and second discharge terminals 121a and 121b facing each other on both sides of the discharge space 121 and first signal electrodes extending from the first and second discharge terminals 121a and 121b, respectively. 122a) and a first ground electrode 122b are formed. Each of the first and second discharge terminals 121a and 121b has one or more protrusions protruding in a triangular shape.

The lower cover plate 130 is formed of an insulator and includes a plate body formed under the intermediate insulation plate 120, and the body has a first signal electrode 122a of the intermediate insulation plate 120. A second signal electrode 131a electrically connected to each other and a second ground electrode 131b electrically connected to the first ground electrode 122b of the intermediate insulating plate 120 are formed.

As described above, the lower cover plate 130 is formed to perform a function of tightly sealing the gas-filled discharge space together with the upper cover plate 130. Therefore, the discharge gas is filled in the discharge space 121 sealed by the upper and lower cover plates 110 and 130.

Each of the plates 110, 120, and 130 is not particularly limited in shape or structure, but in order to easily mount on the printed circuit board, the plate surface contacting the printed circuit board, that is, the bottom surface of the lower cover plate 130 is illustrated in FIG. 3A. As shown in Fig. 3B, flatness is preferable, and in consideration of ease of manufacture and simplicity of lamination, the contact surface between the plates is preferably flat. Considerations or descriptions regarding the structure and shape of such plates apply throughout the present invention.

In the surface mounted electrostatic discharge device according to the embodiment of the present invention, the electrical connection between the intermediate insulating plate 120 and the lower cover plate 130 is formed by the connection between the electrodes of these plates as described above. Specifically, for example, as shown in FIGS. 3A and 3B, the first signal electrode 122a and the first ground electrode extending from each of the first and second discharge terminals 121a and 121b may be formed. 122b is connected to the second signal electrode 131a and the second ground electrode 131b of the lower cover plate 130 via the outer surface of the intermediate insulating plate 120.

Figures 4a, 4b and 4c is an exploded perspective view, a combined cross-sectional view and a back view of the intermediate insulating plate of the surface mounted electrostatic discharge device according to another embodiment according to the present invention, referring to Figures 4a, 4b and 4c, the present invention Surface-mounted electrostatic discharge device according to another embodiment of the upper cover plate 410, the intermediate insulating plate 420 and the lower cover plate 430 is formed with a discharge space 421 penetrating up and down near the center Include.

The upper cover plate 410 is made of a ceramic insulator, and together with the lower cover plate 430, a function of tightly sealing the gas filled discharge space 421 of the intermediate insulation plate 420 to prevent gas leakage. Form to perform.

The intermediate insulating plate 420 performing such a function includes a body of a plate formed of an insulator and formed under the upper cover plate 410, and the discharge space 421 penetrates the body up and down. And first and second discharge terminals 421a and 421b facing each other on both sides of the discharge space 421 and the first and second discharge terminals 421a and 421b, respectively, as shown in FIG. 4C. The first signal electrode 422a and the first ground electrode 422b extending to a predetermined region of the adjacent lower surface are formed.

The lower cover plate 430 is formed of an insulator and includes a plate body formed under the intermediate insulation plate 420, wherein the body has a first signal electrode 422a of the intermediate insulation plate 420. A second signal electrode 431a electrically connected to each other and a second ground electrode 431b electrically connected to the first ground electrode 422b of the intermediate insulating plate 420 are formed.

As described above, the lower cover plate 430 is formed together with the upper cover plate 410 to perform a function of tightly sealing the gas-filled discharge space. Therefore, the discharge gas is filled in the discharge space 421 sealed by the upper and lower cover plates 410 and 430.

In the surface mounted electrostatic discharge device according to another embodiment of the present invention, the electrical connection between the intermediate insulating plate 420 and the lower cover plate 430 is connected to each electrode of these plates as described above. Specifically, for example, as shown in FIGS. 4A and 4B, the first signal electrode 422a and the first ground electrode extending from each of the first and second discharge terminals 421a and 421b. The second signal electrode 431a and the second ground of the lower cover plate 430 directly below the second discharge terminals 421a and 421b without passing through the outer surface of the intermediate insulating plate 420. It may be connected to the electrode 431b.

