KR102674268B1 - laser processing device - Google Patents

Abstract

The laser processing device (laser processing device 1) is capable of moving along a first direction (X direction), and objects ( A support part (support part 7) for supporting the object 100, and a first laser processing head arranged to face each other along the second direction and irradiating laser light to the object supported on the support part ( A laser processing head (10a) and a second laser processing head (laser processing head (10b)), the first laser processing head is mounted, and a third direction (Z) intersecting the first direction and the second direction direction) and a first mounting portion (mounting portion 65) capable of moving along each of the second directions, and the second laser processing head are mounted, and are movable along each of the second and third directions. It is provided with a second mounting part (mounting part 66).

Description

laser processing device

This disclosure relates to a laser processing device.

Patent Document 1 describes a laser processing device that includes a holding mechanism for holding a workpiece and a laser irradiation mechanism for irradiating laser light to the workpiece held in the holding mechanism. In the laser processing device described in Patent Document 1, a laser irradiation mechanism having a condensing lens is fixed to a base, and movement of the workpiece along a direction perpendicular to the optical axis of the condensing lens is performed by a holding mechanism.

Patent Document 1: Japanese Patent No. 5456510

However, in the laser processing apparatus described above, improvement in throughput is desired. In order to improve throughput, for example, increasing the moving speed of the workpiece by the holding mechanism is considered. However, even if the movement speed of the work is attempted to be increased, the acceleration time required for the work to move at a constant speed at the target speed also increases. For this reason, it is difficult to improve throughput beyond a certain level by increasing the moving speed of the workpiece.

The purpose of this disclosure is to provide a laser processing device capable of improving throughput.

The laser processing device according to the present disclosure is movable along a first direction, and includes a support portion for supporting an object along the first direction and a second direction intersecting the first direction, and a support portion facing each other along the second direction. A first laser processing head and a second laser processing head are disposed and are configured to irradiate laser light to an object supported on a support portion, and the first laser processing head is mounted, and a third direction intersecting the first direction and the second direction. and a first mounting portion capable of moving along each of the second directions, a second mounting portion mounted with a second laser processing head, and capable of moving along each of the second and third directions.

In this device, the first laser processing head and the second laser processing head are arranged to face each other on a support portion that supports the object. And the 1st laser processing head and the 2nd laser processing head are independently movable in two mutually intersecting directions via the 1st mounting part and the 2nd mounting part, respectively. For this reason, it becomes possible to perform laser processing by scanning the laser beam at two locations on the object, independently of each other. Therefore, improvement in throughput is achieved.

In the laser processing device according to the present disclosure, the first laser processing head is provided in a first case and a wall portion on the support portion side of the first case, and a first concentrator for concentrating laser light toward an object supported on the support portion. Having a light unit, the second laser processing head has a second case, a second condenser provided on a wall portion on the support portion side of the second case, and a second condenser for concentrating laser light toward an object supported on the support portion, The first mounting portion and the second mounting portion are respectively mounted on opposite wall portions and other wall portions that face each other along the second direction in the first case and the second case, and the first light condensing portion is positioned on the first mounting portion when viewed from the third direction. The arrangement may be biased toward the opposing wall of the case, and the second condensing portion may be disposed biased toward the opposing wall of the second case when viewed from the third direction.

In this case, the first mounting part and the second mounting part are not interposed between the first laser processing head and the second laser processing head. Therefore, the first laser processing head and the second laser processing head can be brought closer to each other in the second direction. In addition, the light condensing portions of each of the first laser processing head and the second laser processing head are disposed with a bias toward the opposing wall side of each case. For this reason, when the first laser processing head and the second laser processing head are brought close to each other, the distance between the light converging parts can be made smaller. As a result, processing using both the first laser processing head and the second laser processing head becomes possible up to a narrower area in the second direction. Therefore, throughput can be clearly improved.

The laser processing device according to the present disclosure further includes a control section that controls the movement of the support section, the first mounting section, and the second mounting section, and the irradiation of laser light from the first laser processing head and the second laser processing head, A plurality of lines extending along the first direction and arranged along the second direction are set, and the control unit directs the laser light from the first laser processing head to one of the plurality of lines in the first direction. The first scan process for scanning and the second scan process for scanning the laser light from the second laser processing head in the first direction with respect to another line among the plurality of lines may be performed so as to overlap at least part of the time. In this way, throughput is improved by performing the first scan process and the second scan process at least partially in overlap. Additionally, by performing the first scan process and the second scan process simultaneously, throughput can be more reliably improved.

In the laser processing device according to the present disclosure, the control unit sequentially performs the first scan process from a line located at one end of the plurality of lines in the second direction of the object toward a line inside the second direction, You may perform a main processing process in which a second scan process is sequentially performed from a line located at the other end of the second direction of the object toward a line inside the second direction among the lines. In this way, in the main processing, the first scan process and the second scan process are performed in order from the line of the contrasting position of the object in the second direction to determine the first direction of the converging point of the laser light with respect to the object. Waste of relative movement is omitted, and throughput is further improved.

In the laser processing device according to the present disclosure, the control unit controls the first light concentrator and the second laser processing head on the object when the first laser processing head and the second laser processing head are closest to each other in the second direction as a result of the main processing process. When some of the plurality of lines remain in the area between the light condensing unit, one of the first laser processing head and the second laser processing head is retreated from the corresponding area of the object, and the first laser processing head is Post-processing may be performed in which laser light from the other of the processing head and the second laser processing head is scanned in the first direction for some lines. In this case, laser processing is possible without exception while improving throughput.

In the laser processing device according to the present disclosure, the first laser processing head and the second laser processing head are closest to each other in the second direction. If the distance in direction is the distance D, the control unit causes the first light collecting part and the second light collecting part to gradually approach in the second direction as a result of the main processing before the distance between them reaches twice the distance D. , one of the first laser processing head and the second laser processing head is moved to the other side of the first laser processing head and the second laser processing head by a distance D, and the first and second light condensing parts are Post-processing may be performed by executing the first scan process and the second scan process while maintaining the distance of . In this case, a greater improvement in throughput is achieved by reducing the processing time on only one of the pair of laser processing heads as much as possible. In particular, this is effective when the line spacing in the second direction is sufficiently small relative to the distance D (for example, when hundreds of lines exist in the range of the distance D).

In the laser processing device according to the present disclosure, the first mounting portion is mounted on a wall portion on the opposite side of the opposing wall portion in the first case, and the second mounting portion is mounted on a wall portion on the opposite side of the opposing wall portion in the second case. Okay. In this case, the first mounting portion and the second mounting portion are easily and securely mounted on the first laser processing head and the second laser processing head so as not to be interposed between the first laser processing head and the second laser processing head. It is possible.

In the laser processing device according to the present disclosure, the first laser processing head includes a first wall portion and a second wall portion facing each other in the first direction, and a third wall portion and a fourth wall portion facing each other in the second direction. It has one case, and the second laser processing head includes a second case including a first wall portion and a second wall portion facing each other in the first direction, and a third wall portion and a fourth wall portion facing each other in the second direction. It has, and the distance between the third wall part and the fourth wall part may be smaller than the distance between the first wall part and the second wall part.

In the laser processing device according to the present disclosure, the first case and the second case include a first wall portion and a second wall portion facing each other in the first direction, and a third wall portion and a fourth wall portion facing each other in the second direction. The distance between the third wall and the fourth wall may be smaller than the distance between the first and second walls.

In these cases, the size of the case of each of the two laser processing heads in the second direction becomes smaller than the size in the first direction. For this reason, it is avoided that the device as a whole becomes larger in the second direction (footprint becomes larger). Additionally, the first direction is the direction of movement of the support portion and the object. For this reason, in the first direction, it is necessary to consider the amount of movement of the support part and the object when scanning the laser beam, so there is little room for suppressing enlargement. Therefore, it is effective to avoid enlargement in the second direction where there is no need to consider the amount of movement of the support portion and the object.

According to the present disclosure, a laser processing device capable of improving throughput can be provided.

