KR19990073280A - Pb free solder reduced oxidation of Zn in Sn-Zn system - Google Patents
Pb free solder reduced oxidation of Zn in Sn-Zn system Download PDFInfo
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- KR19990073280A KR19990073280A KR1019990025547A KR19990025547A KR19990073280A KR 19990073280 A KR19990073280 A KR 19990073280A KR 1019990025547 A KR1019990025547 A KR 1019990025547A KR 19990025547 A KR19990025547 A KR 19990025547A KR 19990073280 A KR19990073280 A KR 19990073280A
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- 229910000679 solder Inorganic materials 0.000 title abstract description 41
- 230000003647 oxidation Effects 0.000 title abstract description 15
- 238000007254 oxidation reaction Methods 0.000 title abstract description 15
- 229910020994 Sn-Zn Inorganic materials 0.000 title description 10
- 229910009069 Sn—Zn Inorganic materials 0.000 title description 10
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 27
- 239000000956 alloy Substances 0.000 claims abstract description 27
- 238000002844 melting Methods 0.000 claims abstract description 17
- 230000008018 melting Effects 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 16
- 239000000203 mixture Substances 0.000 claims abstract description 9
- 229910002059 quaternary alloy Inorganic materials 0.000 claims description 3
- 229910002058 ternary alloy Inorganic materials 0.000 claims description 2
- 239000000155 melt Substances 0.000 claims 1
- 239000011701 zinc Substances 0.000 abstract description 27
- 238000005476 soldering Methods 0.000 abstract description 22
- 238000004519 manufacturing process Methods 0.000 abstract description 20
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract description 12
- 229910052725 zinc Inorganic materials 0.000 abstract description 12
- 238000005266 casting Methods 0.000 abstract description 11
- 239000002184 metal Substances 0.000 abstract description 9
- 229910052751 metal Inorganic materials 0.000 abstract description 9
- 229910017888 Cu—P Inorganic materials 0.000 abstract description 5
- 229910052738 indium Inorganic materials 0.000 abstract description 4
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052787 antimony Inorganic materials 0.000 abstract description 3
- 230000001681 protective effect Effects 0.000 abstract description 3
- 229910052797 bismuth Inorganic materials 0.000 abstract description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 7
- 238000005260 corrosion Methods 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 6
- 239000010949 copper Substances 0.000 description 4
- 229910000765 intermetallic Inorganic materials 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229910020830 Sn-Bi Inorganic materials 0.000 description 3
- 229910018728 Sn—Bi Inorganic materials 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- 229910020935 Sn-Sb Inorganic materials 0.000 description 2
- 229910008757 Sn—Sb Inorganic materials 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- YWEUIGNSBFLMFL-UHFFFAOYSA-N diphosphonate Chemical compound O=P(=O)OP(=O)=O YWEUIGNSBFLMFL-UHFFFAOYSA-N 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- DLYUQMMRRRQYAE-UHFFFAOYSA-N phosphorus pentoxide Inorganic materials O1P(O2)(=O)OP3(=O)OP1(=O)OP2(=O)O3 DLYUQMMRRRQYAE-UHFFFAOYSA-N 0.000 description 2
- 229910016331 Bi—Ag Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910020220 Pb—Sn Inorganic materials 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910009078 Sn—Zn—In Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 210000004185 liver Anatomy 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
본 발명은 전기 및 전자 제품용 무연 땜납의 제조에 관한 것으로, 더욱 상세하게는 땜납의 생산 가격을 줄이기 위해 주석에 저가의 Zn을 다량 함유하면서도 주석-아연(Sn-Zn)계 합금이 갖는 단점인 주조 및 납땜시의 아연산화를 방지할 수 있는 무연 땜납의 제조에 관한 것이다.The present invention relates to the production of lead-free solder for electrical and electronic products, and more particularly, to the tin-zinc (Sn-Zn) -based alloy containing a large amount of low-cost Zn in order to reduce the production cost of the solder The present invention relates to the production of lead-free solder that can prevent zinc oxidation during casting and soldering.