5A and 5B are exploded perspective and combined cross-sectional views of a surface mounted electrostatic discharge device according to still another embodiment of the present invention. Referring to FIGS. 5A and 5B, the surface mounted type according to still another embodiment of the present invention. The electrostatic discharge device includes an upper cover plate 510, an intermediate insulation plate 520, and a lower cover plate 530 formed with discharge spaces 521 penetrating up and down near the center.

The upper cover plate 510 is made of a ceramic insulator and, together with the lower cover plate 530, tightly seals the gas filled discharge space 521 of the intermediate insulation plate 520 to prevent gas leakage. Form to perform. The first signal electrode 511a and the first ground electrode 511b separated from each other on both sides of the lower surface of the upper cover plate 510 are formed in a predetermined region. Here, the electrode end portions of the first signal electrode 511a and the first ground electrode 511b that face each other are formed in a sharp shape such as a triangular pyramid so that discharge can occur efficiently.

The intermediate insulating plate 520 performing such a function includes a body of a plate formed of an insulator and formed under the upper cover plate 410, and the discharge space 421 penetrates the body up and down. The second signal electrode 521a and the second ground electrode 521b are formed on the left side and the right side of the intermediate insulating plate 520, that is, on both sides thereof, and the second signal electrode 521a and the second side are formed. Each of the two ground electrodes 521b extends to one portion of the upper surface and the lower surface.

Accordingly, when the upper cover plate 510 and the intermediate insulation plate 520 are stacked, the first signal electrode 511a of the upper cover plate 510 and the second signal electrode 521a of the intermediate insulation plate 520 are stacked. The first ground electrode 511b of the upper cover plate 510 and the second ground electrode 521b of the intermediate insulation plate 520 are electrically connected to each other.

The lower cover plate 530 is formed of an insulator and includes a plate body formed under the intermediate insulation plate 520. The body has a second signal electrode 521a of the intermediate insulation plate 520. A third signal electrode 531a electrically connected to each other and a third ground electrode 531b electrically connected to the second ground electrode 521b of the intermediate insulating plate 520 are formed. Here, the electrode end portions of the third signal electrode 531a and the third ground electrode 531b facing each other may have a pointed shape such as a triangular pyramid so that discharge can occur efficiently.

As described above, the lower cover plate 530 is formed together with the upper cover plate 510 to perform a function of tightly sealing a gas-filled discharge space. Therefore, the discharge gas is filled in the discharge space 521 sealed by the upper and lower cover plates 510 and 530.

As described in each embodiment of the present invention described above, the electrical connection between the second signal electrode of the lower cover plate and the first signal electrode of the intermediate insulating plate, the second ground electrode of the lower cover plate and the Electrical connection between the first ground electrode of the intermediate insulating plate can be realized by extending the electrode structure in various forms or in various paths, and the present invention is not limited to a specific electrode pattern or an inter-electrode connection form and structure thereof.

In addition, in the embodiment and the other embodiment of the present invention, each of the discharge terminals, including the protrusions protruding in at least one triangular shape on the opposite surfaces of the discharge space for smooth discharge, the intermediate insulation It is formed integrally with the plate. The discharge terminal installed inside the discharge space as described above may be deformed into various shapes such as a sawtooth shape, a triangular pyramid shape, or the like.

When the electrostatic discharge device of the present invention is mounted on a printed circuit board, the lower cover plate of the electrostatic discharge device contacts the printed circuit board. Accordingly, the second signal electrode is connected to the signal line of the mounted printed circuit board. The second ground electrode is connected to the ground plane of the printed circuit board.

Further, in another embodiment of the present invention, the opposite end between the first signal and the ground electrode and the opposite end between the third signal and the ground electrode are formed in the shape of a pointed pattern such as a triangular pyramid. The electrode end can be deformed into various shapes such as a sawtooth shape, a triangular pyramid shape, or the like.

When the electrostatic discharge device of the present invention is mounted on a printed circuit board, the lower cover plate of the electrostatic discharge device contacts the printed circuit board. Accordingly, the third signal electrode is connected to the signal line of the mounted printed circuit board. The third ground electrode is connected to the ground plane of the printed circuit board.

In each of the embodiments of the present invention as described above, the plasma ionization voltage is determined in consideration of the degree of protection for the applied electronic circuit with respect to the discharge characteristics of the plasma gas, and the discharge terminal is formed so as to correspond to the ionization voltage thus determined. The distance between the formed discharge electrodes, the composition of the discharge gas, the size and structure of the discharge space are determined.