1 is a perspective view of a laser processing device according to one embodiment.
FIG. 2 is a front view of a portion of the laser processing device shown in FIG. 1.
FIG. 3 is a front view of the laser processing head of the laser processing device shown in FIG. 1.
FIG. 4 is a side view of the laser processing head shown in FIG. 3.
FIG. 5 is a configuration diagram of the optical system of the laser processing head shown in FIG. 3.
Figure 6 is a configuration diagram of the optical system of a laser processing head of a modified example.
Fig. 7 is a front view of a portion of a laser processing device of a modified example.
Figure 8 is a schematic top view showing the operation of the laser processing device.
Figure 9 is a schematic top view showing the operation of the laser processing device.
Figure 10 is a schematic top view showing the operation of the laser processing device.
Figure 11 is a schematic top view showing the operation of the laser processing device.
Figure 12 is a schematic top view showing the operation of the laser processing device.
Figure 13 is a diagram showing a modified example of the mounting portion and laser processing head.
Figure 14 is a diagram showing a modified example of the mounting portion and the laser processing head.
Figure 15 is a diagram showing a modified example of the mounting portion and laser processing head.
Figure 16 is a diagram showing a modified example of the mounting portion and the laser processing head.
Figure 17 is a diagram showing a modified example of the mounting portion and laser processing head.
Figure 18 is a diagram showing a modified example of the mounting portion and laser processing head.
Figure 19 is a top view showing another example of post-processing.
Figure 20 is a top view showing another example of post-processing.

Hereinafter, one embodiment will be described in detail with reference to the drawings. In addition, in each drawing, identical or equivalent parts are assigned the same reference numerals, and overlapping descriptions are omitted.

[Configuration of laser processing equipment]

As shown in FIG. 1, the laser processing device 1 includes a plurality of moving mechanisms 5 and 6, a support portion 7, and a pair of laser processing heads (a first laser processing head and a second laser processing head). heads) (10A, 10B), a light source unit (8), and a control unit (9). Hereinafter, the first direction is referred to as the X direction, the second direction perpendicular to the first direction is referred to as the Y direction, and the third direction perpendicular to the first and second directions is referred to as the Z direction. In this embodiment, the X direction and Y direction are horizontal directions, and the Z direction is a vertical direction.

The moving mechanism 5 has a fixing part 51, a moving part 53, and a mounting part 55. The fixing portion 51 is mounted on the device frame 1a. The moving part 53 is mounted on a rail provided on the fixed part 51 and can move along the Y direction. The mounting portion 55 is mounted on a rail provided on the moving portion 53 and can move along the X direction.

The moving mechanism 6 includes a fixed part 61, a pair of moving parts (a first moving part, a second moving part) 63, 64, and a pair of mounting parts (a first mounting part, a second mounting part). It has (65, 66). The fixing portion 61 is mounted on the device frame 1a. Each of the pair of moving parts 63 and 64 is mounted on a rail provided on the fixed part 61, and each can move independently along the Y direction. The mounting portion 65 is mounted on a rail provided on the moving portion 63 and can move along the Z direction. The mounting portion 66 is mounted on a rail provided on the moving portion 64 and can move along the Z direction. That is, with respect to the device frame 1a, each of the pair of mounting portions 65 and 66 can move along the Y direction and the Z direction, respectively.

The support part 7 is mounted on a rotation axis provided in the mounting part 55 of the moving mechanism 5, and can rotate with the axis parallel to the Z direction as the center line. That is, the support portion 7 can move along each of the X and Y directions, and can rotate with the axis parallel to the Z direction as the center line. The support portion 7 supports the object 100 along the X and Y directions. The object 100 is, for example, a wafer.

As shown in FIGS. 1 and 2 , the laser processing head 10A (for example, the first laser processing head) is mounted on the mounting portion 65 of the moving mechanism 6. The laser processing head 10A is for irradiating a laser beam (first laser beam) L1 to the object 100 supported by the support part 7 in a state facing the support part 7 in the Z direction. The laser processing head 10B (for example, the second laser processing head) is mounted on the mounting portion 66 of the moving mechanism 6. The laser processing head 10B is for irradiating a laser beam (second laser beam) L2 to the object 100 supported by the support part 7 in a state facing the support part 7 in the Z direction.

The light source unit 8 has a pair of light sources 81 and 82. The light source 81 outputs laser light L1. The laser light L1 is emitted from the emission portion 81a of the light source 81 and is guided to the laser processing head 10A by the optical fiber 2. The light source 82 outputs laser light L2. The laser light L2 is emitted from the emission portion 82a of the light source 82 and is guided to the laser processing head 10B by another optical fiber 2.

The control unit 9 controls each part of the laser processing device 1 (a plurality of moving mechanisms 5 and 6, a pair of laser processing heads 10A and 10B, and a light source unit 8, etc.). Control. The control unit 9 is configured as a computer device including a processor, memory, storage, and communication devices. In the control unit 9, software (program) read into memory, etc. is executed by a processor, and reading and writing of data from memory and storage, and communication by communication devices are controlled by the processor. Thereby, the control unit 9 realizes various functions.

An example of processing using the laser processing device 1 configured as above will be described. An example of this processing is an example of forming a modified area inside the object 100 along each of a plurality of lines set in a grid shape in order to cut the object 100, which is a wafer, into a plurality of chips.

First, the moving mechanism 5 moves the support portion (7) supporting the object 100 along each of the 7) Move it. Next, the moving mechanism 5 rotates the support portion 7 with the axis parallel to the Z direction as the center line so that a plurality of lines extending in one direction from the object 100 follow the X direction.

Next, the moving mechanism 6 moves the laser processing head 10A along the Y direction so that the condensing point of the laser light L1 is located on one line extending in one direction. On the other hand, the moving mechanism 6 moves the laser processing head 10B along the Y direction so that the condensing point of the laser light L2 is located on another line extending in one direction. Next, the moving mechanism 6 moves the laser processing head 10A along the Z direction so that the condensing point of the laser beam L1 is located inside the object 100. On the other hand, the moving mechanism 6 moves the laser processing head 10B along the Z direction so that the condensing point of the laser beam L2 is located inside the object 100.

Next, the light source 81 outputs the laser light L1, so that the laser processing head 10A irradiates the laser light L1 to the object 100, and the light source 82 outputs the laser light L2. Thus, the laser processing head 10B irradiates the laser light L2 to the object 100. At the same time, the condensing point of the laser light L1 moves relatively along one line extending in one direction (the laser light L1 is scanned) and the laser light L2 moves along another line extending in one direction. The moving mechanism 5 moves the support portion 7 along the X direction so that the converging point moves relatively (so that the laser beam L2 is scanned). In this way, the laser processing apparatus 1 forms a modified region inside the object 100 along each of a plurality of lines extending in one direction from the object 100.

Next, the moving mechanism 5 rotates the support portion 7 with the axis parallel to the Z direction as the center line so that a plurality of lines extending from the object 100 in one direction and the other direction orthogonal to the other direction follow the X direction. .

Next, the moving mechanism 6 moves the laser processing head 10A along the Y direction so that the condensing point of the laser light L1 is located on one line extending in the other direction. On the other hand, the moving mechanism 6 moves the laser processing head 10B along the Y direction so that the condensing point of the laser light L2 is located on another line extending in the other direction. Next, the moving mechanism 6 moves the laser processing head 10A along the Z direction so that the condensing point of the laser beam L1 is located inside the object 100. On the other hand, the moving mechanism 6 moves the laser processing head 10B along the Z direction so that the condensing point of the laser beam L2 is located inside the object 100.

Next, the light source 81 outputs the laser light L1, so that the laser processing head 10A irradiates the laser light L1 to the object 100, and the light source 82 outputs the laser light L2. Thus, the laser processing head 10B irradiates the laser light L2 to the object 100. At the same time, the converging point of the laser light L1 moves relatively (the laser light L1 is scanned) along one line extending in the other direction, and the laser light L2 is also moved along another line extending in the other direction. The moving mechanism 5 moves the support portion 7 along the X direction so that the converging point of ) moves relatively (so that the laser light L1 is scanned). In this way, the laser processing apparatus 1 forms a modified region inside the object 100 along each of a plurality of lines extending from the object 100 in one direction and the other direction orthogonal to the other direction.

