KR102691116B1 - Cementation pad and cementation manufacturing equipment - Google Patents

Abstract

The bonding pad includes a first bonding portion, a first inner surface extending inward from the first bonding portion, a second bonding portion, and a second inner surface extending inward from the second bonding portion and contacting the first inner portion in the contact area. Includes. Each of the first joint portion and the second joint portion may include at least one curved surface. Each of the first inner surface and the second inner surface may have an acute angle with respect to the horizontal line.

Description

Cementation pad and cementation manufacturing equipment

Embodiments relate to cementation pads and cementation manufacturing equipment.

It is very important to efficiently perform cementation between different members and prevent cementation defects. When different members face each other, joining is relatively easy. On the other hand, it is not easy to join another member to a region with a curved surface among the members.

Recently, in electronic devices such as mobile phones, the area of the display panel is maximized by forming a curved surface at the edge.

In this case, it is not easy to bond the panel to the edge portion of the substrate.

As an example, cementation may be performed using a roller method. As shown in FIG. 1, after the panel 1 including the adhesive member 2 is positioned on the substrate 4, the roller 3 is rotated to move the panel 1 along one direction to the substrate 4. can be cemented to. However, since the radius of curvature of the edge portion 4a of the substrate 4 and the radius of curvature of the roller 3 are different, even if the roller 3 presses the edge portion 4a of the substrate 4, the panel 1 A bonding defect occurs in which the edge portion 4a of the substrate 4 is separated from the edge portion 4a without being bonded to the edge portion 4a.

As another example, cementation may be performed using a batch method. As shown in FIG. 2, a pressing member 5 that can cover the entire area including the edge portion 4a of the substrate 4 is provided. By pressing the pressing member 5, the panel 1 is bonded to the entire area of the substrate 4, i.e., the center and the periphery, simultaneously. However, as the flat area (near the center) of the substrate 4 and the edge portion 4a are simultaneously bonded by the pressing member 5, the air existing between the panel 1 and the flat area of the substrate 4 is Before it can escape, air bubbles are formed between the flat area of the panel 1 and the substrate 4, and these bubbles cause adhesion defects.

Republic of Korea Patent Publication No. 10-2017-0106552 (2017.09.21.)

Embodiments provide a cementation pad and a cementation manufacturing device that allow a panel to be uniformly and easily bonded to all areas of the substrate regardless of the shape of the substrate.

Embodiments provide a cementation pad and a cementation manufacturing device that can bond a panel to all areas of the substrate without defects such as air bubbles, regardless of the shape of the substrate.

According to one embodiment, the cementation pad includes: a first cementation portion; a first inner surface extending inward from the first joint; second joint portion; and a second inner surface extending inward from the second joint portion and contacting the first inner portion at a contact area. Each of the first joint portion and the second joint portion includes at least one curved surface, and each of the first inner surface and the second inner surface may have an acute angle with respect to the horizontal line.

According to another embodiment, a cementation manufacturing apparatus includes: a first cementation unit for aligning a panel to a substrate and temporarily cementing a portion of the panel to a portion of a first region that is a plane of the substrate; a second bonding unit for bonding the panel to a first region of the substrate using a first bonding pad; and a third bonding unit for bonding the panel to a second region of the substrate using a second bonding pad. The second region of the substrate may be in contact with both sides of the first region.

According to an embodiment, the panel is sequentially bonded to the first area (flat surface) of the first substrate and the second area (curved surface) extending on both sides of the first area, so that the air existing between the panel and the first substrate is released from the outside. It can be exhausted smoothly to prevent the generation of air bubbles.

According to an embodiment, the bonding pad has a bonding portion that is equal to or smaller than the radius of curvature of the second region located on both sides of the first region of the first substrate, and using the bonding portion, the panel is uniformly applied to the second region of the substrate. It is easily cemented and can prevent cementation defects.

According to an embodiment, a groove portion (formed by the first inner surface and the second inner surface) is provided between the first cementation part and the second cementation part of the cementation pad, so that even if the cementation pad is pressed, the lower side of the cementation pad is pressed against the first cementation pad. By not pressurizing the first region of the substrate, damage to the substrate due to pressure on the lower side of the bonding pad can be prevented. Additionally, the cementation pad can press the second region of the substrate more intensively to improve cementation performance.

According to an embodiment, by providing at least one recess between the first cementation portion and the second cementation portion of the cementation pad, when the cementation pad is pressed, the downward and outward movement generated in the first cementation portion and the second cementation portion The expansion in this direction allows the panel to be more smoothly adhered to the second region of the substrate.

Figure 1 is an exemplary diagram showing a conventional cementation manufacturing device.
Figure 2 is another illustration showing a conventional cementation manufacturing device.
Figure 3 shows a cementation manufacturing device according to an embodiment.
Figure 4 is a cross-sectional view showing a substrate according to an embodiment.
Figure 5 is a flowchart explaining the cementation process according to an embodiment.
Figures 6a to 6f show the temporary cementation process in the first cementation unit of Figure 3.
Figures 7a-7d show the first main cementing process in the second cementing unit of Figure 3.
Figures 8a-8e show the second main cementing process in the third cementing unit of Figure 3.
FIG. 9 shows a first cementation device provided in the second cementation unit of FIG. 3.
FIG. 10 shows a second cementing device provided in the third cementing unit of FIG. 3.
11A and 11B show a second cementation pad according to the first embodiment.
FIG. 12 is an enlarged view showing area A of FIG. 9A.
13A and 13B show a second cementation pad according to the second embodiment.
14A and 14B show a second cementation pad according to the third embodiment.
Figures 15 to 18 show a panel being bonded to a substrate using a second bonding pad.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. However, the technical idea of the present invention is not limited to some of the described embodiments, but may be implemented in various different forms, and as long as it is within the scope of the technical idea of the present invention, one or more of the components may be optionally used between the embodiments. It can be used by combining and replacing. In addition, terms (including technical and scientific terms) used in the embodiments of the present invention, unless explicitly specifically defined and described, are generally understood by those skilled in the art to which the present invention pertains. It can be interpreted as meaning, and the meaning of commonly used terms, such as terms defined in a dictionary, can be interpreted by considering the contextual meaning of the related technology. Additionally, the terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention. In this specification, the singular can also include the plural unless specifically stated in the phrase, and when described as “at least one (or more than one) of B and C”, it can be combined with A, B, and C. It may contain one or more of all possible combinations. Additionally, when describing the components of an embodiment of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish the component from other components, and are not limited to the essence, sequence, or order of the component. And, when a component is described as being 'connected', 'coupled' or 'connected' to another component, the component is not only directly connected, combined or connected to that other component, but also is connected to that component. It may also include cases where other components are 'connected', 'coupled', or 'connected' by another component between them. In addition, when described as being formed or disposed "on top or bottom" of each component, top or bottom refers not only to cases where two components are in direct contact with each other, but also to one or more components. This also includes cases where another component described above is formed or placed between two components. In addition, when expressed as “up (above) or down (down),” it can include not only the upward direction but also the downward direction based on one component.

