KR20000012207U - High density semiconductor bulb - Google Patents

Abstract

The present invention relates to a semiconductor light bulb applied by a semiconductor light source, such as L.D. (LED), and more particularly, the shape of the PCB is configured to have a three-dimensional structure, so that the semiconductor light source is high density Of course, the present invention relates to a high-density semiconductor light bulb having a three-dimensional structure that can be applied to a structure (arm socket) of a conventional filament bulb without changing its structural shape.

The purpose of the present invention is to construct a PCB shape as a three-dimensional structure, to increase the density of the semiconductor light source and to make the semiconductor light source have a direct angle at various angles. Simultaneously, the present invention provides a high-density semiconductor light bulb having a three-dimensional structure that can be applied to a structure (arm socket) of a conventional filament bulb without changing its structural shape.

As a specific means of the present invention for achieving the above object;

As a polygonal body, a plurality of pin fixing holes are formed on the outer circumference, and a plurality of light source installation holes are formed so that a semiconductor light source is coupled and fixed, and a power supply unit is formed as a polygonal body having the same shape as the top plate. The bottom plate as a P. C. B. is provided with a plurality of pin fixing holes by supplying an external power supply by the fixing pin of the fixing pin and the fixing pin of the socket fixing pin and the solder pad of the socket coupling portion. The upper and lower plates are connected to each other to be oriented at various angles. The fixing pins of the upper and lower plates are coupled to the power supply fixing pins to connect the upper and lower plates. And a three-dimensional structure consisting of a plurality of side plates as PCBs in which a plurality of light source installation holes are formed to couple and fix the semiconductor light source. Is achieved hameuroseo ratio.

Description

High Density Semiconductor Bulb with Three-dimensional Structure

The present invention relates to a semiconductor light bulb to which a semiconductor light source, such as L.D. (LED), is applied. More specifically, the shape of the PCB has a three-dimensional structure. Of course, the present invention relates to a high density semiconductor bulb having a three-dimensional structure that can be applied to a structure (arm socket) of a conventional filament bulb without changing its structural shape.

In general, a light bulb is widely used as a signal means for lighting a room or applying light (e.g., a traffic light, an aircraft induction lamp, etc.), and such a light bulb is mainly used for a filament light bulb using light generated by flowing a current to a high temperature. In recent years, due to the short lifespan and low luminance of the filament bulb, a light bulb using a semiconductor light source (LED, etc.) is in practical use.

Such a semiconductor bulb has a higher luminous efficiency than a filament bulb, can operate in direct current and alternating current, has a low power consumption, and can reduce maintenance costs due to long life due to its small size and light weight.

As the conventional semiconductor light bulb 100 configured as shown in FIG. 1 has a planar shape, in order to integrate many light sources due to the integration limit of semiconductor light sources in the same area and space, the amount of P. Since the area must be large, excessive manufacturing cost is required, and as the above-mentioned shape of P. C. becomes flat, the semiconductor light source fixedly coupled to the P. C. ratio emits light only in a certain direction. It was to have a structural problem that the lighting efficiency is reduced by the limitation of the orientation angle.

In addition, in order to apply the conventional semiconductor bulb 100 having such a structure as an existing filament bulb, there was another problem of separately installing a new apparatus suitable for this.

Therefore, the present invention was devised to solve the general problems of the above-described conventional semiconductor bulb,

The object of the present invention is to construct the shape of the PCB as a three-dimensional structure, to increase the density of the semiconductor light source, and to realize a high brightness, high brightness efficiency products by having a semiconductor light source having a direct angle at various angles At the same time, to provide a high-density semiconductor bulb having a three-dimensional structure that can be applied to the structure (female socket) of the existing filament bulb without changing the structural shape.

As a specific means of the present invention for achieving the above object;

As a polygonal body, a plurality of pin fixing holes are formed on the outer circumference, and a plurality of light source installation holes are formed so that a semiconductor light source is coupled and fixed, and a power supply unit is formed as a polygonal body having the same shape as the top plate. The bottom plate as a P. C. B. is provided with a plurality of pin fixing holes by supplying an external power supply by the fixing pin of the fixing pin and the fixing pin of the socket fixing pin and the solder pad of the socket coupling portion. The upper and lower plates are connected to each other to be oriented at various angles. The fixing pins of the upper and lower plates are coupled to the power supply fixing pins to connect the upper and lower plates. And a three-dimensional structure consisting of a plurality of side plates as PCBs in which a plurality of light source installation holes are formed to couple and fix the semiconductor light source. Is achieved hameuroseo ratio.