In addition, in an example of the above-described processing, the light source 81 outputs a laser light L1 having transparency to the object 100 by, for example, a pulse oscillation method, and the light source 82 outputs, for example, a laser light L1 that has transparency to the object 100. For example, laser light L2 having transparency to the object 100 is output by a pulse oscillation method. When such laser light is focused inside the object 100, the laser light is particularly absorbed in a portion corresponding to the convergence point of the laser light, and a modified area is formed inside the object 100. The modified region is a region whose density, refractive index, mechanical strength, and other physical properties are different from the surrounding unmodified region. Examples of modified regions include melt processing regions, crack regions, dielectric breakdown regions, and refractive index change regions.

When the laser light output by the pulse oscillation method is irradiated to the object 100 and the converging point of the laser light is relatively moved along the line set on the object 100, a plurality of modified spots are formed in a row along the line. do. One modified spot is formed by irradiation of one pulse of laser light. A row of reformed areas is a set of a plurality of reformed spots arranged in a row. Adjacent modified spots may be connected to each other or may be separated from each other depending on the relative moving speed of the converging point of the laser light with respect to the object 100 and the repetition frequency of the laser light.

［Configuration of the laser processing head］

As shown in FIGS. 3 and 4, the laser processing head 10A includes a case 11 (for example, a first case), an incident portion 12, an adjustment portion 13, and a light condensing portion 14. ) (for example, a first light condensing part).

The case 11 has a first wall 21 and a second wall 22, a third wall 23 and a fourth wall 24, and a fifth wall 25 and a sixth wall 26. there is. The first wall portion 21 and the second wall portion 22 face each other in the X direction. The third wall portion 23 and the fourth wall portion 24 face each other in the Y direction. The fifth wall portion 25 and the sixth wall portion 26 face each other in the Z direction.

The distance between the third wall portion 23 and the fourth wall portion 24 is smaller than the distance between the first wall portion 21 and the second wall portion 22. The distance between the first wall portion 21 and the second wall portion 22 is smaller than the distance between the fifth wall portion 25 and the sixth wall portion 26. Additionally, the distance between the first wall portion 21 and the second wall portion 22 may be the same as the distance between the fifth wall portion 25 and the sixth wall portion 26, or the distance between the fifth wall portion 25 and the sixth wall portion 26 may be the same. It is okay to be larger than the distance from (26).

In the laser processing head 10A, the first wall portion 21 is located on the side of the fixed portion 61 of the moving mechanism 6, and the second wall portion 22 is located on the opposite side to the fixed portion 61. . The third wall portion 23 is located on the side of the mounting portion 65 of the moving mechanism 6, and the fourth wall portion 24 is located on the side of the laser processing head 10B on the opposite side from the mounting portion 65 (Fig. 2). That is, the fourth wall portion 24 is an opposing wall portion that opposes the case (second case) of the laser processing head 10B along the Y direction. The fifth wall portion 25 is located on the opposite side to the support portion 7, and the sixth wall portion 26 is located on the support portion 7 side.

The case 11 is configured so that the case 11 is mounted on the mounting portion 65 with the third wall portion 23 disposed on the mounting portion 65 side of the moving mechanism 6. Specifically, it is as follows. The mounting portion 65 has a base plate 65a and a mounting plate 65b. The base plate 65a is mounted on a rail provided on the moving part 63 (see Fig. 2). The mounting plate 65b is erected at the end of the base plate 65a on the laser processing head 10B side. It is provided (see Figure 2). The case 11 is provided with a mounting portion 65 by screwing the bolt 28 to the mounting plate 65b via the base 27 while the third wall portion 23 is in contact with the mounting plate 65b. ) is installed. The base 27 is provided on each of the first wall portion 21 and the second wall portion 22. The case 11 is removable from the mounting portion 65.

The entrance part 12 is mounted on the fifth wall part 25. The incident unit 12 makes the laser light L1 enter the case 11. The incident portion 12 is biased toward the second wall portion 22 (one wall portion) in the X direction, and toward the fourth wall portion 24 in the Y direction. That is, the distance between the incident portion 12 and the second wall 22 in the X direction is smaller than the distance between the incident portion 12 and the first wall 21 in the ) and the fourth wall portion 24 is smaller than the distance between the incident portion 12 and the third wall portion 23 in the X direction.

The entrance portion 12 is configured so that the connection end 2a of the optical fiber 2 can be connected. At the connection end 2a of the optical fiber 2, a collimator lens is provided for collimating the laser light L1 emitted from the exit end of the fiber, and an isolator is provided to suppress the return light. There is not. The isolator is provided in the middle of the fiber closer to the light source 81 than the connection end 2a. Thereby, miniaturization of the connection end portion 2a and, by extension, miniaturization of the entrance portion 12 are achieved. Additionally, an isolator may be provided at the connection end 2a of the optical fiber 2.

The adjustment unit 13 is disposed within the case 11. The adjustment unit 13 adjusts the laser light L1 incident from the incident unit 12. The adjustment unit 13 is disposed within the case 11 on the fourth wall 24 side with respect to the partition wall 29. The adjustment unit 13 is mounted on the partition wall 29. The partition wall 29 is provided within the case 11 and divides the area within the case 11 into an area on the third wall 23 side and an area on the fourth wall 24 side. The partition wall portion 29 is integrated with the case 11. Each component of the adjustment unit 13 is mounted on the partition wall 29 on the fourth wall 24 side. The partition wall portion 29 functions as an optical base that supports each component of the adjustment portion 13. Details of each configuration of the adjustment unit 13 will be described later.

The light condensing portion 14 is disposed on the sixth wall portion 26 . Specifically, the light condensing portion 14 is disposed on the sixth wall portion 26 while being inserted into the hole 26a formed in the sixth wall portion 26 . The light condensing unit 14 condenses the laser light L1 adjusted by the adjusting unit 13 and emits it out of the case 11. The light condensing portion 14 is biased toward the second wall portion 22 (one wall portion) in the X direction, and toward the fourth wall portion 24 in the Y direction. That is, the light condensing portion 14 is disposed with a bias toward the fourth wall portion (opposite wall portion) 24 of the case 11 when viewed from the Z direction. That is, the distance between the light collecting part 14 and the second wall 22 in the X direction is smaller than the distance between the light collecting part 14 and the first wall 21 in the ) and the fourth wall portion 24 is smaller than the distance between the light condensing portion 14 and the third wall portion 23 in the X direction.

As shown in FIG. 5 , the adjustment unit 13 has an attenuator 31, a beam expander 32, and a mirror 33. The incident unit 12, and the attenuator 31, beam expander 32, and mirror 33 of the adjustment unit 13 are arranged on a straight line (first straight line) A1 extending along the Z direction. . The attenuator 31 and the beam expander 32 are arranged between the incident portion 12 and the mirror 33 on the straight line A1. The attenuator 31 adjusts the output of the laser light L1 incident from the incident unit 12. The beam expander 32 expands the diameter of the laser light L1 whose output has been adjusted by the attenuator 31. The mirror 33 reflects the laser light L1 whose diameter has been expanded by the beam expander 32.

The adjustment unit 13 further includes a reflective spatial light modulator 34 and an imaging optical system 35. The reflective spatial light modulator 34 and imaging optical system 35 of the adjustment unit 13, and the light condensing unit 14 are arranged on a straight line (second straight line) A2 extending along the Z direction. The reflective spatial light modulator 34 modulates the laser light L1 reflected from the mirror 33. The reflective spatial light modulator 34 is, for example, a spatial light modulator (SLM: Spatial Light Modulator) of reflective liquid crystal (LCOS: Liquid Crystal on Silicon). The imaging optical system 35 constitutes a bilateral telecentric optical system in which the reflection surface 34a of the reflective spatial light modulator 34 and the entrance pupil surface 14a of the light condensing unit 14 are in an imaging relationship. The imaging optical system 35 is comprised of three or more lenses.

The straight line A1 and A2 are located on a plane perpendicular to the Y direction. The straight line A1 is located on the second wall 22 side (one wall side) with respect to the straight line A2. In the laser processing head 10A, the laser light L1 enters the case 11 from the incident portion 12 and travels along a straight line A1, and the mirror 33 and the reflective spatial light modulator 34 After being reflected sequentially, it travels along the straight line A2 and is emitted from the light collection unit 14 to the outside of the case 11. Additionally, the order of arrangement of the attenuator 31 and the beam expander 32 may be reversed. Additionally, the attenuator 31 may be disposed between the mirror 33 and the reflective spatial light modulator 34. Additionally, the adjustment unit 13 may have other optical components (for example, a steering mirror disposed before the beam expander 32, etc.).