이를 위하여 본 발명은, 납을 함유하지 않는 다량의 아연을 함유한 Sn-Zn계 합금 땜납의 제조에 있어서, 소량의 In, Sb, Bi 등을 첨가해서 Sn-Zn계 합금의 공정온도인 198℃보다 6∼16℃가 낮은 범위의 융점을 갖도록 하여, 전기 및 전자제품의 납땜 공정에 제품제조 설비의 교체 없이 기존의 납땜 설비를 그대로 사용할 수 있는 온도범위인 182∼192℃의 융점을 가짐은 물론, 다량의 Zn을 함유한 땜납에서 나타나는 단점인 주조 시나 납땜 시에 용탕 위에 다량으로 발생하는 아연의 산화에 따른 드로스(dross)를 거의 생기지 않게 하여 줌으로써 납땜 공정 중에 용탕의 조성을 일정하게 해주고 상기 땜납의 주조 및 납땜 시에 아연의 산화를 방지하는 보호피막을 형성하기 위하여 Cu-P계 마스터합금을 소량 첨가하여 표면의 산화에 의한 부식이 없고 젖음성이 뛰어난 땜납의 제조가 그 특징이다.To this end, the present invention, in the production of Sn-Zn-based alloy solder containing a large amount of zinc that does not contain lead, by adding a small amount of In, Sb, Bi, etc., the process temperature of Sn-Zn-based alloy is 198 ℃ It has a melting point of 6 to 16 ° C lower, and has a melting point of 182 to 192 ° C, which is a temperature range in which the existing soldering equipment can be used as it is without replacing the product manufacturing equipment in the soldering process of electric and electronic products. In this case, the composition of the molten metal is kept constant during the soldering process by minimizing dross due to the oxidation of zinc generated on the molten metal during casting or soldering, which is a disadvantage in solders containing a large amount of Zn. A small amount of Cu-P-based master alloy is added to form a protective film to prevent oxidation of zinc during casting and soldering. The manufacture of the its features.
Description
본 발명은 납을 포함하지 않는 땜납의 제조법에 관한 것으로, 더욱 상세하게는 무연 땜납의 생산 가격을 줄이기 위해 Sn에 저가의 Zn을 다량 함유하면서도 Sn-Zn계 합금이 갖는 단점인 주조 및 납땜시의 아연의 산화(ZnO)에 의한 땜납의 표면부식을 방지할 수 있는 무연 땜납의 제조에 관한 것이다.The present invention relates to a method for producing solder that does not contain lead, and more particularly, in order to reduce the production cost of lead-free solder, in the case of casting and soldering, which is a disadvantage of Sn-Zn-based alloys while containing a large amount of low-cost Zn in Sn. The present invention relates to the production of lead-free solder that can prevent surface corrosion of the solder due to zinc oxide (ZnO).
일반적으로 개발되고 있는 대표적인 주석기지 무연 땜납 합금 중에는, 첫 번째로는 현재 미국과 일본 등지의 외국에서 상용으로 사용되고 있는 Sn-Ag계로 융점이 220℃이상인 비교적 고온의 사용온도를 갖는 땜납이 있다.Among representative tin-based lead-free solder alloys that are generally developed, firstly, Sn-Ag based solders, which are currently used commercially in foreign countries such as the United States and Japan, have a relatively high use temperature with a melting point of 220 ° C or higher.
두 번째로는 Sn-Bi계가 많이 연구되고 있는데, Bi의 함량이 높으면서도 땜납의 제반특성을 만족시키는 땜납을 제조하기 위해 In, Ag등을 첨가한 삼원 및 사원계를 중심으로 많은 연구가 진행되고 있으며, 그 다음으로는 Sn-Sb계를 들 수 있으며 Sn-Bi계와 마찬가지 방법으로 이 합금계의 납땜 특성개선을 위해 연구 또한 많이 진행되고 있다.Secondly, many Sn-Bi systems have been studied, and many researches have been carried out mainly on ternary and quaternary systems with In, Ag, etc. added in order to manufacture solders that have high Bi content and satisfy various characteristics of the solder. Next, Sn-Sb-based and the like, Sn-Bi-based in the same way to improve the soldering properties of this alloy-based research has been much progress.
끝으로 많은 관심 속에서 연구가 진행되고 있는 합금계로는 본 발명과 관련한 Sn-Zn계 땜납이 있으며, 일반적으로 Zn의 함량이 10중량%미만인 합금계를 중심으로 집중적으로 연구 개발되고 있으며 가격 면에서 상기 합금계 땜납 중에서 가장 저렴한 것으로 알려져 있다.Finally, alloys that are being researched with great interest include Sn-Zn-based solders related to the present invention. In general, research is focused on alloys having a Zn content of less than 10% by weight. It is known to be the cheapest among the alloy-based solders.