Figure 3 shows a cementation manufacturing device according to an embodiment.

FIG. 3 shows that a cementation manufacturing apparatus according to an embodiment may include a first cementation unit 100, a second cementation unit 200, and a third cementation unit 300. The first cementation unit 100 and the second cementation unit 200 may be provided in the same space, and the third cementation unit 300 may be provided in a different space, but this is not limited.

Figure 4 is a cross-sectional view showing a substrate according to an embodiment.

Referring to FIG. 4, a panel (20 in FIG. 6) may be bonded to the substrate 10. The panel 20 may include, for example, an LCD panel, an OLED panel, etc., but is not limited thereto. The panel 20 can freely change its shape due to its flexible characteristics. The substrate 10 may be made of a transparent material. For example, the substrate 10 may be made of transparent glass or transparent plastic. When the panel 20 is driven, images or information output from the panel 20 may be displayed to the user through the board 10.

The substrate 10 may include a first region 11, second regions 13a and 13b, and third regions 15a and 15b.

The first area 11 may be a planar area located at the center of the substrate 10 . That is, the first area 11 may be an area parallel to the horizontal direction. For example, the top surface of the first area 11 may have a horizontal plane parallel to the horizontal direction.

The second areas 13a and 13b may be located on both sides of the first area 11 . For example, the second region may include a 2-1 region 13a extending from one side of the first region 11 and a 2-2 region 13b extending from the other side of the first region 11. . For example, the second areas 13a and 13b may have an edge shape or a round shape with at least one radius of curvature. For example, the 2-1 area 13a may have an edge shape or a round shape pointing upward from one side of the first area 11. For example, the 2-2 area 13b may have an edge shape or a round shape pointing upward from the other side of the first area 11.

The boundary point between the first area 11 and the 2-1 area 13a may be reference numeral 17a, and the boundary point between the first area 11 and the 2-2 area 13b may be reference numeral 17b. there is.

The third areas 15a and 15b include the 3-1 area 15a extending along the vertical direction from the 2-1 area 13a and the third area extending along the vertical direction from the 2-2 area 13b. It may include the 3-2 area (15b). The third areas 15a and 15b may have vertical planes parallel to the horizontal direction.

Figure 5 is a flowchart explaining the cementation process according to an embodiment.

Referring to FIGS. 3 to 5 , the first bonding unit 100 may perform a temporary bonding process to bond a portion of the panel 20 to the substrate 10 (S510).

The second bonding unit 200 may perform a process of bonding the panel 20 to the first region 11 of the substrate 10 (S520).

The third bonding unit 300 may perform a process of bonding the panel 20 to the second regions 13a and 13b of the substrate 10 (S530).

Hereinafter, with reference to FIGS. 6 to 8, the cementation process according to the embodiment will be described in detail.

Figures 6a to 6f show the temporary cementation process in the first cementation unit of Figure 3.

The first cementation unit 100 is located on the jig 501, the first driving means 111 on which the jig 501 is equipped with a plurality of suction pads 110a, 110b, and the jig 501, It may include a second driving means 121 equipped with a temporary cementation pad 120 located on the suction pad. For example, the first driving means 111 is configured within the second driving means 121.

The substrate 10 may be fixed to the jig 501. The plurality of suction pads 110a and 110b can adsorb or release the panel 20 by moving up and down in the z-axis and moving and rotating in the x- and y-axes by the second driving means.

The temporary bonding pad 120 and the suction pads 110a and 110b can be moved up and down by the second driving means 121 and can locally bond the panel 20 to the substrate.

A protrusion 122 may be provided on the lower portion of the temporary cementation pad 120. The protrusion 122 may have a round shape.

For example, the height h of the protrusion 122 may be 0.5 millimeters to 10 millimeters. For example, when the height h of the protrusion 122 is less than 0.5 millimeter, a large area of the panel 20 can be bonded to the substrate 10. For example, when the height (h) of the round protrusion 122 exceeds 10 millimeters, a small area of the panel 20 is bonded to the substrate 10, so that the panel 20 is attached to the substrate 10 when moving to the next process. can be detached from.

As shown in FIG. 6A, when the panel 20 is loaded into the first cementation unit 100, a plurality of suction pads 110a, 1110b and the temporary cementation pad 120 are formed by the second driving means 121. The panel 20 can be fixed by lowering at the same time. At this time, the release film 22 may be attached to the panel 20 with an adhesive member (not shown) interposed therebetween. The adhesive member may be, for example, OCA (Optically Clear Adhesive), but is not limited thereto. The release film 22 can prevent contamination of the adhesive member.