The laser processing head 10A further includes a dichroic mirror 15, a measurement unit 16, an observation unit 17, a drive unit 18, and a circuit unit 19.

The dichroic mirror 15 is arranged between the imaging optical system 35 and the light condensing unit 14 on the straight line A2. That is, the dichroic mirror 15 is disposed within the case 11 between the adjustment unit 13 and the light condensing unit 14. The dichroic mirror 15 is mounted on the partition wall 29 on the fourth wall 24 side. The dichroic mirror 15 transmits the laser light L1. From the viewpoint of suppressing astigmatism, the dichroic mirror 15 can be, for example, shaped like a cube or shaped like two plates arranged in a torsional relationship.

The measurement unit 16 is disposed within the case 11 on the first wall 21 side (opposite to one wall side) with respect to the adjustment unit 13. The measuring unit 16 is mounted on the partition wall 29 from the fourth wall 24 side. The measurement unit 16 outputs measurement light L10 to measure the distance between the surface of the object 100 (for example, the surface on the side where the laser light L1 is incident) and the light collection unit 14. , the measurement light L10 reflected from the surface of the object 100 is detected through the light condenser 14. That is, the measurement light L10 output from the measurement unit 16 is irradiated onto the surface of the object 100 through the light condenser 14, and the measurement light L10 reflected from the surface of the object 100 is, It is detected in the measurement unit 16 via the light condensing unit 14.

More specifically, the measurement light L10 output from the measurement unit 16 is connected to the beam splitter 20 and the dichroic mirror 15 mounted on the partition wall 29 on the fourth wall 24 side. It is sequentially reflected and emitted from the light collection unit 14 to the outside of the case 11. The measurement light L10 reflected from the surface of the object 100 enters the case 11 from the light collection unit 14 and is sequentially reflected by the dichroic mirror 15 and the beam splitter 20, and is sequentially reflected by the measurement unit 10. It is incident on (16) and detected by the measuring unit (16).

The observation section 17 is disposed within the case 11 on the first wall 21 side (the side opposite to one wall side) with respect to the adjustment section 13. The observation unit 17 is mounted on the partition wall 29 from the fourth wall 24 side. The observation unit 17 outputs observation light L20 for observing the surface of the object 100 (e.g., the surface on the side where the laser light L1 is incident) and passes through the light converging unit 14, Observation light L20 reflected from the surface of the object 100 is detected. That is, the observation light L20 output from the observation unit 17 is irradiated onto the surface of the object 100 through the light condenser 14, and the observation light L20 reflected from the surface of the object 100 is collected. It is detected by the observation unit 17 via the light emitter 14.

More specifically, the observation light L20 output from the observation unit 17 passes through the beam splitter 20, is reflected by the dichroic mirror 15, and exits the case 11 from the light condenser 14. do. The observation light L20 reflected from the surface of the object 100 enters the case 11 from the light collection unit 14, is reflected by the dichroic mirror 15, and passes through the beam splitter 20 to the observation unit ( 17) and is detected in the observation unit 17. In addition, the wavelengths of the laser light L1, the measurement light L10, and the observation light L20 are different from each other (at least the center wavelengths of each are offset from each other).

The drive unit 18 is mounted on the partition wall 29 on the fourth wall 24 side. The driving unit 18 moves the light condensing unit 14 disposed on the sixth wall 26 along the Z direction, for example, by the driving force of the piezoelectric element.

The circuit portion 19 is disposed within the case 11 on the third wall portion 23 side with respect to the partition wall portion 29. That is, the circuit portion 19 is disposed within the case 11 on the third wall portion 23 side with respect to the adjustment portion 13, the measurement portion 16, and the observation portion 17. The circuit portion 19 is spaced apart from the partition wall portion 29. The circuit portion 19 is, for example, a plurality of circuit boards. The circuit unit 19 processes the signal output from the measurement unit 16 and the signal input to the reflective spatial light modulator 34. The circuit unit 19 controls the drive unit 18 based on the signal output from the measurement unit 16. As an example, the circuit unit 19 is configured to maintain a constant distance between the surface of the object 100 and the light collecting unit 14 based on the signal output from the measuring unit 16 (i.e., the distance between the surface of the object 100 and the light collecting unit 14 is maintained constant). The driver 18 is controlled so that the distance between the surface and the converging point of the laser light (L1) is maintained constant. Additionally, the case 11 is provided with a connector (not shown) to which wiring is connected to electrically connect the circuit section 19 to the control section 9 (see FIG. 1), etc.

Like the laser processing head 10A, the laser processing head 10B includes a case 11 (for example, a second case), an incident part 12, an adjustment part 13, and a light converging part (for example, It is provided with a second light condensing unit (14), a dichroic mirror (15), a measuring unit (16), an observation unit (17), a driving unit (18), and a circuit unit (19). However, as shown in FIG. 2, each configuration of the laser processing head 10B is a virtual plane that passes through the midpoint between the pair of mounting portions 65 and 66 and is perpendicular to the Y direction. It is arranged so as to have a plane symmetry relationship with each configuration of (10A) (this is an example as will be described later).

For example, in the case 11 of the laser processing head 10A, the fourth wall portion 24 is located on the laser processing head 10B side with respect to the third wall portion 23, and the sixth wall portion 26 is located on the third wall portion 23. 5 It is mounted on the mounting portion 65 so as to be located on the support portion 7 side with respect to the wall portion 25. In contrast, in the case 11 of the laser processing head 10B, the fourth wall portion 24 is located on the laser processing head 10A side with respect to the third wall portion 23, and the sixth wall portion 26 is located on the third wall portion 23. 5 It is mounted on the mounting portion 66 so as to be located on the support portion 7 side with respect to the wall portion 25. That is, also in the laser processing head 10B, the fourth wall portion 24 is an opposing wall portion that opposes the case of the laser processing head 10A along the Y direction. Also, in the laser processing head 10B, the light condensing portion 14 is disposed with a bias toward the fourth wall portion (opposite wall portion) 24 of the case 11 when viewed from the Z direction.

The case 11 of the laser processing head 10B is configured so that the case 11 is mounted on the mounting portion 66 with the third wall portion 23 disposed on the mounting portion 66 side. Specifically, it is as follows. The mounting portion 66 has a base plate 66a and a mounting plate 66b. The base plate 66a is mounted on a rail provided on the moving part 63. The mounting plate 66b is provided standing at the end of the base plate 66a on the laser processing head 10A side. The case 11 of the laser processing head 10B is mounted on the mounting portion 66 with the third wall portion 23 in contact with the mounting plate 66b. The case 11 of the laser processing head 10B is detachable from the mounting portion 66.

[Action and effect of laser processing head]

In the laser processing head 10A, since the light source that outputs the laser light L1 is not provided in the case 11, the case 11 can be miniaturized. Moreover, in the case 11, the distance between the third wall portion 23 and the fourth wall portion 24 is smaller than the distance between the first wall portion 21 and the second wall portion 22, and is disposed on the sixth wall portion 26. The light condensing portion 14 is biased toward the fourth wall portion 24 in the Y direction. As a result, when moving the case 11 along the direction perpendicular to the optical axis of the light converging portion 14, for example, another configuration (for example, a laser processing head) is placed on the fourth wall portion 24 side. Even if 10B)) was present, the light concentrator 14 could be brought close to the other configuration. Accordingly, the laser processing head 10A may be suitable for moving the light collecting portion 14 along a direction perpendicular to its optical axis.

Moreover, in the laser processing head 10A, the incident part 12 is provided in the 5th wall part 25, and is biased toward the 4th wall part 24 side in the Y direction. As a result, the area within the case 11 can be effectively used, such as by arranging another component (e.g., the circuit section 19) in the area on the third wall 23 side with respect to the adjustment section 13. You can.

Moreover, in the laser processing head 10A, the light condensing part 14 is biased toward the second wall part 22 in the X direction. As a result, when the case 11 is moved along the direction perpendicular to the optical axis of the light converging portion 14, for example, even if a different configuration exists on the second wall portion 22 side, the other configuration The light condensing part 14 can be brought closer.