1 is a block diagram of a conventional semiconductor light bulb

2 is a partially exploded perspective view of a high-density semiconductor bulb having a three-dimensional structure according to the present invention

3 is a cross-sectional view of a high-density semiconductor bulb having a three-dimensional structure according to the present invention

4 is a perspective view showing a state in which a protective case is applied in the semiconductor bulb according to the present invention

5a and 5b is a configuration diagram showing another embodiment of the external power supply means in the high-density semiconductor bulb having a three-dimensional structure according to the present invention

6 is a three-dimensional view showing another three-dimensional structure in the semiconductor bulb according to the present invention

7 is a cross-sectional view of a semiconductor light bulb according to another three-dimensional structure of the present invention

<Explanation of symbols for major parts of drawing>

DESCRIPTION OF SYMBOLS 1 Semiconductor bulb 2 Upper plate 3,3 'Lower plate 4,4' Side plate

5,5 ', 5 ": Power supply fixing pin 6: Semiconductor light source 7: Power converter 8: Protective case

9: Power supply plate 21,36,41,41 ': Light source installation hole 22,33,33', 42,42 ', 42 ": Pin fixing hole

31,91: Socket 32: Socket fixing pin 34: Solder pad 35,92: Power supply

51,51 ': Terminal 321: Pin fixture R: Resistance C: Female connector Y: Wire

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Figure 2 is a partially exploded perspective view of a high-density semiconductor bulb having a three-dimensional structure according to the present invention, Figure 3 is a cross-sectional view of the coupling of a high-density semiconductor bulb having a three-dimensional structure, Figure 4 is a protective case applied to the high-density semiconductor bulb having a three-dimensional structure 5A and 5B are schematic views showing another embodiment of an external power supply means in a high density semiconductor light bulb having a three-dimensional structure according to the present invention, and FIG. 6 is a semiconductor light bulb according to the present invention. In, is a three-dimensional view showing another three-dimensional structure, Figure 7 is a cross-sectional view of a semiconductor bulb according to another three-dimensional structure of the present invention, looking at its configuration;

As a plate-shaped body that takes a polygonal body, a top plate 2 including a plurality of light source mounting holes 21 and pin fixing holes 22, and the socket plate pin 32 having the same shape as the top plate 2, The lower plate 3 is coupled to the socket 31 and the plurality of pin fixing holes 33 are formed, and the upper and lower plates 2 and 3 are connected and fixed by the power supply fixing pin 5 to install a plurality of light sources. It consists of a plurality of side plates 4 on which balls 41 are formed.

At this time, the top plate 2 composed of a polygonal body is a conventional PCB, that is, a plurality of light source mounting holes 21 are configured to be fixed to the semiconductor light source 6 as a printed circuit board,

The shape of the upper plate 2 is preferably configured as an octagonal body such that the side plate 4 to be described later to have various angles of orientation, the semiconductor light source 6 is fixed to the light source mounting hole 21 is a lamp It is preferable to apply a type of light emitting diode, and such a lamp type light emitting diode includes a pair of lead attaches and two or three leads connected to a die pad, and is formed by a fixing means such as soldering together with a resistor (R). It is coupled to the upper surface of the upper plate (2) as a dog is to emit light according to the energization of the external power, as shown in Figure 2 so that the power supply fixing pin (5) to be described later to the outer circumference of the octagonal body It is desirable to construct a plurality of circular pinned holes 22 in at least eight directions.

