KR20000053601A - 폴리아미드 조성물 - Google Patents
폴리아미드 조성물 Download PDFInfo
- Publication number
- KR20000053601A KR20000053601A KR1020000003379A KR20000003379A KR20000053601A KR 20000053601 A KR20000053601 A KR 20000053601A KR 1020000003379 A KR1020000003379 A KR 1020000003379A KR 20000003379 A KR20000003379 A KR 20000003379A KR 20000053601 A KR20000053601 A KR 20000053601A
- Authority
- KR
- South Korea
- Prior art keywords
- polyamide
- acid
- nylon
- units
- weight
- Prior art date
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- 239000004952 Polyamide Substances 0.000 title claims abstract description 93
- 229920002647 polyamide Polymers 0.000 title claims abstract description 93
- 239000000203 mixture Substances 0.000 title claims abstract description 63
- 125000004427 diamine group Chemical group 0.000 claims abstract description 6
- 125000001142 dicarboxylic acid group Chemical group 0.000 claims abstract description 6
- 239000003063 flame retardant Substances 0.000 claims description 32
- -1 bromine compound Chemical class 0.000 claims description 25
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 24
- 125000003118 aryl group Chemical group 0.000 claims description 17
- 239000000945 filler Substances 0.000 claims description 12
- KKEYFWRCBNTPAC-UHFFFAOYSA-N terephthalic acid group Chemical group C(C1=CC=C(C(=O)O)C=C1)(=O)O KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 11
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 10
- 229910052794 bromium Inorganic materials 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical group NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 claims description 8
- GAGWMWLBYJPFDD-UHFFFAOYSA-N 2-methyloctane-1,8-diamine Chemical group NCC(C)CCCCCCN GAGWMWLBYJPFDD-UHFFFAOYSA-N 0.000 claims description 7
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 4
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims description 4
- 150000003839 salts Chemical class 0.000 claims description 4
- 235000002906 tartaric acid Nutrition 0.000 claims description 4
- 239000011975 tartaric acid Substances 0.000 claims description 4
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical class OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 3
- LDPIQRWHBLWKPR-UHFFFAOYSA-N aminoboronic acid Chemical class NB(O)O LDPIQRWHBLWKPR-UHFFFAOYSA-N 0.000 claims 1
- 229920006012 semi-aromatic polyamide Polymers 0.000 abstract description 17
- 239000004677 Nylon Substances 0.000 abstract description 6
- 229920001778 nylon Polymers 0.000 abstract description 6
- 229920003189 Nylon 4,6 Polymers 0.000 abstract description 3
- 229920002292 Nylon 6 Polymers 0.000 abstract description 3
- 229920002302 Nylon 6,6 Polymers 0.000 abstract description 3
- 239000004953 Aliphatic polyamide Substances 0.000 abstract description 2
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 abstract description 2
- 229920000571 Nylon 11 Polymers 0.000 abstract description 2
- 229920000299 Nylon 12 Polymers 0.000 abstract description 2
- 229920000305 Nylon 6,10 Polymers 0.000 abstract description 2