Looking at the operating state of the antistatic device consisting of the above configuration.

The discharge space of the intermediate insulating plate filled with the discharge gas is sealed by the upper and lower cover plates, and at this time, the static electricity higher than the ionizing voltage through the signal line into the discharge space of the intermediate insulating plate filled with plasma discharge gas. When is introduced into the discharge space, the plasma gas in the discharge space is ionized (ionized) to generate a plasma discharge, thereby lowering the voltage of the signal line.

More specifically, the voltage between the first signal electrode and the first ground electrode on both sides of the discharge space is gradually increased by the electrostatic lamp, so that the ionization voltage (or reference) of the inert gas, that is, the plasma gas, filled in the discharge space. Voltage), the plasma gas is ionized (ionized) to cause plasma discharge, and the voltage between both electrodes, i.e., the first signal electrode and the first ground electrode, drops.

In addition, in the electrostatic discharge device, general discharge characteristics such as discharge start voltage and discharge time are determined by the ionization characteristics of the inert gas filled in the discharge space and the size of the discharge space. It is possible to control the size of the discharge space artificially.

Hereinafter, a method of manufacturing a surface mounted electrostatic discharge device according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 6 is a flowchart showing a method of manufacturing a surface mounted electrostatic discharge device according to the present invention. Referring to FIG. 6, a method of manufacturing a surface mounted electrostatic discharge device according to the present invention uses a multilayer ceramic process. In this regard, first, in the slurry forming step (a) (S51 of FIG. 6), the ceramic powder is mixed with a binder for bonding the powder and a solvent such as water or an organic solution to form a ceramic slurry. In this step, it is preferable to form a ceramic slurry by further adding a dispersant in which the ceramic powder is evenly dispersed in a solvent and a plasticizer for imparting flexibility to the ceramic powder bound by the binder.

Next, in the tape casting step (b) (S52 of FIG. 6), the ceramic slurry formed as described above is coated on a PET (PolyEthylene Terephthalate) film to a desired thickness, and then dried by high temperature wind using a doctor blade. A ceramic green sheet is formed. Next, in the punching step (c) (S53 of FIG. 6), the ceramic green sheet is cut into a predetermined size, that is, a size corresponding to the size of a desired discharge device, to make an upper cover plate, an intermediate insulation plate, and a lower cover plate, respectively. In addition, the intermediate insulation plate is punched to form a discharge space and a discharge space, and the discharge space and the power generation terminal are processed to form a discharge space having a space of a desired size, and the discharge terminal is also processed into a desired shape.

Then, in the printing step (d) (S54 of Fig. 6), the electrode is printed at the set position of each of the intermediate insulating plate and the lower insulating plate. Next, in the stacking step (e) (S55 of FIG. 6), the upper cover plate, the middle insulation plate, and the lower cover plate are stacked. Subsequently, a binder burn-out step is performed, and in this step, organic materials such as binders, dispersants, and plasticizers except ceramic powder are burned off. Subsequently, in the firing step f (S56 of FIG. 6), the laminated plates are fired in a plasma gas atmosphere to fill plasma gas in the discharge space formed in the intermediate insulation plate.

When the laminated plates are fired in the plasma gas atmosphere, the plasma gas is filled and sealed in the discharge space, thereby manufacturing the electrostatic discharge device of the present invention. At this time, the plasma gas filled in the discharge space is selected in consideration of the ionization characteristics as mentioned above.

Finally, in the plating step (g) (S57 of FIG. 6), nickel and lead components (Sn or SnPb) are sequentially plated on the regions to be soldered among the electrodes of the electrostatic discharge apparatus manufactured as described above.

As described above, when the surface-mount type electrostatic discharge device according to the present invention is used in a multilayer ceramic process, the manufacturing process is simple and the electrostatic discharge device of the present invention can be manufactured at low cost.

As described above, according to the surface-mount type electrostatic discharge device according to the present invention, an electrostatic discharge device for protecting an electronic circuit or an electronic component that may be fatally damaged by static electricity may be mounted on a laminated ceramic process. By the easy manufacturing, the manufacturing is simple, and there is a special effect that can be easily mounted on a printed circuit board.