In addition, the lower plate 3 is a printed circuit board having an octagonal shape having the same shape as the upper plate 2 described above, as shown in FIGS. 2 to 3. At the time of fixing the connection of 2, 3, the side plate 4 is configured to be at least wider than the top plate 2 so as to have an inclination angle. Is formed, the bottom of which is configured by being coupled to the ordinary socket 31 for supplying external power by the socket fixing pin 32,

In this way, the power supply of the semiconductor light bulb by the socket 31 is a terminal composed of the center vertex of the socket 31 and the terminal composed of the socket 31 body itself, as shown in Figure 3, each socket fixing pin ( 32 is connected to the lower plate 3, which is a printed circuit board by the pin fixture 321 and the solder pad 34, and is coupled to the side plate 4 and the upper plate 2 through a power supply fixing pin 5 to be described later. The power is supplied to the semiconductor light source 6,

In this way, the power supply unit 35 on the lower plate 3 that supplies power to the semiconductor light source 6 may decompress and rectify (3-5 volts (V)) external power to suit the semiconductor light source 6 as necessary. It is also possible to install a conventional power conversion device (7) consisting of a transformer, a rectifier circuit and a smoothing capacitor electrically connected to each other.

In addition, the side plate 4, which is a connecting means of the upper and lower plates 2 and 3, has a trapezoidal shape as shown in FIG. 2, the upper side of which is the same length as one side of the upper plate 2 described above. The bottom side is formed as the same length as one side of the lower plate 3 described above, and is a printed circuit board formed by forming a plurality of light source mounting holes 41 so that the semiconductor light source 6 and the resistance is fixedly coupled,

Such side plates 4 are configured in eight of the same shape and are fixedly coupled to the octagonal sides of the upper and lower plates 2 and 3 taking the octagonal body. The pin fixing holes 42 are formed in the same shape and position as the pin fixing holes 22 and 33 of the upper and lower plates 2 and 3 as the upper and lower center portions of the upper and lower plates. By fixing by fitting to the upper and lower plates (2, 3) is a fixed coupling is made.

At this time, the power supply fixing pin (5) is a form as shown in Figure 2 when the upper, lower, side plate (2, 3, 4) when fitting the fitting pins (22, 33, 42) It is composed of a pair of terminals 51 and 51 'which are bent to be applied as a fixed coupling means of each of the plates 2, 3 and 4, and also through the pair of terminals 51 and 51'. (+) And (-) electrodes of 3 and 4 are connected by junction.

Thus, looking at the bonding state of the high-density semiconductor bulb (1) having a three-dimensional structure according to the present invention having the configuration as described above;

As shown in FIG. 3, first, the fixing means such as soldering the semiconductor light source 6, which is a lamp-type light emitting diode, to the light source mounting holes 21 and 41 of the upper plate 2 and the plurality of side plates 4, respectively. Fixedly coupled to the central portion of the lower plate 3 by fixing the socket 31 by the socket fixing pin 32, and abutting each side of the upper plate 2 and the upper side of the side plate 4, The power supply fixing pins 5 are fitted into the pin fixing holes 22, 33, and 42 on the plates 2, 3, and 4 while the sides of the lower plate 3 are brought into contact with the lower sides of the side plates 4, respectively. The assembly is completed by combining.

At this time, in the upper, lower, side plates (2, 3, 4) assembled by the power supply fixing pin (5), each power supply fixing pin (5) connecting the lower plate 3 and the side plate (4) One side of the terminal 51 is electrically connected to the pin fixture 321 of the socket fixing pin 32, respectively, and the other terminal 51 'of each power supply fixing pin 5 is the solder pad 34 Is preferably electrically connected.

In addition, as described above, each side plate 4, which is a means for connecting the upper and lower plates 2 and 3, is fixed in an inclined form in the eight directions of the side walls of the upper and lower plates 2 and 3, thereby providing different three-dimensional orientation angles. Will have

Therefore, the semiconductor bulb 1 according to the present invention, the combination is completed as described above is used as a means of illuminating the room at home and factories, etc. as a substitute for the existing filament bulb, or a traffic signal and an aircraft induction lamp which is a signal means applying light As applied to,

This can be used by fitting the socket is coupled to the bottom of the lower plate as a cowcket used by fitting the conventional filament bulb is no need for the installation of a separate device.

At this time, when the semiconductor bulb 1 according to the present invention is applied to general use (home use, factory use, etc.), as shown in FIG. It is preferable to prevent the lead of the LEDs fixed to the upper panel 2 and the respective side plates 4 from bending or breaking the printed circuit board due to the external impact caused by the user's handling around the user.