- 229920000572 Nylon 6/12 Polymers 0.000 abstract description 2
- 229920003231 aliphatic polyamide Polymers 0.000 abstract description 2
- 229920001577 copolymer Polymers 0.000 abstract description 2
- 239000012778 molding material Substances 0.000 abstract description 2
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 abstract description 2
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 48
- 150000001875 compounds Chemical class 0.000 description 17
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 12
- 239000004793 Polystyrene Substances 0.000 description 11
- 229920002223 polystyrene Polymers 0.000 description 11
- 238000012360 testing method Methods 0.000 description 11
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 10
- 239000000835 fiber Substances 0.000 description 10
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical class [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 8
- 239000007789 gas Substances 0.000 description 8
- 239000003365 glass fiber Substances 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 8
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 7
- 229920006287 phenoxy resin Polymers 0.000 description 7
- 239000013034 phenoxy resin Substances 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- 239000004744 fabric Substances 0.000 description 6
- 239000012765 fibrous filler Substances 0.000 description 6
- 238000001746 injection moulding Methods 0.000 description 6
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 6
- 229920001955 polyphenylene ether Polymers 0.000 description 6
- 239000005711 Benzoic acid Substances 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 235000010233 benzoic acid Nutrition 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 5
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 4
- 229920000742 Cotton Polymers 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 4
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 4
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 4
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 4
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 4
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000013589 supplement Substances 0.000 description 4
- SZHOJFHSIKHZHA-UHFFFAOYSA-N tridecanoic acid Chemical compound CCCCCCCCCCCCC(O)=O SZHOJFHSIKHZHA-UHFFFAOYSA-N 0.000 description 4
- NSBGJRFJIJFMGW-UHFFFAOYSA-N trisodium;stiborate Chemical compound [Na+].[Na+].[Na+].[O-][Sb]([O-])([O-])=O NSBGJRFJIJFMGW-UHFFFAOYSA-N 0.000 description 4
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 4
- BNEMLSQAJOPTGK-UHFFFAOYSA-N zinc;dioxido(oxo)tin Chemical compound [Zn+2].[O-][Sn]([O-])=O BNEMLSQAJOPTGK-UHFFFAOYSA-N 0.000 description 4
- 241000202785 Calyptronoma Species 0.000 description 3
- HOKKHZGPKSLGJE-GSVOUGTGSA-N N-Methyl-D-aspartic acid Chemical compound CN[C@@H](C(O)=O)CC(O)=O HOKKHZGPKSLGJE-GSVOUGTGSA-N 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical class OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 3
