KR20000065880A - Thermoelectric cooler/heater modules manufacture with metal plates - Google Patents

Abstract

PURPOSE: A method for manufacturing a thermoelectric cooling and heating module using a metal substrate is provided to improve an operation characteristic of a thermoelectric cooling and heating module by emitting rapidly Peltier heat and Joule heat generated from a module. CONSTITUTION: A method for manufacturing a thermoelectric cooling and heating module using a metal substrate comprises the step of emitting Peltier heat and Joule heat generated from a module within a short time by using a metal plate with high thermal conductivity instead of an existing ceramic substrate. On one side face of the metal substrate, an electric insulating layer for enduring a breakdown voltage more than 2000V is formed by mixing an epoxy resin and an inorganic matter filter.

Description

Thermoelectric cooler / heater modules manufacture with metal plates

The present invention relates to a method for manufacturing a thermoelectric cold / heating device using a metal substrate. The present invention supplements the problems of weak thermal conductivity and mechanical shock of a thermoelectric cold / heating device using a conventional ceramic substrate. -Fast dissipation of Paltier and Joule heat of the junction generated in the device by replacing the upper and lower double-sided boards for the organization of the chips with a high thermal conductivity metal board instead of the conventional ceramic board. The present invention relates to a method for manufacturing a thermoelectric cold / heat device that can improve the efficiency of the thermoelectric cold / heat device and resist a shock.

The thermoelectric cold / heat device using the metal substrate according to the present invention has a high thermal conductivity, and thus heat dissipation at the high temperature side is fast. In the case of alumina ceramics, which is a conventional high thermal conductivity electrical insulating material, its thermal conductivity is 25 (W / m ° C.) or less. In the case of used metal substrates such as aluminum and turalumine, the thermal conductivity varies slightly depending on the material, but it is about 200 (W / m ℃), so it shows 8 times higher thermal conductivity than ceramics.

A method of manufacturing a thermoelectric cold / heat element using a metal substrate according to the present invention will be described in a schematic manner. The thermal conductivity is high in a binder mainly made of epoxy-based resin on one side of a metal substrate (aluminum, copper, turallumin, etc.). Inorganic filler is mixed and 50 ~ 150㎛ coating is used to form an electric insulation film with breakdown voltage over 2000V. A copper foil having a thickness of about 100 to 300 µm is bonded to the upper surface of the film, and then a pattern necessary for the surface of the moving foil is processed by a printing etching method to form a metal substrate. When the two completed metal substrates are fixed up and down by sandwiching N-chips and P-chips in a sandwiched manner, a thermoelectric cold / heat device using the metal substrate of the present invention is completed.

Hereinafter, the manufacturing method of the thermoelectric cold element of the present invention will be described in detail with reference to the drawings. In the manufacturing of the metal substrate 2 in FIG. And pressurize it at a pressure of 40-60kg / ㎠ and heat-treat it for 1.5-3 hours with 500 ℃ hot. After slowly cooling the heat-treated metal plate, the surface of the metal plate was coated with 80-120 μm of the electrical insulating film 4 shown in Fig. 1-B, but the pre-prepared resin solution was in-still and then 500-2000 RPM. After spreading by rotating centrifugal force to form a thin film, the electrical insulation film having high flexibility and coping resistance to thermal expansion of metal plate and breakdown voltage of 2000V or more is formed, and then it is calcined by heat of about 180-280 ℃ and then made of the same material for the second time. An electrical insulating film was formed by the same process, but using the adhesive force of the binder to form the film, the copper foil thickness shown in Fig. 1-1B was pressed at about 100-300 μm and heat-treated again at 180-280 ° C. do. After printing the necessary pattern on the metal substrate made by the above-described method, it is processed by etching method, and then the metal substrate 2, shown in Fig. 1-1a, is placed on the jig. Assemble the conductor lead piece, press it with a pressure plate, and then hot-treat it, separate it from the jig mold, print it with a solder on Paste, and put it back in another jig. 3) After assembling in the form of sandwich and heating it to a predetermined temperature by pressing plate which is jig, Solder of previously printed paste is melt-deposited and the lead wire is attached to the soldered thermoelectric cold element 1a of FIG. The product of thermoelectric cold element is completed.

An object of the present invention is to provide a top and bottom substrate for the tissue arrangement of the N-Chip and P-Chip constituting the thermoelectric cold / hot element in order to solve the weakness of the thermal conductivity and mechanical shock caused by the problems of the conventional ceramic thermoelectric cold / hot element By replacing metal plates with high thermal conductivity instead of conventional ceramics boards, it can quickly release Joule heat generated from the device, which increases the efficiency of thermoelectric devices, and provides thermoelectric devices that are resistant to mechanical shock. It is an object of the present invention.