Moreover, in the laser processing head 10A, the incident part 12 is provided in the 5th wall part 25, and is biased toward the 4th wall part 24 in the Y direction, and the 2nd wall part 22 in the X direction. ) is biased toward the side. As a result, the area within the case 11 can be effectively used, such as by arranging another component (e.g., the circuit section 19) in the area on the third wall 23 side with respect to the adjustment section 13. You can. In addition, other components (e.g., measurement section 16 and observation section 17) are placed in the area within the case 11 on the side of the first wall 21 with respect to the adjustment section 13, etc. in that area. can be used effectively.

Moreover, in the laser processing head 10A, the measurement unit 16 and the observation unit 17 are arranged in an area on the side of the first wall 21 with respect to the adjustment unit 13 among the areas within the case 11, and the circuit section (19) is disposed on the third wall portion 23 side with respect to the adjusting portion 13 in the area within the case 11, and the dichroic mirror 15 is positioned between the adjusting portion 13 and the adjusting portion 11 within the case 11. It is arranged between the light condensing part 14. As a result, the area within the case 11 can be effectively used. Furthermore, in the laser processing apparatus 1, processing is possible based on the measurement result of the distance between the surface of the object 100 and the light converging portion 14. Additionally, in the laser processing apparatus 1, processing based on the observation results of the surface of the object 100 is possible.

Moreover, in the laser processing head 10A, the circuit unit 19 controls the drive unit 18 based on the signal output from the measurement unit 16. As a result, the position of the converging point of the laser light L1 can be adjusted based on the measurement result of the distance between the surface of the object 100 and the light condensing portion 14.

In addition, in the laser processing head 10A, the incident unit 12, and the attenuator 31, beam expander 32, and mirror 33 of the adjustment unit 13 form a straight line A1 extending along the Z direction. It is disposed on a straight line A2 in which the reflective spatial light modulator 34 of the adjustment unit 13, the imaging optical system 35, and the light condensing unit 14, and the condensing unit 14 extend along the Z direction. It is placed on the table. As a result, the adjustment unit 13 including the attenuator 31, the beam expander 32, the reflective spatial light modulator 34, and the imaging optical system 35 can be configured compactly.

Moreover, in the laser processing head 10A, the straight line A1 is located on the second wall portion 22 side with respect to the straight line A2. As a result, in the area within the case 11 on the side of the first wall 21 with respect to the adjustment unit 13, another optical system (for example, the measurement unit 16 and the observation unit) using the light condensing unit 14 is used. 17)), the degree of freedom in configuring other optical systems can be improved.

The above actions and effects are equally exhibited by the laser processing head 10B.

[Variation example of laser processing head]

As shown in FIG. 6, the incident portion 12, the adjusting portion 13, and the condensing portion 14 may be arranged on a straight line A extending along the Z direction. According to this, the adjustment unit 13 can be configured compactly. In that case, the adjustment unit 13 does not need to include the reflective spatial light modulator 34 and the imaging optical system 35. Additionally, the adjustment unit 13 may include an attenuator 31 and a beam expander 32. According to this, the adjustment unit 13 including the attenuator 31 and the beam expander 32 can be configured compactly. Additionally, the order of arrangement of the attenuator 31 and the beam expander 32 may be reversed.

In addition, the light guide of the laser light L1 from the emission part 81a of the light source unit 8 to the incident part 12 of the laser processing head 10A, and the emission part 82a of the light source unit 8 ), at least one of the light guides of the laser light L2 from ) to the incident portion 12 of the laser processing head 10B may be performed by a mirror. Fig. 7 is a front view of a portion of the laser processing device 1 in which the laser light L1 is guided by a mirror. In the configuration shown in FIG. 7, the mirror 3 that reflects the laser light L1 faces the emitting portion 81a of the light source unit 8 in the Y direction and faces the laser processing head 10A in the Z direction. It is mounted on the moving part 63 of the moving mechanism 6 so as to face the entrance part 12.

In the configuration shown in Fig. 7, even if the moving portion 63 of the moving mechanism 6 is moved along the Y direction, the mirror 3 faces the emitting portion 81a of the light source unit 8 in the Y direction. is maintained. Moreover, even if the mounting portion 65 of the moving mechanism 6 is moved along the Z direction, the state in which the mirror 3 faces the incident portion 12 of the laser processing head 10A is maintained in the Z direction. Therefore, regardless of the position of the laser processing head 10A, the laser light L1 emitted from the emitting portion 81a of the light source unit 8 is surely incident on the incident portion 12 of the laser processing head 10A. You can do it. In addition, a light source such as a high-output long/short pulse laser that is difficult to guide light through the optical fiber 2 can also be used.

In addition, in the configuration shown in FIG. 7, the mirror 3 may be mounted on the moving portion 63 of the moving mechanism 6 so that at least one of angle adjustment and position adjustment is possible. According to this, the laser light L1 emitted from the emission part 81a of the light source unit 8 can be made to enter the incident part 12 of the laser processing head 10A more reliably.

Additionally, the light source unit 8 may have one light source. In that case, the light source unit 8 may be configured to emit a part of the laser light output from one light source from the emitter 81a and to emit the remainder of the laser light from the emitter 82a.

［About the operation of laser processing equipment, etc.］

Next, the operation of the laser processing device 1 will be described. Fig. 8 is a schematic top view showing the operation of the laser processing device. In the following drawings, the schematic interior of the laser processing heads 10A and 10B is shown while maintaining the relative positions of each part in FIGS. 1 to 7. As shown in FIG. 8, the object 100 is supported on the support portion 7. In addition, the symbol S in the drawing represents an optical system other than the optical system related to irradiation of the laser light L1 and L2 for forming the modified region, such as the measurement unit 16 and the observation unit 17 described above.

Additionally, the laser processing device 1 is equipped with a pair of alignment cameras (AC) with different magnifications. The alignment camera AC is mounted on the mounting portion 65 together with the laser processing head 10A. The alignment camera AC captures, for example, a device pattern using light passing through the object 100. The image thus obtained is used for alignment of the irradiation position of the laser beams L1 and L2 with respect to the object 100.

The object 100 is provided with a plurality of lines C extending along the X direction and arranged along the Y direction. Line (C) is an imaginary line, but it may also be an actual drawn line. Additionally, on the object 100, a plurality of lines extending along the Y direction and arranged along the

The laser processing device 1 performs laser processing along each line C under the control of the control unit 9. Here, the control unit 9 controls the movement of the support unit 7, the mounting unit 65, and the mounting unit 66, and the laser beams L1 and L2 from the laser processing head 10A and the laser processing head 10B. ) controls the investigation. In the laser processing apparatus 1, the control unit 9 executes the first scan process and the second scan process. The first scan process is a process that scans the laser light L1 from the laser processing head 10A in the X direction with respect to one line C of the plurality of lines C. The second scan process is a process that scans the laser light L2 from the laser processing head 10B in the X direction with respect to another line C among the plurality of lines C.

When the control unit 9 scans the laser light L1 and L2 in the The converging points of the laser beams L1 and L2 are placed at positions inside the object 100 on each line C. Then, in that state, the support portion 7 is moved in the

In particular, here, the control unit 9 executes the first scan process and the second scan process so that they overlap at least part of the time. That is, the control unit 9 ensures that the state in which the laser light L1 is scanned along one line C and the state in which the laser light L2 is scanned along the other line C are simultaneously realized. do. That is, the control unit 9 operates the laser processing head 10A and the laser processing head 10B simultaneously. This clearly improves throughput compared to processing using one laser processing head.

When scanning of the laser light L1 and L2 along one line C is completed, the control unit 9 independently controls each of the laser processing heads 10A and 10B by the interval of the line C. It is moved in the Y direction (Z direction if necessary), and scanning of the laser light L1 and L2 along the next line C (i.e., the first scan process and the second scan process) continues. The control unit 9 continues to perform this operation for approximately the number of lines C, thereby forming a modified region along all of the lines C.

As shown in FIGS. 9 and 10, here, the control unit 9 moves the inner side in the Y direction from the line C located at one end of the Y direction of the object 100 among the plurality of lines C. The first scan process is sequentially performed toward the line C. At the same time, the control unit 9 performs a second scan process in order from the line C located at the other end of the object 100 in the Y direction among the plurality of lines C toward the inner line in the Y direction. Execute (this is called 'main processing'). The line C located at one end of the Y direction and the line C located at the other end of the Y direction have the same length in the X direction.