- 239000004327 boric acid Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 150000002763 monocarboxylic acids Chemical class 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 230000000379 polymerizing effect Effects 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- 239000007858 starting material Substances 0.000 description 3
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 2
- DGZQEAKNZXNTNL-UHFFFAOYSA-N 1-bromo-4-butan-2-ylbenzene Chemical class CCC(C)C1=CC=C(Br)C=C1 DGZQEAKNZXNTNL-UHFFFAOYSA-N 0.000 description 2
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 2
- 239000005635 Caprylic acid (CAS 124-07-2) Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- MHZGKXUYDGKKIU-UHFFFAOYSA-N Decylamine Chemical compound CCCCCCCCCCN MHZGKXUYDGKKIU-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- 239000005639 Lauric acid Substances 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- REYJJPSVUYRZGE-UHFFFAOYSA-N Octadecylamine Chemical compound CCCCCCCCCCCCCCCCCCN REYJJPSVUYRZGE-UHFFFAOYSA-N 0.000 description 2
- 235000021314 Palmitic acid Nutrition 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- YVZATJAPAZIWIL-UHFFFAOYSA-M [Zn]O Chemical compound [Zn]O YVZATJAPAZIWIL-UHFFFAOYSA-M 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- QMKYBPDZANOJGF-UHFFFAOYSA-N benzene-1,3,5-tricarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=CC(C(O)=O)=C1 QMKYBPDZANOJGF-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 2
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000011152 fibreglass Substances 0.000 description 2
- KQNPFQTWMSNSAP-UHFFFAOYSA-N isobutyric acid Chemical compound CC(C)C(O)=O KQNPFQTWMSNSAP-UHFFFAOYSA-N 0.000 description 2
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 description 2
- 229960002446 octanoic acid Drugs 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 235000019260 propionic acid Nutrition 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229940071182 stannate Drugs 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- VLCLHFYFMCKBRP-UHFFFAOYSA-N tricalcium;diborate Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]B([O-])[O-].[O-]B([O-])[O-] VLCLHFYFMCKBRP-UHFFFAOYSA-N 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- KLNPWTHGTVSSEU-UHFFFAOYSA-N undecane-1,11-diamine Chemical compound NCCCCCCCCCCCN KLNPWTHGTVSSEU-UHFFFAOYSA-N 0.000 description 2
- 229940005605 valeric acid Drugs 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- BHSXLOMVDSFFHO-UHFFFAOYSA-N (3-ethylsulfanylphenyl)methanamine Chemical compound CCSC1=CC=CC(CN)=C1 BHSXLOMVDSFFHO-UHFFFAOYSA-N 0.000 description 1
- JVPKLOPETWVKQD-UHFFFAOYSA-N 1,2,2-tribromoethenylbenzene Chemical compound BrC(Br)=C(Br)C1=CC=CC=C1 JVPKLOPETWVKQD-UHFFFAOYSA-N 0.000 description 1
- BMSUWQXMTMGEOM-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-ethenylbenzene Chemical compound BrC1=C(Br)C(Br)=C(C=C)C(Br)=C1Br BMSUWQXMTMGEOM-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- LNETULKMXZVUST-UHFFFAOYSA-N 1-naphthoic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=CC2=C1 LNETULKMXZVUST-UHFFFAOYSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- GBURUDXSBYGPBL-UHFFFAOYSA-N 2,2,3-trimethylhexanedioic acid Chemical compound OC(=O)C(C)(C)C(C)CCC(O)=O GBURUDXSBYGPBL-UHFFFAOYSA-N 0.000 description 1