그러나 상기의 합금계들 중에서 고온용이며 고가의 생산단가를 갖는 첫 번째의 경우를 제외하고는 어느 것도 아직 실용 면에서 문제점을 많이 가지고 있다.However, except for the first case of the high-temperature and expensive production cost among the above-described alloy systems, there are still many problems in practical use.
그 일례로 Sn-Bi계로서는 땜납의 연성 및 기계적 특성을 개선한 Sn-Bi-Ag계등이 있으나 가장 문제가 되는 것은 Bi가 수 중량%정도 들어간 이들 무연 땜납은 Cu 등의 모재와 반응에 의한 금속간화합물을 형성하여 젖음성 및 계면의 취성화에 따른 접착강도에 있어 아직 큰 문제점을 안고 있다.For example, Sn-Bi type is Sn-Bi-Ag type which improves the ductility and mechanical properties of the solder, but the most problematic is that these lead-free solders containing several percent by weight of Bi are reacted with a base metal such as Cu. There is still a big problem in the adhesive strength due to the formation of the liver compound, the wettability and brittleness of the interface.
그 다음의 Sn-Sb계는 좁은 융점대를 갖게 하기 위해 Zn을 수 중량%정도를 함유시킨 것이 많은데 이럴 경우 Sb3Zn라는 금속간 화합물을 만들어 땜납의 기계적 특성을 열화시키는 단점이 있으며, 이를 개선하기 위해 Ag를 수 중량% 함유시킬 경우 액상선의 온도만 증가하고 고상선의 온도는 변화가 거의 없어 고액구간이 너무 넓어서 사용에는 문제점이 아직 많이 남아 있다.In the following Sn-Sb system, Zn is contained in several wt% in order to have a narrow melting point. In this case, there is a disadvantage of deteriorating the mechanical properties of the solder by making an intermetallic compound called Sb 3 Zn. In order to contain a few wt% of Ag, only the temperature of the liquid line is increased and the temperature of the solid line is almost unchanged.
마지막에 설명된 Sn-Zn계의 경우는 전술한 바와 같이 가격이 저렴한 Zn을 사용할 수 있으므로 땜납의 단가를 내릴 수 있는 장점 외에 액상의 유동성이 우수하고, 열 피로에 강하며, 융점이 전자제품조립용에 사용이 가능할 정도로 적합하며, 고액구간이 좁은 등의 장점을 가지고 있는 반면에, Zn의 산화가 쉽게 일어나므로 주조 시나 납땜 시에 Ar분위기 등의 불활성 분위기의 유지가 필요하며 또한 이 산화물에 의해 젖음성이 크게 떨어지는 산화에 의한 부식이 큰 단점이며, 한번 산화된 ZnO의 환원은 1287℃이하에서는 1기압의 수소 분위기 하에서도 환원이 곤란하므로 Zn을 다량 함유한 땜납의 제조에는 아직 문제점이 남아있다.In the case of the Sn-Zn-based system described above, Zn can be inexpensive as described above. Therefore, in addition to lowering the cost of solder, the liquidity of liquid phase is excellent, and it is resistant to thermal fatigue. It is suitable enough to be used for the purpose and has the advantage of narrow narrow liquid section, while oxidation of Zn occurs easily, so it is necessary to maintain inert atmosphere such as Ar atmosphere during casting or soldering. Corrosion by oxidation, which is greatly degraded in wettability, is a major disadvantage, and reduction of ZnO once oxidized is difficult to reduce even under a hydrogen atmosphere of 1 atm under 1287 ° C. Therefore, there is still a problem in the production of solder containing a large amount of Zn.