The structure of the conventional thermoelectric element is printed on the upper and lower ceramic plates of two sheets with a conductive material, and then fired and aged in a kiln, and soldered uniformly on the printed pattern. It is completed by cutting the conductive plate made of copper to be a pattern and fixing it to the printed surface, fixing it on the printed surface, arranging N-chip and P-chip in a sandwich form, and then fixing them. However, the above-described manufacturing method has to be dependent on labor-intensive manual labor, which results in inconsistent quality and problems in mass production, resulting in high manufacturing costs. Also, heat dissipation generated in cold and warm devices, low efficiency due to thermal conductivity, and mechanical shock. It is fragile and there are problems in mass production.

The present invention has been invented to solve the above-described problems, the heat transfer conductor of 50-150㎛ insulation coating material that can withstand high voltage by using aluminum, turallumin, etc., the thermal conductivity is more than 8 times compared to the ceramic substrate After mixing and coating the materials, the invention is invented a thermoelectric cold / heat device using a metal substrate having excellent electrical insulation and heat dissipation by arranging N, P-Chips in a sandwich form and fixing them to a substrate.

1: 1a: A sectional view of a perspective view 1b: 1a of a thermoelectric device

2: Thermal conductivity characteristic diagram of thermoelectric cold and hot element according to the present invention

3: Relationship between high temperature side heat dissipation and maximum temperature difference of thermoelectric cold / heat element according to the present invention

4: Heat resistance curve of the thermoelectric cold and hot element insulating film according to the present invention

5: Breakdown voltage curve at the temperature rise of the insulating film of the thermoelectric cold and hot element according to the present invention

6 is a peel strength curve diagram of the insulating film of the thermoelectric cold and hot element according to the present invention

<Description of the code | symbol about the principal part of drawing>

2: metal substrate 3: N, P-chip 4: electrical insulation film 5: copper foil

Referring to the method of manufacturing a thermoelectric cold element according to the present invention in detail with reference to the drawings in the first production of a metal substrate, such as aluminum, turallumin, the metal substrate 2 shown in Figure 1-1 by cutting to a predetermined dimension After laminating the layers by inserting the diaphragm at regular intervals, pressurize at 40-60kg / ㎠ and heat-treat at 400-600 ℃ in the kiln. On the heat-treated metal sheet, an electric insulation film (4) as shown in Fig. 1-1b is formed to about 100 µm, and a resin solution, which is an insulating material, is deposited, and then diffused with a centrifugal force of 500-2000 RPM to form a thin film to cope with thermal expansion. Once an insulating film with high electrical conductivity and thermal conductivity of about 2000V is formed, it is sintered with heat of about 180-280 ° C, and secondly, an insulating material of epoxy-based resin of paste phase is formed in the same manner as the above-described primary insulating film. Let's do it. Using the adhesive force of the secondary insulating film, 100-300 μm of the copper foil 5 shown in Fig. 1-1 was compressed and heat-treated at 180-280 ° C., and then the necessary pattern was printed and etched on the copper foil 5 surface. do.

Next, put the jig into a jig doll, assemble the connecting lead piece, press it with a pressurized flat plate, heat-treat it, separate it from the mold, print it with a solder on Paste, and put it in the jig. Then, put N, P-Chip (3) as shown in Fig. 1-1b. After assembling and assembling in sandwich type, press the plate again and press it again, heat it to a predetermined temperature, solder it, separate it from the jig, and solder the lead wire to complete the product.

If described in detail an embodiment of the manufacturing method for the present invention described above

<Example 1>

Composition ratio of components of electrical insulating film

Epoxy sheet: 22-26%

Polyethylene Polyamine: 2.8-3.8%

Dibutyl Puthalat (Alcohol Type): 5-6%

Mixing temperature: room temperature

Mixing time: 24 hours

<Example 2>

Phthaly straight: 6.5-8.5%

Dimethylputalate: 3-4%

ED-6 rosin: 20-30%

<Example 3>

Thermal conductive filler manufacturing method

Alumina Al ₂ O ₃ : 10-12%

Berylium-Oxid: 15-18%

Aluminum-nitride: 3.5-5%

Magnesium-Oxid: 3-4%

Mixing temperature: 160-180 ℃

Mixing time: 1.5-2.5 hours

<Example 4>

Electrical insulation film formation method

A predetermined amount of the coating solution material is deposited on one surface of the metal substrate 2 shown in FIGS. ) On the rotating disc. The rotational speed of the rotating plate is about 500-2000RPM, and the rotational speed and the thickness of the insulating film have a correlation. That is, if the rotational speed is high, the coating film is heat-treated with a heat of about 180-280 ° C., and then secondly cooted by the same solution and method to complete the electrical insulating film 4 shown in Fig. 1-1B. At this time, the copper foil (5) prepared in FIG. 1-1 prepared in advance is subjected to surface bonding using the adhesive force of the insulating coating of the second coating in thickness of about 100-300 μm, and then compressed at a pressure of about 40-60 kg / cm 2. Heat treatment to a temperature of about 180-250 ℃. The metal substrate 2 manufactured as described above has a thermal conductivity of 200 (W / m ° C.), and the thermoelectric cold / heat device using the same has about a thermal conductivity of 25 times (W / m ° C.) of the alumina ceramic substrate, which is a conventional high thermal conductivity electrical insulating material. It will have a thermal efficiency. It rapidly releases the Peltier and Joule heat generated at the junction of the thermoelectric elements, which greatly improves the efficiency of the thermoelectric elements. The copper foil is a pattern for the passage of current. The heat generated by the current is also suppressed to double the effect of the thermoelectric element. In Figure 3, heat dissipation The effect on temperature difference between low and high temperature is shown.

