KR102708359B1 - Organic light emitting display device - Google Patents

Abstract

An organic light-emitting display device may include an opening region, a peripheral region surrounding the opening region, and a display region surrounding the peripheral region, and may include a substrate having a first groove formed in the peripheral region with a lower portion extended and an opening formed in the opening region, a light-emitting structure disposed in the display region on the substrate, a blocking structure disposed in the peripheral region on the substrate and surrounding the opening, and an organic insulating pattern covering the blocking structure in the peripheral region on the substrate and having a first color. Accordingly, the visibility of the organic light-emitting display device may be improved.

Description

ORGANIC LIGHT EMITTING DISPLAY DEVICE

The present invention relates to an organic light emitting display device. More specifically, the present invention relates to an organic light emitting display device including a substrate having an opening formed therein.

Flat panel displays are being used as display devices to replace cathode ray tube displays due to their characteristics such as being lightweight and thin. Representative examples of such flat panel displays include liquid crystal displays and organic light emitting diode displays.

The organic light emitting display device may include a display area where an image is displayed and a non-display area where a gate driver, a data driver, wires, functional modules (e.g., a camera module, a motion detection sensor, etc.) are arranged. Recently, an organic light emitting display device has been developed in which an opening is formed in a part of the display area and the functional module is arranged in the opening. In addition, blocking patterns may be formed on the periphery of the portion where the functional module is arranged to block moisture, humidity, etc. that may penetrate into the display area adjacent to the functional module. Furthermore, a window member may be arranged at the top of the organic light emitting display device, and a black matrix may be arranged on a lower surface of the window member overlapping the blocking patterns. Here, the black matrix may be arranged to prevent the blocking patterns from being recognized by a user of the organic light emitting display device. However, when the black matrix is arranged under the window member, an alignment process between the black matrix and the blocking patterns may be added, and a manufacturing cost may increase due to the addition of the black matrix, and an adhesion defect may occur due to a step difference of the black matrix.

An object of the present invention is to provide an organic light emitting display device including a substrate in which an opening is formed.

However, the present invention is not limited to the above-described purpose, and may be variously expanded without departing from the spirit and scope of the present invention.

In order to achieve the above-described object of the present invention, an organic light-emitting display device according to exemplary embodiments of the present invention may include an opening region, a peripheral region surrounding the opening region, and a display region surrounding the peripheral region, and may include a substrate having a first groove formed in the peripheral region with a lower portion extended and an opening formed in the opening region, a light-emitting structure disposed in the display region on the substrate, a blocking structure disposed in the peripheral region on the substrate and surrounding the opening, and an organic insulating pattern covering the blocking structure in the peripheral region on the substrate and having a first color.

In exemplary embodiments, the organic insulating pattern may be disposed within the first groove.

In exemplary embodiments, the organic insulating pattern can block or absorb light incident from outside.

In exemplary embodiments, the first color of the organic insulating pattern may be black.

In exemplary embodiments, the organic insulating pattern may not overlap the light emitting structure.

In exemplary embodiments, the substrate may further include a functional module disposed in the opening.

In exemplary embodiments, the functional module may include a camera module, a face recognition sensor module, a pupil recognition sensor module, an acceleration sensor module, a geomagnetic sensor module, a proximity sensor module, an infrared sensor module, and an illuminance sensor module.

In exemplary embodiments, a side of the organic insulating pattern positioned at the boundary between the peripheral region and the opening region can be in direct contact with the functional module.

In exemplary embodiments, the first groove may surround the opening.

In exemplary embodiments, the first groove may be located between the blocking structure and the opening when the organic light-emitting display device is viewed in a cross-sectional direction.

In exemplary embodiments, the first groove may have a planar shape of a ring when the organic light-emitting display device is viewed in a planar direction.

In exemplary embodiments, the substrate may include a first organic film layer, a first barrier layer disposed on the first organic film layer, a second organic film layer disposed on the first barrier layer and having a trench in the peripheral region, and a second barrier layer disposed on the second organic film layer and having a protrusion protruding inwardly of the trench on the trench, the second barrier layer having an opening defined by the protrusion.

In exemplary embodiments, the protrusion of the second barrier layer may include a first protrusion positioned adjacent to the opening of the substrate and a second protrusion positioned facing the first protrusion and spaced apart from the first protrusion in a direction from the opening area to the peripheral area.

In exemplary embodiments, the trench of the second organic film layer, the protrusion of the second barrier layer and the opening of the second barrier layer may be defined as a first groove extending from the lower portion of the substrate.

In exemplary embodiments, the light-emitting structure may include a lower electrode, a light-emitting layer disposed on the lower electrode, and an upper electrode disposed on the light-emitting layer.

In exemplary embodiments, the light-emitting layer extends from the display area to the peripheral area on the substrate, and the light-emitting layer may be disconnected at a portion where the first groove is formed.

In exemplary embodiments, the upper electrode extends from the display area to the peripheral area on the substrate, and the upper electrode may be disconnected at a portion where the first groove is formed.

In exemplary embodiments, each of the light-emitting layer and the upper electrode may be disposed within at least a portion of the interior of the first groove.

In exemplary embodiments, each of the light-emitting layer and the upper electrode may be disposed on the blocking structure.

In exemplary embodiments, the device may further include a thin film encapsulation structure disposed on the light-emitting structure and a touch screen structure disposed on the display area on the thin film encapsulation structure.

In exemplary embodiments, the thin film encapsulation structure may include a first thin film encapsulation layer including an inorganic material, a second thin film encapsulation layer disposed on the first thin film encapsulation layer and including an organic material, and a third thin film encapsulation layer disposed on the second thin film encapsulation layer and including an inorganic material.

In exemplary embodiments, each of the first thin film encapsulation layer and the third thin film encapsulation layer may extend from the display area to the peripheral area on the substrate and may be continuously arranged at a portion where the first groove is formed.

In exemplary embodiments, the touch screen structure may include a first insulating layer disposed in the display area on the third thin film encapsulation layer, a touch screen electrode disposed on the first insulating layer, a second insulating layer disposed on the touch screen electrode, a touch screen connection electrode disposed on the second insulating layer, and a protective insulating layer disposed on the touch screen connection electrode.

In exemplary embodiments, the first insulating layer may extend from the display area to the peripheral area on the second thin film encapsulation layer and may be continuously arranged in a portion where the first groove is formed.

In exemplary embodiments, the first thin film encapsulation layer, the third thin film encapsulation layer, the first insulating layer and the first insulating layer may be disposed on the blocking structure, and the organic insulating pattern may be disposed between the first insulating layer and the second insulating layer.

In exemplary embodiments, the second insulating layer may contact an upper surface of the first insulating layer in the display area and may contact an upper surface of the organic insulating pattern in the peripheral area.

In exemplary embodiments, the substrate further includes at least one lower-extended second groove formed between the first groove and the opening of the substrate, wherein the first groove can surround the second groove.

In exemplary embodiments, the substrate may further include at least one third groove surrounding the first groove.

In exemplary embodiments, the third groove may surround the blocking structure.

In exemplary embodiments, the substrate may further include a polarizing layer disposed in the display area and peripheral area, and a window member disposed on the polarizing layer.

In exemplary embodiments, the polarizing layer may have an opening that overlaps the opening of the substrate.

In exemplary embodiments, the device may further include an adhesive layer disposed between the polarizing layer and the window member.

Since the organic light-emitting display device according to exemplary embodiments of the present invention includes the organic insulating pattern having the first color, the organic light-emitting display device can prevent the first to third grooves, the blocking structure, and the light-emitting layer and the upper electrode disposed within each of the first to third grooves from being recognized by the user. Accordingly, the visibility of the organic light-emitting display device can be improved.

However, the effects of the present invention are not limited to the effects described above, and may be expanded in various ways without departing from the spirit and scope of the present invention.

FIG. 1 is a perspective view showing an organic light emitting display device according to exemplary embodiments of the present invention.
Fig. 2 is a plan view showing the organic light emitting display device of Fig. 1.
Figures 3 and 4 are perspective views illustrating an opening formed in the organic light emitting display device of Figure 1.
FIG. 5 is a partially enlarged plan view illustrating the “A” area of the organic light-emitting display device of FIG. 2.
FIG. 6 is a block diagram for explaining an external device electrically connected to the organic light emitting display device of FIG. 1.
Fig. 7 is a cross-sectional view taken along line I-I' of the organic light-emitting display device of Fig. 5.
FIG. 8 is a plan view for explaining a touch screen structure included in the organic light emitting display device of FIG. 7.
FIGS. 9 to 19 are cross-sectional views showing a method for manufacturing an organic light-emitting display device according to exemplary embodiments of the present invention.

Hereinafter, with reference to the attached drawings, organic light emitting display devices and a manufacturing method of the organic light emitting display device according to exemplary embodiments of the present invention will be described in detail. In the attached drawings, identical or similar reference numerals are used for identical or similar components.

FIG. 1 is a perspective view showing an organic light emitting display device according to exemplary embodiments of the present invention, FIG. 2 is a plan view showing the organic light emitting display device of FIG. 1, FIGS. 3 and 4 are perspective views for explaining an opening formed in the organic light emitting display device of FIG. 1, FIG. 5 is a partially enlarged plan view showing an enlarged portion of an “A” region of the organic light emitting display device of FIG. 2, and FIG. 6 is a block diagram for explaining an external device electrically connected to the organic light emitting display device of FIG. 1.

Referring to FIGS. 1, 2, and 5, the organic light-emitting display device (100) may include a substrate (for example, the substrate (110) of FIG. 7), a functional module (700), an organic insulating pattern (490), etc. Here, a first groove (930), a second groove (950), and a third groove (970) may be formed in the substrate.

As illustrated in FIG. 2, the organic light-emitting display device (100) may include a display area (10), an opening area (20), a peripheral area (30), and a pad area (40). Here, the peripheral area (30) may substantially surround the opening area (20), and the display area (10) may substantially surround the peripheral area (30). In exemplary embodiments, a first groove (930), a second groove (950), and a third groove (970) may be positioned in the peripheral area (30), and an organic insulating pattern (490) may be arranged in the peripheral area (30) on the first groove (930), the second groove (950), and the third groove (970). In addition, a functional module (700) may be arranged in the opening area (20), and the organic insulating pattern (490) may surround the functional module (700). Optionally, the display area (10) may not completely surround the surrounding area (30).

However, although the shape of each of the opening region (20) and the peripheral region (30) of the present invention has been described as having a circular planar shape, the shape is not limited thereto. For example, the shape of each of the opening region (20) and the peripheral region (30) may have a triangular planar shape, a rhombus planar shape, a polygonal planar shape, a square planar shape, a track-shaped planar shape, or an oval planar shape.

As illustrated in FIGS. 3 and 4, the organic light emitting display device (100) may have a first surface (S1) on which an image is displayed and a second surface (S2) opposite to the first surface (S1). In addition, the organic light emitting display device (100) may include an opening (910) formed in the opening region (20). In exemplary embodiments, a functional module (700) may be disposed in the opening (910). The pad region (40) may be located at one side of the display region (10). The organic light emitting display device (100) may further include a plurality of pad electrodes, and the pad electrodes may be disposed in the pad region (40) on the substrate. The pad electrodes may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, or the like. These may be used alone or in combination with each other. In other exemplary embodiments, the pad electrodes may have a multilayer structure including a plurality of layers. The above pad electrodes may be electrically connected to an external device (101) (see FIG. 6). In other exemplary embodiments, the organic light emitting display device (100) may further include a bending region positioned between the display region (10) and the pad region (40). For example, the bending region may be bent about an axis in a first direction (D1) parallel to the upper surface of the organic light emitting display device (100), and the pad region (40) may be positioned on the lower surface of the organic light emitting display device (100).