In addition, by improving the reliability of the operation by the electrostatic discharge device is integrally connected to the electronic circuit, by minimizing the installation space by the electrostatic discharge device mounted on the electronic circuit, there is an effect to prevent the volume increase of the device accordingly. .

Claims (9)

An upper cover plate 110 made of an insulator; A body of a plate made of an insulator and formed under the upper cover plate 110, wherein the body includes a discharge space 121 formed to penetrate the body up and down, and at both sides of the discharge space 121. An intermediate insulating plate 120 including first and second discharge terminals 121a and 121b formed to face each other; A plate body formed of an insulator and formed under the intermediate insulation plate 120, wherein the body includes a second signal electrode 131a electrically connected to the first discharge terminal 121a, and the second discharge. And a lower cover plate 130 including a second ground electrode 131b electrically connected to the terminal 121b. Surface-mount electrostatic discharge device, characterized in that the discharge gas is filled in the discharge space 121 is sealed by the upper and lower cover plates (110,130). The method of claim 1, wherein the intermediate insulating plate 120 A first signal electrode 122a electrically connecting the first discharge terminal 121a and the second signal electrode 131a of the lower cover plate 130 to each other; And a first ground electrode 122b electrically connecting the second discharge terminal 121b and the second ground electrode 131b of the lower cover plate 130 to the surface mounted type electrostatic discharge. Device. The method of claim 2, wherein the discharge space 121 is Surface-mount electrostatic discharge device, characterized in that formed in a predetermined size to have a desired ionizing voltage characteristics in consideration of the distance between the discharge electrodes formed between the discharge terminals (121a, 121b), the composition of the discharge gas. The method of claim 3, wherein each of the discharge terminal (121a, 121b) Surface-mounted electrostatic discharge device, characterized in that formed integrally with the intermediate insulating plate 120, including a projection protruding in one or more triangular shape on the opposite surfaces of the discharge space 121 facing each other. An upper cover plate 510 including a plate body made of an insulator and including a first signal electrode 511 a and a first ground electrode 511 b formed separately from each other in a setting region at both sides of a lower surface of the body; A body of a plate made of an insulator and formed under the upper cover plate 510, wherein the body includes a discharge space 521 formed to penetrate the body up and down, and formed on a left side of the body to Intermediate insulation including a second signal electrode 521a connected to the first signal electrode 511a and a second ground electrode 521b formed on the right side of the body and connected to the first ground electrode 511b. Plate 120; A plate body formed of an insulator and formed under the intermediate insulation plate 520, wherein the body includes a third signal electrode 531a electrically connected to the second signal electrode 521a, and the second ground. And a lower cover plate 130 including a third ground electrode 531b electrically connected to the electrode 521b. Surface-mount electrostatic discharge device, characterized in that the discharge gas is filled in the discharge space 521 sealed by the upper and lower cover plates (510,530). 6. The surface mounted electrostatic discharge device according to claim 5, wherein the electrode end portions of the first signal electrode (511a) and the first ground electrode (511b) facing each other are formed in a pointed pattern. 6. The surface mounted electrostatic discharge device according to claim 5, wherein the electrode end portions of the third signal electrode (531a) and the third ground electrode (531b) facing each other have a pointed pattern. In the manufacturing method of the surface-mount electrostatic discharge device, (a) a slurry forming step of mixing a ceramic powder with a binder and a solvent to form a ceramic slurry; (b) a tape casting step of coating the ceramic slurry on a P.E.T film and then drying to form a ceramic green sheet; (c) a punching step of cutting the ceramic green sheet to a predetermined size to form an upper cover plate, an intermediate insulation plate and a lower cover plate, and punching the intermediate insulation plate to form a discharge space and a discharge terminal; (d) printing an electrode at a predetermined position of each of the intermediate insulating plate and the lower insulating plate; (e) a lamination step of laminating the upper cover plate, the middle insulation plate and the lower cover plate; (f) firing the deposited plate in a plasma gas atmosphere to form an electrostatic discharge device; Method of manufacturing a surface-mount type electrostatic discharge device comprising a. The method of claim 8, wherein the surface mounted electrostatic discharge device is manufactured. (g) a plating step of sequentially plating nickel and lead components in the region to be soldered among the electrodes of the predetermined electrostatic discharge device; Method of manufacturing a surface-mount type electrostatic discharge device further comprising.