KR20010049113A - calorific equipment of plasma display panel and printed circuit board having the calorific construction of plasma display panel - Google Patents

Abstract

PURPOSE: A radiator of a plasma display panel and a circuit board of the plasma display panel thereof are provided to prevent dusts from contacting each element of the display and to cool the elements effectively. CONSTITUTION: In the radiator of a plasma display panel, an air passage(H) is formed on the heat insulation plates(30a) to prevent air from contacting the panel(12) directly. More than one air groove(32a) is formed on the radiation plate(30a) corresponding to the back side of the panel(12). The air groove(32a) is formed while a dielectric double tape(26) is applied. The dielectric double tape(26), designed for improving a cooling effect, is curved and enlarged against the air groove(32a) so that the heat generated at the panel can be conducted effectively.

Description

Circuit board of plasma display panel having heat dissipation device and heat dissipation structure of plasma display panel {calorific equipment of plasma display panel and printed circuit board having the calorific construction of plasma display panel}

The present invention relates to a circuit board of a plasma display panel having a heat radiating device and a heat radiating structure of a plasma display panel, and more particularly, to prevent heating of the plasma display panel or a circuit board for driving the same. The present invention relates to a heat dissipation device of a plasma display panel and a circuit board of a plasma display panel having a heat dissipation structure to enable normal driving.

BACKGROUND ART In general, a plasma display panel is a device used as a display means by enclosing gas between opposite electrodes and exciting various phosphors with a gas discharge generated in the process of selectively applying voltage thereto.

In the above-described configuration of the plasma display panel 10, as shown in FIG. 1, there is a panel 12 containing phosphor and a voltage applied thereto, and a circuit board 14 for driving the panel 12 is provided. The rear surface of the panel 12 is spaced apart from each other by a flexible printed circuit board 22.

In addition, the panel 12 and the circuit board 14 are covered by the front and rear cases 16 and 18, and these panels 12 and the circuit board 14 are formed inside the front and rear cases 16 and 18. The frame 20 is supported and fixed to maintain a constant distance from each other.

In addition, the temperature of the panel 12 and the circuit board 14 is continuously increased in the plasma display panel 10, and the temperature increase is caused by the angles of the panel 12 and the circuit board 14. It acts as a factor that hinders the normal operation of the component.

Therefore, the plasma display panel 10 is provided with heat dissipation means for dissipating heat generated to prevent the panel 12 and the circuit board 14 from being heated.

The conventional heat dissipation means has a configuration in which a fan 24 is provided to forcibly flow air into the front and rear cases 16 and 18 of the plasma display panel 10, as shown in FIG.

However, according to the configuration in which heat is radiated using the fan 24, dust introduced into the plasma display panel 10 together with air may be collected by static electricity at a high voltage generating portion, and in this case, dust collected As a result, the cooling characteristics are gradually lowered, there is a problem that the overheating of the parts and the function of the parts are not normally performed, and the parts characteristics are deteriorated.

In order to solve the above problem, the heat sink 28 made of metal having high thermal conductivity is attached to the rear surface of the panel 12 with an insulating double-sided tape 26 to dissipate heat generated in the panel 12 through the heat sink 28. In this case, a problem caused by dust collection and the like can be prevented, but there is a problem in that the temperature inside the plasma display panel 10 cannot be stably maintained in terms of reliability and performance due to insufficient cooling efficiency. .

DISCLOSURE OF THE INVENTION An object of the present invention is to solve a conventional problem, and to prevent direct contact of dust with each component of a plasma display panel, and at the same time to effectively cool each component to be heated. And it provides a circuit board of the plasma display panel having a heat radiation structure.

1 is a cross-sectional view schematically showing the configuration of a conventional plasma display panel.

FIG. 2 is a partial cross-sectional view schematically showing a configuration of a heat radiating device of a plasma display panel and an installation relationship thereof according to an embodiment of the present invention.

3 to 5 are partial cross-sectional views schematically showing another embodiment of the heat radiation device configuration of the plasma display panel shown in FIG.

6 is a rear view showing the configuration of the heat sink and its installation relationship with respect to the plasma display panel according to the present invention.

FIG. 7 is a partial cross-sectional view schematically illustrating a heat dissipation device of the plasma display panel according to the exemplary embodiment of the double-sided tape shown in FIG. 6.

8 and 9 are partial cross-sectional views schematically illustrating a heat dissipation device configuration and a coupling relationship of a plasma display panel according to another embodiment of the present invention.