본 발명은 Sn-Zn계 땜납이 갖는 상기와 같은 문제점을 해소하기 위해, 첫 번째로 저가인 아연을 10∼20중량%정도 함유한 주석-아연계 땜납의 제조에 있어서, 소량의 In, Sb, Bi, 등을 첨가해서 주석-아연계의 공정온도보다 6-16℃가 낮은 범위의 융점을 갖도록 하여, 전기 및 전자제품의 납땜공정에서 땜납 설비의 교체 없이 사용할 수 있는 온도범위인 182-192℃의 융점을 가진 무연 땜납의 제조방법을 제안하고자 한다.In order to solve the above problems of Sn-Zn-based solder, the present invention provides a small amount of In, Sb, in the production of tin-zinc-based solder containing about 10 to 20% by weight of zinc, which is inexpensive. By adding Bi, etc., it has a melting point in the range of 6-16 ℃ lower than the tin-zinc process temperature, so that it can be used in the soldering process of electric and electronic products without changing soldering equipment. A method for producing a lead-free solder having a melting point of is proposed.
또한, 두 번째로 주조시나 침적(dipping)납땜이나 프로우(flow)납땜 공정 중에 용탕 위에 다량으로 발생하는 아연의 산화에 따른 드로스(dross)를 거의 생기지 않게 하여 줌으로써 납땜 공정 중에 용탕의 조성을 일정하게 유지해 주고 상기 땜납의 주조 및 납땜 시에 아연의 산화를 방지하는 오산화인(P2O5)의 보호피막을 형성하여 표면부식이 방지되고 젖음성이 뛰어난 땜납의 제조하는데 본 발명의 목적이 있다.Secondly, the composition of the molten metal is fixed during the soldering process by hardly generating dross due to oxidation of zinc generated in a large amount on the molten metal during casting or during dipping soldering or flow soldering. It is an object of the present invention to form a protective film of phosphorus pentoxide (P 2 O 5 ), which is kept in a stable state and prevents oxidation of zinc at the time of casting and soldering of the solder, thereby preventing solder from surface corrosion and having excellent wettability.
이와 같은 목적을 달성하기 위한 본 발명은, 저가인 주석-아연계 땜납의 제조에 있어서 소량의 In, Bi, Sb등을 첨가해서 전기 및 전자제품의 납땜공정에 제품제조 설비의 교체 없이 사용할 수 있는 온도범위인 182-192℃의 융점을 갖게 하는 공정과, Sn-Zn계 합금의 주조시 땜납의 용탕 위에 나타나는 드로스가 일반 Pb-Sn땜납보다 3∼4배의 많으며 이 드로스가 점성이 높은 상태를 유지하므로 드로스의 제거시 다량의 다른 성분이 함께 빠져나가는 것을 방지하기 위해 Cu-P 마스터합금을 소량 첨가하여 드로스의 발생을 적극 억제하는 공정으로 이루어진 것이 특징이다.In order to achieve the above object, the present invention can be used in the manufacture of low-cost tin-zinc solder without adding a small amount of In, Bi, Sb, etc., without replacing the product manufacturing equipment in the soldering process of electrical and electronic products. In the process of having a melting point of 182-192 ° C in the temperature range, and the dross appearing on the molten metal of the solder during the casting of the Sn-Zn alloy, three to four times more than the general Pb-Sn solder, and the dross has a high viscosity. In order to prevent dross from being removed, a large amount of Cu-P master alloy is added to prevent dross from being removed.
이와 같은 목적을 달성하기 위한 본 발명은, Sn에 Zn을 10∼20중량%, In을 0.2∼4중량%, Sb를 0∼2중량%, Bi를 0∼0.8중량%로 혼합된 Sn-Zn-X의 삼원 혹은 사원 공정조성물로 이루어진다. 땜납의 조성을 이런 범위를 갖게 하므로서 전기 및 전자제품용 남땜 설비의 사용온도인 195℃이하의 온도범위인 180-192℃의 융점을 갖는 무연땜납을 제조할 수 있다.The present invention for achieving the above object, Sn-Zn mixed with 10 to 20% by weight Zn, 0.2 to 4% by weight In, 0 to 2% by weight Sb, 0 to 0.8% by weight Bi It consists of a three-way or employee fair composition of -X. By making the composition of the solder within this range, it is possible to produce lead-free solder having a melting point of 180-192 ° C., which is a temperature range of 195 ° C. or less, which is the use temperature of soldering equipment for electric and electronic products.