<Example 5>

In the thermal conductivity diagram of the thermoelectric elements shown in FIG. 2, the point (A) is the case of a conventional ceramic substrate and the dotted line (B) is a thermoelectric element using a new aluminum substrate. ) The heat dissipation of the junction at the high temperature side depends on the heat dissipation conditions (heat sink, surface area, air volume), but it shows an increase of about 22% compared to the thermoelectric cold / heat element using ceramics.

<Example 6>

As a heat resistance curve for the insulating film of the thermoelectric cold and hot element shown in FIG. 4, a special filler having high thermal conductivity is mixed with an resin based on a high heat-resistance epoxy resin on an aluminum substrate to an extremely low temperature of about 0.5 ° C./W. Low electrical resistive coating was formed, which appeared to be effective for high temperature heat release

<Example 7>

The breakdown voltage curve at the temperature rise of the insulating film of the thermoelectric cold / heat element shown in FIG. 5 shows stable operation even in FIGS. It was shown to be effective.

<Example 8>

The peel strength curve of the insulating film of the thermoelectric cold / heat element shown in FIG. 6 shows that the conductive copper foil due to the high heat resistance of the insulating film due to high heat during soldering and dipping under the long-term load state of the thermoelectric element shall not be peeled off. The peel strength test was performed as shown in Figs. 6-6A and 6B with the virtual set temperature 150 deg. C exceeding the maximum temperature in actual operation and 260 deg. C during soldering and dipping as 260 deg.

The present invention can improve the operating characteristics of the thermoelectric cold-temperature device by quickly dissipating Joule heat generated in the thermoelectric cold-temperature device, and can be applied to mass production by being resistant to mechanical shock of the substrate, thus increasing the range of use throughout the industry. It is expected to have a profound effect on the cold and hot industry of the Freon system, which is the main cause of air pollution.

Claims (8)

By replacing metal plates with high thermal conductivity instead of conventional ceramic substrates, the Peltier heat and Joule heat generated in the device can be released quickly. Method of manufacturing the device. Efoxy Resin is mainly mixed on one side of metal substrate (aluminum, copper plate, turalumin, etc.) and Binder, which has high thermal conductivity and inorganic filler, is coated with 50-150㎛ thickness for breakdown voltage over 2000V. A method of manufacturing a thermoelectric cold / hot element using a metal substrate, characterized in that to form an electrical insulating film. After bonding a copper foil having a thickness of about 100-300 μm to the upper surface of the film according to claim 2, the pattern required for the copper foil surface is treated by a printing etching method. Manufacturing method of cold and hot element In the manufacture of the metal substrate 2 in Figure 1a, after cutting the metal substrate to a predetermined dimension after inserting a layer layer of the lamination (Lamination) and pressing it at a pressure of about 40-60kg / ㎠ about 500 ℃ Method for manufacturing a thermoelectric cold element using a metal substrate, characterized in that the heat treatment for about 1.5-3 hours hot. 、 After slowly cooling the metal plate heat-treated in the above-mentioned paragraph 4, coat 80-120 μm of the electrical insulating film 4 shown in Fig. 1-1B on one surface of the metal plate, and in-still the pre-prepared resin solution. Fabrication of thermoelectric cold / heat element using metal substrate, characterized by the fact that it is diffused by rotational centrifugal force of 500-2000RPM to form a thin film, and electrical insulation film with high insulation and thermal conductivity with a breakdown voltage of 2000V or higher is formed. Way. The process treated in the above 5 is fired by heat of about 180-280 ° C., and then an electric insulating film is formed by the same method as the second process using the adhesive force of the binder, which is the film, as shown in FIGS. A method of manufacturing a thermoelectric cold / hot element using a metal substrate, wherein the foil is pressed to about 100-300 μm and heat-treated again with a heat of 180-280 ° C. Put the metal substrate (2) shown in Fig. 1-1 into the mold of the jig, assemble the conductor lead piece, press it with the pressure plate, and then hot-treat it, and print it with a paste on the paste separated from the jig. 1, the solder paste on the previously printed paste is deposited and soldered while the N and P chips 3 shown in FIG. A method of manufacturing a thermoelectric cold / heat device using a metal substrate, characterized in that the lead wire is attached to the thermoelectric cold / heat device (1a). Alumina Al ₂ O ₃ (10-12%), Berylium-Oxid (15-18%), Aluminum-nitride (3.5-5%), Magnesium-Oxid (3-4%) ), A mixing temperature (160-180 ℃), the mixing time (1.5-2.5 hours) characterized in that the manufacturing method of thermoelectric cold and hot element using a metal substrate.