- JCUZDQXWVYNXHD-UHFFFAOYSA-N 2,2,4-trimethylhexane-1,6-diamine Chemical compound NCCC(C)CC(C)(C)CN JCUZDQXWVYNXHD-UHFFFAOYSA-N 0.000 description 1
- CYLVUSZHVURAOY-UHFFFAOYSA-N 2,2-dibromoethenylbenzene Chemical compound BrC(Br)=CC1=CC=CC=C1 CYLVUSZHVURAOY-UHFFFAOYSA-N 0.000 description 1
- WKRCUUPMCASSBN-UHFFFAOYSA-N 2,2-diethylbutanedioic acid Chemical compound CCC(CC)(C(O)=O)CC(O)=O WKRCUUPMCASSBN-UHFFFAOYSA-N 0.000 description 1
- FUOUDTGRVPBIDC-UHFFFAOYSA-N 2,2-diethylheptane-1,7-diamine Chemical compound CCC(CC)(CN)CCCCCN FUOUDTGRVPBIDC-UHFFFAOYSA-N 0.000 description 1
- BTUDGPVTCYNYLK-UHFFFAOYSA-N 2,2-dimethylglutaric acid Chemical compound OC(=O)C(C)(C)CCC(O)=O BTUDGPVTCYNYLK-UHFFFAOYSA-N 0.000 description 1
- QPIDRHUVWIFOBW-UHFFFAOYSA-N 2,2-dimethylhexane-1,6-diamine Chemical compound NCC(C)(C)CCCCN QPIDRHUVWIFOBW-UHFFFAOYSA-N 0.000 description 1
- CRTFIUQMLDPORS-UHFFFAOYSA-N 2,2-dimethyloctane-1,8-diamine Chemical compound NCC(C)(C)CCCCCCN CRTFIUQMLDPORS-UHFFFAOYSA-N 0.000 description 1
- FNAKEOXYWBWIRT-UHFFFAOYSA-N 2,3-dibromophenol Chemical compound OC1=CC=CC(Br)=C1Br FNAKEOXYWBWIRT-UHFFFAOYSA-N 0.000 description 1
- RMIUJCRSUIITNG-UHFFFAOYSA-N 2,3-dimethylbutane-1,4-diamine Chemical compound NCC(C)C(C)CN RMIUJCRSUIITNG-UHFFFAOYSA-N 0.000 description 1
- KEEWXLYVPARTPY-UHFFFAOYSA-N 2,3-dimethylheptane-1,7-diamine Chemical compound NCC(C)C(C)CCCCN KEEWXLYVPARTPY-UHFFFAOYSA-N 0.000 description 1
- DPQHRXRAZHNGRU-UHFFFAOYSA-N 2,4,4-trimethylhexane-1,6-diamine Chemical compound NCC(C)CC(C)(C)CCN DPQHRXRAZHNGRU-UHFFFAOYSA-N 0.000 description 1
- BSWWXRFVMJHFBN-UHFFFAOYSA-N 2,4,6-tribromophenol Chemical compound OC1=C(Br)C=C(Br)C=C1Br BSWWXRFVMJHFBN-UHFFFAOYSA-N 0.000 description 1
- AHBYWKWAVAMOMN-UHFFFAOYSA-N 2,4-diethylhexane-1,6-diamine Chemical compound CCC(CN)CC(CC)CCN AHBYWKWAVAMOMN-UHFFFAOYSA-N 0.000 description 1
- KSQSUDDRZLCKSW-UHFFFAOYSA-N 2,4-dimethylhexane-1,6-diamine Chemical compound NCC(C)CC(C)CCN KSQSUDDRZLCKSW-UHFFFAOYSA-N 0.000 description 1
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- ABPUBUORTRHHDZ-UHFFFAOYSA-N [4-(aminomethyl)-3-bicyclo[2.2.1]heptanyl]methanamine Chemical compound C1CC2(CN)C(CN)CC1C2 ABPUBUORTRHHDZ-UHFFFAOYSA-N 0.000 description 1
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- 239000003086 colorant Substances 0.000 description 1
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- 238000005034 decoration Methods 0.000 description 1
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- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
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- TVQLLNFANZSCGY-UHFFFAOYSA-N disodium;dioxido(oxo)tin Chemical compound [Na+].[Na+].[O-][Sn]([O-])=O TVQLLNFANZSCGY-UHFFFAOYSA-N 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- FPIQZBQZKBKLEI-UHFFFAOYSA-N ethyl 1-[[2-chloroethyl(nitroso)carbamoyl]amino]cyclohexane-1-carboxylate Chemical compound ClCCN(N=O)C(=O)NC1(C(=O)OCC)CCCCC1 FPIQZBQZKBKLEI-UHFFFAOYSA-N 0.000 description 1