또한 상기의 삼원 혹은 사원 합금계에 Cu-10중량%P의 마스터 합금을 총 합금량의 0.1∼1중량%를 첨가해야만 본 발명에서 필요로 하는 목적의 무연땜납의 제조가 완료된다. 이는 주조시 땜납의 용탕 위에 다량으로 발생하는 아연의 산화에 따른 드로스의 생성을 방지해주며, 납땜 공정 중에 발생하는 드로스의 양을 크게 줄여 주므로서 용탕의 조성을 일정하게 유지해 주고 땜납 시에 아연의 산화를 방지하는 오산화인(P2O5)의 보호피막을 형성시켜 땜납부위의 표면부식이 방지되어 광택이 나고 젖음성이 뛰어난 땜납을 제조할 수 있다.In addition, the production of lead-free solder for the purpose required by the present invention is required only when 0.1 to 1% by weight of the total alloy amount of Cu-10% by weight P is added to the ternary or quaternary alloy system. This prevents the formation of dross due to the oxidation of zinc generated in large amounts on the molten solder during casting, and greatly reduces the amount of dross generated during the soldering process, thereby keeping the composition of the molten metal constant and the zinc during soldering. By forming a protective film of phosphorus pentoxide (P 2 O 5 ) to prevent oxidation of the surface of the solder to prevent surface corrosion, it is possible to manufacture a solder with excellent gloss and wettability.
상기 조성물은 Sn-Zn계 합금에 In을 첨가하면 융점 및 젖음성을 개선하기 위한 것이지만 In의 가격이 고가인 점이 문제이므로 사용량을 4중량%이하로 고정하였으며, 더욱 낮은 융점을 갖게 하기 위해서는 다른 제 사의 원소를 첨가하여 융점을 낮추기 위한 것이다.The composition is to improve the melting point and wettability when In is added to the Sn-Zn-based alloy, but since the price of In is a problem, the amount used is fixed to 4 wt% or less. The purpose is to add an element to lower the melting point.
또한 Sn-Zn계에 Sb를 첨가할 경우 용융온도 범위가 좁게 되는 장점을 가지고 있지만 Zn과의 금속간화합물은 피할 수 없으므로 Sb의 최대 첨가량을 2중량%로 고정하도록 하여 Sb3Zn의 생성량을 최소로 한 것이다.In addition, when Sb is added to Sn-Zn, the melting temperature range is narrowed, but the intermetallic compound with Zn is inevitable, so the maximum amount of Sb is fixed at 2% by weight to minimize the amount of Sb 3 Zn produced. I did it.
땜납의 융점을 낮게 하기 위해서는 Bi의 첨가도 효과적이지만 1중량% 이상이 되면 Sn-Zn-In 삼원계의 용융범위를 크게 하므로 최대 첨가량을 0.8중량%로 제한했다.In order to lower the melting point of the solder, the addition of Bi is also effective, but when it is 1 wt% or more, the melting range of the Sn-Zn-In ternary system is increased, so the maximum amount is limited to 0.8 wt%.
아연의 산화방지 및 드로스발생을 억제하기 위해 첨가되는 Cu-P 마스터합금은 Cu에 10중량%의 P를 갖는 마스터합금을 미리 제조한 것을 소량씩 분쇄하여 칭량하기 쉽고 소량 첨가가 용이하도록 준비한 것을 사용한다.The Cu-P master alloy added to prevent zinc oxidation and dross generation is prepared by preparing a master alloy having 10% by weight of P in Cu in small amounts to be easily weighed and easily added. use.
또한 10%의 P를 함유하고 있는 Cu-P 마스터합금의 사용은 최대 1중량%로 제한한 것은 P의 산화 방지효과는 총 합금량에 1O ppm이면 충분하며, Cu가 들어가면 항상 Cu와 침상형태의 금속간화합물을 만들며 이 금속간화합물이 계면에는 전혀 생기지 않지만 기지내에 너무 많이 생성 될 경우 땜납의 취성을 가져 올 수 있으므로 1%이상의 양을 첨가하는 좋지 않다.In addition, the use of Cu-P master alloy containing 10% of P is limited to 1% by weight at maximum. The antioxidant effect of P is only 10 ppm in the total alloy amount. It is not good to add more than 1% because it makes intermetallic compound and this intermetallic compound does not occur at the interface at all but too much in the matrix can lead to brittleness of solder.
주조의 방법은 아래와 같다.The method of casting is as follows.