This point will be explained in more detail. In the main processing, first, the control unit 9 moves the laser processing head 10A via the mounting unit 65 to set the condensing point of the laser light L1 in the Y direction of the object 100. It is placed at a position inside the object 100 on a line C located at one end. At the same time, the control unit 9 positions the converging point of the laser beam L2 at the other end of the Y direction of the object 100 by moving the laser processing head 10B via the mounting unit 66. It is placed at a position inside the object 100 on the line C. At this time, the position of the converging point of the laser light L1 in the X direction and the position of the converging point of the laser light L2 in the

In that state, the control unit 9 moves the support unit 7 in the Move . As a result, the first scan process and the second scan process for each line C are started simultaneously and completed simultaneously. That is, here, the first scan process and the second scan process overlap in their entirety. As a result, a modified region M is formed inside the object 100 along the line C.

Next, the control unit 9 moves the laser processing head 10A via the mounting unit 65 to set the condensing point of the laser beam L1 to 1 point from one end of the Y direction of the object 100. It is placed at a position inside the object 100 on a line C located inside the object 100. At the same time, the control unit 9 moves the laser processing head 10B via the mounting unit 66 to move the converging point of the laser beam L2 to 1 point from the other end of the Y direction of the object 100. It is placed at a position inside the object 100 on a line C located inside the object 100. At this time, the position of the converging point of the laser light L1 in the X direction and the position of the converging point of the laser light L2 in the

In that state, the control unit 9 moves the support unit 7 in the The converging point of the laser light (L1, L2) is moved in the direction (opposite the X direction in the case of reciprocating motion). As a result, here too, the first scan process and the second scan process for each line C are started simultaneously and completed simultaneously. That is, here too, the first scan process and the second scan process overlap in their entirety. By repeating the operation of this control unit 9, the laser processing head 10A and the laser processing head 10B are operated simultaneously up to the inner line C of the object 100, thereby eliminating wasteful laser processing. Processing can be done.

In addition, in the top views of FIG. 9 and later, for the sake of explanation, the modified area M is shown as a solid line, but it is not necessary that the modified area M is actually visible from the surface of the object 100.

Here, as shown in FIG. 11, when repeating the above operation, in the area further inside the object 100, the positional relationship between the laser processing head 10A and the laser processing head 10B is the mutual distance. In the area of the object 100, which has a positional relationship that does not decrease further in the Y direction (for example, a state in which they are in contact with each other), and which corresponds to the distance D between the respective light condensing portions 14, There are cases where unprocessed lines (C) remain. In this case, it becomes difficult to execute the first scan process and the second scan process simultaneously as described above. Therefore, in this case, the control unit 9 executes the following post-processing.

That is, as shown in FIG. 12, the control unit 9 controls the object 100 when the laser processing head 10A and the laser processing head 10B are closest in the Y direction as a result of the main processing. When some lines C remain in the area between each light condensing portion 14, the laser processing head 10A is withdrawn from the corresponding area of the object 100 while the laser processing head 10B is removed from the laser processing head 10B. Post-processing is performed by scanning the laser light L2 in the X direction (performing the second scan process) for the part of the line C.

In addition, the laser processing head 10A and the laser processing head 10B may be reversed. In this way, laser processing is completed for all lines C. Thereafter, by rotating the support portion 7 as necessary, the line intersecting the line C can be set to follow the X direction, and the above operation can be repeated.

［Action and effect of laser processing equipment］

As described above, the laser processing device 1 is movable along the X direction, and includes a support portion 7 for supporting the object 100 along the It is arranged to face each other along and is provided with laser processing heads 10A and 10B for irradiating laser light L1 and L2 to the object 100 supported on the support portion 7. In addition, the laser processing device 1 includes a mounting portion 65 on which the laser processing head 10A is mounted and movable along the Z and Y directions that intersect the X and Y directions, respectively, and a laser processing head ( 10B) is mounted and has a mounting portion 66 that can be moved along each of the Y and Z directions.

In the laser processing device 1, laser processing heads 10A and 10B are arranged to face each other on a support portion 7 that supports the object 100. And the laser processing heads 10A and 10B are capable of moving independently in two directions that intersect each other via the mounting portions 65 and 66, respectively. For this reason, it becomes possible to perform laser processing at two locations on the object 100 independently of each other by scanning the laser beams L1 and L2. Therefore, improvement in throughput is achieved.

In the laser processing device 1, the laser processing head 10A is provided on the case 11 and the sixth wall portion 26 on the support portion 7 side of the case 11, and is supported on the support portion 7. It has a light concentrator 14 for concentrating the laser light L1 toward the object 100. In addition, the laser processing head 10B is also provided on the case 11 and the sixth wall portion 26 on the support portion 7 side of the case 11, and holds the object 100 supported on the support portion 7. It has a light condenser 14 for concentrating the laser light L2 toward the laser beam L2. In addition, the mounting portions 65 and 66 are respectively attached to the fourth wall portion 24 (opposite wall portion) and a different wall portion (here, the third wall portion 23) along the Y direction in the case 11. It is equipped. And, the light condensing portions 14 are disposed with a bias toward the fourth wall portion 24 of the case 11 when viewed from the Z direction.

For this reason, the mounting portions 65 and 66 are not interposed between the laser processing head 10A and the laser processing head 10B. Therefore, the laser processing head 10A and the laser processing head 10B can be brought closer to each other in the Y direction. In addition, the light condensing portions 14 of each of the laser processing heads 10A and 10B are disposed with a bias toward the opposing fourth wall portion 24 of each case 11. For this reason, when the laser processing head 10A and the laser processing head 10B are brought close to each other, the distance between the light condensing portions 14 can be made smaller. As a result, processing using both the laser processing heads 10A and 10B becomes possible up to a narrower area in the Y direction. Therefore, throughput can definitely be improved.

In addition, the laser processing device 1 includes a control unit 9 that controls the movement of the support portion 7 and the mounting portions 65 and 66 and the irradiation of laser light L1 and L2 from the laser processing heads 10A and 10B. ) is provided. Additionally, a plurality of lines C are set on the object 100, extending along the X direction and arranged along the Y direction. And the control unit 9 performs a first scan process of scanning the laser light L1 from the laser processing head 10A in the X direction for one line C among the plurality of lines C, and a plurality of lines C. The second scan process of scanning the laser light L2 from the laser processing head 10B in the X direction for another line C among the lines C is performed so as to overlap at least part of the time. In this way, throughput is improved by performing the first scan process and the second scan process at least partially in overlap. Additionally, by performing the first scan process and the second scan process simultaneously, throughput can be more reliably improved.

In addition, in the laser processing apparatus 1, the control unit 9 operates from a line C located at one end of the Y direction of the object 100 among the plurality of lines C to a line C inside the Y direction. ), sequentially performing the first scan process toward the inner line in the Y direction from the line C located at the other end of the Y direction of the object 100 among the plurality of lines C. 2 Execute the main processing that executes the scan processing. In this way, in the main processing, by sequentially performing the first scan process and the second scan process from the lines C at contrasting positions (also of the same length) of the object 100 in the Y direction, Waste of relative movement of the light-converging point (L1, L2) along the X direction with respect to the object 100 is reduced, and throughput is further improved.

Moreover, in the laser processing apparatus 1, the control unit 9 controls the object 100 when the laser processing head 10A and the laser processing head 10B are closest to each other in the Y direction as a result of the main processing. When some lines C among the plurality of lines C remain in the area between the light converging portions 14, one of the laser processing heads 10A, 10B is removed from the corresponding area of the object 100. While retracting, a post-processing process is performed in which the laser light from the other of the laser processing heads 10A and 10B is scanned in the X direction for some lines C. For this reason, laser processing is possible without exception while improving throughput.

Furthermore, in the laser processing device 1, as an example, the mounting portion 65 is mounted on the third wall portion 23 on the opposite side of the fourth wall portion 24 in the case 11 of the laser processing head 10A. It is done. Additionally, the mounting portion 66 is mounted on the third wall portion 23 on the opposite side of the fourth wall portion 24 in the case 11 of the laser processing head 10B. For this reason, the laser processing head 10A and the laser processing head ( It is possible to mount it on 10B).