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- PWSKHLMYTZNYKO-UHFFFAOYSA-N heptane-1,7-diamine Chemical compound NCCCCCCCN PWSKHLMYTZNYKO-UHFFFAOYSA-N 0.000 description 1
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- HYQBVSXBLGKEDT-UHFFFAOYSA-N hexane-1,4-diamine Chemical compound CCC(N)CCCN HYQBVSXBLGKEDT-UHFFFAOYSA-N 0.000 description 1
- BBPXVYVXKAYBSS-UHFFFAOYSA-N hexane-2,5-diamine Chemical compound CC(N)CCC(C)N BBPXVYVXKAYBSS-UHFFFAOYSA-N 0.000 description 1
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- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- ABMFBCRYHDZLRD-UHFFFAOYSA-N naphthalene-1,4-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1 ABMFBCRYHDZLRD-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- WPUMVKJOWWJPRK-UHFFFAOYSA-N naphthalene-2,7-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=CC2=CC(C(=O)O)=CC=C21 WPUMVKJOWWJPRK-UHFFFAOYSA-N 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- ZWLPBLYKEWSWPD-UHFFFAOYSA-N o-toluic acid Chemical compound CC1=CC=CC=C1C(O)=O ZWLPBLYKEWSWPD-UHFFFAOYSA-N 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical class [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- SVHOVVJFOWGYJO-UHFFFAOYSA-N pentabromophenol Chemical compound OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br SVHOVVJFOWGYJO-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- IUGYQRQAERSCNH-UHFFFAOYSA-N pivalic acid Chemical compound CC(C)(C)C(O)=O IUGYQRQAERSCNH-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
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- 229920003056 polybromostyrene Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- GGHDAUPFEBTORZ-UHFFFAOYSA-N propane-1,1-diamine Chemical compound CCC(N)N GGHDAUPFEBTORZ-UHFFFAOYSA-N 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 229940079864 sodium stannate Drugs 0.000 description 1
- BMENBXQCFCSBAQ-UHFFFAOYSA-N sodium;oxido(dioxo)-$l^{5}-stibane Chemical compound [Na+].[O-][Sb](=O)=O BMENBXQCFCSBAQ-UHFFFAOYSA-N 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 125000000446 sulfanediyl group Chemical group *S* 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- NFMWFGXCDDYTEG-UHFFFAOYSA-N trimagnesium;diborate Chemical compound [Mg+2].[Mg+2].[Mg+2].[O-]B([O-])[O-].[O-]B([O-])[O-] NFMWFGXCDDYTEG-UHFFFAOYSA-N 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/02—Halogenated hydrocarbons
- C08K5/03—Halogenated hydrocarbons aromatic, e.g. C6H5-CH2-Cl
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
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Abstract
Description
폴리아미드용 출발 물질 | 폴리아미드 | |||||||
디카복실산 성분 | 디아민 성분 | 말단-차단제 | 제한점도[η] (dl/g) | 말단차단율(%) | ||||
화합물 | 양(mol) | 화합물 | 양(mol) | 화합물 | 양(mol) | |||
참조실시예1 | TA | 19.60 | NMDA/MODA | 17.0/3.0 | BA | 0.80 | 1.04 | 90 |
참조실시예2 | TA | 19.60 | NMDA/MODA | 17.0/3.0 | BA | 0.60 | 1.30 | 92 |
참조실시예3 | TA/IA | 14.0/6.0 | HMDA | 20.0 | BA | 0.20 | 1.01 | 43 |
실시예1 | 실시예2 | 실시예3 | 실시예4 | 실시예5 | 실시예6 | 실시예7 | 실시예8 | 실시예9 | 실시예10 | 실시예11 | |