FIG. 10 is a schematic cross-sectional view illustrating a configuration of a circuit board of a plasma display panel and a functional relationship thereof according to another embodiment of the present invention.

<Explanation of main symbols used in drawings>

10: plasma display panel 12: panel

14, 42: circuit board 16: front case

18, 52: rear case 20, 40: frame

22: flexible printed circuit board 24: fan

26, 26a: double-sided tape 28, 30a, 30b, 30c, 30d: heat sink

31: metal pipe 32a, 32b, 32c, 32d: ventilation groove

36: inlet 38: outlet

44: heat sink 46: cooling fin

48: duct 50: blowing member

54a, 54b: Ventilation openings 56a, 56b: Ventilation ribs

58: space block

The heat dissipation device configuration of the plasma display panel of the present invention for achieving the above object is supported by the front and rear case and frame so that the plasma display panel connected to the mutual flexible printed circuit board and the circuit board for driving the same are spaced at regular intervals. A heat dissipation device of a plasma display panel, wherein a heat dissipation plate made of metal is attached to the back surface of the plasma display panel between the plasma display panel and the circuit board by using an insulating double-coated tape having high thermal conductivity. At least one air passage is formed to contact the air directly.

In addition, the air passage may be formed on the opposite surface of the heat dissipation plate corresponding to the rear surface of the plasma display panel to form a ventilation groove for forming air flow path by being bonded by the double-sided tape or the back surface of the plasma display panel The heat sink corresponding to the bent at least one or more times by being bonded to the double-sided tape to be formed by the ventilation grooves of the bent portion is not formed by the passage of the air flow and at the same time bent to the heat sink back portion Is preferably formed to perform the cooling fin function.

The air passage may include at least one metal tube having a predetermined diameter in the process of manufacturing the heat sink and cover the heat sink material to form a passage through which the air flows through the metal tube, or at least the heat sink. Two or more plate members may be bonded to each other, and at least one ventilation groove may be formed on opposite surfaces of the plate members to be joined to each other to form a passage through which the air flows.

In addition to the above structure, the circuit board is attached to the rear surface of the heat sink by the double-sided tape so as to share the cooling efficiency by the air passage, or by placing a space block shaped to maintain a predetermined distance at the edge of the heat sink. It may be formed by forming a passage through which air can flow therebetween.

In addition, the air passage is formed as an air flow circuit having an inlet on one side and an outlet on the other side to guide the flow of air on the heat sink corresponding to the plasma display panel, and on the frame A duct may be formed to communicate with each of the outlets, and an air blowing member may be installed at an end of the duct to be supported by the rear case to guide the flow of air.

On the other hand, another configuration of the present invention for achieving the above object, the plasma display panel and the circuit board for driving the same is supported on the front and rear case and the frame so as to be spaced at a predetermined interval is connected to a plurality of flexible printed circuit boards, In the heat dissipation apparatus of the plasma display panel, the heat dissipation plate is attached to the back surface of the plasma display panel between the plasma display panel and the circuit board to increase the cooling efficiency with an insulating double-coated tape having high thermal conductivity. The heat generated from the panel 12 is extended to the rear case through each of the flexible printed circuit boards so as to conduct heat to the rear case.

In addition, another embodiment of the present invention, the plasma display panel and the circuit board for driving the same are supported on the front and rear case and the frame so as to be spaced apart at regular intervals and connected to each other by a flexible printed circuit board, the plasma display panel and the circuit A heat dissipation device of a plasma display panel formed by attaching a heat dissipation plate on the back surface of the plasma display panel between substrates with a high thermal conductivity insulating double-sided tape, to prevent direct air contact on the heat dissipation panel. An air passage is formed, and the circuit board is bonded to the rear surface of the heat sink with the double-sided tape so as to share the cooling efficiency by the air passage, thereby forming an air passage which is the same as the function of the air passage, and the opposite back surface of the circuit board. Air passage mold The heat sink is spaced apart so that a predetermined interval is maintained by the space block, at least one cooling fin is formed at a portion exposed to the outside of the heat sink, a duct is formed on the frame in communication with the air passage, At the end of the duct is formed a blowing member for inducing the flow of air through the air passage.