As illustrated in FIG. 6, the external device (101) and the organic light-emitting display device (100) may be electrically connected via a flexible printed circuit board (FPCB). For example, one side of the flexible printed circuit board may be in direct contact with the pad electrodes, and the other side of the flexible printed circuit board may be in direct contact with the external device (101). For example, the external device (101) may generate a data signal, a gate signal, a light-emitting control signal, a gate initialization signal, an initialization voltage, a power supply voltage, etc. The external device (101) may provide the data signal, the gate signal, the light-emitting control signal, the gate initialization signal, the initialization voltage, the power supply voltage, etc. to the organic light-emitting display device (100) via the pad electrodes. In addition, a driving integrated circuit may be mounted on the flexible printed circuit board. Optionally, the driving integrated circuit may be mounted on the organic light-emitting display device (100) adjacent to the pad electrodes (470).

Referring back to FIGS. 1, 2, and 5, the display area (10) may include a plurality of sub-pixel areas (not shown). The plurality of sub-pixel areas may be arranged in a matrix form throughout the display area (10). A sub-pixel circuit (e.g., a semiconductor element (250) of FIG. 7) may be arranged in each of the sub-pixel areas of the display area (10), and an organic light-emitting diode (e.g., a light-emitting structure (200) of FIG. 7) may be arranged on the sub-pixel circuit. An image may be displayed in the display area (10) through the sub-pixel circuit and the organic light-emitting diode.

For example, first, second and third sub-pixel circuits may be arranged in the sub-pixel areas, and first, second and third organic light-emitting diodes may be arranged on the first to third sub-pixel circuits. The first sub-pixel circuit may be connected to a first organic light-emitting diode capable of emitting red light, the second sub-pixel circuit may be connected to a second organic light-emitting diode capable of emitting green light, and the third sub-pixel circuit may be connected to a third organic light-emitting diode capable of emitting blue light.

In exemplary embodiments, the first organic light emitting diode may be arranged to overlap the first sub-pixel circuit, the second organic light emitting diode may be arranged to overlap the second sub-pixel circuit, and the third organic light emitting diode may be arranged to overlap the third sub-pixel circuit. Optionally, the first organic light emitting diode may be arranged to overlap a portion of the first sub-pixel circuit and a portion of a sub-pixel circuit different from the first sub-pixel circuit, the second organic light emitting diode may be arranged to overlap a portion of the second sub-pixel circuit and a portion of a sub-pixel circuit different from the second sub-pixel circuit, and the third organic light emitting diode may be arranged to overlap a portion of the third sub-pixel circuit and a portion of a sub-pixel circuit different from the third sub-pixel circuit.

In other words, the first to third organic light-emitting diodes can be arranged using an RGB stripe method in which rectangles of the same size are arranged sequentially, an S-stripe method including a blue organic light-emitting diode having a relatively large area, a WRGB method further including a white organic light-emitting diode, a pentile method in which RG-GB are arranged in a repeating form, etc.

Additionally, at least one driving transistor, at least one switching transistor, at least one capacitor, etc. may be arranged in each of the plurality of sub-pixel areas.

However, although the shape of the display area (10) of the present invention has been described as having a rectangular planar shape, the shape is not limited thereto. For example, the shape of the display area (10) may have a triangular planar shape, a rhombus planar shape, a polygonal planar shape, a circular planar shape, a track-shaped planar shape, or an oval planar shape.

Referring back to FIGS. 2 and 5, a functional module (700) may be placed in the opening (910). For example, the functional module (700) may include a camera module capable of capturing (or recognizing) an image of an object, a face recognition sensor module for detecting a user's face, a pupil recognition sensor module for detecting the user's pupils, an acceleration sensor module and a geomagnetic sensor module for determining the movement of the organic light-emitting display device (100), a proximity sensor module and an infrared sensor module for detecting proximity in front of the organic light-emitting display device (100), an illuminance sensor module for measuring the level of brightness when left in a pocket or bag, and the like. In other exemplary embodiments, a vibration module for indicating an incoming call alarm, a speaker module for outputting sound, and the like may be placed in the opening (910).

A first groove (930), a second groove (950), and a third groove (970) may be positioned on the substrate located in the peripheral area (30). The second groove (950) may surround the functional module (700) (or the opening (910)), the first groove (930) may surround the second groove (950), and the third groove (970) may surround the first groove (930). In other words, the first groove (930), the second groove (950), and the third groove (970) may be positioned spaced apart from each other and may have a diameter that increases in sequence. In exemplary embodiments, each of the first groove (930), the second groove (950), and the third groove (970) may have a planar shape of a ring. The first groove (930), the second groove (950), and the third groove (970) may function as a blocking pattern that blocks the permeation path of moisture and humidity. In exemplary embodiments, each of the first groove (930), the second groove (950), and the third groove (970) may have a shape in which the lower portion is expanded (e.g., a reverse step structure).

The organic insulating pattern (490) may be arranged to surround the functional module (700) in the peripheral region (30). In addition, the organic insulating pattern (490) may overlap the first groove (930), the second groove (950), and the third groove (970), and may be positioned inside each of the first groove (930), the second groove (950), and the third groove (970). The organic insulating pattern (490) may have a first color. For example, the organic insulating pattern (490) may have the first color to prevent the first groove (930), the second groove (950), and the third groove (970) from being recognized by a user of the organic light-emitting display device (100). In other words, the organic insulating pattern (490) may block or absorb light incident from the outside, and the first color may be an opaque color (for example, black).

Since the organic light emitting display device (100) according to exemplary embodiments of the present invention includes the organic insulating pattern (490) having the first color, the first to third grooves (930, 950, 970) can be prevented from being recognized by a user of the organic light emitting display device (100).

Although the organic light emitting display device (100) of the present invention has been described as including one functional module (700) and one organic insulating pattern (490), the configuration of the present invention is not limited thereto. For example, in other exemplary embodiments, the organic light emitting display device (100) may include at least two functional modules (700) and at least two organic insulating patterns (490), and each of the organic insulating patterns (490) may surround each of the functional modules (700). In addition, first to third grooves (930, 950, 970) having an extended lower shape may be positioned below each of the organic insulating patterns (490).

FIG. 7 is a cross-sectional view taken along line I-I' of the organic light-emitting display device of FIG. 5, and FIG. 8 is a plan view for explaining a touch screen structure included in the organic light-emitting display device of FIG. 8.

Referring to FIGS. 7 and 8, the organic light-emitting display device (100) may include a substrate (110), a semiconductor element (250), a planarization layer (270), a light-emitting structure (200), a pixel defining film (310), a thin film encapsulation structure (450), a touch screen structure (380), an organic insulating pattern (490), a functional module (700), a polarizing layer (430), an adhesive layer (590), a window member (600), etc. Here, the substrate (110) may include a first organic film layer (111), a first barrier layer (112), a second organic film layer (113), and a second barrier layer (114). As the organic light emitting display device (100) has a display area (10), an opening area (20), a peripheral area (30), and a pad area (40), the substrate (110) may also be divided into a display area (10), an opening area (20), a peripheral area (30), and a pad area (40). In addition, the semiconductor element (250) may include an active layer (130), a gate insulating layer (150), a gate electrode (170), an interlayer insulating layer (190), a source electrode (210), and a drain electrode (230), and the light emitting structure (200) may include a lower electrode (290), an emission layer (330), and an upper electrode (340). Moreover, the thin film encapsulation structure (450) may include a first thin film encapsulation layer (451), a second thin film encapsulation layer (452), and a third thin film encapsulation layer (453), and the touch screen structure (380) may include a first insulating layer (390), a plurality of first touch screen electrodes (382), a plurality of second touch screen electrodes (384), a plurality of touch screen connection electrodes (386), a second insulating layer (395), and a protective insulating layer (410).

In exemplary embodiments, the substrate (110) may further include first to third grooves (930, 950, 970) formed in the peripheral region (30), and the light-emitting layer (330) and the upper electrode (340) may be spaced apart from each other within each of the first to third grooves (930, 950, 970). In other words, the light-emitting layer (330) and the upper electrode (340) may be disconnected within each of the first to third grooves (930, 950, 970). Accordingly, the organic light emitting display device (100) can block moisture, humidity, etc. from penetrating into the semiconductor element (250) and the light emitting structure (200) by including a disconnected light emitting layer (330) and a disconnected upper electrode (340) inside each of the first to third grooves (930, 950, 970). In addition, the substrate (110) can include an opening (910) formed in the opening region (20), and a functional module (700) can be placed in the opening (910) (see FIG. 18).

A first organic film layer (111) may be provided. The first organic film layer (111) may include an organic material having flexibility. For example, the first organic film layer (111) may include a random copolymer or a block copolymer. In addition, the first organic film layer (111) may have high transparency, a low coefficient of thermal expansion, and a high glass transition temperature. Since the first organic film layer (111) contains an imide group, it may have excellent heat resistance, chemical resistance, wear resistance, and electrical characteristics. In exemplary embodiments, the first organic film layer (111) may include polyimide.

A first barrier layer (112) may be entirely disposed on the first organic film layer (111). The first barrier layer (112) may block moisture penetrating through the first organic film layer (111). The first barrier layer (112) may include an inorganic material having flexibility. In exemplary embodiments, the first barrier layer (112) may include silicon oxide, silicon nitride, or the like. For example, the first barrier layer (112) may include silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiOxNy), silicon oxycarbide (SiOxCy), silicon carbonitride (SiCxNy), aluminum oxide (AlOx), aluminum nitride (AlNx), tantalum oxide (TaOx), hafnium oxide (HfOx), zirconium oxide (ZrOx), titanium oxide (TiOx), or the like.

A second organic film layer (113) may be entirely disposed on the first barrier layer (112). In exemplary embodiments, the second organic film layer (113) may have first, second, and third trenches in the peripheral region (30). In other words, each of the first to third portions of the second organic film layer (113) positioned in the peripheral region (30) may be partially removed. For example, the first portion may correspond to a portion where the first groove (930) is positioned, the second portion may correspond to a portion where the second groove (950) is positioned, and the third portion may correspond to a portion where the third groove (970) is positioned. Here, the width of each of the first to third trenches is defined as a first width (W1) (see FIG. 11). Optionally, a portion of the second organic film layer (113) located in the peripheral region (30) may be completely removed so that the second organic film layer (113) has an opening in the peripheral region (30). In this case, the upper surface of the first barrier layer (112) may be exposed through the opening.

The second organic film layer (113) may include an organic material having flexibility. For example, the second organic film layer (113) may include a random copolymer or a block copolymer. In exemplary embodiments, the second organic film layer (113) may include polyimide.

A second barrier layer (114) may be entirely disposed on the second organic film layer (113). In exemplary embodiments, the second barrier layer (114) may have first, second, and third openings in the peripheral region (30). In other words, the second barrier layer (114) may have first and second protrusions (116, 117) (or tips) protruding inwardly from each of the first to third trenches on the first to third trenches, and may have the first to third openings defined by the first and second protrusions (116, 117). For example, the first protrusion (116) may be positioned on the right side of each of the first to third openings, and the second protrusion (117) may be positioned on the left side of each of the first to third openings. In other words, the second protrusion (117) may face the first protrusion (116) and may be positioned spaced apart from the first protrusion (116). Here, the width of each of the first to third openings of the second barrier layer (114) may have a second width (W2) smaller than the first width (W1) (see FIG. 11). In addition, the space positioned below each of the first and second protrusions (116, 117) may be defined as the first and second spaces (118, 119) (see FIG. 12). The first to third trenches of the second organic film layer (113), the first and second protrusions (116, 117) of the second barrier layer (114), and the first to third openings of the second barrier layer (114) may be defined as first to third grooves (930, 950, 970) having a lower portion extended therefrom formed in the substrate (110) located in the peripheral region (30). For example, each of the first to third grooves (930, 950, 970) having a lower portion extended therefrom may have an undercut shape. Each of the first to third grooves (930, 950, 970) may function as a blocking pattern capable of blocking moisture and/or humidity from penetrating from the opening region (20) into the display region (10). In other exemplary embodiments, a plurality of grooves may be further formed between the first groove (930) and the second groove (950), and a plurality of grooves may be further formed between the light-emitting structure (200) and the third groove (970) positioned adjacent to the boundary between the display area (10) and the peripheral area (30).