As shown in FIG. 6B, the release film 22 may be removed from the panel 20 and the adhesive member may be exposed to the outside. As will be explained later, the panel 20 may be bonded to the substrate 10 using an adhesive member.

As shown in FIG. 6C, the substrate 10 is loaded, and the second driving means 121 moves and rotates in the x-axis and y-axis to align the position of the panel 20 with respect to the substrate 10. .

As shown in FIG. 6D, as the plurality of adsorption parts 110a and 110b move upward by the first driving means 111, the panel 20 is positioned at the lowest point of the protrusion 122 of the temporary cementation pad 120. It can be accessed locally.

As shown in FIG. 6E, the plurality of adsorption parts 110a, 1110b and the temporary bonding pad 120 move downward simultaneously by the second driving means 121, so that the protrusion 122 of the temporary bonding pad 120 The panel 20 corresponding to may be in contact with the substrate 10. Thereafter, the second driving means 121 moves additionally downward and presses the temporary bonding pad 120, so that the panel 20 corresponding to the protrusion 122 of the temporary bonding pad 120 is locally temporarily bonded to the substrate. You can.

As shown in FIG. 6F, the panel 20 is detached from the plurality of suction pads 110a and 110b by releasing the suction by the plurality of suction pads 110a and 110b, and the first driving means 111 and the first driving means 111 2 The plurality of suction pads 110a, 110b and the temporary bonding pad 120 can be moved upward to their original positions by the driving means 121.

Accordingly, the central area of the panel 20 can be bonded to the substrate 10, and the remaining area of the panel 20 can be placed on the substrate 10. Accordingly, the panel is bonded to a portion of the first region 11 of the substrate 10, but is not bonded to the remaining portion of the first region 11 and the second regions 13a and 13b of the substrate 10.

The second bonding unit 200 and the third bonding unit 300 sequentially attach the remaining area of the panel 20 to the remaining part of the first area 11 and the second areas 13a and 13b of the substrate 10. A cementing process can be performed.

Figures 7a-7d show the first main cementing process in the second cementing unit of Figure 3.

The second cementation unit 200 may include a jig 503, a vacuum chamber 505 positioned on the jig 503 and capable of moving up and down, and a driving means 217 equipped with a first cementation pad 212. there is. The first cementation pad 212 may be fastened to the driving means 217 through the jig 211. The first cementation pad 212 may be attached to the jig 211 using an adhesive material.

Although not shown, jig 503 may be installed on the stage.

The first cementation pad 212 may have a protrusion 215 . The protrusion 215 may have a round shape. The protrusion 215 protrudes outward and may have a curved surface. When the first cementation pad 212 is pressed, the curved surface of the protrusion 215 may contact the panel 20. That is, the center of the curved surface contacts the panel 20 first, and as the first cementation pad 212 is gradually pressed, it can contact the panel 20 in the order from the center of the curved surface to the periphery. When the peripheral portion of the curved surface contacts the panel 20, stronger pressure is applied to the center of the curved surface, so that the panel 20 can be bonded to the center of the first region 11 of the substrate 10 at the center of the curved surface. Thereafter, strong pressure is applied to the periphery of the curved surface, so that the panel 20 is adhered to the periphery of the first area 11 of the substrate 10 at the periphery of the curved surface, so that the panel 20 is adhered to the periphery of the first area 11 of the substrate 10. It can be cemented throughout (11).

The height (h) of the protrusion 215 may be between 0.2 millimeters and 6 millimeters. When the height h of the round protrusion 215 is less than 0.2 millimeter, the panel 20 is simultaneously bonded to the center and peripheral portions of the first region 11 of the substrate 10 by the first bonding pad 212. Air bubbles may be generated. When the height (h) of the round protrusion 215 exceeds 6 millimeters, even if the first cementation pad 212 is applied with a predetermined pressure, elastic pressure is not applied well to the periphery of the protrusion 215, so that the panel (20) ) may not be adhered to the periphery of the first region 11 of the substrate 10. In addition, when the height h of the round protrusion 215 exceeds 6 millimeters, the first bonding pad 212 is pressed and the first bonding pad 212 is bonded to the peripheral portion, the substrate 10 Cracks may occur due to strong pressing force in the center.

As shown in FIG. 7A, when the substrate 10 to which the panel 20 is locally bonded through the process in the first bonding unit 100 is received, the substrate 10 is fixed to the jig 503. You can.

After the vacuum chamber 505 moves downward and comes into close contact with the jig 503, the air in the space formed by the vacuum chamber 505 and the jig 503 is exhausted through the exhaust part 218 to form the vacuum chamber 505 and the jig 503. A vacuum may be formed by the jig 503.

As shown in FIG. 7C, the driving means 217 moves downward so that the lowest point of the protrusion 215 of the first cementation pad 212 comes into contact with the panel 20. Thereafter, the driving means 217 moves additionally downward to pressurize the first cementation pad 212, so that the panel corresponding to the center of the first cementation pad 212 is pressed by the center of the first cementation pad 212. (20) is bonded to the center of the first region 11 of the substrate 10, and then the panel 20 is bonded to the substrate 10 by applying pressure in the order from the center to the periphery of the first bonding pad 212. It can be sequentially cemented from the center to the periphery of the first region 11. Accordingly, the panel 20 can be bonded to the entire first region 11 of the substrate 10 by the first bonding pad 212 .

The panel 20 is bonded in order from the center to the periphery of the first region 11 of the substrate 10 by the first bonding pad 212, so that the panel 20 and the first region 11 of the substrate 10 ) is moved from the center of the first region 11 of the substrate 10 to the periphery and is exhausted to the outside, thereby preventing the generation of bubbles.

As shown in FIG. 7D, the exhaust unit 218 is opened and atmospheric air is supplied to the vacuum chamber 505, so that the vacuum chamber 505 is in a standby state. Afterwards, the vacuum chamber 505 and the driving means 217 may move upward to their original positions.