폴리아미드 | 참조실시예1 | 참조실시예2 | 참조실시예3 | 참조실시예1 | 참조실시예2 | 참조실시예1 | 참조실시예2 | 참조실시예1 | 참조실시예1 | 참조실시예1 | 참조실시예3 |
난연제(양)1) | A(45) | B(45) | A(45) | C(75) | C(75) | D(52) | D(52) | A(45) | E(45) | F(75) | C(75) |
난연 보조제(양)1) | a(7) | b(7) | a(7) | a(10) | a(10) | a(7) | a(7) | c(10) | a(7) | a(10) | a(10) |
유리 섬유(양)1) | (75) | (75) | (75) | (90) | (90) | (80) | (80) | (75) | (75) | (90) | (90) |
내열성(℃) | 440 | 439 | 430 | 435 | 434 | 437 | 437 | 418 | 439 | 420 | 426 |
성형물 외관 | 양호 | 양호 | 양호 | 양호 | 양호 | 양호 | 양호 | 양호 | 양호 | 양호 | 양호 |
드룰드 수지 용융물양(g) | 0.08 | 0.17 | 0.12 | 0.05 | 0.01 | 0.05 | 0.01 | 0.11 | 0.25 | 0.30 | 0.10 |
난연제 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 |
금형 부식 | 변화없음 | 변화없음 | 변화없음 | 변화없음 | 변화없음 | 변화없음 | 변화없음 | 변화없음 | 변화없음 | 변화없음 | 변화없음 |
비교실시예1 | 비교실시예2 | 비교실시예3 | 비교실시예4 | 비교실시예5 | 비교실시예6 | 비교실시예7 | 비교실시예8 | 비교실시예9 | |
폴리아미드 | 참조실시예1 | 참조실시예3 | 참조실시예1 | 참조실시예1 | 참조실시예1 | 참조실시예3 | 참조실시예1 | 참조실시예1 | 참조실시예1 |
난연제(양)1) | A(45) | A(45) | A(45) | B(45) | - | C(85) | A(45) | A(45) | A(45) |
난연 보조제(양)1) | d(7) | d(7) | e(7) | - | a(50) | d(7) | f(7) | g(7) | f+g(3.5+3.5) |
유리 섬유(양)1) | (75) | (75) | (75) | (80) | (75) | (95) | (75) | (75) | (75) |
내열성(℃) | 379 | 370 | 2) | 392 | 440 | 362 | 420 | 407 | 415 |
성형물 외관 | 불량(흑색화) | 불량(흑색화) | 2) | 불량(흑색화) | 양호 | 불량(흑색화) | 양호 | 불량(흑색화) | 불량(흑색화) |
드룰드 수지 용융물의 양(g) | 2.1 | 3.5 | 2) | 2.5 | 0.01 | 2.7 | 2.1 | 0.6 | 1.9 |
난연제 | V-0 | V-0 | 2) | V-2 | V-2 | V-0 | V-0 | V-0 | V-0 |
금형 부식 | 적갈색화 | 적갈색화 | 2) | 갈색화 | 변화없음 | 갈색화 | 변화없음 | 갈색화 | 변화없음 |
Claims (5)
- (A) 폴리아미드 100 중량부, (B) 방향족 환-포함 브롬 화합물 10 내지 200 중량부 및 (C) 주석산의 금속염 및 붕산의 알칼리 토금속염중에서 선택된 하나 이상의 난연 보조제 0.1 내지 100 중량부를 함유하는 폴리아미드 조성물.
- 제1항에 있어서, 폴리아미드 (A)가 (a) 테레프탈산 단위의 함량이 60 내지 100 mol%인 디카복실산 단위 및 (b) C6-18 지방족 알킬렌디아민 단위의 함량이 60 내지 100 mol%인 디아민 단위를 함유하는 폴리아미드 조성물.
- 제2항에 있어서, 지방족 알킬렌디아민 단위가 1,9-노난디아민 단위, 2-메틸-1,8-옥탄디아민 단위 또는 이들 모두인 폴리아미드 조성물.
- 제1항 내지 제3항중 어느 한 항에 있어서, 폴리아미드(A) 100중량부에 대해 0.1 내지 200 중량부의 충전제 (D)를 추가로 함유하는 폴리아미드 조성물.
- 제1항 내지 제4항중 어느 한 항에 따른 폴리아미드 조성물로 제조된 성형물.
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JP2141399 | 1999-01-29 | ||
JP99-21413 | 1999-01-29 |
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KR20000053601A true KR20000053601A (ko) | 2000-08-25 |
KR100368511B1 KR100368511B1 (ko) | 2003-01-24 |
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KR20000003379A KR100368511B1 (ko) | 1999-01-29 | 2000-01-25 | 폴리아미드 조성물 |
Country Status (9)
Country | Link |
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US (1) | US6258927B1 (ko) |
EP (1) | EP1024171B1 (ko) |
KR (1) | KR100368511B1 (ko) |
CN (1) | CN1122084C (ko) |
AT (1) | ATE238390T1 (ko) |
CA (1) | CA2296171C (ko) |
DE (1) | DE60002236T2 (ko) |
SG (1) | SG87882A1 (ko) |
TW (1) | TWI243840B (ko) |
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US8933154B2 (en) | 2012-12-27 | 2015-01-13 | Cheil Industries Inc. | Flame retardant thermoplastic resin composition and molded article including the same |
KR20200057160A (ko) | 2018-11-15 | 2020-05-26 | 주식회사 엘지화학 | 난연 폴리아미드 수지 조성물의 제조방법 및 이를 포함하는 성형품의 제조방법 |
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Publication number | Priority date | Publication date | Assignee | Title |