In exemplary embodiments of the present invention, since the organic light-emitting display device (100) includes the first to third grooves (930, 950, 970), the light-emitting layer (330) and the upper electrode (340) can be easily disconnected due to a relatively large number of the first to third grooves (930, 950, 970) with their lower portions extended. In addition, since a relatively large number of the first to third grooves (930, 950, 970) with their lower portions extended are arranged in the peripheral region (30), when an external impact or stress during a manufacturing process is transmitted to the substrate (110) in the direction from the opening region (20) to the display region (10), the amount of the impact can be reduced due to a relatively large number of the first to third grooves (930, 950, 970) with their lower portions extended. Furthermore, by arranging a relatively large number of first to third grooves (930, 950, 970) with their lower portions extended in the peripheral region (30), the contact area between the first thin film encapsulation layer (451) and the substrate (110) in the peripheral region (30) can be relatively increased, and thus, the first thin film encapsulation layer (451) can be prevented from being separated from the substrate (110).

The second barrier layer (114) can block moisture penetrating through the second organic film layer (113). The second barrier layer (114) can include an inorganic material having flexibility. In exemplary embodiments, the second barrier layer (114) can include silicon oxide or silicon nitride.

Accordingly, a substrate (110) including a first organic film layer (111), a first barrier layer (112), a second organic film layer (113), and a second barrier layer (114) can be placed.

However, although the substrate (110) has been described as having four layers, the configuration of the present invention is not limited thereto. For example, in other exemplary embodiments, the substrate (110) may include a single layer or at least two layers.

In other exemplary embodiments, the substrate (110) may include a transparent or opaque material. For example, the substrate (110) may include a quartz substrate, a synthetic quartz substrate, a calcium fluoride substrate, a fluorine-doped quartz (F-doped quartz) substrate, a sodalime glass substrate, a non-alkali glass substrate, and the like.

A buffer layer (not shown) may be disposed on the substrate (110) (e.g., the second barrier layer (114)). For example, the buffer layer may be disposed on the entire display area (10) on the substrate (110). Optionally, it may be disposed on the peripheral area (30) on the substrate (110). In this case, the buffer layer may include an opening that overlaps the opening of the second barrier layer (114). The buffer layer may prevent metal atoms or impurities from diffusing from the substrate (110) to the semiconductor element (250) and the light-emitting structure (200), and may control the heat transfer rate during the crystallization process for forming the active layer, thereby obtaining a substantially uniform active layer. In addition, the buffer layer may play a role in improving the flatness of the surface of the substrate (110) when the surface of the substrate (110) is not uniform. Depending on the type of the substrate (110), two or more buffer layers may be provided on the substrate (110) or the buffer layer may not be disposed. For example, the buffer layer may include an organic material or an inorganic material.

An active layer (130) may be arranged in a display area (10) on a substrate (110). The active layer (130) may include an oxide semiconductor, an inorganic semiconductor (e.g., amorphous silicon, poly silicon), an organic semiconductor, or the like. The active layer (130) may have source and drain regions.

A gate insulating layer (150) may be disposed on the active layer (130). The gate insulating layer (150) may cover the active layer (130) in the display area (10) on the substrate (110) and may not be disposed in the peripheral area (30). That is, the gate insulating layer (150) may be disposed only in the display area (10) on the substrate (110). For example, the gate insulating layer (150) may sufficiently cover the active layer (130) on the substrate (110) and may have a substantially flat upper surface without generating a step around the active layer (130). Optionally, the gate insulating layer (150) may cover the active layer (130) on the substrate (110) and may be disposed along the profile of the active layer (130) with a uniform thickness. The gate insulating layer (150) may include a silicon compound, a metal oxide, or the like. Optionally, the gate insulating layer (150) may have a multilayer structure including a plurality of insulating layers. For example, the insulating layers may have different thicknesses or include different materials.

A gate electrode (170) may be placed in a display area (10) on a gate insulating layer (150). The gate electrode (170) may be placed on a portion of the gate insulating layer (150) where the active layer (130) is positioned at the bottom. The gate electrode (170) may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, or the like. For example, the gate electrode (170) may include gold (Au), silver (Ag), aluminum (Al), tungsten (W), copper (Cu), platinum (Pt), nickel (Ni), titanium (Ti), palladium (Pd), magnesium (Mg), calcium (Ca), lithium (Li), chromium (Cr), tantalum (Ta), molybdenum (Mo), scandium (Sc), neodymium (Nd), iridium (Ir), an alloy containing aluminum, aluminum nitride (AlN), an alloy containing silver, tungsten nitride (WN), an alloy containing copper, an alloy containing molybdenum, titanium nitride (TiN), chromium nitride (CrN), tantalum nitride (TaN), strontium ruthenium oxide (SrRuO), zinc oxide (ZnO), indium tin oxide (ITO), tin oxide (SnO), indium oxide (InO), gallium oxide (GaO), indium zinc oxide (IZO), and the like. These may be used alone or in combination with each other. Optionally, the gate electrode (170) may include a multilayer structure including a plurality of layers.

An interlayer insulating layer (190) may be disposed on the gate electrode (170). The interlayer insulating layer (190) may cover the gate electrode (170) in the display area (10) on the gate insulating layer (150), and may not be disposed in the peripheral area (30). That is, the interlayer insulating layer (190) may be disposed only in the display area (10) on the gate insulating layer (150). For example, the interlayer insulating layer (190) may sufficiently cover the gate electrode (170) on the gate insulating layer (150), and may have a substantially flat upper surface without generating a step around the gate electrode (170). Optionally, the interlayer insulating layer (190) may cover the gate electrode (170) on the gate insulating layer (150) and may be disposed along the profile of the gate electrode (170) with a uniform thickness. The interlayer insulating layer (190) may include a silicon compound, a metal oxide, or the like. Optionally, the interlayer insulating layer (190) may have a multilayer structure including a plurality of insulating layers. For example, the insulating layers may have different thicknesses or include different materials.

A source electrode (210) and a drain electrode (230) may be arranged in a display area (10) on an interlayer insulating layer (190). The source electrode (210) may be connected to a source region of the active layer (130) through a contact hole formed by removing a first portion of the gate insulating layer (150) and the interlayer insulating layer (190), and the drain electrode (230) may be connected to a drain region of the active layer (130) through a contact hole formed by removing a second portion of the gate insulating layer (150) and the interlayer insulating layer (190). The source electrode (210) and the drain electrode (230) may each include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, or the like. These may be used alone or in combination with each other. In other exemplary embodiments, each of the source electrode (210) and the drain electrode (230) may have a multilayer structure including a plurality of layers. Accordingly, a semiconductor element (250) including an active layer (130), a gate insulating layer (150), a gate electrode (170), an interlayer insulating layer (190), a source electrode (210), and a drain electrode (230) can be placed.

However, although the semiconductor element (250) has been described as having an upper gate structure, the configuration of the present invention is not limited thereto. For example, the semiconductor element (250) may have a lower gate structure, a double gate structure, etc.

In addition, although the organic light emitting display device (100) is described as including one semiconductor element, the configuration of the present invention is not limited thereto. For example, the organic light emitting display device (100) may include at least one semiconductor element and at least one storage capacitor.

A planarization layer (270) may be disposed on the interlayer insulating layer (190), the source electrode (210), and the drain electrode (230). The planarization layer (270) may cover the source electrode (210) and the drain electrode (230) in the display area (10) on the interlayer insulating layer (190), and may not be disposed in the peripheral area (30). That is, the planarization layer (270) may be disposed only in the display area (10) on the interlayer insulating layer (190). For example, the planarization layer (270) may be disposed with a relatively thick thickness in the display area (10), and in this case, the planarization layer (270) may have a substantially flat upper surface, and a flattening process may be added to the planarization layer (270) to implement a flat upper surface of the planarization layer (270). Optionally, a planarization layer (270) may be disposed along the profile of the source electrode (210) and the drain electrode (230) with a uniform thickness in the display area (10) on the interlayer insulating layer (190). The planarization layer (270) may be made of an organic material or an inorganic material. In exemplary embodiments, the planarization layer (270) may include an organic material.

The lower electrode (290) may be arranged in the display area (10) on the planarization layer (270). The lower electrode (290) may be connected to the drain electrode (230) through a contact hole formed by removing a portion of the planarization layer (270), and the lower electrode (290) may be electrically connected to the semiconductor element (250). The lower electrode (290) may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, or the like. These may be used alone or in combination with each other. In other exemplary embodiments, the lower electrode (290) may have a multilayer structure including a plurality of layers.

The pixel defining film (310) may be disposed in the display area (10) on the planarization layer (270) and may not be disposed in the peripheral area (30). That is, the pixel defining film (310) may be disposed only in the display area (10) on the planarization layer (270). For example, the pixel defining film (310) may cover both sides of the lower electrode (290) and expose a part of the upper surface of the lower electrode (290). The pixel defining film (310) may be made of an organic material or an inorganic material. In exemplary embodiments, the pixel defining film (310) may include an organic material.

A blocking structure (550) may be positioned between a first groove (930) and a third groove (970) on a substrate (110) located in a peripheral area (30). In other words, the first groove (930) and the second groove (950) may be positioned between the blocking structure (550) and the functional module (700), and the third groove (970) may be positioned between the blocking structure (550) and the light-emitting structure (200). In addition, a light-emitting layer (330), an upper electrode (340), a first thin film encapsulation layer (451), a third thin film encapsulation layer (453), a first insulating layer (390), an organic insulating pattern (490), and a second insulating layer (395) may be positioned in that order on the blocking structure (550). The blocking structure (550) may surround the opening (910) (or the functional module (700)). For example, the blocking structure (550) may have a planar shape of a ring. In exemplary embodiments, the blocking structure (550) may serve to block leakage of the second thin film encapsulation layer (452). Optionally, further blocking structures may be arranged between the first groove (930) and the third groove (970). The blocking structure (550) may include an organic material or an inorganic material. In exemplary embodiments, the blocking structure (550) may include an organic material.

The light-emitting layer (330) is disposed on the pixel defining film (310) and the lower electrode (290) in the display area (10) and can extend in the first direction (D1), and can be disposed in the peripheral area (30) on the substrate (110) and the blocking structure (550). In exemplary embodiments, the light-emitting layer (330) can be partially disposed inside each of the first to third grooves (930, 950, 970), and can be spaced apart in the depth direction (for example, in the direction from the second barrier layer (114) to the first organic film layer (111)) from the portion where each of the first to third grooves (930, 950, 970) is located. That is, the light-emitting layer (330) can be disconnected from the peripheral area (30). In other words, the light-emitting layer (330) can be separated from the surrounding area (30) by the first and second spaces (118, 119).