Figures 8a-8e show the second main cementing process in the third cementing unit of Figure 3.

The third cementation unit 300 may include a jig 508, a vacuum chamber 507 located on the jig 508 and capable of moving up and down, and a driving means 317 equipped with a second cementation pad 312. there is. The second cementation pad 212 may be fastened to the driving means 317 through the jig 311. The second cementation pad 312 may be attached to the jig 311 using an adhesive material. Jig 508 may be installed on stage 507.

The shape of the second cementation pad will be described in detail later.

As shown in FIG. 8A , when a substrate having a panel bonded to the first region through a process in the second bonding unit 300 is received, the corresponding substrate 10 may be fixed to the jig 508 .

As shown in FIG. 8B, the stage 507 can be moved in the U, V, and W directions to align the position of the substrate 10 to the second bonding pad 312.

As shown in FIG. 8C, after the vacuum chamber 507 moves downward and comes into close contact with the jig 508, the air in the space formed by the vacuum chamber 507 and the jig 508 is blown out through the exhaust part 318. By exhausting the vacuum, a vacuum can be formed by the vacuum chamber 507 and the jig 508.

As shown in FIG. 8D, the driving means 317 moves downward so that the first and second bonding parts (321 and 322 in FIG. 11A) located on both sides of the second bonding pad 312 are attached to the panel 20. You can access it. Thereafter, the driving means 317 moves additionally downward to pressurize the second cementation pad 312, thereby increasing the pressure at the first and second cementation portions (321 and 322 in FIG. 11A) of the second cementation pad 312. The panel 20 corresponding to the first and second bonding portions (321 and 322 in FIG. 11A) of the second bonding pad 312 can be bonded to the second regions 13a and 13b of the substrate 10. . Specifically, as shown in FIG. 4, when the second bonding pad 312 is gradually pressed, the first bonding pad 212 adheres to the first region 11 and the second region 13a of the substrate 10. , 13b) is in contact with the panel 20 corresponding to the boundary points 17a and 17b, and this panel 20 is pressed so that the panel 20 is in contact with the first region 11 and the second region of the substrate 10. It can be cemented at the boundary points 17a and 17b between the areas 13a and 13b. As another example, when the second cementation pad 312 is gradually pressed, the second cementation pad 312 moves between the boundary points 17a and 17b and from the boundary points 17a and 17b toward the center of the substrate 10. It is also possible to contact the panel 20 corresponding to a point in the area between points spaced a certain distance apart. The certain distance may be, for example, 3 millimeters or less. Thereafter, the panel 20 is placed in the second region of the substrate 10 in order from the boundary points 17a, 17b between the first region 11 and the second regions 13a, 13b of the substrate 10 to the outside. 13a, 13b) can be cemented. As another example, the panel 20 is positioned in one of the areas between the boundary points 17a, 17b of the substrate 10 and a point spaced less than 3 millimeters from the boundary points 17a, 17b toward the center of the substrate 10. It can be bonded to the second regions 13a and 13b of the substrate 10 in order from the point outwards. This may be possible due to the geometric shape of the second cementation pad 312. The second cementation pad 312 will be described in detail later.

According to the embodiment, bubbles are generated by sequential cementation such that the panel 20 is bonded starting from the first region 11 of the substrate 10 and then bonded to the second regions 13a and 13b of the substrate 10. It is possible to prevent cementation defects by fundamentally blocking the process.

According to an embodiment, the shape of the second bonding pad 312 is made to correspond to the shape of the second regions 13a and 13b of the substrate 10, so that the panel 20 is formed into the second regions 13a and 13b of the substrate 10. 13b), the panel 20 and the second regions 13a and 13b of the substrate 10 are easily and uniformly bonded without any lifting, thereby preventing bonding defects.

As shown in Figure 8e, after air is injected into the space between the vacuum chamber 507 and the jig 508 to create an atmospheric state, the vacuum chamber 507 and the driving means 317 can move upward to their original positions. there is.

Meanwhile, the temporary cementation pad 120 of the first cementation unit 100, the first cementation pad 212 of the second cementation unit 200, and/or the second cementation pad 312 of the third cementation unit 300 may be formed of an elastic material. For example, the temporary bonding pad 120, the first bonding pad 212, and/or the second bonding pad 312 may be formed of one of silicone, rubber, and resin materials such as silicone or epoxy. The resin material may include, for example, epoxy resin.

FIG. 9 shows a first cementation device provided in the second cementation unit of FIG. 3.

The first cementation device 210 according to the embodiment may be provided in the second cementation unit 200.

The first cementation device 210 may include a jig 211, a first cementation pad 212 mounted on the jig 211, and first and second deformation suppression blocks 213 and 214.

The first cementation device 210 may be pressed in an upward and downward direction by a pressing device (not shown). For example, when the first bonding device 210 is located below the panel 20, the first bonding device 210 is pressed upward by the pressing device, so that the panel 20 is It can be cemented in area 1 (11).

The jig 211 serves to support the first cementation device 210 as a whole. The jig 211 is equipped with a mounting portion (not shown), and the first cementation pad 212 can be mounted on this mounting portion using an adhesive material.

When the first cementation pad 212 is pressed, the first and second deformation suppression blocks 213 and 214 suppress elastic deformation in the vertical direction generated in the first cementation pad 212 and prevent elastic deformation in the left and right directions. It can be promoted. For example, when the first cementation pad 212 is pressed, elastic deformation may occur in the upper, lower, left, and right directions of the first cementation pad 212. Here, elastic deformation can be defined as a force pushing in a specific direction. For example, the elastic deformation of the first cementation pad 212 in the vertical direction may be a force pushing the first cementation pad 212 in the vertical direction.