When separate cases such as traffic lights and aircraft guidance lamps are configured, the protective case 8 can be used without the configuration. Thus, in the case of applying the semiconductor bulb 1 according to the present invention as a signal means, each is separate. Since the power supply is controlled by the control box, it is possible to exclude the power converter 7 selectively installed on the lower plate.

Thus, when the semiconductor light bulb 1 according to the present invention, which is applied to a general purpose or a signal means, is screwed with a socket, the positive pole (+) of the external power transmitted from the socket is composed of a terminal composed of a vertex of the socket 31 and the like. Each side plate 4 and the top plate 2 through one side terminal of the power supply fixing pin 5 for fixing the lower plate 3 and the side plate 4 by the pin fixing tool 321 of the socket fixing pin 32 to be joined The cathode (-) is transferred to the semiconductor light source (6), and the semiconductor light source of each side plate (4) and the upper plate (2) through the other terminal of the power supply fixing pin (5) electrically connected to the solder pad 34 It is delivered to (6) is to emit a lamp-type light emitting diode which is a semiconductor light source (6) fixedly coupled to the upper plate (2) and each side plate (4),

The light emission of the light emitting diodes can transmit light of the light emitting diodes in various directions by various angles of direction of the top plate 2 and each side plate 4, and the top plate 2 and the side plate 4 have a three-dimensional structure. As the semiconductor light source 6 can be fixedly installed as much as it is combined, it is possible to realize a high brightness semiconductor light bulb according to the high integration of the semiconductor light source 6,

In particular, when applied as a signal means, due to the series and parallel structure of the semiconductor light source 6, even if a failure occurs in some light-emitting diodes, only part of the light off, so that it can perform the basic functions of its own safety The overall dimension is taken into consideration.

In addition, the upper, lower, side plates (2, 3, 4) coupled as a three-dimensional structure as described above can be configured to have a three-dimensional structure of a polygonal body including a rectangular body as necessary.

On the other hand, Figure 5a and 5b is another embodiment of the socket 31 which is a supply means for supplying external power in the semiconductor bulb 1 according to the present invention,

5A shows a female connector C electrically connected to the semiconductor light source 6 at the bottom of the lower plate 3 instead of the socket 31 fixed by the socket fixing pin 32 to the bottom of the lower plate 3. ), And the external power is supplied by the male connector (C) and the male connector that is engaged with the female connector (C). 5B is a form in which a plurality of wires Y terminals are electrically connected to the bottom surface of the lower plate 3 so that external power is supplied by the wires Y. By configuring the supply form of the power supply in the form of a connector (C) or a wire (Y) it is possible to expand the range of use of the semiconductor bulb (1) according to the present invention.

In addition, Figure 6 is another embodiment of the three-dimensional structure of the semiconductor bulb (1 ') according to the present invention,

This constitutes a plurality of semiconductor light sources (6) by constructing the light source installation hole 36 and the pin fixing hole 33 'with the upper surface of the lower plate 3' which takes the octagon without the configuration of the upper plate 2 as shown. Lamp type light emitting diode) is fixedly coupled, and the bottom surface of the lower plate 3 'has the same shape as that of the lower plate 3', and has a socket 91 coupled by a socket fixing pin to an external power supply means. The power supply plate 9 is fixedly coupled to the pin-shaped hole 33 'of the lower plate 3' by the rod-shaped power supply fixing pin 5 ".

The plurality of side plates 4 'fixedly coupled to the outer circumference of the lower plate 3' by the power supply fixing pin 5 'includes a plurality of light source installation holes 41' and a pin fixing hole 42 '. Take the trapezoidal shape in which the semiconductor light source 6 is fixedly coupled to the bottom surface, unlike the above-described embodiment, the length of the upper side is longer than the length of the bottom side contacting the lower plate 3 'and the lower plate 3' Take the shape of lampshade when the combination of the side plate (4 ') and the side plate (4') is securely fixed by the fixed coupling of the power supply fixing pin (5 ') through a separate pin fixing hole (42 ") In being configured while letting