For example, when each of the first to third grooves (930, 950, 970) does not have the first and second protrusions (116, 117), the light-emitting layer (330) may be continuously arranged in the portion where the first to third grooves (930, 950, 970) are formed, and the light-emitting layer (330) may be used as a moisture and/or moisture permeation path. In other words, a part of the light-emitting layer (330) (for example, a side end of the light-emitting layer (330)) may be exposed in the opening region (20), and the moisture and/or moisture may permeate into the exposed portion of the light-emitting layer (330). In this case, the semiconductor element (250) and the light-emitting structure (200) arranged in the display region (10) adjacent to the peripheral region (30) may be damaged by the moisture and/or moisture. Meanwhile, in exemplary embodiments of the present invention, since the organic light-emitting display device (100) has first to third grooves (930, 950, 970) with expanded lower portions, the light-emitting layer (330) can be separated inside each of the first to third grooves (930, 950, 970). That is, since the light-emitting layer (330) is separated inside each of the first to third grooves (930, 950, 970), the moisture permeation path of the light-emitting layer (330) can be blocked. Accordingly, even if the light-emitting layer (330) is disposed in the peripheral region (30), pixel defects of the organic light-emitting display device (100) may not occur.

The light-emitting layer (330) may have a multilayer structure including an organic light emission layer (EML), a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), an electron injection layer (EIL), etc. In exemplary embodiments, the organic light-emitting layer (EML), the hole injection layer (HIL), the hole transport layer (HTL), the electron transport layer (ETL), and the electron injection layer (EIL) may be disposed in the peripheral region (30). In other exemplary embodiments, the hole injection layer (HIL), the hole transport layer (HTL), the electron transport layer (ETL), and the electron injection layer (EIL) excluding the organic light-emitting layer (EML) may be disposed in the peripheral region (30).

The organic light-emitting layer (EML) of the light-emitting layer (330) may be formed using at least one of light-emitting materials capable of emitting different color lights (i.e., red light, green light, blue light, etc.) depending on the sub-pixels. Alternatively, the organic light-emitting layer (EML) of the light-emitting layer (330) may emit white light overall by stacking a plurality of light-emitting materials capable of emitting different color lights, such as red light, green light, and blue light. In this case, a color filter may be disposed on the light-emitting layer (330) disposed on the lower electrode (290). The color filter may include at least one of a red color filter, a green color filter, and a blue color filter. Optionally, the color filter may include a yellow color filter, a cyan color filter, and a magenta color filter. The color filter may include a photosensitive resin or a color photoresist.

The upper electrode (340) is arranged to overlap on the light-emitting layer (330) of the display area (10), can extend in the first direction (D1), and can be arranged in the peripheral area (30) on the light-emitting layer (330). In exemplary embodiments, the upper electrode (340) can be partially arranged inside each of the first to third grooves (930, 950, 970), and can be spaced apart in the depth direction from the portion where each of the first to third grooves (930, 950, 970) is located. That is, the upper electrode (340) can be disconnected from the peripheral area (30). In other words, the upper electrode (340) can be separated from the peripheral area (30) by the first and second spaces (118, 119).

For example, if each of the first to third grooves (930, 950, 970) does not have the first and second protrusions (116, 117), the upper electrode (340) may be continuously disposed in the portion where the first to third grooves (930, 950, 970) are formed, and the upper electrode (340) may be used as a moisture and/or moisture permeation path. In other words, a part of the upper electrode (340) (for example, a side end of the upper electrode (340)) may be exposed in the opening region (20), and the moisture and/or moisture may permeate into the exposed portion of the upper electrode (340). In this case, the semiconductor element (250) and the light-emitting structure (200) disposed in the display region (10) adjacent to the peripheral region (30) may be damaged by the moisture and/or moisture. Meanwhile, in exemplary embodiments of the present invention, since the organic light-emitting display device (100) has first to third grooves (930, 950, 970) having extended lower portions, the upper electrode (340) can be separated inside each of the first to third grooves (930, 950, 970). That is, since the upper electrode (340) is separated inside each of the first to third grooves (930, 950, 970), the moisture permeation path of the upper electrode (340) can be blocked. Accordingly, even if the upper electrode (340) is disposed in the peripheral area (30), pixel defects of the organic light-emitting display device (100) may not occur.

The upper electrode (340) may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These may be used alone or in combination with each other. In other exemplary embodiments, the upper electrode (340) may have a multilayer structure including a plurality of layers.

Accordingly, a light-emitting structure (200) including a lower electrode (290), a light-emitting layer (330), and an upper electrode (340) can be placed.

A capping layer (not shown) may be disposed on the upper electrode (340). The capping layer may be disposed to overlap the upper electrode (340) of the display area (10) and may extend in the first direction (D1), and may be disposed in the peripheral area (30) on the upper electrode (340). In exemplary embodiments, the capping layer may be partially disposed inside each of the first to third grooves (930, 950, 970), and may be spaced apart in the depth direction from the portions where each of the first to third grooves (930, 950, 970) is located. That is, the capping layer may be disconnected from the peripheral area (30). In other words, the capping layer may be separated from the peripheral area (30) by the first and second spaces (118, 119).

For example, when each of the first to third grooves (930, 950, 970) does not have the first and second protrusions (116, 117), the capping layer may be continuously disposed at a portion where the first to third grooves (930, 950, 970) are formed, and the capping layer may be used as a moisture and/or moisture permeation path. In other words, a portion of the capping layer (for example, a side edge of the capping layer) may be exposed in the opening region (20), and the moisture and/or moisture may permeate into the exposed portion of the capping layer. In this case, the semiconductor element (250) and the light-emitting structure (200) disposed in the display region (10) adjacent to the peripheral region (30) may be damaged by the moisture and/or moisture. Meanwhile, in exemplary embodiments of the present invention, since the organic light-emitting display device (100) has first to third grooves (930, 950, 970) with expanded lower portions, the capping layer may be separated inside each of the first to third grooves (930, 950, 970). That is, since the capping layer is separated inside each of the first to third grooves (930, 950, 970), the moisture permeation path of the capping layer may be blocked. Accordingly, even if the capping layer is disposed in the peripheral area (30), pixel defects of the organic light-emitting display device (100) may not occur.

The capping layer can protect the light emitting structure (200) and can include an organic material or an inorganic material. In exemplary embodiments, the capping layer can include an organic material, such as a triamine derivative, an arylenediamine derivative, 4,4'-N,N'-dicarbazole-biphenyl (4,4'-bis(N-carbazolyl)-1,1'-biphenyl CBP), tris-8-hydroxyquinoline aluminum Alq3, and the like.

A first thin film encapsulation layer (451) may be disposed in the display area (10) and the peripheral area (30) on the upper electrode (340). The first thin film encapsulation layer (451) may be disposed along the profile of the upper electrode (340) with a uniform thickness to cover the upper electrode (340) in the display area (10) and may extend to the peripheral area (30). In the peripheral area (30), the first thin film encapsulation layer (451) may be disposed along the profile of the upper electrode (340). In other words, the first thin film encapsulation layer (451) may be continuously disposed in the portions where each of the first to third grooves (930, 950, 970) is formed. In exemplary embodiments, the first thin film encapsulation layer (451) may completely cover each of the first to third grooves (930, 950, 970). In other words, the first thin film encapsulation layer (451) can cover the first and second protrusions (116, 117), be arranged in the first and second spaces (118, 119), and completely cover the light-emitting layer (330) and the upper electrode (340) arranged inside each of the first to third grooves (930, 950, 970). That is, the first thin film encapsulation layer (451) can directly contact the second organic film layer (113) in the first and second spaces (118, 119). The first thin film encapsulation layer (451) can prevent the light-emitting structure (200) from being deteriorated due to the penetration of moisture, oxygen, etc. In addition, the first thin film encapsulation layer (451) can also perform a function of protecting the light-emitting structure (200) from external impact. The first thin film encapsulation layer (451) may include inorganic materials having flexibility.

A second thin film encapsulation layer (452) may be disposed on a portion of the display area (10) and the peripheral area (30) on the first thin film encapsulation layer (451). In exemplary embodiments, the second thin film encapsulation layer (452) may fill the interior of the third groove (970) and may not be disposed on the interior of each of the first groove (930) and the second groove (950). Optionally, the second thin film encapsulation layer (452) may be disposed only on the display area (10). The second thin film encapsulation layer (452) may improve the flatness of the organic light emitting display device (100) and protect the light emitting structure (200). The second thin film encapsulation layer (452) may include flexible organic materials.

A third thin film encapsulation layer (453) may be arranged in the display area (10) on the second thin film encapsulation layer (452) and the peripheral area (30) on the first thin film encapsulation layer (451). The third thin film encapsulation layer (453) may be arranged along the profile of the second thin film encapsulation layer (452) with a uniform thickness in the display area (10) and may extend to the peripheral area (30). In the peripheral area (30), the third thin film encapsulation layer (453) may be arranged along the profile of the first thin film encapsulation layer (451) with a uniform thickness. In other words, the third thin film encapsulation layer (453) may be arranged continuously in the portions where each of the first to third grooves (930, 950, 970) is formed. The third thin film encapsulation layer (453) can prevent the light emitting structure (200) from being deteriorated due to the penetration of moisture, oxygen, etc., together with the first thin film encapsulation layer (451). In addition, the third thin film encapsulation layer (453) can also perform the function of protecting the light emitting structure (200) from external impact, together with the first thin film encapsulation layer (451) and the second thin film encapsulation layer (452). The third thin film encapsulation layer (453) can include inorganic materials having flexibility.

Accordingly, a thin film encapsulation structure (450) including a first thin film encapsulation layer (451), a second thin film encapsulation layer (452), and a third thin film encapsulation layer (453) can be arranged. Optionally, the thin film encapsulation structure (450) can be arranged as a five-layer structure laminated with the first to fifth thin film encapsulation layers or a seven-layer structure laminated with the first to seventh thin film encapsulation layers.

A first insulating layer (390) may be disposed in the display area (10) and the peripheral area (30) on the third thin film encapsulation layer (453). The first insulating layer (390) may be disposed along the profile of the third thin film encapsulation layer (453) with a uniform thickness in the display area (10) to cover the third thin film encapsulation layer (453) and may extend to the peripheral area (30). In the peripheral area (30), the first insulating layer (390) may be disposed along the profile of the third thin film encapsulation layer (453) with a uniform thickness. In other words, the first insulating layer (390) may be continuously disposed in the portion where the first to third grooves (930, 950, 970) are formed. The first insulating layer (390) may include an organic material or an inorganic material. Optionally, the first insulating layer (390) may have a multilayer structure including a plurality of insulating layers. For example, the insulating layers may have different thicknesses or contain different materials.

An organic insulating pattern (490) may be arranged in a peripheral region (30) on the first insulating layer (390). In exemplary embodiments, the organic insulating pattern (490) may be arranged only in the peripheral region (30), may cover the blocking structure (550), and may not overlap with the light-emitting structure (200). Optionally, the organic insulating pattern (490) may be arranged in a part of the display region (10), but may not overlap with the light-emitting structure (200).

The organic insulating pattern (490) can surround the functional module (700) and have a planar shape of a ring. The organic insulating pattern (490) can overlap the first groove (930), the second groove (950), and the third groove (970), and can be located inside each of the first groove (930), the second groove (950), and the third groove (970). The organic insulating pattern (490) can block or absorb light incident from the outside, and can have an opaque color (for example, black).