In the embodiment, the elastic deformation generated in the vertical direction of the first cementation pad 212 is suppressed and the elastic deformation generated in the vertical direction of the first cementation pad 212 is converted to the left and right directions, thereby forming the first cementation pad 212. The converted elastic deformation is added to the elastic deformation generated in the left and right directions of the first cementation pad 212, so that the elastic deformation of the first cementation pad 212 in the left and right directions may be enhanced. By using this enhanced elastic deformation in the left and right directions, the panel 20 can be more strongly and uniformly bonded to the entire first region 11 of the substrate 10 by the first bonding pad 212. there is.

FIG. 10 shows a second cementation device provided in the third cementation unit of FIG. 3.

The second cementation device 310 according to the embodiment may be provided in the third cementation unit 300.

The second cementation device 310 may include a jig 311, a second cementation pad 312 mounted on the jig 311, and first and second deformation suppression blocks 313 and 314.

The second cementation device 310 may be pressed in an upward and downward direction by a pressing device (not shown). For example, when the second bonding device 310 is located below the panel 20, the second bonding device 310 is pressed upward by the pressing device, so that the panel 20 is It can be cemented in two areas (13a, 13b).

The jig 311 serves to support the second cementation device 310 as a whole. The jig 311 is provided with a mounting portion (not shown), and the second cementation pad 312 can be mounted on this mounting portion using an adhesive material. When the second cementation pad 312 is pressed, the first and second deformation suppression blocks 313 and 314 suppress elastic deformation in the vertical direction generated in the second cementation pad 312 and prevent elastic deformation in the left and right directions. It can be promoted. For example, when the second cementation pad 312 is pressed, elastic deformation may occur in the upper, lower, left, and right directions of the second cementation pad 312. In this case, since the second regions 13a and 13b, that is, the edge portions, of the second substrate 10 to which the panel 20 is to be bonded do not exist on the upper and lower sides of the second bonding pad 312, the second bonding pad ( 312), the elastic deformation generated in the vertical direction may act as a waste element.

In the embodiment, the elastic deformation generated in the vertical direction of the second cementing pad 312 is suppressed and the elastic deformation generated in the vertical direction of the second cementing pad 312 is converted to the left and right directions, thereby forming the second cementing pad 312. The converted elastic deformation is added to the elastic deformation generated in the left and right directions of the second cementation pad 312, so that the elastic deformation of the second cementation pad 312 in the left and right directions may be enhanced. By using the improved elastic deformation in the left and right directions in this way, the panel 20 is more strongly and uniformly bonded to the entire second region 13a and 13b of the substrate 10 by the second bonding pad 312. It can be.

11A and 11B show a second cementation pad according to the first embodiment.

The second bonding pad 312 according to the first embodiment may include a first bonding portion 321 and a second bonding portion 322.

As shown in FIG. 12, the first bonding portion 321 and the second bonding portion 322 may be arranged to be spaced apart from each other. For example, the first bonding portion 321 may be located below the first side of the second bonding pad 312, and the second bonding portion 322 may be located below the second side of the second bonding pad 312. there is. For example, the distance between the first bonding portion 321 and the second bonding portion 322 may be smaller than the distance between the 3-1 region 15a and the 3-2 region 15b of the substrate 10.

Each of the first joint portion 321 and the second joint portion 322 may include at least one curved surface 323 or 324.

The first curved surface 323 may be located outside each of the first joint portion 321 and the second joint portion 322. For example, the first curved surface 323 may have a first radius of curvature that is at least smaller than the radius of curvature of the second regions 13a and 13b of the substrate 10 . When the second cementation pad 312 is pressed, the elastic deformation force of the first curved surface 323 of each of the first cementation portion 321 and the second cementation portion 322 increases in the outward direction, so that the first curved surface 323 ) The panel 20 may be bonded to the second regions 13a and 13b of the substrate 10 by applying pressure.

The first curved surface 323 may be formed between the 1-1 point 323a and the 1-2 point 323b located on the inside.

The second curved surface 324 may be located inside each of the first joint portion 321 and the second joint portion 322. The second curved surface 324 may be in contact with the first curved surface 323. Specifically, the second curved surface 324 may contact the 1-1 point 323a of the first curved surface 323.

The second curved surface 324 may have a second radius of curvature that is larger than the first radius of curvature of the first curved surface 323. The second curved surface 324 may be formed between the 2-1 point 324a and the 2-2 point 324b located on the inside. In this case, the 2-2 point 324b of the second curved surface 324 may contact the 1-1 point 323a of the first curved surface 323.

The 2-1 point 324a of the second curved surface 324 is located at the boundary point 17a, 17b between the first region 11 and the second region 13a, 13b of the substrate 10. It can be accessed through . Accordingly, the panel 20 is bonded at least from the boundary points 17a and 17b between the first region 11 and the second regions 13a and 13b of the substrate 10 by pressing the second curved surface 324. In this way, after bonding is achieved between the panel 20 and the first region 11 of the substrate 10 by applying pressure of the first bonding pad 212, the first bonding portion of the second bonding pad 312 ( 321) and the second bonding portion 322, the panel 20 is pressed to the boundary between the first region 11 and the second region 13a and 13b of the substrate 10 by pressing the second curved surface 324 of each. It can be sequentially cemented from the points 17a and 17b to the entire second area 13a and 13b.

As another example, the 2-1 point 324a of the second curved surface 324 is spaced from the boundary points 17a and 17b by less than 3 millimeters in the direction of the center of the substrate 10. One point in the area between the points can be contacted with the panel 20 interposed therebetween. Accordingly, by pressing the second curved surface 324, a space between the boundary points 17a and 17b of the panel 20 and a point spaced from the boundary points 17a and 17b by less than 3 millimeters in the direction of the center of the substrate 10 is applied. It can be bonded from one point of the region, so that after bonding is achieved between the panel 20 and the first region 11 of the substrate 10 by the pressure of the first bonding pad 212, the second bonding pad 312 ), the panel 20 is connected to the boundary points 17a and 17b by pressing the second curved surface 324 of each of the first and second joint parts 321 and 322. It may be sequentially bonded to the entire second region 13a and 13b from one point in the region between points spaced less than 3 millimeters apart in the center direction of the substrate 10.