우선 Sn을 먼저 용해시킨 후 마스터 합금을 필요량만큼 첨가하고 용탕의 온도를 700∼800℃로 올리고 용융 시간을 충분히 유지하여 한다.Firstly, Sn is first dissolved, and then a master alloy is added to the required amount.
이어 나머지 다른 합금 원소들을 첨가하기 시작하여 마지막으로 Zn을 첨가하는 순서를 따른다.Then start adding the other alloying elements and finally follow the order of adding Zn.
상기와 같은 순서를 따라야만 용탕의 균질성과 Zn의 산화를 최대한으로 방지할 수 있다. 이렇게 할 경우 미량 첨가된 Cu는 결정립 미세화제의 역할을 하며, P는 용탕 중의 산소와 결합하여 P2O5를 형성하고 이미 형성된 ZnO와는 액상의 복합산화물Only by following the above procedure, the homogeneity of the molten metal and the oxidation of Zn can be prevented to the maximum. In this case, a trace amount of added Cu acts as a grain refining agent, P combines with oxygen in the molten metal to form P 2 O 5 , and a liquid complex oxide with ZnO already formed.
(ZnOㆍP2O5)를 형성하므로 외부로부터 침입되는 산소에 의한 산화공정을 지연시키는 역할을 한다.Since it forms (ZnO.P 2 O 5 ), it plays a role of delaying the oxidation process by oxygen invading from the outside.
상기방법에 의한 제조공정에 따른 제반특성의 결과를 요약하면 표 1에서 보는 바와 같이 본 발명의 우수성을 알 수 있다.Summarizing the results of the various properties according to the manufacturing process according to the above method, as shown in Table 1, the superiority of the present invention can be seen.
표 1에 대한 보충설명은 다음과 같다. 상기한 각 항 중에서 젖음성 시험은 무산소 동판위에 0.4그램의 땜납을 올려 놓고 220℃에서 5초간 유지한 후 냉각한 것을 수직으로 절단한 면을 미세 연마한 후 금속현미경으로 촬영한 사진에 대한 접촉각의 비교한 것이다.Supplementary description of Table 1 is as follows. Among the above items, the wettability test was performed by comparing 0.4 g of solder on an oxygen-free copper plate and holding it at 220 ° C. for 5 seconds, and then comparing the contact angle with respect to the photograph taken with a metal microscope after finely grinding the surface cut vertically. It is.
내식성은 표면의 광택성 유무와 대기 중에서 1개월간 방치한 후의 광택변화로 비교한 것이다. 또한 융점범위는 고액구간의 상대크기로 비교하였으며, 불활성분위기의 필요 유무는 본 발명에서는 대기 중에서의 합금화와 솔더링을 행한 결과로서 표면상태가 양호함을 기준으로 한 것이며 다른 비교 발명조성은 표면 및 동판과 땜납 경계부에 아연등의 산화에 의한 흑색화 현상이 나타남을 비교한 것이다.Corrosion resistance is compared with the gloss of the surface and the change of gloss after being left in the atmosphere for 1 month. In addition, the melting point range was compared with the relative size of the solid-liquid range, and the necessity of the inert atmosphere is based on the good surface condition as a result of alloying and soldering in the air in the present invention. And blackening due to oxidation of zinc and the like at the solder boundary.
이상에서 상술한 바와 같이 본 발명은, 무연 땜납의 생산 가격을 줄이기 위해 Sn에 저가의 Zn을 다량 함유하면서도 전기 및 전자제품의 땜납 공정에 그대로 적용할 수 있는 정도의 융점과 용융범위를 갖는 사원계 합금조성물을 제조하고, 여기에 Cu-P 마스터합금을 소량 첨가하면 Sn-Zn합금계가 갖는 단점인 주조 및 납땜시의 아연산화를 방지할 수 있어 젖음성과 내식성이 우수한 땜납을 제조할 수 있는 것이다.As described above, the present invention, in order to reduce the production cost of lead-free solder, the present invention contains a large amount of low-cost Zn in Sn, but has a melting point and melting range that can be applied to the soldering process of electrical and electronic products as it is. When the alloy composition is prepared and a small amount of Cu-P master alloy is added thereto, zinc oxidation during casting and soldering, which is a disadvantage of the Sn-Zn alloy system, can be prevented, thereby producing solder having excellent wettability and corrosion resistance.
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