The organic insulating pattern (490) may be arranged with a relatively thick thickness in the peripheral region (30) on the first insulating layer (390), and in this case, the organic insulating pattern (490) may have a substantially flat upper surface, and a flattening process may be added to the organic insulating pattern (490) to implement the flat upper surface of the organic insulating pattern (490). Optionally, the organic insulating pattern (490) may be arranged with a uniform thickness along the profile of the first insulating layer (390) in the display region (10) on the first insulating layer (390). The organic insulating pattern (490) may be made of an organic material or an inorganic material. In exemplary embodiments, the organic insulating pattern (490) may include an organic material such as a photoresist, a polyacryl-based resin, a polyimide-based resin, a polyamide-based resin, a siloxane-based resin, an acrylic-based resin, an epoxy-based resin, and the like. In addition, the organic insulating pattern (490) may further include a light-shielding material to have a black color. The light-shielding material may include carbon black, titanium nitride oxide, titanium black, phenylene black, aniline black, cyanine black, nigrosine acid black, a black resin, and the like.

For example, a conventional organic light emitting display device may include a black matrix positioned to overlap with a peripheral area (30) to prevent the light emitting layer (330) and the upper electrode (340) disposed within each of the first to third grooves (930, 950, 970), the blocking structure (550), and the first to third grooves (930, 950, 970) from being recognized by a user. The black matrix may be disposed between an adhesive layer (590) and a window member (600). When the black matrix is disposed, an alignment process may be added to accurately place the black matrix in the peripheral area (30), and manufacturing costs may increase due to the addition of the black matrix, and adhesion failure of the adhesive layer (590) may occur due to a step difference of the black matrix.

An organic light emitting display device (100) according to exemplary embodiments of the present invention includes an organic insulating pattern (490) having an opaque color that can prevent a light emitting layer (330) and an upper electrode (340) disposed within each of the first to third grooves (930, 950, 970), a blocking structure (550), and the first to third grooves (930, 950, 970) from being recognized by a user, and since the alignment process is not added, the manufacturing cost of the organic light emitting display device (100) can be relatively reduced. In addition, since the step difference due to the black matrix is not generated, an adhesion failure of the adhesive layer (590) can not occur.

First touch screen electrodes (382) and second touch screen electrodes (384) may be arranged in a display area (10) on a first insulating layer (390). As illustrated in FIG. 8, each of the first touch screen electrodes (382) may extend in a second direction (D2) and may be arranged spaced apart from each other in the first direction (D1). The second touch screen electrodes (384) may be arranged spaced apart from each other in the second direction (D2) between two adjacent first touch screen electrodes (382) among the first touch screen electrodes (382). For example, each of the first and second touch screen electrodes (382, 384) may include carbon nanotubes (CNT), transparent conductive oxides, indium tin oxide (ITO), indium gallium zinc oxide (IGZO), zinc oxide (ZnO), graphene, silver nanowires (Ag nano-wires (AgNW), copper (Cu), chromium (Cr), and the like.

A second insulating layer (395) may be disposed in the display area (10) on the first touch screen electrodes (382) and the second touch screen electrodes (384). The second insulating layer (395) may be disposed along the profile of the first and second touch screen electrodes (382, 384) with a uniform thickness to cover the first and second touch screen electrodes (382, 384) in the display area (10) and may extend to the peripheral area (30). In the peripheral area (30), the second insulating layer (395) may be disposed along the profile of the organic insulating pattern (490). In other words, the second insulating layer (395) may be in contact with the upper surface of the first insulating layer (390) in the display area (10) and may be in contact with the upper surface of the organic insulating pattern (490) in the peripheral area (30). The second insulating layer (395) may include an organic material or an inorganic material. Optionally, the second insulating layer (395) may have a multilayer structure including a plurality of insulating layers. For example, the insulating layers may have different thicknesses or include different materials.

Touch screen connection electrodes (386) may be arranged in the display area (10) on the second insulating layer (395). As illustrated in FIG. 8, the touch screen connection electrodes (386) may electrically connect two second touch screen electrodes (384) adjacent in the first direction (D1) among the second touch screen electrodes (384) through a contact hole. For example, the touch screen connection electrodes (386) may include the same material as the first and second touch screen electrodes (382, 384). Optionally, the touch screen connection electrodes (386) may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, or the like. These may be used alone or in combination with each other.

A protective insulating layer (410) may be disposed on the display area (10) and the peripheral area (30) on the second insulating layer (395) and the touch screen connection electrodes (386). The protective insulating layer (410) may be disposed with a relatively thick thickness on the second insulating layer (395), and in this case, the protective insulating layer (410) may have a substantially flat upper surface. Optionally, the protective insulating layer (410) may be disposed along the profile of the touch screen connection electrodes (386) and the conductive pattern (400) to cover the touch screen connection electrodes (386) and the conductive pattern (400) with a uniform thickness on the display area (10) and the peripheral area (30) on the second insulating layer (395). The protective insulating layer (410) may be made of an organic material or an inorganic material. In exemplary embodiments, the protective insulating layer (410) may include an organic material.

Accordingly, a touch screen structure (380) including a first insulating layer (390), first touch screen electrodes (382), second touch screen electrodes (384), a second insulating layer (395), touch screen connection electrodes (386), and a protective insulating layer (410) can be arranged.

A polarizing layer (430) may be disposed on the touch screen structure (380). The polarizing layer (430) may overlap the display area (10) and the peripheral area (30) on the substrate (110). In other words, the polarizing layer (430) may have an opening that exposes the opening area (20). The polarizing layer (430) may include a linear polarizing film and a λ/4 phase retardation film. The λ/4 phase retardation film may be disposed on the protective insulating layer (410). The λ/4 phase retardation film may convert the phase of light. For example, the λ/4 phase retardation film may convert light vibrating up and down or light vibrating left and right into right-handed circularly polarized light or left-handed circularly polarized light, and may convert right-handed circularly polarized light or left-handed circularly polarized light into light vibrating up and down or light vibrating left and right. The above λ/4 phase retardation film may include a birefringent film including a polymer, an alignment film of a liquid crystal polymer, a film including an alignment layer of a liquid crystal polymer, etc.

A linear polarizing film may be disposed on the λ/4 phase retardation film. The linear polarizing film can selectively transmit light. For example, the linear polarizing film can transmit light vibrating up and down or light vibrating left and right. In this case, the linear polarizing film may have a horizontal stripe pattern or a vertical stripe pattern. When the linear polarizing film includes a horizontal stripe pattern, the linear polarizing film can block light vibrating up and down and transmit light vibrating left and right. When the linear polarizing film has a vertical stripe pattern, the linear polarizing film can block light vibrating left and right and transmit light vibrating up and down. Light transmitted through the linear polarizing film can pass through the λ/4 phase retardation film. As described above, the λ/4 phase retardation film can change the phase of light. For example, when light vibrating up and down and left and right passes through the linear polarizing film, the linear polarizing film having a horizontal stripe pattern can transmit the light vibrating left and right. When the light vibrating left and right passes through the λ/4 phase retardation film, the light vibrating left and right can be converted into left-hand circularly polarized light. The light having the left-hand circularly polarized light can be reflected by the upper electrode (340) in the display area (10), and the light can be converted into right-hand circularly polarized light. When the light having the right-hand circularly polarized light passes through the λ/4 phase retardation film, the light can be converted into light vibrating up and down. Here, the light vibrating up and down cannot transmit the linear polarizing film having a horizontal stripe pattern. Accordingly, the light can be extinguished by the linear polarizing film and the λ/4 phase retardation film. For example, the polarizing film may include an iodine-based material, a dye-containing material, or a polyene-based material. In other exemplary embodiments, a polarizing layer (430) may be disposed under the touch screen structure (380).

A functional module (700) may be placed in the opening area (20). In exemplary embodiments, the functional module (700) may be in contact with a side surface of the substrate (110), a side surface of the light-emitting layer (330), a side surface of the upper electrode (340), a side surface of the first thin film encapsulation layer (451), a side surface of the third thin film encapsulation layer (453), a side surface of the first insulating layer (390), a side surface of the organic insulating pattern (490), a side surface of the second insulating layer (395), a side surface of the protective insulating layer (410), and a side surface of the polarizing layer (430) at the boundary between the peripheral area (30) and the opening area (20).

For example, the functional module (700) may include a camera module, a face recognition sensor module, a pupil recognition sensor module, an acceleration sensor module, a geomagnetic sensor module, a proximity sensor module, an infrared sensor module, an illuminance sensor module, a vibration module, a speaker module, and the like.

An adhesive layer (590) may be disposed on the display area (10), the peripheral area (30), and the opening area (20) on the polarizing layer (430) and the functional module (700). In other words, the adhesive layer (590) may be disposed on the entire substrate (110). The adhesive layer (590) may be disposed to adhere the window member (600) to the polarizing layer (430). For example, the adhesive layer (590) may include an optical clear adhesive OCA, a pressure sensitive adhesive PSA, or the like, including acrylic-based adhesives, silicone-based adhesives, urethane-based adhesives, rubber-based adhesives, and vinyl ether-based adhesives. In other exemplary embodiments, the adhesive layer (590) may have an opening that exposes the opening area (20). In such a case, the window member (600) and the functional module (700) may be in direct contact.

A window member (600) may be disposed in the display area (10), the opening area (20), and the peripheral area (30) on the adhesive layer (590). In other words, the window member (600) may be disposed entirely on the substrate (110). The window member (600) may protect the polarizing layer (430), the touch screen structure (380), the light-emitting structure (200), the semiconductor element (250), etc. The window member (600) may include a plurality of layers. For example, the window member (600) may include protective coating layers, base film layers, etc. made of organic or inorganic materials. The protective coating layer may be disposed on the base film layer, and the protective coating layer may have a hardness greater than a hardness of the base film layer in order to protect the base film layer. The base film layer may include polyimide, polyethylene terephthalate (PET), polyethylene naphthalene (PEN), polypropylene (PP), polycarbonate (PC), polystyrene (PS), polysulfone PSul, polyethylene PE, polyphthalamide (PPA), polyethersulfone (PES), polyarylate PAR, polycarbonate oxide (PCO), modified polyphenylene oxide (MPPO), urethane, thermoplastic poly urethane (TPU), etc. In addition, the protective coating layer may include an acrylic material, an epoxy material, etc. In other exemplary embodiments, the window member (600) may have a single layer.

In this way, the organic light emitting display device (100) illustrated in FIG. 7 can be provided.

Since the organic light-emitting display device (100) according to exemplary embodiments of the present invention includes the organic insulating pattern (490) having the first color, the organic light-emitting display device (100) can prevent the light-emitting layer (330) and the upper electrode (340) disposed inside each of the first to third grooves (930, 950, 970), the blocking structure (550), and the first to third grooves (930, 950, 970) from being recognized by the user. Accordingly, the visibility of the organic light-emitting display device (100) can be improved.

FIGS. 9 to 19 are cross-sectional views showing a method for manufacturing an organic light-emitting display device according to exemplary embodiments of the present invention.

Referring to FIG. 9, a rigid glass substrate (105) may be provided. A first organic film layer (111) may be formed on the glass substrate (105). The first organic film layer (111) may be formed entirely on the glass substrate (105) and may be formed using a flexible organic material such as polyimide.

A first barrier layer (112) may be formed entirely on the first organic film layer (111). The first barrier layer (112) may block moisture penetrating through the first organic film layer (111). The first barrier layer (112) may be formed using an inorganic material having flexibility, such as silicon oxide or silicon nitride. For example, the first barrier layer (112) may include silicon oxide, silicon nitride, silicon oxynitride, silicon oxycarbide, silicon carbonitride, aluminum oxide, aluminum nitride, tantalum oxide, hafnium oxide, zirconium oxide, titanium oxide, or the like.

A second organic film layer (113) can be formed on the first barrier layer (112). The second organic film layer (113) can be formed entirely on the first barrier layer (112) and can be formed using an organic material having flexibility, such as polyimide.

A second barrier layer (114) may be formed entirely on the second organic film layer (113). The second barrier layer (114) may block moisture penetrating through the second organic film layer (113). The second barrier layer (114) may be formed using an inorganic material having flexibility, such as silicon oxide or silicon nitride.