Meanwhile, the gap between the first bonding portion 321 and the 3-1 region 15a of the first substrate 10 or the second bonding portion 322 and the 3-2 region of the first substrate 10 ( The spacing between 15b) may be changed depending on the elastic deformation pressure of the second cementation pad 312.

The first bonding portion 321 of the second bonding pad 312 may be spaced apart from the boundary point between the 2-1 region 13a and the 3-1 region 15a of the substrate 10. For example, the outermost end of the first bonded portion 321, that is, the 1-2 point 323b of the first curved surface 323, is connected to the 2-1 region 13a and the 3-1 region of the substrate 10. (15a) may be spaced apart from the boundary point between. For example, the 1-2 point 323b of the first curved surface 323 is 0.3 millimeter to 3 millimeters from the boundary point between the 2-1 region 13a and the 3-1 region 15a of the substrate 10. may be separated.

The second bonding portion 322 of the second bonding pad 312 may be spaced apart from the boundary point between the 2-2 region 13b and the 3-2 region 15b of the substrate 10. For example, the outermost end of the second bonding portion 322, that is, the 1-2 point 323b of the first curved surface 323, is located between the 2-1 region 13a and the 3-2 region of the substrate 10. (15b) may be spaced apart from the boundary point between. The 1-2 point 323b of the first curved surface 323 is spaced from 0.3 millimeter to 3 millimeters from the boundary point between the 2-2 region 13b and the 3-2 region 15b of the substrate 10. You can.

In this way, the 1-2 point 323b of the first curved surface 323 is spaced apart from the boundary point between the 2-1 region 13a and the 3-1 region 15a of the substrate 10 and the second The 1-2 point 323b of the curved surface 324 is spaced apart from the boundary point between the 2-2 region 13b and the 3-2 region 15b of the substrate 10, thereby forming a second bonding pad 312. ) can be easily moved up and down between the 3-1 region 15a and the 3-2 region 15b of the substrate 10. In addition, when the second bonding pad 312 is lowered and then pressed, the first curved surface 323 of the first bonding portion 321 and the first curved surface 323 of the second bonding portion 322 move in an outward direction. It is elastically deformed so that the 1-2 point 323b of the first curved surface 323 is positioned in the 2-1 region 13a and 2-2 region 13b of the substrate 10 with the panel 20 interposed therebetween. You can access the work area of .

The second cementation pad 312 according to the first embodiment may include a first inner surface 325 and a second inner surface 326.

The first inner surface 325 and the second inner surface 326 may be symmetrical with respect to the center of the second cementation pad 312, but this is not limited.

The first inner surface 325 may extend inward from the first joint portion 321. The first inner surface 325 may have an acute angle with respect to the horizontal line. For example, the first inner surface 325 may have an angle of 5 degrees to 30 degrees with respect to the horizontal line. Accordingly, the first inner surface 325 may be a surface extending diagonally from the first joint portion 321 at an angle of 5 degrees to 30 degrees.

The second inner surface 326 may extend inward from the second joint portion 322. The second inner surface 326 may have an acute angle with respect to the horizontal line. For example, the second inner surface 326 may have an angle of 5 degrees to 30 degrees with respect to the horizontal line. Accordingly, the second inner surface 326 may be a surface extending diagonally from the first joint portion 321 at an angle of 5 degrees to 30 degrees.

The first inner surface 325 and the second inner surface 326 may meet at the center of the second cementation pad 312, and the point where they meet can be defined as a contact area (329 in FIG. 13A). The angle between the first inner surface 325 and the second inner surface 326 in this contact area 329 may have an obtuse angle. For example, the angle between the first inner surface 325 and the second inner surface 326 in the contact area 329 may be 120 degrees to 170 degrees.

In this case, a groove 350 recessed inward with respect to the horizontal line may be formed by the first inner surface 325 and the second inner surface 326. Even if the first bonding pad 212 is pressed by the groove 350, the panel 20 is not bonded to the first region 11 of the substrate 10, and the first bonding portion 321 and the second bonding pad 212 are not bonded to the first region 11 of the substrate 10. It can be bonded only to the second regions 13a and 13b of the substrate 10 by the portion 322.

The second cementation pad 312 according to the first embodiment may include a first outer surface 327 and a second outer surface 328.

The first outer surface 327 and the second outer surface 328 may be symmetrical with respect to the center of the second bonding pad 312, but this is not limited.

The first outer surface 327 may extend outward from the first joint portion 321. The first outer surface 327 may have an acute angle with respect to the vertical line. For example, the first outer surface 327 may have an angle of 3 to 35 degrees with respect to the vertical line. Accordingly, the first outer surface 327 may be a surface extending diagonally from the first joint portion 321 at an angle of 3 degrees to 35 degrees.

The second outer surface 328 may extend outward from the second joint portion 322. The second outer surface 328 may have an acute angle with respect to the vertical line. For example, the second outer surface 328 may have an angle of 3 to 35 degrees with respect to the vertical. Accordingly, the second outer surface 328 may be a surface extending diagonally from the second joint portion 322 at an angle of 3 degrees to 35 degrees.

The upper area of the second cementation pad 312 may be mounted on the mounting portion of the second cementation device 310. Each of the first outer surface 327 and the second outer surface 328 may be in contact with the upper area of the second bonding pad 312.

Meanwhile, a recess 331 may be provided in the area where the first inner surface 325 and the second inner surface 326 meet, that is, the contact area 329.