Here, in the laser processing device 1, the case 11 includes a first wall portion 21 and a second wall portion 22 that face each other in the X direction, a third wall portion 23 that faces each other in the Y direction, and It includes a fourth wall portion 24, and the distance between the third wall portion 23 and the fourth wall portion 24 is smaller than the distance between the first wall portion 21 and the second wall portion 22.

For this reason, the size of the case 11 of each of the laser processing heads 10A and 10B in the Y direction becomes smaller than the size in the X direction. As a result, the device as a whole is prevented from being enlarged in the Y direction (increasing the footprint). Additionally, the X direction is the direction of movement of the support portion 7 and the object 100. For this reason, in the Therefore, it is effective to avoid enlargement in the Y direction where there is no need to consider the amount of movement of the support portion 7 and the object 100 (during scanning).

Moreover, in the laser processing head 10A, the circuit part 19 is arrange|positioned on the 3rd wall part 23 side with respect to the adjustment part 13 within the case 11. As a result, among the areas within the case 11, the area on the third wall 23 side can be effectively used for the adjustment unit 13.

Moreover, in the laser processing head 10A, the adjustment section 13 is disposed within the case 11 on the fourth wall 24 side with respect to the partition wall 29, and the circuit section 19 is located in the case ( In 11), it is arranged on the third wall portion 23 side with respect to the partition wall portion 29. This makes it difficult for the heat generated in the circuit section 19 to be transmitted to the adjustment section 13, so that deformation in the adjustment section 13 due to the heat generated in the circuit section 19 can be suppressed, and the laser beam ( L1) can be adjusted appropriately. Moreover, the circuit section 19 can be efficiently cooled in the area on the third wall 23 side among the areas within the case 11 by, for example, air cooling or water cooling.

Moreover, in the laser processing head 10A, the adjustment part 13 is mounted on the partition wall part 29. Thereby, the adjustment part 13 can be supported reliably and stably within the case 11.

［Variation example］

The above embodiment exemplifies one embodiment of a laser processing device. Therefore, the laser processing device according to the present disclosure is not limited to the laser processing device 1 described above and may be arbitrarily modified.

13 to 18 are diagrams showing modifications of the mounting portion and the laser processing head. As shown in (a) of FIG. 13, the mounting portion 65 is provided on the first wall portion 21 of the case 11 of the laser processing head 10A, and the mounting portion 66 is attached to the laser processing head 10B. It may be provided on the first wall portion 21 of the case 11. In addition, as shown in FIG. 13(b), the mounting portion 65 is provided on the third wall portion 23 of the case 11 of the laser processing head 10A, and the mounting portion 66 is attached to the laser processing head. In the form provided on the third wall 23 of the case 11 of (10B), the positions of the moving parts 63 and 64 in the mounting parts 65 and 66 may be varied in the X direction. Furthermore, as shown in FIG. 13(c), the mounting portion 65 is provided on the second wall portion 22 of the case 11 of the laser processing head 10A, and the mounting portion 66 is attached to the laser processing head ( It may be provided on the second wall portion 22 of the case 11 of 10B).

In addition, as shown in Figure 14 (a), the mounting portion 65 is provided on the fifth wall portion 25 of the case 11 of the laser processing head 10A, and the mounting portion 66 is attached to the laser processing head ( It may be provided on the fifth wall portion 25 of the case 11 of 10B). In addition, as shown in FIG. 14(b), the mounting portion 65 is provided on the sixth wall portion 26 of the case 11 of the laser processing head 10A, and the mounting portion 66 is attached to the laser processing head ( It may be provided on the sixth wall portion 26 of the case 11 of 10B). As described above, the mounting portions 65 and 66 may be mounted on a wall portion different from the fourth wall portion 24 that opposes each other along the Y direction. Furthermore, as shown in (c) of FIG. 14, a light condensing portion 14 is provided at the center of the case 11 in the It's okay to prepare it.

In addition, as in the above example, in the laser processing device 1, it is not necessary to use the laser processing head 10A and the laser processing head 10B as a pair of laser processing heads. That is, the laser processing device 1 uses a pair (one type) of laser processing heads 10A, as shown in (a) of FIG. 15, or as shown in (b) of FIG. 15. Likewise, a pair (of one different type) of laser processing heads 10B can be used. In these cases, with respect to one laser processing head 10A, 10B, the other laser processing head 10A, 10B is rotated 180° around the Z-axis direction, and the The positions of the centers of directions are arranged to coincide. In these cases, there is no need to prepare two types of laser processing heads.

Like these, even when only the laser processing head 10A (or only the laser processing head 10B) is used, the wall portions that provide the mounting portions 65 and 66 can be changed in various ways. For example, as shown in FIG. 16(a), a mounting portion 65 is provided on the first wall portion 21 of the case 11 of one laser processing head 10A, and one laser processing head 10A is provided. A mounting portion 66 can be provided on the second wall portion 22 of the case 11 of (10A). Moreover, as shown in FIG. 16(b), a mounting portion 65 is provided on the second wall portion 22 of the case 11 of one laser processing head 10B, and one laser processing head 10B is provided. ), a mounting portion 66 may be provided on the first wall portion 21 of the case 11. That is, even in these cases, the mounting portions 65 and 66 may be mounted on a wall portion different from the fourth wall portion 24 that opposes each other along the Y direction.

Here, as shown in (a) of FIG. 17, the laser processing head 10A and the laser processing head 10B may be arranged in the Y direction at positions where they do not overlap each other in the X direction. In this case, as shown in FIG. 17(b), the light condensing part 14 of the laser processing head 10A and the light collecting part 14 of the laser processing head 10B overlap in the X-axis direction. It becomes possible. Therefore, it becomes possible to perform laser processing by executing the first and second scan processes for all lines C in the main processing process. In other words, post-processing becomes unnecessary. However, in this case, the movement distance in the X direction of the support portion 7 during the first and second scan processing is equal to the shift amount in the It gets longer. As shown in FIG. 18, the same applies even when only one type (here, laser processing head 10A) is used.

The configuration shown in FIGS. 17 and 18 provides a processing length ( It can be adopted in cases where the merit of being able to process with two laser processing heads (post-processing is not necessary) outweighs the disadvantage of increasing the length of the moving distance of the support portion 7.

Here, as another example of post-processing of the laser processing device 1, examples shown in FIGS. 19 and 20 can be given. That is, here, first, as shown in FIG. 19(a), the control unit 9 controls a line C located at one end of the Y direction of the object 100 among the plurality of lines C. The first scan process is sequentially performed from , toward the inner line C in the Y direction. At the same time, the control unit 9 performs a second scan process in order from the line C located at the other end of the object 100 in the Y direction among the plurality of lines C toward the inner line in the Y direction. Execute (i.e., execute main processing).

In Figures 10 and 11, an example is given in which main processing is performed until the laser processing head 10A and the laser processing head 10B come closest to each other (for example, contact). At this time, the distance between the light concentrators 14 was distance D. In contrast, in this example, as shown in (b) of FIG. 19, the control unit 9 advances the main processing process, thereby controlling the laser processing unit 14 of the laser processing head 10A. The light collecting portions 14 of the head 10B gradually approach in the Y direction (at each interval of the line C), so that the distance between the light collecting portions 14 is greater than twice the distance D (or the same amount). ) When the distance (E1) is reached, scanning of the laser light (L1, L2) is stopped. At the same time, as shown in FIG. 20(a), the control unit 9 controls one of the laser processing heads 10A and 10B (here, the laser processing head 10B) to the laser processing heads 10A and 10B. 10B) is moved to the other side (here, the laser processing head 10A) by a distance D. As a result, the distance between the light condensing portions 14 becomes a distance E2 that is smaller than the distance E1. When the distance E1 is approximately twice the distance D, the distance E2 is approximately equal to the distance D.

In that state, the control unit 9 sequentially executes the first scan process and the second scan process in the Y direction while maintaining the distance between the light condensing units 14 at the distance E2. At this time, the laser processing head 10A and the laser processing head 10B repeat scanning of the laser beams L1 and L2 in the X direction while moving in the same direction (Y direction). Then, when the first scan process and the second scan process are continued simultaneously, only when the unprocessed line C remains at the end, one side of the laser processing heads 10A, 10B is applied to the line C. Processing is performed using . At this time, the other of the laser processing heads 10A, 10B may be maintained at a position where the distance E2 is maintained, or may be moved to another position. This is the post-processing in this example. According to this, the processing time in only one of the pair of laser processing heads 10A, 10B is reduced as much as possible, and further improvement in throughput is achieved. In particular, it is effective when the spacing between lines C in the Y direction is sufficiently small relative to the distance D (for example, when hundreds of lines C exist in the range of the distance D).