Accordingly, a substrate (110) including a first organic film layer (111), a first barrier layer (112), a second organic film layer (113), and a second barrier layer (114) can be formed. The substrate (110) can be divided into a display area (10), an opening area (20), and a peripheral area (30).

Since the substrate (110) is thin and flexible, the substrate (110) can be formed on a rigid glass substrate (105) to support the formation of an upper structure (e.g., a semiconductor element and a light-emitting structure). For example, after the upper structure is formed on the substrate (110), the glass substrate (105) can be removed. In other words, due to the flexible properties of the first organic film layer (111), the first barrier layer (112), the second organic film layer (113), and the second barrier layer (114), it may be difficult to directly form the upper structure on the first organic film layer (111), the first barrier layer (112), the second organic film layer (113), and the second barrier layer (114). Taking these points into consideration, by forming the upper structure using a glass substrate (105) and then removing the glass substrate (105), the first organic film layer (111), the first barrier layer (112), the second organic film layer (113), and the second barrier layer (114) can be used as the substrate (110).

A buffer layer (not shown) may be formed on the substrate (110). The buffer layer may be formed entirely on the substrate. The buffer layer may prevent metal atoms or impurities from diffusing from the substrate (110), and may control the heat transfer rate during the crystallization process for forming the active layer to obtain a substantially uniform active layer. In addition, the buffer layer may play a role in improving the flatness of the surface of the substrate (110) when the surface of the substrate (110) is not uniform. Depending on the type of the substrate (110), two or more buffer layers may be provided on the substrate (110), or the buffer layer may not be formed. For example, the buffer layer may be formed using an organic material or an inorganic material.

An active layer (130) may be formed in a display area (10) on a substrate (110). The active layer (130) may be formed using an oxide semiconductor, an inorganic semiconductor, an organic semiconductor, or the like. The active layer (130) may have source and drain regions.

A gate insulating layer (150) may be formed on the active layer (130). The gate insulating layer (150) may cover the active layer (130) in the display area (10) on the substrate (110) and may extend in a first direction (D1) from the display area (10) to the opening area (20). That is, the gate insulating layer (150) may be formed entirely on the substrate (110). For example, the gate insulating layer (150) may sufficiently cover the active layer (130) on the substrate (110) and may have a substantially flat upper surface without generating a step around the active layer (130). Optionally, the gate insulating layer (150) may cover the active layer (130) on the substrate (110) and may be formed along the profile of the active layer (130) with a uniform thickness. The gate insulating layer (150) may be formed using a silicon compound, a metal oxide, or the like. Optionally, the gate insulating layer (150) may have a multilayer structure including a plurality of insulating layers. For example, the insulating layers may have different thicknesses or include different insulating materials.

A gate electrode (170) may be formed in a display area (10) on a gate insulating layer (150). The gate electrode (170) may be formed on a portion of the gate insulating layer (150) where the active layer (130) is positioned at the bottom. The gate electrode (170) may be formed using a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, or the like. For example, the gate electrode (170) may include gold, silver, aluminum, tungsten, copper, platinum, nickel, titanium, palladium, magnesium, calcium, lithium, chromium, tantalum, molybdenum, scandium, neodymium, iridium, an alloy containing aluminum, aluminum nitride, an alloy containing silver, tungsten nitride, an alloy containing copper, an alloy containing molybdenum, titanium nitride, chromium nitride, tantalum nitride, strontium ruthenium oxide, zinc oxide, indium tin oxide, tin oxide, indium oxide, gallium oxide, indium zinc oxide, and the like. These may be used alone or in combination with each other. Optionally, the gate electrode (170) may include a multilayer structure including a plurality of layers.

An interlayer insulating layer (190) may be formed on the gate electrode (170). The interlayer insulating layer (190) may cover the gate electrode (170) in the display area (10) on the gate insulating layer (150) and may extend in the first direction (D1) on the gate insulating layer (150). That is, the interlayer insulating layer (190) may be formed entirely on the gate insulating layer (150). For example, the interlayer insulating layer (190) may sufficiently cover the gate electrode (170) on the gate insulating layer (150) and may have a substantially flat upper surface without generating a step around the gate electrode (170). Optionally, the interlayer insulating layer (190) may cover the gate electrode (170) on the gate insulating layer (150) and may be formed along the profile of the gate electrode (170) with a uniform thickness. The interlayer insulating layer (190) may be formed using a silicon compound, a metal oxide, or the like. Optionally, the interlayer insulating layer (190) may have a multilayer structure including a plurality of insulating layers. For example, the insulating layers may have different thicknesses or include different insulating materials.

Referring to FIG. 10, a source electrode (210) and a drain electrode (230) may be formed in a display area (10) on an interlayer insulating layer (190). The source electrode (210) may be connected to a source region of an active layer (130) through a contact hole formed by removing a first portion of the gate insulating layer (150) and the interlayer insulating layer (190), and the drain electrode (230) may be connected to a drain region of an active layer (130) through a contact hole formed by removing a second portion of the gate insulating layer (150) and the interlayer insulating layer (190). The source electrode (210) and the drain electrode (230) may be formed using a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, or the like, respectively. These may be used alone or in combination with each other. In other exemplary embodiments, each of the source electrode (210) and the drain electrode (230) may have a multilayer structure including a plurality of layers. Accordingly, a semiconductor element (250) including an active layer (130), a gate insulating layer (150), a gate electrode (170), an interlayer insulating layer (190), a source electrode (210), and a drain electrode (230) can be formed.

A planarization layer (270) may be formed on the interlayer insulating layer (190), the source electrode (210), and the drain electrode (230). The planarization layer (270) may cover the source electrode (210) and the drain electrode (230) in the display area (10) on the interlayer insulating layer (190), and may not be formed in the peripheral area (30). That is, the planarization layer (270) may be formed only in the display area (10) on the interlayer insulating layer (190). For example, the planarization layer (270) may be formed with a relatively thick thickness in the display area (10), and in this case, the planarization layer (270) may have a substantially flat upper surface, and a flattening process may be added to the planarization layer (270) to implement a flat upper surface of the planarization layer (270). Optionally, a planarization layer (270) may be formed along the profile of the source electrode (210) and the drain electrode (230) with a uniform thickness in the display area (10) on the interlayer insulating layer (190). The planarization layer (270) may be formed using an organic material.

The lower electrode (290) may be formed in the display area (10) on the planarization layer (270). The lower electrode (290) may be connected to the drain electrode (230) through a contact hole formed by removing a portion of the planarization layer (270), and the lower electrode (290) may be electrically connected to the semiconductor element (250). The lower electrode (290) may be formed using a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, or the like. These may be used alone or in combination with each other. In other exemplary embodiments, the lower electrode (290) may have a multilayer structure including a plurality of layers.

Referring to FIG. 11, after the lower electrode (290) is formed, the gate insulating layer (150) and the interlayer insulating layer (190) located in the peripheral region (30) can be removed. After the gate insulating layer (150) and the interlayer insulating layer (190) located in the peripheral region (30) are removed, first to third grooves (930, 950, 970) having an extended lower portion can be formed in the substrate (110) located in the peripheral region (30) through a laser or dry etching process. Each of the first to third grooves (930, 950, 970) can have an undercut shape. For example, the first, second and third trenches formed in the second organic film layer (113) and having a first width (W1) and the first, second and third openings formed in the second barrier layer (114) and having a second width (W2) smaller than the first width (W1) may be defined as the undercut shape. Optionally, the first, second and third openings formed in the second organic film layer (113) and having a first width (W1) and the first, second and third openings formed in the second barrier layer (114) and having a second width (W2) smaller than the first width (W1) may also be defined as the undercut shape. In this case, the upper surface of the first barrier layer (112) may be exposed through the first to third openings of the second organic film layer (113).

First and second protrusions (116, 117) protruding inwardly from each of the first to third trenches of the second organic film layer (113) can be defined by the first to third openings of the second barrier layer (114).

For example, the first protrusion (116) may be positioned adjacent to the boundary between the peripheral area (30) and the opening area (20), and the second protrusion (117) may face the first protrusion (116) and be positioned spaced apart from the first protrusion (116). In addition, the spaces positioned below each of the first and second protrusions (116, 117) may be defined as first and second spaces (118, 119) (see FIG. 12). Accordingly, the first to third trenches of the second organic film layer (113), the first and second protrusions (116, 117) of the second barrier layer (114), and the first to third openings of the second barrier layer (114) may be defined as first to third grooves (930, 950, 970) having a lower portion extended therefrom formed in the substrate (110) located in the peripheral region (30). In other exemplary embodiments, a plurality of grooves may be formed spaced apart from the second groove (950) in the first direction (D1), and a plurality of grooves may be formed spaced apart from the third groove (970) in the direction opposite to the first direction (D1).

Referring to FIG. 12, the pixel defining film (310) may be formed in the display area (10) on the planarization layer (270) and may not be formed in the peripheral area (30). That is, the pixel defining film (310) may be formed only in the display area (10) on the planarization layer (270). For example, the pixel defining film (310) may cover both sides of the lower electrode (290) and expose a part of the upper surface of the lower electrode (290). The pixel defining film (310) may be formed using an organic material.

A blocking structure (550) may be formed between the first groove (930) and the third groove (970) on the substrate (110) located in the peripheral region (30). The blocking structure (550) may surround the opening region (20). For example, the blocking structure (550) may have a planar shape of a ring. Optionally, further blocking structures may be formed between the first groove (930) and the third groove (970). The blocking structure (550) may be formed using an organic material. For example, the blocking structure (550) and the pixel defining film (310) may be simultaneously formed using the same material. In other exemplary embodiments, the blocking structure (550) may include a lower blocking structure and an upper blocking structure. In this case, the lower blocking structure and the flattening layer (270) can be formed simultaneously using the same material, and the upper blocking structure and the pixel defining film (310) can be formed simultaneously using the same material.

The light-emitting layer (330) is formed on the pixel defining film (310) and the lower electrode (290) in the display area (10) and can extend in the first direction (D1), and can be formed in the peripheral area (30) on the substrate (110) and the blocking structure (550). In exemplary embodiments, the light-emitting layer (330) can be partially formed inside each of the first to third grooves (930, 950, 970), and can be spaced apart in the depth direction from the portion where each of the first to third grooves (930, 950, 970) is located. That is, the light-emitting layer (330) can be disconnected from the peripheral area (30). In other words, the light-emitting layer (330) can be separated from the peripheral area (30) by the first and second spaces (118, 119).

The light-emitting layer (330) may have a multilayer structure including an organic light-emitting layer (EML), a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL). In exemplary embodiments, the organic light-emitting layer (EML), the hole injection layer (HIL), the hole transport layer (HTL), the electron transport layer (ETL), and the electron injection layer (EIL) may be formed in the peripheral region (30). In other exemplary embodiments, the hole injection layer (HIL), the hole transport layer (HTL), the electron transport layer (ETL), and the electron injection layer (EIL) may be formed in the peripheral region (30) excluding the organic light-emitting layer (EML).

The organic light-emitting layer (EML) of the light-emitting layer (330) may be formed using at least one of light-emitting materials capable of emitting different color lights (i.e., red light, green light, blue light, etc.) depending on the sub-pixels. Alternatively, the organic light-emitting layer (EML) of the light-emitting layer (330) may emit white light overall by stacking a plurality of light-emitting materials capable of emitting different color lights, such as red light, green light, and blue light. In this case, a color filter may be formed on the light-emitting layer (330) formed on the lower electrode (290). The color filter may include at least one of a red color filter, a green color filter, and a blue color filter. Optionally, the color filter may include a yellow color filter, a cyan color filter, and a magenta color filter. The color filter may be formed using a photosensitive resin or a color photoresist.