When the second bonding pad 312 is pressed, the recess 331 may further strengthen the elastic deformation of the first bonding portion 321 and the second bonding portion 322 in the outward direction. That is, when the second cementation pad 312 is pressed, the recess 331 expands further in the transverse direction, and the expansion of the recess 331 in the transverse direction causes the first cementation portion 321 and The elastic deformation of the second bonding portion 322 is further strengthened in the outward direction, so that the second bonding portion 322 can be bonded more strongly to the second regions 13a and 13b of the substrate 10 of the panel 20. In addition, when the second cementation pad 312 is pressed by the recess 331, the lifespan can be extended by preventing the cementation pad 312 from being torn or a strong load being generated when the recess 331 is not present. there is.

The recess 331 may be a groove recessed inward. The recess 331 may have a hemispherical shape, but is not limited thereto. The recess 331 may have a radius of curvature of, for example, 2.5 millimeters to 5 millimeters.

The recess 331 may be formed long along the longitudinal direction of the second cementation pad 312.

Although not shown, the recesses 331 may be provided in plural numbers spaced apart from each other along the longitudinal direction of the second cementation pad 312.

13A and 13B show a second cementation pad according to the second embodiment.

The second embodiment is the same as the first embodiment except for at least two recesses 332 and 333. Accordingly, in the second embodiment, components having the same shape, structure, and/or function as those of the first embodiment are assigned the same reference numerals, and detailed descriptions are omitted.

At least one recess 332 may be formed on the first inner surface 325. At least one recess 333 may be formed on the second inner surface 326.

The recesses 332 and 333 may be equal to or smaller than the radius of curvature of the recess 331 according to the first embodiment.

The recesses 332 and 333 may be formed long along the longitudinal direction of the second cementation pad 312.

Although not shown, the recesses 332 and 333 may be provided in plural numbers spaced apart from each other along the longitudinal direction of the second bonding pad 312.

14A and 14B show a second cementation pad according to the third embodiment.

The third embodiment may be a combination of the recess 331 of the first embodiment and the recesses 332 and 333 of the second embodiment. Accordingly, in the third embodiment, components having the same shape, structure, and/or function as those of the first embodiment and/or the second embodiment are assigned the same reference numerals, and detailed descriptions are omitted.

A recess 331 is provided in the area where the first inner surface 325 and the second inner surface 326 meet, that is, the contact area 329, and at least one recess ( 332) may be provided, and at least one recess 333 may be provided on the second inner surface 326.

The recesses 331, 332, and 333 may be formed long along the longitudinal direction of the second cementation pad 312.

Although not shown, the recesses 331, 332, and 333 may be provided in plural numbers spaced apart from each other along the longitudinal direction of the second cementation pad 312.

Figures 15 to 18 show the panel being bonded to the substrate using the second bonding pad.

As shown in FIGS. 5 and 15, the second bonding pad 312 is pressed to the 2-1 point of the second curved surface 324 of each of the first bonding portion 321 and the second bonding portion 322. 324a may be in contact with the boundary points 17a and 17b between the first region 11 and the second region 13a and 13b of the substrate 10 with the panel 20 interposed therebetween.

As another example, the second bonding pad 312 is pressed so that the 2-1 point 324a of the second curved surface 324 of each of the first bonding portion 321 and the second bonding portion 322 is moved to the panel 20. ) may be in contact with a point in the area between the boundary points 17a, 17b of the substrate 10 and a point spaced less than 3 millimeters from the boundary points 17a, 17b.

As shown in FIGS. 3 and 4 , the panel 20 may be bonded to the first region 11 of the substrate 10 in the second bonding unit 200 . That is, the panel 20 extends from the center of the first region 11 of the substrate 10 to the boundary points 17a and 17b between the first region 11 and the second regions 13a and 13b of the substrate 10. It can be cemented up to. In the subsequent process, in the third bonding unit 300 equipped with the second bonding pad 312, the panel 20 can be bonded to the second regions 13a and 13b of the substrate 10. In particular, the panel 20 has at least a boundary point 17a, 17b between the first region 11 and the second region 13a, 13b of the substrate 10 or a boundary point 17a, 17b of the substrate 10. It must be cemented in order from one point in the area between the boundary points 17a and 17b and a point spaced less than 3 millimeters away from the boundary points 17a and 17b towards the outside to achieve excellent cementation quality without generating bubbles. Therefore, according to the embodiment, by changing the shape of the second cementation pad 312, when the second cementation pad 312 is pressed, the second curved surface of each of the first cementation portion 321 and the second cementation portion 322 The 2-1 point 324a of 324 is the boundary point 17a, 17b between the first region 11 and the second region 13a, 13b of the substrate 10 with the panel 20 interposed therebetween. can be accessed.

According to the embodiment, by changing the shape of the second cementation pad 312, when the second cementation pad 312 is pressed, the second curved surface 324 of each of the first cementation portion 321 and the second cementation portion 322 ) is the area between the boundary points 17a and 17b of the substrate 10 with the panel 20 interposed between the 2-1 point 324a and a point spaced less than 3 millimeters from the boundary points 17a and 17b. can be reached at one point.

5 and 16, when the second bonding pad 312 is additionally pressed, the second curved surfaces 324 of each of the first bonding portion 321 and the second bonding portion 322 are elastic. Deformation may cause expansion in a downward and/or outward direction. Accordingly, the second curved surface 324 of each of the first bonded portion 321 and the second bonded portion 322 is formed on the panel 20 in the order from the 2-1 point 324a to the 2-2 point 324b. ) is pressed, so that the panel 20 can be bonded to a portion of the second regions 13a and 13b of the substrate 10 corresponding to the second curved surface 324.

As shown in FIGS. 5 and 17 , the first curved surface 323 and the second curved surface 324 of the first joint portion 321 and the second joint portion 322 may be in contact with each other. That is, the 1-1 point 323a of the first curved surface 323 and the 2-2 point 324b of the second curved surface 324 may be the same point.