Meanwhile, another embodiment of the present invention includes a frame 20 for supporting the plasma display panel 12 and the circuit board 14 connected to the flexible printed circuit board 22 so as to be spaced apart from each other at regular intervals. In the heat dissipation device of the plasma display panel is provided with front and rear cases (16, 18) to cover the plurality of ventilation means penetrating the inner and outer sides on the rear surface of the rear case (18), The plurality of ventilation holes 54a formed through the upper portion of the rear surface of the case 52 are formed to be inclined from the lower side of the inside to the upper side of the outside to facilitate the discharge of the internal air having heat, The upper side of the rear case 52, the ventilation ribs 56a are formed to induce the direction of the discharged air and prevent the inflow of dust from the upper side. The plurality of vents 54b formed through the lower portion are formed to be inclined in the upper direction from the lower side of the outside to facilitate the inflow of low temperature external air into the inside, and the outer portion of the upper portion of the outer periphery of the vent hole 54b. Ventilation ribs (56b) for extending the low-temperature air at the same time and to block the inflow of dust from the upper upper side is formed.

In addition, another embodiment of the present invention, the flexible printed circuit board 22 is supported by the plasma display panel 12, the front and rear cases (16, 18) and the frame 20 spaced apart from each other at regular intervals. In the circuit board of the plasma display panel to drive the plasma display panel 12 through the at least one, At least one air can flow through the surplus portion of the circuit formed to drive the plasma display panel 12 The above heat dissipation opening 44 is formed.

In addition, another embodiment of the present invention, the flexible printed circuit board 22 is supported by the plasma display panel 12, the front and rear cases (16, 18) and the frame 20 spaced apart from each other at regular intervals. In the circuit board of the plasma display panel to drive the plasma display panel 12 through, using a resin having good thermal conductivity instead of the double-sided tape for bonding the plasma display panel 12 and the heat sink, the heat sink It is formed to form the unevenness is formed so that these adhesive resin is filled in the groove portion of the uneven portion.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 to 5b are partial cross-sectional views schematically showing the configuration of the heat dissipation device of the plasma display panel 12 according to each embodiment of the present invention, Figure 6 is a configuration of the heat sink for the plasma display panel according to the present invention and its installation FIG. 7 is a partial cross-sectional view schematically showing a configuration of a heat dissipation device of a plasma display panel according to an embodiment of the double-sided tape shown in FIG. 6, and FIGS. 8 and 9 are different embodiments of the present invention, respectively. FIG. 10 is a partial cross-sectional view schematically showing a heat dissipation device of a plasma display panel and a coupling relationship thereof, and FIG. 10 schematically shows a configuration and a functional relationship of a circuit board of a plasma display panel according to another embodiment of the present invention. As sectional drawing, the same code | symbol is attached | subjected about the same part as before, and detailed description is abbreviate | omitted accordingly. And groups.

First, referring to the configuration of the heat dissipation device of the plasma display panel according to an embodiment of the present invention, as shown in FIGS. 2 to 7, air is directly directed to the panel 12 on the heat sinks 30a, 30b, 30c, and 30d. The air passage (H) is formed to prevent the contact with.

In this configuration, as shown in FIG. 2, at least one ventilation groove 32a is formed on a corresponding surface of the heat sink 30a corresponding to the rear surface of the panel 12 to be bonded with an insulating double-sided tape 26. The ventilation groove 32a formed in the process is formed as a passage through which air can flow.

In addition, the insulating double-sided tape 26 for the ventilation groove 32a thus formed is bent to increase the efficiency of conducting heat generated in the panel 12 with respect to the side surface of the ventilation groove 32a to widen the contact area thereof. Is bonded.

On the other hand, the other configuration for forming the air passage (H), as shown in Figure 3, the heat sink (30b) is formed in a curved shape, the portion which is not bonded by the double-sided tape 26 by this bending is The panel 12 is provided with a ventilation groove 32b having an excited shape, and the ventilation groove 32b forms a passage through which air can flow again.

In addition, the rear surface of the heat sink 30b is bent to form a protruding shape, this protruding shape is to perform a cooling fin function to increase the cooling efficiency when in contact with the outside air.

As described above, the insulating double-coated tape 26 with respect to the ventilation groove 32b is partially inserted into a curved shape so as to have a wide contact area with respect to the side wall of the ventilation groove 32b so as to improve the thermal conductivity. Are glued.

In addition to such a configuration, the configuration shown in FIG. 4 is a structure in which the circuit board 14 spaced apart from the panel 12 is bonded to the bent heat sink 30b with an insulating double-coated tape 26 having high thermal conductivity. The portion bent by the bonding of 30b) and the circuit board 14 is again formed by another air passage to form a configuration that dissipates heat generated in the circuit board 14 as in the panel 12.