The upper electrode (340) is formed to overlap on the light-emitting layer (330) of the display area (10), can extend in the first direction (D1), and can be formed in the peripheral area (30) on the light-emitting layer (330). In exemplary embodiments, the upper electrode (340) can be partially formed inside the first to third grooves (930, 950, 970), and can be spaced apart in the depth direction from the portions where each of the first to third grooves (930, 950, 970) is located. That is, the upper electrode (340) can be disconnected from the peripheral area (30). In other words, the upper electrode (340) can be separated from the peripheral area (30) by the first and second spaces (118, 119).

The upper electrode (340) may be formed using a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, or the like. These may be used alone or in combination with each other. In other exemplary embodiments, the upper electrode (340) may have a multilayer structure including a plurality of layers.

Accordingly, a light-emitting structure (200) including a lower electrode (290), a light-emitting layer (330), and an upper electrode (340) can be formed.

A capping layer (not shown) may be formed on the upper electrode (340). The capping layer is formed to overlap on the upper electrode (340) of the display area (10), may extend in the first direction (D1), and may be formed in the peripheral area (30) on the upper electrode (340). In exemplary embodiments, the capping layer may be partially formed inside each of the first to third grooves (930, 950, 970), and may be spaced apart in the depth direction from the portions where each of the first to third grooves (930, 950, 970) is located. That is, the capping layer may be disconnected from the peripheral area (30). In other words, the capping layer may be separated from the peripheral area (30) by the first and second spaces (118, 119). The capping layer may protect the light-emitting structure (200). In exemplary embodiments, the capping layer can be formed using an organic material such as a triamine derivative, an arylenediamine derivative, 4,4'-N,N'-dicarbazole-biphenyl, tris-8-hydroxyquinoline aluminum, and the like.

Referring to FIG. 13, a first thin film encapsulation layer (451) may be formed in the display area (10) and the peripheral area (30) on the upper electrode (340). The first thin film encapsulation layer (451) may be formed along the profile of the upper electrode (340) with a uniform thickness to cover the upper electrode (340) in the display area (10) and may extend to the peripheral area (30). In the peripheral area (30), the first thin film encapsulation layer (451) may be formed along the profile of the upper electrode (340). In other words, the first thin film encapsulation layer (451) may be continuously formed in a portion where each of the first to third grooves (930, 950, 970) is formed. In exemplary embodiments, the first thin film encapsulation layer (451) may completely cover each of the first to third grooves (930, 950, 970). In other words, the first thin film encapsulation layer (451) can cover the first and second protrusions (116, 117), can be formed in the first and second spaces (118, 119), and can completely cover the light-emitting layer (330) and the upper electrode (340) formed inside each of the first to third grooves (930, 950, 970). That is, the first thin film encapsulation layer (451) can directly contact the second organic film layer (113) in the first and second spaces (118, 119). The first thin film encapsulation layer (451) can prevent the light-emitting structure (200) from being deteriorated due to the penetration of moisture, oxygen, etc. In addition, the first thin film encapsulation layer (451) can also perform a function of protecting the light-emitting structure (200) from external impact. The first thin film encapsulation layer (451) can be formed using inorganic materials having flexibility.

A second thin film encapsulation layer (452) may be formed on a portion of the display area (10) and the peripheral area (30) on the first thin film encapsulation layer (451). In exemplary embodiments, the second thin film encapsulation layer (452) may fill the interior of the third groove (970) and may not be formed on the interior of each of the first groove (930) and the second groove (950). The second thin film encapsulation layer (452) may improve the flatness of the organic light emitting display device (100) and protect the light emitting structure (200). The second thin film encapsulation layer (452) may be formed using flexible organic materials.

Referring to FIG. 14, a third thin film encapsulation layer (453) may be formed in the display area (10) on the second thin film encapsulation layer (452) and the peripheral area (30) on the first thin film encapsulation layer (451). The third thin film encapsulation layer (453) may be formed along the profile of the second thin film encapsulation layer (452) with a uniform thickness in the display area (10) and may extend to the peripheral area (30). In the peripheral area (30), the third thin film encapsulation layer (453) may be formed along the profile of the first thin film encapsulation layer (451) with a uniform thickness. In other words, the third thin film encapsulation layer (453) may be formed continuously in the portions where each of the first to third grooves (930, 950, 970) is formed. The third thin film encapsulation layer (453) can prevent the light emitting structure (200) from being deteriorated due to the penetration of moisture, oxygen, etc., together with the first thin film encapsulation layer (451). In addition, the third thin film encapsulation layer (453) can also perform the function of protecting the light emitting structure (200) from external impact, together with the first thin film encapsulation layer (451) and the second thin film encapsulation layer (452). The third thin film encapsulation layer (453) can be formed using inorganic materials having flexibility.

Accordingly, a thin film encapsulation structure (450) including a first thin film encapsulation layer (451), a second thin film encapsulation layer (452), and a third thin film encapsulation layer (453) can be formed. Optionally, the thin film encapsulation structure (450) can be formed as a five-layer structure laminated with the first to fifth thin film encapsulation layers or a seven-layer structure laminated with the first to seventh thin film encapsulation layers.

A first insulating layer (390) may be formed in the display area (10) and the peripheral area (30) on the third thin film encapsulation layer (453). The first insulating layer (390) may be formed to cover the third thin film encapsulation layer (453) in the display area (10) and may be formed along the profile of the third thin film encapsulation layer (453) with a uniform thickness and may extend to the peripheral area (30). In the peripheral area (30), the first insulating layer (390) may be formed along the profile of the third thin film encapsulation layer (453) with a uniform thickness. In other words, the first insulating layer (390) may be formed continuously in the portions where each of the first to third grooves (930, 950, 970) is formed. The first insulating layer (390) may be formed using an organic material or an inorganic material. Optionally, the first insulating layer (390) may have a multilayer structure including a plurality of insulating layers. For example, the insulating layers may have different thicknesses or contain different materials.

Referring to FIG. 15, an organic insulating pattern (490) may be formed in a peripheral region (30) on a first insulating layer (390). In exemplary embodiments, the organic insulating pattern (490) may be formed only in the peripheral region (30), may cover the blocking structure (550), and may not overlap with the light-emitting structure (200). In addition, the organic insulating pattern (490) may surround the opening region (20) and may have a planar shape of a ring. The organic insulating pattern (490) may overlap with the first groove (930), the second groove (950), and the third groove (970), and may be located inside each of the first groove (930), the second groove (950), and the third groove (970). The organic insulating pattern (490) may block or absorb light incident from the outside, and may have an opaque color (for example, black). The organic insulating pattern (490) may be formed with a relatively thick thickness in the peripheral region (30) on the first insulating layer (390), and in this case, the organic insulating pattern (490) may have a substantially flat upper surface, and a flattening process may be added to the organic insulating pattern (490) to implement the flat upper surface of the organic insulating pattern (490). Optionally, the organic insulating pattern (490) may be formed along the profile of the first insulating layer (390) with a uniform thickness in the display region (10) on the first insulating layer (390). The organic insulating pattern (490) may be formed using an organic material such as a photoresist, a polyacrylic resin, a polyimide resin, a polyamide resin, a siloxane resin, an acrylic resin, an epoxy resin, or the like. In addition, the organic insulating pattern (490) may further include a light-blocking material to have a black color. The above-mentioned shading material can be formed using carbon black, titanium nitride, titanium black, phenylene black, aniline black, cyanine black, nigrosinic acid black, black resin, and the like.

Referring to FIG. 16, first touch screen electrodes (382) and second touch screen electrodes (384) may be formed in a display area (10) on a first insulating layer (390) (see FIG. 8). Each of the first touch screen electrodes (382) may extend in a second direction (D2) and may be formed spaced apart from each other in the first direction (D1). The second touch screen electrodes (384) may be formed spaced apart from each other in the second direction (D2) between two adjacent first touch screen electrodes (382) among the first touch screen electrodes (382). For example, each of the first and second touch screen electrodes (382, 384) may be formed using carbon nanotubes, transparent conductive oxides, indium tin oxide, indium gallium zinc oxide, zinc oxide, graphene, silver nanowires, copper, chromium, or the like.

A second insulating layer (395) may be formed in the display area (10) on the first touch screen electrodes (382) and the second touch screen electrodes (384). The second insulating layer (395) may be formed along the profile of the first and second touch screen electrodes (382, 384) with a uniform thickness to cover the first and second touch screen electrodes (382, 384) in the display area (10), and may extend to the peripheral area (30). In the peripheral area (30), the second insulating layer (395) may be formed along the profile of the organic insulating pattern (490). In other words, the second insulating layer (395) may be in contact with the upper surface of the first insulating layer (390) in the display area (10) and may be in contact with the upper surface of the organic insulating pattern (490) in the peripheral area (30). The second insulating layer (395) may be formed using an organic material or an inorganic material. Optionally, the second insulating layer (395) may have a multilayer structure including a plurality of insulating layers. For example, the insulating layers may have different thicknesses or include different materials.

Referring to FIG. 17, touch screen connection electrodes (386) may be formed in the display area (10) on the second insulating layer (395) (see FIG. 8). The touch screen connection electrodes (386) may electrically connect two second touch screen electrodes (384) adjacent in the first direction (D1) among the second touch screen electrodes (384) through a contact hole. For example, the touch screen connection electrodes (386) may be formed using the same material as the first and second touch screen electrodes (382, 384). Optionally, the touch screen connection electrodes (386) may be formed using a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, or the like. These may be used alone or in combination with each other.

A protective insulating layer (410) may be formed on the display area (10) and the peripheral area (30) on the second insulating layer (395) and the touch screen connection electrodes (386). The protective insulating layer (410) may be formed with a relatively thick thickness on the second insulating layer (395), and in this case, the organic insulating pattern (490) may have a substantially flat upper surface. Optionally, the protective insulating layer (410) may be formed along the profile of the touch screen connection electrodes (386) and the conductive pattern (400) to cover the touch screen connection electrodes (386) and the conductive pattern (400) with a uniform thickness on the display area (10) and the peripheral area (30) on the second insulating layer (395). The protective insulating layer (410) may be formed using an organic material.

Accordingly, a touch screen structure (380) including a first insulating layer (390), first touch screen electrodes (382), second touch screen electrodes (384), a second insulating layer (395), touch screen connection electrodes (386), and a protective insulating layer (410) can be formed.

A polarizing layer (430) may be formed on the touch screen structure (380). The polarizing layer (430) may be formed entirely on the substrate (110). The polarizing layer (430) may include a linear polarizing film and a λ/4 phase retardation film. The λ/4 phase retardation film may be formed on the protective insulating layer (410). The λ/4 phase retardation film may convert the phase of light. For example, the λ/4 phase retardation film may convert light vibrating up and down or light vibrating left and right into right-handed circularly polarized light or left-handed circularly polarized light, and may convert right-handed circularly polarized light or left-handed circularly polarized light into light vibrating up and down or light vibrating left and right. The λ/4 phase retardation film may be formed using a birefringent film including a polymer, an alignment film of a liquid crystal polymer, a film including an alignment layer of a liquid crystal polymer, or the like.

A linear polarizing film may be formed on the above λ/4 phase retardation film. The linear polarizing film may selectively transmit light. For example, the linear polarizing film may transmit light vibrating up and down or light vibrating left and right. In this case, the linear polarizing film may have a horizontal stripe pattern or a vertical stripe pattern. The linear polarizing film may be formed using an iodine-based material, a material containing a dye, or a polyene-based material.