When the second bonding pad 312 is additionally pressed, the panel 20 may be bonded to a corresponding portion of the substrate 10 corresponding to the 1-1 point 323a of the first curved surface 323.

5 and 18, when the second bonding pad 312 is additionally pressed, the first curved surface 323 of each of the first bonding portion 321 and the second bonding portion 322 is elastic. Deformation may cause expansion in a downward and/or outward direction. Accordingly, the panels 20 are arranged in the order from the 1-1 point 323a to the 2-2 point 324b of the first curved surface 323 of each of the first bonded portion 321 and the second bonded portion 322. ) is pressed, so that the panel 20 can be bonded to other parts of the second regions 13a and 13b of the substrate 10 corresponding to the first curved surface 323.

Embodiments may be applied to fields that require bonding between different members, such as electronic devices.

Claims (20)

A bonding pad for bonding a panel to a substrate including a first region that is a horizontal plane, a second region that is in contact with both sides of the first region, and a third region that is a vertical plane that is in contact with the second region,
first cementation portion;
a first inner surface extending inward from the first joint;
second joint portion; and
It includes a second inner surface extending inward from the second joint portion and contacting the first inner surface at a contact area,
Each of the first joint portion and the second joint portion includes at least one curved surface,
Each of the first inner surface and the second inner surface has an acute angle with respect to the horizontal,
Each of the first inner surface and the second inner surface has an angle of 5 degrees to 30 degrees with respect to the horizontal line,
It is concavely formed by the first inner surface and the second inner surface,
The at least one curved surface is
a first curved surface having a first radius of curvature that is at least smaller than the radius of curvature of the second region of the substrate;
It includes a second curved surface located inside the first curved surface and closer to the center of the cementation pad than the first curved surface 323,
The second curved surface has a second radius of curvature that is greater than the first radius of curvature of the first curved surface,
The contact area has a hemispherical recess.
Cementation pad. According to paragraph 1,
The first curved surface is,
Point 1-1 and,
Having a 1-2 point spaced apart from the 1-1 point
Cementation pad. According to paragraph 2,
The 1-2 points of the first curved surface are spaced apart from the third region of the substrate.
Cementation pad. According to paragraph 3,
The first-second point of the first curved surface is spaced from 0.3 millimeter to 3 millimeters from a boundary point between the second region and the third region of the substrate.
Cementation pad. In the second paragraph,
The above second surface is
A point 2-1 that contacts the substrate with the above panel in between,
Having a 2-2 point that is in contact with the 1-1 point of the above first curved surface
Bonding pad. delete delete delete According to paragraph 1,
The recess has a radius of curvature of 2.5 millimeters to 5 millimeters.
Cementation pad. According to paragraph 1,
The first inner surface and the second inner surface have at least two hemispherical recesses.
Cementation pad. According to paragraph 1,
a first outer surface extending outward from the first joint; and
Comprising a second outer surface extending outward from the second joint portion
Cementation pad. According to clause 11,
Each of the first outer surface and the second outer surface has an acute angle with respect to a vertical line.
Cementation pad. According to clause 12,
Each of the first outer surface and the second outer surface has an angle of 3 degrees to 35 degrees with respect to the vertical line.
Cementation pad. According to clause 11,
The first bonding portion, the second bonding portion, the first inner surface, the second inner surface, the first outer surface, and the second outer surface are integrally formed of one of silicone, rubber, and resin materials.
Cementation pad. a first bonding unit for aligning the panel to the substrate and temporarily bonding a portion of the panel to a portion of a first region that is a plane of the substrate;
a second bonding unit for bonding the panel to a first region of the substrate using a first bonding pad; and
A third bonding unit for bonding the panel to a second region of the substrate using a second bonding pad,
A second region of the substrate is in contact with both sides of the first region,
The second cementation pad is
First joint portion;
a first inner surface extending inward from the first joint;
second joint portion; and
It includes a second inner surface extending inward from the second joint portion and contacting the first inner surface at a contact area,
Each of the first inner surface and the second inner surface has an acute angle with respect to the horizontal,
Each of the first inner surface and the second inner surface has an angle of 5 degrees to 30 degrees with respect to the horizontal line,
It is concavely formed by the first inner surface and the second inner surface,
Each of the first bonded portion and the second bonded portion is
a first curved surface located outside and having a first radius of curvature that is at least less than the radius of curvature of the second region of the substrate;
It includes a second curved surface that is in contact with the first curved surface and is located inside the first curved surface and is closer to the center of the second cementation pad than the first curved surface 323,
The second curved surface has a second radius of curvature that is greater than the first radius of curvature of the first curved surface,
The contact area has a hemispherical recess.
Cementation manufacturing equipment. According to clause 15,
The first cementation pad includes a round protrusion,
The protrusion height of the protrusion is 0.2 millimeter to 6 millimeter.
Cementation manufacturing equipment. According to clause 16,
When the first cementation pad is pressed, the panel is cemented to the first region of the substrate in the order from the center to the periphery of the round protrusion of the first cementation pad.
Cementation manufacturing equipment. delete According to clause 15,
When the second cementation pad is pressed, the panel is cemented to a boundary point between the first area and the second area by a first point of the second curved surface, a second point of the second curved surface, the The panel is bonded to the second region of the substrate in the order of the first point of the first curved surface and the second point of the first curved surface.
Cementation manufacturing equipment. According to clause 15,
The second cementation unit,
Comprising first and second deformation suppression blocks disposed above and below the first cementation pad to change the elastic deformation of the first cementation pad,
The third cementation unit,
Comprising first and second deformation suppression blocks disposed above and below the second cementation pad to change the elastic deformation of the second cementation pad.
Cementation manufacturing equipment.

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