In addition, another configuration for forming the air passage (H), as shown in Figure 5a, at least one metal tube 31 having a predetermined diameter in the process of manufacturing the heat sink 30c, and the outside thereof It is a configuration formed so that the air flows through the metal tube 31 to cover the molten heat sink (30c) material.

In this configuration, as shown in Fig. 5B, at least one or more ventilation grooves 32d are formed on a corresponding surface on which at least two or more are superimposed, and these ventilation grooves 32d each have a plate member 30d. It may be formed in a configuration that is formed as a passage through which air flows in the bonding process.

As shown in FIG. 6, the air passage H formed as described above has an inlet 36 and an outlet 38 communicating with the above-described air passage H at predetermined portions of the heat sinks 30a, 30b, 30c, and 30d. Is formed into a flow circuit of air having

The inlet 36 and the outlet 38 are formed at an extended portion so that the corner portions of the heat sinks 30a, 30b, 30c, and 30d can be supported and fixed to the frame 40, and the inlet 36 is a panel ( 12) and the outlet 38 is preferably formed to be located above.

On the other hand, as shown in Figure 6, the double-sided tape 26 for attaching the heat sink (30a, 30b, 30c, 30d) to the panel 12 has a plurality of flexible printed circuit boards (extended and connected to the panel 12) Between 22, as shown in FIG. 7, the double-sided tape 26a adhered to the rear case 18 formed of a metallic material, and the extended double-sided tape 26a transfers the heat generated from the panel 12 to the rear case 18. Will be inverted.

According to this configuration, the heat sink (30a, 30b, 30c, 30d) is sufficiently cooled in the process of air flows through the air passage (H) formed in the heat sink (30a, 30b, 30c, 30d) heat conduction or air flow The convection causes the cooling efficiency of the plasma display panel 12 to be increased.

6 and 7, the double-sided tape 26a is formed to extend between the flexible printed circuit boards 22, and both ends thereof are connected to the surface of the rear case 18 formed of a metal material. As the heat generated in the panel 12 by the tape 26a is conducted to the rear case 18, the cooling efficiency can be further increased.

On the other hand, in addition to the above-described configuration, in the configuration shown in Fig. 8, the heat-dissipating plates 30a, 30b, 30c, and 30d having the air passages H on the rear surface of the panel 12 are formed of an insulating double-coated tape 26 having high thermal conductivity. The circuit board 14 is again attached to the back surface of the heat sinks 30a, 30b, 30c, and 30d thus attached by double-sided tapes 26 and 26a as described above, and is attached to the back surface of the circuit board 14 again. Another heat sink 30e that performs the same function as the heat sinks 30a, 30b, 30c, and 30d described above is spaced apart from each other to form a flow path of air with the space block 58 at the edge of the circuit board 14.

In addition, each of the above-described double-sided tapes 26 and 26a extends between the flexible printed circuit boards 22 and is connected to the rear case 18 made of metal, and the panel 12 and the circuit board 14 and each of In the frame 40 supporting and fixing the heat sinks 30a, 30b, 30c, 30d, and 30e, a duct 48 communicating with the above-described air passage H in a conventional manner is formed, and the duct 48 At the end, a blower member 50 is formed to force air to flow through the air passage H described above.

According to this configuration, the air forcedly flowing through the air passage (H) by the blower member 50 is not directly in contact with the panel 12 and the circuit board 14, so that dust is formed in each component having high voltage. Is more effectively cooled without dust collection.

Meanwhile, in the heat dissipation device configuration of the plasma display panel according to another embodiment of the present invention, as shown in FIG. Vent holes 54a and 54b are formed.

In the upper portion of the vent hole (54a) formed on the upper side of the rear case 52 of the vent holes (54a, 54b) formed in this way, the ventilated shape extending from the inside to the outer upper direction so as to easily discharge the air inside A rib 56a is formed, and the ventilation rib 56a induces the flow of air to the outside and at the same time serves to block the inflow of dust and the like from the outer upper side of the rear case 52.

In addition, an outer upper portion of the vent hole 54b formed at the lower side of the rear case 52 is provided with a ventilation rib 56b protruding from the inside to the outer lower direction so that low temperature external air can be easily introduced therein. The rib 56b induces air flow to the inside and at the same time serves to block the inflow of dust and the like from the outside of the rear case 52.