Additionally, another example of the main processing of the laser processing device 1 can be given. That is, in FIG. 8 or the like, the control unit 9 moves from a line C located at one end of the object 100 in the Y direction among the plurality of lines C toward a line C inside the Y direction. In addition to executing the first scan process in order, the second scan process is sequentially performed from the line C located at the other end of the Y direction of the object 100 among the plurality of lines C toward the inner line in the Y direction. Here is an example of main processing that performs scan processing.

However, in the laser processing apparatus 1, throughput can be improved by performing the first scan process and the second scan process so that they overlap at least part of the time, so the example of the main processing process is not limited to the above example. No. For example, the control unit 9 sequentially moves from the line C located at one end in the Y direction of the object 100 among the plurality of lines C toward the line C inside the Y direction. In addition to executing the first scan process, the second scan process is sequentially performed from the central line C in the Y direction among the plurality of lines C toward the other end side in the Y direction of the object 100. Okay. In this case, since the length of the line C is different between the first and second scan processes that are executed simultaneously, the object 100 moves in the X direction in accordance with the scan of the relatively long line C. Although this is necessary, there is a possibility that merit may arise depending on the situation of the object 100. Additionally, a scan form different from the above example is acceptable.

In addition, the control unit 9 operates at different wavelengths and at condensing positions in the Z direction by the laser light L1 from the laser processing head 10A and the laser light L2 from the laser processing head 10B. , it is okay to perform processing (multiple processing) on the object 100. Multi-wavelength processing is, for example, when processing a wafer made by bonding silicon (Si) and glass (case 1), or when part of the laser light (L1, L2) incident from the back side is absorbed by the device. It can be used when processing wafers that may cause damage to the circuit (second case).

In the first case, processing is performed from the glass side because both light with a wavelength for processing silicon (e.g., 1064 nm) and light with a wavelength for processing glass (e.g., 532 nm) need to reach the target material. . The focusing position of the laser light L1 from the laser processing head 10A is aligned beyond the glass into the silicon, and the focusing position of the laser light L2 from the laser processing head 10B is aligned within the glass, and processing is performed with the corresponding wavelength. Conduct. In order to process a wafer in which two different types of substrates are bonded in this way through multi-wavelength processing, the wavelength for processing the lower substrate among the wavelengths must be a wavelength that transmits the upper substrate. Here, since multi-wavelength processing is performed using a pair of laser processing heads 10A and 10B, throughput is improved.

Meanwhile, in the second case, the condensing position of the laser light L1 from the laser processing head 10A is set near the device, and the condensing position of the laser light L2 from the laser processing head 10B is set near the device. Set it to a location away from The wavelength of the laser light (L1) is set to a wavelength that is more absorbed by the substrate (e.g., 1064 nm) to reduce leakage light to the device side, and the wavelength of the laser light (L2) is set to a wavelength that is more absorbable by the substrate, even if some leakage light occurs. , it can be set to a longer wavelength (for example, 1342 nm) than the wavelength of the laser light L1, which is more suitable for processing the substrate.

In addition, the circuit unit 19 is not limited to processing the signal output from the measurement unit 16 and/or the signal input to the reflective spatial light modulator 34, but also processes any signal from the laser processing head. It's good if you can handle it.

Industrial applicability

A laser processing device capable of improving throughput is provided.

1 - Laser processing device
7 - support
9 - Control unit
10A - Laser processing head (first laser processing head)
10B - Laser processing head (second laser processing head)
11 - Case (Case 1, Case 2)
14 - Light concentrator (first concentrator, second concentrator)
24 - Fourth wall (opposite wall)
65 - Mounting part (first mounting part)
66 - Mounting part (second mounting part)
100 - object
C - line
L1, L2 - Laser light

Claims (9)

a support portion capable of moving along a first direction and supporting an object along the first direction and a second direction intersecting the first direction;
A first laser processing head and a second laser processing head arranged to face each other along the second direction and irradiating laser light to the object supported on the support portion;
a first mounting portion on which the first laser processing head is mounted and capable of moving along each of a third direction and the second direction intersecting the first direction and the second direction;
a second mounting portion on which the second laser processing head is mounted and capable of moving in each of the second and third directions;
The first laser processing head has a first case and a first condensing part provided on a wall portion of the first case on the side of the support portion and configured to converge the laser light toward the object supported on the support portion. ,
The second laser processing head has a second case and a second light condenser provided on a wall portion of the second case on the side of the support portion and configured to converge the laser light toward the object supported on the support portion. ,
The first mounting portion and the second mounting portion are mounted on opposite wall portions and different wall portions that face each other along the second direction in the first case and the second case, respectively,
The first light condensing portion is disposed with a bias toward the opposing wall portion in the first case when viewed from the third direction,
The laser processing device wherein the second light condensing portion is disposed with a bias toward the opposing wall portion in the second case when viewed from the third direction. In claim 1,
Further comprising a control unit that controls movement of the support part, the first mounting part, and the second mounting part, and irradiation of the laser light from the first laser processing head and the second laser processing head,
A plurality of lines extending along the first direction and arranged along the second direction are set on the object,
The control unit may perform a first scan process for scanning the laser light from the first laser processing head in the first direction with respect to one line among the plurality of lines, and the first scan processing with respect to another line among the plurality of lines. 2. A laser processing device that performs a second scan process of scanning the laser light from a laser processing head in the first direction so as to overlap at least part of the time. In claim 2,
The control unit sequentially executes the first scan process from a line located at one end of the object in the second direction among the plurality of lines toward an inner line in the second direction, while sequentially performing the first scan process on the plurality of lines. A laser processing device that performs a main processing in which the second scan processing is sequentially performed from a line located at the other end of the object in the second direction toward an inner line in the second direction. In claim 3,
The control unit, as a result of the main processing, when the first laser processing head and the second laser processing head are closest to the second direction, the first light collecting unit and the second focusing unit on the object When some of the plurality of lines remain in the area between the light unit, one of the first laser processing head and the second laser processing head is retracted from the corresponding area of the object, A laser processing device that performs post-processing by scanning the laser light from the other of the first laser processing head and the second laser processing head in the first direction with respect to the part of the line. In claim 3,
If the distance in the second direction between the first light condensing part and the second light condensing part when the first laser processing head and the second laser processing head are closest in the second direction is the distance D, The control unit, as a result of the main processing, causes the first laser processing head and the second light collecting unit to gradually approach in the second direction before the distance between them reaches twice the distance D. One of the laser processing heads is moved to the other side of the first laser processing head and the second laser processing head by a distance D, and the first scan is performed while maintaining the distance between the first light condensing part and the second light condensing part. A laser processing device that performs processing and post-processing that performs the second scan processing. The method according to any one of claims 1 to 4,
The first mounting portion is mounted on a wall portion opposite to the opposing wall portion in the first case,
The laser processing device wherein the second mounting portion is mounted on a wall portion opposite to the opposing wall portion in the second case. In claim 1,
The first laser processing head has a first case including a first wall portion and a second wall portion facing each other in the first direction, and a third wall portion and a fourth wall portion facing each other in the second direction,
The second laser processing head has a second case including a first wall portion and a second wall portion facing each other in the first direction, and a third wall portion and a fourth wall portion facing each other in the second direction,
The laser processing device wherein the distance between the third wall portion and the fourth wall portion is smaller than the distance between the first wall portion and the second wall portion. The method according to any one of claims 1 to 5,
The first case and the second case include first and second wall portions facing each other in the first direction, and third and fourth wall portions facing each other in the second direction,
The laser processing device wherein the distance between the third wall portion and the fourth wall portion is smaller than the distance between the first wall portion and the second wall portion. In claim 6,
The first case and the second case include first and second wall portions facing each other in the first direction, and third and fourth wall portions facing each other in the second direction,
The laser processing device wherein the distance between the third wall portion and the fourth wall portion is smaller than the distance between the first wall portion and the second wall portion.

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