It has the same electrical connection state as that of the embodiment, i.e., the electrical connection state by the socket 91 and the power supply fixing pin 5 ", but the light emitting diode, which is the semiconductor light source 6, is formed inside to be emitted by the light emitting diode. Since only a limited portion of the light is illuminated without being dispersed, it can be easily used where a concentrated light is needed, and the solid-state semiconductor bulb 1 ′ according to another embodiment of the present invention is required. According to the configuration of the protective case (8) or take a polygonal body including a rectangular body, as well as the socket 91, which is a supply means of the external power supply can be used in the form of connector (C) and wire (Y) As shown in FIG. 7, the above-described power converter 7 is installed as the power supply unit 92 of the power supply plate 9 so that external power is reduced and rectified to be suitable for the semiconductor light source 6. That can be A.

As described above, the high-density semiconductor light bulb having a three-dimensional structure according to the present invention has excellent luminous efficiency, low power consumption, small size, light weight, and low maintenance cost due to long life. By combining the C. ratio as a three-dimensional structure, as the direction angle of the semiconductor light source is configured in several directions, the lighting efficiency can be improved and the semiconductor light source can be highly integrated on the P.C. As it does not require a separate device by applying the socket form or the connector and wire form of the existing bulb as it is easy to use as it is a very useful design for producers and users.

Claims (6)

The top plate 2 as a P. C. rain, which is formed of a plurality of pin fixing holes 22 on the outer circumference as a polygonal body, and a plurality of light source mounting holes 21 are formed to couple and fix the semiconductor light source 6, As the polygonal body having the same shape as the top plate 2, the power supply unit 35 is constituted by the socket fixing pin 32, the conventional socket 31 which is an external power supply means is fixed and coupled to the socket fixing pin 32 The lower plate 3 as a P. C. ratio, which is supplied with external power by the pin fixing tool 321 and the solder pad 34, which are fixing means, is formed with a plurality of pin fixing holes 33, As the fixing means for connecting the upper plate (2) and the lower plate (3) is composed of a plurality of to have a direct angle at various angles and a plurality of power supply fixed through the pin fixing holes (22, 33) of the upper and lower plates (2,3) Side plates 4 as PC ratios in which a plurality of light source mounting holes 41 are formed so that the pins 5 are coupled to each other and fixed to the outer circumference of the upper and lower plates 2 and 3 and the semiconductor light source 6 is coupled and fixed. A high density semiconductor bulb (1) having a three-dimensional structure, characterized in that consisting of). A power supply plate 9 as a PC, which is a polygonal body, which is fixed to the bottom of the ordinary socket 91, which is an external power supply means, and supplies external power by the power supply unit 92, and the power supply plate 9 It is coupled to the bottom by a plurality of power supply fixing pins 5 ", and the light source installation hole 36 is configured to couple the semiconductor light source 6 to the top surface, and the outer periphery of the plurality of pin fixing holes 33 '. ) Is formed of a plurality of bottom plate (3 ') as a P, C and a plurality of angles to have a direct angle at a plurality of angles through the pin fixing hole (33') of the lower plate (3 ') Side plates as PC ratios in which a plurality of light source mounting holes 41 'are formed so as to couple and fix each connection at the outer circumference of the lower plate 3' and the semiconductor light source 6 is fixed to the inner side by combining the 5 '. 4) the semiconductor light source 6 is composed of the inner side of the lower plate 3 'and the plurality of side plates 4'. High-density semiconductor light bulb (1 ') having a body structure. The high-density semiconductor bulb (1) having a three-dimensional structure according to claim 1 or 2, wherein a female connector (C) or a male connector is coupled to replace the sockets (31,91) as an external power supply means. One'). The high-density semiconductor bulb 1 (1 ') having a three-dimensional structure according to one of claims 1 to 2, characterized in that a plurality of wires (Y) are coupled to each other in place of the sockets (31, 91) as external power supply means. ). The high-density having a three-dimensional structure according to any one of claims 1 to 2, wherein the power supply units (35, 92) are provided with a conventional power converter (7) capable of decompressing and rectifying external power as necessary. Semiconductor bulb 1 (1 '). 3. A high density semiconductor light bulb (1) having a three-dimensional structure according to any one of claims 1 to 2, characterized in that a protective case (8) in the form of a glass hole for accommodating each plate joined as a three-dimensional structure is constructed.