After the polarizing layer (430) is formed, a laser may be irradiated to the opening area (20) on the polarizing layer (430). Optionally, another etching process may be performed to expose the opening area (20) on the glass substrate (105).

Referring to FIGS. 18, 19, and 7, an opening (910) may be formed in the opening region (20) by the laser irradiation, and a functional module (700) may be formed in the opening (910). In exemplary embodiments, the functional module (700) may be in contact with a side surface of the substrate (110), a side surface of the light-emitting layer (330), a side surface of the upper electrode (340), a side surface of the first thin film encapsulation layer (451), a side surface of the third thin film encapsulation layer (453), a side surface of the first insulating layer (390), a side surface of the organic insulating pattern (490), a side surface of the second insulating layer (395), a side surface of the protective insulating layer (410), and a side surface of the polarizing layer (430) at the boundary between the peripheral region (30) and the opening region (20). For example, the functional module (700) may include a camera module, a face recognition sensor module, a pupil recognition sensor module, an acceleration sensor module, a geomagnetic sensor module, a proximity sensor module, an infrared sensor module, an illuminance sensor module, a vibration module, a speaker module, and the like.

An adhesive layer (590) may be formed on the display area (10), peripheral area (30), and aperture area (20) on the polarizing layer (430) and the functional module (700). In other words, the adhesive layer (590) may be formed on the entire substrate (110). For example, the adhesive layer (590) may be formed using an optically transparent adhesive, a pressure-sensitive adhesive, or the like, including an acrylic adhesive, a silicone adhesive, a urethane adhesive, a rubber adhesive, a vinyl ether adhesive, etc. In other exemplary embodiments, after the adhesive layer (590) is formed on the polarizing layer (430), a laser may be irradiated to the aperture area (20) on the adhesive layer (590). In this case, the adhesive layer (590) may have an opening that exposes the aperture area (20).

A window member (600) may be formed in the display area (10), the opening area (20), and the peripheral area (30) on the adhesive layer (590). In other words, the window member (600) may be formed entirely on the substrate (110). The window member (600) may protect the polarizing layer (430), the touch screen structure (380), the light-emitting structure (200), the semiconductor element (250), etc. The window member (600) may include a plurality of layers. For example, the window member (600) may be formed using protective coating layers, base film layers, etc. made of organic or inorganic materials. The protective coating layer may be formed on the base film layer, and the protective coating layer may have a hardness greater than a hardness of the base film layer in order to protect the base film layer. The above base film layer may include polyimide, polyethylene terephthalate, polyethylene naphthalene, polypropylene, polycarbonate, polystyrene, polysulfone, polyethylene, polyphthalamide, polyethersulfone, polyarylate, polycarbonate oxide, modified polyphenylene oxide, urethane, thermoplastic polyurethane, and the like. In addition, the protective coating layer may include an acrylic material, an epoxy material, and the like. In other exemplary embodiments, the window member (600) may have a single layer.

After the window member (600) is formed, the glass substrate (105) can be separated from the substrate (110). Accordingly, the organic light emitting display device (100) illustrated in FIG. 7 can be manufactured.

In a conventional method for manufacturing an organic light emitting display device, a black matrix may be formed in a portion overlapping with a peripheral area (30) to prevent the light emitting layer (330) and the upper electrode (340) formed inside each of the first to third grooves (930, 950, 970), the blocking structure (550), and the first to third grooves (930, 950, 970) from being recognized by a user. The black matrix may be formed between an adhesive layer (590) and a window member (600). When the black matrix is formed, an alignment process may be added to accurately form the black matrix in the peripheral area (30), and the manufacturing cost may increase due to the addition of the black matrix, and an adhesion defect of the adhesive layer (590) may occur due to a step difference of the black matrix.

In a method for manufacturing an organic light-emitting display device according to exemplary embodiments of the present invention, an organic insulating pattern (490) having an opaque color that can prevent the light-emitting layer (330) and the upper electrode (340) formed inside each of the first to third grooves (930, 950, 970), the blocking structure (550), and the first to third grooves (930, 950, 970) from being recognized by a user can be formed. Accordingly, since the black matrix is not additionally formed and the alignment process is not added, the manufacturing cost of the organic light-emitting display device can be relatively reduced. In addition, since a step due to the black matrix is not generated, an adhesion failure of the adhesive layer (590) may not occur.

Although the present invention has been described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various modifications and changes may be made thereto without departing from the spirit and scope of the present invention as set forth in the claims below.

The present invention can be applied to various display devices that can be equipped with an organic light emitting display device. For example, the present invention can be applied to numerous display devices such as display devices for vehicles, ships, and aircraft, portable communication devices, display devices for exhibition or information transmission, medical display devices, etc.

10: Display area 20: Opening area
30: Peripheral area 40: Pad area
100: Organic light emitting display device 101: External device
105: Glass substrate 110: Substrate
111: First organic film layer 112: First barrier layer
113: Second organic film layer 114: Second barrier layer
116: First projection 117: Second projection
118: Space 1 119: Space 2
130: Active layer 150: Gate insulating layer
170: Gate electrode 190: Interlayer insulating layer
200: Display panel 210: Source electrode
230: Drain electrode 250: Semiconductor element
270: Flattening layer 290: Lower electrode
200: Light-emitting structure 310: Pixel defining film
330: Light-emitting layer 340: Upper electrode
380: Touch screen structure 382: First touch screen electrodes
384: Second touch screen electrodes 386: Touch screen connection electrodes
390: First insulation layer 395: Second insulation layer
410: Protective insulation layer 450: Thin film encapsulation structure
451 First thin film encapsulation layer 452: Second thin film encapsulation layer
453: Third thin film encapsulation layer 490: Organic insulating pattern
550: Blocking structure 700: Functional module
910: Opening 930: 1st groove
950: 2nd groove 970: 3rd groove
590: Adhesive layer 600: Window absence

Claims (32)

A substrate comprising an opening region, a peripheral region surrounding the opening region, and a display region surrounding the peripheral region, the substrate having a first groove having a lower portion extended formed in the peripheral region and an opening formed in the opening region;
A light-emitting structure disposed in the display area on the substrate;
a blocking structure disposed in the peripheral area on the substrate and surrounding the opening; and
covering the blocking structure in the peripheral area on the substrate, and including an organic insulating pattern having a first color;
An organic light-emitting display device, characterized in that the organic insulating pattern is arranged within the first groove. delete An organic light-emitting display device, characterized in that in claim 1, the organic insulating pattern blocks or absorbs light incident from the outside. An organic light-emitting display device, characterized in that in the third paragraph, the first color of the organic insulating pattern is black. An organic light-emitting display device, characterized in that in claim 1, the organic insulating pattern does not overlap with the light-emitting structure. In paragraph 1,
An organic light emitting display device characterized by further comprising a functional module arranged in the opening of the substrate. An organic light-emitting display device, characterized in that in claim 6, the functional module includes a camera module, a face recognition sensor module, a pupil recognition sensor module, an acceleration sensor module, a geomagnetic sensor module, a proximity sensor module, an infrared sensor module, and an illuminance sensor module. An organic light-emitting display device, characterized in that in claim 6, a side of the organic insulating pattern located at the boundary between the peripheral area and the opening area is in direct contact with the functional module. An organic light emitting display device, characterized in that in claim 1, the first groove surrounds the opening. An organic light emitting display device, characterized in that in the first aspect, the first groove is located between the blocking structure and the opening when the organic light emitting display device is viewed in a cross-sectional direction. An organic light-emitting display device, characterized in that in claim 1, the first groove has a planar shape of a ring when the organic light-emitting display device is viewed in a planar direction. In the first paragraph, the substrate,
First organic film layer;
A first barrier layer disposed on the first organic film layer;
A second organic film layer disposed on the first barrier layer and having a trench in the peripheral region; and
An organic light-emitting display device characterized by comprising a second barrier layer disposed on the second organic film layer, having a protrusion protruding inwardly of the trench on the trench, and having an opening defined by the protrusion. In the 12th paragraph, the protrusion of the second barrier layer is,
a first protrusion positioned adjacent to the opening of the substrate; and
An organic light emitting display device characterized by including a second protrusion facing the first protrusion and positioned spaced apart from the first protrusion in a direction from the opening area to the peripheral area. An organic light emitting display device, characterized in that in claim 12, the trench of the second organic film layer, the protrusion of the second barrier layer, and the opening of the second barrier layer are defined by a first groove extended from the lower portion of the substrate. In the first paragraph, the light-emitting structure,
lower electrode;
a light-emitting layer disposed on the lower electrode; and
An organic light-emitting display device characterized by including an upper electrode disposed on the light-emitting layer. An organic light emitting display device, characterized in that in claim 15, the light emitting layer extends in a direction from the display area to the peripheral area on the substrate, and the light emitting layer is disconnected at a portion where the first groove is formed. An organic light emitting display device, characterized in that in claim 15, the upper electrode extends from the display area to the peripheral area on the substrate, and the upper electrode is disconnected at a portion where the first groove is formed. An organic light emitting display device, characterized in that in claim 15, each of the light emitting layer and the upper electrode is disposed in at least a portion of the interior of the first groove. An organic light emitting display device, characterized in that in claim 15, each of the light emitting layer and the upper electrode is disposed on the blocking structure. In the first paragraph,
A thin film encapsulation structure disposed on the above light-emitting structure; and
An organic light emitting display device further comprising a touch screen structure disposed in the display area on the thin film encapsulation structure. In the 20th paragraph, the thin film encapsulation structure,
A first thin film encapsulating layer comprising an inorganic material;
A second thin film encapsulation layer disposed on the first thin film encapsulation layer and containing an organic material; and
An organic light emitting display device characterized by including a third thin film encapsulation layer disposed on the second thin film encapsulation layer and containing an inorganic material. An organic light emitting display device, characterized in that in claim 21, each of the first thin film encapsulation layer and the third thin film encapsulation layer extends from the display area to the peripheral area on the substrate and is continuously arranged in a portion where the first groove is formed. In the 21st paragraph, the touch screen structure,
A first insulating layer disposed on the display area on the third thin film encapsulation layer;
A touch screen electrode disposed on the first insulating layer;
A second insulating layer disposed on the touch screen electrode;
A touch screen connection electrode disposed on the second insulating layer; and
An organic light emitting display device characterized by including a protective insulating layer disposed on the touch screen connection electrode. An organic light emitting display device, characterized in that in claim 23, the first insulating layer extends from the display area to the peripheral area on the second thin film encapsulation layer and is continuously arranged in a portion where the first groove is formed. An organic light-emitting display device, characterized in that in claim 23, the first thin film encapsulation layer, the third thin film encapsulation layer, the first insulating layer and the first insulating layer are disposed on the blocking structure, and the organic insulating pattern is disposed between the first insulating layer and the second insulating layer. An organic light-emitting display device, characterized in that in claim 23, the second insulating layer contacts the upper surface of the first insulating layer in the display area and contacts the upper surface of the organic insulating pattern in the peripheral area. In the first paragraph, the substrate,
further comprising at least one lower extended second groove formed between the first groove and the opening of the substrate,
An organic light emitting display device, characterized in that the first groove surrounds the second groove. In the first paragraph, the substrate,
An organic light emitting display device characterized by further comprising at least one third groove surrounding the first groove. An organic light emitting display device, characterized in that in claim 28, the third groove surrounds the blocking structure. In the first paragraph,
A polarizing layer disposed in the display area and the peripheral area on the substrate; and
An organic light emitting display device characterized by further comprising a window member disposed on the polarizing layer. An organic light emitting display device, characterized in that in claim 30, the polarizing layer has an opening overlapping the opening of the substrate. In Article 30,
An organic light emitting display device further comprising an adhesive layer disposed between the polarizing layer and the window member.

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