On the other hand, the configuration of the circuit board of the plasma display panel according to another embodiment of the present invention, as shown in Figure 10, the plurality of circuits that allow the flow of air to the excess portion where the circuit of the circuit board 42 is not formed The heat dissipation port 44 is formed.

The cooling efficiency of the circuit board 42 is improved in the process of flowing air on the front and rear surfaces of the circuit board 42 through the heat dissipation hole 44 formed as described above.

On the other hand, in the heat sink structure of the plasma display panel according to another embodiment of the present invention, instead of the double-sided tape for bonding the plasma display panel and the heat sink, an adhesive resin having good heat dissipation characteristics is used, and as described above, The adhesive resin may be filled in the groove portion of the uneven portion to substantially increase the volume of the heat dissipation structure.

According to the embodiment of the present invention described above, since the air passage is formed on the heat sink attached to the plasma display panel, the flowing air is not in direct contact with the panel and the circuit board, thereby preventing dust collection phenomenon. By improving the cooling efficiency due to the flow of air has an effect that each component constituting the plasma display panel performs a stable function in terms of reliability and performance.

While the embodiments of the present invention have been described in detail with reference to the accompanying drawings, the present invention is not limited thereto, and the present invention may be variously modified and changed without departing from the spirit or the field of the present invention. It will be readily apparent to those of ordinary skill in the art.

Claims (13)