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Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3829400A (en) * | 1971-05-28 | 1974-08-13 | Toray Industries | Flame retardant polyamide fiber composition using oxy-tin compounds and process for the preparation thereof |
JPS5432457B2 (ko) * | 1972-06-16 | 1979-10-15 | ||
US4564650A (en) * | 1983-12-22 | 1986-01-14 | Allied Corporation | Flame retardant amine terminated polyamide composition |
GB9016555D0 (en) * | 1990-07-27 | 1990-09-12 | Alcan Int Ltd | Fire-retardant compositions |
KR100219796B1 (ko) * | 1991-12-31 | 1999-10-01 | 폴 루르 | 열가소성 수지 조성물 |
CA2137477C (en) | 1993-12-24 | 2002-05-07 | Hideaki Oka | Polyamide and polyamide composition |
JPH10168311A (ja) * | 1996-10-08 | 1998-06-23 | Unitika Ltd | 難燃性ポリアミド樹脂組成物 |
US6207745B1 (en) * | 1998-02-04 | 2001-03-27 | Bp Amoco Corporation | Flame retardant anti-drip polyamide compositions |
PT960907E (pt) * | 1998-05-22 | 2003-12-31 | Kyowa Chem Ind Co Ltd | Composicao de resina termoplastica retardada da chama |
-
1999
- 1999-12-29 SG SG9906663A patent/SG87882A1/en unknown
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- 2000-01-04 TW TW089100048A patent/TWI243840B/zh not_active IP Right Cessation
- 2000-01-17 CA CA002296171A patent/CA2296171C/en not_active Expired - Lifetime
- 2000-01-25 KR KR20000003379A patent/KR100368511B1/ko active IP Right Grant
- 2000-01-27 DE DE60002236T patent/DE60002236T2/de not_active Expired - Lifetime
- 2000-01-27 EP EP00101281A patent/EP1024171B1/en not_active Expired - Lifetime
- 2000-01-27 AT AT00101281T patent/ATE238390T1/de not_active IP Right Cessation
- 2000-01-28 CN CN00101910A patent/CN1122084C/zh not_active Expired - Lifetime
- 2000-01-31 US US09/494,046 patent/US6258927B1/en not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2009084800A1 (en) * | 2007-12-28 | 2009-07-09 | Cheil Industries Inc. | Flameproof thermoplastic resin composition and method for preparing the same |
KR101004668B1 (ko) * | 2007-12-28 | 2011-01-04 | 제일모직주식회사 | 난연성 열가소성 수지 조성물 및 그 제조방법 |
US8367754B2 (en) | 2007-12-28 | 2013-02-05 | Cheil Industries Inc. | Flameproof thermoplastic resin composition and method for preparing the same |
US8933154B2 (en) | 2012-12-27 | 2015-01-13 | Cheil Industries Inc. | Flame retardant thermoplastic resin composition and molded article including the same |
KR20200057160A (ko) | 2018-11-15 | 2020-05-26 | 주식회사 엘지화학 | 난연 폴리아미드 수지 조성물의 제조방법 및 이를 포함하는 성형품의 제조방법 |
Also Published As
Publication number | Publication date |
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EP1024171A1 (en) | 2000-08-02 |
US6258927B1 (en) | 2001-07-10 |
CA2296171C (en) | 2004-02-03 |
KR100368511B1 (ko) | 2003-01-24 |
DE60002236D1 (de) | 2003-05-28 |
DE60002236T2 (de) | 2004-02-19 |
CN1263910A (zh) | 2000-08-23 |
TWI243840B (en) | 2005-11-21 |
SG87882A1 (en) | 2002-04-16 |
CN1122084C (zh) | 2003-09-24 |
CA2296171A1 (en) | 2000-07-29 |
ATE238390T1 (de) | 2003-05-15 |
EP1024171B1 (en) | 2003-04-23 |
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