The plasma display panel 12 connected to the mutually flexible printed circuit board 22 and the circuit board 14 for driving the same are supported by the front and rear cases 16 and 18 and the frame 20 so as to be spaced at regular intervals. A plasma display panel in which a metal heat sink 28 is attached to the back surface of the plasma display panel 12 between the plasma display panel 12 and the circuit board 14 by an insulating double-coated tape 26 having a high thermal conductivity. In the radiator of At least one air passage (H) is formed on the heat sinks (30a, 30b, 30c) to directly contact the rear surface of the panel (12) with air. The air passage (H) of claim 1, wherein air is flowable by being adhered by the double-sided tape (26) on the opposite surface of the heat sink (30a) corresponding to the back surface of the plasma display panel (12). At least one ventilation groove (32a) formed as a passage is formed. The heat dissipation plate 30b of claim 1, wherein the heat dissipation plate 30b corresponding to the rear surface of the plasma display panel 12 is bent at least one or more times, and the heat dissipation plate 30b is formed on the double-sided tape 26. Ventilation groove (32b) portion is formed by being bent by being bonded by a) is formed as a passage that allows the flow of air, the curved shape of the back surface of the heat sink (30b) is characterized in that it is formed to perform a cooling fin function Heat dissipation device for plasma display panel. The method of claim 1, wherein the air passage (H) is disposed at least one metal tube 31 having a predetermined diameter in the process of manufacturing the heat sink (30c) and covered with a heat sink (30c) material outside the metal tube ( 31) is configured to form a passage through which air flows. According to claim 1, wherein the air passage (H) is formed by the heat sink (30c) at least two or more plate members are bonded to each other, at least one or more ventilation grooves (32c) on the opposing surface of each plate member bonded to each other ) Is formed to form a passage through which the air flows by the ventilation grooves (32c) are bonded to each other. 5. The circuit board 14 is formed at an edge portion of the double-sided tape 26 or the heat sink 30b with respect to the curved heat sink 30b adhered to the plasma display panel 12. The heat dissipation device of the plasma display panel characterized in that the coupling is formed of a space block (58) of a predetermined shape to maintain a predetermined interval is formed therebetween as a passage through which air flows. The air passage (H) according to any one of claims 1 to 5, wherein the heat dissipation plates (30a, 30b) are adhered to the plasma display panel 12 by the double-sided tape (26) or the heat dissipation plate (6). The air flow circuit having an air inlet 36 on one side and an outlet 38 on the other side to guide the flow of air through the ventilation grooves 32a, 32b, and 32c formed on the 30c. Heat dissipation device for plasma display panel. The air passage (H) according to any one of claims 1 to 5, wherein the heat dissipation plates (30a, 30b) are adhered to the plasma display panel 12 by the double-sided tape (26) or the heat dissipation plate (6). It is formed of an air flow circuit having an air inlet 36 on one side and an outlet 38 on the other side to guide the flow of air through the ventilation grooves 32a, 32b, 32c formed on the 30c. A duct 48 is formed on the inlet 36 and the outlet 38 so as to communicate with each other, and the end of the duct 48 is supported by the rear case 18 to induce the flow of air. Radiating device of the plasma display panel, characterized in that the blowing member (50) is installed. The plasma display panel 12 and the circuit boards 14 and 42 for driving the plasma display panel 12 and the circuit boards 14 and 42 are supported by the front and rear cases 16 and 18 and the frame 20 so as to be spaced at regular intervals. A heat insulating plate 28 connected to the plasma display panel 12 and an insulating double-coated tape 26 having high thermal conductivity on the back surface of the plasma display panel 12 between the board and the circuit board 14 to increase cooling efficiency. In the heat radiation device of the plasma display panel is attached, The double-sided tape 26a extends and bonds to the rear case 18 through each of the flexible printed circuit boards 22 to conduct heat generated in the plasma display panel 12 to the rear case 18. The heat dissipation device of the plasma display panel. The plasma display panel 12 and the circuit board 14 for driving the plasma display panel 12 are supported by the front and rear cases 16 and 18 and the frame 20 so as to be spaced at regular intervals, and are connected to each other by the flexible printed circuit board 22. The heat dissipation plate 28 is attached to the back surface of the plasma display panel 12 between the plasma display panel 12 and the circuit board 14 by an insulating double-coated tape 26 having high thermal conductivity to increase cooling efficiency. In the heat dissipation device of the display panel, An air passage H is formed on the heat sinks 30a, 30b, and 30c to directly contact the rear surface of the panel 12, and the circuit board 42 is formed on the back surface of the heat sinks 30a, 30b, and 30c. ) Is bonded to the double-sided tape 26 so as to share the cooling efficiency by the air passage, thereby forming an air passage H identical to the function of the air passage, and forming an air passage (H) on the opposite rear surface of the circuit board 14. The heat dissipation plate 30d having the H) is spaced apart from the space block 58 so as to be maintained at a predetermined interval, and at least one cooling fin 46 is formed at a portion exposed to the outside of the heat dissipation plate 30d. A duct 48 is formed on the frame 40 to communicate with the air passage H, and an air blowing member 50 for inducing the flow of air through the air passage H is formed at an end of the duct 48. ) Is installed in the plasma display panel Thermal unit. Front and rear cases 16 and 18 that cover the outer portion, including a frame 20 that supports the plasma display panel 12 and the circuit board 14 connected to the flexible printed circuit board 22 at a predetermined interval from each other. In the heat dissipation device of the plasma display panel is provided, a plurality of ventilation means penetrating the inner and the outer side is formed on the rear surface of the rear case 18, The plurality of vent holes 54a formed through the rear upper portion of the rear case 52 are formed to be inclined from the lower side to the upper side of the outside to facilitate the discharge of internal air having heat, and the vent holes 54 are outside. The upper portion of the periphery of the ventilation ribs 56a for inducing the direction of the air discharged and preventing the inflow of dust from the upper upper side is formed, a plurality of vents penetrating through the lower portion of the rear surface of the rear case 52 ( 54b) is formed to be inclined from the lower side of the outside to the upper side of the inside to facilitate the introduction of low temperature outside air, and to facilitate the introduction of external low temperature air into the upper portion of the outer periphery of the vent hole 54b. At the same time, the plasma display, characterized in that the ventilation ribs 56b for blocking the inflow of dust from the outside upper side is formed extended Heat shield of the panel. The plasma display panel 12 is driven by a flexible printed circuit board 22 that is supported by the plasma display panel 12, the front and rear cases 16 and 18, and the frame 20 at a predetermined interval from each other. In the circuit board of the plasma display panel, And at least one heat dissipation hole (44) through which air can flow through an excess portion of the circuit formed to drive the plasma display panel (12). The plasma display panel 12 connected to the mutually flexible printed circuit board 22 and the circuit board 14 for driving the same are supported by the front and rear cases 16 and 18 and the frame 20 so as to be spaced at regular intervals. Plasma display formed by attaching a metal heat sink 28 with an insulating adhesive resin 26 having high thermal conductivity on the back surface of the plasma display panel 12 between the plasma display panel 12 and the circuit board 14. In the heat dissipation device of the panel, And the heat sink includes at least a concave-convex portion, and at least partially fills in the groove portion of the concave-convex portion, thereby increasing an adhesive area and increasing the volume of the heat dissipation structure.